TW201144414A - Manufacturing method of flame retardant and phosphorous-modified hardener - Google Patents
Manufacturing method of flame retardant and phosphorous-modified hardener Download PDFInfo
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Description
201144414 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種UV遮蔽性能優異之經磷改質的阻 燃固化劑之製造方法,更具體而言,係關於一種UV遮蔽性 能優異,同時具有阻燃性及耐熱特性之經磷改質的阻燃固 化劑之製造方法。 【先前技術】 現今,塑膠之用途係廣泛使用於電氟機器、輸送機器 、建築材料等各種產業領域,但幾乎為破、氧、氫等有機 物質,由於容易燃燒的特性,一直持續增加對於考慮火災 發生時之安全的阻燃化必要性。一般而言,火在發生燃燒 時,需要燃料、氧、能量,當無法滿足其中任一者條件的 情形時’火災亦無法發生。即,塑踢之陴燃化的方法中, 除去發生火災之三因子中一者以上的要因時,便可具體實 現。所謂阻燃固化劑係指藉由以化學或物理性地添加鹵素 系、填系、氮系或金屬產物等賦予阻燃性效果高的化合物 於具有容易燃燒性質的高分子材料中,可延遲起燃,並阻 止物質燃燒擴大。 阻燃固化劑的種類別與用途別被多樣地分類,但主要 分成反應型及添加型。反應型阻燃固化劑係指分子内具有 官能基而進行化學反應的型式,不大受到外部條塑, 使阻燃效果持續雜翻化劑,㈣目化ϋ 於塑膠内物理性地混合、添加、分散 則係才曰 欺而獲得阻燃效果者, 201144414 主要用於熱可塑性塑膠。 現今的添加型或反應型阻燃固化劑有各式各樣的種類 ,作為添加型阻燃固化劑,有三曱笨紛鱗酸酿、曱苯紛二 本基鱗酸自曰、二本基鱗酸g旨、三丁基碟酸g旨、參(漠氣丙 基)磷酸酯、參(二氣丙基)磷酸酯等;作為反應型阻燃 固化劑,有溴酚的溴苯基烯丙基醚、乙烯基氣乙酸酯、銻 二醇、四溴雙酚A等屬於此者。 反應型阻燃固化劑係與基質(substrate)作化學性反廡 ,故永遠與聚合物構造物混合,但添加型阻義化劑系統 因發揮阻燃性的物質與聚合物基質不會產生化學反應,被 添加的阻燃性物質單純地分散或溶解於基質,而經常自基 質損失的情形很多。 & “ y !及叩制窀路基板之類的電.201144414 VI. Description of the Invention: [Technical Field] The present invention relates to a method for producing a phosphorus-modified flame retardant curing agent excellent in UV shielding performance, and more particularly to an ultraviolet shielding property, and at the same time A method for producing a phosphorus-modified flame retardant curing agent having flame retardancy and heat resistance. [Prior Art] Today, the use of plastics is widely used in various industrial fields such as electric fluorine machines, conveying machines, building materials, etc., but almost all organic substances such as broken, oxygen, hydrogen, etc., continue to increase due to the characteristics of easy combustion. The need for safe flame retardation in the event of a fire. In general, when a fire burns, fuel, oxygen, and energy are required, and when it is impossible to satisfy any of the conditions, the fire cannot occur. That is, in the method of burning the plastic kick, the factor of one or more of the three factors causing the fire can be specifically realized. The flame retardant curing agent refers to a compound having a high flame retardancy effect by chemically or physically adding a halogen-based, a filler, a nitrogen-based or a metal product, and the like, and can be delayed in a polymer material having an easily combustible property. Burns and prevents the burning of substances from expanding. The types and uses of flame retardant curing agents are classified variously, but are mainly classified into reactive and additive types. The reactive flame retardant curing agent refers to a type that has a functional group in the molecule and undergoes a chemical reaction, and is not subject to external strip molding, so that the flame retardant effect continues to be a compound turning agent, and (4) visualizing the physical mixing and addition in the plastic. Disperse is the only one used for thermoplastic plastics. 201144414 Mainly used for thermoplastic plastics. Today's additive or reactive flame retardant curing agents are available in a wide variety of types. As an additive flame retardant curing agent, there are three kinds of sulphuric acid squeegee, sulphur benzene, two base squama, and two base squama. Acid g, tributyl acid acid g, ginseng (dimethyl propyl) phosphate, ginseng (di-propyl) phosphate, etc.; as a reactive flame retardant curing agent, bromophenyl allylic bromophenol The group ether, vinyl gas acetate, decanediol, tetrabromobisphenol A, etc. belong to this. The reactive flame retardant curing agent is chemically reacted with the substrate, so it is always mixed with the polymer structure, but the additive type resisting agent system does not produce chemistry due to the flame retardant substance and the polymer matrix. The reaction, the added flame retardant substance is simply dispersed or dissolved in the matrix, and often is often lost from the matrix. & " y ! and make electricity such as circuit boards.
應用領域’實施通過自動光學檢査(A 管理。施典型地係於〜細nm範圍之 紫外線(IAO吸光度,因此’使时紫外線賴效果❺ =賦刊V賴雜。—般衫,㈣f路餘製造心 :月曰組成物,係I系化合物’使用雙紛A型環氧樹脂(Bi type EpGxy)、魏#環氧樹脂、祕清漆環章 v曰(_laC Epoxy)、四苯基乙貌環氧樹脂(T伽啲 nyl ethane Epoxy)等作為環氧樹脂,其中四苯其 樹脂係為賦予UV遮蔽性能 土疋衣菊 遮蔽践,_㈣光料«的仍 製造用之樹脂組成物之固化劑為可二印=: 201144414 cy、DDS、DDM、紛轉清漆、曱盼祕清漆、雙紛續 酿清漆固化劑。印刷電路基板製造用之樹脂之情形,必須 具有優異的隨特性、對鋼或銘絲醯亞胺薄膜之類的基 材有優異接著力、高麵轉移溫度、高尺寸安定性、低吸 水而且具有uv遮蔽性能,但通常具有uv遮蔽性能的 料並不含有阻燃特性的物質(齒素系、碟、氣等),且罝 有印刷電祕㈣造狀_,其_雜及物性差的缺 點0 囚此 系化合物(非二燃性於含盼系化合物的樹脂,添加磷 : 、糸的情形’使阻燃性提升。然而,在 ^應型阻燃劑’係分子内具有官能基而進行化學反應的型 式’不大受外部條件影響,但與表現阻燃效果的物質相比 ,經添加的關性物質,單純地分散或溶解於基質,而經 常自基質損失的情形很多,且阻燃特性與反應型相比具有 阻燃性低落的缺點。並且’添加型阻燃劑之情形,經由不 參與,環氧樹_化反應時之反應,麵轉移溫度會減少 二熱安定性低落’尤其,會發生具有與素材之接著特性顯 著降低等之物理的、化學的物性差的問題之缺點。 【發明内容】 [發明概要;I [發明欲解決的課題] 本發明係為解決前述問題而被提出’本發明所欲解決 的課題係提供即使不含㈣素化合物,仍具#uv遮蔽性能 201144414 化學的物性之經 優異阻燃特性、接H機械的物性 磷改質的阻燃固化劑之製造方法。 [用以解決課題之手段] 用以實現該課題的本發明,係提供一種uv遮蔽性能優 異之、_改質的阻燃固化劑之製造方法,其包含將盼系化 合物(1)及下述化學式1〜2所代表之化合物中任一者以上 之經鱗改質的紛系化合物⑵,於酸觸媒下,㈣系化合 物進行酚醛清漆反應而製造阻燃固化劑的步驟。 〔化1〕Application field 'implemented by automatic optical inspection (A management. The application is typically in the range of ~ fine nm ultraviolet light (IAO absorbance, so 'the time to make the ultraviolet light ❺ 赋 赋 赋 赋 赋 赋 — — — — — — — — — — — — — — — — — — — — — — — — — — — , Heart: Mooncake composition, I-based compound' uses Bi type EpGxy, Wei # epoxy resin, secret varnish ring v曰 (_laC Epoxy), tetraphenyl ethane epoxy Resin (T 啲 yl yl yl p 作为 作为 作为 作为 作为 作为 作为 作为 作为 , , , , , , , 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四二印=: 201144414 cy, DDS, DDM, varnish, 曱 秘 清 varnish, double varnish curing agent. The resin used in the manufacture of printed circuit boards must have excellent characteristics, steel or Ming silk Substrates such as yttrium imide films have excellent adhesion, high surface transfer temperature, high dimensional stability, low water absorption and uv shielding properties, but materials with uv shielding properties generally do not contain flame retardant properties (tooth Prime, dish, gas, etc.)罝 There are printed electric secrets (4) _, _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ However, the type in which the chemical reaction is carried out in the molecule of the flame retardant's molecule is not greatly affected by external conditions, but the added substance is simply added as compared with the substance exhibiting the flame retardant effect. Dispersed or dissolved in the matrix, and often lost from the matrix, and the flame retardant properties have the disadvantage of lower flame retardancy than the reactive type. And in the case of 'additional flame retardant, via non-participation, epoxy tree _ In the reaction at the time of the reaction, the surface transfer temperature is reduced, and the thermal stability is lowered. In particular, there is a problem that physical and chemical physical properties such as a significant decrease in the subsequent properties of the material are inferior. [Summary of the Invention] [Summary of the Invention] I [The subject to be solved by the present invention] The present invention has been made to solve the aforementioned problems. The problem to be solved by the present invention is to provide a #uv shielding property 201144414 chemistry even if it does not contain a (tetra) compound. A method for producing a flame retardant curing agent having excellent physical properties and excellent physical flame retardancy and H-mechanical physical phosphorus modification. [Means for Solving the Problem] The present invention for achieving the object provides an excellent uv shielding performance. And a method for producing a modified flame retardant curing agent, comprising the squamous compound (2) of any one or more of the compounds represented by the compound (1) and the following chemical formulas 1 to 2; Under the acid catalyst, the step (4) is a step of preparing a flame retardant curing agent by performing a novolac reaction. [Chemical 1]
〔化2〕〔化2〕
r£r£
該化學式1〜2中,心係各自獨立地為: 201144414In the chemical formulas 1 to 2, the cardiac systems are each independently: 201144414
R^R3係各自獨立地為Η、醇、絲基n 、羧基、羥基、硫醇或氰基,·或 曰 嗣 經取代或_取代之Ci〜c狀絲、 代之c心之、峰代或_取代之cvcJii t 經取代或非經取代之c^c夕—关A / 、土或 經取代之之醯基、經取枓^ 代及非 美,非、峰代之Cl〜ClG之雜烷 基,該取代可為醇、炫氧基、喊、醋 硫醇及氰基中任一者以上; 羧土羟基 X係各自獨立地為Η ;或 、盈取代或非經取代之c广Cw之燒基基,其中該取代可 :、、醇、燒氧基、_、s旨、_、錄、經基、硫醇及氮基中 任一者以上; Y係各自獨立地為S或so2;或 …經取代或非經取代之C1〜C1Q之燒基,該取代可為醇、 、元氧基醚、酿、酉同、叛基、經基、硫醇及氣基中住一者 n係各自獨立地為丨〜2之整數。 依據本發明一較佳實施例,該酚系化合物(1)可為下 201144414 述化學式3〜4所代表之化合物中任一者以上。 〔化3〕R^R3 are each independently a hydrazine, an alcohol, a silk group n, a carboxyl group, a hydroxyl group, a thiol or a cyano group, or a Ci~c-shaped filament substituted or _substituted, substituted by a c-heart, a peak Or _substituted cvcJii t substituted or unsubstituted c^c —- off A /, earth or substituted sulfhydryl group, by 枓^ generation and non-beauty, non-peak, peak of Cl~ClG An alkyl group, the substitution may be any one of an alcohol, a methoxy group, a thiophene thiol, and a cyano group; the carboxylate hydroxy X groups are each independently Η; or a substituted or unsubstituted c-wide Cw a calcination group, wherein the substitution may be:, an alcohol, an alkoxy group, a _, a s, a _, a ph, a thiol, a thiol or a nitro group; the Y series are each independently S or so2 Or a substituted or unsubstituted C1~C1Q alkyl group, which may be an alcohol, a methoxy ether, a brew, a sulphur, a thiol, a thiol, a thiol, and a gas group. Each is independently an integer of 丨~2. According to a preferred embodiment of the present invention, the phenolic compound (1) may be any one or more of the compounds represented by Chemical Formulas 3 to 4 of 201144414. 〔化3〕
〔化4〕〔化4〕
該化學式3〜4中,X係各自獨立地為Η ;或 經取代或非經取代之CcCw之烷基,該取代可為醇、 烷氧基、醚、酯、酮、羧基、羥基、硫醇及氰基中任一者 以上; Y係各自獨立地為S或so2;或 經取代或非經取代之c广C1Q之烷基,該取代可為醇、 院氧基、醚、酯、明、緩基、羧基、硫醇及氰基中任一者 以上。 依據本發明另一較佳實施例,該酚系化合物(1)可為 選自盼、甲驗、乙紛、丁紛、辛紛、苯基酌、茴香基酌·、 201144414 甲氧基酚、乙氧基酚、雙酚A、雙酚F、雙酚A及雙酚ad所 構成之群中任一者以上。 依據本發明另一較佳實施例,該酚系化合物及化 學式1〜2所代表之經嶙改質的紛系化合物(2 )之和,相對 於該醛系化合物,可以4 : 1〜20 : 1之莫耳比被反應。 依據本發明另一較佳實施例,該經磷改質的酚系化合 物可為OH為1價以上之經磷改質的酚體。更具體而言,可 為選自經磷改質的酚、經磷改質的甲酚、經磷改質的乙酚 經磷改質的丁酚、經磷改質的辛酚、經磷改質的苯基酚 、經磷改質的茴香基酚、經磷改質的曱氧基酚、經磷改質 的乙氧基酚、經磷改質的雙酚A、經磷改質的雙酚F、經磷 改質的雙酚S及經磷改質的雙酚AD所構成之群中任一者以 _依據本發明另一較佳實施例,該酸觸媒可選自草酸、p + ρΊ Μ~酸、鹽酸水溶液、硫酸水溶液、硝酸水溶 液及磷酸水溶液所構成之群中任一者以上。 化風,f本發明另—較佳實施例,祕系化合物可為下述 予J〜6所代表之化合物中中任一者以上。 〔化5〕In the chemical formulas 3 to 4, the X groups are each independently Η; or a substituted or unsubstituted CcCw alkyl group, and the substitution may be an alcohol, an alkoxy group, an ether, an ester, a ketone, a carboxyl group, a hydroxyl group, a thiol. And any one of the cyano groups; the Y series are each independently S or so2; or the substituted or unsubstituted c-C1Q alkyl group, the substitution may be an alcohol, a hospitaloxy group, an ether, an ester, a bright, Any one of a buffer group, a carboxyl group, a thiol group, and a cyano group. According to another preferred embodiment of the present invention, the phenolic compound (1) may be selected from the group consisting of a pro, a test, an ethylene, a Ding, a Xin, a phenyl, an anisine, 201144414 methoxyphenol, Any one or more of the group consisting of ethoxylated phenol, bisphenol A, bisphenol F, bisphenol A, and bisphenol ad. According to another preferred embodiment of the present invention, the phenolic compound and the conjugated compound (2) represented by the chemical formulas 1 to 2 may be 4:1 to 20 with respect to the aldehyde compound: The molar ratio of 1 is reacted. According to another preferred embodiment of the present invention, the phosphorus-modified phenolic compound may be a phosphorus-modified phenol having an OH of 1 or more. More specifically, it may be selected from phosphorus-modified phenol, phosphorus-modified cresol, phosphorus-modified phenol, phosphorus-modified butyl phenol, phosphorus-modified octyl phenol, and phosphorus modified. Phenolic phenol, phosphorus-modified anisidine, phosphorus-modified decyl phenol, phosphorus-modified ethoxylated phenol, phosphorus-modified bisphenol A, phosphorus-modified double Any one of the group consisting of phenol F, phosphorus-modified bisphenol S, and phosphorus-modified bisphenol AD. According to another preferred embodiment of the present invention, the acid catalyst may be selected from the group consisting of oxalic acid, p + ρ Ί 任一 ~ acid, aqueous hydrochloric acid, aqueous sulfuric acid solution, aqueous nitric acid solution and aqueous phosphoric acid solution. The present invention is a further preferred embodiment, and the secret compound may be any one of the compounds represented by the following J to 6. 〔化5〕
〔化6〕 201144414〔化6〕 201144414
X係各自獨立地為Η ;或 經取代或非經取代之CcCio之院基,該取代可為醇、 烷氧基、醚、酯、酮、羧基、羥基、硫醇及氰基中任一者 以上。 依據本發明另一較佳實施例,經由該製造方法製造之 經磷改質的阻燃固化劑可為下述化學式7〜8所代表之化合 物中任一者以上。 包含下述化學式7〜8所代表之化合物中任一者以上之U V遮蔽性能優異之經磷改質的阻燃固化劑的樹脂組成物。 〔化7〕The X series are each independently Η; or a substituted or unsubstituted CcCio, which may be any of an alcohol, an alkoxy group, an ether, an ester, a ketone, a carboxyl group, a hydroxyl group, a thiol, and a cyano group. the above. According to another preferred embodiment of the present invention, the phosphorus-modified flame retardant curing agent produced by the production method may be any one of the compounds represented by the following Chemical Formulas 7 to 8. A resin composition of a phosphorus-modified flame retardant curing agent having excellent U V shielding properties, which is one or more of the compounds represented by the following Chemical Formulas 7 to 8. [7]
A AA A
201144414201144414
化學式7、8中,八係各自獨立地為: OHIn Chemical Formulas 7 and 8, the eight systems are each independently: OH
該A中之至少—者以上為At least one of the above A
OHOH
〇H〇H
或or
OH ROH R
Ri係各自獨立地為:The Ri series are each independently:
酮 ,R2AR3係各自獨立地為H、醇、烧氧基、醚、醋 羧基、羥基、硫醇或氰基;或 m r取代或非㈣代之Cl〜ClG之烧基、經取代或非經取 經取代或非經取代之㈣。之 經取代或非經取代之Cl〜CiQq香族化合物、 ^ 經取代之C心之縣、經取代或非經取代之 201144414 基,該取代可為醇、烷氧基、醚、酯、酮、羧基、羥基、 硫醇及氰基中任一者以上; X係各自獨立地為Η ;或 經取代或非經取代之CcCio之烷基,該取代可為醇、 烷氧基、醚、酯、酮、羧基、羥基、硫醇及氰基中任一者 以上; Y係各自獨立地為S或so2;或 經取代或非經取代之CfCu)之烷基,該取代可為醇、 烷氧基、醚、酯、酮、羧基、羥基、硫醇及氰基中任一者 以上; η係各自獨立地為1〜2之整數;及 m係各自獨立地為0至1中任一個整數,使滿足Α部分使 共價結合的碳原子之原子價。 [發明效果] 經由本發明之製造方法而製造的具有UV遮蔽性能之 經磷改質的阻燃固化劑,即使不含鹵素化合物,亦可同時 實現UV遮蔽性能、優異阻燃特性、接著性、機械的、化學 的物性。 而且,經由該製造方法而製造之經磷改質的阻燃固化 劑,具有作為碳酸酯、ABS、HIPS等工程塑膠之添加劑之 優異阻燃、财熱特性及物理的、化學的物性,且有可能作 為環氧樹脂、氰酸酯樹脂及丙烯酸酯樹脂之原料,及環氧 樹脂之固化劑之使用。通過此等EMC之類的高信賴性之電 氣、電子構件之絕緣材料,可廣泛適用於要求優異阻燃性 12 201144414 及熱的安定性的無齒素化合物之PCB基板及絕緣板等、各 種複合材料、接著劑、塗布劑、塗料等。 【實施方式】 [用以實施發明之形態] 以下,更詳細地說明本發明。 如前所述,為克服®素阻燃固化劑之缺點,於習知揭 示之非齒素系阻燃固化劑的情形,有所謂減少環境污染的 優點,但與函素系阻燃固化劑相比,不僅阻燃效果低落, 且有各種物理的、化學的物性差的問題。而且,於印刷電 路基板製造用之樹脂的情形,阻燃特性以外,亦要求uv 遮蔽性能’但幾乎所有UV遮蔽用原料,並不含有阻燃特 性的物質素系、璘、氮等)’且具有印刷電路基板製 造用之樹脂,其阻燃特性差的缺點。 /據此,本發明提供即使不含有鹵素,與以往之非齒素 系阻燃SHb劑相比’具有贿、效果及物性健,且同時具 有UV遮蔽性能之經磷改質的阻_化劑,藉此為對含齡 系化合物的樹脂賦予阻燃性,添加⑽化合物(非齒素系 )的If形’使阻燃性提升。然而’在反應型阻燃劑,係分 2具有g能基而進行化學反應的型式,不大受外部條件 =響:但與表現_效果的物質相比,經添加的阻燃性物 二單純地分散或轉於基質,秘f自基質損失的情形 Γ二且且、!^特性與反應翻比,具有阻祕低落的缺點 。、且’添加型阻燃劑之情形,經由不參與與環氧樹月旨之 13 201144414 硬化反應時之反應,玻璃轉移溫度會減少,熱安定性低落 ,尤其,解決與素材之接著特性顯著降低等之物理的、化 學的物性差的問題。 據此,本發明提供一種UV遮蔽性能優異之經磷改質 的阻燃固化劑之製造方法,其包含將酚系化合物(1)及 下述化學式1〜2所代表之化合物中任一者以上之經磷改質 的酚系化合物(2),於酸觸媒下,進行酚醛清漆反應而 製造阻燃固化劑的步驟,而且探索前述問題之解決。Ketones, R2AR3 are each independently H, an alcohol, an alkoxy group, an ether, a carboxylic acid carboxyl group, a hydroxyl group, a thiol or a cyano group; or a mr-substituted or non-(tetra)-substituted alkyl group, a substituted or a non-treated medium. Replaced or not replaced (4). Substituted or unsubstituted Cl~CiQq fragrant compound, ^ substituted C heart county, substituted or unsubstituted 201144414 group, the substitution may be an alcohol, an alkoxy group, an ether, an ester, a ketone, Any one of a carboxyl group, a hydroxyl group, a thiol group and a cyano group; the X groups are each independently a hydrazine; or a substituted or unsubstituted CcCio alkyl group, the substitution may be an alcohol, an alkoxy group, an ether, an ester, Any one of a ketone, a carboxyl group, a hydroxyl group, a thiol group and a cyano group; the Y series are each independently an S or a 2; or a substituted or unsubstituted CfCu) alkyl group, and the substitution may be an alcohol or an alkoxy group. Any one or more of an ether, an ester, a ketone, a carboxyl group, a hydroxyl group, a thiol, and a cyano group; the η series are each independently an integer of 1 to 2; and the m systems are each independently an integer of 0 to 1, such that The valence of the carbon atom that satisfies the covalently bonded moiety. [Effect of the Invention] The phosphorus-modified flame retardant curing agent having UV shielding properties produced by the production method of the present invention can simultaneously achieve UV shielding performance, excellent flame retardant properties, adhesion, and even if it does not contain a halogen compound. Mechanical, chemical properties. Moreover, the phosphorus-modified flame retardant curing agent produced by the production method has excellent flame retardancy, richness, and physical and chemical properties as additives of engineering plastics such as carbonate, ABS, and HIPS, and has It may be used as a raw material for epoxy resins, cyanate resins and acrylate resins, and as a curing agent for epoxy resins. Insulation materials for electrical and electronic components such as EMC, which are highly reliable, can be widely applied to PCB substrates and insulating sheets, etc., which require excellent flame retardancy 12 201144414 and thermal stability. Materials, adhesives, coating agents, coatings, and the like. [Embodiment] [Mode for Carrying Out the Invention] Hereinafter, the present invention will be described in more detail. As mentioned above, in order to overcome the shortcomings of the flame retardant curing agent, in the case of the non-dental flame retardant curing agent disclosed in the prior art, there is an advantage of reducing the environmental pollution, but with the flame retardant curing agent. In comparison, not only the flame retarding effect is low, but also various physical and chemical physical properties are poor. Further, in the case of a resin for producing a printed circuit board, in addition to flame retardant properties, uv shielding performance is required, but almost all materials for UV shielding do not contain flame retardant substances, bismuth, nitrogen, etc. There is a disadvantage that the resin for producing a printed circuit board has poor flame retardancy. /According to the above, the present invention provides a phosphorus-modified resisting agent having a brittle effect, a physical property, and a UV shielding property, even if it does not contain a halogen, compared with the conventional non-dental flame-retardant SHb agent. In order to impart flame retardancy to the resin of the age-containing compound, the addition of the (10) compound (non-dentate type) If-form improves the flame retardancy. However, in the case of the reactive flame retardant, the type which has a g energy group and undergoes a chemical reaction is not greatly affected by the external condition = ring: the flame retardant added is simpler than the substance exhibiting the effect. Disperse or transfer to the substrate, the secret of the loss of the substrate from the substrate. ^ Characteristics and reaction ratio, with the disadvantage of low barrier. And in the case of 'additional flame retardant, the glass transition temperature is reduced and the thermal stability is lowered by not participating in the reaction with the epoxy resin of 13 201144414. In particular, the solution and the subsequent properties of the material are significantly lowered. The problem of physical and chemical properties is poor. According to the present invention, there is provided a method for producing a phosphorus-modified flame retardant curing agent having excellent UV shielding properties, which comprises a phenolic compound (1) and a compound represented by the following Chemical Formulas 1 to 2; The phosphorus-modified phenolic compound (2) is subjected to a novolak reaction under an acid catalyst to produce a flame retardant curing agent, and the above problems are solved.
〔化1〕 QH〔化1〕 QH
〔化2〕〔化2〕
於該化學式1〜2,1^係各自獨立地為: 14 201144414In the chemical formulas 1 to 2, 1^ are each independently: 14 201144414
酯、酿} 銳/⑽3係各自獨立地為Η、醇、炫氧基、驗 羧基、羥基、硫醇或氰基;或 代之rc^r取代之縣、峰代或非經取 代^ 之縣、經取代或非經取代之Μ。之块基、或 、韓代或祕取代之cvc狀芳錢化合物、經取代或非Ester, brewing} sharp / (10) 3 series are each independently hydrazine, alcohol, methoxy, carboxyl, hydroxy, thiol or cyano; or replaced by rc ^ r replaced by county, peak or non-substituted ^ county , substituted or unsubstituted. a cvc-like aromatic compound substituted by a block, or a Korean or a secret, substituted or not
Cl〇之雜燒 醋、酮、羥基、羥基、 經取代之CrCio之醯基、經取代或非經取代之匸 基,該取代可為醇、烷氧基、醚 硫醇及氰基中任一者以上; X係各自獨立地為Η ;或 烷氧基 以上; 醚、酯、酮、羧基、羥基、硫醇及氰基中任 經取代或非經取代之Cl〜CiQ之淀基,該取代可為醇 者 y係各自獨立地為s或so2;或 經取代或非經取代之Ci〜Ciq之烷基,該取代可為醇、 烷氧基、醚、酯、酮、羧基、羥基、硫醇及氰基中佟〜 .. 者 η係各自獨立地為丨〜2之整數。 具體而言,該化學式丨〜2所代表之經磷改質的酚系化八 15 201144414 物(2)係可由盼系化合物與填系化合物反應而製造,較佳 可為選自酚、曱酚、乙酚、丁基酚、辛基酚、苯基酚、茵 香基盼、曱氧基盼、乙氧基盼、萘紛、雙齡A、雙紛F、雙 酚S、雙盼AD及聯苯基所構成之群中任一者以上之酚系化 合物與構系化合物反應而製造,較佳為盼系化合物,與路 系化合物於鹼觸媒條件下,進行甲階酚醛樹脂化反應後, 使用醇系溶劑經烧氧基化製造出甲階酚醛樹脂化合物後, 與磷系化合物反應透過脱醇反應製造出經磷改質的酚系化 合物,其製造方法不限於此等。 此時,作為使用的磷系化合物,使用選自3,4,5,6_二苯 并-1,2-氧雜膦-2-氧化物(3,4,5,6>Dibenzo-l,2_oxaphosphane -2-oxide)〔以下’稱為‘DOPO’〕、二曱基亞鱗酸酯(Di methylphosphite)〔以下,稱為4DEP,〕及二苯基氧化膦( DiphenylphosphineOxide)〔以下,稱為‘Dp〇,〕所構成之 群之化合物,有利於UV遮蔽性能及阻燃效果及物性之提升 〇 如此經磷改質的酚系化合物(2)只要為該化學式丨〜之 所代表之化合物的話,則無限制地使用,較佳是,作為該 化學式1所代表之紛系化合物,可使用經填改質的齡、經礙 改質的曱盼,作為該化學式2所代表之紛系化合物,可使用 經磷改質的雙酚A、經磷改質的雙酚?、經磷改質的雙酚a D、經磷改質的雙酚s等。 依據本發明一較佳實施例,該酚系化合物(1)可為下 述化學式3〜4所代表之化合物中任一者以上。 201144414 〔化3〕a hydrazine ketone, a ketone, a hydroxyl group, a hydroxyl group, a substituted thiol group of a substituted CrCio group, a substituted or unsubstituted thiol group, and the substitution may be any one of an alcohol, an alkoxy group, an ether thiol, and a cyano group. The X series are each independently a hydrazine; or an alkoxy group or more; a substituted or unsubstituted lye group of an alkyl group, an ester, a ketone, a carboxyl group, a hydroxyl group, a thiol group, and a cyano group, which is substituted or unsubstituted. The alcohol may be independently s or so2; or substituted or unsubstituted Ci~Ciq alkyl, the substitution may be an alcohol, an alkoxy group, an ether, an ester, a ketone, a carboxyl group, a hydroxyl group, a sulfur Alcohol and cyano oxime ~ .. η are each independently an integer of 丨~2. Specifically, the phosphorus-modified phenolic system represented by the chemical formula 丨2 can be produced by reacting a compound with a compound, preferably from a phenol or a phenol. , Ethylphenol, butyl phenol, octyl phenol, phenyl phenol, indoline, oxime, ethoxy, naphthalene, double age A, double F, bisphenol S, double expectant AD The phenolic compound of any one or more of the group consisting of biphenyl groups is produced by reacting with a constitutive compound, preferably a compound of a desired compound, and a resol resin reaction with a route compound under a base catalyst condition. After the resol phenol resin compound is produced by alkoxylation using an alcohol-based solvent, a phosphorus-modified phenol-based compound is produced by a dealcoholization reaction with a phosphorus-based compound, and the method for producing the phenol-based compound is not limited thereto. At this time, as the phosphorus compound to be used, a compound selected from 3,4,5,6-dibenzo-1,2-oxaphosphonium-2-oxide (3,4,5,6) Dibenzo-l, 2_oxaphosphane -2-oxide) [hereinafter referred to as 'DOPO'], Dimethylphosphite (hereinafter referred to as 4DEP,) and Diphenylphosphine Oxide (hereinafter referred to as ' The compound of the group consisting of Dp〇,] is advantageous for the UV shielding property, the flame retarding effect, and the physical property. The phenolic compound (2) thus modified by the phosphorus is a compound represented by the chemical formula ,~ In the case of the compound represented by the chemical formula 1, it is preferred to use a modified age and a modified intermediate, as a compound represented by the chemical formula 2, Use phosphorus-modified bisphenol A and phosphorus-modified bisphenol? Phosphorous modified bisphenol a D, phosphorus modified bisphenol s, and the like. According to a preferred embodiment of the present invention, the phenolic compound (1) may be any one or more of the compounds represented by the following Chemical Formulas 3 to 4. 201144414 〔化3〕
〔化4〕〔化4〕
化學式3〜4中,X係各自獨立地為Η ;或 經取代或非經取代之Ci-Cn之烷基,該取代可為醇、 烧氧基、醚、酯、酮、叛基、經基、硫醇及氰基中任一者 以上; Y係各自獨立地為S或so2;或 經取代或非經取代之CcCio之烷基,該取代可為醇、 院氧基、醚、酯、酮、叛基、經基、硫醇及氰基中任一者 以上。 依據本發明另一較佳實施例,該酚系化合物(1)為選 自酚、曱酚、乙酚、丁基酚、辛基酚、苯基酚、茴香基酚 、曱氧基酚、乙氧基酚、萘酚、雙酚A、雙酚F、雙酚S及 17 201144414 雙酚AD所構成之群中任—者以上,更佳地是,作為該化學 式3所代表之㈣、化合物,可使㈣、曱盼;作為該化學式 4所,表之紛系化合物,使用雙盼A、雙盼F、雙紛AD、雙 酚^冑利於UV遮蔽性能及阻燃效果及物性之提升。 另方面,於本發明,使用酚系化合物(丨)及化學式 1〜2中任――者以上所代表之經磷改質的酚系化合物(2)任 者寺了元成本發明之目的。若未添加經_改質的酴系化 合物⑺於盼系化合物⑴+,添加填系化合物進行盼 經清漆反料情形,可表·ν遮紐能,但化合物本身為 不3有表現阻燃特性的化合物,會發生無阻燃特性之問題 。換δ之’為對要求UV_性㈣印刷電路基板用之樹脂 組成物被要求賦予的物性為阻燃性、接著力、高玻璃轉移 溫度、耐熱性及UV遮蔽性能,印刷電路基板用之樹脂組成 物使用環氧樹脂、UV遮蔽性環氧樹脂、_改質的環氧樹 脂或添加型碟系阻燃劑、盼酸清漆固化劑。然而,為賦予 阻燃性而使用添加型磷系阻燃劑之情形,經由不參與與環 氧基之硬化反應時之反應,玻璃轉移溫度減少,熱安定性 低落,尤其,會發生具有與素材之接著特性顯著降低等物 理的化予的物性差的問題之缺點,使用經碗改質的環氧 樹月旨的情形’具有經由硬化物本身硬化密度之減少,破璃 轉移溫度之減少、熱安定性之減少及接著特性差的缺點, 無UV遮蔽性能而必須添加其他17¥遮蔽性環氧樹脂,但 遮蔽性環氧樹脂不含有表現阻燃特性的物質,結果具有印 刷電路基板用之樹脂硬化物之鱗含量低落而阻燃特性變差 201144414 的缺點。即,為賦予1;乂遮蔽效果及阻燃特性,必須添加二 種以上之物質,故具有製造工程費用上昇而價格競爭力低 落的缺點。 而且,未使用酚系化合物(1),僅使用經填改質的酚 系化合物(2)於酸觸媒下,與醛系化合物進行酚醛清漆反 應的情形,經由經磷改質的酚系之相對的大分子量於酚醛 清漆反應時’反應物之分子量會急劇地變大,會發生不可 ·· 能有製品之順利生產的問題。而且,使用大分子量之1}乂遮 蔽阻燃固化劑於環氧基之硬化反應的情形,藉由具有大分 子量之UV遮蔽阻燃固化劑而硬化反應時,由於立體障礙而 無法平順產生硬化反應,結果環氧基及固化劑之未反應物 質殘留,會發生硬化物之玻璃轉移溫度、耐燃性及接著等 之物性變差的問題。 本發明中所使用的該醛化合物係與該酚系化合物及經 碟改質酚系化合物進行酚醛清漆反應時所使用,為賦TUV 遮蔽性能,若可將1莫耳之醛化合物與4莫耳以上之酚系及 經磷改質齡系化合物反應者的話,則無限制地使用,較佳 為可使用下述化學式5〜6所代表之醛系化合物,更佳為可使 、 用乙二醛、對苯二曱醛等。 〔化5〕 & fIn Chemical Formulas 3 to 4, X is each independently Η; or a substituted or unsubstituted Ci-Cn alkyl group, and the substitution may be an alcohol, an alkoxy group, an ether, an ester, a ketone, a thiol group, a thiol group. And any one of a thiol and a cyano group; the Y series are each independently S or so2; or a substituted or unsubstituted CcCio alkyl group, the substitution may be an alcohol, a hospitaloxy group, an ether, an ester, a ketone Any one of above, thiol, thiol, thiol and cyano. According to another preferred embodiment of the present invention, the phenolic compound (1) is selected from the group consisting of phenol, indophenol, ethylphenol, butylphenol, octylphenol, phenylphenol, anisidine, anthoxyphenol, and B. More than or equal to the group consisting of oxyphenol, naphthol, bisphenol A, bisphenol F, bisphenol S and 17 201144414 bisphenol AD, more preferably, as a compound represented by the chemical formula 3, It can be used as the compound of the formula 4, and the use of double expectant A, double expectant F, double AD, and bisphenol is beneficial to the UV shielding performance, the flame retarding effect and the physical property. On the other hand, in the present invention, the phenol-based compound (丨) and the phosphorus-modified phenol-based compound (2) represented by any of the above formulas 1 to 2 are used for the purpose of the invention. If the ruthenium-based compound (7) is not added to the compound (1)+, and the compound is added to the varnish, the nucleus can be viscous, but the compound itself is not flammable. For compounds, there is no problem with flame retardant properties. In the case of the resin composition required for the UV-based (four) printed circuit board, the physical properties required to be imparted are flame retardancy, adhesion, high glass transition temperature, heat resistance and UV shielding performance, and resins for printed circuit boards. As the composition, an epoxy resin, a UV-shielding epoxy resin, a modified epoxy resin, an additive-type dish-based flame retardant, and an acid-preserving varnish curing agent are used. However, in the case where an additive-type phosphorus-based flame retardant is used for imparting flame retardancy, the glass transition temperature is lowered and the heat stability is lowered by not participating in the reaction with the epoxy group hardening reaction, and in particular, the material and the material are generated. Then, the characteristics are remarkably reduced, and the physical properties of the physical properties are poor. The use of the bowl-modified epoxy tree has the effect of reducing the hardening density of the cured product itself, reducing the glass transition temperature, and the heat. The disadvantage of the decrease in stability and the difference in the subsequent characteristics is that it is necessary to add another 17% shielding epoxy resin without UV shielding performance, but the shielding epoxy resin does not contain a substance exhibiting flame retardant properties, and as a result, it has a resin for a printed circuit board. The scale of the hardened material is low and the flame retardant property is deteriorated. In other words, in order to impart 1; 乂 shielding effect and flame retardant property, it is necessary to add two or more kinds of substances, which has the disadvantage that the cost of manufacturing engineering increases and the price competitiveness is low. Further, when the phenolic compound (1) is not used, only the phenolic compound (2) which is filled with the modified phenolic compound is subjected to a novolak reaction with an aldehyde-based compound under an acid catalyst, and is subjected to a phosphorus-modified phenolic system. When the relative large molecular weight is reacted in the novolac reaction, the molecular weight of the reactants is drastically increased, and there is a problem that the product can be produced smoothly. Moreover, in the case of using a large molecular weight 1} 乂 masking flame retardant curing agent in the epoxy group hardening reaction, when the reaction is hardened by a UV shielding flame retardant curing agent having a large molecular weight, the hardening reaction cannot be smooth due to steric hindrance As a result, the unreacted substances of the epoxy group and the curing agent remain, and the problem of deterioration of the glass transition temperature, flame resistance, and subsequent physical properties of the cured product occurs. The aldehyde compound used in the present invention is used in the reaction of the phenolic compound and the dish-modified phenolic compound in a novolak reaction, and is a TUV shielding property, and if 1 mol of the aldehyde compound can be used with 4 mol. In the case of the above phenol-based or phosphorus-modified compound, the aldehyde-based compound represented by the following Chemical Formulas 5 to 6 can be preferably used, and it is more preferred to use glyoxal. , p-benzoaldehyde, and the like. 〔化5〕 & f
H W 〔化6〕 201144414H W [化6] 201144414
Η X 化學式6中,X係各自獨立地為η ;或 經取代或非經取代之Cl〜C1Q之烷基,該取代玎為醇、 烷氧基、醚、酯、酮、羧基、羥基、硫醇及氰基中任一者 以上者。 該酸觸媒只要為酚系化合物及經破改質酚系化合物與 酸化合物之酴搭清漆化反應中使用的酸觸媒的話,則無限 制,較佳為包含草酸、PTSA、MSA、ESA、硫酸、端酸、 鹽酸、p-甲苯橫酸、續酸、鹽酸水溶液、硫酸水溶液、 硝酸水溶液及磷酸水溶液’該等以外亦可使用自肀面上鱗 入的現有酸觸媒。 依據本發明之一特徵,添加該化學式3〜4所代表之化 合物中任一者以上之齡系化合物(1 )及該化學式1〜2所代 表之經磷改質酚系化合物(2)中任一者以上之酚系化合物 ’於酸觸媒下與醛系化合物進行酚醛清漆反應。此時,反 應條件較佳為以酚系化合物(1)與經碟改質酴系化合物( 2)之和為基準’可與酸糸化合物以4: 1〜2〇 : 1之莫耳比被 反應。若反應莫耳比在前述範圍之外,於4莫耳以下的情形 ,由於酚系化合物與醛系化合物之劇烈反應,有膠化可能 性的問題會發生,於2〇莫耳以上的情形,有11乂遮蔽之經磷 改質的阻燃固化劑之安定生產的可能,但由於必要以上之 過量酚系化合物,有製品之生產性顯著低落的問題會發生 20 201144414 該酚醛清漆反應係於50〜150°C,較佳為80〜l3〇y L下進 行1小時〜20小時。最終UV遮蔽性能優異之經磷改質的卩且. 固化劑之磷含量,可藉由該化學式1〜2之經磷改質齡系化二 物之莫耳比調整最終化合物之磷含量,uv遮蔽性能優異σ 經磷改質的阻燃固化劑之磷含量可為1〜15%,較佳為 %。若磷含量低於1% ’則阻燃效果微小,若超過15%,則 有化學構造上之改質為不可能的問題。而且,通常之ϋν^ 蔽效果,於高密度多層之印刷電路基板之類的電子應用領 域,有用於實施通過自動光學檢査(ΑΟΙ)的積層體之品質 管理’ ΑΟΙ典型地為450nm至約650nm範圍之波長下進行紫 外線(UV)吸光度的測量,此有可能經由υν-Vis測定器來 測量。 另一方面,較佳為,該UV遮蔽性能優異之經磷改質的 阻燃固化劑化合物,係經由將稍微過量之酚系化合物與經 磷改質酚系化合物與醛化合物於酸觸媒下’作酚醛清漆化 反應而獲得,過量之酚系化合物及/或經磷改質酚系化合物 可通過蒸顧而去除。而且’用於本發明之酚醛清漆化反應 之酸觸媒’除經熱被分離的草酸以外,使用鹼化合物NaOH 、KOH、NA2C〇3等之水溶液藉由中和及多數之水洗工程可 進行去除殘存之酸觸媒的工程,並未限於此方法,還可藉 由各式各樣之方法被分離。 依據本發明一較佳實施例’通過該酚醛清漆反應所製 造之經磷改質的阻燃固化劑可為下述化學式7〜8所代表之 21 201144414 化合物中任一者以上。Η X In Chemical Formula 6, X is each independently η; or a substituted or unsubstituted alkyl group of C1 to C1Q, and the substituted hydrazine is an alcohol, an alkoxy group, an ether, an ester, a ketone, a carboxyl group, a hydroxyl group, or a sulfur. Any one of an alcohol and a cyano group. The acid catalyst is not limited as long as it is an acid catalyst used in a varnishing reaction between a phenolic compound and a phenolic compound and an acid compound, and preferably contains oxalic acid, PTSA, MSA, ESA, A conventional acid catalyst which is scaled from the surface of the crucible may be used in addition to sulfuric acid, terminal acid, hydrochloric acid, p-toluene acid, a continuous acid, an aqueous hydrochloric acid solution, a sulfuric acid aqueous solution, an aqueous nitric acid solution, and an aqueous phosphoric acid solution. According to one of the features of the present invention, the compound (1) of any one of the compounds represented by the chemical formulas 3 to 4 and the phosphorus-modified phenolic compound (2) represented by the chemical formulas 1 to 2 are added. One or more phenolic compounds are subjected to a novolak reaction with an aldehyde compound under an acid catalyst. In this case, the reaction conditions are preferably based on the sum of the phenolic compound (1) and the disc-modified lanthanide compound (2), which can be compared with the acid bismuth compound by a molar ratio of 4:1 to 2:1. reaction. If the reaction molar ratio is outside the above range, in the case of 4 mol or less, since the phenolic compound reacts violently with the aldehyde compound, there is a problem that the possibility of gelation occurs, and in the case of 2 mol or more, There is a possibility of stable production of 11 乂 shielded phosphorus-modified flame retardant curing agent, but due to the above excess phenolic compound, the problem of the product's productivity is significantly low. 20 201144414 The phenolic varnish reaction is based on 50 It is carried out at ~150 ° C, preferably 80 to 13 〇 y L for 1 hour to 20 hours. The phosphorous content of the phosphorus-modified sulphuric acid, which is excellent in UV shielding performance, can be adjusted by the molar ratio of the phosphorus-modified ageing compound of the chemical formula 1 to 2, and the phosphorus content of the final compound, uv Excellent shielding performance σ The phosphorous-modified flame retardant curing agent may have a phosphorus content of 1 to 15%, preferably %. If the phosphorus content is less than 1%, the flame retarding effect is small, and if it exceeds 15%, there is a problem that chemical structural modification is impossible. Moreover, in general, in the field of electronic applications such as high-density multilayer printed circuit boards, there is a quality management for carrying out laminated bodies by automatic optical inspection (ΑΟΙ), typically ranging from 450 nm to about 650 nm. Ultraviolet (UV) absorbance measurements were taken at the wavelengths, which may be measured via a υν-Vis meter. On the other hand, it is preferred that the phosphorus-modified flame retardant curing agent compound excellent in UV shielding performance is obtained by a slight excess of a phenolic compound and a phosphorus-modified phenolic compound and an aldehyde compound under an acid catalyst. 'Available as a novolak varnish reaction, and an excess of the phenolic compound and/or the phosphorus-modified phenolic compound can be removed by steaming. Further, 'the acid catalyst used for the novolac reaction of the present invention' can be removed by neutralizing and most of the water washing works using an aqueous solution of an alkali compound such as NaOH, KOH or NA2C〇3 in addition to oxalic acid which is separated by heat. The engineering of the residual acid catalyst is not limited to this method, and can be separated by various methods. According to a preferred embodiment of the present invention, the phosphorus-modified flame retardant curing agent produced by the novolak reaction may be any one of 21 201144414 compounds represented by the following Chemical Formulas 7 to 8.
〔化7〕 A A〔化7〕 A A
mm
化學式7、8中,A係各自獨立地為: OHIn Chemical Formulas 7 and 8, the A series are each independently: OH
22 20114441422 201144414
Ri係各自獨立地為:The Ri series are each independently:
R2及R3係各自獨立地為Ή、醇、烧氧基、醚、_、_、 羧基、羥基、硫醇或氰基;或 、經取代或非經取代之之院基、經取代或#經取 代之C! C10之稀基、經取代或非經取代之Cl〜Ci〇之快基、或 經取代或非經取代之C1〜C1G之芳香族化合物、經取代或# 經取代之C广c10之酿基、經取代或非經取代之Cl〜c雜炫 基,該取代可為醇、烧氧基、趟、醋、酉同、羰基、經基、 硫醇及氰基中任一者以上; X係各自獨立地為η;或 經取代或非經取代之Ci〜Ch)之烷基,該取代玎為醇、 烧氧基、at、酿、酮、缓基、經基、硫醇及氰基中任一者 以上; Y係各自獨立地為s或S〇2;或 經取代或非峰代之C1〜C1()之絲,該取代可為醇、 院氧基、ϋ、S旨、酮、絲、經基、硫醇及氰基十任 以上; t η係各自獨立地為丨〜2之整數;及 m係各自獨立地為〇至1之中任一者之整數,使滿足a部 分共價而將碳原子之原子價。 ° 23 201144414 依據本發明一較佳具體例,提供包含該化學式7〜8所代 表之新穎化口物中任一者以上之UV遮蔽性能優異之經磷 改質的阻燃固化劑的樹脂組成物。 通過該方法所製造本發明之UV遮蔽性能 優異之經磷 改?的阻燃S]化劑,於考慮機械的*性之提升與阻燃性能 之提升之均衡時’相對於樹脂成分獅重量%,添純卜50 重量%之阻燃固化劑,較佳可添加1G〜3G重量%。於此情形 為賦予1U化劑之優異阻燃、耐熱特性及物理的、化學的 物? 生可使用%氧樹脂、氰酸g旨樹脂及丙烯酸酉旨樹脂之原 料及環氧樹脂之JU化劑。通過此等高信賴性之電氣、電子 ,,之絕緣材料’可廣泛地適用於要求優異阻燃性及熱的 安定性的無自純合狀PCB基板聽緣㈣、各種複合 材料、接著劑、塗布劑、塗料等。尤其’於高密度多層之 印刷電路基板之類的電子應用領域’有用於實施通過自動 光學檢査(AOI)的積層體之品質管理。 另一方面,依據本發明一較佳態樣,含有該阻燃固化 劑的樹脂組成物係包含單獨或混合平常之環氧樹脂類與固 化劑類、無機物類、觸媒類等。具體而言,該被添加的環 氧樹脂類只要為平常印刷電路基板等所使用的樹脂組成物 所含者的話,則無限制地使用,較佳可選自雙酚A型環氧樹 脂、雙酚F型環氧樹脂、雙酚AD型環氧樹脂、雙酚S型環氧 樹脂、聯苯基型環氧樹脂、酴酚酸清漆型環氧樹脂、Dcpd 型環氧樹脂、雙盼A盼酸清漆型環氧樹脂、雙酚J7紛搭清漆 型環氧樹脂、甲紛紛經清漆型環氧樹脂、雙紛§盼酿清漆型 24 201144414 環氧樹脂、聯苯基酚醛清漆型環氧樹脂、二甲苯酚醛清漆 型環氧樹脂、DCPD酚酚醛清漆型環氧樹脂、聯苯基笨2酚 醛清漆型環氧樹脂、參苯基酚酚醛清漆型環氧樹脂群$任 何一者以上。 依據本發明其他較佳實施例,構成樹脂組成物的固化 劑類只要是平常印刷電路基板等使用的樹脂組成物所含者 的話,則無限制地使用,可選自酚酚醛清漆型固化劑、甲R2 and R3 are each independently hydrazine, alcohol, alkoxy, ether, _, _, carboxy, hydroxy, thiol or cyano; or substituted or unsubstituted pharmaceutically, substituted or Substituted C! C10, a substituted or unsubstituted Cl~Ci〇 group, or a substituted or unsubstituted C1~C1G aromatic compound, substituted or #substituted C-C10 a substituted, unsubstituted or unsubstituted Cl~c heterocyclyl which may be any of an alcohol, an alkoxy group, a hydrazine, a vinegar, a hydrazine, a carbonyl group, a thiol group, a thiol group and a cyano group. X is each independently η; or a substituted or unsubstituted alkyl of Ci~Ch), which is an alcohol, an alkoxy group, an at, a ketone, a ketone, a thiol, a thiol, and a thiol. Any one of the cyano groups; the Y groups are each independently s or S 〇 2; or the substituted or non-peak C1 to C1 () silk, the substitution may be an alcohol, a hospitaloxy group, a hydrazine, a s And ketone, silk, mercapto, thiol and cyano are more than ten; t η are each independently an integer of 丨~2; and m are each independently an integer from 〇 to 1 such that Part a will be covalent Valence atoms. According to a preferred embodiment of the present invention, there is provided a resin composition comprising a phosphorus-modified flame retardant curing agent excellent in UV shielding properties of any one of the novelizing mouths represented by the chemical formulas 7 to 8. . The phosphorus-modified flame retardant S] agent which is excellent in the UV shielding property of the present invention produced by the method is considered to be % relative to the resin component lion when considering the improvement of the mechanical property and the improvement of the flame retardant property. Adding 50% by weight of the flame retardant curing agent, preferably adding 1G to 3G% by weight. In this case, it is an excellent flame retardant, heat-resistant property, physical and chemical substance imparted to the 1U chemical agent, and a raw material of the epoxy resin, the cyanate resin, the acrylic resin, and the epoxy resin can be used. . These high-reliability electrical and electronic insulation materials can be widely applied to the self-purifying PCB substrate listening edge (4), various composite materials, and adhesives, which require excellent flame retardancy and thermal stability. Coating agent, paint, etc. In particular, in the field of electronic applications such as high-density multilayer printed circuit boards, there is a quality management for implementing laminated bodies by automatic optical inspection (AOI). On the other hand, according to a preferred aspect of the present invention, the resin composition containing the flame retardant curing agent comprises an epoxy resin and a curing agent, an inorganic substance, a catalyst or the like which are usually used alone or in combination. Specifically, the epoxy resin to be added is not limited as long as it is contained in a resin composition used for a usual printed circuit board or the like, and is preferably selected from bisphenol A type epoxy resin and double. Phenol F type epoxy resin, bisphenol AD type epoxy resin, bisphenol S type epoxy resin, biphenyl type epoxy resin, indophenol varnish type epoxy resin, Dcpd type epoxy resin, double hope A Acid varnish type epoxy resin, bisphenol J7 with varnish type epoxy resin, a pair of varnish type epoxy resin, double § 盼 varnish type 24 201144414 epoxy resin, biphenyl novolac type epoxy resin, Any one or more of a xylenol varnish type epoxy resin, a DCPD phenol novolak type epoxy resin, a biphenyl stupid 2 novolak type epoxy resin, and a phenylphenol novolak type epoxy resin group. According to another preferred embodiment of the present invention, the curing agent constituting the resin composition may be used without limitation as long as it is contained in a resin composition used for a usual printed circuit board or the like, and may be selected from a phenol novolak type curing agent. A
酚酚醛清漆型固化劑、雙酚F酚醛清漆型固化劑、雙酚AD 祕清漆型固化劑、雙盼8祕清漆型固化劑、二甲笨祕 清漆型固化劑、DCPD酚酚醛清漆型固化劑、聯笨基笨基酚 酿清漆型m化劑、參笨基㈣料漆型固化劑及雙氰胺群 中任何一者以上。 依據本發明另一較佳實施例,樹脂組成物所含的無機 物類只要是平常印刷電路基板等㈣的樹餘成物所含者 的話’則無限制地使用’可選自氫氧倾、⑪石群中任何 一者以上。 等例。 依據本發明另-較佳實施例,構成樹脂組成物的觸媒 類只要是平常印刷·基板較料_組成物所含者的 話,則無限制地使用,具體而言,作為咪唾系觸媒,可單 獨或混合使用2_甲基咪唾、2_乙基·4_甲基^坐、2_十一基啼 唑、2-十七基咪唑、2_笨基咪唑、2_苯基冰甲基咪唑二卜 ^基·2·^°米嗤、2·胺基乙基·2_曱基—、1·氰基乙基-2-苯基_4、5,二(氰基乙基氧基甲基)料等,但不限制於此 25 201144414 依據本發明另一較佳實施例,該樹脂組成物之UV遮蔽 效率於UV領域的100〜400nm可為95%以上。 以下’藉由實施例進一步具體說明本發明,但下述實 施例並非限制本發明之範圍者,其必須解釋為用以幫助理 解本發明者。 <製造例1> 於反應槽中投入酚94.1 lg(l莫耳)中之多聚曱醛( paraform) 90.32 ( 1.25莫耳)、水30g及氫氧化鈉水溶液3.3g 並一邊加熱擾拌一邊於50°C之溫度進行反應5小時後,使用 水41.5g及硫酸0.1N硫酸1.67g而使中和反應進行,接著投入 曱醇255g後,於溫度70°C使進行反應5小時後,投入 DOPO207.36g。接著,一邊除去甲醇,一邊於i4〇°c之溫度 進行反應10小時以上後,製造經磷改質的DOPO-酚。 以下,DOPO-雙酚A、DPO_盼亦使用該之方法製造。 <實施例1> 於反應槽中投入酚564.66g(6莫耳)、D0P0-酚323.1 1g (1莫耳)並一邊加熱攪拌,一邊於溫度9〇°C使DOPO-酚溶 解後,將酸觸媒草酸8.87g分成3次投入而使反應進行。接 著,將乙二醛(Glyoxal) (40%水溶液)i45g ( 1莫耳) 分5次投入而使反應進行。接著,於溫度卯*^進行6小時反 應後,為分解為酸觸媒的草酸,於15〇t進行〗小時追加反 應。為除去未反應酚,於200。(:、真空下,進行酚回收工程 後,取得磷含量為5.68%的UV遮蔽性能優異之經磷改質的 阻燃固化劑化合物517g( FT-IR結果:類酚羥基(phen〇1_like 26 201144414 hydroxyl group) : 3300cm'1' P = O : nOOcm'VnSOcm'1' P-C-0 (芳香族性):9721-1、P-C (芳香族性)14240^1)。 評價固化劑化合物之UV遮蔽物性時使用UV-Vis測定 器’其結果圖示於下述第1圖。 <實施例2> 於反應槽中投入酚564.66g(6莫耳)、DOPO-酚(p = 9.59% )646.21g( 2莫耳)並一邊加熱攪拌,一邊於溫度90¾ 使D0P0-酚溶解後,將酸觸媒草酸12.“分3次投入。接著, 將乙二醛(40%水溶液)145g (1莫耳)分5次投入,而使 反應進行。接著,於溫度90。(:進行6時間反應後,為分解為 酸觸媒的草酸’於l50〇c進行〗小時追加反應。為除去未反 應酚’於200°C、真空下,進行酚回收工程後,取得磷含量 為8.73%的UV遮蔽性能優異之經攝改質的阻燃固化劑化合 物646g (FT-IR結果:類盼經基:3300cm·1、P=0 : Ι200αη /1280cm 1、P-C-Ο (芳香族性):972cm·1、P-C (芳香族性 )1424cm·1) 〇 評價固化劑化合物之UV遮蔽物性時使用UV_Vis測定 器,其結果圖示於下述第2圖。 <實施例3> 於反應槽中投入齡564.66g ( 6莫耳)、DOPO-雙紛A ( P=9.4%)680g(l莫耳)並一邊加熱攪拌,一邊於溫度9(rc 使DOPO-雙酚A溶解後,將酸觸媒草酸12 44§分3次投入。 接著,將乙二醛(40%水溶液)i45g ( 1莫耳)分5次投入 而使反應進行。接著,於溫度9〇°c進行6時間反應後,為分 27 201144414 解為酸觸媒的草酸,於150°C進行1小時追加反應。為除去 未反應酚,於2〇(TC、真空下,進行酚回收工程後,取得磷 含量為7.0 %的U V遮蔽性能優異之經磷改質的阻燃固化劑 化合物858g(FT-IR結果:類酚羥基:3300CHT1、P=〇: 12〇〇 cm 1/1280crl、P-C-0 (芳香族性):972cm·1、P,C (芳香族 性)1424CIT1)。 評價固化劑化合物之UV遮蔽物性時使用UV-Vis測定 器,其結果圖示於下述第3圖。 <實施例4> 於反應槽中投入酚564_66g (6莫耳)、DPO-Phenol (P -10% ) 31〇g (丨莫耳)並一邊加熱攪拌,一邊於溫度9〇。〇 使〇1>〇_紛溶解後’將酸觸媒草酸8.74g分3次投入。接著, 將乙二搭(40%水溶液)145g (1莫耳)分5次投入而使反 應進行。接著’於溫度9〇。(:進行6〜7小時反應後,為分解為 酸觸媒的草酸,於150〇c進行丨小時追加反應。為除去未反 應酚,於200 C進行酚回收工程後,取得磷含量為5 71%的 uv遮蔽性能優異之經磷改質的阻燃固化劑化合物515g ( FT-IR結果:類酚羥基:3300cm·1、p=〇 : 1200^/1280011 -1、p-c-o (芳香族性):972αιΓΐ、p_c (芳香族性)1424 αιΓ1)。 3平價固化劑化合物之〇乂遮蔽物性時使用uv_vis測定 器,其結果圖示於下述第4圖。 <實施例5> 於反應槽中投入紛564 66g(6莫耳)、D〇p〇_驗(p = 28 201144414 9.59% )323.11g( 1莫耳)並一邊加熱攪拌,一邊於溫度9〇ac 使DOPO-酚溶解後,將酸觸嬅草酸12 ]^分成3次投入。接著 ’花2小時將對苯二甲紛(p_Tefephthalaldehyde) 5〇%溶液 (Tolunen) 264g ( 1莫耳)分割投入,而使反應進行。接 著’於溫度9〇°C進行6〜7小時反應後,為分解為酸觸媒的草 酸’於15〇°C進行1小時追加反應。為除去未反應酚,於2〇〇〇c 進行紛回收工程後,取得磷含量為4.9%的UV遮蔽性能優異 之經鱗改質的阻燃固化劑化合物568g (FT-IR結果:類酚羥 基:3300cm·1、P = 〇 : mocufVmOcm-1、P-C-0 (芳香族 性):972cm-1、P-C (芳香族性)1424(^1)。 坪價固化劑化合物之UV遮蔽物性時使用UV_Vis測定 器’其結果圖示於下述第5圖。 <比較例1> 除添加作為磷系化合物之三苯基磷酸酯(磷含量9.5% 、ei8〇4PH15) 326g替代DOPO-酚之外,與實施例1同樣地 實施’取得磷含量為4.36%之阻燃固化劑化合物655g。 坪價固化劑化合物之UV遮蔽物性時使用UV-Vis測定 器’其結果圖示於下述第6圖。 <比較例2> 於反應槽中投入甲基溶纖劑(Methyl Cellosolve)與 DOP〇-紛(P=9.59%) 323.llg (1莫耳)並一邊加熱攪拌 ’一邊於溫度90Ϊ使DOPO-酚溶解。接著,將酸觸媒草酸 3.23g分成3次投入後,將乙二醛(4〇%水溶液)36.25g花2 小時分割投入 ,而使反應進行。接著,於溫度90°C進行10 29 201144414 小時反應後,為分解為酸觸媒的草酸,一邊於150°C除去曱 基溶纖劑’一邊進行1小時追加反應後,除去甲基溶纖劑後 ,取得填含量為9.1%的UV遮蔽性能優異之經填改質的阻燃 固化劑化合物330g ( FT-IR結果:類酚羥基:3300011]、P =0 : 1200cin /1280cm 、P-C-0 (芳香族性):972CIH·1、 P-C (芳香族性)1424cm·1)。 評價固化劑化合物之UV遮蔽物性時使用UV-Vis測定 器,其結果圖示於下述第7圖。 另一方面,於第8圖,圖示為〇H E.E.W103g/OH、固體 成分55%、軟化點為110°C的酚酚醛清漆固化劑(phen〇i NoVolac Hardener)之使用UV Vis測定器的測定結果。 <評價例> 以平常之方法通過該實施例丨〜5及比較例丨〜2而製造之 阻燃固化劑化合物,如下述表2至表4之摻合比加以摻合而 製造印刷電路基板用之接著劑。 而且,為评價該實施例及比較例中製造之經罐改質的 阻燃固化劑化合物之物性,實施如該表2至表4之摻合,並 顯示其結果。 具體而言,以下述表2至表4所示的摻合比摻合實施例 及比較例所製造賴脂而製作清漆後,含浸於玻璃纖維並 實施預浸(Pre.preg)作業。預浸係於175。(:使進行5分鐘後 作成半硬化㈣後,將8重則於1賊、25kgf/em2壓力下 進行15分鐘加壓後’再施加12〇分鐘4〇kgfW壓力加壓。接 著’於冷媒中冷凍30分鐘。 201144414 (1) 阻燃性試驗依據UL-94方法實施。 斗具體而言,試片為“5xl/2”’使用5個試片而試片接觸火 化10秒後,除去火花,將試片滅火,再接觸10秒後,再次 除去火花的方法,計算5個試#之丨、2:欠燃燒時間之總和( 1 2-人燃燒時間之總和為50秒以内的情形,阻燃等級為V-0 ’ 50秒以上〜250秒以下的情形為V-1)。 (2) 玻璃轉移溫度之測定實驗係利用示差熱分析器( DSC) (20/min)。 (3) 剝離強度(Peel Strength)係依據 GISC-6471 方 法測定。 (4) UV遮蔽之評價係使用SINC0 s_31〇〇裝備來測定 〇 (5) 膠化時間係使用膠化時間測定器(gel timer)於 170°C測定。 (6) UV遮蔽率於該表2至表4中所示的糝合比使用 UV-Vis測量器作測定,於1〇〇〜4〇〇n[n,uv遮蔽率之平均値 示於表1。 [表1] 實施例1 實施例2 實施例3 實施例4 實施例5 比較例1 比較例2 99.4% 99.5% 99.6% 99.5% 99.3% 99.1% 67.5% 31 201144414 [表2] 樹脂組成物1 (實施例1) 樹月旨組成物2 (實施例2) 樹脂組成物3 (實施例3) YD-011M68 14.7 14.7 14.7 YDPN-638A80 112.5 112.5 112.5 磷改質環氧樹脂 0 0 0 KDT-4400 0 0 0 阻燃固化劑(實 施例1〜比較例2) (NY60%) 131.3 87.26 114.5 酚酚醛清漆固化 劑 0 53.54 41.63 Dicy 2 2 2 矽石 44.69 45.45 47.9 MCs 44.69 45.45 47.9 2MI 0.01 0.01 0.01 組成物UV遮蔽 OK OK OK 阻燃等級/燃燒時 間 V-0(25s) V-0(23s) V-0(24s) 麟含量 2.0% 2.0% 2.0% 剝離強度 1.4 1.3 1.4 170膠化時間 199s 165s 175s 玻璃轉移溫度 155.4 166.82 173.2 32 201144414 [表3] 樹月旨多诚物4 (實施例4) 樹脂組成物5 (實施例5) 交樹脂組成 物1 (財交例1) 交樹月旨組成 物2 (比較例2) YD-011M68 14.7 14.7 14.7 14.7 YDPN-638A 80 112.5 112.5 112.5 112.5 磷改質環氧 樹脂 0 0 0 0 KDT-4400 0 0 0 0 阻燃固化劑 (實施例1〜 比較例2 ) (NV55%) 131.3 189 141.34 81.33 酚酚醛清漆 固化劑 0 0 0 56.72 Dicy 2 2 2 2 矽石 44.69 50.98 46.2 45 MCs 44.69 50.98 46.2 45 2MI 0.01 0.01 0.01 0.01 組成物UV 遮蔽 OK OK OK OK 阻燃等級/燃 燒時間 V-0(21s) V-0(45s) V-l(55s) V-0(41s) 磷含量 2.0% 2.0% 1.6 2.0% 剝離強度 1.4 1.3 0.9 1.2 170膠化時間 205s 195s 210s 170s 玻璃轉移溫 度 157.0 155.0 148.6 150.5 33 201144414 [表4] 樹脂組成物3 (實施例3) 比較樹脂組成物Phenolic novolac type curing agent, bisphenol F novolac type curing agent, bisphenol AD secret varnish type curing agent, Shuangpan 8 secret varnish type curing agent, dimethyl stupid varnish type curing agent, DCPD phenol novolac type curing agent Any one or more of the stupid base phenolic varnish type m-forming agent, the stupid base (four) paint-type curing agent and the dicyandiamide group. According to another preferred embodiment of the present invention, the inorganic substance contained in the resin composition is used as long as it is contained in the tree residue of the ordinary printed circuit board or the like (4), and can be used without limitation. Any one of the stone groups. Etc. According to another preferred embodiment of the present invention, the catalyst constituting the resin composition is used without limitation as long as it is included in the composition of the substrate or the substrate. Specifically, it is used as a catalyst. 2_Methyl iodide, 2_ethyl·4_methyl^, 2_undecylcarbazole, 2-heptadecylimidazole, 2-phenylidene imidazole, 2-phenylene may be used singly or in combination. Ice methylimidazole dibromo 2·^°m嗤, 2·aminoethyl·2_mercapto-, 1·cyanoethyl-2-phenyl_4,5, di(cyano) The base oxymethyl) material, etc., but not limited to this. 25 201144414 According to another preferred embodiment of the present invention, the UV shielding efficiency of the resin composition may be 95% or more in the range of 100 to 400 nm in the UV field. The invention is further illustrated by the following examples, which are not to be construed as limiting the scope of the invention. <Production Example 1> In a reaction tank, a polyformaldehyde 90.32 (1.25 mol), 30 g of water, and 3.3 g of an aqueous sodium hydroxide solution in a phenol 94.1 lg (l mole) were charged and heated while stirring. After the reaction was carried out at a temperature of 50 ° C for 5 hours, a neutralization reaction was carried out using 41.5 g of water and 1.67 g of sulfuric acid 0.1 N sulfuric acid, and then 255 g of decyl alcohol was added thereto, and then the reaction was carried out at a temperature of 70 ° C for 5 hours, and then charged. DOPO207.36g. Next, while removing methanol, the reaction was carried out at a temperature of i4 ° C for 10 hours or more to prepare a phosphorus-modified DOPO-phenol. Hereinafter, DOPO-bisphenol A and DPO_ are also produced by the method. <Example 1> Into a reaction tank, 564.66 g (6 mol) of phenol and 32. 1 g of D0P0-phenol (1 mol) were charged, and while DOPO-phenol was dissolved at a temperature of 9 ° C while heating and stirring, The acid catalyst oxalic acid 8.87 g was divided into three inputs to carry out the reaction. Next, Glyoxal (40% aqueous solution) i45 g (1 mol) was introduced in 5 portions to carry out the reaction. Subsequently, after reacting for 6 hours at a temperature of 卯*^, it was an oxalic acid which decomposed into an acid catalyst, and an additional reaction was carried out at 15 〇t. To remove unreacted phenol, at 200. (:, under vacuum, after phenol recovery, a phosphorus-modified flame retardant curing compound 517g with excellent UV shielding performance of 5.68% was obtained (FT-IR result: phenolic hydroxyl group (phen〇1_like 26 201144414) Hydroxyl group) : 3300cm'1' P = O : nOOcm'VnSOcm'1' PC-0 (aromatic): 9721-1, PC (aromatic) 14240^1) Evaluation of UV shielding properties of curing agent compounds In the case of using a UV-Vis measuring instrument, the results are shown in Fig. 1 below. <Example 2> 564.66 g (6 mol) of phenol and DOPO-phenol (p = 9.59%) 646.21 g were charged into the reaction vessel. (2 mol), while heating and stirring, dissolving D0P0-phenol at a temperature of 902⁄4, and then introducing the acid-catalyzed oxalic acid 12. "3 times. Next, glyoxal (40% aqueous solution) 145 g (1 mol) The reaction was carried out in 5 minutes, and then at a temperature of 90. (After the reaction for 6 hours, the oxalic acid decomposed into an acid catalyst was subjected to an additional reaction at 150 ° C to remove the unreacted phenol. After phenol recovery at 200 ° C under vacuum, a UV-shielding performance of 8.73% was obtained. Burning curing agent compound 646g (FT-IR result: expectation base: 3300cm·1, P=0: Ι200αη /1280cm 1, PC-Ο (aromatic): 972cm·1, PC (aromatic) 1424cm· 1) When the UV shielding property of the curing agent compound was evaluated, a UV_Vis measuring instrument was used, and the results are shown in Fig. 2 below. <Example 3> The age of the reactor was 564.66 g (6 m), DOPO- Double A (P = 9.4%) 680 g (l mole), while heating and stirring, while dissolving DOPO-bisphenol A at temperature 9 (rc, the acid-catalyzed oxalic acid 12 44 § was divided into three times. Next, Glycolaldehyde (40% aqueous solution) i45 g (1 mol) was charged in 5 times to carry out the reaction. Then, after 6 hours of reaction at a temperature of 9 ° C, the oxalic acid which is an acid catalyst was obtained as a fraction of 27 201144414. The reaction was further carried out at 150 ° C for 1 hour. In order to remove the unreacted phenol, a phosphorus-modified flame retardant having an excellent UV blocking property of 7.0% of phosphorus was obtained after phenol recovery in 2 Torr under vacuum. Curing agent compound 858g (FT-IR results: phenolic hydroxyl group: 3300 CHT1, P=〇: 12〇〇cm 1/1280crl, PC-0 (aromatic): 972cm·1, P, C ( Aromaticity) 1424CIT1) A UV-Vis measuring instrument was used to evaluate the UV shielding properties of the curing agent compound, and the results are shown in Fig. 3 below. <Example 4> Phenol 564-66 g (6 mol) and DPO-Phenol (P -10%) 31 〇g (丨mol) were charged into the reaction vessel while stirring at a temperature of 9 Torr. 〇 〇1>〇_dissolved after the acid catalyst oxalic acid 8.74g was put into 3 times. Next, 145 g (1 mol) of Ethylene (40% aqueous solution) was introduced in 5 portions to carry out the reaction. Then 'at a temperature of 9 〇. (: After 6 to 7 hours of reaction, the oxalic acid decomposed into an acid catalyst was subjected to an additional reaction at 150 ° C for 1 hour. To remove unreacted phenol, a phenol recovery process was carried out at 200 C to obtain a phosphorus content of 5 71. % uv shielding performance of phosphorus-modified flame retardant curing agent compound 515g (FT-IR results: phenolic hydroxyl group: 3300cm·1, p=〇: 1200^/1280011 -1, pco (aromatic): 972αιΓΐ, p_c (aromatic) 1424 αιΓ1). The uv_vis measuring device is used for the masking property of the flat curing agent compound, and the results are shown in Fig. 4 below. <Example 5> Into the reaction tank 564 66g (6 moles), D〇p〇_ test (p = 28 201144414 9.59%) 323.11g (1 mole) and heated and stirred, while the DOPO-phenol is dissolved at a temperature of 9〇ac, the acid is The contact oxalic acid 12]^ was divided into 3 inputs. Then, 2 hours of p-Tefephthalaldehyde 5 〇% solution (Tolunen) 264 g (1 mol) was divided and the reaction was allowed to proceed. After 9 to 7 hours of reaction at 9 ° C, the oxalic acid decomposed into an acid catalyst was carried out at 15 ° C for 1 hour. In addition, in order to remove unreacted phenol, 568 g of a scale-modified flame retardant curing agent compound having excellent UV shielding performance with a phosphorus content of 4.9% was obtained after 2 〇〇〇c recovery (FT-IR results: Phenolic hydroxyl group: 3300 cm·1, P = 〇: mocuf VmOcm-1, PC-0 (aromatic): 972 cm-1, PC (aromatic) 1424 (^1). UV shielding property of pinger curing agent compound In the case of using a UV_Vis measuring device, the results are shown in Fig. 5 below. <Comparative Example 1> In addition to adding a triphenyl phosphate (phosphorus content: 9.5%, ei8〇4PH15) as a phosphorus compound, 326 g is substituted for DOPO-phenol. In the same manner as in Example 1, 655 g of a flame retardant curing agent compound having a phosphorus content of 4.36% was obtained. A UV-Vis measuring device was used for the UV shielding properties of the valence curing agent compound. Fig. 6 <Comparative Example 2> Methyl cellosolve (Methyl Cellosolve) and DOP 〇-(P = 9.59%) 323.11 g (1 mol) were added to the reaction vessel while heating and stirring. 90Ϊ dissolved DOPO-phenol. Then, after the acid catalyst oxalic acid 3.23g was divided into 3 inputs, glyoxal (4〇%) The solution was subjected to a reaction of 36.25 g for 2 hours, and the reaction was allowed to proceed. Then, after the reaction was carried out at a temperature of 90 ° C for 10 29 201144414 hours, the ketone-based cellosolve was removed at 150 ° C for the decomposition of the oxalic acid to the acid catalyst. After the addition of the methyl cellosolve for 1 hour, the amount of the modified flame-retardant curing agent compound having a UV content of 9.1% was obtained (FT-IR result: phenolic hydroxyl group: 3300011], P = 0: 1200 cin / 1280 cm, PC-0 (aromatic): 972 CIH · 1, PC (aromatic) 1424 cm · 1). A UV-Vis measuring instrument was used to evaluate the UV shielding properties of the curing agent compound, and the results are shown in Fig. 7 below. On the other hand, in Fig. 8, a phenol phenol aldehyde varnish curing agent (phen〇i NoVolac Hardener) having a 〇H EEW103g/OH, a solid content of 55%, and a softening point of 110 ° C is used. The measurement results. <Evaluation Example> A flame-retardant curing agent compound produced by the above-described Examples 丨 to 5 and Comparative Examples 丨 to 2 was blended as in the following Tables 2 to 4 to produce a printed circuit. An adhesive for the substrate. Further, in order to evaluate the physical properties of the tank-modified flame retardant curing agent compound produced in the examples and the comparative examples, blending as shown in Tables 2 to 4 was carried out, and the results were shown. Specifically, the varnish produced by blending the lysates of the examples and the comparative examples with the blending ratios shown in the following Tables 2 to 4 was used to prepare a varnish, and then impregnated with glass fibers to carry out a prepreg operation. Prepreg is tied to 175. (: After making 5 minutes of semi-hardening (4), 8 weights will be pressurized for 1 minute under a pressure of 1 thief and 25kgf/em2, then '12 hours of additional pressure for 4 〇kgfW. Then 'freeze in the refrigerant. 30 minutes. 201144414 (1) The flame retardancy test is carried out according to the UL-94 method. Specifically, the test piece is "5xl/2"' using 5 test pieces and the test piece is exposed to cremation for 10 seconds, then the spark is removed. The test piece is extinguished, and after 10 seconds of contact, the method of removing the spark is again performed, and the sum of the five test #丨, 2: the underburning time is calculated (the sum of the 1-two burning times is less than 50 seconds, the flame retardant level) For the case of V-0 '50 seconds or more to 250 seconds or less, it is V-1). (2) Measurement of glass transition temperature The experiment uses a differential thermal analyzer (DSC) (20/min). (3) Peel strength ( Peel Strength was determined according to the method of GISC-6471. (4) Evaluation of UV shielding was performed using SINC0 s_31〇〇 equipment to determine 〇(5) Gelation time was determined at 170 ° C using a gel timer. (6) The UV shielding ratio is determined by using the UV-Vis measuring device as shown in Tables 2 to 4, at 1〇〇. 4〇〇n[n, the average value of the uv masking rate is shown in Table 1. [Table 1] Example 1 Example 2 Example 3 Example 4 Example 5 Comparative Example 1 Comparative Example 2 99.4% 99.5% 99.6% 99.5 % 99.3% 99.1% 67.5% 31 201144414 [Table 2] Resin Composition 1 (Example 1) Tree Composition 2 (Example 2) Resin Composition 3 (Example 3) YD-011M68 14.7 14.7 14.7 YDPN- 638A80 112.5 112.5 112.5 Phosphorus modified epoxy resin 0 0 0 KDT-4400 0 0 0 Flame retardant curing agent (Example 1 to Comparative Example 2) (NY60%) 131.3 87.26 114.5 Phenolic novolac curing agent 0 53.54 41.63 Dicy 2 2 2 Meteorite 44.69 45.45 47.9 MCs 44.69 45.45 47.9 2MI 0.01 0.01 0.01 Composition UV shading OK OK OK Flame retardant grade / burning time V-0 (25s) V-0 (23s) V-0 (24s) Lin content 2.0% 2.0 % 2.0% Peel strength 1.4 1.3 1.4 170 Gelation time 199s 165s 175s Glass transition temperature 155.4 166.82 173.2 32 201144414 [Table 3] Shuyue Duocheng 4 (Example 4) Resin composition 5 (Example 5) Composition 1 (Financial Example 1) Crossing Composition 2 (Comparative Example 2) YD-011M68 14.7 14.7 14.7 14.7 YDPN-638A 80 112.5 112 .5 112.5 112.5 Phosphorus modified epoxy resin 0 0 0 0 KDT-4400 0 0 0 0 Flame retardant curing agent (Example 1 to Comparative Example 2) (NV55%) 131.3 189 141.34 81.33 Phenolic novolac curing agent 0 0 0 56.72 Dicy 2 2 2 2 Meteorite 44.69 50.98 46.2 45 MCs 44.69 50.98 46.2 45 2MI 0.01 0.01 0.01 0.01 Composition UV shading OK OK OK OK Flame retardant grade / burning time V-0 (21s) V-0 (45s) Vl ( 55s) V-0 (41s) Phosphorus content 2.0% 2.0% 1.6 2.0% Peel strength 1.4 1.3 0.9 1.2 170 gelation time 205s 195s 210s 170s Glass transition temperature 157.0 155.0 148.6 150.5 33 201144414 [Table 4] Resin composition 3 (implementation Example 3) Comparing resin composition
YD-011M68 YDPN-638A80 磷改質環氧樹脂 KDT-4400 阻燃固化劑 (實施例1〜比較例2) (NV60%) 酚酚醛清漆固化劑YD-011M68 YDPN-638A80 Phosphorus modified epoxy resin KDT-4400 Flame retardant curing agent (Example 1 to Comparative Example 2) (NV60%) Phenolic novolac curing agent
Dicy 矽石 MCsDicy Diamond MCs
2MI 組成物UV遮蔽 阻燃性 磷含量 剝離強度 170膠化時間 玻璃轉移溫度 第1圖〜第8圖係顯示依據本發明製造之經磷改質的阻 燃固化劑及比較例之UV遮蔽性能者,χ軸表示光之、皮長 wavelenth) ,y軸表示光之穿透率。由第丨圖〜第8 此光之該波長帶之光遮蔽效果。於該波長帶下穿口知 ,,接近1_越無遮蔽效果,越接近㈣於其該波長帶有 所明優異的遮蔽效果,但依據本發明可知,所製造的而遮 蔽性能優異之經磷改質的固化劑KUV領域的1〇—39〇nm下 的UV穿透率為。 34 201144414 Μ固化^該第1圖〜第8圖及表1可知,本發明實施例1〜5之降 :固化劑之UV錢率,與比較例Κ2相比,猶蔽效果優 ㈣Γ匕且’依據表2〜3可知,使用實施例1〜5之阻燃固化劑 組成物卜4含有Uv遮蔽效果及反應型之阻燃劑 ::添力姻劑的比較樹脂組成物ι相比,有所謂接著力 優異’且玻璃轉移溫度高,優異的阻燃性。 :且’依據該表何知,利用本發明實關之樹脂的情 形掛麵樹脂本身之阻燃特性的磷時,具有υν遮蔽性能, 於機組成物之製造時未添加其他_環氧樹脂(填系環 氧樹脂)及具有UV遮蔽性能的環氧樹脂(KDT.44G0,國都 化學股份有限公司),可知其性能被發揮。具體而言,由 該表4之結果,可知添加阻燃環氧樹脂的情形,玻璃轉 度及接著力顯著減少。 氣 [產業上之利用可能性] 通過本發明之製造方法所製造的UV遮蔽性能優異之 _改質的MSI化劑及含有該固化劑之樹脂組成物,'可 廣泛地適用於PCB基板及絕緣板等、各種之複合材料、 著劑、塗布劑、塗料。 【圖式簡單説明】 第1圖為藉由本發明一最佳實施例所製造的阻燃固化 劑之UV遮蔽率圖。 第2圖為藉由本發明一最佳實施例所製造的阻燃固化 劑之UV遮蔽率圖。 35 201144414 第3圖為藉由本發明一最佳實施例所製造的阻燃固化 劑之UV遮蔽率圖。 第4圖為藉由本發明一最佳實施例所製造的阻燃固化 劑之UV遮蔽率圖。 第5圖為藉由本發明一最佳實施例所製造的阻燃固化 劑之UV遮蔽率圖。 第6圖為藉由比較例1所製造的阻燃固化劑之UV遮蔽 率圖。 第7圖為藉由比較例2所製造的阻燃固化劑之UV遮蔽 率圖。 第8圖為OH.E.E.W103g/eq、固體成分55%、軟化點1 10°C的紛盼酸清漆固化劑(Phenol NoVolac Hardener)的 UV遮蔽率圖。 【主要元件符號說明】 無。 362MI composition UV shielding flame retardant phosphorus content peeling strength 170 gelation time glass transition temperature FIG. 1 to FIG. 8 show the phosphorus-modified flame retardant curing agent and the UV shielding performance of the comparative example produced according to the present invention. , the χ axis indicates the light, the skin length is wavelenth), and the y axis indicates the light transmittance. The light shielding effect of this wavelength band from the second to the eighth light. In the wavelength band, it is known that the closer to 1_the more the shielding effect is, the closer to (4) the shielding effect is excellent at the wavelength, but according to the present invention, the phosphorus which is produced and has excellent shielding performance is known. The UV transmittance of the modified curing agent in the KUV field at 1〇-39〇nm. 34 201144414 ΜCuring ^ Figure 1 to Figure 8 and Table 1 show that the reduction of the UV valence of the curing agent in the first to fifth embodiments of the present invention is superior to that of the comparative example Κ 2 (4) and According to Tables 2 to 3, it is known that the flame retardant curing agent composition of Examples 1 to 5 contains a Uv shielding effect and a reactive flame retardant: compared to the comparative resin composition of the Timing agent, there is a so-called It is excellent in strength and has a high glass transition temperature and excellent flame retardancy. According to the table, it is known that, in the case of the resin of the present invention, the phosphorus of the flame retardant property of the noodles resin itself has a υν shielding property, and no other epoxy resin is added in the manufacture of the machine composition. It is an epoxy resin and an epoxy resin (KDT.44G0, Guodu Chemical Co., Ltd.) having UV shielding properties, and its performance is exhibited. Specifically, from the results of Table 4, it is understood that the glass transition and the adhesion are remarkably reduced in the case where a flame-retardant epoxy resin is added. Gas [Industrial Applicability] The UV-shielding property produced by the production method of the present invention is excellent, and the modified MSI agent and the resin composition containing the same can be widely applied to a PCB substrate and insulation. A variety of composite materials, coatings, coating agents, and coatings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a graph showing the UV shielding rate of a flame retardant curing agent produced by a preferred embodiment of the present invention. Fig. 2 is a graph showing the UV shielding rate of a flame retardant curing agent produced by a preferred embodiment of the present invention. 35 201144414 Figure 3 is a graph showing the UV shielding rate of a flame retardant curing agent produced by a preferred embodiment of the present invention. Figure 4 is a graph showing the UV shielding rate of a flame retardant curing agent produced by a preferred embodiment of the present invention. Fig. 5 is a graph showing the UV shielding rate of a flame retardant curing agent produced by a preferred embodiment of the present invention. Fig. 6 is a graph showing the UV shielding rate of the flame retardant curing agent produced by Comparative Example 1. Fig. 7 is a graph showing the UV shielding rate of the flame retardant curing agent produced by Comparative Example 2. Fig. 8 is a UV shielding rate diagram of OH.E.E.W103g/eq, a solid component of 55%, and a softening point of 10 °C, Phenol NoVolac Hardener. [Main component symbol description] None. 36
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