WO2013069100A1 - Appareil pour inspecter une carte imprimée - Google Patents

Appareil pour inspecter une carte imprimée Download PDF

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Publication number
WO2013069100A1
WO2013069100A1 PCT/JP2011/075768 JP2011075768W WO2013069100A1 WO 2013069100 A1 WO2013069100 A1 WO 2013069100A1 JP 2011075768 W JP2011075768 W JP 2011075768W WO 2013069100 A1 WO2013069100 A1 WO 2013069100A1
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WO
WIPO (PCT)
Prior art keywords
light source
color light
resist
image
circuit board
Prior art date
Application number
PCT/JP2011/075768
Other languages
English (en)
Japanese (ja)
Inventor
昌年 笹井
Original Assignee
株式会社メガトレード
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社メガトレード filed Critical 株式会社メガトレード
Priority to PCT/JP2011/075768 priority Critical patent/WO2013069100A1/fr
Priority to KR1020127025525A priority patent/KR20130077813A/ko
Priority to JP2013542740A priority patent/JP5854531B2/ja
Priority to CN2011800230489A priority patent/CN102959385A/zh
Publication of WO2013069100A1 publication Critical patent/WO2013069100A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/062—LED's
    • G01N2201/0627—Use of several LED's for spectral resolution

Definitions

  • the present invention relates to a printed circuit board inspection apparatus that can accurately inspect pads, resists, and the like formed on the surface of a printed circuit board.
  • images of pads, resists, and the like formed on the surface of a printed circuit board are acquired by a camera and automatically inspected based on the images.
  • pads and resists have their own colors and reflectances, it is preferable to inspect them by irradiating light according to their characteristics.
  • an object of the present invention is to provide a printed circuit board inspection apparatus capable of performing a high-precision inspection by irradiating light according to characteristics of a pad, a resist, or the like.
  • the present invention provides a printed circuit board inspection apparatus for inspecting the formation state of pads and resist formed on a printed circuit board at a first angle that provides bright field illumination with respect to the camera.
  • a first inspection means for taking an image of a printed circuit board with a camera using light from a light source to a third color light source, and inspecting the pad surface for scratches using the image of the first color light source; and the diffuse illumination A second inspection unit that inspects the formation state of the pad contour using the image of the second color light source, and a third inspection unit that inspects the formation state of the resist using the image of the third color light source. It is a thing.
  • the third color light source is provided in a direction that makes an acute angle with respect to the optical axis of the camera provided in an oblique direction with respect to the normal line of the printed circuit board.
  • the first color light source is a red LED light source
  • the second color light source is a green light source or a blue light source
  • the third color light source is a blue LED light source or a green LED light source having a different color from the second color light source.
  • a metal surface such as a pad has a high red wavelength reflectance, so images such as scratches and dents can be obtained, and a color close to green or blue like a resist. For, surface images can be accurately acquired with green or blue dark field illumination.
  • the pattern area is inspected also using the image of the second color light source.
  • the resist portion that could not be inspected with the light sources of the respective colors can be inspected with the light sources of other colors.
  • a region on the base material and the region below the resist are separated using a predetermined brightness threshold, and the region below the resist is expanded, The application state of the resist on the substrate is inspected.
  • the resist region on the base material and the region under the resist pattern are separated using a predetermined luminance threshold, and the region under the resist pattern is inspected for disconnection or short circuit.
  • the first color light source disposed at a first angle that provides bright field illumination with respect to the camera;
  • a second color light source that is a diffused illumination by a fluorescent lamp, and a third color light source arranged at a third angle that is dark field illumination with respect to the camera, from the first color light source to the third color light source
  • a first inspection means for taking an image of a printed circuit board with a camera using the light of the first light, and inspecting the presence or absence of a scratch on the pad surface using the image of the first color light source, and a second color light source that is the diffuse illumination. Since the second inspection means for inspecting the formation state of the pad contour using the image and the third inspection means for inspecting the formation state of the resist using the image of the third color light source are provided. Optimal inspection according to the characteristics of the area So that it is able to.
  • positioning of the illuminating device and camera of the automatic inspection apparatus which shows one embodiment of this invention
  • positioning state of LED of the 1st color light source in the form The figure which shows the image of the pad acquired using each color light source in the form
  • the figure which shows the image of the resist acquired using each color light source in the form The figure which shows the image of the pattern under a resist acquired using each color light source in the same form
  • the inspection apparatus 1 for a printed circuit board 7 in this embodiment includes an illuminating device 2 that irradiates light onto the printed circuit board 7 placed on a stage, and the light from the illuminating apparatus 2 that is reflected by the printed circuit board 7.
  • the camera 6 that receives the reflected light and the first inspection means 81 to the third inspection means that inspect the formation state of the pads 71 and the resist 72 formed on the surface of the printed circuit board 7 from the image acquired by the camera 6. 83 (see FIG. 6).
  • the illuminating device 2 is provided with a first LED 32 having a red LED 32 arranged at a first angle that is specularly reflected with respect to the optical axis of the camera 6 (that is, an angle that provides bright field illumination).
  • the second color light source 4 which is a green fluorescent lamp arranged at an angle different from the first angle, and the blue LED arranged in an acute angle direction with respect to the optical axis of the camera 6.
  • the surface of the pad 71 is inspected for scratches 71b, dents 71c and the like by the image of the first color light source 3 of the red LED 32, and the contour 71a of the pad 71 by the green diffuse illumination.
  • the formation state of the resist 72 can be inspected by dark field illumination with a blue LED.
  • the inspection apparatus 1 in the present embodiment will be described in detail.
  • the printed circuit board 7 to be inspected is placed on a stage using a transport means (not shown), and transported to the lower part of the illumination device 2 and the camera 6 in that state. Then, light of each color is simultaneously emitted from the lighting device 2, and light reflected by the printed circuit board 7 is acquired by the camera 6.
  • the camera 6 for acquiring an image a color camera or the like that is separated into a plurality of wavelengths such as RGB by a color filter and receives each light by a CCD element and converts it into an electrical signal is used. .
  • the illuminating device 2 includes a first color light source 3 composed of a red LED 32, a second color light source 4 composed of a fluorescent lamp which is a green diffuse illumination, and a third color light source 5 composed of a blue LED. And is configured.
  • the red LEDs 32 which are the first color light sources 3 are arranged in a plurality of rows (two rows in FIG. 2) along the longitudinal direction of the elongated substrate 31 as shown in FIG.
  • the angles of the optical axes of the red LEDs 32 are crossed. That is, the red LED 32 in the first row is attached so that the optical axis is inclined toward one end along the longitudinal direction of the substrate, and the longitudinal direction of the substrate is in the second row of red LEDs 32. Is attached so that the optical axis is inclined toward the other end side.
  • the red light emitted from the first color light source 3 is strongly reflected by the exposed copper or gold pad 71 of the printed circuit board 7, and various kinds of light are emitted from the intersecting red LEDs 32. It is possible to cause the camera 6 to receive light in a state in which the contrast of the direction scratch 71b and the dent 71c is increased. Note that when the reflected light, which is such bright field illumination, is received by the camera 6, the light is strongly reflected by the contour 71a of the pad 71 (FIG. 3A), and the variation in luminance becomes large and clear. An outline image cannot be acquired. Also, regarding the discoloration of the pad 71, since the variation in surface luminance is large, an image suitable for inspection cannot be acquired. For this reason, the light from the first color light source 3 is used as illumination for inspecting fine scratches 71b and dents 71c of the pad 71.
  • the second color light source 4 which is a green fluorescent lamp is provided at a different angle from the red LED 32 which is bright field illumination.
  • the second color light source 4 is attached so as to be inclined toward the red LED 32 with respect to the normal line of the printed circuit board 7, so that the surface of the pad 71 is brightened.
  • an umbrella 41 is provided on the side opposite to the printed circuit board 7 so as to diffuse light over a wider range than the first light source, so that the light from the fluorescent lamp is diffused over a wide range. ing.
  • a diffusion plate may be provided in front of the second color light source 4 to diffuse the light. Then, by irradiating the printed board 7 with such green diffused light, an image with a clear outline 71a of the exposed pad 71 can be acquired as shown in FIG. 3B. That is, when diffuse illumination is used, the small scratches 71b and dents 71c on the pad surface are difficult to see, but the contour 71a of the pad 71 has little variation in light, so that a clear image can be acquired. it can. Moreover, since the S / N ratio is also high for the discoloration of the pad 71, an image that is favorable for inspection can be acquired.
  • green diffused light is used as illumination for detecting the contour 71a of the pad 71 as a first purpose.
  • green light is used as the second color light source 4
  • red light when red light is used, the reflectance of the exposed pad 71 becomes high, and light is emitted from the contour 71 a of the pad 71. This is because it is difficult to extract the contour 71a image due to large reflection.
  • green light is used as the second color light source 4
  • the reflectance at the pad 71 is reduced, so that the image of the contour 71a of the pad 71 can be clearly extracted and the resist 72 is green.
  • blue or blue since the reflectance can be increased with green light, an image suitable for the inspection of the resist 72 can be acquired.
  • the fluorescent lamp is used as the diffuse illumination.
  • the fluorescent lamp since the red and blue wavelengths are included in addition to the green wavelength, even when the resist 72 is reddish brown or blue, This is to cope with this.
  • a green fluorescent lamp is used.
  • a blue fluorescent lamp is used corresponding to the color of the resist 72. You may do it.
  • the blue fluorescent lamp has weaker light in the red wavelength range than the green fluorescent lamp, it is better to use the green fluorescent lamp when inspecting the reddish resist 72.
  • the blue LED as the third color light source 5 has an acute angle with respect to the optical axis of the camera 6 arranged in an oblique direction (that is, in the normal direction of the printed circuit board 7). On the other hand, it is provided on the camera 6 side). Then, by irradiating blue light from the third color light source 5 as dark field illumination, it is possible to acquire irregularly reflected light of a rough portion formed on the surface of the printed circuit board 7.
  • examples of the rough portion include a pooled portion or a thin portion of the resist 72, or a missing portion of the resist 72 or uneven printing of silk.
  • the pad 71 when the pad 71 is irradiated with light by dark field illumination, most of the light is regularly reflected on the surface of the pad 71, and a clear image such as a scratch 71b or a dent 71c on the pad surface can be acquired. It will disappear. For this reason, the dark field illumination from the blue LED is used as illumination when the formation state of the resist 72 is inspected.
  • blue LED when blue diffused illumination is used as the 2nd color light source 4, green LED different from this is used.
  • the light from the first color light source 3 to the third color light source 5 is simultaneously irradiated onto the printed circuit board 7 and the reflected light is acquired by the camera 6.
  • the camera 6 acquires this image, it is separated into wavelengths in the RGB region by a color filter that is a separation means, and is stored in the storage means 80 as a different image by each CCD element.
  • FIG. 6 which is a functional block diagram
  • an exposed area of the pad 71 is extracted based on an image acquired by green diffuse illumination, and the area is contracted.
  • inspection is performed with bright field illumination from the red LED 32 that is the first color light source 3.
  • an image within a predetermined luminance range corresponding to the luminance value of the pad 71 is extracted, and the image is contracted by several pixels.
  • an image of the contraction region is extracted from the image of the red LED 32, and a luminance value histogram for each RGB in the region is generated (FIG. 7a).
  • the quality of the pad 71 is determined based on the number of pixels having a luminance value lower than the first threshold value a1 and the number of pixels having a luminance value higher than the second threshold value a2.
  • the part having the luminance value may be determined as the scratch 71b or the dent 71c, and the quality may be determined according to the length or area.
  • the first inspection means 81 inspects the discoloration of the pad surface in addition to the scratch 71b and the dent 71c of the pad 71.
  • an image within a predetermined luminance width corresponding to the luminance value of the pad 71 is extracted based on an image by green diffuse illumination, and the image is contracted by several pixels.
  • a luminance value histogram for each RGB is generated from the image of the contracted area obtained by the green diffuse illumination, and it is determined how many pixels having luminance values other than the predetermined RGB luminance value exist. .
  • the second inspection means 82 inspects the formation state of the contour 71 a of the pad 71.
  • an image within a predetermined luminance width corresponding to the luminance value of the pad 71 is extracted based on the image by the green diffuse illumination as in the first inspection unit 81.
  • contraction and expansion processing is performed on the extracted area of the pad 71, and the contraction area of the pad 71 as shown in the upper diagram of FIG.
  • a luminance histogram is generated with the outer normal direction of the axis as an axis.
  • what was shown with the thick continuous line in the upper figure of FIG. 8 has shown the outline 71a of the pad 71.
  • the quality of the contour 71a is determined based on how far the inflection point of the luminance histogram in the pixel along the radial direction from the contracted portion of the contour 71a is away from the position of the inflection point of the luminance histogram in the reference data. . That is, if the inflection point of the histogram is a predetermined value or more away from the position of the inflection point of the reference data, it is determined that there is a protrusion or a chip and that it is defective.
  • the third inspection unit 83 inspects the resist 72.
  • the region of the resist 72 on the pattern and the region of the resist 72 on the base material are separated, and each region is separated. Inspect based on blue image.
  • an image having a luminance width corresponding to the on-pattern resist 72 is extracted from the obtained blue image and also corresponds to the on-substrate resist 72. Extract an image with luminance width.
  • the wavelength is relatively short, so that the refractive index at the resist 72 increases, and light enters in a direction substantially perpendicular to the inside. Then, the vertical light is reflected in the pattern in a substantially vertical direction, and the light is refracted in the direction of the camera, so that a bright image with a larger amount of light can be acquired. Then, based on the image of the on-pattern resist 72 by the blue light, the disconnection 74 or short of the pattern 73 under the resist is inspected.
  • cluster processing is performed to collect regions having substantially the same luminance in the inspection region, and the number of cluster regions in the inspection region is compared with the number of cluster regions in the reference image. Do. At this time, if the disconnection 74 occurs in the inspection area, as shown in FIG. 9, the number of cluster areas (area “1” in FIG. 9) corresponding to the brightness of the pattern 73 under the resist is the reference image. Therefore, it can be determined that the disconnection 74 has occurred. On the other hand, when the inspection area is short-circuited, the cluster area corresponding to the brightness of the resist 72 on the base material is divided, so that the cluster area of the resist color on the base material ("0" area in FIG. 9) is present.
  • the presence or absence of the disconnection 74 or the short circuit is determined by the cluster processing, but the disconnection 74 or the short circuit may be determined by other methods.
  • the extracted resist lower pattern 73 is expanded, and the resist 72 region excluding the vicinity of the boundary of the pattern 73 is inspected.
  • the reason why the vicinity of the boundary of the pattern 73 is excluded is that the application state of the resist 72 becomes unstable at the boundary portion of the pattern 73.
  • the resist 72 is irradiated with light by dark field illumination by a blue LED. Therefore, if there is a pool of ink, the reflected light from that portion is received.
  • ink loss or the like reflected light from the boundary portion can be received. Therefore, it is determined that there is an ink pool or a chip based on the number of pixels having a predetermined luminance or higher due to the reflected light, and it is determined that the ink is defective according to the size.
  • the third inspection unit 83 can inspect the formation state of the resist 72 by the green diffuse illumination that is the second color light source 4.
  • the green image that is the second color light source 4 the entire resist 72 is inspected without separating the pattern 73 portion.
  • the green image is diffuse illumination, it is possible to obtain an image mainly due to reflection due to the surface roughness without being influenced by some unevenness of the surface. It is possible to acquire an image that is not easily affected by the unevenness near the contour 71a.
  • the stage is moved to the lower side of the illumination device 2, and the light from the first color light source 3 to the third color light source 5 is simultaneously irradiated (step S1).
  • the reflected light is separated into a plurality of wavelengths such as RGB by a color filter, and each is received by the CCD element of the camera 6 (step S2), and the image of the first color light source 3 and the image of the second color light source 4 are received.
  • the image is stored in the storage unit 80 as an image of the third color light source 5.
  • an image corresponding to the luminance width of the pad 71 is extracted based on the image of the second color light source 4 (that is, an image obtained by green diffuse illumination) (step S3), and the image is contracted and the pad 71 is subjected to contraction processing. Is extracted (step S4). Then, a luminance value histogram is generated for the inner region of the pad 71 in the image of the first color light source 3 (that is, the image of the red LED 32) (step S5), and the first in order to inspect scratches and dents (step S6).
  • a predetermined number of pixels having a luminance lower than the threshold value a1 it is determined to be defective, and when a predetermined number of pixels having a luminance higher than the second threshold value a2 is determined to be defective.
  • a luminance value histogram is generated from the image of the contracted area obtained by the green diffuse illumination (step S7), and how many pixels have luminance values other than the predetermined RGB luminance values. Determine whether. At this time, if there are a predetermined number or more of pixels other than the predetermined luminance value, it is determined that the region is a discolored region and is defective (step S8).
  • an image within a predetermined luminance width corresponding to the luminance value of the pad 71 is extracted based on the image by the green diffuse illumination (step S4). Then, the extracted area of the pad 71 is contracted and expanded to extract a ring-shaped green image area surrounded by the contracted area and the enlarged area (step S9). A luminance histogram having the radial direction as an axis is generated from the contraction region of the pad 71 as shown (step S10). Then, the quality of the contour 71a is determined based on whether or not the inflection point in the histogram is within a predetermined range of the position of the inflection point in the histogram in the reference data (step S11).
  • step S12 in order to inspect the formation state of the resist 72, the resist pattern, etc., based on the dark field illumination image of the blue LED which is the third color light source 5, the region of the resist 72 on the pattern and the substrate The regions of the resist 72 are separated (step S12), and each region is inspected based on the blue image.
  • cluster processing is performed to collect regions having substantially the same luminance in the inspection region (step S13).
  • the presence or absence of disconnection 74 or a short circuit is determined by comparing the number of cluster areas in the inspection area with the number of cluster areas in the reference image (step S14).
  • step S15 When the application state of the resist 72 on the substrate is inspected, the extracted resist lower pattern 73 is expanded to extract the resist 72 area excluding the vicinity of the boundary of the pattern 73 (step S15).
  • step S16 pixels having a predetermined luminance or more are counted, and according to the number of pixels, it is determined that there is an ink pool or chipping (step S16).
  • the entire resist 72 is inspected (step S17). Also in the inspection by the green diffuse illumination, the number of pixels in the high luminance portion generated by the rough surface portion is counted, and the ink accumulation or chipping, the presence of foreign matter, etc. are determined according to the number.
  • the first bright light illumination is applied to the camera 6.
  • the first color light source 3 arranged at an angle of the second color light source 4, the second color light source 4, which is diffused illumination by a fluorescent lamp, and the third color light source 5 arranged at a third angle serving as dark field illumination with respect to the camera 6.
  • the image of the printed circuit board 7 is taken by the camera 6 using light from the first color light source 3 to the third color light source 5, and the scratches 71b on the pad surface using the image of the first color light source 3
  • First inspection means 81 for inspecting the presence or absence of light second inspection means 82 for inspecting the formation state of the pad 71 outline 71a using the image of the second color light source 4 as the diffuse illumination, and the third color light source 5 Inspection of resist 72 formation using images of Since that was so and a third inspection unit 83, it is possible to perform optimum inspection in accordance with the characteristics of each inspection area.
  • the third color light source 5 is provided in an acute angle with the camera 6 provided in an oblique direction with respect to the printed circuit board 7, light with extremely small surface roughness such as a pad 71 is obtained.
  • irregularly reflected light from the pool of the resist 72 having an extremely large surface roughness can be acquired, and the formation state of the resist 72 can be effectively inspected.
  • the first color light source 3 is a red LED 32 light source
  • the second color light source 4 is a green light source or a blue light source
  • the third color light source 5 is a blue LED light source or green LED of a color different from the second color light source 4. Since the light source is used, it is possible to accurately acquire images such as scratches 71b and dents 71c on the pad 71, and for green and blue colors such as the resist 72, green and blue dark fields. A surface image can be accurately obtained by illumination.
  • the pattern 73 area is inspected using the image of the second color light source 4 as well, so that it cannot be inspected with the light sources of the respective colors.
  • the resist 72 can be inspected with a light source of another color.
  • the red LED 32 is crossed and provided as the first color light source 3, but a lens or the like may be provided in front of the light source to realize substantially parallel light.
  • a green fluorescent lamp is used as the second color light source 4, but a diffuser plate may be attached to the green LED to realize diffused light.
  • blue LED was provided as the 3rd color light source 5, it can also be implement
  • red means a wavelength within a predetermined width based on red (first wavelength)
  • green means a wavelength within a predetermined width based on green (second wavelength)
  • Blue means a wavelength within a predetermined width based on blue (third wavelength).
  • the RGB light is irradiated onto the printed circuit board 7 at the same time, but it is also possible to individually irradiate the light for each RGB and acquire the images individually.
  • the first inspection means 81 in the above embodiment inspects the scratches 71b and dents 71c and discoloration of the pad 71
  • the second inspection means 82 inspects the contour 71a of the pad 71
  • the third inspection means 83 in resist The application state of 72 and the formation state of the pattern 73 under the resist 72 are inspected.
  • these individual inspection methods may be inspected by an algorithm other than the method shown in the above embodiment. .

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  • Life Sciences & Earth Sciences (AREA)
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Abstract

L'invention vise à effectuer une inspection précise par rayonnement d'une lumière correspondant à des caractéristiques d'une plage d'accueil et d'une réserve. A cet effet, l'invention porte sur un appareil d'inspection (1) d'une carte imprimée (7), lequel appareil comporte : une diode électroluminescente rouge (32) qui est disposée selon un premier angle tel que la diode électroluminescente rouge est un appareil d'éclairage de champ lumineux par rapport à une caméra (6) ; une deuxième source de lumière de couleur (4), à savoir un appareil d'éclairage diffus utilisant une lampe fluorescente verte ; et une troisième source de lumière (5), qui est disposée selon un troisième angle tel que la troisième source de lumière de couleur est un appareil d'éclairage de champ sombre par rapport à la caméra (6), et qui est constituée par une diode électroluminescente bleue. Une image de la carte imprimée (7) est photographiée à l'aide de la caméra (6) en utilisant une lumière émise à partir des sources de lumière, à partir de la première source de lumière (3) jusqu'à la troisième source de lumière (5), et des rayures (71b) et une marque d'impact (71c) sur une surface de plage d'accueil et le fait que la surface de plage d'accueil a ou non un changement de couleur sont inspectées à l'aide d'une image obtenue à l'aide d'une lumière émise à partir de la diode électroluminescente rouge (32), à savoir l'appareil d'éclairage de champ lumineux. De plus, un état de formation d'un profil (71a) d'une plage d'accueil (71) est inspecté à l'aide d'une image obtenue à l'aide d'une lumière émise à partir de la lampe fluorescente, à savoir l'appareil d'éclairage diffus vert. De plus, une accumulation et un écaillage de la réserve (72), et une déconnexion et un court-circuit d'un motif inférieur de réserve sont inspectés à l'aide d'une image obtenue à partir de la troisième source de lumière (5), à savoir la diode électroluminescente (2).
PCT/JP2011/075768 2011-11-08 2011-11-08 Appareil pour inspecter une carte imprimée WO2013069100A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/JP2011/075768 WO2013069100A1 (fr) 2011-11-08 2011-11-08 Appareil pour inspecter une carte imprimée
KR1020127025525A KR20130077813A (ko) 2011-11-08 2011-11-08 프린트 기판의 검사 장치
JP2013542740A JP5854531B2 (ja) 2011-11-08 2011-11-08 プリント基板の検査装置
CN2011800230489A CN102959385A (zh) 2011-11-08 2011-11-08 印刷电路板的检查装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2011/075768 WO2013069100A1 (fr) 2011-11-08 2011-11-08 Appareil pour inspecter une carte imprimée

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WO2013069100A1 true WO2013069100A1 (fr) 2013-05-16

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JP (1) JP5854531B2 (fr)
KR (1) KR20130077813A (fr)
CN (1) CN102959385A (fr)
WO (1) WO2013069100A1 (fr)

Cited By (2)

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CN111982929A (zh) * 2020-08-14 2020-11-24 加藤义晴 一种电子部件检测设备及电子部件检测方法
WO2023162934A1 (fr) * 2022-02-28 2023-08-31 株式会社レゾナック Procédé d'inspection de motif, procédé de fabrication de motif de réserve, procédé de sélection de substrat cible et procédé de fabrication de substrat cible

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI495867B (zh) * 2014-07-22 2015-08-11 Machvision Inc Application of repeated exposure to multiple exposure image blending detection method
KR20190088302A (ko) 2018-01-18 2019-07-26 재단법인한국조선해양기자재연구원 자동차 타이어 모니터링 장치
CN108827181B (zh) * 2018-03-14 2021-04-09 浙江大学山东工业技术研究院 一种基于视觉的板材表面检测方法
CN108956462A (zh) * 2018-05-15 2018-12-07 武汉科技大学 一种彩色相机rgb图像融合视觉检测系统及检测方法
CN108896566A (zh) * 2018-07-27 2018-11-27 佛山市坦斯盯科技有限公司 一种aoi相机及光源模组
CN108760769A (zh) * 2018-08-02 2018-11-06 佛山市坦斯盯科技有限公司 一种用于线路板的cis检测装置
CN108801921A (zh) * 2018-08-02 2018-11-13 佛山市坦斯盯科技有限公司 一种用于线路板的cis相机和光源模组
JPWO2020170712A1 (ja) * 2019-02-22 2021-12-16 株式会社棚澤八光社 配線板
CN116978806A (zh) 2019-03-28 2023-10-31 浜松光子学株式会社 检查装置及检查方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04113259A (ja) * 1989-12-21 1992-04-14 American Teleph & Telegr Co <Att> 鏡面状の三次元形状を有する突出部の検査方法とその装置
JPH04311053A (ja) * 1991-04-10 1992-11-02 Nec Corp 欠陥判定器
JPH06222013A (ja) * 1992-09-11 1994-08-12 Hologenix Inc 表面の光学的検査装置
JPH1137719A (ja) * 1997-07-15 1999-02-12 Fujitsu Ltd 検査装置
JP2002529907A (ja) * 1998-11-05 2002-09-10 サイバーオプティクス コーポレーション 改良された画像形成システムを備えた電子回路組立装置
JP2007192597A (ja) * 2006-01-17 2007-08-02 Saki Corp:Kk 被検査体の検査装置
JP2010217169A (ja) * 2009-03-12 2010-09-30 Ajuhitek Inc 印刷回路基板の外観検査システム及びその方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4826750B2 (ja) * 2005-04-08 2011-11-30 オムロン株式会社 欠陥検査方法およびその方法を用いた欠陥検査装置
JP4389982B2 (ja) * 2007-08-09 2009-12-24 オムロン株式会社 基板外観検査装置
JP4719284B2 (ja) * 2008-10-10 2011-07-06 トヨタ自動車株式会社 表面検査装置
JP2011099726A (ja) * 2009-11-05 2011-05-19 Fujitsu Ltd 表面欠陥検査装置及び表面欠陥検査方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04113259A (ja) * 1989-12-21 1992-04-14 American Teleph & Telegr Co <Att> 鏡面状の三次元形状を有する突出部の検査方法とその装置
JPH04311053A (ja) * 1991-04-10 1992-11-02 Nec Corp 欠陥判定器
JPH06222013A (ja) * 1992-09-11 1994-08-12 Hologenix Inc 表面の光学的検査装置
JPH1137719A (ja) * 1997-07-15 1999-02-12 Fujitsu Ltd 検査装置
JP2002529907A (ja) * 1998-11-05 2002-09-10 サイバーオプティクス コーポレーション 改良された画像形成システムを備えた電子回路組立装置
JP2007192597A (ja) * 2006-01-17 2007-08-02 Saki Corp:Kk 被検査体の検査装置
JP2010217169A (ja) * 2009-03-12 2010-09-30 Ajuhitek Inc 印刷回路基板の外観検査システム及びその方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111982929A (zh) * 2020-08-14 2020-11-24 加藤义晴 一种电子部件检测设备及电子部件检测方法
WO2023162934A1 (fr) * 2022-02-28 2023-08-31 株式会社レゾナック Procédé d'inspection de motif, procédé de fabrication de motif de réserve, procédé de sélection de substrat cible et procédé de fabrication de substrat cible

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