CL2014001868A1 - Agente mejorador de conductividad del calor que comprende particula de hidroxido de magnesio que tiene espesor de 10 nm a 0,2 um y relacion de aspecto medido por metodo sem no menor de 10; composicion de resina; articulo moldeado; lamina de radiacion de calor; y metodo para mejorar conductividad termica. - Google Patents

Agente mejorador de conductividad del calor que comprende particula de hidroxido de magnesio que tiene espesor de 10 nm a 0,2 um y relacion de aspecto medido por metodo sem no menor de 10; composicion de resina; articulo moldeado; lamina de radiacion de calor; y metodo para mejorar conductividad termica.

Info

Publication number
CL2014001868A1
CL2014001868A1 CL2014001868A CL2014001868A CL2014001868A1 CL 2014001868 A1 CL2014001868 A1 CL 2014001868A1 CL 2014001868 A CL2014001868 A CL 2014001868A CL 2014001868 A CL2014001868 A CL 2014001868A CL 2014001868 A1 CL2014001868 A1 CL 2014001868A1
Authority
CL
Chile
Prior art keywords
resin composition
thickness
aspect ratio
molded article
magnesium hydroxide
Prior art date
Application number
CL2014001868A
Other languages
English (en)
Inventor
Shigeo Miyata
Hitoshi Manabe
Daisuke Kudo
Kohei OOHORI
Original Assignee
Sea Water Chemical Inst Inc
Kyowa Chem Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sea Water Chemical Inst Inc, Kyowa Chem Ind Co Ltd filed Critical Sea Water Chemical Inst Inc
Publication of CL2014001868A1 publication Critical patent/CL2014001868A1/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F5/00—Compounds of magnesium
    • C01F5/14—Magnesium hydroxide
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F5/00—Compounds of magnesium
    • C01F5/14—Magnesium hydroxide
    • C01F5/20—Magnesium hydroxide by precipitation from solutions of magnesium salts with ammonia
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F5/00—Compounds of magnesium
    • C01F5/14—Magnesium hydroxide
    • C01F5/22—Magnesium hydroxide from magnesium compounds with alkali hydroxides or alkaline- earth oxides or hydroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • C08L9/06—Copolymers with styrene
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/10—Particle morphology extending in one dimension, e.g. needle-like
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/54—Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/32—Thermal properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/2224—Magnesium hydroxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
CL2014001868A 2012-01-20 2014-07-15 Agente mejorador de conductividad del calor que comprende particula de hidroxido de magnesio que tiene espesor de 10 nm a 0,2 um y relacion de aspecto medido por metodo sem no menor de 10; composicion de resina; articulo moldeado; lamina de radiacion de calor; y metodo para mejorar conductividad termica. CL2014001868A1 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012009583 2012-01-20
JP2012089890 2012-04-11

Publications (1)

Publication Number Publication Date
CL2014001868A1 true CL2014001868A1 (es) 2014-11-07

Family

ID=48799353

Family Applications (1)

Application Number Title Priority Date Filing Date
CL2014001868A CL2014001868A1 (es) 2012-01-20 2014-07-15 Agente mejorador de conductividad del calor que comprende particula de hidroxido de magnesio que tiene espesor de 10 nm a 0,2 um y relacion de aspecto medido por metodo sem no menor de 10; composicion de resina; articulo moldeado; lamina de radiacion de calor; y metodo para mejorar conductividad termica.

Country Status (12)

Country Link
US (1) US20150000887A1 (es)
EP (1) EP2806006B1 (es)
JP (1) JP6038049B2 (es)
KR (1) KR101899631B1 (es)
CN (1) CN104053742A (es)
CA (1) CA2860971C (es)
CL (1) CL2014001868A1 (es)
MX (1) MX2014008754A (es)
RU (1) RU2598621C2 (es)
SG (1) SG11201404256UA (es)
TW (1) TWI583779B (es)
WO (1) WO2013108937A1 (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150177430A1 (en) * 2012-06-29 2015-06-25 Kyowa Chemical Industry Co., Ltd. Heat shielding material
JPWO2016043343A1 (ja) * 2014-09-18 2017-04-27 協和化学工業株式会社 コロイダルシリカ被覆水酸化マグネシウム
KR20180008377A (ko) * 2015-05-15 2018-01-24 교와 가가꾸고교 가부시키가이샤 섬유상 염기성 황산마그네슘, 그 제조 방법 및 그 수지 조성물
CN107915974A (zh) * 2016-10-08 2018-04-17 中国石油化工股份有限公司 导热树脂组合物及其制备方法
JP7198033B2 (ja) * 2018-10-03 2022-12-28 出光ユニテック株式会社 樹脂シート、積層体および包装体
EP3976711A1 (en) 2019-06-03 2022-04-06 Dow Global Technologies LLC Coated conductor
EP4029916A4 (en) * 2019-09-10 2023-10-11 SETOLAS Holdings, Inc. THERMAL CONDUCTIVITY IMPROVER, METHOD FOR IMPROVING THERMAL CONDUCTIVITY, THERMALLY CONDUCTIVE RESIN COMPOSITION AND THERMALLY CONDUCTIVE RESIN MOLDED PRODUCT
CN113278288A (zh) * 2021-05-25 2021-08-20 扬州工业职业技术学院 一种高分子基导热复合材料及其制备方法
WO2024053091A1 (ja) * 2022-09-09 2024-03-14 株式会社海水化学研究所 高配向性金属複合塩

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58134134A (ja) * 1982-02-04 1983-08-10 Kyowa Chem Ind Co Ltd 成形適性及び機械的強度の改善された難燃性樹脂組成物
JPS62115048A (ja) * 1985-11-13 1987-05-26 Idemitsu Petrochem Co Ltd ポリオレフイン樹脂組成物
JP2774935B2 (ja) 1994-05-31 1998-07-09 筒中プラスチック工業株式会社 発熱性路材
JP2966755B2 (ja) * 1995-03-17 1999-10-25 タテホ化学工業株式会社 高アスペクト比金属水酸化物または金属酸化物固溶体およびそれらの製造方法
JP3482057B2 (ja) 1995-12-22 2003-12-22 協和化学工業株式会社 高熱伝導性を有する合成樹脂組成物および高熱伝導性改良剤
WO2000035808A1 (fr) * 1998-12-14 2000-06-22 Kyowa Chemical Industry Co., Ltd. Particules d'hydroxyde de magnesium, procede de production correspondant, et composition de resine renfermant lesdites particules
JP3850371B2 (ja) 2001-12-25 2006-11-29 タテホ化学工業株式会社 酸化マグネシウム粉末を含む樹脂組成物
JP4744911B2 (ja) 2005-03-31 2011-08-10 ポリプラスチックス株式会社 高熱伝導性樹脂組成物
WO2007097795A2 (en) * 2005-11-28 2007-08-30 Martin Marietta Materials, Inc. Flame-retardant magnesium hydroxide compositions and associated methods of manufacture and use
JP4471935B2 (ja) * 2006-01-17 2010-06-02 協和化学工業株式会社 電子部品封止用材料
JP4679383B2 (ja) * 2006-02-09 2011-04-27 北川工業株式会社 熱伝導性制振材
JP2009286668A (ja) * 2008-05-30 2009-12-10 Konoshima Chemical Co Ltd 水酸化マグネシウム系熱伝導性フィラーとその製造方法、及び熱伝導性樹脂組成物と成型体。
PL2628710T3 (pl) * 2010-10-12 2019-01-31 Kyowa Chemical Industry Co., Ltd. Wodorotlenek magnezu o wysokim współczynniku kształtu

Also Published As

Publication number Publication date
TW201335351A (zh) 2013-09-01
MX2014008754A (es) 2014-08-27
KR20140116110A (ko) 2014-10-01
RU2014134046A (ru) 2016-03-20
SG11201404256UA (en) 2014-11-27
EP2806006A1 (en) 2014-11-26
KR101899631B1 (ko) 2018-09-17
JPWO2013108937A1 (ja) 2015-05-11
TWI583779B (zh) 2017-05-21
JP6038049B2 (ja) 2016-12-07
AU2013210289A1 (en) 2014-08-14
RU2598621C2 (ru) 2016-09-27
CA2860971A1 (en) 2013-07-25
US20150000887A1 (en) 2015-01-01
AU2013210289B2 (en) 2016-09-29
CN104053742A (zh) 2014-09-17
WO2013108937A1 (ja) 2013-07-25
EP2806006B1 (en) 2020-11-25
CA2860971C (en) 2018-12-11
EP2806006A4 (en) 2015-11-25

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