WO2013134894A1 - 一种叠层线圈类器件的制造方法 - Google Patents
一种叠层线圈类器件的制造方法 Download PDFInfo
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- WO2013134894A1 WO2013134894A1 PCT/CN2012/000366 CN2012000366W WO2013134894A1 WO 2013134894 A1 WO2013134894 A1 WO 2013134894A1 CN 2012000366 W CN2012000366 W CN 2012000366W WO 2013134894 A1 WO2013134894 A1 WO 2013134894A1
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000000919 ceramic Substances 0.000 claims abstract description 46
- 239000004020 conductor Substances 0.000 claims abstract description 17
- 239000012212 insulator Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 19
- 239000000084 colloidal system Substances 0.000 claims description 11
- 238000007650 screen-printing Methods 0.000 claims description 10
- 238000007639 printing Methods 0.000 claims description 4
- 239000011230 binding agent Substances 0.000 claims description 3
- 238000010329 laser etching Methods 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 2
- 239000004615 ingredient Substances 0.000 claims description 2
- 238000005336 cracking Methods 0.000 abstract description 3
- 230000032798 delamination Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 238000005245 sintering Methods 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 238000005520 cutting process Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 27
- 229910000859 α-Fe Inorganic materials 0.000 description 9
- 239000000843 powder Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(iii) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 description 2
- 238000001354 calcination Methods 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000010017 direct printing Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- UPWOEMHINGJHOB-UHFFFAOYSA-N oxo(oxocobaltiooxy)cobalt Chemical compound O=[Co]O[Co]=O UPWOEMHINGJHOB-UHFFFAOYSA-N 0.000 description 2
- CBECDWUDYQOTSW-UHFFFAOYSA-N 2-ethylbut-3-enal Chemical compound CCC(C=C)C=O CBECDWUDYQOTSW-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- JTHNLKXLWOXOQK-UHFFFAOYSA-N n-propyl vinyl ketone Natural products CCCC(=O)C=C JTHNLKXLWOXOQK-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/042—Printed circuit coils by thin film techniques
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
Definitions
- the present invention relates to a method of fabricating a laminated coil type device.
- Stacked power coil devices include stacked high current magnetic beads, stacked power inductors, and stacked power Type transformers, etc. It is widely used in power lines of various portable products because of its high reliability, ease of mass production, ease of miniaturization, and thinness.
- the conventional laminated coil type device is shown in FIG. 2, and is printed directly on the ceramic insulating layer 202. Pole 201.
- the electrode paste is printed, it will inevitably spread out to both sides, and it is difficult to form a narrow and thick electrode, which will reduce the area enclosed by the coil and thus reduce the inductance or impedance of the product; 3
- the thickness of the electrode 201 is increased by the method of multiple printing, since the electrode 201 is convex at the time of lamination, the bonding of the ceramic insulating layer 202 is significantly affected, and an electrode short circuit occurs. Bad air gap 203, cracking and delamination.
- Japanese Patent No. 11-97244 proposes that each segment of the electrode coil is connected in parallel and then integrated. A method of spiraling a coil to reduce the DC resistance of the product.
- this method causes a decrease in the inductance or impedance of the product due to a large increase in the length of the magnetic circuit, and on the other hand, it also becomes This increases the cost of the product and limits the thinning of the product.
- An object of the present invention is to provide a method of fabricating a stacked power type coil type device having a low thickness and a low DC resistance.
- the object of the present invention can be achieved by designing a method of manufacturing a laminated coil type device comprising the following steps:
- the ceramic insulating layer sheet and the coil layer sheet with the coil conductor are laminated and cut in order to form a unit size, thereby obtaining a laminate.
- the step C is implemented in the following two ways:
- step B screen printing on the ceramic insulator sheet with conductive vias obtained in step B
- the method is to print the ceramic colloid out of the main body of the coil layer sheet, and at the set position of the coil layer sheet, the ceramic colloid is not printed to form a coil-shaped groove;
- step C201 taking the ceramic insulator sheet obtained in step A, forming a coil-shaped groove at a coil layer setting position by laser etching;
- the ceramic insulator sheet forming the coil-shaped groove and the strip obtained in step B are electrically conductive
- the conductive paste with Ag as a main component is printed by a screen printing method at the groove of the coil shape, and the thickness of the conductive paste is equal to or slightly larger than the groove depth.
- An internal electrode is formed.
- the coil conductor of the coil layer sheet of the present invention is filled in the groove of the ceramic sheet, on the one hand
- the printed coil conductor is not spread out, and the width of the electrode is controlled so as not to reduce the enveloping area of the coil and cause the inductance or the impedance to decrease; on the other hand, the electrode does not protrude significantly and affects the interlayer bonding. Therefore, there are no defects such as coil short circuit, air gap, cracking, and delamination.
- it is convenient to produce a narrow and thick coil electrode, so that it can be used to produce extremely low direct current Low-cost, small-sized, low-thickness laminated power coils with large inductance or impedance.
- Figure 1 is a schematic view showing the lamination of a laminated coil type device
- Figure 2 is a schematic view of a section 101 in Figure 1, which is a schematic cross-sectional view of the electrode at the time of direct printing;
- Figure 3 is a schematic cross-sectional view showing the electrode layer when the coil layer sheet obtained by the two-layer direct printing method is superposed;
- Figure 4 is a schematic cross-sectional view showing the electrode of the coil layer sheet of the present invention.
- Figure 5 is a top perspective view of the laminate before sintering.
- a method of manufacturing a laminated coil type device comprising the steps of:
- the laminate to be cut is heated in air at about 400 ° C for 2 hours to remove the binder. Ingredients; again, the laminate is sintered in air at 850 to 910 ° C for 2 to 6 hours;
- a conductive paste containing Ag as a main component is applied by a dipping method or the like. It was sintered in air at about 600 ° C for 1 hour, thereby forming an external electrode.
- the coil conductor of the present invention is not directly printed on the surface of the ceramic sheet, but is embedded in the ceramic
- the inside of the ceramic sheet, that is, a groove in the shape of a coil is formed on the ceramic sheet, and then the coil conductor paste is filled in the groove by screen printing. As shown in Figure 4.
- the step C includes the following steps:
- step B screen printing on the ceramic insulator sheet with conductive vias obtained in step B
- the method is to print the ceramic colloid out of the main body of the coil layer sheet, and at the set position of the coil layer sheet, 4 the ceramic colloid is not printed to form a coil-shaped groove;
- the conductive colloid with Ag as the main component is a conductive colloid commonly used in the industry.
- Method 2 includes the following steps:
- step C201 taking the ceramic insulator sheet obtained in step A, forming a coil-shaped groove at a coil layer setting position by laser etching;
- a ceramic insulator sheet forming a coil-shaped groove and a conductive via hole obtained in step B After the ceramic insulator sheets are laminated, a conductive paste with Ag as a main component is printed by a screen printing method at a groove of a coil shape, and the thickness of the conductive paste is equal to or slightly larger than the groove depth. An internal electrode is formed.
- a laminated power inductor will be described as an example.
- Ceramic material forming a laminated power inductor for ferrite, the ferrite component is a component used in the industry to manufacture products such as laminated power inductors.
- the production method is as follows: First, weigh Fe2O3, CuO, ZnO, NiO according to the specified amount. The powder is compounded, for example, wet-mixed by a ball mill or the like, and then dried, followed by calcination to obtain a ferrite material, wherein the calcination is usually carried out at 700 to 1300 ° C for 2 to 8 hours.
- a ferrite colloid was prepared on the basis of obtaining a ferrite fine powder.
- Making ferrite colloids, and The same methods are used in the manufacture of products such as laminated power inductors.
- An organic solvent such as ethyl acetate, ethanol, isopropanol, terpineol or the like and an organic binder such as poly are added to the above ferrite fine powder.
- a vinyl butyral, an ethyl cellulose, an acrylic resin, etc. may be added, if necessary, a plasticizer, a dispersing agent, or the like. These were mixed to obtain a ferrite colloid.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
一种叠层线圈类器件的制造方法,涉及的叠层线圈类器件包括将形成线圈的导体与绝缘体叠层而形成的叠层体,制造方法包括以下步骤:A、制成陶瓷绝缘层薄片;B、形成带导电通孔的陶瓷绝缘层薄片;C、形成带线圈导体的线圈层薄片,使线圈导体嵌于陶瓷绝缘层薄片内;D、将陶瓷绝缘层薄片和带线圈导体的线圈层薄片按照预定次序叠层并切断得到叠层体;E、将被切断的叠层体除去胶结料成分,将此叠层体烧结;F、在叠层体的两端部上,形成外部电极。叠层线圈类器件的制造方法可方便地制作具有低的直流电阻,而且无分层、开裂、气隙等不良的叠层功率型线圈类器件。
Description
本发明涉及一种叠层线圈类器件的制作方法。
叠层功率型线圈类器件包括叠层大电流磁珠、叠层功率电感及叠层功率
型变压器等。由于其具有可靠性高、易于大批量生产、易于小型化及薄型化 等优点,被广泛应用于各种便携产品的电源线路中。
对叠层功率型线圈类器件,要求其采用一定陶瓷材料时,在较小尺寸,
尤其是较薄厚度的产品空间内实现较大的阻抗或电感量,特别要求产品具有 极低的直流电阻以能承受大电流。分析可知,使线圈电极截面又窄又厚是叠
层功率型线圈类器件达到上述目标的最有效方法。
传统的叠层线圈类器件如图2 所示,是在陶瓷绝缘层202上直接印刷电
极201。然而,一方面,电极浆料印刷后不可避免的会向两边摊开,难以形成 窄且厚的电极,这将会减小线圈包围的面积进而降低产品的电感量或阻抗; 另一方面如图3
所示,即使采用多次印刷的方法增大电极201 厚度,但在叠层时由于电极201凸起,会明显影响陶瓷绝缘层202的结合,出现电极短路、
气隙203、开裂及分层等不良。
为解决传统叠层线圈类器件的问题,中国专利CN201138593Y 提出在一
个产品中采用多个相隔离的线圈并联的方法降低磁珠的直流电阻。但很明显, 并联线圈会降低产品的电感量或阻抗,而多个线圈并联也会成倍增加产品的
成本,且使产品薄型化受到限制。
又,日本专利11-97244 提出将电极线圈的各段分别多组并联后再整体构
成螺旋状线圈的方法,以此来降低产品的直流电阻。然而,此方法一方面由 于大幅增加了磁路长度而导致产品电感量或阻抗下降,另一方面也同样会成
倍增加产品的成本且使产品薄型化受到限制。
本发明的目的在于提供一种制作具有低厚度及低直流电阻的叠层功率型 线圈类器件的方法。
本发明的目的可以这样实现,设计一种叠层线圈类器件的制造方法,包 括以下步骤:
A、制成陶瓷绝缘层薄片;
B、将部分陶瓷绝缘层薄片制成带导电通孔的陶瓷绝缘层薄片;
C、形成带线圈导体的线圈层薄片,使线圈导体嵌于陶瓷绝缘体薄片内部;
D、将陶瓷绝缘层薄片和带线圈导体的线圈层薄片按次序叠层切断使形成 单位尺寸,从而得到叠层体。
所述步骤C 有以下两种方法实现:
方法一:
C101、在步骤B 得到的带导电通孔的陶瓷绝缘体薄片上,采用丝网印刷
的方法将陶瓷胶体印刷出线圈层薄片的主体,在线圈层薄片的设定位置,则 未印刷上陶瓷胶体而形成线圈形状的沟槽;
C102、采用丝网印刷的方法将以Ag 为主要成分的导电胶体印刷在线圈
形状的沟槽处,且导电胶体的厚度等于或略大于沟槽的深度,形成内部电极。
方法二:
C201、取步骤A 得到的陶瓷绝缘体薄片,采用激光刻蚀的方法在线圈层 设定位置形成线圈形状的沟槽;
C202、将形成线圈形状沟槽的陶瓷绝缘体薄片与步骤B 得到的带导电通
孔的陶瓷绝缘体薄片叠合后,再采用丝网印刷的方法将以Ag 为主要成分的导 电胶体印刷在线圈形状的沟槽处,且导电胶体的厚度等于或略大于沟槽深度,
形成内部电极。
本发明所述线圈层薄片的线圈导体填充在陶瓷薄片的沟槽内,一方面可
使印刷后的线圈导体不会摊开,电极的宽度受控,不至于使线圈包围面积减 小而导致电感量或阻抗降低;另一方面电极不会明显凸起而影响层间结合,
因此不会出现线圈短路、气隙、开裂及分层等不良。总而言之,采用本发明 3 所述方法,可方便制作出既窄且厚的线圈电极,因此可用于制作极低直流电
阻的大电感量或阻抗的低成本、小尺寸、低厚度的叠层功率型线圈类器。
图1 叠层线圈类器件的叠层示意图;
图2 是图1 中截面101 示意图,为直接印刷法时电极处的截面示意图;
图3 表示叠合两层直接印刷法所得线圈层薄片时,电极处的截面示意图;
图4 是本发明制作线圈层薄片的电极处截面示意图;
图5 为烧结前叠层体的俯视透视图。
以下结合实施例对本发明作进一步的描述。
一种叠层线圈类器件的制造方法,包括以下步骤:
A、制成陶瓷绝缘层薄片;
B、将部分陶瓷绝缘层薄片制成带导电通孔的陶瓷绝缘层薄片;
C、形成带线圈导体的线圈层薄片,使线圈导体嵌于陶瓷绝缘体薄片内部;
D、将陶瓷绝缘层薄片和带线圈导体的线圈层薄片按次序叠层切断使形成 单位尺寸,从而得到叠层体;
E、将被切断的叠层体在空气中,在约400℃下加热2 小时,除去胶结料
成分;再次,将此叠层体在空气中,在850~910℃下烧结2~6 小时;
F、在叠层体的两端部上,使用浸渍法等涂敷以Ag为主成分的导电胶体,
并在空气中于约600℃下烧结1小时,由此形成外部电极。
本发明所述的线圈导体并非直接印刷于陶瓷薄片的表面上,而是嵌于陶
瓷薄片的内部,即在陶瓷薄片上先形成线圈形状的沟槽,然后采用丝网印刷 的方法将线圈导体浆料填充于沟槽内。如图4 所示。
制作线圈层薄片有两种方法。
方法一、所述步骤C 包括以下步骤:
C101、在步骤B 得到的带导电通孔的陶瓷绝缘体薄片上,采用丝网印刷
的方法将陶瓷胶体印刷出线圈层薄片的主体,在线圈层薄片的设定位置,则 4 未印刷上陶瓷胶体而形成线圈形状的沟槽;
C102、采用丝网印刷的方法将以Ag 为主要成分的导电胶体印刷在线圈形
状的沟槽处,且导电胶体的厚度等于或略大于沟槽的深度,形成内部电极。
以Ag 为主要成分的导电胶体为现在业界常用的导电胶体。
方法二、所述步骤C 包括以下步骤:
C201、取步骤A 得到的陶瓷绝缘体薄片,采用激光刻蚀的方法在线圈层 设定位置形成线圈形状的沟槽;
C202、将形成线圈形状沟槽的陶瓷绝缘体薄片与步骤B得到的带导电通孔
的陶瓷绝缘体薄片叠合后,再采用丝网印刷的方法将以Ag为主要成分的导电 胶体印刷在线圈形状的沟槽处,且导电胶体的厚度等于或略大于沟槽深度,
形成内部电极。
以制造叠层功率型电感器为例进行说明。形成叠层功率电感的陶瓷材料
为铁氧体,该铁氧体的组分为现在业界制造叠层功率电感等产品所采用的组 分。在此简述一下制作方法为:首先按规定量称取Fe2O3、CuO、ZnO、NiO
的粉末,进行配合,例如利用球磨机等进行湿式混合,接着将其干燥,随后 进行煅烧得到铁氧体材料,其中煅烧通常以700~1300℃进行2-8小时。接着可
根据需要添加用以降低烧结温度和调节材料物性的微量Bi2O3、Co2O3等,用砂 磨机等将其粉碎到规定粒径,得到所需铁氧体微细粉末;
在取得铁氧体微细粉末的基础上制作铁氧体胶体。制作铁氧体胶体,与
现在业界制造叠层功率电感等产品所采用的方法相同。在上述铁氧体微细粉 末中加入有机溶剂如乙酸乙酯、乙醇、异丙醇、松油醇等和有机粘合剂如聚
乙烯醇缩丁醛、乙基纤维素、丙烯酸树脂等,根据需要也可添加增塑剂、分 散剂等。将这些混匀后得到铁氧体胶体。
Claims (9)
- 一种叠层线圈类器件的制造方法,其特征在于包括以下步骤:A、制成陶瓷绝缘层薄片;B、将部分陶瓷绝缘层薄片制成带导电通孔的陶瓷绝缘层薄片;C、形成带线圈导体的线圈层薄片,使线圈导体嵌于陶瓷绝缘层薄片内;D、将陶瓷绝缘层薄片和带线圈导体的线圈层薄片按次序叠层切断使形成 单位尺寸,从而得到叠层体。
- 根据权利要求1 所述的叠层线圈类器件的制造方法,其特征在于, 所述步骤C 包括以下步骤:C101、在步骤B 得到的带导电通孔的陶瓷绝缘体薄片上,采用丝网印刷 的方法将陶瓷胶体印刷出线圈层薄片的主体,在线圈层薄片的设定位置,则 未印刷上陶瓷胶体而形成线圈形状的沟槽;C102、采用丝网印刷的方法将以Ag 为主要成分的导电胶体印刷在线圈形 状的沟槽处,且导电胶体的厚度等于或略大于沟槽的深度,形成内部电极。
- 根据权利要求1 所述的叠层线圈类器件的制造方法,其特征在于, 所述步骤C 包括以下步骤:C201、取步骤A 得到的陶瓷绝缘体薄片,采用激光刻蚀的方法在线圈层 设定位置形成线圈形状的沟槽;C202、将形成线圈形状沟槽的陶瓷绝缘体薄片与步骤B 得到的带导电通 孔的陶瓷绝缘体薄片叠合后,再采用丝网印刷的方法将以Ag 为主要成分的导 电胶体印刷在线圈形状的沟槽处,且导电胶体的厚度等于或略大于沟槽深度, 形成内部电极。
- 根据权利要求2 或权利要求3 所述的叠层线圈类器件的制造方法, 其特征在于:所述线圈形状的沟槽尺寸为沟槽深度与沟槽宽度之比≥20%。
- 根据权利要求2 或权利要求3 所述的叠层线圈类器件的制造方法, 其特征在于:所述形成单位尺寸的线圈层薄片的线圈烧结前外缘至薄片边缘 的距离≤120um。
- 根据权利要求2 或权利要求3 所述的叠层线圈类器件的制造方法, 2 其特征在于:所述形成单位尺寸的线圈层薄片其中线圈包围面积占薄片平面 面积的比例≥30%。
- 根据权利要求1 所述的叠层线圈类器件的制造方法,其特征在于: 所述陶瓷绝缘层薄片的厚度为10~60um。
- 根据权利要求1 所述的叠层线圈类器件的制造方法,其特征在于: 所述带导电通孔的陶瓷绝缘层薄片,导电通孔的直径为50~200um。
- 根据权利要求1 所述的叠层线圈类器件的制造方法,其特征在于, 还包括以下步骤:E、将被切断的叠层体在空气中,在约400℃下加热2 小时,除去胶结料 成分;再次,将此叠层体在空气中,在850~910℃下烧结2~6 小时;F、在叠层体的两端部上,使用浸渍法等涂敷以Ag 为主成分的导电性胶 体,并在空气中于约600℃下烧结1 小时,由此形成外部电极。
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JP7140481B2 (ja) | 2017-09-25 | 2022-09-21 | 日東電工株式会社 | インダクタおよびその製造方法 |
CN110391081A (zh) * | 2018-04-16 | 2019-10-29 | 弘邺科技有限公司 | 磁感应元件的线圈印刷方法 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03219605A (ja) * | 1990-01-24 | 1991-09-27 | Murata Mfg Co Ltd | 積層型インダクタンス素子 |
CN1781166A (zh) * | 2003-11-28 | 2006-05-31 | 株式会社村田制作所 | 层叠式陶瓷电子元件及其制造方法 |
CN101556854A (zh) * | 2008-04-09 | 2009-10-14 | 深圳振华富电子有限公司 | 叠层片式线圈集成件及其制造方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4117878C2 (de) * | 1990-05-31 | 1996-09-26 | Toshiba Kawasaki Kk | Planares magnetisches Element |
JP3114323B2 (ja) * | 1992-01-10 | 2000-12-04 | 株式会社村田製作所 | 積層チップコモンモードチョークコイル |
JPH09326329A (ja) * | 1996-04-02 | 1997-12-16 | Matsushita Electric Ind Co Ltd | セラミック積層デバイス用部材の製造方法及びセラミック積層デバイス用部材 |
US6194248B1 (en) * | 1997-09-02 | 2001-02-27 | Murata Manufacturing Co., Ltd. | Chip electronic part |
JP2000195720A (ja) * | 1998-10-22 | 2000-07-14 | Taiyo Yuden Co Ltd | 積層電子部品 |
EP1008997B1 (en) * | 1998-12-11 | 2004-10-27 | Matsushita Electric Industrial Co., Ltd. | High-Q inductor for high frequency |
JP3582454B2 (ja) * | 1999-07-05 | 2004-10-27 | 株式会社村田製作所 | 積層型コイル部品及びその製造方法 |
JP2001118731A (ja) * | 1999-10-19 | 2001-04-27 | Murata Mfg Co Ltd | チップ型複合電子部品およびその製造方法 |
JP3551876B2 (ja) * | 2000-01-12 | 2004-08-11 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法 |
US6429763B1 (en) * | 2000-02-01 | 2002-08-06 | Compaq Information Technologies Group, L.P. | Apparatus and method for PCB winding planar magnetic devices |
JP3610881B2 (ja) * | 2000-05-22 | 2005-01-19 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法及び積層セラミック電子部品 |
JP3791406B2 (ja) * | 2001-01-19 | 2006-06-28 | 株式会社村田製作所 | 積層型インピーダンス素子 |
JP2002305123A (ja) * | 2001-04-06 | 2002-10-18 | Murata Mfg Co Ltd | 積層セラミック電子部品の製造方法及び積層インダクタの製造方法 |
CN100584146C (zh) * | 2005-04-19 | 2010-01-20 | Tdk株式会社 | 多层陶瓷基板及其制造方法 |
US7323948B2 (en) * | 2005-08-23 | 2008-01-29 | International Business Machines Corporation | Vertical LC tank device |
US7638988B2 (en) * | 2006-02-21 | 2009-12-29 | Virginia Tech Intellectual Properties, Inc. | Co-fired ceramic inductors with variable inductance, and voltage regulator having same |
-
2012
- 2012-03-14 CN CN2012100654232A patent/CN102592817A/zh active Pending
- 2012-03-23 US US13/978,542 patent/US9251952B2/en active Active
- 2012-03-23 WO PCT/CN2012/000366 patent/WO2013134894A1/zh active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03219605A (ja) * | 1990-01-24 | 1991-09-27 | Murata Mfg Co Ltd | 積層型インダクタンス素子 |
CN1781166A (zh) * | 2003-11-28 | 2006-05-31 | 株式会社村田制作所 | 层叠式陶瓷电子元件及其制造方法 |
CN101556854A (zh) * | 2008-04-09 | 2009-10-14 | 深圳振华富电子有限公司 | 叠层片式线圈集成件及其制造方法 |
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