WO2014006706A1 - Dispositif de dépôt en phase vapeur - Google Patents

Dispositif de dépôt en phase vapeur Download PDF

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Publication number
WO2014006706A1
WO2014006706A1 PCT/JP2012/067107 JP2012067107W WO2014006706A1 WO 2014006706 A1 WO2014006706 A1 WO 2014006706A1 JP 2012067107 W JP2012067107 W JP 2012067107W WO 2014006706 A1 WO2014006706 A1 WO 2014006706A1
Authority
WO
WIPO (PCT)
Prior art keywords
vapor deposition
deposition material
material container
opening
preventing member
Prior art date
Application number
PCT/JP2012/067107
Other languages
English (en)
Japanese (ja)
Inventor
英二 古屋
健児 高坂
Original Assignee
中外炉工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中外炉工業株式会社 filed Critical 中外炉工業株式会社
Priority to JP2014523485A priority Critical patent/JP5832650B2/ja
Priority to PCT/JP2012/067107 priority patent/WO2014006706A1/fr
Priority to TW102117717A priority patent/TWI600781B/zh
Publication of WO2014006706A1 publication Critical patent/WO2014006706A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases

Definitions

  • the present invention provides a plurality of vapor deposition material containers in which a vapor deposition material is accommodated in a recess whose upper surface is opened, on a rotatable rotating support body in the circumferential direction, and a specific vapor deposition material is accommodated by the rotary support body.
  • a vapor deposition apparatus vapor deposition apparatus that guides a body to a heating position, heats a vapor deposition material accommodated in a recess of the vapor deposition material container, evaporates the vapor deposition material through the opening, and deposits the vapor deposition material on the surface of the material to be processed. Is.
  • a vapor deposition material accommodated in a recess of a specific vapor deposition material container is irradiated with a beam and heated, and this vapor deposition material is evaporated, the evaporated vapor deposition material is transferred to another vapor deposition material container. It is characterized in that it is prevented from being mixed into the deposited vapor deposition material.
  • vacuum deposition apparatuses have been used to deposit various materials on the surface of various materials to be processed such as glass substrates.
  • various vapor deposition materials are accommodated in a concave portion of a vapor deposition material container such as a crucible, and a beam such as a plasma beam is emitted from a beam emission device such as a plasma gun.
  • the vapor deposition material accommodated in the recess is irradiated from the opened upper surface of the vapor deposition material container to evaporate the vapor deposition material, and the vapor deposition material is vapor deposited on the surface of the material to be processed to form a film.
  • a vapor deposition apparatus when different vapor deposition materials are sequentially deposited on the surface of the material to be treated, or when different vapor deposition materials are vapor deposited on the surface of the different material to be treated, In order to efficiently deposit various vapor deposition materials on the surface one after another, for example, as shown in Patent Documents 1 and 2, a plurality of vapor deposition material accommodating portions for accommodating the vapor deposition materials are provided on the upper surface of the rotatable rotating body.
  • the vapor deposition material accommodated in the vapor deposition material container guided to the beam irradiation position is irradiated with the beam to evaporate the vapor deposition material
  • the vapor deposition material evaporated from the vapor deposition material container
  • the vaporized vapor deposition material is mixed into the vapor deposition material accommodated in the other vapor deposition material container. There was a problem.
  • Patent Document 2 a protective cover provided with an opening in a portion facing the vapor deposition material container guided to the beam irradiation position is provided above the rotating body so as to cover the other vapor deposition material container.
  • the vapor deposition material evaporated from the vapor deposition material container guided to the beam irradiation position is mixed into the vapor deposition material accommodated in another vapor deposition material container not guided to the beam irradiation position. It is shown to prevent this.
  • the vapor deposition material evaporated from the vapor deposition material container guided to the beam irradiation position is not removed between the protective cover and the rotator.
  • the vapor deposition material is guided to the other vapor deposition material container through the gap, and the vaporized vapor deposition material cannot be sufficiently prevented from being mixed into the vapor deposition material accommodated in the other vapor deposition material container, and is evaporated.
  • the evaporated material adheres to the lower surface of the protective cover and the rotating body is rotated to guide the other evaporated material container to the beam irradiation position the evaporated material attached to the lower surface of the protective cover enters the other evaporated material container. There was a problem of falling and mixing in the deposited vapor deposition material.
  • the gap between the protective cover and the rotating body is narrowed to prevent the evaporated vapor deposition material from being guided to another vapor deposition material container through the space between the protective cover and the rotating body.
  • the gap between the protective cover and the rotating body because the rotating body is rotated and the deposition material container is sequentially guided to the beam irradiation position.
  • the present invention provides a plurality of vapor deposition material containers in which a vapor deposition material is accommodated in a recess whose upper surface is opened on a rotatable rotation support body in the circumferential direction.
  • a specific vapor deposition material container is guided to a heating position such as a beam irradiation position, and the vapor deposition material is heated by irradiating the vapor deposition material accommodated in the recess through the opening of the vapor deposition material container to evaporate the vapor deposition material.
  • the vapor deposition material accommodated in the concave portion of the vapor deposition material container guided to the heating position such as the beam irradiation position is irradiated with a beam to heat the vapor deposition material.
  • the vapor deposition material is evaporated and vapor deposited on the surface of the material to be treated, it is possible to appropriately prevent the evaporated vapor deposition material from being mixed into the vapor deposition material accommodated in another vapor deposition material container. It is to be an issue.
  • a plurality of vapor deposition material containers in which a vapor deposition material is accommodated in a recess having an upper surface opened are provided on a rotatable rotating support body in the circumferential direction.
  • the specific vapor deposition material container is guided to the heating position by the rotating support, the vapor deposition material accommodated in the recess of the vapor deposition material container is heated, and the vapor deposition material is evaporated through the opening to be processed.
  • the deposition member provided with the opening for exposing the vapor deposition material container guided to the heating position is rotated so as to cover the upper surface of the other vapor deposition material container.
  • the upper surface of the vapor deposition material container that was placed on the support and led to the heating position was positioned above the lower surface of the deposition-preventing member at the edge of the opening.
  • the beam is irradiated.
  • the vapor deposition material evaporated from the opened upper surface of the vapor deposition material container is suppressed from being led to the lower surface side of the deposition member through the gap between the vapor deposition material container and the opening. It is prevented from being led to another vapor deposition material container through between the lower surface of the substrate and the rotary support.
  • the evaporated vapor deposition material is separated from the vapor deposition material container and the It is further suppressed from being led to the lower surface side of the adhesion preventing member through the opening of the adhesion preventing member from being led to another vapor deposition material container through between the lower surface of the adhesion preventing member and the rotary support. Become so.
  • the adhesion preventing member having the opening for exposing the vapor deposition material container guided to the heating position as described above is disposed on the rotary support so as to cover the upper surface of the other vapor deposition material container.
  • the deposition preventing member is placed between the lower step and the upper step.
  • induced to the heating position can be provided in the lower step part of an adhesion prevention member.
  • a separation convex portion that separates the vapor deposition material container guided to the heating position from another vapor deposition material container adjacent thereto is provided between the adhesion preventing member and the rotation support body.
  • the gap between the lower surface of the deposition-preventing member provided with the separation convex portion and the rotary support body is further narrowed, and the vapor deposition material evaporated from the upper surface of the vapor deposition material container is accommodated in the vapor deposition material container. Even if it is led to the lower surface side of the deposition preventive member through between the body and the opening, the vapor deposition material is suppressed and evaporated between the lower surface of the deposition preventive member provided with the separation projection and the rotating support. Is further prevented from being led to another vapor deposition material container.
  • the vapor deposition material is evaporated from the specific vapor deposition material container guided to the heating position, and this vapor deposition material is vapor deposited on the surface of the material to be treated, and then supported by the rotating support.
  • an elevating device for elevating and lowering at least one of the deposition preventing member and the rotating support can be provided.
  • the lower surface in the opening edge of the said opening part does not collide with the upper surface of the said vapor deposition material container by this raising / lowering apparatus.
  • the rotary support is rotated so that the next vapor deposition material container is guided to the heating position.
  • the deposition member is lowered by the lifting device, and the upper surface of the next vapor deposition material container is opened to the lip of the opening. It is made to position above the lower surface of the adhesion-preventing member.
  • the heat-resistant ring when the heat-resistant ring is attached to the lip of the opening of the adhesion-preventing member and the upper surface portion of the heat-resistant ring is inclined downward from the inner peripheral side toward the outer peripheral side, the adhesion is prevented.
  • the heat-resistant ring prevents the edge of the opening of the member from being deformed by heat, and the lump of vapor deposition material adhering to the opening of the opening is downward toward the outer peripheral side of the upper surface of the heat-resistant ring.
  • the adhesion preventing member provided with the opening for exposing the vapor deposition material container guided to the heating position is placed on the rotating support so as to cover the upper surface of the other vapor deposition material container. Since the upper surface of the vapor deposition material container guided to the heating position is positioned above the lower surface of the deposition preventing member at the lip of the opening, the beam is irradiated. The vapor deposition material evaporated from the upper surface of the vapor deposition material container that is opened is suppressed from being led to the lower surface side of the deposition preventing member through the space between the vapor deposition material container and the opening. It is prevented from adhering or being led to another vapor deposition material container through the lower surface of the adhesion-preventing member and the rotary support.
  • the vapor deposition material accommodated in the concave portion of the vapor deposition material container is irradiated with a beam through the opening of the vapor deposition material container guided to the heating position by the rotating support, thereby vapor deposition material.
  • the vapor deposition material evaporated from the vapor deposition material container is guided to the other vapor deposition material container and enters the other vapor deposition material container. Mixing into the stored vapor deposition material is appropriately prevented.
  • a vapor is emitted from a beam emitting device toward a vapor deposition material container guided to a beam irradiation position by a rotating support, and the vapor deposition material accommodated in the vapor deposition material container
  • a vapor deposition material container guided to a beam irradiation position by a rotating support
  • the vapor deposition material accommodated in the vapor deposition material container It is the schematic explanatory drawing which showed the state which irradiates a beam to evaporate vapor deposition material and vapor-deposits this vapor deposition material on the surface of a to-be-processed material. It is the disassembled perspective view which showed the adhesion preventing member, the vapor deposition material container, and the rotation support body in the vapor deposition apparatus in the said embodiment.
  • each holding member provided with a plurality of vapor deposition material containers in which a vapor deposition material is contained in a recess having an upper surface opened is provided on the upper surface of the rotating support body in a circumferential direction with a required interval. It is the schematic perspective view which showed the state hold
  • a heat-resistant ring is attached to the lip of the opening of the adhesion-preventing member, and the upper surface of the heat-resistant ring is inclined downward from the inner peripheral side toward the outer peripheral side. It is partial sectional explanatory drawing shown.
  • a vapor deposition apparatus according to an embodiment of the present invention will be specifically described with reference to the accompanying drawings.
  • the vapor deposition apparatus which concerns on this invention is not limited to what was shown to the following embodiment, In the range which does not change the summary of invention, it can change suitably and can implement.
  • the rotating shaft 2 a of the rotating device 2 is introduced into the vacuum chamber 1 from the bottom of the vacuum chamber 1, and the center of the disk-shaped rotating support 10 is formed.
  • the rotating support 10 is rotated around the rotating shaft 2a by holding the portion on the rotating shaft 2a.
  • a sealing member 2 b is provided so that outside air does not enter the vacuum chamber 1 from a portion where the rotating shaft 2 a of the rotating device 2 is introduced into the vacuum chamber 1.
  • a plurality of (four in the example shown in the figure) holding recesses 11 are provided on the upper surface of the rotary support 10 with a required interval in the circumferential direction.
  • the separation protrusions 12 having triangular protrusions are provided radially from the center, and on the outer periphery of the upper surface of the rotary support 10.
  • An annular convex portion 13 protruding upward is provided.
  • each vapor deposition material container 3 in which the vapor deposition material T is accommodated in the concave portions whose upper surfaces are opened are held in the respective holding concave portions 11 provided on the upper surface of the rotary support 10.
  • the upper surface of each vapor deposition material container 3 is positioned above the separating projection 12.
  • planar circular deposition preventing member 20 provided with the opening 21 for exposing the vapor deposition material container 3 guided to the beam irradiation position is covered with the above-described upper surface of the other vapor deposition material container 3. It is arranged on the rotating support 10.
  • the outer diameter of the anti-adhesion member 20 is slightly larger than that of the rotary support 10, and the side wall 20c extending downward along the outer periphery of the anti-adhesion member 20 The outer peripheral side of the rotary support 10 is covered.
  • projecting pieces 22 projecting in opposite directions from the outer periphery of the deposition preventing member 20 are provided at positions on both sides in the diameter direction of the deposition preventing member 20, and the projecting pieces 22 on both sides are vacuumed from the bottom of the vacuum chamber 1, respectively.
  • the lifting / lowering rod 4a of the lifting / lowering device 4 introduced into the chamber 1 is held by the lifting / lowering rod 4a.
  • a sealing member 4 b is provided so that outside air does not enter the vacuum chamber 1 from a portion where the lifting rod 4 a in the lifting device 4 is introduced into the vacuum chamber 1.
  • the said adhesion prevention member 20 is formed in the level
  • a beam B such as a plasma beam is emitted from a beam emitting apparatus 5 such as a plasma gun provided on the side of the vacuum chamber 1, and the beam
  • the vapor deposition material T accommodated in the recess of the vapor deposition material container 3 guided to the irradiation position is irradiated with the beam B to evaporate the vapor deposition material T, and the evaporated vapor deposition material T is disposed in the upper part of the vacuum chamber 1. Vapor deposition is performed on the surface of the processed material W.
  • the rotating device 2 rotates the rotating shaft.
  • the rotating support body 10 holding the vapor deposition material container 3 around the center 2a is rotated, and the vapor deposition material container 3 containing the vapor deposition material T to be vapor-deposited on the workpiece W is guided to the beam irradiation position.
  • the deposition preventing member 20 is lowered by the lifting rod 4 a provided in the lifting device 4.
  • the adhesion preventing member 20 is lowered in this way, and the opening 21 provided in the lower step portion 20a of the adhesion preventing member 20 as shown in FIGS. 1, 4 and 5A, 5B.
  • the vapor deposition material container 3 guided to the beam irradiation position is introduced into the inside, and the upper surface of the vapor deposition material container 3 guided to the beam irradiation position is placed on the edge of the opening 21 provided in the adhesion preventing member 20. Projecting above the upper surface of the adhesion-preventing member 20, and two portions provided radially on the upper surface of the rotary support 10 so as to define a portion for holding the vapor deposition material container 3 guided to the beam irradiation position.
  • the separation convex portion 12 is positioned below the lower surface of the fan-shaped lower step portion 20 a provided with the opening 21, and the gap between the lower surface of the lower step portion 20 a of the deposition preventing member 20 and the upper surface of the rotation support 10 is very narrow. It is trying to become.
  • the beam B is irradiated to the vapor deposition material T accommodated in the vapor deposition material container 3 to evaporate the vapor deposition material T accommodated in the vapor deposition material container 3.
  • the vapor deposition material T which evaporated from the upper surface opened of the vapor deposition material container 3 will flow into the lower surface side of the deposition preventing member 20 through between the vapor deposition material container 3 and the opening part 21 of the deposition preventing member 20.
  • the rotation support is performed so as to partition the portion that holds the vapor deposition material container 3 guided to the beam irradiation position.
  • the gap between the lower surface of the lower step portion 20a of the anti-adhesion member 20 and the upper surface of the rotary support 10 is very narrow due to the two separating projections 12 provided on the upper surface of the body 10.
  • the vapor deposition material T flowing into the lower surface side of the member 20 is prevented from being guided to another vapor deposition material container 3 through the gap between the lower surface of the lower step portion 20a of the deposition preventing member 20 and the upper surface of the rotary support 10.
  • the vapor deposition apparatus of this embodiment when the vapor deposition material T accommodated in the vapor deposition material container 3 guided to the beam irradiation position is evaporated and vapor deposited on the surface of the material W to be processed, the vapor deposition material T evaporated from the vapor deposition material container 3 is appropriately prevented from being introduced into the other vapor deposition material container 3 and mixed into the vapor deposition material T accommodated in the other vapor deposition material container 3. It becomes like this.
  • the said separation convex part 12 is a triangular protrusion, when raising and lowering the adhesion prevention member 20 as mentioned above, on this separation convex part 12 Even if the lump of the vapor deposition material T falls, the lump of the vapor deposition material T falls down on the rotary support 10 from the separation convex portion 12, and the lump of the vapor deposition material T falls on the separation convex portion 12 and the lower surface of the adhesion preventing member 20. It will not be caught between.
  • the separation convex portion 12 and the annular convex portion 13 are provided on the upper surface of the rotary support 10 itself.
  • a disk member 30 to be mounted is used, and a mounting hole 31 to be mounted on the rotary support 10 is provided at the center of the disk member 30 and a through hole corresponding to the holding recess 11 in the rotary support 10 is provided.
  • 32, and a separation convex portion 33 having a triangular projection radially from the central mounting hole 31 is provided on the upper surface of the disk member 30 and protrudes upward along the outer periphery of the upper surface of the disk member 30.
  • An annular convex portion 34 may be provided.
  • the disk member 30 when the disk member 30 is detachably mounted on the upper surface of the rotary support 10, the vapor deposition material T flows into the lower surface side of the deposition preventing member 20, and the vapor deposition material T adheres to the disk member 30.
  • the disk member 30 can be easily replaced by being detached from the upper surface of the rotary support 10.
  • the upper surface of the vapor deposition material container 3 guided to the beam irradiation position as described above is arranged from the upper surface of the deposition preventing member 20 at the rim of the opening 21 provided in the deposition preventing member 20.
  • the upper surface of the vapor deposition material container 3 guided to the beam irradiation position is positioned above the lower surface of the deposition preventing member 20 at the lip of the opening 21 provided in the deposition preventing member 20.
  • the vapor deposition material T evaporated from the opened upper surface of the vapor deposition material container 3 passes between the vapor deposition material container 3 and the opening 21 of the adhesion preventing member 20 and the lower surface of the adhesion preventing member 20. Inflow to the side is suppressed.
  • a heat-resistant ring 23 is attached to the rim of the opening 21 of the deposition preventing member 20, and the upper surface of the heat-resistant ring 23 is set on the inner peripheral side.
  • the edge of the opening 21 of the deposition preventing member 20 is prevented from being deformed by heat by the heat-resistant ring 23 and attached to the edge of the opening 21.
  • the vapor deposition material T is peeled off when the adhesion preventing member 20 is moved up and down, the vapor deposition material T is formed on the adhesion preventing member 20 along the surface inclined downward toward the outer peripheral side of the upper surface portion of the heat-resistant ring 23. As a result, it is prevented from falling on the rotary support 10 or in the other vapor deposition material container 3.
  • the vapor deposition material T is irradiated with the beam B from the beam emitting device 5 to heat the vapor deposition material T.
  • heating means such as an electric heater (not shown) It is also possible to heat the vapor deposition material T by providing.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

Dans le cas où une pluralité de corps d'admission de matériau de dépôt en phase vapeur est agencée sur un corps de support rotatif, et qu'un matériau de dépôt en phase vapeur est admis à l'intérieur d'un corps d'admission de matériau de dépôt en phase vapeur spécifique, et soumis à une évaporation par chauffage, alors l'invention empêche ce matériau de dépôt en phase vapeur de s'incorporer à un matériau de dépôt en phase vapeur admis dans un autre corps d'admission de matériau de dépôt en phase vapeur. La pluralité de corps d'admission de matériau de dépôt en phase vapeur (3) admettant un matériau de dépôt en phase vapeur (T) à l'intérieur d'une partie retrait dont la face supérieure est ouverte, est agencée sur un corps de support rotatif (10) permettant une rotation. Un corps d'admission de matériau de dépôt en phase vapeur spécifique, est guidé en une position chauffage. Le matériau de dépôt en phase vapeur contenu à l'intérieur du corps d'admission de matériau de dépôt en phase vapeur spécifique, est soumis à une évaporation par chauffage. Un élément anti-dépôt (20) dans lequel est agencée une partie ouverture (21) exposant un corps d'admission de matériau de dépôt en phase vapeur guidé en une position irradiation de faisceau, est disposé sur le corps de support rotatif de manière à recouvrir la face supérieure de l'autre corps d'admission de matériau de dépôt en phase vapeur. La face supérieure ouverte du corps d'admission de matériau de dépôt en phase vapeur guidé en une position irradiation de faisceau, est positionnée plus haut que la face inférieure de l'élément anti-dépôt sur le bord ouverture de la partie ouverture.
PCT/JP2012/067107 2012-07-04 2012-07-04 Dispositif de dépôt en phase vapeur WO2014006706A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014523485A JP5832650B2 (ja) 2012-07-04 2012-07-04 蒸着装置
PCT/JP2012/067107 WO2014006706A1 (fr) 2012-07-04 2012-07-04 Dispositif de dépôt en phase vapeur
TW102117717A TWI600781B (zh) 2012-07-04 2013-05-20 蒸鍍裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/067107 WO2014006706A1 (fr) 2012-07-04 2012-07-04 Dispositif de dépôt en phase vapeur

Publications (1)

Publication Number Publication Date
WO2014006706A1 true WO2014006706A1 (fr) 2014-01-09

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JP (1) JP5832650B2 (fr)
TW (1) TWI600781B (fr)
WO (1) WO2014006706A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022520307A (ja) * 2018-11-30 2022-03-30 フェローテック（ユーエスエー）コーポレイション 電子ビーム源を用いた被覆のためのるつぼカバー

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07166335A (ja) * 1993-12-15 1995-06-27 Nikon Corp イオンプレーティング装置
JPH08225927A (ja) * 1995-02-22 1996-09-03 Nikon Corp 蒸発物るつぼ
JP2002038256A (ja) * 2000-06-01 2002-02-06 Boc Group Inc:The 複数ポケットの電子ビーム源
JP2002097566A (ja) * 2000-09-18 2002-04-02 Toyo Commun Equip Co Ltd 電子ビーム蒸着用電子銃
JP2006200040A (ja) * 2005-01-21 2006-08-03 Samsung Sdi Co Ltd 加熱容器支持台及びそれを備えた蒸着装置
JP2007332433A (ja) * 2006-06-16 2007-12-27 Seiko Epson Corp 真空蒸着装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07166335A (ja) * 1993-12-15 1995-06-27 Nikon Corp イオンプレーティング装置
JPH08225927A (ja) * 1995-02-22 1996-09-03 Nikon Corp 蒸発物るつぼ
JP2002038256A (ja) * 2000-06-01 2002-02-06 Boc Group Inc:The 複数ポケットの電子ビーム源
JP2002097566A (ja) * 2000-09-18 2002-04-02 Toyo Commun Equip Co Ltd 電子ビーム蒸着用電子銃
JP2006200040A (ja) * 2005-01-21 2006-08-03 Samsung Sdi Co Ltd 加熱容器支持台及びそれを備えた蒸着装置
JP2007332433A (ja) * 2006-06-16 2007-12-27 Seiko Epson Corp 真空蒸着装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022520307A (ja) * 2018-11-30 2022-03-30 フェローテック（ユーエスエー）コーポレイション 電子ビーム源を用いた被覆のためのるつぼカバー
US11807935B2 (en) 2018-11-30 2023-11-07 Ferrotec (Usa) Corporation Crucible cover for coating with an electron beam source
JP7394134B2 (ja) 2018-11-30 2023-12-07 フェローテック（ユーエスエー）コーポレイション 電子ビーム源を用いた被覆のためのるつぼカバー

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Publication number Publication date
TW201402845A (zh) 2014-01-16
JP5832650B2 (ja) 2015-12-16
TWI600781B (zh) 2017-10-01
JPWO2014006706A1 (ja) 2016-06-02

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