WO2013094025A1 - Procédé de traitement par laser - Google Patents

Procédé de traitement par laser Download PDF

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Publication number
WO2013094025A1
WO2013094025A1 PCT/JP2011/079539 JP2011079539W WO2013094025A1 WO 2013094025 A1 WO2013094025 A1 WO 2013094025A1 JP 2011079539 W JP2011079539 W JP 2011079539W WO 2013094025 A1 WO2013094025 A1 WO 2013094025A1
Authority
WO
WIPO (PCT)
Prior art keywords
region
laser
shape
excavation
irradiation
Prior art date
Application number
PCT/JP2011/079539
Other languages
English (en)
Japanese (ja)
Inventor
裕 本木
俊博 森
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to KR1020137017497A priority Critical patent/KR20130086388A/ko
Priority to PCT/JP2011/079539 priority patent/WO2013094025A1/fr
Priority to JP2012525788A priority patent/JP5100917B1/ja
Publication of WO2013094025A1 publication Critical patent/WO2013094025A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Definitions

  • the present invention relates to a laser processing method for drilling a workpiece by laser light irradiation.
  • Drilling with a laser processing machine is applied to the formation of blind holes by drilling until reaching a desired depth without penetrating the workpiece.
  • a blind hole may be formed by excavation from the resin layer to the copper foil layer.
  • Copper is regarded as one of highly reflective materials that reflect laser light with high efficiency.
  • the laser light reaches the copper foil layer through excavation of the resin layer, the laser light is reflected by the copper foil layer, so that the progress of the laser processing beyond that is stopped.
  • the progress of the laser processing is stopped when the copper foil layer is exposed. In this case, a sufficient number of shots of laser light can be irradiated to perform uniform processing up to the copper foil layer.
  • Patent Document 1 proposes a technique of superimposing irradiation regions of laser light whose energy density distribution is controlled in order to suppress the occurrence of unevenness due to overlapping of laser light.
  • the laser beam When using a laser beam whose energy density is attenuated from the center of the beam cross section toward the periphery, in order to equalize the energy received on the workpiece, it is half of the width of the beam cross section.
  • the laser beam is irradiated every time the relative movement is performed at the pitch. In this case, the relative movement of the laser light is performed for the entire excavation area so that the irradiation areas overlap in two consecutive shots.
  • the laser processing machine requires a special optical system for producing laser light having a desired energy distribution.
  • a laser beam having a rectangular beam cross section that is inclined so that each side is inclined with respect to the scanning direction of the laser beam is used.
  • a part of the irradiation area corresponding to the rectangular corner portion continuously remains on the outer edge of the excavation area.
  • additional work for shaping the outer edge of the excavation area is required. If the beam cross-section is further reduced in order to allow it to be regarded as a straight line even if the rectangular corner portion remains, the number of shots required for processing is further increased.
  • the present invention has been made in view of the above, and obtains a laser processing method capable of processing an excavation region wider than the beam cross section of the laser beam by reducing unevenness and making the depth uniform and efficiently. For the purpose.
  • the present invention sequentially irradiates the excavation area of a workpiece with laser light having a small beam cross section with respect to the excavation area, thereby processing the excavation area.
  • a laser processing method wherein a laser beam forming a first irradiation region corresponding to the beam cross-section of the first shape is formed on the workpiece with a beam cross-section of a first shape.
  • the first processing step of sequentially irradiating the entire surface of the first and second beam sections smaller than the first shape, and a beam section corresponding to the second shape on the workpiece.
  • the processing steps are performed. Generation of unevenness is suppressed by setting a region other than the overlapping region in which a part of the first irradiation region is overlapped as the second irradiation region.
  • the distribution of the energy density of the laser light is arbitrary without adjustment, and the adjustment of the overlapping amount of the irradiation area of the laser light and the special optical system according to the energy distribution are not required.
  • An excavation area having a straight side as an outer edge can be obtained without additional work for shaping the outer edge of the excavation area.
  • the excavation area wider than the beam cross section of the laser beam can be processed efficiently by reducing the unevenness and making the depth uniform and efficiently.
  • FIG. 1 is a diagram showing a schematic configuration of a laser processing machine to which a laser processing method according to an embodiment of the present invention is applied.
  • FIG. 2 is a diagram for explaining the irradiation region in the first processing step and the irradiation region in the second processing step.
  • FIG. 3 is a schematic diagram for explaining the relationship between the first irradiation region and the second irradiation region and the state in which the workpiece is excavated.
  • FIG. 4 is a diagram for explaining an example of the relationship between the position of the first irradiation region and the position of the second irradiation region.
  • FIG. 5 is a diagram illustrating an example of the relationship between the position of the first irradiation region and the position of the second irradiation region.
  • FIG. 1 is a diagram showing a schematic configuration of a laser processing machine to which a laser processing method according to an embodiment of the present invention is applied.
  • the laser processing machine 100 is an apparatus that performs laser processing on the workpiece 3 by irradiating the workpiece 3 with laser light L (pulse laser light).
  • the workpiece 3 is, for example, a printed wiring board including a surface resin layer and an inner copper foil layer.
  • the laser processing machine 100 processes, for example, a surface resin layer. In the laser processing method of the present embodiment, any material may be processed as the workpiece 3.
  • the laser oscillator 1 emits a beam-shaped laser beam L.
  • the beam shaping unit 10 shapes the beam cross section of the laser light L.
  • the galvano scanner 11 rotates the galvanometer mirror 13.
  • the galvanometer mirror 13 reflects the laser light L from the beam shaping unit 10.
  • the galvanometer mirror 13 changes the traveling direction of the laser light L by rotating.
  • the galvano scanner 12 rotates the galvanometer mirror 14.
  • the galvanometer mirror 14 reflects the laser light L from the galvanometer mirror 13.
  • the galvanometer mirror 14 changes the traveling direction of the laser light L by rotating.
  • the galvanometer mirrors 13 and 14 move the irradiation region of the laser beam L in the XY directions on the workpiece 3.
  • the f ⁇ lens 15 is a condensing lens having telecentricity.
  • the f ⁇ lens 15 aligns the direction of the chief ray of the laser light L in the Z direction perpendicular to the XY plane.
  • the XY table 16 is placed on the workpiece 3 and moves in the XY plane by driving an X-axis motor and a Y-axis motor (both not shown). Thereby, the XY table 16 moves the workpiece 3 in the X direction and the Y direction.
  • the processing control device 2 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like.
  • the processing control device 2 controls the entire laser processing machine 100.
  • the machining control device 2 performs NC (Numerical Control) control of the laser oscillator 1, the galvano scanners 11 and 12, and the XY table 16 in accordance with the machining program.
  • NC Numerical Control
  • the laser beam machine 100 forms a blind hole in the workpiece 3 by performing excavation until it reaches a desired depth without penetrating the workpiece 3.
  • the laser processing machine 100 processes the excavation area by sequentially irradiating the laser beam L while moving the irradiation area in the excavation area of the workpiece 3.
  • the excavation area is an area to be excavated by the laser beam L as a whole.
  • the laser processing machine 100 processes the excavation area of the workpiece 3 through the first processing step and the second processing step.
  • the laser processing machine 100 sequentially irradiates the entire excavation region with laser light having a first-shaped beam cross section.
  • the first shape is, for example, a square.
  • the first shape is smaller than the excavation area.
  • the laser processing machine 100 applies, for example, a mask having a first shape opening as the beam shaping unit 10.
  • the laser processing machine 100 sequentially irradiates the excavation area with laser light having a second-shaped beam cross section.
  • the second shape is smaller than the excavation area and smaller than the second shape.
  • the second shape is, for example, a square.
  • the laser processing machine 100 applies, for example, a mask having a second shape opening as the beam shaping unit 10.
  • the beam shaping unit 10 may be any optical element that can change the shape of the beam cross section of the laser light L to the first shape and the second shape.
  • FIG. 2 is a diagram for explaining the irradiation region in the first processing step and the irradiation region in the second processing step.
  • FIG. 3 is a schematic diagram for explaining the relationship between the first irradiation region and the second irradiation region and the state in which the workpiece is excavated.
  • the laser processing machine 100 may perform either the first processing step or the second processing step first.
  • the laser beam L forms the first irradiation region 21 on the workpiece 3.
  • the first irradiation region 21 corresponds to a beam cross section of the first shape. Due to the transfer limit when the image of the first shape, which is the opening of the mask, is transferred onto the workpiece 3, the first irradiation region 21 has a shape with rounded corners. The first irradiation area 21 is smaller than the excavation area 24.
  • the laser processing machine 100 sequentially irradiates the entire excavation region 24 with the laser light L so as to form an overlapping region 23 in which parts of the first irradiation region 21 overlap each other. For example, the laser processing machine 100 sequentially moves the position of the laser beam L so that two first irradiation regions 21 in the X direction and two Y irradiation directions are formed with respect to the excavation region 24 having a shape close to a square.
  • a part of the first irradiation areas 21 adjacent in the X direction and a part of the first irradiation areas 21 adjacent in the Y direction constitute the overlapping area 23, respectively.
  • the overlapping region 23 has a cross shape with the center of the excavation region 24 as an intersection in the XY plane.
  • the workpiece 3 is dug deeply in the overlapping region 23 in the first irradiation region 21.
  • the intersection portion where the four first irradiation regions 21 overlap is a superposition of a rounded corner portion of each first irradiation region 21, and thus other portions of the overlapping region 23.
  • excavation is unlikely to progress greatly.
  • excavation progresses greatly in the overlapping region 23 as compared with the portion other than the overlapping region 23 in the first irradiation region 21.
  • the laser beam L forms the second irradiation region 22 on the workpiece 3.
  • the second irradiation region 22 corresponds to a beam cross section having a second shape. Similar to the first irradiation region 21, the second irradiation region 22 has a rounded corner at a square due to the transfer limit when transferring the second shape image, which is the opening of the mask, onto the workpiece 3. It becomes a shape.
  • the second irradiation area 22 is smaller than the excavation area 24 and smaller than the first irradiation area 21.
  • the laser processing machine 100 sequentially irradiates the laser light L such that the second irradiation region 22 is included in the region other than the overlapping region 23 in the excavation region 24.
  • the area other than the overlapping area 23 is divided into two in the X direction and two in the Y direction by the cross-shaped overlapping area 23.
  • the laser beam machine 100 sequentially moves the position of the laser beam L so that the second irradiation region 22 matches each of the four regions.
  • An interval corresponding to the width of the overlapping region 23 is provided between the second irradiation regions 22 adjacent in the X direction and between the second irradiation regions 22 adjacent in the Y direction.
  • the workpiece 3 is dug in a portion other than the overlapping region 23.
  • the laser processing machine 100 excavates a depth corresponding to the difference between the depth of the overlapping region 23 and the depth of the portion other than the overlapping region 23 in the first processing step.
  • the laser beam machine 100 excavates the second irradiation area 22 until it reaches the depth of the overlapping area 23.
  • the laser beam machine 100 forms a blind hole in the workpiece 3 in which the entire excavation region 24 has a uniform depth by the first and second machining steps.
  • the laser processing machine 100 uses the laser beam L having the same energy in the first processing step and the second processing step, for example.
  • the laser processing machine 100 irradiates the entire excavation region 24 with the laser light L by a total of four shots, once for each of the four regions partially overlapping each other.
  • the laser processing machine 100 irradiates the laser light L by four shots, once for each of four regions that are spaced from each other in the excavation region 24.
  • the laser processing machine 100 may irradiate each region with the laser beam L by a plurality of shots.
  • the laser processing machine 100 sets the energy of the laser beam L in the second processing step to be smaller than the energy of the laser beam L in the first processing step.
  • the laser processing machine 100 may appropriately adjust the number of shots and energy of the laser light L according to the finished state required for the blind hole obtained by the first processing step and the second processing step.
  • the laser processing method includes a first processing step in which parts of the first irradiation region 21 are overlapped with each other, and a second processing step in which the second irradiation region 22 is made to coincide with other than the overlapping region 23.
  • the laser beam L may be shaped in the beam cross section in the first processing step and the second processing step, and no special adjustment of the energy distribution is necessary.
  • the laser processing method it is possible to obtain the excavation region 24 having a straight side as the outer edge without performing additional processing for shaping the outer edge of the excavation region 24.
  • the excavation region 24 wider than the beam cross section of the laser light L can be processed efficiently by reducing the unevenness and making the depth uniform.
  • the laser processing machine 100 includes one of the first irradiation regions 21 in the first processing step and one of the second irradiation regions 22 in the second processing step. Then, the center positions are matched.
  • the laser processing machine 100 can use a common coordinate as a target on which the laser beam L is incident in the first processing step and the second processing step. Thereby, the laser beam machine 100 can facilitate control.
  • the laser processing machine 100 includes one of the first irradiation regions 21 in the first processing step and one of the second irradiation regions 22 in the second processing step.
  • a part of the outer edge of the second irradiation region 22 is made to coincide with a portion of the first irradiation region 21 that constitutes the outer edge of the excavation region 24.
  • Two sides in a direction perpendicular to each other in a substantially square formed by the first irradiation region 21 and two sides in a direction perpendicular to each other in a substantially square formed by the second irradiation region 22 are at the outer edge of the excavation region 24. Match.
  • the laser processing machine 100 matches the boundary of the region where excavation is performed in the first processing step and the boundary of the region where excavation is performed in the second processing step at the outer edge of the excavation region 24. Thereby, the laser beam machine 100 can reduce the occurrence of irregularities in the vicinity of the outer edge of the excavation region 24. Further, the laser processing machine 100 can form a tapered surface or the like on the outer edge of the excavation region 24.
  • the laser processing machine 100 determines the position of the first irradiation region 21 and the position of the second irradiation region 22 according to the shape required for the blind hole obtained by the first processing step and the second processing step. You may adjust suitably.
  • a square is adopted as the first shape and the second shape for the substantially square excavation region 24, so that the second irradiation region 22 is provided in a region other than the overlapping region 23.
  • the first shape and the second shape are not limited to a square shape, and can be appropriately modified.
  • the first shape and the second shape may be rectangular, for example.
  • the second irradiation region 22 is formed in a region other than the overlapping region 23 by adopting a rectangle as the first shape and the second shape. Can be matched. By adopting a rectangle as the first shape and the second shape, it is possible to obtain the excavation region 24 having a straight side as an outer edge.
  • the laser processing method according to the present invention is useful for processing for excavating a region larger than the beam cross section, and is suitable for, for example, drilling a printed wiring board, counterbore processing with a large diameter, and the like.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne un procédé de traitement par laser, comprenant : une première étape d'usinage dans laquelle une lumière laser, qui forme une section transversale de faisceau ayant une première forme et qui forme sur un objet devant être usiné une première zone de rayonnement (21) correspondant à la section transversale de faisceau ayant la première forme, est rayonnée de manière séquentielle sur l'intégralité d'une zone d'excavation (24) ; et une seconde étape d'usinage dans laquelle une lumière laser, qui forme une section transversale de faisceau ayant une seconde forme inférieure à la première forme et qui forme sur l'objet devant être usiné une seconde zone de rayonnement (22) correspondant à la section transversale de faisceau ayant la seconde forme, est rayonnée de manière séquentielle sur la zone d'excavation (24). Au cours de la première étape d'usinage, la lumière laser formant la première zone de rayonnement (21) est rayonnée de manière séquentielle afin de former une zone de chevauchement (23) dans laquelle des sections dans la première zone de rayonnement (21) se chevauchent les unes par rapport aux autres. Au cours de la seconde étape d'usinage, la lumière laser formant la seconde zone de rayonnement (22) est rayonnée de manière séquentielle de sorte que la seconde zone de rayonnement (22) est incluse dans une zone dans la zone d'excavation (24) autre que la zone de chevauchement (23).
PCT/JP2011/079539 2011-12-20 2011-12-20 Procédé de traitement par laser WO2013094025A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020137017497A KR20130086388A (ko) 2011-12-20 2011-12-20 레이저 가공방법
PCT/JP2011/079539 WO2013094025A1 (fr) 2011-12-20 2011-12-20 Procédé de traitement par laser
JP2012525788A JP5100917B1 (ja) 2011-12-20 2011-12-20 レーザ加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2011/079539 WO2013094025A1 (fr) 2011-12-20 2011-12-20 Procédé de traitement par laser

Publications (1)

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WO2013094025A1 true WO2013094025A1 (fr) 2013-06-27

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PCT/JP2011/079539 WO2013094025A1 (fr) 2011-12-20 2011-12-20 Procédé de traitement par laser

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KR (1) KR20130086388A (fr)
WO (1) WO2013094025A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2684635B1 (fr) * 2012-07-11 2016-06-08 SEMIKRON Elektronik GmbH & Co. KG Substrat et procédé destiné à préparer la rupture d'un substrat pour au moins un composant semi-conducteur de puissance

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102581115B1 (ko) * 2021-10-20 2023-09-21 주식회사 휴비스 에나멜선 탈피를 위한 레이저 가공 헤드

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000263263A (ja) * 1999-03-12 2000-09-26 Sumitomo Heavy Ind Ltd レーザ穴あけ加工方法及び加工装置
JP2004314154A (ja) * 2003-04-18 2004-11-11 Murata Mfg Co Ltd レーザスキャニング加工方法
JP2007090438A (ja) * 2007-01-11 2007-04-12 Sumitomo Heavy Ind Ltd レーザ加工方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000263263A (ja) * 1999-03-12 2000-09-26 Sumitomo Heavy Ind Ltd レーザ穴あけ加工方法及び加工装置
JP2004314154A (ja) * 2003-04-18 2004-11-11 Murata Mfg Co Ltd レーザスキャニング加工方法
JP2007090438A (ja) * 2007-01-11 2007-04-12 Sumitomo Heavy Ind Ltd レーザ加工方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2684635B1 (fr) * 2012-07-11 2016-06-08 SEMIKRON Elektronik GmbH & Co. KG Substrat et procédé destiné à préparer la rupture d'un substrat pour au moins un composant semi-conducteur de puissance

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JP5100917B1 (ja) 2012-12-19
JPWO2013094025A1 (ja) 2015-04-27
KR20130086388A (ko) 2013-08-01

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