WO2013108937A1 - 熱伝導改良剤 - Google Patents
熱伝導改良剤 Download PDFInfo
- Publication number
- WO2013108937A1 WO2013108937A1 PCT/JP2013/051514 JP2013051514W WO2013108937A1 WO 2013108937 A1 WO2013108937 A1 WO 2013108937A1 JP 2013051514 W JP2013051514 W JP 2013051514W WO 2013108937 A1 WO2013108937 A1 WO 2013108937A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thermal conductivity
- weight
- magnesium hydroxide
- hydroxide particles
- thickness
- Prior art date
Links
- 239000003623 enhancer Substances 0.000 title abstract 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims abstract description 68
- 239000000347 magnesium hydroxide Substances 0.000 claims abstract description 68
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims abstract description 68
- 239000002245 particle Substances 0.000 claims abstract description 58
- 229920005989 resin Polymers 0.000 claims abstract description 30
- 239000011347 resin Substances 0.000 claims abstract description 30
- 239000011342 resin composition Substances 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 26
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 12
- 239000000194 fatty acid Substances 0.000 claims description 12
- 229930195729 fatty acid Natural products 0.000 claims description 12
- 150000004665 fatty acids Chemical class 0.000 claims description 10
- 239000012756 surface treatment agent Substances 0.000 claims description 10
- 229920002379 silicone rubber Polymers 0.000 claims description 9
- 239000004945 silicone rubber Substances 0.000 claims description 9
- 239000011777 magnesium Substances 0.000 claims description 8
- 239000011247 coating layer Substances 0.000 claims description 7
- 239000007822 coupling agent Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 239000004480 active ingredient Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000003945 anionic surfactant Substances 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- 150000003014 phosphoric acid esters Chemical class 0.000 claims description 5
- 150000005846 sugar alcohols Polymers 0.000 claims description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- 239000005749 Copper compound Substances 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 150000001869 cobalt compounds Chemical class 0.000 claims description 2
- 150000001880 copper compounds Chemical class 0.000 claims description 2
- 150000002506 iron compounds Chemical class 0.000 claims description 2
- 150000002697 manganese compounds Chemical class 0.000 claims description 2
- 150000002816 nickel compounds Chemical class 0.000 claims description 2
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 150000003682 vanadium compounds Chemical class 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 229920002545 silicone oil Polymers 0.000 claims 1
- -1 phosphorus compound Chemical class 0.000 description 23
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 6
- YIXJRHPUWRPCBB-UHFFFAOYSA-N magnesium nitrate Chemical compound [Mg+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O YIXJRHPUWRPCBB-UHFFFAOYSA-N 0.000 description 6
- 239000000395 magnesium oxide Substances 0.000 description 6
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 6
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 6
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 159000000003 magnesium salts Chemical class 0.000 description 5
- 239000001632 sodium acetate Substances 0.000 description 5
- 235000017281 sodium acetate Nutrition 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- WWSJZGAPAVMETJ-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-3-ethoxypyrazol-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C=1C(=NN(C=1)CC(=O)N1CC2=C(CC1)NN=N2)OCC WWSJZGAPAVMETJ-UHFFFAOYSA-N 0.000 description 4
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- 238000000975 co-precipitation Methods 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 4
- 239000013500 performance material Substances 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 150000008055 alkyl aryl sulfonates Chemical class 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- 235000011114 ammonium hydroxide Nutrition 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 229910001629 magnesium chloride Inorganic materials 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000010298 pulverizing process Methods 0.000 description 3
- 235000011121 sodium hydroxide Nutrition 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- 238000004073 vulcanization Methods 0.000 description 3
- 239000004636 vulcanized rubber Substances 0.000 description 3
- ALSTYHKOOCGGFT-KTKRTIGZSA-N (9Z)-octadecen-1-ol Chemical compound CCCCCCCC\C=C/CCCCCCCCO ALSTYHKOOCGGFT-KTKRTIGZSA-N 0.000 description 2
- VBICKXHEKHSIBG-UHFFFAOYSA-N 1-monostearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 description 2
- 239000005695 Ammonium acetate Substances 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 235000019257 ammonium acetate Nutrition 0.000 description 2
- 229940043376 ammonium acetate Drugs 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 2
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- 238000001095 inductively coupled plasma mass spectrometry Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 2
- 235000019341 magnesium sulphate Nutrition 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 2
- XMLQWXUVTXCDDL-UHFFFAOYSA-N oleyl alcohol Natural products CCCCCCC=CCCCCCCCCCCO XMLQWXUVTXCDDL-UHFFFAOYSA-N 0.000 description 2
- 229940055577 oleyl alcohol Drugs 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000012763 reinforcing filler Substances 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- JXKPEJDQGNYQSM-UHFFFAOYSA-M sodium propionate Chemical compound [Na+].CCC([O-])=O JXKPEJDQGNYQSM-UHFFFAOYSA-M 0.000 description 2
- 239000004324 sodium propionate Substances 0.000 description 2
- 235000010334 sodium propionate Nutrition 0.000 description 2
- 229960003212 sodium propionate Drugs 0.000 description 2
- 150000003871 sulfonates Chemical class 0.000 description 2
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- RZRNAYUHWVFMIP-KTKRTIGZSA-N 1-oleoylglycerol Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCC(O)CO RZRNAYUHWVFMIP-KTKRTIGZSA-N 0.000 description 1
- IEKHISJGRIEHRE-UHFFFAOYSA-N 16-methylheptadecanoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O IEKHISJGRIEHRE-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- ZFFMLCVRJBZUDZ-UHFFFAOYSA-N 2,3-dimethylbutane Chemical group CC(C)C(C)C ZFFMLCVRJBZUDZ-UHFFFAOYSA-N 0.000 description 1
- QLZJUIZVJLSNDD-UHFFFAOYSA-N 2-(2-methylidenebutanoyloxy)ethyl 2-methylidenebutanoate Chemical compound CCC(=C)C(=O)OCCOC(=O)C(=C)CC QLZJUIZVJLSNDD-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- VWVRASTUFJRTHW-UHFFFAOYSA-N 2-[3-(azetidin-3-yloxy)-4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]pyrazol-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound O=C(CN1C=C(C(OC2CNC2)=N1)C1=CN=C(NC2CC3=C(C2)C=CC=C3)N=C1)N1CCC2=C(C1)N=NN2 VWVRASTUFJRTHW-UHFFFAOYSA-N 0.000 description 1
- IKOKHHBZFDFMJW-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-3-(2-morpholin-4-ylethoxy)pyrazol-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C=1C(=NN(C=1)CC(=O)N1CC2=C(CC1)NN=N2)OCCN1CCOCC1 IKOKHHBZFDFMJW-UHFFFAOYSA-N 0.000 description 1
- HVTQDSGGHBWVTR-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-3-phenylmethoxypyrazol-1-yl]-1-morpholin-4-ylethanone Chemical compound C(C1=CC=CC=C1)OC1=NN(C=C1C=1C=NC(=NC=1)NC1CC2=CC=CC=C2C1)CC(=O)N1CCOCC1 HVTQDSGGHBWVTR-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- MGGVALXERJRIRO-UHFFFAOYSA-N 4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-2-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-1H-pyrazol-5-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C=1C(=NN(C=1)CC(=O)N1CC2=C(CC1)NN=N2)O MGGVALXERJRIRO-UHFFFAOYSA-N 0.000 description 1
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 1
- 235000021357 Behenic acid Nutrition 0.000 description 1
- DPUOLQHDNGRHBS-UHFFFAOYSA-N Brassidinsaeure Natural products CCCCCCCCC=CCCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- URXZXNYJPAJJOQ-UHFFFAOYSA-N Erucic acid Natural products CCCCCCC=CCCCCCCCCCCCC(O)=O URXZXNYJPAJJOQ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004113 Sepiolite Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000004699 Ultra-high molecular weight polyethylene Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229920001895 acrylonitrile-acrylic-styrene Polymers 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 238000004630 atomic force microscopy Methods 0.000 description 1
- 229940116226 behenic acid Drugs 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 235000011116 calcium hydroxide Nutrition 0.000 description 1
- 159000000007 calcium salts Chemical class 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- ZSBRYDJXHOFQMW-UHFFFAOYSA-N chloroethene;ethene;ethenyl acetate Chemical compound C=C.ClC=C.CC(=O)OC=C ZSBRYDJXHOFQMW-UHFFFAOYSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- DPUOLQHDNGRHBS-KTKRTIGZSA-N erucic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-KTKRTIGZSA-N 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- PAJKBYQWGBVBPE-UHFFFAOYSA-N ethene;terephthalic acid Chemical compound C=C.C=C.C=C.OC(=O)C1=CC=C(C(O)=O)C=C1 PAJKBYQWGBVBPE-UHFFFAOYSA-N 0.000 description 1
- MASNVFNHVJIXLL-UHFFFAOYSA-N ethenyl(ethoxy)silicon Chemical compound CCO[Si]C=C MASNVFNHVJIXLL-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 229920006228 ethylene acrylate copolymer Polymers 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- YQEMORVAKMFKLG-UHFFFAOYSA-N glycerine monostearate Natural products CCCCCCCCCCCCCCCCCC(=O)OC(CO)CO YQEMORVAKMFKLG-UHFFFAOYSA-N 0.000 description 1
- RZRNAYUHWVFMIP-HXUWFJFHSA-N glycerol monolinoleate Natural products CCCCCCCCC=CCCCCCCCC(=O)OC[C@H](O)CO RZRNAYUHWVFMIP-HXUWFJFHSA-N 0.000 description 1
- SVUQHVRAGMNPLW-UHFFFAOYSA-N glycerol monostearate Natural products CCCCCCCCCCCCCCCCC(=O)OCC(O)CO SVUQHVRAGMNPLW-UHFFFAOYSA-N 0.000 description 1
- 238000010559 graft polymerization reaction Methods 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 238000009775 high-speed stirring Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000010335 hydrothermal treatment Methods 0.000 description 1
- 229920002681 hypalon Polymers 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 description 1
- 239000011654 magnesium acetate Substances 0.000 description 1
- 235000011285 magnesium acetate Nutrition 0.000 description 1
- 229940069446 magnesium acetate Drugs 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000006078 metal deactivator Substances 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- 229930014626 natural product Natural products 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 235000011007 phosphoric acid Nutrition 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920005671 poly(vinyl chloride-propylene) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920005629 polypropylene homopolymer Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
- 235000011118 potassium hydroxide Nutrition 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052624 sepiolite Inorganic materials 0.000 description 1
- 235000019355 sepiolite Nutrition 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical group [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 description 1
- 229920001862 ultra low molecular weight polyethylene Polymers 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 238000004876 x-ray fluorescence Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
- C01F5/00—Compounds of magnesium
- C01F5/14—Magnesium hydroxide
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
- C01F5/00—Compounds of magnesium
- C01F5/14—Magnesium hydroxide
- C01F5/20—Magnesium hydroxide by precipitation from solutions of magnesium salts with ammonia
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
- C01F5/00—Compounds of magnesium
- C01F5/14—Magnesium hydroxide
- C01F5/22—Magnesium hydroxide from magnesium compounds with alkali hydroxides or alkaline- earth oxides or hydroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
- C08L9/06—Copolymers with styrene
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/10—Particle morphology extending in one dimension, e.g. needle-like
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/54—Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/32—Thermal properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/2224—Magnesium hydroxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/016—Additives defined by their aspect ratio
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
Definitions
- the present invention relates to a heat conduction improver, a resin composition containing the same, and a molded product thereof.
- the present invention also relates to a method for improving the thermal conductivity of a resin composition.
- Magnesium oxide, aluminum oxide, silica, and the like have been used so far as thermal conductivity improvers for synthetic resins, rubbers, ceramics, and the like (Patent Document 1).
- Silica has low thermal conductivity.
- Aluminum oxide has high heat conductivity but high hardness, and therefore has a drawback of wearing a molding machine and a mold during molding. Therefore, magnesium oxide, which has a low hardness and has a thermal conductivity approximately three times that of alumina, has attracted attention as a thermal conductivity improver.
- magnesium oxide is gradually attacked by water or water vapor to change to magnesium hydroxide, and has the disadvantage that physical properties are lost.
- Various improvements have been made with the aim of higher thermal conductivity.
- Patent Document 2 the surface of magnesium oxide having a coating layer of a double oxide of silicon and / or aluminum and magnesium
- Patent Document 3 magnesium oxide surface-coated with a phosphorus compound
- Patent Document 4 A technique using magnesium hydroxide as a heat conduction improving agent has also been proposed (Patent Document 4).
- Patent Document 4 A technique using magnesium hydroxide as a heat conduction improving agent has also been proposed.
- An object of the present invention is to provide a heat conduction improving agent capable of improving the thermal conductivity of a resin.
- a further object of the present invention is to provide a resin composition having excellent mechanical strength such as tensile strength and elongation, and high thermal conductivity, and a molded product thereof.
- this invention is providing the method of improving the thermal conductivity of a resin composition.
- This inventor advanced the research which improves the heat conduction improving agent which uses magnesium hydroxide particle as an active ingredient. As a result, it has been found that magnesium hydroxide particles having a high aspect ratio have an excellent effect as a thermal conductivity improver, and the present invention has been completed.
- the present invention is a thermal conductivity improver comprising magnesium hydroxide particles having an thickness of 10 nm to 0.2 ⁇ m and an aspect ratio (major axis / thickness) by SEM of 10 or more as an active ingredient.
- the present invention also relates to a resin composition comprising (i) 100 parts by weight of resin and (ii) 20 to 300 parts by weight of a thermal conductivity improver, wherein the thermal conductivity improver is 10 nm to 0.2 ⁇ m.
- the resin composition is a magnesium hydroxide particle having a thickness and an aspect ratio (major axis / thickness) by SEM of 10 or more.
- this invention is a molded article which consists of the said resin composition.
- the present invention is a method for improving the thermal conductivity of a resin composition containing a resin and magnesium hydroxide particles, having a thickness of 10 nm to 0.2 ⁇ m with respect to 100 parts by weight of the resin, and SEM
- 20 to 300 parts by weight of magnesium hydroxide particles having an aspect ratio (major axis / thickness) of 10 or more are blended.
- the thermal conductivity improver of the present invention comprises magnesium hydroxide particles having a thickness of 10 nm to 0.2 ⁇ m and an aspect ratio (major axis / thickness) by SEM of 10 or more as an active ingredient.
- the thickness of the magnesium hydroxide particles is 10 nm to 0.2 ⁇ m, preferably 10 nm to 0.15 ⁇ m, more preferably 10 nm to 0.08 ⁇ m, as measured by the SEM method.
- the lower limit of the thickness of the magnesium hydroxide particles may be 20 nm.
- the thickness of the magnesium hydroxide particles is an arithmetic average (average thickness) of measured values of the thickness of any ten crystallites in the SEM photograph (20,000 magnifications).
- the aspect ratio (major axis / thickness) of the magnesium hydroxide particles is 10 or more, preferably 15 or more, more preferably 10 to 100, and still more preferably 50 to 200.
- the aspect ratio of the magnesium hydroxide particles is a value obtained by dividing the average major axis obtained from the arithmetic average of the major axis measurements of any ten crystallites by the average thickness in the SEM photograph (20,000 magnifications).
- the BET specific surface area of the magnesium hydroxide particles is preferably 5 to 30 m 2 / g, more preferably 10 to 30 m 2 / g, more preferably 10 to 25 m 2 / g, and further preferably 10 to 20 m 2 / g. is there.
- Magnesium hydroxide particles have a CaO content of 0.01% by weight or less, a Cl content of 0.05% by weight or less, an Na content of 0.01% by weight or less, an iron compound, a manganese compound, a cobalt compound, and chromium.
- the total content of the compound, copper compound, vanadium compound and nickel compound is preferably 0.02% by weight or less in terms of metal.
- the magnesium hydroxide particles have an Mg (OH) 2 content of preferably 99.0% by weight or more, more preferably 99.5% by weight or more, and further preferably 99.8% by weight or more.
- Magnesium hydroxide particles can be produced by hydrothermally treating a slurry obtained by adding alkali to a water-soluble magnesium salt and hydroprecipitating the magnesium hydroxide particles. Magnesium oxide is obtained.
- the water-soluble magnesium salt include magnesium chloride, magnesium nitrate, magnesium acetate, and magnesium sulfate.
- the alkali include caustic soda, calcium hydroxide, potassium hydroxide, and aqueous ammonia.
- monovalent organic acids include acetic acid, propionic acid, butyric acid, and formic acid.
- those sodium salt, potassium salt, magnesium salt, calcium salt etc. are mentioned.
- the amount of alkali used is preferably 20 to 200 mol, more preferably 30 to 100 mol, and still more preferably 40 to 90 mol, with respect to 1 mol of the water-soluble magnesium salt.
- the amount of the monovalent organic acid used is preferably 0.001 to 10 mol, more preferably 0.01 to 5.0 mol, and still more preferably 0.05 to 3.0, with respect to 1 mol of the water-soluble magnesium salt. Is a mole.
- the temperature of the hydrothermal treatment is preferably 100 to 300 ° C, more preferably 110 to 250 ° C, and still more preferably 130 to 200 ° C. (Surface treatment agent)
- the magnesium hydroxide particles are preferably subjected to a surface treatment with a surface treatment agent.
- Surface treatment agents include higher fatty acids, anionic surfactants, phosphate esters, coupling agents (silane, titanate, aluminum), polyhydric alcohol and fatty acid esters, acrylic polymers, and silicone treatment agents. And at least one selected from the group consisting of and the like.
- higher fatty acids include higher fatty acids having 10 or more carbon atoms such as stearic acid, erucic acid, palmitic acid, lauric acid, and behenic acid, and alkali metal salts of these higher fatty acids.
- Anionic surfactants include higher alcohol sulfates such as stearyl alcohol and oleyl alcohol, polyethylene glycol ether sulfates, amide bond sulfates, ester bond sulfates, ester bond sulfonates, and amide bond sulfonates. , Ether bond sulfonate, ether bond alkylaryl sulfonate, ester bond alkylaryl sulfonate, amide bond alkylaryl sulfonate, and the like.
- phosphate esters include mono- or diesters such as orthophosphoric acid and oleyl alcohol, stearyl alcohol, or a mixture of both, and their acid forms, alkali metal salts, amine salts, and the like.
- As coupling agents vinyl ethoxysilane, vinyl-tris (2-methoxy-ethoxy) silane, gamma-methacryloxypropyltrimethoxysilane, gamma-aminopropyltrimethoxysilane, beta- (3,4-epoxycyclohexyl) ethyltrimethoxy Silane coupling agents such as silane, gamma-glycidoxypropyltrimethoxysilane, gamma-mercaptopropyltrimethoxysilane; isopropyltriisostearoyl titanate, isopropyltris (dioctylpyrophosphate) titanate, isopropyltri (N-amino
- Examples of polyhydric alcohol and fatty acid esters include glycerol monostearate and glycerol monooleate.
- Surface treatment of magnesium hydroxide particles using a surface treatment agent can be carried out by a wet or dry method known per se.
- the surface treatment agent may be added in a liquid or emulsion form to a magnesium hydroxide slurry and mechanically mixed sufficiently at a temperature up to about 100 ° C.
- the surface treatment agent may be added in a liquid, emulsion, or solid form with sufficient stirring with a mixer such as a Henschel mixer, and mixed sufficiently under heating or non-heating.
- the addition amount of the surface treatment agent is preferably 10% by weight or less, more preferably 1.0 to 8.0% by weight, more preferably 1.0 to 3.0% by weight, based on the weight of the magnesium hydroxide particles. It is.
- the surface-treated magnesium hydroxide particles can be made into a final product form by appropriately selecting and implementing means such as water washing, dehydration, granulation, drying, pulverization, and classification, if necessary.
- (Coating layer) In order to increase the acid resistance of the magnesium hydroxide particles, the surface of the magnesium hydroxide particles can be coated with a coating agent having acid resistance.
- the coating agent is, for example, an oxide or hydroxide of at least one element selected from the group consisting of silicon, aluminum, titanium, zirconia, zinc and boron.
- a coating layer made of silicon oxide or hydroxide formed by the action of silicic acid and its soluble salts.
- the amount of the coating agent used is preferably 2% by weight or less, more preferably 0.01 to 1.5% by weight, and more preferably 0.01 to 1.0% by weight with respect to the magnesium hydroxide particles.
- the surface of the coating layer is further treated with at least one surface treatment agent selected from the group consisting of higher fatty acids, anionic surfactants, phosphate esters, coupling agents, and esters of polyhydric alcohols and fatty acids. be able to.
- the resin composition of the present invention is a resin composition containing (i) 100 parts by weight of resin and (ii) 20 to 300 parts by weight of a thermal conductivity improver, and the thermal conductivity improver is 20 nm to 0 nm.
- the resin composition is magnesium hydroxide particles having a thickness of 2 ⁇ m and an aspect ratio (major axis / thickness) by SEM of 10 or more.
- the resin composition of the present invention can be used as a sealing material for heat-generating parts such as semiconductors, resistors and capacitors, and as a material for parts requiring heat dissipation such as a base, a housing, a heat exchanger, and a bearing.
- the resin may be any resin that is usually used as a molded product.
- examples thereof include polymers or copolymers of C 2 to C 8 olefins ( ⁇ -olefins) such as polyethylene, polypropylene, ethylene / propylene copolymers, polybuden, poly-4-methylpentene-1, and the like.
- thermoplastic resin examples include polyolefin or a copolymer thereof.
- polypropylene homopolymer polypropylene resin such as ethylene propylene copolymer, high density polyethylene, low density polyethylene, linear low density polyethylene, ultra low density polyethylene, EVA (ethylene vinyl acetate resin), EEA (Ethylene ethyl acrylate resin), EMA (ethylene methyl acrylate copolymer resin), EAA (ethylene acrylic acid copolymer resin), polyethylene resins such as ultrahigh molecular weight polyethylene, polybutene, poly 4-methylpentene-1, etc. And C 2 to C 6 olefin ( ⁇ -ethylene) polymers or copolymers.
- thermosetting resins such as epoxy resins, phenol resins, melamine resins, unsaturated polyester resins, alkyd resins, urea resins, and EPDM, butyl rubber, isoprene rubber, SBR, NBR, chlorosulfonated polyethylene, NIR, urethane rubber, butadiene
- examples thereof include synthetic rubbers such as rubber, acrylic rubber, silicone rubber, and fluorine rubber.
- the content of the magnesium hydroxide particles in the resin composition is preferably 10 to 300 parts by weight, more preferably 25 to 200 parts by weight with respect to 100 parts by weight of the resin.
- the resin composition of the present invention may contain a thermal conductivity improving aid.
- the heat conductivity improving aid inorganic substances on the fiber or chain are used, and these may be natural products or synthetic products.
- examples of the fibrous inorganic substance include basic magnesium sulfate, carbon fiber, wollastonite, aluminum borate, potassium titanate, sepiolite, and zonotolite.
- examples of the substance include acetylene black.
- the content of the thermal conductivity improving aid in the resin composition is preferably 200 parts by weight or less, more preferably 0.01 to 150 parts by weight, and even more preferably 0.1 to 100 parts by weight with respect to 100 parts by weight of the resin. It is weight.
- additives, reinforcing materials, fillers and the like can be added to the resin composition of the present invention, and examples thereof include a vulcanizing agent, an antioxidant, an ultraviolet absorber, a flame retardant, a light stabilizer, Metal deactivators, end agents, colorants, hardeners, lubricants, nucleating agents, foaming agents, deodorizers, lithopone, clay, wood chips, glass fiber, ferrite, carbon black, talc, mica, calcium carbonate, red
- additives such as phosphorus, tin and inorganic salts thereof, metal fibers and metal powders, reinforcing materials, and fillers.
- the present invention includes a molded article made of the resin composition.
- the present invention is a method for improving the thermal conductivity of a resin composition containing a resin and magnesium hydroxide particles, having a thickness of 10 nm to 0.2 ⁇ m with respect to 100 parts by weight of the resin, and an SEM method
- the above method is characterized in that 20 to 300 parts by weight of magnesium hydroxide particles having an aspect ratio (major axis / thickness) of 10 or more are blended.
- the resin and magnesium hydroxide particles are as described above.
- the characteristics of the magnesium hydroxide particles and the resin composition were measured by the following methods.
- A Thermal conductivity: According to ISO / CD 22007-2. Apparatus: Hot disk method thermophysical property measuring apparatus TPA-501 (manufactured by Kyoto Electronics) 7 mm ⁇ sensor RTK-7 is used.
- B BET specific surface area: Measured according to the method described in “Catalyst” (Vol. 2 No. 4, page 473, 1960 Tokuji Takagi).
- C Aspect ratio: SEM method: Obtained from the arithmetic average of measured values of the major axis and thickness of any ten crystallites in an SEM photograph (magnification of 20000?) Of magnesium hydroxide particles.
- Atomic force microscopy Measured with OLS3500 type manufactured by OLYMPUS.
- D CaO, Cl, Na: X-ray fluorescence method (base: atomic absorption method)
- E Analysis of Fe, Mn, Cu, V, Co, Ni, Cr: ICP-MS method (Inductively Coupled Plasma-Mass Spectrometry)
- F Mg (OH) 2 : Chelate titration method
- g Tensile strength: JIS K6301 (vulcanized rubber physical test method)
- H Elongation: JIS K6301 (vulcanized rubber physical test method)
- I Hardness: JIS K6253 (spring type A)
- the total amount of the reaction product was hydrothermally treated at 160 ° C. for 5 hours using a 1.0 KL autoclave. After cooling to 100 ° C. or lower, the product was taken out from the autoclave, filtered, washed with water, dried and pulverized. The obtained magnesium hydroxide was observed with an SEM, a photograph was taken, and the major axis and thickness of 10 crystallites were measured and averaged. As a result, the major axis was 2.6 ⁇ m, the thickness was 0.12 ⁇ m, and thus the aspect ratio was 21. The aspect ratio measured with an atomic force microscope was 46.
- Example 5 surface treatment 500 g of the magnesium hydroxide particles obtained in Example 1 were put in a Henschel mixer, and 5 g of vinylsilane corresponding to 1% by weight with respect to the weight of the magnesium hydroxide particles was diluted with 50 mL of ethanol with high-speed stirring and added. Surface treated. This was dried at 120 ° C.
- Example 1 In Example 1, it carried out like Example 1 except not using sodium acetate.
- the major axis of the crystallites of the obtained magnesium hydroxide particles was 0.77 ⁇ m, the thickness was 0.14 ⁇ m, and the aspect ratio was 5.5.
- the aspect ratio measured with an atomic force microscope was 10.
- Table 1 shows the characteristics of the magnesium hydroxide particles obtained in Examples 1 to 4 and Comparative Example 1.
- Example 6 100 parts by weight of dimethyl vinyl silicone rubber (TSE201 Momentive Performance Materials Japan GK) and 100 parts by weight of magnesium hydroxide particles obtained in Example 1 as a heat conductive filler are charged into a kneader and kneaded. went.
- a sufficiently kneaded dimethylvinyl silicone rubber compound is taken out, and a crosslinking agent, 2.5-dimethyl-2,5-t-butylperoxyhexane (TC-8, manufactured by Momentive Performance Materials Japan GK) 1.0 weight part was mixed uniformly and the composition was prepared.
- the obtained composition was made into a sheet having a thickness of 2 mm, subjected to press vulcanization under conditions of 160 ° C. ⁇ 10 minutes, and then subjected to secondary vulcanization at 200 ° C. ⁇ 4 hours. Then, after returning to normal temperature and 24 hours passed, the hardness, tensile strength, and elongation of the sheet were measured according to JIS-K6301 (vulcanized rubber physical test method).
- Example 7 A sheet was prepared in the same manner as in Example 6 except that the magnesium hydroxide particles obtained in Example 1 were replaced with the magnesium hydroxide particles obtained in Example 2, and the thermal conductivity was measured. The evaluation results are shown in Table 2.
- Example 8 A sheet was prepared in the same manner as in Example 6 except that the magnesium hydroxide particles obtained in Example 1 were replaced with the magnesium hydroxide particles obtained in Example 3, and the thermal conductivity was measured. The evaluation results are shown in Table 2.
- Example 9 A sheet was prepared in the same manner as in Example 6 except that the magnesium hydroxide particles obtained in Example 1 were replaced with the magnesium hydroxide particles obtained in Example 4, and the thermal conductivity was measured. The evaluation results are shown in Table 2.
- Comparative Example 2 A sheet was prepared in the same manner as in Example 6 except that the magnesium hydroxide particles obtained in Example 1 were replaced with the magnesium hydroxide particles obtained in Comparative Example 1 in Example 6, and the thermal conductivity was measured. The evaluation results are shown in Table 2.
- Example 10-1 Preparation of heat dissipation sheet 100 parts by weight of dimethyl vinyl silicone rubber (TSE201 Momentive Performance Materials Japan GK) and 25 parts by weight of magnesium hydroxide particles obtained in Example 4 were kneaded with a biaxial open roll.
- Example 10-2 to Example 10-4 (Preparation of heat dissipation sheet) A heat radiating sheet was prepared in the same manner as in Example 10-1, except that the amount of magnesium hydroxide particles obtained in Example 4 was changed to the amount shown in Table 3. The evaluation results are shown in Table 3.
- Example 10-5 300 g of the magnesium hydroxide obtained in Example 2 was pulverized and dispersed in isopropyl alcohol using a stirrer, and then 9 g of methyl hydrogen silicone (Shin-Etsu Chemical Co., KF-9901) was added for surface treatment.
- Example 10-6 After pulverizing the magnesium hydroxide obtained in Example 3 and treating the surface with silicone in the same manner as in Example 5, 100 parts by weight of dimethylvinylsilicone rubber was blended, and then kneaded and molded.
- a test piece was prepared. Table 3 shows the thermal conductivity measurement results of this test piece. Comparative Example 3 Instead of 25 parts by weight of the magnesium hydroxide particles obtained in Example 4 in Example 10-1, 100 parts by weight of Kisuma 8 (magnesium hydroxide manufactured by Kyowa Chemical Industry Co., Ltd., aspect ratio 4.8 by SEM method) was used. Except using, the heat-radiation sheet was prepared similarly to Example 10-1, and the heat conductivity was measured. The evaluation results are shown in Table 3.
- the thermal conductivity improving agent of the present invention contains magnesium hydroxide particles having a high aspect ratio as an active ingredient, it can impart high thermal conductivity to the resin.
- the resin composition containing the thermal conductivity improving agent of the present invention has high thermal conductivity. According to the method for improving the thermal conductivity of the present invention, the thermal conductivity of the resin composition can be improved without lowering the physical properties of the resin composition.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Geology (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Composite Materials (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
Abstract
Description
本発明者は、水酸化マグネシウム粒子を有効成分とする熱伝導改良剤を改良する研究を進めた。その結果、高いアスペクト比を有する水酸化マグネシウム粒子が、熱伝導性改良剤として優れた効果を奏することを見出し、本発明を完成した。
すなわち本発明は、10nm~0.2μmの厚みを有し、かつSEM法によるアスペクト比(長径/厚み)が10以上である水酸化マグネシウム粒子を有効成分とする熱伝導性改良剤である。
また本発明は、(i)100重量部の樹脂および(ii)20~300重量部の熱伝導性改良剤を含有する樹脂組成物であって、熱伝導性改良剤は10nm~0.2μmの厚みを有し、かつSEM法によるアスペクト比(長径/厚み)が10以上の水酸化マグネシウム粒子である前記樹脂組成物である。
また本発明は、前記樹脂組成物からなる成形品である。
さらに本発明は、樹脂および水酸化マグネシウム粒子を含有する樹脂組成物の熱伝導性を向上させる方法であって、樹脂100重量部に対して、10nm~0.2μmの厚みを有し、かつSEM法によるアスペクト比(長径/厚み)が10以上である水酸化マグネシウム粒子を20~300重量部配合させることを特徴とする前記方法である。
本発明の熱伝導性改良剤は、10nm~0.2μmの厚みを有し、かつSEM法によるアスペクト比(長径/厚み)が10以上である水酸化マグネシウム粒子を有効成分とする。
水酸化マグネシウム粒子の厚みは、SEM法による測定で10nm~0.2μm、好ましくは10nm~0.15μm、さらに好ましくは10nm~0.08μmである。水酸化マグネシウム粒子の厚みの下限は20nmでもよい。水酸化マグネシウム粒子の厚みは、SEM写真(20,000倍率)中、任意の10個の結晶子の厚さの測定値の算術平均である(平均厚み)。
水酸化マグネシウム粒子のアスペクト比(長径/厚み)は、10以上、好ましくは15以上、より好ましくは、10~100、さらに好ましくは50~200である。水酸化マグネシウム粒子のアスペクト比は、SEM写真(20,000倍率)中、任意の10個の結晶子の長径の測定値の算術平均から求めた平均長径を平均厚みで除した値である。
水酸化マグネシウム粒子のBET法比表面積は、好ましくは5~30m2/g、より好ましくは10~30m2/g、より好ましくは10~25m2/g、さらに好ましくは10~20m2/gである。
水酸化マグネシウム粒子は、CaO含有量が0.01重量%以下、Cl含有量が0.05重量%以下、Na含有量が0.01重量%以下、さらに鉄化合物、マンガン化合物、コバルト化合物、クロム化合物、銅化合物、バナジウム化合物およびニッケル化合物の合計含有量が、金属に換算して0.02重量%以下であることが好ましい。
水酸化マグネシウム粒子は、Mg(OH)2含有量が、好ましくは99.0重量%以上、より好ましくは99.5重量%以上、さらに好ましくは99.8重量%以上である。
(水酸化マグネシウム粒子の製造方法)
水酸化マグネシウム粒子は、水溶性マグネシウム塩にアルカリを加え共沈させたスラリーを水熱処理して水酸化マグネシウム粒子を製造する際に1価有機酸を存在させると、アスペクト比が高い本発明の水酸化マグネシウムが得られる。
水溶性マグネシウム塩として、塩化マグネシウム、硝酸マグネシウム、酢酸マグネシウム、硫酸マグネシウム等が挙げられる。アルカリとして、苛性ソーダ、水酸化カルシウム、水酸化カリウム、アンモニア水等が挙げられる。1価の有機酸として、酢酸、プロピオン酸、酪酸、蟻酸が挙げられる。またそれらのナトリウム塩、カリウム塩、マグネシウム塩、カルシウム塩等が挙げられる。
アルカリの使用量は、水溶性マグネシウム塩1モルに対して、好ましくは20~200モル、より好ましくは30~100モル、さらに好ましくは40~90モルである。1価有機酸の使用量は、水溶性マグネシウム塩1モルに対して、好ましくは0.001~10モル、より好ましくは0.01~5.0モル、さらに好ましくは0.05~3.0モルである。
水熱処理の温度は、好ましくは100~300℃、より好ましくは110~250℃、さらに好ましくは130~200℃である。
(表面処理剤)
水酸化マグネシウム粒子は、表面処理剤で表面処理をすることが好ましい。表面処理剤としては、高級脂肪酸類、アニオン系界面活性剤、リン酸エステル類、カップリング剤(シラン系、チタネート系、アルミニウム系)および多価アルコールと脂肪酸のエステル類、アクリルポリマーおよびシリコーン処理剤等からなる群から選ばれた少なくとも1種が挙げられる。
高級脂肪酸類として、ステアリン酸、エルカ酸、パルミチン酸、ラウリン酸、ベヘニン酸等の炭素数10以上の高級脂肪酸類、これら高級脂肪酸のアルカリ金属塩が挙げられる。
アニオン系界面活性剤として、ステアリルアルコールやオレイルアルコール等の高級アルコールの硫酸エステル塩、ポリエチレングリコールエーテルの硫酸エステル塩、アミド結合硫酸エステル塩、エステル結合硫酸エステル塩、エステル結合スルホネート、アミド結合スルホン酸塩、エーテル結合スルホン酸塩、エーテル結合アルキルアリールスルホン酸塩、エステル結合アルキルアリールスルホン酸塩、アミド結合アルキルアリールスルホン酸塩等が挙げられる。
リン酸エステル類として、オルトリン酸とオレイルアルコール、ステアリルアルコール等のモノまたはジエステルまたは両者の混合物であって、それらの酸型またはアルカリ金属塩またはアミン塩等が挙げられる。
カップリング剤として、ビニルエトキシシラン、ビニル−トリス(2−メトキシ−エトキシ)シラン、ガンマ−メタクリロキシプロピルトリメトキシシラン、ガンマ−アミノプロピルトリメトキシシラン、ベーター(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、ガンマ−グリシドキシプロピルトリメトキシシラン、ガンマ−メルカプトプロピルトリメトキシシラン等のシランカップリング剤類;イソプロピルトリイソステアロイルチタネート、イソプロピルトリス(ジオクチルパイロフォスフェート)チタネート、イソプロピルトリ(N−アミノエチル−アミノエチル)チタネート、イソプロピルトリデシルベンゼンスルホニルチタネート等のチタネート系カップリング剤類;アセトアルコキシアルミニウムジイソプロピレート等のアルミニウム系カップリング剤類等が挙げられる。
多価アルコールと脂肪酸のエステル類として、グリセリンモノステアレート、グリセリンモノオレエート等が挙げられる。
表面処理剤を使用して、水酸化マグネシウム粒子の表面コーティング処理をするには、それ自体公知の湿式または乾式法により実施できる。例えば湿式法としては、水酸化マグネシウムのスラリーに該表面処理剤を液状またはエマルジョン状で加え、約100℃までの温度で機械的に十分混合すればよい。乾式法としては、水酸化マグネシウムの粉末をヘンシェルミキサー等の混合機により、十分攪拌下で表面処理剤を液状、エマルジョン状、固形状で加え、加熱または非加熱下に十分に混合すればよい。表面処理剤の添加量は、水酸化マグネシウム粒子の重量に基づいて、好ましくは10重量%以下、より好ましくは1.0~8.0重量%、より好ましくは1.0~3.0重量%である。
表面処理をした水酸化マグネシウム粒子は、必要により、例えば水洗、脱水、造粒、乾燥、粉砕、分級等の手段を適宜選択して実施し、最終製品形態とすることができる。
(被覆層)
水酸化マグネシウム粒子の耐酸性を上げるために、水酸化マグネシウム粒子の表面を、耐酸性を有する被覆剤より表面被覆することが出来る。被覆剤としては、例えばケイ素、アルミニウム、チタン、ジルコニア、亜鉛およびホウ素からなる群より選ばれる少なくとも一種の元素の、酸化物または水酸化物である。ケイ酸およびその可溶性塩類を作用させて形成したケイ素の酸化物または水酸化物からなる被覆層を有することが好ましい。
被覆剤の使用量は水酸化マグネシウム粒子に対し、好ましくは2重量%以下、より好ましくは0.01~1.5重量%、より好ましくは0.01~1.0重量%である。
被覆層の上をさらに、高級脂肪酸類、アニオン系界面活性剤、リン酸エステル類、カップリング剤および多価アルコールと脂肪酸のエステル類からなる群より選ばれる少なくとも一種の表面処理剤で表面処理することができる。
<樹脂組成物>
本発明の樹脂組成物は、(i)100重量部の樹脂および(ii)20~300重量部の熱伝導性改良剤を含有する樹脂組成物であって、熱伝導性改良剤は20nm~0.2μmの厚みを有し、かつSEM法によるアスペクト比(長径/厚み)が10以上の水酸化マグネシウム粒子である前記樹脂組成物である。
本発明の樹脂組成物は、半導体や抵抗体やコンデンサー等の発熱部分の封止材料、基盤、ハウジング、熱交換器、軸受け等の放熱性の要求される部品の材料として用いることができる。
樹脂は、通常、成形品として使用されるものであればよい。その例としてはポリエチレン、ポリプロピレン、エチレン/プロピレン共重合体、ポリブデン、ポリ・4−メチルペンテン−1等の如きC2~C8オレフィン(α−オレフィン)の重合体もしくは共重合体、これらオレフィンとジエンとの共重合体類、エチレン−アクリレート共重合体、ポリスチレン、ABS樹脂、AAS樹脂、AS樹脂、MBS樹脂、エチレン/塩ビ共重合樹脂、エチレン酢ビコポリマー樹脂、エチレン−塩ビ−酢ビグラフト重合樹脂、塩化ビニリデン、ポリ塩化ビニル、塩素化ポリエチレン、塩素化ポリプロピレン、塩ビプロピレン共重合体、酢酸ビニル樹脂、フェノキシ樹脂、ポリアセタール、ポリアミド、ポリイミド、ポリカーボネート、ポリスルホン、ポリフェニレンオキサイド、ポリフェニレンサルファイド、ポリエチレンテレフタレート、ポリブチレンテレフタレート、メタクリル樹脂等の熱可塑性樹脂が例示できる。
熱可塑性樹脂の好ましい例としては、ポリオレフィンまたはその共重合体が挙げられる。具体的には、ポリプロピレンホモポリマー、エチレンプロピレン共重合体の様なポリプロピレン系樹脂、高密度ポリエチレン、低密度ポリエチレン、直鎖状低密度ポリエチレン、超低密度ポリエチレン、EVA(エチレンビニルアセテート樹脂)、EEA(エチレンエチルアクリレート樹脂)、EMA(エチレンアクリル酸メチル共重合樹脂)、EAA(エチレンアクリル酸共重合樹脂)、超高分子量ポリエチレンの様なポリエチレン系樹脂、およびポリブテン、ポリ4−メチルペンテン−1等のC2~C6のオレフィン(α−エチレン)の重合体もしくは共重合体が挙げられる。
さらに、エポキシ樹脂、フェノール樹脂、メラミン樹脂、不飽和ポリエステル樹脂、アルキド樹脂、尿素樹脂等の熱硬化性樹脂およびEPDM、ブチルゴム、イソプレンゴム、SBR,NBR,クロロスルホン化ポリエチレン、NIR、ウレタンゴム、ブタジエンゴム、アクリルゴム、シリコーンゴム、フッ素ゴム等の合成ゴムを例示することができる。
樹脂組成物中の水酸化マグネシウム粒子の含有量は、100重量部の樹脂に対して、好ましくは10~300重量部、より好ましくは25~200重量である。
本発明の樹脂組成物は、熱伝導性改良助剤を含有していてもよい。熱伝導性改良助剤としては、繊維状または鎖上の無機物質が使用され、これらは天然品でも合成品でもよい。これら助剤の具体例を示すと、繊維状の無機物質としては、例えば、塩基性硫酸マグネシウム、炭素繊維、ワラスナイト、ホウ酸アルミニウム、チタン酸カリウム、セピオライト、ゾノトライトが例示され、また鎖状の無機物質としては、例えばアセチレンブラックが例示される。樹脂組成物中の熱伝導性改良助剤の含有量は、100重量部の樹脂に対して、好ましくは200重量部以下、より好ましくは0.01~150重量、さらに好ましくは0.1~100重量である。
本発明の樹脂組成物には、各種の添加剤、補強材、充填剤等を加えることが出来き、これらを例示すると加硫剤、酸化防止剤、紫外線吸収剤、難燃剤、光安定剤、金属不活性化剤、架端剤、着色剤、硬化剤、滑剤、造核剤、発泡剤、脱臭剤、リトポン、クレー、木片、ガラス繊維、フェライト、カーボンブラック、タルク、マイカ、炭酸カルシウム、赤燐、錫およびその無機塩類、金属繊維、金属粉末などの添加剤、補強材、充填剤が挙げられる。
<成形品>
本発明は、前記樹脂組成物からなる成形品を包含する。成形品として放熱シート、放熱板、放熱ケース、放熱カバーなどが挙げられる。
<樹脂組成物の熱伝導性を向上させる方法>
本発明は、樹脂および水酸化マグネシウム粒子を含有する樹脂組成物の熱伝導性を向上させる方法であって、樹脂100重量部に対して、10nm~0.2μmの厚みを有し、かつSEM法によるアスペクト比(長径/厚み)が10以上である水酸化マグネシウム粒子を20~300重量部配合させることを特徴とする前記方法を包含する。樹脂および水酸化マグネシウム粒子は前述の通りである。
(a)熱伝導率:ISO/CD 22007−2による。装置:ホットディスク法熱物性測定装置 TPA−501(京都電子工業製)7mmφセンサー RTK−7を使用。
(b)BET法比表面積:「触媒」(Vol.2 No.4 473ページ 1960年 高木徳二)記載の方法に従って測定した。
(c)アスペクト比:
SEM法:水酸化マグネシウム粒子のSEM写真(20000倍率?)中、任意の10個の結晶子の長径、厚さの測定値の算術平均から求める。
原子間力顕微鏡法:OLYMPUS社製 OLS3500タイプにより測定。
(d)CaO、Cl,Na:蛍光X線法(ベース:原子吸光法)
(e)Fe,Mn,Cu,V,Co,Ni,Crの分析:ICP−MS法(Inductively Coupled Plasma−Mass Spectrometry)
(f)Mg(OH)2:キレート滴定法
(g)引っ張り強さ :JIS K6301(加硫ゴム物理試験方法)
(h)伸び :JIS K6301(加硫ゴム物理試験方法)
(i)硬さ :JIS K6253(スプリング式タイプA)
実施例1
塩化マグネシウムと酢酸ソーダの混合水溶液(Mg=1.0モル/L,酢酸ソーダ=1.5モル/L、30℃)400Lに、3.0モル/Lの水酸化ナトリウム水溶液(30℃)213Lを攪拌下に加え共沈反応させた。この反応物全量を1.0KLオートクレーブにより160℃で5時間水熱処理を行った。100℃以下に冷却後、オートクレーブから取り出し、ろ過、水洗、乾燥、粉砕した。
得られた水酸化マグネシウムをSEMで観察し、写真をとり、10個の結晶子の長径と厚みを測定し平均した。その結果長径は、2.6μm、厚さは0.12μm、したがってアスペクト比が21であった。原子間力顕微鏡で測定したアスペクト比は46であった。
実施例2
試薬1級の塩化マグネシウムと酢酸ソーダの混合水溶液(Mg=2.0モル/L,酢酸ソーダ=2.0モル/L、30℃)4Lに、8モル/Lのアンモニア水溶液(30℃)1.8Lを攪拌下に加え共沈反応させた。この反応物1Lをとり、オートクレーブに入れ、250℃で3時間水熱処理を行った。100℃以下に冷却後、オートクレーブから取り出し、ろ過、水洗、乾燥、粉砕した。
得られた水酸化マグネシウムをSEMで観察し、写真をとり、10個の結晶子の横幅と厚みを測定し平均した。その結果横幅は、4.5μm、厚さは0.06μm、したがってアスペクト比が75であった。原子間力顕微鏡で測定したアスペクト比は130であった。
実施例3
試薬1級の硝酸マグネシウムとプロピオン酸ソーダの混合水溶液(Mg=1.5モル/L,プロピオン酸ソーダ=1.0モル/L,35℃)5Lに8モル/Lのカセイソーダ(35℃)1.6Lを攪拌下に加え共沈反応させた。この反応物1Lを取り、オートクレーブにより180℃で4時間水熱処理を行った後、実施例1と同様に処理した。
得られた水酸化マグネシウムをSEMで測定した結果、結晶の横幅は、3.8μm、厚さは0.09μm、アスペクト比は42であった。原子間力顕微鏡で測定したアスペクト比は73であった。
実施例4
硝酸マグネシウムと酢酸アンモニウムの混合水溶液(Mg=1.5モル/L,酢酸アンモニウム=1.5モル/L,35℃)400Lに4モル/Lのアンモニア水(35℃)240Lを攪拌下に加え共沈反応させた。この反応物全量を1.0KLオートクレーブにより200℃で4時間水熱処理を行った後、実施例1と同様にして行った。得られた水酸化マグネシウムをSEMで観察し、写真をとり測定した結果、結晶子の長径は、3.5μm、厚さは0.11μm、アスペクト比は31であった。原子間力顕微鏡で測定したアスペクト比は78であった。
実施例5(表面処理)
実施例1で得られた水酸化マグネシウム粒子500gをヘンシェルミキサーに入れ、高速攪拌下に水酸化マグネシウム粒子の重量に対し、1重量%に相当する5gのビニルシランを50mLのエタノールに希釈後、添加し表面処理した。これを120℃で乾燥した。
比較例1
実施例1において、酢酸ソーダを用いない以外は実施例1と同様に行った。得られた水酸化マグネシウム粒子の結晶子の長径は0.77μm、厚さは0.14μm、アスペクト比が5.5であった。原子間力顕微鏡で測定したアスペクト比は10であった。
実施例1~4、比較例1で得られた水酸化マグネシウム粒子の特性を表1に示す。
ジメチルビニルシリコーンゴム(TSE201 モメンティブ・パホーマンス・マテリアルズ・ジャパン合同会社製)100重量部と、熱伝導性充填剤として実施例1で得られた水酸化マグネシウム粒子100重量部をニーダーに仕込み、混練を行った。充分混練されたジメチルビニルシリコーンゴムコンパウンドを取り出し、これに架橋剤、2.5−ジメチル−2,5−t−ブチルパーオキシヘキサン(TC−8,モメンティブ・パホーマンス・マテリアルズ・ジャパン合同会社製)1.0重量部を均一に混合し組成物を調製した。
得られた組成物を厚さ2mmのシートとし,160℃×10分の条件でプレス加硫を行った後、200℃×4時間で二次加硫を行った。その後、常温に戻して24時間経過後に、シートの硬度、引っ張り強さ、伸びをJIS−K6301(加硫ゴム物理試験方法)に従って測定した。さらに熱伝導率をISO/CC22007−2に従い、ホットディスク法熱物性測定装置TPA−501(京都電子工業製)を用いて測定した。評価結果を表2に示す。
実施例7
実施例6において実施例1で得られた水酸化マグネシウム粒子を、実施例2で得られた水酸化マグネシウム粒子に置き換える以外は実施例6と同様にシートを調製し、熱伝導率を測定した。評価結果を表2に示す。
実施例8
実施例6において実施例1で得られた水酸化マグネシウム粒子を、実施例3で得られた水酸化マグネシウム粒子に置き換える以外は実施例6と同様にシートを調製し、熱伝導率を測定した。評価結果を表2に示す。
実施例9
実施例6において実施例1で得られた水酸化マグネシウム粒子を、実施例4で得られた水酸化マグネシウム粒子に置き換える以外は実施例6と同様にシートを調製し、熱伝導率を測定した。評価結果を表2に示す。
比較例2
実施例6において実施例1で得られた水酸化マグネシウム粒子を、比較例1で得られた水酸化マグネシウム粒子に置き換える以外は実施例6と同様にシートを調製し、熱伝導率を測定した。評価結果を表2に示す。
ジメチルビニルシリコーンゴム(TSE201 モメンティブ・パホーマンス・マテリアルズ・ジャパン合同会社製)100重量部と、実施例4で得られた水酸化マグネシウム粒子25重量部を二軸オープンロールで混練した。この場合のロール幅10目盛にて生のジメチルビニルシリコーンゴムをロールに巻き付け、高アスペクト比水酸化マグネシウム粒子を徐々に投入。ロール幅13目盛りで10回切り返し、加硫剤2.5−ジメチル−2,5−t−ブチルパーオキシヘキサン(TC−8、モメンティブ・パホーマンス・マテリアルズ・ジャパン合同会社製)を添加し、再度10回切り返し混連する。取り出しはロール幅15目盛で10回切り返し後、シリコーンゴムコンパウンドを採取した。
このシリコーンゴムコンパウンドを厚さ2mmのシートとし,160℃×10分の条件でプレス加硫を行った後、200℃×4時間で二次加硫を行い、放熱シートを調製した。その後、常温に戻して24時間経過後に、シートの、引っ張り強さ、伸び、硬度および熱伝導率を測定した。評価結果を表3に示す。
実施例10−2~実施例10−4(放熱シートの作成)
実施例4で得られた水酸化マグネシウム粒子の配合量を表3に示す量にする以外は、実施例10−1と同様に放熱シートを調製した。評価結果を表3に示す。
実施例10−5
実施例2で得られた水酸化マグネシウム300gを粉砕し、イソプロピルアルコールに攪拌機を用い、分散させた後、メチルハイドロジェンシリコーン(信越化学性、KF−9901)を9g加え、表面処理した。この後、ろ過、乾燥、粉砕した。この粉末を、ジメチルビニルシリコーンゴム100重量部に対し、100重量部、および架橋剤(パーオキサイド)を加え、オープンロールで、混合後、プレス成型機を用い160℃で、10分架橋させ、直径50mm、厚さ3.0mmに加圧成型した。この試料を用い、定常熱流法(ASTM E1530に準拠)で熱伝導率を測定した。その結果を表3に示す。
実施例10−6
実施例3で得られた水酸化マグネシウムを粉砕し、実施例5と同様にして、シリコーンで表面処理した後、ジメチルビニルシリコーンゴム100重量部に対し、100重量部配合した後、混練、成型し試験片を作成した。この試験片の、熱伝導性の測定結果を表3に示す。
比較例3
実施例10−1において実施例4で得られた水酸化マグネシウム粒子25重量部の代わりに、キスマ8(協和化学工業株式会社製水酸化マグネシウム、SEM法によるアスペクト比4.8)を100重量部用いる以外は、実施例10−1と同様に放熱シートを調製し熱伝導率を測定した。評価結果を表3に示す。
Claims (14)
- 10nm~0.2μmの厚みを有し、かつSEM法によるアスペクト比(長径/厚み)が10以上である水酸化マグネシウム粒子を有効成分とする熱伝導性改良剤。
- 水酸化マグネシウム粒子のアスペクト比が15以上である請求項1記載の熱伝導性改良剤。
- 水酸化マグネシウム粒子のBET法比表面積が10~30m2/gである請求項1記載の熱伝導性改良剤。
- 水酸化マグネシウム粒子の、CaO含有量が0.01重量%以下、Cl含有量が0.05重量%以下、Na含有量が0.01重量%以下、さらに鉄化合物、マンガン化合物、コバルト化合物、クロム化合物、銅化合物、バナジウム化合物およびニッケル化合物の合計含有量が、金属に換算して0.02重量%以下であり、Mg(OH)2含有量が99.5重量%以上である請求項1記載の熱伝導性改良剤。
- 高級脂肪酸類、アニオン系界面活性剤、リン酸エステル類、カップリング剤および多価アルコールと脂肪酸のエステル類、シリコーンオイル、からなる群より選ばれる少なくとも一種の表面処理剤により表面処理されている請求項1記載の熱伝導性改良剤。
- ケイ素、アルミニウム、チタン、ジルコニア、亜鉛およびホウ素からなる群より選ばれる少なくとも一種の元素の、酸化物または水酸化物からなる被覆層を有する請求項1記載の熱伝導性改良剤。
- ケイ酸およびその可溶性塩類を作用させて形成したケイ素の酸化物または水酸化物からなる被覆層を有する請求項1記載の熱伝導性改良剤。
- 被覆層の上がさらに、高級脂肪酸類、アニオン系界面活性剤、リン酸エステル類、カップリング剤および多価アルコールと脂肪酸のエステル類からなる群より選ばれる少なくとも一種の表面処理剤により表面処理されている請求項6または7に記載の熱伝導性改良剤。
- 請求項1記載の熱伝導性改良剤を有効成分とする放熱剤。
- (i)100重量部の樹脂および(ii)20~300重量部の熱伝導性改良剤を含有する樹脂組成物であって、熱伝導性改良剤は10nm~0.2μmの厚みを有し、かつSEM法によるアスペクト比(長径/厚み)が10以上の水酸化マグネシウム粒子である前記樹脂組成物。
- 樹脂が、シリコーンゴムである請求項10記載の樹脂組成物。
- 請求項10記載の樹脂組成物からなる成形品。
- 請求項10記載の樹脂組成物からなる放熱シート。
- 樹脂および水酸化マグネシウム粒子を含有する樹脂組成物の熱伝導性を向上させる方法であって、樹脂100重量部に対して、10nm~0.2μmの厚みを有し、かつSEM法によるアスペクト比(長径/厚み)が10以上である水酸化マグネシウム粒子を20~300重量部配合させることを特徴とする前記方法。
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13739047.2A EP2806006B1 (en) | 2012-01-20 | 2013-01-18 | Thermal conduction enhancer |
AU2013210289A AU2013210289B9 (en) | 2012-01-20 | 2013-01-18 | Heat Conductivity Improving Agent |
CN201380005618.0A CN104053742A (zh) | 2012-01-20 | 2013-01-18 | 热传导改进剂 |
CA2860971A CA2860971C (en) | 2012-01-20 | 2013-01-18 | Heat conductivity improving agent |
RU2014134046/05A RU2598621C2 (ru) | 2012-01-20 | 2013-01-18 | Повышающий теплопроводность материал |
KR1020147019865A KR101899631B1 (ko) | 2012-01-20 | 2013-01-18 | 열 전도 개량제 |
JP2013554378A JP6038049B2 (ja) | 2012-01-20 | 2013-01-18 | 熱伝導改良剤 |
US14/372,077 US20150000887A1 (en) | 2012-01-20 | 2013-01-18 | Heat conductivity improving agent |
SG11201404256UA SG11201404256UA (en) | 2012-01-20 | 2013-01-18 | Thermal conduction enhancer |
MX2014008754A MX2014008754A (es) | 2012-01-20 | 2013-01-18 | Dispositivo mejorador de la conductividad termica. |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012009583 | 2012-01-20 | ||
JP2012-009583 | 2012-01-20 | ||
JP2012-089890 | 2012-04-11 | ||
JP2012089890 | 2012-04-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013108937A1 true WO2013108937A1 (ja) | 2013-07-25 |
Family
ID=48799353
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2013/051514 WO2013108937A1 (ja) | 2012-01-20 | 2013-01-18 | 熱伝導改良剤 |
Country Status (12)
Country | Link |
---|---|
US (1) | US20150000887A1 (ja) |
EP (1) | EP2806006B1 (ja) |
JP (1) | JP6038049B2 (ja) |
KR (1) | KR101899631B1 (ja) |
CN (1) | CN104053742A (ja) |
CA (1) | CA2860971C (ja) |
CL (1) | CL2014001868A1 (ja) |
MX (1) | MX2014008754A (ja) |
RU (1) | RU2598621C2 (ja) |
SG (1) | SG11201404256UA (ja) |
TW (1) | TWI583779B (ja) |
WO (1) | WO2013108937A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016043343A1 (ja) * | 2014-09-18 | 2016-03-24 | 協和化学工業株式会社 | コロイダルシリカ被覆水酸化マグネシウム |
JP2020055245A (ja) * | 2018-10-03 | 2020-04-09 | 出光ユニテック株式会社 | 樹脂シートおよび包装体 |
WO2024053091A1 (ja) * | 2022-09-09 | 2024-03-14 | 株式会社海水化学研究所 | 高配向性金属複合塩 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2881314A1 (en) * | 2012-06-29 | 2014-01-03 | Kyowa Chemical Industry Co., Ltd. | Heat shielding material |
KR20180008377A (ko) * | 2015-05-15 | 2018-01-24 | 교와 가가꾸고교 가부시키가이샤 | 섬유상 염기성 황산마그네슘, 그 제조 방법 및 그 수지 조성물 |
CN107915974A (zh) * | 2016-10-08 | 2018-04-17 | 中国石油化工股份有限公司 | 导热树脂组合物及其制备方法 |
US20220243109A1 (en) * | 2019-09-10 | 2022-08-04 | Kyowa Chemical Industry Co., Ltd. | Thermal conductivity improver, thermal conductivity improvement method, thermal-conductive resin composition and thermal-conductive resin molded product |
CN113278288A (zh) * | 2021-05-25 | 2021-08-20 | 扬州工业职业技术学院 | 一种高分子基导热复合材料及其制备方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58134134A (ja) * | 1982-02-04 | 1983-08-10 | Kyowa Chem Ind Co Ltd | 成形適性及び機械的強度の改善された難燃性樹脂組成物 |
JPH07324146A (ja) | 1994-05-31 | 1995-12-12 | Tsutsunaka Plast Ind Co Ltd | 熱伝導性ゴム組成物 |
JPH09176368A (ja) | 1995-12-22 | 1997-07-08 | Kyowa Chem Ind Co Ltd | 高熱伝導性を有する合成樹脂組成物および高熱伝導性改良剤 |
WO2000035808A1 (fr) * | 1998-12-14 | 2000-06-22 | Kyowa Chemical Industry Co., Ltd. | Particules d'hydroxyde de magnesium, procede de production correspondant, et composition de resine renfermant lesdites particules |
JP2004027177A (ja) | 2001-12-25 | 2004-01-29 | Tateho Chem Ind Co Ltd | 酸化マグネシウム粉末を含む樹脂組成物 |
JP2006282783A (ja) | 2005-03-31 | 2006-10-19 | Polyplastics Co | 高熱伝導性樹脂組成物 |
JP2007211141A (ja) * | 2006-02-09 | 2007-08-23 | Kitagawa Ind Co Ltd | 熱伝導性制振材 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62115048A (ja) * | 1985-11-13 | 1987-05-26 | Idemitsu Petrochem Co Ltd | ポリオレフイン樹脂組成物 |
JP2966755B2 (ja) * | 1995-03-17 | 1999-10-25 | タテホ化学工業株式会社 | 高アスペクト比金属水酸化物または金属酸化物固溶体およびそれらの製造方法 |
US7514489B2 (en) * | 2005-11-28 | 2009-04-07 | Martin Marietta Materials, Inc. | Flame-retardant magnesium hydroxide compositions and associated methods of manufacture and use |
JP4471935B2 (ja) * | 2006-01-17 | 2010-06-02 | 協和化学工業株式会社 | 電子部品封止用材料 |
JP2009286668A (ja) * | 2008-05-30 | 2009-12-10 | Konoshima Chemical Co Ltd | 水酸化マグネシウム系熱伝導性フィラーとその製造方法、及び熱伝導性樹脂組成物と成型体。 |
ES2688800T3 (es) * | 2010-10-12 | 2018-11-07 | Kyowa Chemical Industry Co., Ltd. | Hidróxido de magnesio de alta relación de aspecto |
-
2013
- 2013-01-18 KR KR1020147019865A patent/KR101899631B1/ko active IP Right Grant
- 2013-01-18 SG SG11201404256UA patent/SG11201404256UA/en unknown
- 2013-01-18 US US14/372,077 patent/US20150000887A1/en not_active Abandoned
- 2013-01-18 JP JP2013554378A patent/JP6038049B2/ja active Active
- 2013-01-18 WO PCT/JP2013/051514 patent/WO2013108937A1/ja active Application Filing
- 2013-01-18 CN CN201380005618.0A patent/CN104053742A/zh active Pending
- 2013-01-18 RU RU2014134046/05A patent/RU2598621C2/ru not_active IP Right Cessation
- 2013-01-18 CA CA2860971A patent/CA2860971C/en active Active
- 2013-01-18 TW TW102101965A patent/TWI583779B/zh active
- 2013-01-18 EP EP13739047.2A patent/EP2806006B1/en active Active
- 2013-01-18 MX MX2014008754A patent/MX2014008754A/es unknown
-
2014
- 2014-07-15 CL CL2014001868A patent/CL2014001868A1/es unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58134134A (ja) * | 1982-02-04 | 1983-08-10 | Kyowa Chem Ind Co Ltd | 成形適性及び機械的強度の改善された難燃性樹脂組成物 |
JPH07324146A (ja) | 1994-05-31 | 1995-12-12 | Tsutsunaka Plast Ind Co Ltd | 熱伝導性ゴム組成物 |
JPH09176368A (ja) | 1995-12-22 | 1997-07-08 | Kyowa Chem Ind Co Ltd | 高熱伝導性を有する合成樹脂組成物および高熱伝導性改良剤 |
WO2000035808A1 (fr) * | 1998-12-14 | 2000-06-22 | Kyowa Chemical Industry Co., Ltd. | Particules d'hydroxyde de magnesium, procede de production correspondant, et composition de resine renfermant lesdites particules |
JP2004027177A (ja) | 2001-12-25 | 2004-01-29 | Tateho Chem Ind Co Ltd | 酸化マグネシウム粉末を含む樹脂組成物 |
JP2006282783A (ja) | 2005-03-31 | 2006-10-19 | Polyplastics Co | 高熱伝導性樹脂組成物 |
JP2007211141A (ja) * | 2006-02-09 | 2007-08-23 | Kitagawa Ind Co Ltd | 熱伝導性制振材 |
Non-Patent Citations (1)
Title |
---|
CATALYST, vol. 2, no. 4, 1960, pages 473 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016043343A1 (ja) * | 2014-09-18 | 2016-03-24 | 協和化学工業株式会社 | コロイダルシリカ被覆水酸化マグネシウム |
JPWO2016043343A1 (ja) * | 2014-09-18 | 2017-04-27 | 協和化学工業株式会社 | コロイダルシリカ被覆水酸化マグネシウム |
JP2020055245A (ja) * | 2018-10-03 | 2020-04-09 | 出光ユニテック株式会社 | 樹脂シートおよび包装体 |
JP7198033B2 (ja) | 2018-10-03 | 2022-12-28 | 出光ユニテック株式会社 | 樹脂シート、積層体および包装体 |
WO2024053091A1 (ja) * | 2022-09-09 | 2024-03-14 | 株式会社海水化学研究所 | 高配向性金属複合塩 |
Also Published As
Publication number | Publication date |
---|---|
US20150000887A1 (en) | 2015-01-01 |
JPWO2013108937A1 (ja) | 2015-05-11 |
EP2806006A4 (en) | 2015-11-25 |
RU2598621C2 (ru) | 2016-09-27 |
EP2806006B1 (en) | 2020-11-25 |
CL2014001868A1 (es) | 2014-11-07 |
KR20140116110A (ko) | 2014-10-01 |
CN104053742A (zh) | 2014-09-17 |
MX2014008754A (es) | 2014-08-27 |
JP6038049B2 (ja) | 2016-12-07 |
SG11201404256UA (en) | 2014-11-27 |
RU2014134046A (ru) | 2016-03-20 |
TW201335351A (zh) | 2013-09-01 |
CA2860971A1 (en) | 2013-07-25 |
AU2013210289A1 (en) | 2014-08-14 |
TWI583779B (zh) | 2017-05-21 |
AU2013210289B2 (en) | 2016-09-29 |
EP2806006A1 (en) | 2014-11-26 |
CA2860971C (en) | 2018-12-11 |
KR101899631B1 (ko) | 2018-09-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6038049B2 (ja) | 熱伝導改良剤 | |
JP4157560B2 (ja) | 難燃剤のポリオレフィンまたはその共重合体への使用 | |
WO2016163562A1 (ja) | 水酸化マグネシウム粒子およびその製造方法 | |
WO2012050222A1 (ja) | 高アスペクト比水酸化マグネシウム | |
AU2005301161A1 (en) | Flame retardant composites | |
KR102097837B1 (ko) | 복합 난연제, 수지 조성물 및 성형품 | |
JP4785134B2 (ja) | 電気絶縁性が改良された受酸剤、それを含む組成物およびその成形品 | |
US10233305B2 (en) | Magnesium hydroxide-based solid solution, and resin composition and precursor for highly active magnesium oxide which include same | |
JP6598271B2 (ja) | 高アスペクト比板状ハイドロタルサイト、その製造方法及びその樹脂組成物 | |
AU2013210289B9 (en) | Heat Conductivity Improving Agent | |
JP2004225033A (ja) | 電気絶縁性向上剤及び電気絶縁性が向上した樹脂組成物 | |
JP2013234112A (ja) | 板状酸化マグネシウム | |
WO2024053091A1 (ja) | 高配向性金属複合塩 | |
US20170233578A1 (en) | Colloidal silica coated magnesium hydroxide | |
Gite et al. | Abdul Ahamad1, Chetan B Patil2 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13739047 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2013554378 Country of ref document: JP Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 2860971 Country of ref document: CA |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14372077 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2014001868 Country of ref document: CL Ref document number: 2013739047 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 20147019865 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: MX/A/2014/008754 Country of ref document: MX |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 2013210289 Country of ref document: AU Date of ref document: 20130118 Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: P773/2014 Country of ref document: AE |
|
ENP | Entry into the national phase |
Ref document number: 2014134046 Country of ref document: RU Kind code of ref document: A |
|
REG | Reference to national code |
Ref country code: BR Ref legal event code: B01A Ref document number: 112014017507 Country of ref document: BR |
|
ENP | Entry into the national phase |
Ref document number: 112014017507 Country of ref document: BR Kind code of ref document: A2 Effective date: 20140716 |