WO2013069100A1 - Apparatus for inspecting printed board - Google Patents

Apparatus for inspecting printed board Download PDF

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Publication number
WO2013069100A1
WO2013069100A1 PCT/JP2011/075768 JP2011075768W WO2013069100A1 WO 2013069100 A1 WO2013069100 A1 WO 2013069100A1 JP 2011075768 W JP2011075768 W JP 2011075768W WO 2013069100 A1 WO2013069100 A1 WO 2013069100A1
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WO
WIPO (PCT)
Prior art keywords
light source
color light
resist
image
circuit board
Prior art date
Application number
PCT/JP2011/075768
Other languages
French (fr)
Japanese (ja)
Inventor
昌年 笹井
Original Assignee
株式会社メガトレード
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社メガトレード filed Critical 株式会社メガトレード
Priority to JP2013542740A priority Critical patent/JP5854531B2/en
Priority to KR1020127025525A priority patent/KR20130077813A/en
Priority to PCT/JP2011/075768 priority patent/WO2013069100A1/en
Priority to CN2011800230489A priority patent/CN102959385A/en
Publication of WO2013069100A1 publication Critical patent/WO2013069100A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/062—LED's
    • G01N2201/0627—Use of several LED's for spectral resolution

Definitions

  • the present invention relates to a printed circuit board inspection apparatus that can accurately inspect pads, resists, and the like formed on the surface of a printed circuit board.
  • images of pads, resists, and the like formed on the surface of a printed circuit board are acquired by a camera and automatically inspected based on the images.
  • pads and resists have their own colors and reflectances, it is preferable to inspect them by irradiating light according to their characteristics.
  • an object of the present invention is to provide a printed circuit board inspection apparatus capable of performing a high-precision inspection by irradiating light according to characteristics of a pad, a resist, or the like.
  • the present invention provides a printed circuit board inspection apparatus for inspecting the formation state of pads and resist formed on a printed circuit board at a first angle that provides bright field illumination with respect to the camera.
  • a first inspection means for taking an image of a printed circuit board with a camera using light from a light source to a third color light source, and inspecting the pad surface for scratches using the image of the first color light source; and the diffuse illumination A second inspection unit that inspects the formation state of the pad contour using the image of the second color light source, and a third inspection unit that inspects the formation state of the resist using the image of the third color light source. It is a thing.
  • the third color light source is provided in a direction that makes an acute angle with respect to the optical axis of the camera provided in an oblique direction with respect to the normal line of the printed circuit board.
  • the first color light source is a red LED light source
  • the second color light source is a green light source or a blue light source
  • the third color light source is a blue LED light source or a green LED light source having a different color from the second color light source.
  • a metal surface such as a pad has a high red wavelength reflectance, so images such as scratches and dents can be obtained, and a color close to green or blue like a resist. For, surface images can be accurately acquired with green or blue dark field illumination.
  • the pattern area is inspected also using the image of the second color light source.
  • the resist portion that could not be inspected with the light sources of the respective colors can be inspected with the light sources of other colors.
  • a region on the base material and the region below the resist are separated using a predetermined brightness threshold, and the region below the resist is expanded, The application state of the resist on the substrate is inspected.
  • the resist region on the base material and the region under the resist pattern are separated using a predetermined luminance threshold, and the region under the resist pattern is inspected for disconnection or short circuit.
  • the first color light source disposed at a first angle that provides bright field illumination with respect to the camera;
  • a second color light source that is a diffused illumination by a fluorescent lamp, and a third color light source arranged at a third angle that is dark field illumination with respect to the camera, from the first color light source to the third color light source
  • a first inspection means for taking an image of a printed circuit board with a camera using the light of the first light, and inspecting the presence or absence of a scratch on the pad surface using the image of the first color light source, and a second color light source that is the diffuse illumination. Since the second inspection means for inspecting the formation state of the pad contour using the image and the third inspection means for inspecting the formation state of the resist using the image of the third color light source are provided. Optimal inspection according to the characteristics of the area So that it is able to.
  • positioning of the illuminating device and camera of the automatic inspection apparatus which shows one embodiment of this invention
  • positioning state of LED of the 1st color light source in the form The figure which shows the image of the pad acquired using each color light source in the form
  • the figure which shows the image of the resist acquired using each color light source in the form The figure which shows the image of the pattern under a resist acquired using each color light source in the same form
  • the inspection apparatus 1 for a printed circuit board 7 in this embodiment includes an illuminating device 2 that irradiates light onto the printed circuit board 7 placed on a stage, and the light from the illuminating apparatus 2 that is reflected by the printed circuit board 7.
  • the camera 6 that receives the reflected light and the first inspection means 81 to the third inspection means that inspect the formation state of the pads 71 and the resist 72 formed on the surface of the printed circuit board 7 from the image acquired by the camera 6. 83 (see FIG. 6).
  • the illuminating device 2 is provided with a first LED 32 having a red LED 32 arranged at a first angle that is specularly reflected with respect to the optical axis of the camera 6 (that is, an angle that provides bright field illumination).
  • the second color light source 4 which is a green fluorescent lamp arranged at an angle different from the first angle, and the blue LED arranged in an acute angle direction with respect to the optical axis of the camera 6.
  • the surface of the pad 71 is inspected for scratches 71b, dents 71c and the like by the image of the first color light source 3 of the red LED 32, and the contour 71a of the pad 71 by the green diffuse illumination.
  • the formation state of the resist 72 can be inspected by dark field illumination with a blue LED.
  • the inspection apparatus 1 in the present embodiment will be described in detail.
  • the printed circuit board 7 to be inspected is placed on a stage using a transport means (not shown), and transported to the lower part of the illumination device 2 and the camera 6 in that state. Then, light of each color is simultaneously emitted from the lighting device 2, and light reflected by the printed circuit board 7 is acquired by the camera 6.
  • the camera 6 for acquiring an image a color camera or the like that is separated into a plurality of wavelengths such as RGB by a color filter and receives each light by a CCD element and converts it into an electrical signal is used. .
  • the illuminating device 2 includes a first color light source 3 composed of a red LED 32, a second color light source 4 composed of a fluorescent lamp which is a green diffuse illumination, and a third color light source 5 composed of a blue LED. And is configured.
  • the red LEDs 32 which are the first color light sources 3 are arranged in a plurality of rows (two rows in FIG. 2) along the longitudinal direction of the elongated substrate 31 as shown in FIG.
  • the angles of the optical axes of the red LEDs 32 are crossed. That is, the red LED 32 in the first row is attached so that the optical axis is inclined toward one end along the longitudinal direction of the substrate, and the longitudinal direction of the substrate is in the second row of red LEDs 32. Is attached so that the optical axis is inclined toward the other end side.
  • the red light emitted from the first color light source 3 is strongly reflected by the exposed copper or gold pad 71 of the printed circuit board 7, and various kinds of light are emitted from the intersecting red LEDs 32. It is possible to cause the camera 6 to receive light in a state in which the contrast of the direction scratch 71b and the dent 71c is increased. Note that when the reflected light, which is such bright field illumination, is received by the camera 6, the light is strongly reflected by the contour 71a of the pad 71 (FIG. 3A), and the variation in luminance becomes large and clear. An outline image cannot be acquired. Also, regarding the discoloration of the pad 71, since the variation in surface luminance is large, an image suitable for inspection cannot be acquired. For this reason, the light from the first color light source 3 is used as illumination for inspecting fine scratches 71b and dents 71c of the pad 71.
  • the second color light source 4 which is a green fluorescent lamp is provided at a different angle from the red LED 32 which is bright field illumination.
  • the second color light source 4 is attached so as to be inclined toward the red LED 32 with respect to the normal line of the printed circuit board 7, so that the surface of the pad 71 is brightened.
  • an umbrella 41 is provided on the side opposite to the printed circuit board 7 so as to diffuse light over a wider range than the first light source, so that the light from the fluorescent lamp is diffused over a wide range. ing.
  • a diffusion plate may be provided in front of the second color light source 4 to diffuse the light. Then, by irradiating the printed board 7 with such green diffused light, an image with a clear outline 71a of the exposed pad 71 can be acquired as shown in FIG. 3B. That is, when diffuse illumination is used, the small scratches 71b and dents 71c on the pad surface are difficult to see, but the contour 71a of the pad 71 has little variation in light, so that a clear image can be acquired. it can. Moreover, since the S / N ratio is also high for the discoloration of the pad 71, an image that is favorable for inspection can be acquired.
  • green diffused light is used as illumination for detecting the contour 71a of the pad 71 as a first purpose.
  • green light is used as the second color light source 4
  • red light when red light is used, the reflectance of the exposed pad 71 becomes high, and light is emitted from the contour 71 a of the pad 71. This is because it is difficult to extract the contour 71a image due to large reflection.
  • green light is used as the second color light source 4
  • the reflectance at the pad 71 is reduced, so that the image of the contour 71a of the pad 71 can be clearly extracted and the resist 72 is green.
  • blue or blue since the reflectance can be increased with green light, an image suitable for the inspection of the resist 72 can be acquired.
  • the fluorescent lamp is used as the diffuse illumination.
  • the fluorescent lamp since the red and blue wavelengths are included in addition to the green wavelength, even when the resist 72 is reddish brown or blue, This is to cope with this.
  • a green fluorescent lamp is used.
  • a blue fluorescent lamp is used corresponding to the color of the resist 72. You may do it.
  • the blue fluorescent lamp has weaker light in the red wavelength range than the green fluorescent lamp, it is better to use the green fluorescent lamp when inspecting the reddish resist 72.
  • the blue LED as the third color light source 5 has an acute angle with respect to the optical axis of the camera 6 arranged in an oblique direction (that is, in the normal direction of the printed circuit board 7). On the other hand, it is provided on the camera 6 side). Then, by irradiating blue light from the third color light source 5 as dark field illumination, it is possible to acquire irregularly reflected light of a rough portion formed on the surface of the printed circuit board 7.
  • examples of the rough portion include a pooled portion or a thin portion of the resist 72, or a missing portion of the resist 72 or uneven printing of silk.
  • the pad 71 when the pad 71 is irradiated with light by dark field illumination, most of the light is regularly reflected on the surface of the pad 71, and a clear image such as a scratch 71b or a dent 71c on the pad surface can be acquired. It will disappear. For this reason, the dark field illumination from the blue LED is used as illumination when the formation state of the resist 72 is inspected.
  • blue LED when blue diffused illumination is used as the 2nd color light source 4, green LED different from this is used.
  • the light from the first color light source 3 to the third color light source 5 is simultaneously irradiated onto the printed circuit board 7 and the reflected light is acquired by the camera 6.
  • the camera 6 acquires this image, it is separated into wavelengths in the RGB region by a color filter that is a separation means, and is stored in the storage means 80 as a different image by each CCD element.
  • FIG. 6 which is a functional block diagram
  • an exposed area of the pad 71 is extracted based on an image acquired by green diffuse illumination, and the area is contracted.
  • inspection is performed with bright field illumination from the red LED 32 that is the first color light source 3.
  • an image within a predetermined luminance range corresponding to the luminance value of the pad 71 is extracted, and the image is contracted by several pixels.
  • an image of the contraction region is extracted from the image of the red LED 32, and a luminance value histogram for each RGB in the region is generated (FIG. 7a).
  • the quality of the pad 71 is determined based on the number of pixels having a luminance value lower than the first threshold value a1 and the number of pixels having a luminance value higher than the second threshold value a2.
  • the part having the luminance value may be determined as the scratch 71b or the dent 71c, and the quality may be determined according to the length or area.
  • the first inspection means 81 inspects the discoloration of the pad surface in addition to the scratch 71b and the dent 71c of the pad 71.
  • an image within a predetermined luminance width corresponding to the luminance value of the pad 71 is extracted based on an image by green diffuse illumination, and the image is contracted by several pixels.
  • a luminance value histogram for each RGB is generated from the image of the contracted area obtained by the green diffuse illumination, and it is determined how many pixels having luminance values other than the predetermined RGB luminance value exist. .
  • the second inspection means 82 inspects the formation state of the contour 71 a of the pad 71.
  • an image within a predetermined luminance width corresponding to the luminance value of the pad 71 is extracted based on the image by the green diffuse illumination as in the first inspection unit 81.
  • contraction and expansion processing is performed on the extracted area of the pad 71, and the contraction area of the pad 71 as shown in the upper diagram of FIG.
  • a luminance histogram is generated with the outer normal direction of the axis as an axis.
  • what was shown with the thick continuous line in the upper figure of FIG. 8 has shown the outline 71a of the pad 71.
  • the quality of the contour 71a is determined based on how far the inflection point of the luminance histogram in the pixel along the radial direction from the contracted portion of the contour 71a is away from the position of the inflection point of the luminance histogram in the reference data. . That is, if the inflection point of the histogram is a predetermined value or more away from the position of the inflection point of the reference data, it is determined that there is a protrusion or a chip and that it is defective.
  • the third inspection unit 83 inspects the resist 72.
  • the region of the resist 72 on the pattern and the region of the resist 72 on the base material are separated, and each region is separated. Inspect based on blue image.
  • an image having a luminance width corresponding to the on-pattern resist 72 is extracted from the obtained blue image and also corresponds to the on-substrate resist 72. Extract an image with luminance width.
  • the wavelength is relatively short, so that the refractive index at the resist 72 increases, and light enters in a direction substantially perpendicular to the inside. Then, the vertical light is reflected in the pattern in a substantially vertical direction, and the light is refracted in the direction of the camera, so that a bright image with a larger amount of light can be acquired. Then, based on the image of the on-pattern resist 72 by the blue light, the disconnection 74 or short of the pattern 73 under the resist is inspected.
  • cluster processing is performed to collect regions having substantially the same luminance in the inspection region, and the number of cluster regions in the inspection region is compared with the number of cluster regions in the reference image. Do. At this time, if the disconnection 74 occurs in the inspection area, as shown in FIG. 9, the number of cluster areas (area “1” in FIG. 9) corresponding to the brightness of the pattern 73 under the resist is the reference image. Therefore, it can be determined that the disconnection 74 has occurred. On the other hand, when the inspection area is short-circuited, the cluster area corresponding to the brightness of the resist 72 on the base material is divided, so that the cluster area of the resist color on the base material ("0" area in FIG. 9) is present.
  • the presence or absence of the disconnection 74 or the short circuit is determined by the cluster processing, but the disconnection 74 or the short circuit may be determined by other methods.
  • the extracted resist lower pattern 73 is expanded, and the resist 72 region excluding the vicinity of the boundary of the pattern 73 is inspected.
  • the reason why the vicinity of the boundary of the pattern 73 is excluded is that the application state of the resist 72 becomes unstable at the boundary portion of the pattern 73.
  • the resist 72 is irradiated with light by dark field illumination by a blue LED. Therefore, if there is a pool of ink, the reflected light from that portion is received.
  • ink loss or the like reflected light from the boundary portion can be received. Therefore, it is determined that there is an ink pool or a chip based on the number of pixels having a predetermined luminance or higher due to the reflected light, and it is determined that the ink is defective according to the size.
  • the third inspection unit 83 can inspect the formation state of the resist 72 by the green diffuse illumination that is the second color light source 4.
  • the green image that is the second color light source 4 the entire resist 72 is inspected without separating the pattern 73 portion.
  • the green image is diffuse illumination, it is possible to obtain an image mainly due to reflection due to the surface roughness without being influenced by some unevenness of the surface. It is possible to acquire an image that is not easily affected by the unevenness near the contour 71a.
  • the stage is moved to the lower side of the illumination device 2, and the light from the first color light source 3 to the third color light source 5 is simultaneously irradiated (step S1).
  • the reflected light is separated into a plurality of wavelengths such as RGB by a color filter, and each is received by the CCD element of the camera 6 (step S2), and the image of the first color light source 3 and the image of the second color light source 4 are received.
  • the image is stored in the storage unit 80 as an image of the third color light source 5.
  • an image corresponding to the luminance width of the pad 71 is extracted based on the image of the second color light source 4 (that is, an image obtained by green diffuse illumination) (step S3), and the image is contracted and the pad 71 is subjected to contraction processing. Is extracted (step S4). Then, a luminance value histogram is generated for the inner region of the pad 71 in the image of the first color light source 3 (that is, the image of the red LED 32) (step S5), and the first in order to inspect scratches and dents (step S6).
  • a predetermined number of pixels having a luminance lower than the threshold value a1 it is determined to be defective, and when a predetermined number of pixels having a luminance higher than the second threshold value a2 is determined to be defective.
  • a luminance value histogram is generated from the image of the contracted area obtained by the green diffuse illumination (step S7), and how many pixels have luminance values other than the predetermined RGB luminance values. Determine whether. At this time, if there are a predetermined number or more of pixels other than the predetermined luminance value, it is determined that the region is a discolored region and is defective (step S8).
  • an image within a predetermined luminance width corresponding to the luminance value of the pad 71 is extracted based on the image by the green diffuse illumination (step S4). Then, the extracted area of the pad 71 is contracted and expanded to extract a ring-shaped green image area surrounded by the contracted area and the enlarged area (step S9). A luminance histogram having the radial direction as an axis is generated from the contraction region of the pad 71 as shown (step S10). Then, the quality of the contour 71a is determined based on whether or not the inflection point in the histogram is within a predetermined range of the position of the inflection point in the histogram in the reference data (step S11).
  • step S12 in order to inspect the formation state of the resist 72, the resist pattern, etc., based on the dark field illumination image of the blue LED which is the third color light source 5, the region of the resist 72 on the pattern and the substrate The regions of the resist 72 are separated (step S12), and each region is inspected based on the blue image.
  • cluster processing is performed to collect regions having substantially the same luminance in the inspection region (step S13).
  • the presence or absence of disconnection 74 or a short circuit is determined by comparing the number of cluster areas in the inspection area with the number of cluster areas in the reference image (step S14).
  • step S15 When the application state of the resist 72 on the substrate is inspected, the extracted resist lower pattern 73 is expanded to extract the resist 72 area excluding the vicinity of the boundary of the pattern 73 (step S15).
  • step S16 pixels having a predetermined luminance or more are counted, and according to the number of pixels, it is determined that there is an ink pool or chipping (step S16).
  • the entire resist 72 is inspected (step S17). Also in the inspection by the green diffuse illumination, the number of pixels in the high luminance portion generated by the rough surface portion is counted, and the ink accumulation or chipping, the presence of foreign matter, etc. are determined according to the number.
  • the first bright light illumination is applied to the camera 6.
  • the first color light source 3 arranged at an angle of the second color light source 4, the second color light source 4, which is diffused illumination by a fluorescent lamp, and the third color light source 5 arranged at a third angle serving as dark field illumination with respect to the camera 6.
  • the image of the printed circuit board 7 is taken by the camera 6 using light from the first color light source 3 to the third color light source 5, and the scratches 71b on the pad surface using the image of the first color light source 3
  • First inspection means 81 for inspecting the presence or absence of light second inspection means 82 for inspecting the formation state of the pad 71 outline 71a using the image of the second color light source 4 as the diffuse illumination, and the third color light source 5 Inspection of resist 72 formation using images of Since that was so and a third inspection unit 83, it is possible to perform optimum inspection in accordance with the characteristics of each inspection area.
  • the third color light source 5 is provided in an acute angle with the camera 6 provided in an oblique direction with respect to the printed circuit board 7, light with extremely small surface roughness such as a pad 71 is obtained.
  • irregularly reflected light from the pool of the resist 72 having an extremely large surface roughness can be acquired, and the formation state of the resist 72 can be effectively inspected.
  • the first color light source 3 is a red LED 32 light source
  • the second color light source 4 is a green light source or a blue light source
  • the third color light source 5 is a blue LED light source or green LED of a color different from the second color light source 4. Since the light source is used, it is possible to accurately acquire images such as scratches 71b and dents 71c on the pad 71, and for green and blue colors such as the resist 72, green and blue dark fields. A surface image can be accurately obtained by illumination.
  • the pattern 73 area is inspected using the image of the second color light source 4 as well, so that it cannot be inspected with the light sources of the respective colors.
  • the resist 72 can be inspected with a light source of another color.
  • the red LED 32 is crossed and provided as the first color light source 3, but a lens or the like may be provided in front of the light source to realize substantially parallel light.
  • a green fluorescent lamp is used as the second color light source 4, but a diffuser plate may be attached to the green LED to realize diffused light.
  • blue LED was provided as the 3rd color light source 5, it can also be implement
  • red means a wavelength within a predetermined width based on red (first wavelength)
  • green means a wavelength within a predetermined width based on green (second wavelength)
  • Blue means a wavelength within a predetermined width based on blue (third wavelength).
  • the RGB light is irradiated onto the printed circuit board 7 at the same time, but it is also possible to individually irradiate the light for each RGB and acquire the images individually.
  • the first inspection means 81 in the above embodiment inspects the scratches 71b and dents 71c and discoloration of the pad 71
  • the second inspection means 82 inspects the contour 71a of the pad 71
  • the third inspection means 83 in resist The application state of 72 and the formation state of the pattern 73 under the resist 72 are inspected.
  • these individual inspection methods may be inspected by an algorithm other than the method shown in the above embodiment. .

Abstract

[Problem] To perform accurate inspection by radiating light corresponding to characteristics of a pad and a resist. [Solution] An inspection apparatus (1) of a printed board (7) is provided with: a red LED (32), which is disposed at a first angle such that the red LED is a bright-field illumination apparatus with respect to a camera (6); a second color light source (4), i.e., a diffused illumination apparatus using a green fluorescent lamp; and a third color light source (5), which is disposed at a third angle such that the third color light source is a dark-field illumination apparatus with respect to the camera (6), and is configured of a blue LED. An image of the printed board (7) is photographed by means of the camera (6) using light emitted from the light sources, from the first light source (3) to the third light source (5), and scratches (71b) and a hit mark (71c) on a pad surface and whether the pad surface has a color change or not are inspected using an image obtained by means of light emitted from the red LED (32), i.e., the bright-field illumination apparatus. Furthermore, a forming state of a profile (71a) of a pad (71) is inspected using an image obtained by means of light emitted from the fluorescent lamp, i.e., the green diffused illumination apparatus. Furthermore, pool and chipping of the resist (72), and disconnection and short-circuiting of a resist lower pattern are inspected using an image obtained from the third light source (5), i.e., the blue LED.

Description

プリント基板の検査装置Printed circuit board inspection equipment
　本発明は、プリント基板の表面に形成されたパッド、レジストなどを精度良く検査できるようにしたプリント基板の検査装置に関するものである。 The present invention relates to a printed circuit board inspection apparatus that can accurately inspect pads, resists, and the like formed on the surface of a printed circuit board.
　一般に、プリント基板の表面に形成されたパッドやレジストなどは、カメラでその画像が取得され、その画像に基づいて自動で検査される。 In general, images of pads, resists, and the like formed on the surface of a printed circuit board are acquired by a camera and automatically inspected based on the images.
　ところで、このような検査装置でプリント基板の画像を取得する場合、カメラに対して正反射となる方向から光を照射（すなわち、明視野照明）してしまうと、エッジや凹凸を有する部分のコーナーなどで光が強く反射してしまい、エッジの形状をうまく検出することができなくなってしまう。このため、一般的には、プリント基板の画像を取得する場合には、そのカメラに対して正反射となる方向とは異なる方向から光を照射する暗視野照明で画像を取得するようにしている（特許文献１の第４段落、特許文献２の第３０段落）。 By the way, when an image of a printed circuit board is obtained with such an inspection apparatus, if light is irradiated from the direction of regular reflection on the camera (that is, bright field illumination), the corner of the portion having an edge or unevenness As a result, the light is strongly reflected and the shape of the edge cannot be detected well. For this reason, generally, when an image of a printed circuit board is acquired, the image is acquired by dark field illumination in which light is emitted from a direction different from the direction of regular reflection with respect to the camera. (The 4th paragraph of patent documents 1 and the 30th paragraph of patent documents 2).
特表２００２－５３５６８７号公報Special Table 2002-535687 特開２００８－２６８１４１号公報JP 2008-268141 A
　しかしながら、このように暗視野照明でプリント基板のパッドやレジストなどを検査する場合、次のような問題を生じる。 However, when the printed circuit board pads and resists are inspected by dark field illumination in this way, the following problems occur.
　すなわち、プリント基板を検査する場合、パッド表面の傷、パッドの凹凸の有無、パッド輪郭の欠陥、パッド表面の変色、レジストの剥がれやインク溜まりなどを検査するが、上述のように暗視野照明で画像を取得すると、パッドの輪郭についてはある程度正確に画像を取得することができるものの、パッドの表面に形成された傷などについては画像が暗くなって鮮明な画像を取得することができなくなってしまう。 In other words, when inspecting a printed circuit board, it inspects the surface of the pad, scratches on the surface of the pad, defects in the pad outline, discoloration of the pad surface, peeling of the resist, ink reservoir, etc. When an image is acquired, an image can be acquired with a certain degree of accuracy with respect to the outline of the pad, but a flaw formed on the surface of the pad becomes dark and an image cannot be acquired clearly. .
　また、パッドやレジストなどについては、それぞれ独自の色や反射率などを有しているため、それぞれの特性に応じた光を照射して検査することが好ましい。 Also, since pads and resists have their own colors and reflectances, it is preferable to inspect them by irradiating light according to their characteristics.
　そこで、本発明は、パッドやレジストなどにおける特性に応じた光を照射して精度良い検査を行えるようにしたプリント基板の検査装置を提供することを目的とする。 Therefore, an object of the present invention is to provide a printed circuit board inspection apparatus capable of performing a high-precision inspection by irradiating light according to characteristics of a pad, a resist, or the like.
　すなわち、本発明は上記課題を解決するために、プリント基板に形成されたパッドやレジストの形成状態を検査するプリント基板の検査装置において、カメラに対して明視野照明となる第一の角度に配置された第一色光源と、蛍光灯による拡散照明である第二色光源と、カメラに対して暗視野照明となる第三の角度に配置された第三色光源とを備え、前記第一色光源から第三色光源までの光を用いてカメラでプリント基板の画像を撮影し、前記第一色光源の画像を用いてパッド表面の傷の有無を検査する第一検査手段と、前記拡散照明である第二色光源の画像を用いてパッド輪郭の形成状態を検査する第二検査手段と、前記第三色光源の画像を用いてレジストの形成状態を検査する第三検査手段とを備えるようにしたものである。 That is, in order to solve the above-described problems, the present invention provides a printed circuit board inspection apparatus for inspecting the formation state of pads and resist formed on a printed circuit board at a first angle that provides bright field illumination with respect to the camera. A first color light source, a second color light source that is a diffused illumination by a fluorescent lamp, and a third color light source that is disposed at a third angle that provides dark field illumination with respect to the camera. A first inspection means for taking an image of a printed circuit board with a camera using light from a light source to a third color light source, and inspecting the pad surface for scratches using the image of the first color light source; and the diffuse illumination A second inspection unit that inspects the formation state of the pad contour using the image of the second color light source, and a third inspection unit that inspects the formation state of the resist using the image of the third color light source. It is a thing.
　このようにすれば、パッドやレジストの特性に応じた光源の色や角度で画像を取得することができるため、それぞれの検査領域の特性に応じた最適な検査をすることができるようになる。 In this way, since an image can be acquired with the color and angle of the light source according to the characteristics of the pad and resist, it is possible to perform the optimal inspection according to the characteristics of each inspection area.
　また、このような発明において、第三色光源を、プリント基板の法線に対して斜め方向に設けられたカメラの光軸に対して鋭角となる方向に設けるようにする。 In such an invention, the third color light source is provided in a direction that makes an acute angle with respect to the optical axis of the camera provided in an oblique direction with respect to the normal line of the printed circuit board.
　このようにすれば、パッドの表面に形成された極めて小さい傷や凹凸の反射光を取得することがなくなり、表面粗さが極めて大きなレジストの溜まりなどの乱反射光を取得することにより、効果的にレジストの形成状態を検査することができるようになる。 In this way, it is no longer necessary to acquire reflected light of extremely small scratches and irregularities formed on the surface of the pad, and by acquiring irregularly reflected light such as a pool of resist having a very large surface roughness, it is possible to effectively It becomes possible to inspect the formation state of the resist.
　さらに、第一色光源を赤色ＬＥＤ光源とし、前記第二色光源を緑色光源もしくは青色光源とし、前記第三色光源を第二色光源とは異なる色の青色ＬＥＤ光源もしくは緑色ＬＥＤ光源とする。 Furthermore, the first color light source is a red LED light source, the second color light source is a green light source or a blue light source, and the third color light source is a blue LED light source or a green LED light source having a different color from the second color light source.
　このようにすれば、パッドのような金属表面については赤色の波長の反射率が高くなるため傷や打痕などの画像を取得することができ、また、レジストのように緑色や青色に近い色については、緑色や青色の暗視野照明で表面画像を正確に取得することができる。 In this way, a metal surface such as a pad has a high red wavelength reflectance, so images such as scratches and dents can be obtained, and a color close to green or blue like a resist. For, surface images can be accurately acquired with green or blue dark field illumination.
　加えて、第三検査手段でレジストの形成状態を検査する場合、前記第二色光源の画像も用いてパターン領域を検査する。 In addition, when the resist formation state is inspected by the third inspection means, the pattern area is inspected also using the image of the second color light source.
　このようにすれば、それぞれの色の光源で検査できなかったレジストの部分を他の色の光源で検査することができるようになる。 In this way, the resist portion that could not be inspected with the light sources of the respective colors can be inspected with the light sources of other colors.
　具体的には、第三色光源の画像を基準として、所定の輝度閾値を用いて基材上レジストとレジスト下パターンの領域を分離し、レジスト下パターンの領域を膨張処理して、その外側の基材上レジストの塗布状態を検査する。 Specifically, with the image of the third color light source as a reference, a region on the base material and the region below the resist are separated using a predetermined brightness threshold, and the region below the resist is expanded, The application state of the resist on the substrate is inspected.
　また、第三色光源の画像を基準として、所定の輝度閾値を用いて基材上レジストとレジスト下パターンの領域を分離し、レジスト下パターンの領域について断線やショートの有無を検査する。 In addition, using the image of the third color light source as a reference, the resist region on the base material and the region under the resist pattern are separated using a predetermined luminance threshold, and the region under the resist pattern is inspected for disconnection or short circuit.
　本発明によれば、プリント基板に形成されたパッドやレジストの形成状態を検査するプリント基板の検査装置において、カメラに対して明視野照明となる第一の角度に配置された第一色光源と、蛍光灯による拡散照明である第二色光源と、カメラに対して暗視野照明となる第三の角度に配置された第三色光源とを備え、前記第一色光源から第三色光源までの光を用いてカメラでプリント基板の画像を撮影し、前記第一色光源の画像を用いてパッド表面の傷の有無を検査する第一検査手段と、前記拡散照明である第二色光源の画像を用いてパッド輪郭の形成状態を検査する第二検査手段と、前記第三色光源の画像を用いてレジストの形成状態を検査する第三検査手段とを備えるようにしたので、それぞれの検査領域の特性に応じた最適な検査をすることができるようになる。 According to the present invention, in a printed circuit board inspection apparatus for inspecting the formation state of pads and resist formed on a printed circuit board, the first color light source disposed at a first angle that provides bright field illumination with respect to the camera; A second color light source that is a diffused illumination by a fluorescent lamp, and a third color light source arranged at a third angle that is dark field illumination with respect to the camera, from the first color light source to the third color light source A first inspection means for taking an image of a printed circuit board with a camera using the light of the first light, and inspecting the presence or absence of a scratch on the pad surface using the image of the first color light source, and a second color light source that is the diffuse illumination. Since the second inspection means for inspecting the formation state of the pad contour using the image and the third inspection means for inspecting the formation state of the resist using the image of the third color light source are provided. Optimal inspection according to the characteristics of the area So that it is able to.
本発明の一実施の形態を示す自動検査装置の照明装置とカメラの配置を示す図The figure which shows arrangement | positioning of the illuminating device and camera of the automatic inspection apparatus which shows one embodiment of this invention 同形態における第一色光源のＬＥＤの配置状態を示す図The figure which shows the arrangement | positioning state of LED of the 1st color light source in the form 同形態における各色光源を用いて取得したパッドの画像を示す図The figure which shows the image of the pad acquired using each color light source in the form 同形態における各色光源を用いて取得したレジストの画像を示す図The figure which shows the image of the resist acquired using each color light source in the form 同形態における各色光源を用いて取得したレジスト下パターンの画像を示す図The figure which shows the image of the pattern under a resist acquired using each color light source in the same form 同形態における機能ブロック図Functional block diagram in the same form 同形態におけるパッドやレジストを検査する際のヒストグラムを示す図The figure which shows the histogram at the time of test | inspecting the pad and resist in the same form 同形態におけるパッドの輪郭を検査する際におけるヒストグラムを示す図The figure which shows the histogram at the time of inspecting the outline of the pad in the same form 同形態におけるレジスト下パターンのクラスタ処理を示す図The figure which shows the cluster processing of the pattern under a resist in the same form 同形態における検査のフローチャートFlow chart of inspection in the same form
　以下、本発明の一実施の形態について図面を参照して説明する。この実施の形態におけるプリント基板７の検査装置１は、ステージに載置されたプリント基板７に対して光を照射する照明装置２と、その照明装置２からの光であってプリント基板７で反射した反射光を受光するカメラ６と、そのカメラ６によって取得された画像からプリント基板７の表面に形成されたパッド７１やレジスト７２などの形成状態を検査する第一検査手段８１から第三検査手段８３（図６参照）などを備えて構成されている。そして、特徴的には、その照明装置２について、カメラ６の光軸に対して正反射となる第一の角度（すなわち、明視野照明となる角度）に配置された赤色ＬＥＤ３２を備えた第一色光源３と、その第一の角度とは異なる角度に配置された緑色の蛍光灯である第二色光源４と、カメラ６の光軸に対して鋭角となる方向に配置された青色ＬＥＤからなる第三色光源５とを備え、その赤色ＬＥＤ３２の第一色光源３による画像によってパッド７１の表面の傷７１ｂや打痕７１ｃなどを検査するとともに、緑色の拡散照明によってパッド７１の輪郭７１ａなどの形成状態を検査し、また、青色ＬＥＤによる暗視野照明によってレジスト７２の形成状態などを検査できるようにしたものである。以下、本実施の形態における検査装置１について詳細に説明する。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The inspection apparatus 1 for a printed circuit board 7 in this embodiment includes an illuminating device 2 that irradiates light onto the printed circuit board 7 placed on a stage, and the light from the illuminating apparatus 2 that is reflected by the printed circuit board 7. The camera 6 that receives the reflected light and the first inspection means 81 to the third inspection means that inspect the formation state of the pads 71 and the resist 72 formed on the surface of the printed circuit board 7 from the image acquired by the camera 6. 83 (see FIG. 6). Characteristically, the illuminating device 2 is provided with a first LED 32 having a red LED 32 arranged at a first angle that is specularly reflected with respect to the optical axis of the camera 6 (that is, an angle that provides bright field illumination). From the color light source 3, the second color light source 4, which is a green fluorescent lamp arranged at an angle different from the first angle, and the blue LED arranged in an acute angle direction with respect to the optical axis of the camera 6. The surface of the pad 71 is inspected for scratches 71b, dents 71c and the like by the image of the first color light source 3 of the red LED 32, and the contour 71a of the pad 71 by the green diffuse illumination. In addition, the formation state of the resist 72 can be inspected by dark field illumination with a blue LED. Hereinafter, the inspection apparatus 1 in the present embodiment will be described in detail.
　まず、この検査対象となるプリント基板７は、図示しない搬送手段を用いてステージ上に載置され、その状態で照明装置２やカメラ６の下方部分まで搬送される。そして、そこで照明装置２から各色の光が同時に照射され、そのうちプリント基板７で反射した光がカメラ６によって取得される。ここで、画像を取得するためのカメラ６としては、カラーフィルターによってＲＧＢなどの複数の波長に分離するものであって、それぞれをＣＣＤ素子で受光して電気信号に変換するカラーカメラなどが用いられる。 First, the printed circuit board 7 to be inspected is placed on a stage using a transport means (not shown), and transported to the lower part of the illumination device 2 and the camera 6 in that state. Then, light of each color is simultaneously emitted from the lighting device 2, and light reflected by the printed circuit board 7 is acquired by the camera 6. Here, as the camera 6 for acquiring an image, a color camera or the like that is separated into a plurality of wavelengths such as RGB by a color filter and receives each light by a CCD element and converts it into an electrical signal is used. .
　この照明装置２は、図１に示すように、赤色ＬＥＤ３２からなる第一色光源３と、緑色の拡散照明である蛍光灯からなる第二色光源４と、青色ＬＥＤからなる第三色光源５とを備えて構成されている。 As shown in FIG. 1, the illuminating device 2 includes a first color light source 3 composed of a red LED 32, a second color light source 4 composed of a fluorescent lamp which is a green diffuse illumination, and a third color light source 5 composed of a blue LED. And is configured.
　このうち、第一色光源３である赤色ＬＥＤ３２は、図２に示すように、細長い基板３１の長手方向に沿って複数列（図２では二列）をなすように配置されており、各列の赤色ＬＥＤ３２の光軸の角度をそれぞれ交叉させるようにしている。すなわち、第一列目の赤色ＬＥＤ３２については、基板の長手方向に沿って一方の端部側に光軸が傾くように取り付けられており、第二列目の赤色ＬＥＤ３２については、基板の長手方向に沿って他端部側に光軸が傾くように取り付けられている。そして、このように赤色ＬＥＤ３２を配置することによって、細長い基板３１の短手方向の幅の範囲内で二方向からの細い赤色光を照射させるようにしている。このとき、第一色光源３から照射された赤色の光は、プリント基板７の露出している銅や金色のパッド７１で強く反射され、また、交叉している赤色ＬＥＤ３２からの光によって種々の方向の傷７１ｂや打痕７１ｃについてコントラストを強くした状態でカメラ６に受光させることができる。なお、このような明視野照明である反射光をカメラ６に受光させると、パッド７１の輪郭７１ａで光が強く反射してしまい（図３（ａ））、輝度のばらつきが大きくなって明確な輪郭画像を取得することができなってしまう。また、パッド７１の変色についても、表面輝度のばらつきが大きいので検査に適した画像を取得することができなくなる。このため、この第一色光源３からの光については、パッド７１の細かい傷７１ｂや打痕７１ｃを検査するための照明として用いる。 Among these, the red LEDs 32 which are the first color light sources 3 are arranged in a plurality of rows (two rows in FIG. 2) along the longitudinal direction of the elongated substrate 31 as shown in FIG. The angles of the optical axes of the red LEDs 32 are crossed. That is, the red LED 32 in the first row is attached so that the optical axis is inclined toward one end along the longitudinal direction of the substrate, and the longitudinal direction of the substrate is in the second row of red LEDs 32. Is attached so that the optical axis is inclined toward the other end side. By arranging the red LED 32 in this way, thin red light from two directions is irradiated within the range of the width of the elongated substrate 31 in the short direction. At this time, the red light emitted from the first color light source 3 is strongly reflected by the exposed copper or gold pad 71 of the printed circuit board 7, and various kinds of light are emitted from the intersecting red LEDs 32. It is possible to cause the camera 6 to receive light in a state in which the contrast of the direction scratch 71b and the dent 71c is increased. Note that when the reflected light, which is such bright field illumination, is received by the camera 6, the light is strongly reflected by the contour 71a of the pad 71 (FIG. 3A), and the variation in luminance becomes large and clear. An outline image cannot be acquired. Also, regarding the discoloration of the pad 71, since the variation in surface luminance is large, an image suitable for inspection cannot be acquired. For this reason, the light from the first color light source 3 is used as illumination for inspecting fine scratches 71b and dents 71c of the pad 71.
　一方、緑色の蛍光灯である第二色光源４は、明視野照明である赤色ＬＥＤ３２とは異なる角度に設けられる。ここでは、第二色光源４を、図１に示すように、プリント基板７の法線に対して赤色ＬＥＤ３２側に傾けるように取り付けられており、これによってパッド７１の表面を明るくした状態で画像を取得できるようにしている。また、この第二色光源４については、第一光源よりも光を広範囲に拡散させるように、プリント基板７とは反対側に傘４１を設けて蛍光灯からの光を広範囲に拡散させるようにしている。なお、光を広範囲に拡散させる場合、傘４１を設ける以外にも、第二色光源４の前面に拡散板を設けて光を拡散させるようにしてもよい。そして、このような緑色の拡散光をプリント基板７に照射させることにより、図３（ｂ）に示すように、露出しているパッド７１の輪郭７１ａが明確な画像を取得できるようにしている。すなわち、拡散照明を用いた場合は、パッド表面の小さな傷７１ｂや打痕７１ｃについては見えにくくなるものの、パッド７１の輪郭７１ａについては光のばらつきが少ないために、明確な画像を取得することができる。また、パッド７１の変色についてもＳ／Ｎ比が高くなるため、検査に良好な画像を取得することができる。そこで、このような緑色の拡散光を、第一の目的として、パッド７１の輪郭７１ａを検出するための照明として用いるようにしている。なお、ここでは、第二色光源４として緑色光を用いるようにしているが、赤色光を用いた場合は、露出しているパッド７１の反射率が高くなり、パッド７１の輪郭７１ａで光が大きく反射して輪郭７１ａ画像を抽出しにくくなるからである。これに対して、第二色光源４として緑色光を用いれば、パッド７１での反射率が小さくなるために、パッド７１の輪郭７１ａの画像を明確に抽出することができるとともに、レジスト７２が緑色や青色である場合に、緑色光で反射率を大きくすることができるため、レジスト７２の検査にも適した画像を取得することができるようになる。また、拡散照明として蛍光灯を用いるようにしたのは、蛍光灯の場合、緑色の波長以外に赤色や青色の波長も含まれるため、レジスト７２が赤茶色や青色である場合であっても、これに対応できるようになるためである。なお、ここでは緑色の蛍光灯を用いるようにしているが、パッド７１の輪郭７１ａ以外にレジスト７２の形成状態についても検査する場合は、そのレジスト７２の色に対応して青色の蛍光灯を用いるようにしてもよい。ただし、青色の蛍光灯は、緑色の蛍光灯に比べて赤色波長域の光が弱いため、赤っぽいレジスト７２を検査する場合は、緑色の蛍光灯を用いた方がよい。 On the other hand, the second color light source 4 which is a green fluorescent lamp is provided at a different angle from the red LED 32 which is bright field illumination. Here, as shown in FIG. 1, the second color light source 4 is attached so as to be inclined toward the red LED 32 with respect to the normal line of the printed circuit board 7, so that the surface of the pad 71 is brightened. To be able to get. For the second color light source 4, an umbrella 41 is provided on the side opposite to the printed circuit board 7 so as to diffuse light over a wider range than the first light source, so that the light from the fluorescent lamp is diffused over a wide range. ing. In addition, when diffusing light over a wide range, in addition to providing the umbrella 41, a diffusion plate may be provided in front of the second color light source 4 to diffuse the light. Then, by irradiating the printed board 7 with such green diffused light, an image with a clear outline 71a of the exposed pad 71 can be acquired as shown in FIG. 3B. That is, when diffuse illumination is used, the small scratches 71b and dents 71c on the pad surface are difficult to see, but the contour 71a of the pad 71 has little variation in light, so that a clear image can be acquired. it can. Moreover, since the S / N ratio is also high for the discoloration of the pad 71, an image that is favorable for inspection can be acquired. Therefore, such green diffused light is used as illumination for detecting the contour 71a of the pad 71 as a first purpose. Here, although green light is used as the second color light source 4, when red light is used, the reflectance of the exposed pad 71 becomes high, and light is emitted from the contour 71 a of the pad 71. This is because it is difficult to extract the contour 71a image due to large reflection. On the other hand, if green light is used as the second color light source 4, the reflectance at the pad 71 is reduced, so that the image of the contour 71a of the pad 71 can be clearly extracted and the resist 72 is green. In the case of blue or blue, since the reflectance can be increased with green light, an image suitable for the inspection of the resist 72 can be acquired. In addition, the fluorescent lamp is used as the diffuse illumination. In the case of the fluorescent lamp, since the red and blue wavelengths are included in addition to the green wavelength, even when the resist 72 is reddish brown or blue, This is to cope with this. Here, a green fluorescent lamp is used. However, in the case of inspecting the formation state of the resist 72 in addition to the contour 71a of the pad 71, a blue fluorescent lamp is used corresponding to the color of the resist 72. You may do it. However, since the blue fluorescent lamp has weaker light in the red wavelength range than the green fluorescent lamp, it is better to use the green fluorescent lamp when inspecting the reddish resist 72.
　次に、第三色光源５である青色ＬＥＤは、図１に示すように、斜め方向に配置されたカメラ６の光軸に対して鋭角となる方向（すなわち、プリント基板７の法線方向に対してカメラ６側）に設けられる。そして、この第三色光源５から暗視野照明として青色光を照射させることによって、プリント基板７の表面に形成された粗い部分の乱反射光を取得することができる。ここで、粗い部分としては、レジスト７２の溜まり部分や薄い部分、あるいは、レジスト７２の抜け、シルクの印刷むらなどが挙げられる。一方、暗視野照明でパッド７１に光を照射した場合、パッド７１の表面でほとんどの光が正反射されてしまい、パッド表面の傷７１ｂや打痕７１ｃなどの鮮明な画像を取得することができなくなってしまう。このため、青色ＬＥＤからの暗視野照明については、レジスト７２の形成状態を検査する際の照明として用いるようにする。なお、ここでは青色ＬＥＤを用いるようにしているが、第二色光源４として青色の拡散照明を用いた場合は、これとは異なる緑色ＬＥＤを用いるようにする。 Next, as shown in FIG. 1, the blue LED as the third color light source 5 has an acute angle with respect to the optical axis of the camera 6 arranged in an oblique direction (that is, in the normal direction of the printed circuit board 7). On the other hand, it is provided on the camera 6 side). Then, by irradiating blue light from the third color light source 5 as dark field illumination, it is possible to acquire irregularly reflected light of a rough portion formed on the surface of the printed circuit board 7. Here, examples of the rough portion include a pooled portion or a thin portion of the resist 72, or a missing portion of the resist 72 or uneven printing of silk. On the other hand, when the pad 71 is irradiated with light by dark field illumination, most of the light is regularly reflected on the surface of the pad 71, and a clear image such as a scratch 71b or a dent 71c on the pad surface can be acquired. It will disappear. For this reason, the dark field illumination from the blue LED is used as illumination when the formation state of the resist 72 is inspected. In addition, although blue LED is used here, when blue diffused illumination is used as the 2nd color light source 4, green LED different from this is used.
　そして、これらの第一色光源３から第三色光源５までの光を同時にプリント基板７に照射させ、カメラ６によってその反射光を取得する。このカメラ６でこの画像を取得するに際しては、分離手段であるカラーフィルターによってＲＧＢの領域の波長に分離し、それぞれＣＣＤ素子によって異なる画像として記憶手段８０に記憶させる。 Then, the light from the first color light source 3 to the third color light source 5 is simultaneously irradiated onto the printed circuit board 7 and the reflected light is acquired by the camera 6. When the camera 6 acquires this image, it is separated into wavelengths in the RGB region by a color filter that is a separation means, and is stored in the storage means 80 as a different image by each CCD element.
　次に、このようにＲＧＢの領域の波長に分離された画像に基づいて、プリント基板７の形成状態を検査する方法について説明する。 Next, a method for inspecting the formation state of the printed circuit board 7 based on the image thus separated into the wavelengths of the RGB region will be described.
　＜パッド表面検査＞
まず、機能ブロック図である図６における第一検査手段８１では、緑色の拡散照明で取得された画像に基づいて、露出しているパッド７１の領域を抽出し、その領域を収縮処理する。そして、そのパッド７１の輪郭７１ａから所定の内側領域において、第一色光源３である赤色ＬＥＤ３２からの明視野照明で検査する。具体的には、緑色の拡散照明である第二色画像に基づき、パッド７１の輝度値に対応する所定の輝度幅の範囲内の画像を抽出し、その画像を数画素分収縮処理する。そして、赤色ＬＥＤ３２による画像からその収縮領域の画像を抽出し、その領域内におけるＲＧＢ毎の輝度値ヒストグラムを生成する（図７ａ）。このとき、第一の閾値ａ１よりも低い輝度値を有する画素が所定数以上存在している場合や、第二の閾値ａ２よりも高い輝度値を有する画素が所定数以上存在している場合、傷７１ｂや打痕７１ｃなどが存在していると判断して、「不良」である旨を出力を行う。なお、ここでは、第一の閾値ａ１よりも低い輝度値の画素数や第二の閾値ａ２よりも高い輝度値の画素数によってパッド７１の良否を判定するようにしているが、所定幅内の輝度値を有する部位を傷７１ｂや打痕７１ｃであると判断し、その長さや面積に応じて良否を判定するようにしてもよい。 <Pad surface inspection>
First, in the first inspection means 81 in FIG. 6 which is a functional block diagram, an exposed area of the pad 71 is extracted based on an image acquired by green diffuse illumination, and the area is contracted. Then, in a predetermined inner region from the contour 71 a of the pad 71, inspection is performed with bright field illumination from the red LED 32 that is the first color light source 3. Specifically, based on the second color image that is the green diffuse illumination, an image within a predetermined luminance range corresponding to the luminance value of the pad 71 is extracted, and the image is contracted by several pixels. Then, an image of the contraction region is extracted from the image of the red LED 32, and a luminance value histogram for each RGB in the region is generated (FIG. 7a). At this time, when there are a predetermined number of pixels having a luminance value lower than the first threshold a1, or when a predetermined number of pixels having a luminance value higher than the second threshold a2 are present, It is determined that there is a flaw 71b, a dent 71c, and the like, and a “not good” is output. Here, the quality of the pad 71 is determined based on the number of pixels having a luminance value lower than the first threshold value a1 and the number of pixels having a luminance value higher than the second threshold value a2. The part having the luminance value may be determined as the scratch 71b or the dent 71c, and the quality may be determined according to the length or area.
　また、第一検査手段８１では、パッド７１の傷７１ｂや打痕７１ｃ以外に、パッド表面の変色についても検査を行う。この変色検査を行う場合、同様に、緑色の拡散照明による画像に基づいて、パッド７１の輝度値に対応する所定の輝度幅内の画像を抽出し、その画像を数画素分収縮処理する。そして、今度は、その緑色の拡散照明で得られた収縮領域の画像から、ＲＧＢ毎の輝度値ヒストグラムを生成し、所定のＲＧＢ輝度値以外の輝度値を有する画素がどれくらい存在するかを判断する。このとき、その所定の輝度値以外の画素が所定数以上存在している場合は、変色している領域であると判断して「不良」である旨の判断を行う。 Also, the first inspection means 81 inspects the discoloration of the pad surface in addition to the scratch 71b and the dent 71c of the pad 71. When performing this discoloration inspection, similarly, an image within a predetermined luminance width corresponding to the luminance value of the pad 71 is extracted based on an image by green diffuse illumination, and the image is contracted by several pixels. This time, a luminance value histogram for each RGB is generated from the image of the contracted area obtained by the green diffuse illumination, and it is determined how many pixels having luminance values other than the predetermined RGB luminance value exist. . At this time, if there are a predetermined number or more of pixels other than the predetermined luminance value, it is determined that the area is discolored and is determined to be “bad”.
　＜パッドの輪郭検査＞
次に、第二検査手段８２では、パッド７１の輪郭７１ａの形成状態を検査する。この輪郭７１ａの形成状態を検査する場合は、第一検査手段８１と同様に、緑色の拡散照明による画像に基づいて、パッド７１の輝度値に対応する所定の輝度幅内の画像を抽出する。そして、その抽出されたパッド７１の領域について収縮と膨張処理を行い、その収縮領域と拡大領域で囲まれたリング状の緑色画像領域について、図８の上図に示すようなパッド７１の収縮領域の外側法線方向を軸とする輝度ヒストグラムを生成する。なお、図８の上図において太い実線で示されたものがパッド７１の輪郭７１ａを示している。そして、その輪郭７１ａを収縮された部分から半径方向に沿った画素における輝度ヒストグラムの変曲点が、基準データにおける輝度ヒストグラムの変曲点の位置からどれくらい離れているかによって輪郭７１ａの良否を判定する。すなわち、ヒストグラムの変曲点が基準データの変曲点の位置より所定値以上離れている場合は、突起や欠けが存在しているとして不良であると判断する。 <Pad contour inspection>
Next, the second inspection means 82 inspects the formation state of the contour 71 a of the pad 71. When the formation state of the contour 71a is inspected, an image within a predetermined luminance width corresponding to the luminance value of the pad 71 is extracted based on the image by the green diffuse illumination as in the first inspection unit 81. Then, contraction and expansion processing is performed on the extracted area of the pad 71, and the contraction area of the pad 71 as shown in the upper diagram of FIG. A luminance histogram is generated with the outer normal direction of the axis as an axis. In addition, what was shown with the thick continuous line in the upper figure of FIG. 8 has shown the outline 71a of the pad 71. FIG. The quality of the contour 71a is determined based on how far the inflection point of the luminance histogram in the pixel along the radial direction from the contracted portion of the contour 71a is away from the position of the inflection point of the luminance histogram in the reference data. . That is, if the inflection point of the histogram is a predetermined value or more away from the position of the inflection point of the reference data, it is determined that there is a protrusion or a chip and that it is defective.
　＜レジスト７２の検査＞
また、第三検査手段８３ではレジスト７２の検査を行う。このレジスト７２の検査を行う場合、第三色光源５である青色ＬＥＤの暗視野照明の画像に基づいて、パターン上レジスト７２の領域と基材上レジスト７２の領域を分離し、それぞれの領域を青色画像に基づいて検査する。この青色画像からパターン上レジスト７２と基材上レジスト７２とを分離する場合、取得された青色画像からパターン上レジスト７２に対応する輝度幅の画像を抽出するとともに、基材上レジスト７２に対応する輝度幅の画像を抽出する。このとき、カメラ下に配置した青色ＬＥＤを用いると、相対的に波長が短いのでレジスト７２での屈折率が大きくなり、内部にほぼ垂直な方向で光が侵入する。そして、その垂直な光がパターンでほぼ垂直な方向に反射し、その光がカメラの方向に屈折するので、より光量の多い明るい画像を取得することができる。そして、この青色の光によるパターン上レジスト７２の画像に基づいてレジスト下のパターン７３の断線７４やショートなどを検査する。この断線７４やショートなどを検査する場合、検査領域における略同一輝度を有する領域をまとめるクラスタ処理を行い、その検査領域におけるクラスタ領域の数と基準画像におけるクラスタ領域の数とを比較することなどによって行う。このとき、検査領域に断線７４が生じている場合は、図９に示すように、レジスト下のパターン７３の輝度に対応するクラスタ領域（図９における「１」の領域）の個数が、基準画像におけるクラスタ領域の数よりも多くなるため、断線７４を生じていると判断することができる。一方、検査領域にショートを生じている場合は、基材上レジスト７２の輝度に対応するクラスタ領域が分断されるため、基材上レジスト色のクラスタ領域（図９における「０」の領域）が基準画像におけるクラスタ領域の数よりも多くなる。これによってショートを生じていると判断することができる。なお、ここでは、クラスタ処理によって断線７４やショートの有無を判断するようにしているが、これ以外の方法で断線７４やショートを判断するようにしてもよい。 <Inspection of resist 72>
The third inspection unit 83 inspects the resist 72. When inspecting the resist 72, based on the image of dark field illumination of the blue LED that is the third color light source 5, the region of the resist 72 on the pattern and the region of the resist 72 on the base material are separated, and each region is separated. Inspect based on blue image. When separating the on-pattern resist 72 and the on-substrate resist 72 from the blue image, an image having a luminance width corresponding to the on-pattern resist 72 is extracted from the obtained blue image and also corresponds to the on-substrate resist 72. Extract an image with luminance width. At this time, if a blue LED arranged under the camera is used, the wavelength is relatively short, so that the refractive index at the resist 72 increases, and light enters in a direction substantially perpendicular to the inside. Then, the vertical light is reflected in the pattern in a substantially vertical direction, and the light is refracted in the direction of the camera, so that a bright image with a larger amount of light can be acquired. Then, based on the image of the on-pattern resist 72 by the blue light, the disconnection 74 or short of the pattern 73 under the resist is inspected. When inspecting this disconnection 74, short circuit, etc., cluster processing is performed to collect regions having substantially the same luminance in the inspection region, and the number of cluster regions in the inspection region is compared with the number of cluster regions in the reference image. Do. At this time, if the disconnection 74 occurs in the inspection area, as shown in FIG. 9, the number of cluster areas (area “1” in FIG. 9) corresponding to the brightness of the pattern 73 under the resist is the reference image. Therefore, it can be determined that the disconnection 74 has occurred. On the other hand, when the inspection area is short-circuited, the cluster area corresponding to the brightness of the resist 72 on the base material is divided, so that the cluster area of the resist color on the base material ("0" area in FIG. 9) is present. More than the number of cluster regions in the reference image. As a result, it can be determined that a short circuit has occurred. Here, the presence or absence of the disconnection 74 or the short circuit is determined by the cluster processing, but the disconnection 74 or the short circuit may be determined by other methods.
　次に、基材上のレジスト７２の塗布状態を検査する場合、抽出されたレジスト下パターン７３を膨張処理し、そのパターン７３の境界近傍を除いたレジスト７２領域について検査を行う。このパターン７３の境界近傍を除くようにしたのは、パターン７３の境界部分ではレジスト７２の塗布状態が不安定になるからである。このレジスト７２の塗布状態を検査する場合においては、青色ＬＥＤによる暗視野照明によってレジスト７２に光を照射させているので、インクの溜まりが存在していると、その部分についての反射光を受光することができ、また、インクの抜けなどが存在している場合は、その境界部分についての反射光を受光することができる。そこで、この反射光による所定輝度以上の画素の個数によって、インク溜まりや欠けがあると判断し、その大きさに応じて不良である旨の判断を行う。 Next, when inspecting the application state of the resist 72 on the base material, the extracted resist lower pattern 73 is expanded, and the resist 72 region excluding the vicinity of the boundary of the pattern 73 is inspected. The reason why the vicinity of the boundary of the pattern 73 is excluded is that the application state of the resist 72 becomes unstable at the boundary portion of the pattern 73. When the application state of the resist 72 is inspected, the resist 72 is irradiated with light by dark field illumination by a blue LED. Therefore, if there is a pool of ink, the reflected light from that portion is received. In addition, when there is ink loss or the like, reflected light from the boundary portion can be received. Therefore, it is determined that there is an ink pool or a chip based on the number of pixels having a predetermined luminance or higher due to the reflected light, and it is determined that the ink is defective according to the size.
　＜レジスト下のパターン７３検査＞
また、この第三検査手段８３では、さらに、第二色光源４である緑色の拡散照明によってもレジスト７２の形成状態を検査できるようにしている。この第二色光源４である緑色画像によってレジスト７２の形成状態を検査する場合、パターン７３の部分を分離せずにレジスト７２全体を検査する。これによって、青色画像で検査できなかったレジスト下パターン７３の境界を含めたレジスト７２全体での剥離や異物付着を検査することができるようになる。また、緑色画像は拡散照明であるために、表面の多少の凹凸の影響を受けず主として表面粗さによる反射による画像を取得することができ、レジスト下パターン７３の有り無しやそのレジスト下パターン７３の輪郭７１ａ付近の凹凸の影響も受けにくい画像を取得することができる。そして、そのように取得された画像に基づいて、図７の所定の輝度値ａ３以下の輝度を有する画素がどれくらい存在するか、あるいは、所定の輝度値ａ４以上の輝度を有する画素がどれくらい存在するかによってインクの溜まりや欠けの有無を判断する。 <Inspection of pattern 73 under resist>
In addition, the third inspection unit 83 can inspect the formation state of the resist 72 by the green diffuse illumination that is the second color light source 4. When the formation state of the resist 72 is inspected by the green image that is the second color light source 4, the entire resist 72 is inspected without separating the pattern 73 portion. As a result, it is possible to inspect the entire resist 72 including the boundary of the lower resist pattern 73 that could not be inspected with the blue image and the adhesion of foreign matter. Further, since the green image is diffuse illumination, it is possible to obtain an image mainly due to reflection due to the surface roughness without being influenced by some unevenness of the surface. It is possible to acquire an image that is not easily affected by the unevenness near the contour 71a. Then, based on the acquired image, how many pixels have a luminance equal to or lower than the predetermined luminance value a3 in FIG. 7 or how many pixels have a luminance equal to or higher than the predetermined luminance value a4. The presence or absence of ink accumulation or chipping is determined based on the above.
　次に、このように構成されたプリント基板７の検査装置１における検査のフローについて図１０を参照して説明する。 Next, an inspection flow in the inspection apparatus 1 for the printed circuit board 7 configured as described above will be described with reference to FIG.
　まず、プリント基板７の表面の形成状態を検査する場合、ステージを照明装置２の下方まで移動させ、そこで、第一色光源３から第三色光源５の光を同時に照射させる（ステップＳ１）。そして、その反射光をカラーフィルターによってＲＧＢなどの複数の波長に分離し、それぞれをカメラ６のＣＣＤ素子で受光して（ステップＳ２）、第一色光源３の画像、第二色光源４の画像、第三色光源５の画像として記憶手段８０に記憶させる。 First, when the formation state of the surface of the printed circuit board 7 is inspected, the stage is moved to the lower side of the illumination device 2, and the light from the first color light source 3 to the third color light source 5 is simultaneously irradiated (step S1). The reflected light is separated into a plurality of wavelengths such as RGB by a color filter, and each is received by the CCD element of the camera 6 (step S2), and the image of the first color light source 3 and the image of the second color light source 4 are received. Then, the image is stored in the storage unit 80 as an image of the third color light source 5.
　そして、まず、第二色光源４の画像（すなわち、緑色拡散照明による画像）に基づいて、パッド７１の輝度幅に対応した画像を抽出し（ステップＳ３）、その画像を収縮処理してパッド７１の内側領域を抽出する（ステップＳ４）。そして、第一色光源３の画像（すなわち、赤色ＬＥＤ３２による画像）におけるそのパッド７１の内側領域について輝度値ヒストグラムを生成し（ステップＳ５）、傷や打痕を検査すべく（ステップＳ６）第一の閾値ａ１よりも低い輝度の画素が所定数存在する場合に不良であると判定するとともに、第二の閾値ａ２よりも高い輝度の画素が所定数存在する場合についても不良であると判定する。 First, an image corresponding to the luminance width of the pad 71 is extracted based on the image of the second color light source 4 (that is, an image obtained by green diffuse illumination) (step S3), and the image is contracted and the pad 71 is subjected to contraction processing. Is extracted (step S4). Then, a luminance value histogram is generated for the inner region of the pad 71 in the image of the first color light source 3 (that is, the image of the red LED 32) (step S5), and the first in order to inspect scratches and dents (step S6). When there is a predetermined number of pixels having a luminance lower than the threshold value a1, it is determined to be defective, and when a predetermined number of pixels having a luminance higher than the second threshold value a2 is determined to be defective.
　また、これと並行して、その緑色の拡散照明で得られた収縮領域の画像から、輝度値ヒストグラムを生成し（ステップＳ７）、所定のＲＧＢ輝度値以外の輝度値を有する画素がどれくらい存在するかを判断する。このとき、その所定の輝度値以外の画素が所定数以上存在している場合、変色領域であるとして不良である旨の判断を行う（ステップＳ８）。 In parallel with this, a luminance value histogram is generated from the image of the contracted area obtained by the green diffuse illumination (step S7), and how many pixels have luminance values other than the predetermined RGB luminance values. Determine whether. At this time, if there are a predetermined number or more of pixels other than the predetermined luminance value, it is determined that the region is a discolored region and is defective (step S8).
　次に、パッド７１の輪郭７１ａの形成状態を検査すべく、緑色の拡散照明による画像に基づいて、パッド７１の輝度値に対応する所定の輝度幅内の画像を抽出する（ステップＳ４）。そして、その抽出されたパッド７１の領域について収縮と膨張処理を行って、その収縮領域と拡大領域で囲まれたリング状の緑色画像領域を抽出し（ステップＳ９）、その領域について、図８に示すようなパッド７１の収縮領域から半径方向を軸とする輝度ヒストグラムを生成する（ステップＳ１０）。そして、そのヒストグラムにおける変曲点が、基準データにおけるヒストグラムにおける変曲点の位置の所定範囲内に収まっているか否かによって輪郭７１ａの良否を判定する（ステップＳ１１）。 Next, in order to inspect the formation state of the contour 71a of the pad 71, an image within a predetermined luminance width corresponding to the luminance value of the pad 71 is extracted based on the image by the green diffuse illumination (step S4). Then, the extracted area of the pad 71 is contracted and expanded to extract a ring-shaped green image area surrounded by the contracted area and the enlarged area (step S9). A luminance histogram having the radial direction as an axis is generated from the contraction region of the pad 71 as shown (step S10). Then, the quality of the contour 71a is determined based on whether or not the inflection point in the histogram is within a predetermined range of the position of the inflection point in the histogram in the reference data (step S11).
　さらに、今度は、レジスト７２の形成状態やレジストしたパターンなどの検査をすべく、第三色光源５である青色ＬＥＤの暗視野照明の画像に基づいて、パターン上レジスト７２の領域と基材上レジスト７２の領域を分離し（ステップＳ１２）、それぞれの領域を青色画像に基づいて検査する。このとき、パターン上レジスト７２の画像に基づいてレジスト下のパターン７３の断線７４やショートなどを検査する場合は、検査領域における略同一輝度を有する領域をまとめるクラスタ処理を行い（ステップＳ１３）、その検査領域におけるクラスタ領域の数と基準画像におけるクラスタ領域の数とを比較することなどによって断線７４やショートの有無を判定する（ステップＳ１４）。 Furthermore, this time, in order to inspect the formation state of the resist 72, the resist pattern, etc., based on the dark field illumination image of the blue LED which is the third color light source 5, the region of the resist 72 on the pattern and the substrate The regions of the resist 72 are separated (step S12), and each region is inspected based on the blue image. At this time, when the disconnection 74 or the short of the pattern 73 under the resist is inspected based on the image of the resist 72 on the pattern, cluster processing is performed to collect regions having substantially the same luminance in the inspection region (step S13). The presence or absence of disconnection 74 or a short circuit is determined by comparing the number of cluster areas in the inspection area with the number of cluster areas in the reference image (step S14).
　また、基材上レジスト７２の塗布状態を検査する場合は、抽出されたレジスト下パターン７３を膨張処理してそのパターン７３の境界近傍を除いたレジスト７２領域を抽出し（ステップＳ１５）、その領域で所定輝度以上の画素を計数して、その個数に応じてインク溜まりや欠けがあると判断する（ステップＳ１６）。 When the application state of the resist 72 on the substrate is inspected, the extracted resist lower pattern 73 is expanded to extract the resist 72 area excluding the vicinity of the boundary of the pattern 73 (step S15). In step S16, pixels having a predetermined luminance or more are counted, and according to the number of pixels, it is determined that there is an ink pool or chipping (step S16).
　さらに、第二色光源４である緑色の拡散照明によってもレジスト７２の形成状態を検査する場合、レジスト７２全体を検査する（ステップＳ１７）。この緑色の拡散照明による検査においても、表面の粗い部分によって生じる輝度の高い部分の画素の個数を計数し、その数に応じてインクの溜まりや欠け、異物の存在などを判断する。 Furthermore, when the formation state of the resist 72 is also inspected by the green diffuse illumination that is the second color light source 4, the entire resist 72 is inspected (step S17). Also in the inspection by the green diffuse illumination, the number of pixels in the high luminance portion generated by the rough surface portion is counted, and the ink accumulation or chipping, the presence of foreign matter, etc. are determined according to the number.
　このように上記実施の形態によれば、プリント基板７に形成されたパッド７１やレジスト７２の形成状態を検査するプリント基板７の検査装置１において、カメラ６に対して明視野照明となる第一の角度に配置された第一色光源３と、蛍光灯による拡散照明である第二色光源４と、カメラ６に対して暗視野照明となる第三の角度に配置された第三色光源５とを備え、前記第一色光源３から第三色光源５までの光を用いてカメラ６でプリント基板７の画像を撮影し、前記第一色光源３の画像を用いてパッド表面の傷７１ｂの有無を検査する第一検査手段８１と、前記拡散照明である第二色光源４の画像を用いてパッド７１輪郭７１ａの形成状態を検査する第二検査手段８２と、前記第三色光源５の画像を用いてレジスト７２の形成状態を検査する第三検査手段８３とを備えるようにしたので、それぞれの検査領域の特性に応じた最適な検査を行うことができるようになる。 As described above, according to the embodiment, in the inspection apparatus 1 for the printed circuit board 7 for inspecting the formation state of the pad 71 and the resist 72 formed on the printed circuit board 7, the first bright light illumination is applied to the camera 6. The first color light source 3 arranged at an angle of the second color light source 4, the second color light source 4, which is diffused illumination by a fluorescent lamp, and the third color light source 5 arranged at a third angle serving as dark field illumination with respect to the camera 6. The image of the printed circuit board 7 is taken by the camera 6 using light from the first color light source 3 to the third color light source 5, and the scratches 71b on the pad surface using the image of the first color light source 3 First inspection means 81 for inspecting the presence or absence of light, second inspection means 82 for inspecting the formation state of the pad 71 outline 71a using the image of the second color light source 4 as the diffuse illumination, and the third color light source 5 Inspection of resist 72 formation using images of Since that was so and a third inspection unit 83, it is possible to perform optimum inspection in accordance with the characteristics of each inspection area.
　また、第三色光源５を、プリント基板７に対して斜め方向に設けられたカメラ６と鋭角となる方向に設けるようにしたので、パッド７１などのように表面粗さが極めて小さい光を取得することがなくなり、表面粗さが極めて大きいレジスト７２の溜まりからの乱反射光を取得して、効果的にレジスト７２の形成状態を検査することができるようになる。 In addition, since the third color light source 5 is provided in an acute angle with the camera 6 provided in an oblique direction with respect to the printed circuit board 7, light with extremely small surface roughness such as a pad 71 is obtained. Thus, irregularly reflected light from the pool of the resist 72 having an extremely large surface roughness can be acquired, and the formation state of the resist 72 can be effectively inspected.
　さらに、第一色光源３を赤色ＬＥＤ３２光源とし、前記第二色光源４を緑色光源もしくは青色光源とし、前記第三色光源５を第二色光源４とは異なる色の青色ＬＥＤ光源もしくは緑色ＬＥＤ光源としたので、パッド７１の傷７１ｂや打痕７１ｃなどの画像を正確に取得することができるようになるとともに、レジスト７２のように緑色や青色に近い色については、緑色や青色の暗視野照明で表面画像を正確に取得することができる。 Further, the first color light source 3 is a red LED 32 light source, the second color light source 4 is a green light source or a blue light source, and the third color light source 5 is a blue LED light source or green LED of a color different from the second color light source 4. Since the light source is used, it is possible to accurately acquire images such as scratches 71b and dents 71c on the pad 71, and for green and blue colors such as the resist 72, green and blue dark fields. A surface image can be accurately obtained by illumination.
　加えて、第三検査手段８３でレジスト７２の形成状態を検査する場合、前記第二色光源４の画像も用いてパターン７３領域を検査するようにしたので、それぞれの色の光源で検査できなかったレジスト７２の部分を他の色の光源で検査することができるようになる。 In addition, when the formation state of the resist 72 is inspected by the third inspection means 83, the pattern 73 area is inspected using the image of the second color light source 4 as well, so that it cannot be inspected with the light sources of the respective colors. The resist 72 can be inspected with a light source of another color.
　なお、本発明は上記実施の形態に限定されることなく種々の態様で実施することができる。 Note that the present invention is not limited to the above-described embodiment, and can be implemented in various modes.
　例えば、上記実施の形態では、第一色光源３として赤色ＬＥＤ３２を交叉させて設けるようにしたが、光源の前にレンズなどを設けて略平行な光を実現させるようにしてもよい。 For example, in the above-described embodiment, the red LED 32 is crossed and provided as the first color light source 3, but a lens or the like may be provided in front of the light source to realize substantially parallel light.
　また、上記実施の形態では、第二色光源４として緑色蛍光灯を用いるようにしたが、緑色ＬＥＤに拡散板を取り付けて拡散光を実現させるようにしてもよい。 In the above embodiment, a green fluorescent lamp is used as the second color light source 4, but a diffuser plate may be attached to the green LED to realize diffused light.
　さらに、上記実施の形態では、第三色光源５として青色ＬＥＤを設けるようにしたが、青色蛍光灯によって実現することもできる。 Furthermore, in the said embodiment, although blue LED was provided as the 3rd color light source 5, it can also be implement | achieved by a blue fluorescent lamp.
　なお、ここで赤色とは、赤色（第一波長）を基調とする所定幅内の波長を意味し、緑色とは、緑色（第二波長）を基調とする所定幅内の波長を意味し、青色とは、青色（第三波長）を基調とする所定幅内の波長を意味するものである。 Here, red means a wavelength within a predetermined width based on red (first wavelength), and green means a wavelength within a predetermined width based on green (second wavelength), Blue means a wavelength within a predetermined width based on blue (third wavelength).
　加えて、上記実施の形態では、ＲＧＢの光を同時にプリント基板７に照射させるようにしているが、ＲＧＢ毎に個別に光を照射させて画像を個別に取得するようにしてもよい。 In addition, in the above-described embodiment, the RGB light is irradiated onto the printed circuit board 7 at the same time, but it is also possible to individually irradiate the light for each RGB and acquire the images individually.
　また、上記実施の形態における第一検査手段８１では、パッド７１の傷７１ｂや打痕７１ｃ、変色などを検査し、第二検査手段８２ではパッド７１の輪郭７１ａを、第三検査手段８３ではレジスト７２の塗布状態やレジスト７２下のパターン７３の形成状態などを検査するようにしているが、これら個々の検査方法については上記実施形態で示された方法以外のアルゴリズムによって検査するようにしてもよい。 Further, the first inspection means 81 in the above embodiment inspects the scratches 71b and dents 71c and discoloration of the pad 71, the second inspection means 82 inspects the contour 71a of the pad 71, and the third inspection means 83 in resist. The application state of 72 and the formation state of the pattern 73 under the resist 72 are inspected. However, these individual inspection methods may be inspected by an algorithm other than the method shown in the above embodiment. .
１・・・自動検査装置
２・・・照明装置
３・・・第一色光源
３１・・・基板
３２・・・赤色ＬＥＤ
４・・・第二色光源
４１・・・傘
５・・・第三色光源
６・・・カメラ
７・・・プリント基板
７１・・・パッド
７１ａ・・・輪郭
７１ｂ・・・傷
７１ｃ・・・打痕
７２・・・レジスト
７３・・・パターン
７４・・・断線
８１・・・第一検査手段
８２・・・第二検査手段
８３・・・第三検査手段
９・・・記憶部 DESCRIPTION OF SYMBOLS 1 ... Automatic inspection apparatus 2 ... Illumination device 3 ... First color light source 31 ... Board | substrate 32 ... Red LED
4 ... Second color light source 41 ... Umbrella 5 ... Third color light source 6 ... Camera 7 ... Printed circuit board 71 ... Pad 71a ... Contour 71b ... Scratch 71c ... ... Dent 72... Resist 73 .. pattern 74 .. disconnection 81 .. first inspection means 82... Second inspection means 83.

Claims (6)

  1. プリント基板に形成されたパッドやレジストの形成状態を検査するプリント基板の検査装置において、
    カメラに対して明視野照明となる第一の角度に配置された第一色光源と、
    蛍光灯による拡散照明である第二色光源と、
    カメラに対して暗視野照明となる第三の角度に配置された第三色光源とを備え、
    前記第一色光源から第三色光源までの光を用いてカメラでプリント基板の画像を撮影し、
    前記第一色光源の画像を用いてパッド表面の傷の有無を検査する第一検査手段と、
    前記拡散照明である第二色光源の画像を用いてパッド輪郭の形成状態を検査する第二検査手段と、
    前記第三色光源の画像を用いてレジストの形成状態を検査する第三検査手段と、
    を備えたことを特徴とするプリント基板の検査装置。     In a printed circuit board inspection device that inspects the formation state of pads and resist formed on the printed circuit board,
    A first color light source disposed at a first angle for bright field illumination with respect to the camera;
    A second color light source that is a diffuse illumination by a fluorescent lamp;
    A third color light source arranged at a third angle to be dark field illumination with respect to the camera,
    Taking an image of the printed circuit board with a camera using light from the first color light source to the third color light source,
    First inspection means for inspecting the presence or absence of scratches on the pad surface using the image of the first color light source;
    Second inspection means for inspecting the formation state of the pad contour using the image of the second color light source that is the diffuse illumination;
    Third inspection means for inspecting the formation state of the resist using the image of the third color light source;
    A printed circuit board inspection apparatus comprising:
  2. 前記第三色光源が、プリント基板に対して斜め方向に設けられたカメラと鋭角となる方向に設けられるものである請求項１に記載のプリント基板の検査装置。 The printed circuit board inspection apparatus according to claim 1, wherein the third color light source is provided in a direction that forms an acute angle with a camera provided in an oblique direction with respect to the printed circuit board.
  3. 前記第一色光源が赤色ＬＥＤ光源であり、前記第二色光源が緑色光源もしくは青色光源であり、前記第三色光源が第二色光源とは異なる色の青色ＬＥＤ光源もしくは緑色ＬＥＤ光源である請求項１に記載のプリント基板の検査装置。 The first color light source is a red LED light source, the second color light source is a green light source or a blue light source, and the third color light source is a blue LED light source or a green LED light source having a different color from the second color light source. The printed circuit board inspection apparatus according to claim 1.
  4. 前記第三検査手段が、前記第二色光源の画像も用いてパターン領域を検査するようにしたものである請求項１から３いずれか１項に記載のプリント基板の検査装置。 4. The printed circuit board inspection apparatus according to claim 1, wherein the third inspection unit inspects the pattern region using the image of the second color light source. 5.
  5. 前記第三色光源の画像を基準として、所定の輝度閾値を用いて基材上レジストとレジスト下パターンの領域を分離し、レジスト下パターンの領域を膨張処理して、その外側の基材上レジストの塗布状態を検査するようにした請求項１に記載のプリント基板の検査装置。 Using the image of the third color light source as a reference, the resist pattern on the base material and the area under the resist pattern are separated using a predetermined luminance threshold value, the area under the resist pattern is expanded, and the resist on the base material on the outside thereof is processed. The printed circuit board inspection apparatus according to claim 1, wherein the application state of the printed circuit board is inspected.
  6. 前記第三色光源の画像を基準として、所定の輝度閾値を用いて基材上レジストとレジスト下パターンの領域を分離し、レジスト下パターンの領域について断線やショートの有無を検査するようにした請求項１に記載のプリント基板の検査装置。 A request for separating the resist pattern on the substrate and the pattern under the resist using a predetermined luminance threshold with the image of the third color light source as a reference and inspecting the pattern pattern under the resist for the presence of disconnection or short circuit. Item 4. The printed circuit board inspection apparatus according to Item 1.
PCT/JP2011/075768 2011-11-08 2011-11-08 Apparatus for inspecting printed board WO2013069100A1 (en)

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PCT/JP2011/075768 WO2013069100A1 (en) 2011-11-08 2011-11-08 Apparatus for inspecting printed board
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