WO2014002893A1 - Feuille conductrice anisotrope et procédé de liaison d'électrode l'utilisant - Google Patents

Feuille conductrice anisotrope et procédé de liaison d'électrode l'utilisant Download PDF

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Publication number
WO2014002893A1
WO2014002893A1 PCT/JP2013/067089 JP2013067089W WO2014002893A1 WO 2014002893 A1 WO2014002893 A1 WO 2014002893A1 JP 2013067089 W JP2013067089 W JP 2013067089W WO 2014002893 A1 WO2014002893 A1 WO 2014002893A1
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Prior art keywords
metal
alloy
resin
anisotropic conductive
particles
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PCT/JP2013/067089
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English (en)
Japanese (ja)
Inventor
裕之 大幡
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株式会社村田製作所
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Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201380019393.4A priority Critical patent/CN104221223B/zh
Priority to JP2014522592A priority patent/JP5783329B2/ja
Publication of WO2014002893A1 publication Critical patent/WO2014002893A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/365—Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder

Definitions

  • the present invention relates to an anisotropic conductive sheet and an electrode joining method using the same.
  • an anisotropic conductive adhesive obtained by adding metal powder (conductive particles) in a thermosetting resin, or a method using an anisotropic conductive sheet obtained by forming the sheet into a sheet is used. (That is, a method of joining electrodes by heating and pressurizing with an anisotropic conductive adhesive or an anisotropic conductive sheet interposed between the electrodes).
  • the electrical connection by this method depends only on the physical contact of the conductive particles and the shape retention of the thermosetting resin. If the resin expands, flows, decomposes, etc. due to heating, the connection is lost. Therefore, it is difficult to mount other parts through a reflow process after connection, and the use is limited to the bonding of LCD (liquid crystal display) glass substrates to chips and FPCs (flexible printed circuit boards). ing.
  • Patent Document 1 Japanese Patent Laid-Open No. 10-199333 discloses a method of using a glycidylamine-based resin as a thermosetting resin.
  • Patent Document 2 Japanese Patent Laid-Open No. 11-120919
  • a naphthalene epoxy resin having a bifunctional or higher glycidyl ether group is used as the thermosetting resin.
  • Patent Document 3 Japanese Patent Application Laid-Open No. 2007-131649) discloses a method using a multilayer anisotropic conductive film in which an adhesive layer having a DSC exothermic peak temperature of 130 to 180 ° C.
  • Patent Document 4 Japanese Patent Application Laid-Open No. 2011-219683 discloses an epoxy resin composition in which the difference between the Tan ⁇ value at ⁇ 40 ° C. and the maximum Tan ⁇ is 0.1 or more, and conductive particles. A method using an isotropic conductive paste or film is disclosed.
  • thermosetting resin used in order to obtain heat resistance that can withstand reflow, is improved to improve heat resistance or reduce thermal shock, but the conductive particles themselves are physically The contact reliability after heat treatment is not high.
  • Patent Document 5 Japanese Patent Laid-Open No. 2000-12620
  • a large number of independent conductive paths are formed in the thickness direction and are independent in the surface direction, and a heat-resistant fiber layer is formed around the conductive paths.
  • a method of using a film is disclosed.
  • a special manufacturing method is required to form conductive paths arranged in one direction, which is expensive and can only be supplied in the form of a film.
  • electrical connection depends on physical contact, and reliability after heat treatment is not high.
  • the conductive particles are coated with a low melting point metal such as solder and melted at the temperature at the time of joining.
  • a method of fixing them to each other is also conceivable.
  • the joint formed by this method is easily melted, so that the reliability after the heat treatment is not improved.
  • Patent Document 6 Japanese Patent Laid-Open No. 2003-286457
  • alloy particles whose melting point is improved by heating and melting and cooling solidification are used as conductive fine particles, and the conductive fine particles are regularly arranged in the plane.
  • a conductive adhesive sheet is disclosed.
  • the conductive fine particles include three or more kinds of metal elements selected from copper, silver, gold, nickel, and the like, and metal fine particles obtained by coating the surface of the metal particles with another metal are used as the conductive fine particles. It is disclosed. If the electrodes are joined together by heating and cooling using this conductive adhesive sheet, it will not melt even if reheated at the same temperature, so that reflow resistance may be obtained.
  • Patent Document 7 International Publication No. 2012/066675 describes a first metal (an alloy containing Sn or Sn of 70% by weight or more) and a second metal (Cu—Mn alloy) having a melting point higher than that of the first metal.
  • Cu-Ni alloy is used as a solder paste or via filler, and an intermetallic compound having a high melting point is formed at a low temperature in a short time, and a low melting point component does not remain. It is described that a connection structure with excellent strength is provided.
  • the constituent material of the anisotropic conductive sheet is not disclosed.
  • JP 10-199333 A Japanese Patent Application Laid-Open No. 11-120819 JP 2007-131649 A JP 2011-219683 A JP 2000-12620 A JP 2003-286457 A International Publication No. 2012/066675
  • the present invention can withstand the high temperature of the mounting process by reflow, and an anisotropic conductive sheet for forming a highly reliable inter-electrode joint in a shorter time than before, and an electrode joint using the same It aims to provide a method.
  • the present invention is an anisotropic conductive sheet comprising a resin and conductive particles dispersed in the resin,
  • the conductive particles include particles made of a second metal and a first metal that coats at least a part of the surface of the particles,
  • the first metal is made of Sn or an alloy containing 70 wt% or more of Sn,
  • the anisotropic conductive sheet is characterized in that the second metal is made of a Cu—Ni alloy or a Cu—Mn alloy having a melting point higher than that of the first metal.
  • the resin preferably includes a thermosetting resin.
  • the ratio of Ni in the Cu—Ni alloy is preferably 10 to 15% by weight, and the ratio of Mn in the Cu—Mn alloy is preferably 10 to 15% by weight.
  • the present invention is a method of joining the two or more electrodes by heating and pressurizing the anisotropic conductive sheet according to claim 1 between the two or more electrodes. And the present invention also relates to an electrode bonding method in which an intermetallic compound having a melting point of 300 ° C. or higher is generated by a reaction between the first metal and the second metal at a bonding portion of the two or more electrodes.
  • At least the surface portion of the two or more electrodes is made of copper or a copper alloy. Further, it is preferable that at least the surface portion of the two or more electrodes is made of a Cu—Ni alloy or a Cu—Mn alloy.
  • an intermetallic compound is rapidly generated at the joint between the electrodes, so that it can withstand the high temperature of the mounting process by reflow.
  • a highly reliable inter-electrode junction can be formed in a shorter time than conventional.
  • the anisotropic conductive sheet of the present invention is An anisotropic conductive sheet comprising a resin and conductive particles dispersed in the resin,
  • the conductive particles include particles made of a second metal and a first metal that coats at least a part of the surface of the particles,
  • the first metal is made of Sn or an alloy containing 70 wt% or more of Sn,
  • the second metal is made of a Cu—Ni alloy or a Cu—Mn alloy having a higher melting point than the first metal.
  • the resin in which the conductive particles are dispersed is not particularly limited as long as it is made of a resin sheet made of an electrically insulating material.
  • the resin preferably contains a thermosetting resin.
  • the thermosetting resin include epoxy resins, phenol resins, unsaturated polyester resins, silicone resins, bismaleimide triazine resins, polyimide resins, polyurethane resins, and the like.
  • the epoxy resin include bisphenol type epoxy resin, novolac type epoxy resin, biphenyl type epoxy resin and the like.
  • the dispersion state of the conductive particles is not particularly limited, but is preferably a uniform dispersion state. Moreover, it is preferable that most of the conductive particles are not in direct contact with each other. Thereby, the anisotropy which has electroconductivity only in the pressurization direction is provided.
  • the conductive particles dispersed in the resin include particles made of a second metal and a first metal that coats at least a part of the surface of the particle.
  • conductive particles 1 in which the surfaces of particles made of the second metal 12 are coated with the first metal 11 can be cited (FIG. 1).
  • the particle diameter of the particles made of the second metal is not particularly limited, but the average particle diameter is preferably 1 to 20 ⁇ m.
  • the first metal covers substantially the entire surface of the particles made of the second metal. This is because the area where the first metal and the second metal are in contact with each other increases, so that an intermetallic compound is efficiently generated.
  • the thickness of the coating layer composed of the first metal is equal to or less than a predetermined thickness so that substantially all of the first metal is converted into an intermetallic compound by heating and pressurization during electrode joining. It is preferable to set to. For example, when heating at 250 ° C. and pressurization at 4 MPa is performed for 2 minutes and the particle diameter of the particles made of the second metal is 5 ⁇ m, the thickness of the coating layer made of the first metal is 2 ⁇ m to 3 ⁇ m. It is preferable.
  • the first metal is made of Sn or an alloy containing 70% by weight or more of Sn. That is, the first metal is a metal composed of Sn alone or an alloy containing 70 wt% or more of Sn. As an alloy containing 70 wt% or more of Sn, 70 wt% or more of Sn, Cu, Ni, Ag, Au, Sb, Zn, Bi, In, Ge, Al, Co, Mn, Fe, Cr, Mg, And an alloy containing at least one selected from the group consisting of Mn, Pd, Si, Sr, Te and P.
  • the second metal (Cu—Ni) necessary for producing a desired intermetallic compound (Cu 2 NiSn, Cu 2 MnSn, Ni—Sn intermetallic compound, Mn—Sn intermetallic compound, Sn—Cu intermetallic compound, etc.) is obtained. It is possible to supply a sufficient amount of Sn, which is a reaction component with an alloy or a Cu—Mn alloy. When the content of Sn in the first metal is less than 70% by weight, the amount of Sn is insufficient and a desired amount of intermetallic compound is not generated, and an interelectrode joint excellent in heat resistance cannot be obtained. When the first metal is an alloy, it is preferable that Sn is contained in an amount of 85% by weight or more because the above-described effect can be obtained with certainty.
  • the second metal is made of a Cu—Ni alloy or a Cu—Mn alloy having a melting point higher than that of the first metal.
  • the Cu—Ni alloy is an alloy whose main components are Cu and Ni, and may contain other metal components.
  • the Cu—Mn alloy is an alloy whose main components are Cu and Mn, and may contain other metal components. Examples of the Cu—Ni alloy include Cu-10Ni, and examples of the Cu—Mn alloy include Cu-10Mn.
  • the numeral 10 of “Cu-10Ni” indicates the value by weight of the component (in this case, Ni), and the same applies to other descriptions.
  • the ratio of Ni in the Cu—Ni alloy is preferably 10 to 15% by weight.
  • the ratio of Mn in the Cu—Mn alloy is preferably 10 to 15% by weight.
  • Ni or Mn necessary and sufficient to produce a desired intermetallic compound can be supplied.
  • the ratio of Ni in the Cu—Ni alloy and the ratio of Mn in the Cu—Mn alloy is less than 10% by weight, all Sn in the first metal tends to remain without becoming an intermetallic compound. Further, even when the ratio of Ni in the Cu—Ni alloy and the ratio of Mn in the Cu—Mn alloy exceeds 15 wt%, all Sn in the first metal tends to remain without being an intermetallic compound.
  • the electrode joining method of the present invention comprises: It is a method of joining the two or more electrodes by heating and pressurizing the anisotropic conductive sheet between the two or more electrodes, An intermetallic compound having a melting point of 300 ° C. or more generated by the reaction between the first metal and the second metal is generated at a joint portion of the two or more electrodes.
  • Electrode Examples of the two or more electrodes (conductor layers) include electrodes used for various known wiring boards.
  • a material of the electrode for example, copper, silver, aluminum, SUS, nickel, gold, or an alloy thereof can be used, and copper or a copper alloy is preferable.
  • an electrode consists of conductor foil.
  • the resin constituting the resin sheet provided with the electrode is not particularly limited as long as it is a material having electrical insulation properties, but preferably includes a thermoplastic resin.
  • the thermoplastic resin include polyimide, liquid crystal polymer (LCP), polyether ketone resin (PEEK), polyphenylene sulfide resin (PPS), and polyether imide.
  • the resin sheet containing a thermoplastic resin for example, the thermosetting resin (polyimide: PI) sheet
  • the same kind of resin as the resin constituting the anisotropic conductive sheet may be used, or a different kind of resin may be used.
  • the junction between the via-hole conductor and the conductor layer contains an intermetallic compound having a melting point of 300 ° C. or higher generated by the reaction between the first metal and the second metal.
  • the intermetallic compound preferably contains Cu2NiSn or Cu2MnSn.
  • a wiring board including a joint portion formed of these intermetallic compounds having a melting point of 300 ° C. or higher is excellent in heat resistance and impact resistance.
  • the difference in lattice constant between the second metal and the intermetallic compound initially formed on the surface of the second metal when heated and pressed in contact with the first metal is the lattice constant of the second metal.
  • it is a Cu—Ni alloy or a Cu—Mn alloy which is a metal (including an alloy) that is 50% or more.
  • the “intermetallic compound that is first generated on the surface of the second metal” is an intermetallic compound that is first generated on the surface of the second metal after the heat treatment is started.
  • a ternary alloy composed of a metal constituting the second metal for example, Cu2NiSn, Cu2MnSn, preferably an alloy composed of Cu, Ni and Sn, or an alloy composed of Cu, Mn and Sn.
  • “Difference in lattice constant between the first intermetallic compound formed on the surface of the second metal and the second metal” refers to the lattice constant of the intermetallic compound first formed on the surface of the second metal (the length of the crystal axis). ) Minus the lattice constant of the second metal component (the length of the crystal axis). That is, this difference in lattice constant indicates how much the lattice constant of the intermetallic compound newly generated at the interface with the second metal is different from the lattice constant of the second metal. It does not matter whether the lattice constant of is large. Usually, the lattice constant of the intermetallic compound is larger than the lattice constant of the second metal component.
  • the intermetallic compound of the first metal and the second metal can be obtained.
  • the reaction to be generated can be accelerated, and an intermetallic compound can be generated by heat treatment at a relatively low temperature for a short time. Therefore, the low melting point first metal in the via-hole conductor is a high melting point intermetallic compound.
  • the via-hole conductor having excellent heat resistance is formed in a short time.
  • the difference in lattice constant between the intermetallic compound initially formed on the surface of the second metal and the second metal is less than 50% with respect to the lattice constant of the second metal. Even if the first metal and the second metal are used, such an effect cannot be obtained.
  • the resin 2 is electrically conductive.
  • An anisotropic conductive sheet in which the particles 1 are dispersed is interposed (FIG. 2A).
  • the electrode 3, the conductive particles 1, and the conductive particles 1 are firmly bonded via the intermetallic compound 13, and thus the reliability that does not depend on the durability of the resin. High junction structure can be obtained. Such a connection structure is also excellent in conductivity. Moreover, since there is anisotropy in conductivity, a short circuit between the electrodes is unlikely to occur, which can contribute to a higher density of electrode terminals.
  • the melting point of the intermetallic compound 13 is higher than the melting point of Sn which is a low melting point metal. Further, since the diffusion rate of the first metal and the second metal when the intermetallic compound is generated is high, Sn is mostly converted into the intermetallic compound and hardly remains, and the low melting point component in the heating process No outflow occurs. Therefore, a highly heat-resistant bonding structure that can withstand the mounting process by reflow is obtained.
  • the conductive particles that do not contribute to the bonding between the electrodes even after the bonding is performed since (the first metal particles and the second metal particles) remain independently in the resin, Sn having a low melting point in the first metal not forming an intermetallic compound remains, and this is the heat of reflow. There is a possibility of flowing out.
  • the temperature of the heat treatment (heating) preferably reaches 230 ° C. or higher for at least a certain time.
  • Sn melting point: 232 ° C.
  • the maximum temperature of heat processing is 300 degrees C or less. This is because when the temperature exceeds 300 ° C., the resin constituting the substrate 4 may flow out when the liquid crystal polymer (LCP) is included.
  • the pressurizing pressure is 0 Pa
  • the temperature at which the resin (LCP) starts to flow is about 315 ° C., although it depends on the molecular weight of the resin.
  • the pressure for pressurization is preferably 1 to 8 MPa.
  • the time for heating and pressurizing is preferably 10 seconds to 5 minutes.
  • the above mixed liquid was coated at a thickness of 30 ⁇ m on the PET film subjected to the mold release treatment, heated to 80 ° C. to dry the solvent, and an anisotropic conductive sheet was formed on the PET film.
  • a powder made of a Cu-10Ni alloy (Ni content: 10% by weight) with an average particle diameter of 15 ⁇ m and a 1 ⁇ m coating layer formed by tin electroless plating was used. Also, bisphenol A type epoxy resin was used as the resin, microcapsule type imidazole type curing agent was used as the curing agent, and methyl ethyl ketone was used as the solvent.
  • FR-4 Fluor Retardant Type 4
  • thermocompression bonding heat and pressurization
  • the pressure-bonded test substrate was heat-treated 10 times in a reflow oven at 260 ° C. for 4 minutes, and the change in resistance value before and after the treatment was measured.
  • the measurement of resistance value was implemented by making conduction
  • Sn flow-out was not confirmed.
  • 1 conductive particles 11 first metal (Sn), 12 second metal (Cu—Ni alloy), 13 intermetallic compound, 2 resin, 3 electrode (conductor layer), 4 substrate.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Powder Metallurgy (AREA)

Abstract

La présente invention concerne une feuille conductrice anisotrope qui contient une résine (2) et des particules conductrices (1) qui sont dispersées dans la résine (2), et qui est caractérisée en ce que : les particules conductrices (1) contiennent des particules qui sont formées d'un second métal (12) et d'un premier métal (11) qui recouvre au moins une partie des surface des particules ; le premier métal (11) est formé de Sn ou d'un alliage qui contient 70 % en poids ou plus de Sn ; et le second métal (12) est formé d'un alliage Cu-Ni ou d'un alliage Cu-Mn qui possède un point de fusion supérieur à celui du premier métal (11).
PCT/JP2013/067089 2012-06-25 2013-06-21 Feuille conductrice anisotrope et procédé de liaison d'électrode l'utilisant WO2014002893A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201380019393.4A CN104221223B (zh) 2012-06-25 2013-06-21 各向异性导电片材以及使用其的电极接合方法
JP2014522592A JP5783329B2 (ja) 2012-06-25 2013-06-21 異方性導電シート、および、それを用いた電極接合方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-141716 2012-06-25
JP2012141716 2012-06-25

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WO2014002893A1 true WO2014002893A1 (fr) 2014-01-03

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JP (1) JP5783329B2 (fr)
CN (1) CN104221223B (fr)
WO (1) WO2014002893A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016007888A1 (fr) * 2014-07-11 2016-01-14 Tyco Electronics Corporation Dispositif électrique
JP2016069231A (ja) * 2014-09-30 2016-05-09 株式会社村田製作所 ステンドグラスの製造方法、ステンドグラス接合用の金属ペースト
WO2016076094A1 (fr) * 2014-11-14 2016-05-19 株式会社村田製作所 Élément de jonction, procédé de jonction et composition métallique
WO2016167245A1 (fr) * 2015-04-16 2016-10-20 古河電気工業株式会社 Film adhésif électroconducteur et film de découpage/fixation de puces
WO2016194434A1 (fr) * 2015-05-29 2016-12-08 株式会社村田製作所 Dispositif de liaison et procédé de liaison
US10413992B2 (en) * 2014-01-07 2019-09-17 Murata Manufacturing Co., Ltd. Method for joining structural material, joining sheet, and joint structure
EP4312472A1 (fr) * 2022-07-26 2024-01-31 SK On Co., Ltd. Module de batterie comprenant une partie de liaison conductrice pour lier une carte de circuit imprimé et une fpcb, et procédé de liaison de carte de circuit imprimé

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US10413992B2 (en) * 2014-01-07 2019-09-17 Murata Manufacturing Co., Ltd. Method for joining structural material, joining sheet, and joint structure
WO2016007888A1 (fr) * 2014-07-11 2016-01-14 Tyco Electronics Corporation Dispositif électrique
JP2016069231A (ja) * 2014-09-30 2016-05-09 株式会社村田製作所 ステンドグラスの製造方法、ステンドグラス接合用の金属ペースト
WO2016076094A1 (fr) * 2014-11-14 2016-05-19 株式会社村田製作所 Élément de jonction, procédé de jonction et composition métallique
JPWO2016076094A1 (ja) * 2014-11-14 2017-07-06 株式会社村田製作所 接合部材の接合方法、金属組成物
WO2016167245A1 (fr) * 2015-04-16 2016-10-20 古河電気工業株式会社 Film adhésif électroconducteur et film de découpage/fixation de puces
JPWO2016167245A1 (ja) * 2015-04-16 2017-11-24 古河電気工業株式会社 導電性接着フィルムおよびダイシングダイボンディングフィルム
WO2016194434A1 (fr) * 2015-05-29 2016-12-08 株式会社村田製作所 Dispositif de liaison et procédé de liaison
JPWO2016194434A1 (ja) * 2015-05-29 2018-02-08 株式会社村田製作所 接合用部材および接合方法
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EP4312472A1 (fr) * 2022-07-26 2024-01-31 SK On Co., Ltd. Module de batterie comprenant une partie de liaison conductrice pour lier une carte de circuit imprimé et une fpcb, et procédé de liaison de carte de circuit imprimé

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