WO2013097128A1 - 含磷低分子量聚苯醚树脂的制备方法 - Google Patents
含磷低分子量聚苯醚树脂的制备方法 Download PDFInfo
- Publication number
- WO2013097128A1 WO2013097128A1 PCT/CN2011/084873 CN2011084873W WO2013097128A1 WO 2013097128 A1 WO2013097128 A1 WO 2013097128A1 CN 2011084873 W CN2011084873 W CN 2011084873W WO 2013097128 A1 WO2013097128 A1 WO 2013097128A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- phosphorus
- polyphenylene ether
- molecular weight
- ether resin
- low molecular
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/48—Polymers modified by chemical after-treatment
- C08G65/485—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/46—Post-polymerisation treatment, e.g. recovery, purification, drying
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/48—Polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
Definitions
- the present invention relates to a process for preparing a polyphenylene ether resin, and more particularly to a process for preparing a phosphorus-containing low molecular weight polyphenylene ether resin.
- the electronic and electrical industry is developing rapidly, and the development direction of electronic products is thin and light, high performance, high reliability and environmental protection.
- the specific requirements of electronic circuit boards are also high heat resistance, low thermal expansion coefficient, high heat and humidity resistance, environmentally friendly flame retardancy, low dielectric constant and dielectric loss, and high elastic modulus. Therefore, the conventional epoxy resin can not fully meet the development needs of electronic circuit boards, and the application of polyphenylene ether resin with high heat resistance, low dielectric constant, dielectric loss and toughness in electronic circuit boards is also more The more prominent it is.
- conventional polyphenylene ether resins are still insufficient in processing due to their high molecular weight.
- phosphorus-containing compounds are commonly used in the industry to achieve flame retardant effects, such as phosphorus-containing phenanthrene compound DOPO and its derivatives.
- the halogen-free polyphenylene ether resin compositions currently used for electronic circuit boards generally use an additive type phosphorus-containing flame retardant to achieve flame retardancy requirements, but they are insufficient in heat and humidity resistance and chemical resistance.
- the phosphorus-containing phenol compound is insoluble in a non-polar solvent such as toluene, the method of redistribution in a solution as reported in Japanese Patent Laid-Open No. Hei 9-235349, Japanese Patent No. 3248424, and the like cannot be produced.
- a phosphorus-containing low molecular weight polyphenylene ether is obtained. Summary of the invention
- An object of the present invention is to provide a method for preparing a phosphorus-containing low molecular weight polyphenylene ether resin, which has a good processability and is suitable for use in a base resin for high frequency circuit boards.
- the present invention provides a process for preparing a phosphorus-containing low molecular weight polyphenylene ether resin, which comprises the steps as follows:
- Step 1 Providing a phosphorus-containing phenol compound and a raw material polyphenylene ether resin having a number average molecular weight of 10,000 or more;
- Step 2 dissolving the raw material polyphenylene ether resin in a solvent to prepare a raw material polyphenylene ether resin solution; Step 3. adding the phosphorus-containing phenol compound to the raw material polyphenylene ether resin solution;
- Step 4 the initiator is introduced, and the reaction temperature is above 60 ° C under the action of the initiator. Distribution reaction
- Step 5 After the reaction is completed, the product phosphorus-containing low molecular weight polyphenylene ether resin is obtained, and the number average molecular weight thereof is 1000 to 6000.
- the mass ratio of the raw material polyphenylene ether resin to the phosphorus-containing phenol compound is 100:80 to 100:4.
- the phosphorus-containing phenol compound is a phosphorus-containing compound containing one or two or more phenolic hydroxyl groups, and the phosphorus-containing phenol compound is 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10- A combination of an oxide and an adduct of benzoquinone, 1,4-tea oxime, p-hydroxybenzaldehyde or rosmarinic acid, and one or more of other phosphorus-containing phenolic compounds, respectively.
- step 2 the ratio of the raw material polyphenylene ether resin to the solvent is 4:100 ⁇ 200:100, and the solvent is benzene, toluene, xylene, butanone, acetone, n-butanol, isobutanol or isopropanol. One or more combinations.
- the phosphorus-containing phenol compound is uniformly dispersed in the raw material polyphenylene ether resin solution.
- the initiator is dicumyl peroxide, t-butyl peroxy cumyl, di-tert-butyl peroxide, tert-butyl peroxydicarbonate, 2,5-dimethyl-2,5-di-tert Butyl cumylperoxyhexyne-3, 2,5-dimethyl 2,5-di-tert-butylperoxyhexane, peroxy-paraben, 1,1-bis(tert-amylperoxy)
- step 4 the initiator is charged in one or more times; after the initiator is introduced, the reaction material needs to be kept at the reaction temperature for more than 30 minutes.
- a catalyst is further added, and the catalyst is added before or after the introduction of the initiator, and the catalyst is selected from the group consisting of metal salts of naphthenic acid, vanadium pentoxide, aniline, amine compounds, quaternary ammonium salts, imidazoles and scale salts. One or more.
- the product phosphorus-containing low molecular weight polyphenylene ether resin is washed with water or an alkali solution, and the washing step is carried out at room temperature or above 60 °C.
- the present invention produces a phosphorus-containing low molecular weight polyphenylene ether tree by dispersing a phosphorus-containing phenol compound in a raw material polyphenylene ether resin solution and performing a redistribution reaction in the presence of an initiator.
- the phosphorus-containing low molecular weight polyphenylene ether resin has good processability and is suitable for the addition of matrix resin or other polymer materials of composite materials such as high-frequency circuit boards. detailed description
- the phosphorus-containing phenolic compound is insoluble in a non-polar solvent such as toluene, and the phosphorus-containing phenolic compound and the high-molecular-weight polyphenylene ether cannot coexist in the same phase, so that the reaction of the conventional solution system cannot be used to obtain a low molecular weight phosphorus-containing low molecular weight poly Diphenyl ether resin.
- the inventors conducted intensive studies and found that the phosphorus-containing phenol compound is uniformly dispersed in the raw material polyphenylene ether solution, and peroxidized at a certain temperature.
- the redistribution reaction of the polyphenylene ether can be carried out by the initiation of the substance, and after the reaction, the original two-phase reaction material also becomes one phase, that is, the obtained phosphorus-containing polyphenylene ether resin has 4 in the non-polar solvent. Good solubility.
- the obtained phosphorus-containing low molecular weight polyphenylene ether resin is excellent in processability, and is suitable for a base resin for a high-frequency circuit board by being blended with a thermosetting resin such as an epoxy resin or a cyanate ester.
- the present invention provides a method for preparing a phosphorus-containing low molecular weight polyphenylene ether resin, which comprises the steps as follows:
- Step 1 Providing raw materials: a phosphorus-containing phenol compound and a raw material polyphenylene ether resin having a number average molecular weight of 10,000 or more; under a sufficient initiator and reaction conditions, the higher the proportion of the phosphorus-containing phenol compound, the obtained product polyphenylene ether
- the lower the number average molecular weight of the resin, the higher the number average molecular weight (Mn) of the polyphenylene ether resin used in the electronic circuit board is generally controlled to be 1000 to 6000. Therefore, the quality of the raw material polyphenylene ether resin and the phosphorus-containing phenol compound is preferred.
- the ratio is 100:80 ⁇ 100:4.
- the phosphorus-containing phenol compound is a phosphorus-containing compound containing one or two or more phenolic hydroxyl groups, and the phosphorus-containing phenol compound is 9, 10-dihydro-9-oxa-10-phosphaphenanthrene-10- Addition of oxides (DOPO) to phenylhydrazine, 1,4-antimony, p-hydroxybenzaldehyde or rosmarinic acid (DOPO-HQ, DOPO-NQ, DOPO-HPM and DOPO, respectively) -triol, etc., and combinations of one or more of other phosphorus-containing phenolic compounds.
- DOPO-HQ, DOPO-NQ, DOPO-HPM and DOPO-triol are as follows:
- Step 2 dissolving the raw material polyphenylene ether resin in a solvent to prepare a polyphenylene ether resin solution; the ratio of the polyphenylene ether resin to the solvent is 4:100 to 200:100, and the polyphenylene ether resin has a number average molecular weight of 10,000.
- the above commercially available polyphenylene ether resin may be a solvent or a combination of one or more of benzene, toluene, xylene, butanone, acetone, n-butanol, isobutanol or isopropanol.
- Step 3 Adding a phosphorus-containing phenol compound to the raw material polyphenylene ether resin solution.
- the phosphorus-containing phenol compound is uniformly dispersed in the raw material polyphenylene ether resin solution.
- Step 4 The initiator is charged, and the redistribution reaction is carried out under the action of an initiator at a reaction temperature of 60 ° C or higher.
- the initiator may be fed in a one-time or multiple-time manner, preferably multiple times, more preferably at a rate of 0.1 part by mass or less.
- the initiator is dicumyl peroxide, t-butyl peroxy cumyl, di-tert-butyl peroxide, tert-butyl peroxydicarbonate, 2,5-dimethyl-2,5-di-tert Butyl cumylperoxyhexyne-3,
- the reaction temperature is preferably 80 ° C or higher.
- the reaction material is reacted more rapidly when the reaction temperature is high, but the temperature should be controlled below the boiling point of the solvent. After the initiator is added, the reaction mass is kept at the reaction temperature for more than 30 minutes.
- a catalyst may also be added to promote the efficiency of the initiator, the catalyst being selected from the group consisting of a metal salt of naphthenic acid, vanadium pentoxide, aniline, an amine compound, a quaternary ammonium salt, an imidazole, and a scaly salt. Or a variety.
- the catalyst may be added to the reaction mass before or after the initiator is introduced. It is not recommended to mix the catalyst and the initiator together.
- Step 5 After the reaction is completed, the product phosphorus-containing low molecular weight polyphenylene ether resin is obtained, and the number average molecular weight thereof is 1000 to 6000.
- the product is preferably washed with water or an alkali solution, and the washing step may be carried out at room temperature or at 60 ° C or higher, preferably at 60 ° C or higher.
- Example 1 The embodiments of the present invention are described in detail below, but the present invention is not limited to the scope of the embodiments.
- Example 1
- the present invention prepares a phosphorus-containing low molecular weight polyphenylene ether resin by dispersing a phosphorus-containing phenol compound in a polyphenylene ether resin solution and performing a redistribution reaction in the presence of an initiator.
- the low molecular weight polyphenylene ether resin has good processability and is suitable for the addition of matrix resin or other polymer materials of composite materials such as high frequency circuit boards.
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Polyethers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020147004406A KR101636628B1 (ko) | 2011-12-29 | 2011-12-29 | 저분자량의 인-함유 폴리페닐렌 옥사이드 수지를 제조하는 방법 |
US14/236,109 US8889816B2 (en) | 2011-12-29 | 2011-12-29 | Method for preparing phosphorus-containing polyphenylene oxide resin with low molecular weight |
EP11879024.5A EP2799466A4 (en) | 2011-12-29 | 2011-12-29 | METHOD FOR PRODUCING PHOSPHOROUS POLYPHENYLENOXIDE RESIN WITH LOW MOLECULAR WEIGHT |
PCT/CN2011/084873 WO2013097128A1 (zh) | 2011-12-29 | 2011-12-29 | 含磷低分子量聚苯醚树脂的制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2011/084873 WO2013097128A1 (zh) | 2011-12-29 | 2011-12-29 | 含磷低分子量聚苯醚树脂的制备方法 |
Publications (1)
Publication Number | Publication Date |
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WO2013097128A1 true WO2013097128A1 (zh) | 2013-07-04 |
Family
ID=48696212
Family Applications (1)
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PCT/CN2011/084873 WO2013097128A1 (zh) | 2011-12-29 | 2011-12-29 | 含磷低分子量聚苯醚树脂的制备方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8889816B2 (zh) |
EP (1) | EP2799466A4 (zh) |
KR (1) | KR101636628B1 (zh) |
WO (1) | WO2013097128A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9051465B1 (en) | 2012-02-21 | 2015-06-09 | Park Electrochemical Corporation | Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound |
US9243164B1 (en) | 2012-02-21 | 2016-01-26 | Park Electrochemical Corporation | Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2013097133A1 (zh) * | 2011-12-29 | 2013-07-04 | 广东生益科技股份有限公司 | 热固性树脂组合物以及用其制作的预浸料与印刷电路板用层压板 |
TWI667276B (zh) * | 2014-05-29 | 2019-08-01 | 美商羅傑斯公司 | 具改良耐燃劑系統之電路物質及由其形成之物件 |
US10233365B2 (en) | 2015-11-25 | 2019-03-19 | Rogers Corporation | Bond ply materials and circuit assemblies formed therefrom |
CN107266685B (zh) * | 2017-05-08 | 2020-06-23 | 西南科技大学 | 一种含磷、硅聚合型阻燃剂及其制备方法 |
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JP3248424B2 (ja) | 1996-02-29 | 2002-01-21 | 松下電工株式会社 | 変成ポリフェニレンオキサイドの製法、この製法による変成ポリフェニレンオキサイドを用いたエポキシ樹脂組成物、この組成物を用いたプリプレグ、及びこのプリプレグを用いた積層板 |
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US20090004484A1 (en) * | 2007-06-26 | 2009-01-01 | Doosan Corporation | Resine Composition For Printed Circuit Board And Composite Substrate And Copper Laminates Using The Same |
KR100835785B1 (ko) * | 2007-06-26 | 2008-06-09 | 주식회사 두산 | 인쇄회로기판용 수지 조성물, 이를 이용한 복합기재 및동박 적층판 |
US9422412B2 (en) * | 2011-09-22 | 2016-08-23 | Elite Material Co., Ltd. | Halogen-free resin composition and copper clad laminate and printed circuit board using same |
-
2011
- 2011-12-29 EP EP11879024.5A patent/EP2799466A4/en active Pending
- 2011-12-29 US US14/236,109 patent/US8889816B2/en active Active
- 2011-12-29 KR KR1020147004406A patent/KR101636628B1/ko active IP Right Grant
- 2011-12-29 WO PCT/CN2011/084873 patent/WO2013097128A1/zh active Application Filing
Patent Citations (5)
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JPH09235349A (ja) | 1995-12-26 | 1997-09-09 | Matsushita Electric Works Ltd | エポキシ樹脂組成物、この樹脂組成物を用いたプリプレグ 、及びこのプリプレグを用いた積層板 |
JP3248424B2 (ja) | 1996-02-29 | 2002-01-21 | 松下電工株式会社 | 変成ポリフェニレンオキサイドの製法、この製法による変成ポリフェニレンオキサイドを用いたエポキシ樹脂組成物、この組成物を用いたプリプレグ、及びこのプリプレグを用いた積層板 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US9051465B1 (en) | 2012-02-21 | 2015-06-09 | Park Electrochemical Corporation | Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound |
US9243164B1 (en) | 2012-02-21 | 2016-01-26 | Park Electrochemical Corporation | Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound |
Also Published As
Publication number | Publication date |
---|---|
US8889816B2 (en) | 2014-11-18 |
KR20140073487A (ko) | 2014-06-16 |
KR101636628B1 (ko) | 2016-07-05 |
EP2799466A1 (en) | 2014-11-05 |
EP2799466A4 (en) | 2015-11-18 |
US20140148556A1 (en) | 2014-05-29 |
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