WO2014021419A1 - Composition de résine durcissable - Google Patents

Composition de résine durcissable Download PDF

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Publication number
WO2014021419A1
WO2014021419A1 PCT/JP2013/070875 JP2013070875W WO2014021419A1 WO 2014021419 A1 WO2014021419 A1 WO 2014021419A1 JP 2013070875 W JP2013070875 W JP 2013070875W WO 2014021419 A1 WO2014021419 A1 WO 2014021419A1
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group
silicone resin
sio
curable resin
composition
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PCT/JP2013/070875
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English (en)
Japanese (ja)
Inventor
吉仁 武井
丈章 齋木
元紀 田熊
奈央 佐藤
つばさ 伊藤
愛美 金
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横浜ゴム株式会社
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Priority to JP2013554125A priority Critical patent/JP6400904B2/ja
Priority to CN201380035817.6A priority patent/CN104411771B/zh
Publication of WO2014021419A1 publication Critical patent/WO2014021419A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/14—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C08K5/057—Metal alcoholates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Definitions

  • the present invention relates to a curable resin composition.
  • Patent Document 1 a curable resin composition containing a silicone resin having a reactive functional group at both ends is known (see Patent Document 1 and the like), and is used, for example, in the field of electronic materials.
  • a curable resin composition containing a silicone resin has increased.
  • a curable resin composition having good adhesion to an adherend is demanded.
  • a curable resin composition is a composition for encapsulating an optical semiconductor, good transparency after curing and a higher refractive index are also required. This is because the higher the refractive index of a cured product that seals an optical semiconductor such as an LED, the light extraction efficiency is improved and the brightness becomes brighter.
  • This invention is made
  • the present inventors have found that a composition containing a specific silicone resin and a specific organometallic compound has excellent adhesion and good transparency and high after curing.
  • the inventors have found that it exhibits a refractive index and completed the present invention. That is, the present invention provides the following (1) to (7).
  • a curable resin composition comprising a polysiloxane compound (B) having a Si—H bond, an organic zirconium compound (C), and a hydrosilylation catalyst (D).
  • R 1 represents a substituted or unsubstituted monovalent hydrocarbon group
  • R 2 represents an alkyl group
  • X represents an alkenyl group
  • r represents an integer of 0 or 1
  • n represents And represents an integer greater than or equal to 1.
  • a plurality of R 1 , R 2 and X may be the same or different from each other, but at least one R 1 in one molecule represents an aryl group.
  • the content of the organozirconium compound (C) is 0.001 to 10 parts by mass with respect to 100 parts by mass in total of the silicone resin (A) and the polysiloxane compound (B).
  • the content of the hydrosilylation reaction catalyst (D) is 0.00001 to 0.1 parts by mass with respect to a total of 100 parts by mass of the silicone resin (A) and the polysiloxane compound (B).
  • the curable resin composition according to any one of (1) to (3) above.
  • a is a positive number
  • b is 0 or a positive number
  • c is 0 or a positive number
  • d is 0 or a positive number
  • e is 0 or a positive number
  • B / a is a number from 0 to 10
  • c / a is a number from 0 to 0.5
  • d / (a + b + c + d) is a number from 0 to 0.3
  • e / (a + b + c + d) is 0. It is a number of ⁇ 0.4.
  • the curable resin composition of the present invention (hereinafter also referred to as “the composition of the present invention”) is a silicone having one or more aryl groups in one molecule and having an alkenyl group and an alkoxy group at both ends.
  • Resin (A) polysiloxane compound (B) having one or more aryl groups and two or more Si—H bonds in one molecule, organozirconium compound (C), hydrosilylation reaction catalyst (D ) And a curable resin composition.
  • each component contained in the composition of the present invention will be described in detail.
  • the silicone resin (A) contained in the composition of the present invention is a silicone resin having one or more aryl groups in one molecule and having an alkenyl group and an alkoxy group at both ends.
  • the composition of the present invention has improved adhesion to the adherend, but it can be added by an alkenyl group and a condensation reaction by an alkoxy group by containing the silicone resin (A). It is presumed that.
  • cured material shows a high refractive index because the composition of this invention contains the silicone resin (A) which has an aryl group. This is presumably because the polarizability of the aryl group is high and intermolecular interaction works. Since the cured product exhibits a high refractive index, the light extraction efficiency is improved when the composition of the present invention is a composition for encapsulating an optical semiconductor. Furthermore, since the intermolecular interaction works in the aryl group as compared with the methyl group or the like, the gas permeability is improved, and an improvement in sulfur resistance can be expected.
  • the aryl group means a substituted or unsubstituted aryl group.
  • the content of aryl groups in all organic groups bonded to silicon atoms is preferably 5 mol% or more. More preferably, it is at least mol%. If the content of the aryl group is within this range, the composition of the present invention has an appropriate viscosity and the cured product has a higher refractive index. Moreover, it is preferable that content of the aryl group in a silicon atom bond all organic group is 99 mol% or less.
  • the “organic group” bonded to the silicon atom is not particularly limited, and examples thereof include a substituted or unsubstituted monovalent hydrocarbon group represented by R 1 described later (hereinafter the same).
  • the silicone resin (A) contained in the composition of the present invention is particularly limited as long as it is a silicone resin having one or more aryl groups in one molecule and having an alkenyl group and an alkoxy group at both ends. However, it is preferably a silicone resin represented by the following formula (A1).
  • R 1 represents a substituted or unsubstituted monovalent hydrocarbon group
  • R 2 represents an alkyl group
  • X represents an alkenyl group
  • r represents an integer of 0 or 1
  • n 1
  • a plurality of R 1 , R 2 and X may be the same or different from each other, but at least one R 1 in one molecule represents an aryl group.
  • the integer represented by n is preferably an integer of 3 to 1000, and can be a numerical value corresponding to the weight average molecular weight of the silicone resin (A).
  • Examples of the substituted or unsubstituted monovalent hydrocarbon group (excluding the aryl group) represented by R 1 include, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl Group, tert-butyl group, various pentyl groups, various hexyl groups, various octyl groups, various decyl groups, cyclopentyl groups, cyclohexyl groups and other alkyl groups having 1 to 18 carbon atoms; vinyl group, propenyl group, allyl group, hexenyl group Alkenyl groups having 2 to 18 carbon atoms such as octenyl group, cyclopentenyl group and cyclohexenyl group; aralkyl groups having 7 to 18 carbon atoms such as benzyl group and phenethyl group; and the like.
  • an alkyl group having 1 to 18 carbon atoms is preferable, an alkyl group having 1 to 10 carbon atoms is more preferable, an alkyl group having 1 to 6 carbon atoms is more preferable, and a methyl group Particularly preferred is an ethyl group.
  • the substituted or unsubstituted monovalent hydrocarbon group represented by R 1 includes an aryl group.
  • This aryl group is a substituted or unsubstituted aryl group.
  • an aryl group having 6 to 18 carbon atoms such as a phenyl group and a naphthyl group; a tolyl group, a xylyl group, an ethylphenyl group Alkyl having 7 to 18 carbon atoms such as propylphenyl group, butylphenyl group, pentylphenyl group, hexylphenyl group, heptylphenyl group, octylphenyl group, nonylphenyl group, decylphenyl group, undecylphenyl group, dodecylphenyl group, etc.
  • Aryl group and the like. Of these, an unsubstituted aryl group having 6 to 18 carbon atoms is preferable, and a phenyl group is more preferable because the cured product of the composition of the present invention exhibits a higher refractive index.
  • Examples of the alkyl group represented by R 2 include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, various pentyl groups, and various hexyl groups. , Various octyl groups, various decyl groups, cyclopentyl groups, cyclohexyl groups, and the like.
  • an alkyl group having 1 to 10 carbon atoms is preferable, an alkyl group having 1 to 6 carbon atoms is more preferable, and a methyl group and an ethyl group are preferable. Is more preferable.
  • R 2 represents an alkyl group
  • “—OR 2 ” represents an alkoxy group in the formula (A1).
  • Examples of the alkenyl group represented by X include a vinyl group, a propenyl group, an allyl group, a hexenyl group, an octenyl group, a cyclopentenyl group, a cyclohexenyl group, and the like, because the curability of the composition of the present invention is excellent. , Vinyl group and allyl group are preferable.
  • the weight average molecular weight (Mw) of the silicone resin (A) is preferably 500 to 1,000,000 from the viewpoints of mechanical properties, ease of viscosity operation, and ease of reaction operation.
  • a weight average molecular weight shall be the weight average molecular weight of polystyrene conversion by the gel permeation chromatography (GPC) which uses chloroform as a solvent.
  • the viscosity of the silicone resin (A) at 25 ° C. is preferably 20 to 1,000,000 mPa ⁇ s from the viewpoints of mechanical properties, ease of viscosity operation, and ease of reaction operation. 500 to 100,000 mPa ⁇ s is more preferable. In the present invention, the viscosity is measured at 25 ° C. in accordance with 4.1 (Brookfield rotary viscometer) of JIS K7117-1.
  • Such a silicone resin (A) includes, for example, a silicone resin having one or more aryl groups in one molecule and silanol groups at both ends, and one or more alkenyl groups in one molecule. It is obtained by reaction with the alkoxysilane it has. More specifically, the silicone resin (A) is preferably obtained by a reaction between a silicone resin (a1) described later and an alkoxysilane (a2) described later. Hereinafter, the manufacturing method of a silicone resin (A) is demonstrated.
  • the silicone resin (a1) used in the method for producing the silicone resin (A) is a silicone resin having silanol groups at both ends represented by the following formula (1).
  • the silanol group means a group in which a hydroxy group (—OH) is directly bonded to a silicon atom (Si).
  • R 1 has the same meaning as R 1 described above, and a plurality of R 1 may be the same or different, but at least one R 1 is aryl in one molecule. Indicates a group.
  • m represents an integer of 1 or more.
  • the integer represented by m is preferably an integer of 3 to 1000, and can be a numerical value corresponding to the weight average molecular weight of the silicone resin (a1).
  • the weight average molecular weight (Mw) of the silicone resin (a1) is 500 to 1,000,000 in terms of mechanical properties, ease of viscosity operation of the resulting silicone resin (A), and ease of reaction operation. 000 is preferred.
  • the viscosity of the silicone resin (a1) at 25 ° C. is preferably 20 to 1,000,000 mPa ⁇ s, more preferably 500 to 100,000 mPa ⁇ s from the same viewpoint.
  • the alkoxysilane (a2) used in the method for producing the silicone resin (A) is an alkoxysilane having at least two alkoxy groups in one molecule represented by the following formula (2).
  • R 2 , X and r are synonymous with R 2 , X and r described above.
  • a plurality of R 2 may be the same or different.
  • the weight average molecular weight (Mw) of the alkoxysilane (a2) is 100 to 2 from the viewpoints of reactivity, mechanical properties, ease of viscosity operation of the resulting silicone resin (A), and ease of reaction operation. 1,000 is preferable, and 140 to 1,000 is more preferable.
  • R 3 represents a substituted or unsubstituted monovalent hydrocarbon group or a hydrogen atom.
  • the substituted or unsubstituted monovalent hydrocarbon group represented by R 3 include those described as the substituted or unsubstituted monovalent hydrocarbon group represented by R 1 , among others, the ease of removal after the reaction, From the viewpoint of compatibility with the silicone resin and availability, it is preferably a monovalent aliphatic hydrocarbon group, more preferably an alkyl group, methyl group, ethyl group, n-propyl group. More preferably, it is a group.
  • the method for producing the silicone resin (A) comprises a step of reacting the silicone resin (a1) and the alkoxysilane (a2) in the presence of the carboxylic acid compound (a3) to obtain a reaction product (hereinafter referred to as “reaction step”). ").
  • reaction step the content ratio of each component is not particularly limited, but from the viewpoint of ease of reaction operation and reaction reproducibility, alkoxysilane (a2) 5 to 100 parts by mass of silicone resin (a1) The amount is preferably 100 parts by mass and 0.001 to 10 parts by mass of the carboxylic acid compound (a3).
  • the reaction between the silicone resin (a1) and the alkoxysilane (a2) is preferably performed by stirring.
  • stirring it is preferable to heat in a temperature range of 60 to 120 ° C. from the viewpoint of milder reaction conditions, and the stirring time (reaction time) is preferably 3 to 12 hours.
  • the method of stirring and heating is not particularly limited, and can be performed by a conventionally known method.
  • the carboxylic acid compound (a3) functions as a catalyst, and the reaction between the silicone resin (a1) and the alkoxysilane (a2) proceeds. That is, “—OH” possessed by the silicone resin (a1) and “—OR 2 ” possessed by the alkoxysilane (a2) react to give “R 2 OH” as a by-product, whereby the above-described silicone resin ( A) is formed as the main product.
  • This reaction process will be described more specifically.
  • a carboxylic acid compound (a3) represented by the following formula (3 ′) is used as a catalyst, and a silicone resin (a1 represented by the following formula (1 ′) is used.
  • the reaction is traced by 1 H-NMR to confirm the disappearance of the peak derived from the silanol group of the silicone resin (a1) or the appearance of a peak derived from a component other than the component used in the reaction.
  • the reaction can be completed as a reaction product containing the silicone resin (A) as a main product and a by-product.
  • the method for producing the silicone resin (A) in the present invention is a step of removing a by-product from the reaction product to obtain a silicone resin (A) as a main product (hereinafter also referred to as “removing step”). May be provided.
  • the method for removing the by-product is not particularly limited, and examples thereof include a method of stirring the reaction product under reduced pressure while heating. At this time, conditions such as heating temperature, pressure, stirring time and the like are not particularly limited and can be appropriately set according to the by-product to be generated, but together with the by-product, unreacted alkoxysilane (a2) In addition, it is preferable that the conditions are such that the carboxylic acid compound (a3) as a catalyst can be removed at the same time.
  • the heating temperature is preferably 120 to 160 ° C.
  • the pressure is preferably 1 to 30 mmHg
  • the stirring time is 2 to 5 hours. Is preferred.
  • the viscosity of the reaction product was measured, and the by-product, unreacted alkoxysilane (a2) and carboxylic acid compound (a3) were removed when the viscosity increased from the beginning and remained unchanged. As an end, it can be terminated.
  • the polysiloxane compound (B), the organic zirconium compound (C), and the hydrosilylation catalyst (D) will be described as components that contribute to the curing of the above-described silicone resin (A).
  • the polysiloxane compound (B) contained in the composition of the present invention is a polysiloxane compound having one or more aryl groups and two or more Si—H bonds in one molecule.
  • Si—H bond means a hydrogen atom (H) bonded to a silicon atom (Si) in a main skeleton formed by a siloxane bond (... Si—O—Si).
  • the polysiloxane compound (B) undergoes an addition reaction (hydrosilylation reaction) with respect to the alkenyl group of the silicone resin (A). At this time, since the polysiloxane compound (B) has at least two Si—H bonds in one molecule, it functions as a crosslinking agent between the silicone resins (A).
  • the amount of the Si—H bond (hereinafter referred to as “Si—H / Si for convenience” with respect to 1 mol of the alkenyl group of the silicone resin (A) described above.
  • the “ ⁇ Vi molar ratio”) is preferably 0.5 to 5.0 mol, more preferably 0.5 to 1.5 mol.
  • the polysiloxane compound (B) has an aryl group, which makes the composition of the present invention excellent in compatibility with the above-described silicone resin (A) having an aryl group and suppresses turbidity. Excellent in transparency of cured product.
  • the content of the aryl group in the silicon atom-bonded total organic group is preferably 5 mol% or more, and more preferably 10 mol% or more. If the content of the aryl group is within this range, the composition of the present invention is more excellent in transparency and has a higher refractive index after curing.
  • content of the aryl group in a silicon atom bond all organic group is 99 mol% or less.
  • the polysiloxane compound (B) is not particularly limited as long as it is a polysiloxane compound having one or more aryl groups and two or more Si—H bonds in one molecule.
  • the polysiloxane compound (B) is represented by the following formula (b1). What is done.
  • R 4 represents a substituted or unsubstituted monovalent hydrocarbon group or a hydrogen atom excluding an alkenyl group, and t represents an integer of 1 or more.
  • R ⁇ 4 > may be the same or different, However, In 1 molecule, at least 1 R ⁇ 4 > shows an aryl group and at least 2 R ⁇ 4 > shows a hydrogen atom.
  • Examples of the substituted or unsubstituted monovalent hydrocarbon group represented by R 4 include those described as the substituted or unsubstituted monovalent hydrocarbon group represented by R 1 .
  • the integer represented by t can be a numerical value corresponding to the weight average molecular weight of the polysiloxane compound (B).
  • the weight average molecular weight (Mw) of the polysiloxane compound (B) is 100 to 10,000 because the adhesiveness of the composition of the present invention is more excellent and the physical properties after curing are also improved. It is preferably 120 to 5,000.
  • the viscosity of the polysiloxane compound (B) at 25 ° C. is preferably from 0.1 to 10,000 mPa ⁇ s, more preferably from 1 to 100 mPa ⁇ s from the viewpoints of compatibility and workability. preferable.
  • polysiloxane compound (B) represented by the formula (b1) a commercially available product can be used.
  • the polysiloxane compound (B) may be partly or wholly a silicone resin represented by the following average composition formula (b2).
  • R 5 is a substituted or unsubstituted monovalent hydrocarbon group or a hydrogen atom excluding the same or different alkenyl groups, and 0.1 to 40 mol% of all R 5 in one molecule is Is a hydrogen atom, 10 mol% or more of the total R 5 is an aryl group
  • X 5 is a hydrogen atom or an alkyl group
  • h is a positive number
  • i 0 or a positive number
  • j is 0 or
  • It is a positive number, g / f is a number from 0 to 10, h / f is a number from 0 to
  • Examples of the substituted or unsubstituted monovalent hydrocarbon group represented by 6 in the formula (b2) are those described as the substituted or unsubstituted monovalent hydrocarbon group represented by R 1 and excluding the alkenyl group. Can be mentioned.
  • Organic zirconium compound (C) ⁇ Organic zirconium compound (C)>
  • the organozirconium compound (C) contained in the composition of the present invention functions as a condensation catalyst that accelerates the condensation reaction of the alkoxy group of the silicone resin (A).
  • the composition of the present invention is excellent in adhesion by containing the organic zirconium compound (C) in combination with the silicone resin (A).
  • the resulting cured product is colored and inferior in transparency, but the cured product of the composition of the present invention using the organic zirconium compound (C) is colored. Suppressed and excellent in transparency. This is presumably because the transition of d electrons in zirconium is less likely to occur than in titanium.
  • the organic zirconium compound (C) is not particularly limited, but for example, zirconium alkoxide, zirconium chelate and the like are preferably used.
  • the zirconium alkoxide is not particularly limited, and examples thereof include tetraethoxyzirconium, tetra-n-propoxyzirconium, tetra-i-propoxyzirconium, tetra-n-butoxyzirconium, tetra-i-butoxyzirconium, tetra-sec-butoxyzirconium. Tetra-t-butoxyzirconium, tetra-2-ethylhexylzirconium and the like. Among them, tetra-n-butoxyzirconium and tetra-2-ethylhexylzirconium are preferable.
  • the zirconium chelate is not particularly limited, and examples thereof include triethoxy mono (acetylacetonato) zirconium, tri-n-propoxy mono (acetylacetonato) zirconium, tri-i-propoxymono (acetylacetonato) zirconium, Tri-n-butoxy mono (acetylacetonato) zirconium, tri-sec-butoxy mono (acetylacetonato) zirconium, tri-t-butoxymono (acetylacetonato) zirconium, diethoxybis (acetylacetonato) Zirconium, di-n-propoxy bis (acetylacetonato) zirconium, di-i-propoxy bis (acetylacetonato) zirconium, di-n-butoxy bis (acetylacetonato) zirconium Di-sec-butoxy bis (acetylacetonato) zirconium
  • di -i- propoxy bis (ethylacetoacetate) zirconium di -i- propoxy bis (acetylacetonate) zirconium, tetrakis (acetylacetonato) zirconium are preferred.
  • zirconium metal salts include aliphatic carboxylates such as zirconyl dioctylate and zirconyl dineodecane; alicyclic carboxylates such as zirconyl naphthenate and zirconyl cyclohexane; aromatic carboxylates such as zirconyl benzoate; Acid salt; and the like.
  • organic zirconium compound (C) examples include those described above, alone or in combination of two or more.
  • the content of the organic zirconium compound (C) is preferably 0.001 to 10 parts by mass with respect to 100 parts by mass in total of the silicone resin (A) and the polysiloxane compound (B), and 0.01 to 5 It is preferable that it is a mass part. If content of an organozirconium compound (C) is this range, while the composition of this invention is excellent in sclerosis
  • the catalyst for hydrosilylation reaction (D) contained in the composition of the present invention is used in combination with the polysiloxane compound (B) to promote the addition reaction (hydrosilylation reaction) to the alkenyl group of the silicone resin (A).
  • a conventionally known catalyst can be used, and examples thereof include a platinum-based catalyst, a rhodium-based catalyst, a palladium-based catalyst, and the like, and a platinum-based catalyst is preferable.
  • platinum-based catalysts include chloroplatinic acid, chloroplatinic acid-olefin complexes, chloroplatinic acid-divinyltetramethyldisiloxane complexes, chloroplatinic acid-alcohol coordination compounds, platinum diketone complexes, and the like. May be used alone or in combination of two or more.
  • the content of the hydrosilylation reaction catalyst (D) is a catalytic amount, but because the curability of the composition of the present invention is excellent, a total of 100 of the above-described silicone resin (A) and polysiloxane compound (B).
  • the amount is preferably 0.00001 to 0.1 parts by weight, more preferably 0.0001 to 0.01 parts by weight with respect to parts by weight.
  • the composition of the present invention may further contain a curing retarder (E).
  • the curing retarder (E) is a component for adjusting the curing rate and working life of the composition of the present invention.
  • the curing retarder (E) is a component for adjusting the curing rate and working life of the composition of the present invention.
  • 3-methyl-1-butyn-3-ol, 3,5-dimethyl- Alcohol derivatives having a carbon-carbon triple bond such as 1-hexyn-3-ol, phenylbutynol, 1-ethynyl-1-cyclohexanol; 3-methyl-3-penten-1-yne, 3,5-dimethyl- Enyne compounds such as 3-hexen-1-yne; low molecular weight siloxanes containing alkenyl groups such as tetramethyltetravinylcyclotetrasiloxane and tetramethyltetrahexenylcyclotetrasiloxane; methyl-tris
  • content of a hardening retarder (E) is suitably selected according to the usage method etc. of the composition of this invention, for example, a total of 100 mass parts of silicone resin (A) mentioned above and a polysiloxane compound (B).
  • the amount is preferably 0.00001 to 0.1 parts by mass, and more preferably 0.0001 to 0.01 parts by mass.
  • composition of the present invention may further contain a silicone resin (F) represented by the following average composition formula (f).
  • a silicone resin (F) represented by the following average composition formula (f).
  • R 6 is the same or different substituted or unsubstituted monovalent hydrocarbon group, and 10 mol% or more of all R 6 in one molecule is an aryl group, and X 6 is a hydrogen atom.
  • a is a positive number
  • b is 0 or a positive number
  • c is 0 or a positive number
  • d is 0 or a positive number
  • e is 0 or a positive number
  • B / a is a number from 0 to 10
  • c / a is a number from 0 to 0.5
  • d / (a + b + c + d) is a number from 0 to 0.3
  • e / (a + b + c + d) is 0. It is a number of ⁇ 0.4.
  • Examples of the substituted or unsubstituted monovalent hydrocarbon group represented by 6 in the formula (f) include those described as the substituted or unsubstituted monovalent hydrocarbon group represented by R 1 .
  • the content of aryl groups in the silicon atom-bonded all organic groups is preferably 5 to 95 mol%, more preferably 20 to 80 mol%.
  • the content of the silicone resin (F) is not particularly limited. For example, it is preferably 10 to 1000 parts by mass with respect to 100 parts by mass in total of the silicone resin (A) and the polysiloxane compound (B) described above. More preferred is 50 to 500 parts by mass.
  • the composition of the present invention may further contain an adhesion promoter (G).
  • adhesion-imparting agent (G) include a silane coupling agent.
  • Specific examples of the silane coupling agent include aminosilane, vinyl silane, epoxy silane, methacryl silane, isocyanate silane, imino silane, reaction products thereof, and the like.
  • the compound etc. which are obtained by reaction with polyisocyanate are mentioned, It is preferable that it is an epoxy silane.
  • the epoxy silane is not particularly limited as long as it is a compound having an epoxy group and an alkoxysilyl group.
  • ⁇ -glycidoxypropylmethyldimethoxysilane ⁇ -glycidoxypropylethyldiethoxysilane, ⁇ -glycid Dialkoxyepoxysilanes such as xylpropylmethyldiethoxysilane and ⁇ - (3,4 epoxycyclohexyl) ethylmethyldimethoxysilane; ⁇ -glycidoxypropyltrimethoxysilane, ⁇ - (3,4 epoxycyclohexyl) ethyltrimethoxysilane And the like, and the like.
  • the content of the adhesion-imparting agent (G) is not particularly limited, but it is 0.5 with respect to a total of 100 parts by mass of the above-described silicone resin (A), polysiloxane compound (B), and organic zirconium compound (C). It is preferably ⁇ 10 parts by mass, more preferably 1 to 5 parts by mass.
  • the manufacturing method of the composition of this invention is not specifically limited, For example, the method of manufacturing by mixing the essential component mentioned above and an arbitrary component is mentioned. Further, the method for obtaining a cured product by curing the composition of the present invention is not particularly limited, and examples thereof include a method of heating the composition of the present invention at 80 to 200 ° C. for 10 minutes to 720 minutes.
  • composition of the present invention is, for example, in the field of display materials, optical recording medium materials, optical equipment materials, optical component materials, optical fiber materials, optical / electronic functional organic materials, semiconductor integrated circuit peripheral materials, etc. It can be used as a primer, a sealing material and the like.
  • the composition of the present invention can be suitably used as a composition for encapsulating an optical semiconductor because it has excellent adhesion and its cured product exhibits good transparency and high refractive index.
  • the optical semiconductor to which the composition of the present invention can be applied is not particularly limited, and examples thereof include a light emitting diode (LED), an organic electroluminescent element (organic EL), a laser diode, and an LED array.
  • LED light emitting diode
  • organic EL organic electroluminescent element
  • laser diode a laser diode
  • LED array As a method for using the composition of the present invention as an optical semiconductor sealing composition, for example, the composition of the present invention is applied to an optical semiconductor, and the optical semiconductor to which the composition of the present invention is applied is heated. The method of hardening the composition of invention is mentioned.
  • the method for applying and curing the composition of the present invention is not particularly limited, and examples thereof include a method using a dispenser, a potting method, screen printing, transfer molding, and injection
  • the obtained cured product was measured for transmittance (unit:%) at a wavelength of 400 nm using an ultraviolet / visible (UV-Vis) absorption spectrum measuring apparatus (manufactured by Shimadzu Corporation) in accordance with JIS K 0115: 2004.
  • the measurement results are shown in Table 1 below. If the transmittance value is 80% T or more, it can be evaluated as being excellent in “transparency”.
  • ⁇ Tensile shear bond strength, CF> The prepared composition was bonded to an adherend (aluminum alloy plate, A1050P, manufactured by Partec Co., Ltd.) with an adhesion area of 12.5 mm ⁇ 25 mm, and then cured by heating at 150 ° C. for 2 hours, and tested. Got the body. Using the obtained specimen, a tensile test was performed in accordance with JIS K6850: 1999, and the tensile shear bond strength (unit: MPa) was measured. Further, the ratio (unit:%) of the cohesive failure (CF) area to the adhesion area was also measured. The results are shown in Table 1 below. It can be evaluated that the higher the value of tensile shear adhesive strength and the closer the value of CF is to 100, the better the adhesion.
  • ⁇ Reflow test, wet heat test> The manufactured composition was applied to an LED package (manufactured by Enomoto) and cured by heating at 150 ° C. for 2 hours to prepare a test specimen.
  • eight test bodies were produced for each example. The eight test specimens thus produced were subjected to the following two types of tests, and the number of test specimens for which peeling of the cured product was not confirmed was counted. The larger the number, the better the adhesion.
  • Silicone resin A1 Silicone resin having a phenyl group and having a vinyl group and a methoxy group at both ends, produced as described later (Mw: 2,000, viscosity: 250 mPa ⁇ s, containing vinyl group) Amount: 3.10% by mass, content of phenyl group in all silicon-bonded organic groups: 50 mol%). It is represented by the following formula (A1-1), and n ′ in the formula is a numerical value corresponding to the weight average molecular weight of the silicone resin A1.
  • Silicone resin X1 A methylphenyl silicone resin having a phenyl group and having a methyl group and a vinyl group at both ends (PMV-9925, Gelest, Mw: 2,500, viscosity: 500 mPa ⁇ s, vinyl group Content: 2.2% by mass, content of phenyl group in all silicon atom-bonded organic groups: 50 mol%)
  • Silicone resin X2 A silicone resin represented by the following formula (X2), produced as described later, having no phenyl group and having a vinyl group and a methoxy group at both ends (Mw: 20,000) , Viscosity: 1,000 mPa ⁇ s, vinyl group content: 0.30% by mass)
  • Polysiloxane compound B1 dimethylhydrogensiloxy group-blocked methylhydrogensiloxane-methylphenylsiloxane copolymer (HPM-502, manufactured by Gelest, Mw: 4,300, phenyl group in silicon atom-bonded all organic groups) Content: 33 mol%)
  • Polysiloxane compound Z1 Organopolysiloxane represented by the following formula (Z1) (HMS-991, manufactured by Gelest, Mw: 1,600)
  • Organic zirconium compound C1 tetra-n-butoxyzirconium (Orgachix ZA-65, manufactured by Matsumoto Trading Co., Ltd.)
  • Organic titanium compound Y1 Tetra-i-propoxy titanium (TA-10, manufactured by Matsumoto Fine Chemical Co., Ltd.)
  • Catalyst for hydrosilylation reaction D1 Chloroplatinic acid-divinyltetramethyldisiloxane complex (Gelest, Mw: 474.68) Curing retarder E1: 3-methyl-1-butyn-3-ol (manufactured by Tokyo Chemical Industry Co., Ltd., Mw: 100) Silicone resin F1: Phenyl silicone resin represented by an average composition formula “(PhSiO 3/2 ) 0.9 (ViMe 2 SiO 1/2 ) 0.1 ” (vinyl group content: 5.6 mass%, all silicon atoms bonded) (Phyl group content in organic group: 75 mol%) Adhesion imparting agent G1: ⁇ -glycidoxypropyltrimethoxysilane (KBM-403, manufactured by Shin-Etsu Chemical Co., Ltd.)
  • silicone resin A1, A2, X2 it manufactured as follows. First, a 2 L 3-neck flask was equipped with a Dimroth condenser and a mechanical stirrer, and the components shown in Table 2 below (unit: parts by mass) were enclosed. Next, the mechanical stirrer was rotated while the flask was immersed in an oil bath and heated to 100 ° C., and the components enclosed in the flask were stirred and reacted for 6 hours.
  • the silicone resin a1-1 which will be described later, a1-2, disappearance of a peak derived from a silanol group of the a1-3, or the appearance of a peak derived from a component other than the component enclosed in a flask, 1 H
  • the reaction was terminated as a reaction product containing the main product (silicone resins A1, A2, and X2) was obtained.
  • the reaction product was stirred for 3 hours under conditions of 140 ° C.
  • silicone resins A1, A2 and X2 were obtained.
  • Silicone resin a1-1 Silanol group polymethylphenylsiloxane at both ends (Mw: 1,500)
  • Silicone resin a1-2 Silanol group diphenylsiloxane-dimethylsiloxane copolymer at both terminals (PDS-1615, manufactured by Gelest, Mw: 1,000)
  • Silicone resin a1-3 Silanol polydimethylsiloxane at both ends (DMS-S27, manufactured by Gelest, Mw: 18,000, viscosity: 800 mPa ⁇ s)
  • Alkoxysilane a2-1 Trimethoxyvinylsilane (KBM-1003, manufactured by Shin-Etsu Chemical Co., Ltd., Mw: 148.2)
  • Carboxylic acid compound a3-1 Acetic acid (Deer grade 1, manufactured by Kanto Chemical Co., Inc.)

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne une composition de résine durcissable qui présente une excellente adhérence et fournit un produit durci qui a une bonne transparence et un indice de réfraction élevé. Cette composition de résine durcissable contient (A) une résine silicone ayant un ou plusieurs groupes aryle dans chaque molécule et a un groupe alcényle et un groupe alcoxy à toutes les extrémités, (B) un composé polysiloxane qui a un ou plusieurs groupes aryle et au moins deux liaisons Si-H dans chaque molécule, (C) un composé du zirconium organique et (D) un catalyseur pour des réactions d'hydrosilylation.
PCT/JP2013/070875 2012-08-03 2013-08-01 Composition de résine durcissable WO2014021419A1 (fr)

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CN115612448B (zh) * 2022-12-19 2023-08-25 北京康美特科技股份有限公司 用于微型led元件的有机硅封装胶及其封装方法

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TW201412882A (zh) 2014-04-01
TWI596160B (zh) 2017-08-21

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