JP2007303853A - End inspection device - Google Patents

End inspection device Download PDF

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Publication number
JP2007303853A
JP2007303853A JP2006129894A JP2006129894A JP2007303853A JP 2007303853 A JP2007303853 A JP 2007303853A JP 2006129894 A JP2006129894 A JP 2006129894A JP 2006129894 A JP2006129894 A JP 2006129894A JP 2007303853 A JP2007303853 A JP 2007303853A
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Japan
Prior art keywords
image
test object
means
imaging
inspection apparatus
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JP2006129894A
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Japanese (ja)
Inventor
Tadashi Sakaguchi
直史 坂口
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Nikon Corp
株式会社ニコン
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Application filed by Nikon Corp, 株式会社ニコン filed Critical Nikon Corp
Priority to JP2006129894A priority Critical patent/JP2007303853A/en
Priority claimed from EP07742906.6A external-priority patent/EP2023130B1/en
Publication of JP2007303853A publication Critical patent/JP2007303853A/en
Pending legal-status Critical Current

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Abstract

An object of the present invention is to accurately inspect the state of an end portion of a flat object to be inspected.
An image pickup means for picking up an end of a flat plate-like object to be detected from a position perpendicular to a surface parallel to the front surface or the back surface of the object to be detected; and an image obtained by the image pickup means; And an inspection means 7 for inspecting a state of a portion inclined with respect to the front surface or the back surface of the end portion by comparing with a reference image stored in advance.
[Selection] Figure 1

Description

  The present invention relates to an edge inspection apparatus for inspecting an edge of a flat substrate such as a semiconductor wafer or a liquid crystal glass substrate.

  In recent years, the degree of integration of circuit patterns formed on a semiconductor wafer has been increasing year by year, and the types of substances used for wafer surface treatment during production have increased. Accordingly, it has become important to observe the vicinity of the edge of the wafer located at the boundary between the films formed on the wafer during the production process. This defect management near the end face affects the yield of circuits made from the wafer.

  Therefore, for example, observe the periphery of the edge of a flat substrate such as a semiconductor wafer from a plurality of directions, and inspect for foreign matter or film peeling, bubbles in the film, wraparound of the film, cutting marks, etc. Is done.

As an inspection apparatus that performs these inspections, there is an apparatus that performs foreign object detection using scattered light by irradiation with laser light or the like (see, for example, Patent Document 1).
JP-A-11-351850

  For example, an end portion of a semiconductor wafer has a surface inclined with respect to the surface, and there is a problem that it is difficult to inspect the state of the inclined surface in a conventional inspection apparatus. It was.

  An object of the present invention is to provide an end inspection apparatus capable of accurately inspecting the state of the end of a flat plate-shaped object.

In order to solve the above problems, the edge inspection apparatus of the present invention is:
An imaging means for imaging an end of a flat test object from a position perpendicular to a surface parallel to the front surface or the back surface of the test object;
An inspection unit that inspects the state of the end portion of the end portion inclined with respect to the front surface or the back surface by comparing an image obtained by the imaging unit with a reference image stored in advance; Features.

Moreover, the edge inspection apparatus of the present invention is
An imaging means for imaging an end of a flat test object from a position perpendicular to a surface parallel to the front surface or the back surface of the test object;
An inspection means for inspecting the state of the inclined portion with respect to the front surface or the back surface of the end portion by comparing the image obtained by the imaging means with a reference image;
Rotating means for rotating the test object;
The image pickup means picks up an end portion at a plurality of rotation angle positions of the test object by rotation by the rotation means, and the inspection means uses an image picked up at another rotation angle position as the reference image. It is characterized by that.

  ADVANTAGE OF THE INVENTION According to this invention, the state of the edge part of a flat plate-shaped to-be-tested object can be test | inspected accurately.

Hereinafter, embodiments of the present invention will be described.
FIG. 1 is a diagram showing a configuration of an end portion inspection apparatus according to an embodiment of the present invention. The semiconductor wafer 1 is placed on the holding table 2 and held by suction. The rotation drive unit 3 rotates the holding table 2. Thereby, the semiconductor wafer 1 held on the holding table 2 can be rotated.

  The camera 4 is installed above the semiconductor wafer 1, and can capture an image of the outer peripheral end of the semiconductor wafer 1 from above. The camera 4 is preferably installed at a position perpendicular to the surface of the semiconductor wafer 1 from the end of the semiconductor wafer 1, but where it can be imaged at the end of the semiconductor wafer 1. It doesn't matter. Note that the camera 4 may be installed below the semiconductor wafer 1 to image the end of the back surface of the wafer 1.

  The camera 4 has an epi-illumination function, and can capture an image by performing epi-illumination on at least a part of the imaging range. The optical system for epi-illumination of the camera 4 is a telecentric optical system.

  The illumination device 5 is a device for illuminating the end portion of the semiconductor wafer 1 from the lateral direction. Illumination with diffuse light or illumination with high directivity is performed. Illumination light from the illumination device is illuminated from directions other than above and below the front or back surface of the semiconductor wafer 1. In the present embodiment, the illumination device 5 is installed so that illumination can be performed from the outer side of the outer periphery of the same surface as the front surface (or back surface) of the semiconductor wafer 1. The illumination device 5 can switch the illumination by the illumination device 5 to either illumination with diffused light or illumination with highly directional light under the control of the control device 7. Moreover, the illumination device 5 can switch the light source when performing either illumination by diffused light or illumination by illumination light with high directivity. The wavelength of the illumination light can be changed by switching the light source between, for example, a halogen lamp and an LED. By changing the wavelength of the illumination light, the color of the illumination light changes, and as a result, the white balance can be adjusted.

  The horizontal drive unit 6 moves the holding table 2 and the rotation drive unit 3 in the horizontal direction. Here, the horizontal direction is a direction parallel to the surface on which the semiconductor wafer 1 of the holding table 2 in the figure is placed, and the horizontal direction in the figure. Such horizontal driving is performed in order to correct a so-called eccentric state caused by the fact that the center of the semiconductor wafer 1 does not coincide with the center of rotation of the holding table 2 when the semiconductor wafer 1 is placed on the holding table 2. Do.

The control device 7 controls operations of the rotation drive unit 3, the camera 4, the illumination device 5, and the horizontal drive unit 6, and detects defects at the end of the semiconductor wafer 1 based on the image from the camera 4.
Next, a configuration for acquiring an image of the edge of the semiconductor wafer 1 by the camera 4 will be described. FIG. 2 is a view for explaining imaging of the end portion of the semiconductor wafer 1 by the camera 4 of the end portion inspection apparatus according to the first embodiment of the present invention. In FIG. 2, the illumination device 5 a irradiates the end of the semiconductor wafer 1 with diffused light by providing a diffusion plate in front of the light source.

  At the end of the semiconductor wafer 1, there are an upper surface region indicated by symbol A in FIG. 2 and a region inclined with respect to the upper surface indicated by symbol B. The area A is subjected to epi-illumination by the telecentric optical system of the camera 4, and the camera 4 captures a bright field image of the area A based on the epi-illumination. For the region B, the illumination by the illumination device 5 is switched to the illumination by the diffused light, and a bright field image is captured by the camera 4 by the diffused light illumination. In the figure, when the illumination device 5 is used for diffused light illumination, the illumination device is denoted by reference numeral 5a, and when used for illumination by highly directional illumination light, the illumination device is denoted by reference numeral 5b. And In this way, the bright field images of both the area A and the area B can be taken simultaneously by the camera 4.

  Prior to imaging with the camera 4, the control device 7 determines that the brightness of the area A and the brightness of the area B are within the range that can be captured by the camera 4 based on the image input to the camera 4. Control is performed to adjust the intensity of epi-illumination by the camera 4 and the intensity of illumination light from the illumination device 5. Further, the control device 7 performs control to adjust the white balance of the image input to the camera 4 by switching the light source of the illumination device 5.

  FIG. 3 is a diagram for explaining how to detect a defect using a captured image. An area indicated by C on the upper surface of the semiconductor wafer 1 in FIG. FIG. 3B is an image obtained by previously capturing an image of the region C with a non-defective wafer. FIG. 3C is an image of the region C of the semiconductor wafer 1 to be inspected. The image of the non-defective wafer of FIG. 3B is stored in the control unit 7 in advance, and the control unit 7 is the image of the semiconductor wafer 1 to be inspected imaged by the camera 4 as shown in FIG. Compare with This comparison is performed by obtaining the image of FIG. 3D by subtracting the corresponding pixel values of the image of FIG. 3D from the pixel values of the image of FIG. The image in FIG. 3D is a defect image indicating a defect. If there is no defect, the image in FIG. 3 (d) should be a white image on the entire surface, but the black portion as shown in FIG. 3 (d) is a defect.

  FIG. 4 is a diagram for explaining a coordinate system for specifying the position of the detected defect. FIG. 4 shows an image captured within the imaging range by the camera 4, but consider that a coordinate system is defined with a certain point in the image as the origin. In FIG. 4, the upper left point of the image is defined as the origin O, the horizontal direction is defined as the X axis, and the lower direction is defined as the Y axis. The X value and the Y value can be obtained from the number of pixels from the origin to a certain position, and the position in the image can be specified. Further, the θ value is used to specify the position in the semiconductor wafer 1. As shown by the arrow F in FIG. 3A, the semiconductor wafer 1 can be rotated. The control unit 7 can control the rotation of the semiconductor wafer 1, and can control the imaging at each rotation angle position by the camera 4, thereby obtaining an image of the end portion of the entire circumference of the semiconductor wafer 1. The rotation angle position can be specified by a rotation angle from a certain reference position. The reference position can be determined by detecting a notch or an orientation flat provided at the end of the semiconductor wafer 1 by a known technique. Therefore, the end position of the semiconductor wafer is specified by the rotation angle θ from the reference position and the coordinate value (θ, X, Y) based on the position X value and Y value in the captured image at the position of the rotation angle θ. Can do. In FIG. 4, the position of the black point that is a defect is indicated by coordinate values (θ, X, Y).

  FIG. 5 is a diagram for explaining the correction of the eccentric state due to the fact that the center of the semiconductor wafer 1 and the rotation center of the holding table 2 do not coincide with each other when the semiconductor wafer 1 is placed on the holding table 2. When placing the semiconductor wafer 1 on the holding table, it is difficult to make the center of the semiconductor wafer 1 coincide with the rotation center of the holding table 2. Therefore, when the holding table 2 is rotated and the end portions of the semiconductor wafer 1 are sequentially imaged by the camera 4 at a plurality of rotational positions, the positions of the end portions in the captured images are shifted depending on the rotational positions. Become. As shown in FIG. 5, the position of the region B at the end of the semiconductor wafer 1 in the image captured by the camera 4 is indicated by the lower broken line from the position indicated by the upper broken line in the image, depending on the rotation position. It changes to the position. Such an eccentricity can be obtained by a known technique, and can be obtained by detecting the position of the end portion while rotating the semiconductor wafer 1 once.

  In the present embodiment, correction is performed at the time of image capturing by obtaining the amount of eccentricity at each rotational angle position in advance. The control unit 7 controls the horizontal drive unit 6 so that the position of the region B in the image becomes a position indicated by a solid line in FIG. Move in the direction.

  Since a part of the arc on the outer periphery of the image of the end portion of the semiconductor wafer 1 as shown in FIG. 5 can be approximated as a straight line, the coordinates that are normal to the outer periphery of the semiconductor wafer 1 (Y shown in FIG. 4) If the image is taken after correcting the (direction) position (horizontal movement of the holding table 2), an image at each rotational position can be obtained while correcting the eccentricity.

  As described above, the defect detection of the end portion of the semiconductor wafer 1 is performed based on the images picked up at the respective rotation angle positions. The defect detection has been described with reference to FIG. As described above, the defect is detected by comparing the imaged image shown in FIG. 3A with the image of the non-defective wafer imaged in advance shown in FIG.

  The rotation angle position to be imaged at the time of inspection can be set in advance. The number of rotation angle positions to be imaged can be set so that all the ends of the entire outer periphery of the semiconductor wafer 1 can be imaged, or a predetermined inspection position can be set. For the non-defective wafer image, an image at the same position as the rotation angle position to be imaged at the time of inspection is captured in advance and stored in the control unit 7. Then, by comparing an image captured at each rotation angle position (FIG. 3B) and a corresponding non-defective wafer image (non-defective wafer image at the same rotation angle position as the captured image). Perform defect detection. This operation is performed for each image at each rotation angle position.

  In addition, the non-defective wafer image does not necessarily have to be held in advance corresponding to all the rotation angle positions to be imaged at the time of inspection. If the edge image of a non-defective wafer is not significantly different depending on the rotation angle position, hold the image at a certain position of the non-defective wafer and compare the image with the image taken at each rotation angle position. By doing so, defect detection is possible.

  Further, even if there is no image of a non-defective wafer, it is possible to detect defects as follows. In the present embodiment, by rotating the semiconductor wafer 1, images of the end portions at a plurality of rotation angle positions are obtained. Therefore, defect detection can be performed by comparing an image at an angular position with an image at another angular position. This is because an image including a defect has a large difference from other images. For example, when detecting a defect in an image at a certain rotation angle position, it may be compared with an image at an adjacent rotation angle position. If adjacent portions are normal, there should be no significant difference. Therefore, if there is a large difference in the image, it is determined that a defect exists. Of course, it is possible to detect a defect even by comparing with an image at a position other than the adjacent rotation angle position.

In this way, even if there is no image of a non-defective wafer, it is possible to detect a defect by comparing it with an image of an end portion at another position of the semiconductor wafer to be inspected.
FIG. 6 is a diagram for explaining the imaging of the edge of the semiconductor wafer 1 by the camera 4 of the edge inspection apparatus according to the second embodiment of the present invention. In FIG. 6, the illumination by the illumination device 5 is switched to line illumination by an optical fiber by the control device 7, and illumination with high directivity is performed. In the drawing, the illuminating device is denoted by reference numeral 5b when illumination with high directivity is performed. Also in this embodiment, as in the case of FIG. 2, the region A of the semiconductor wafer 1 is subjected to epi-illumination by the telecentric optical system of the camera 4, and the region based on the epi-illumination is obtained by the camera 4. A bright field image of A is taken. For the region B, a dark field image is captured by the camera 4 by line illumination from the illumination device 5b. In this way, the camera 4 can simultaneously capture the bright field image of the region A and the dark field image of the region B.

  The difference from the first embodiment of FIG. 2 is that a dark field image of region B is captured. In the inspection of the presence or absence of foreign matter such as scratches on the edge of the semiconductor wafer 1 and attached dust, the dark field image is easier to detect.

  FIG. 7 is a view for explaining imaging of the end portion of the semiconductor wafer 1 by the camera 4 of the end portion inspection apparatus according to the third embodiment of the present invention. In the present embodiment, line illumination light is irradiated from the illumination device 5b as in the second embodiment of FIG. However, the epi-illumination from the camera 4 is not performed. That is, in this embodiment, the epi-illumination from the camera 4 is stopped by the control by the control device 7, the illumination by the illumination device 5 is switched to the line illumination, and the dark field of the areas A and B is only by the line illumination by the camera 4. Take an image.

  As described above, the dark field image is easier to detect in the inspection of the presence or absence of foreign matters such as scratches on the edge of the semiconductor wafer 1 and attached dust, but in this embodiment, the regions A and B The effect can be obtained for both of the above.

  FIG. 8 is a view for explaining imaging of the end portion of the semiconductor wafer 1 by the camera 4 of the end portion inspection apparatus according to the fourth embodiment of the present invention. In the present embodiment, similarly to the first embodiment of FIG. 2, the illumination device 5a performs illumination with diffused light. However, the epi-illumination from the camera 4 is not performed as in the third embodiment. That is, in the present embodiment, a bright field image of the region B is captured by the camera 4 by the diffused light illumination from the illumination device 5.

  As described above, according to the embodiment, the control device 7 switches the illumination by the illumination device 5 to illumination with diffused light or illumination with high directivity. Further, the control device 7 switches whether to perform the epi-illumination by the camera 4 or not. By switching the illumination method in this way, it is easy to detect uneven defects such as dust by imaging with a dark field image, or observing the state and color of the defect by imaging with a bright field image Is possible. In this way, inspection can be performed while switching to an illumination system that facilitates detection of a defect to be inspected, so that inspection can be performed with optimal illumination.

  FIG. 9 is a diagram for explaining another example of defect inspection using the edge inspection apparatus of the present embodiment. At the surface edge of the semiconductor wafer 1, there is a boundary portion of the resist film applied on the surface. This boundary portion exists in the region A. FIG. 9 shows an image in which the boundary portion is captured. The defect detection by this image can be performed by comparing with the image of the non-defective wafer, as described with reference to FIG. In that case, whether or not the boundary portion of the film is normal can be determined by performing the following processing.

  In the image shown in FIG. 9, the distance in the radial direction from the boundary portion of the film to the outermost periphery of the end portion is obtained at each position. Since the radial direction is actually substantially equal to the vertical direction in the figure, the distance in the vertical direction may be obtained. Then, the maximum value (the distance indicated by the arrow Max in FIG. 9) and the minimum value (the distance indicated by the arrow Min in FIG. 9) are obtained. In the same way for a non-defective wafer, the maximum value and the minimum value are obtained, the allowable range is determined, the values are compared, and whether or not the value in the captured image is within the allowable range is determined.

  It is preferable that the quality determination using such an image is performed using a color image. In addition to the R (red) component, G (green) component, and B (blue) component image from the color image, the H (hue), S (saturation), and I (lightness) components are obtained from the RGB values. The pass / fail judgment may be made based on the value of.

  In the above embodiment, as described with reference to FIG. 5, the correction of the eccentricity in the state where the semiconductor wafer 1 is placed on the holding table 2 is performed by moving the semiconductor wafer 1 by driving the horizontal driving unit 6. It went by. In this correction, the relative positional relationship between the camera 4 and the end of the semiconductor wafer 1 may be corrected. Therefore, the correction may be performed by moving the camera 4 in the horizontal direction.

  Further, the image captured by the camera 4 is processed without changing the physical relative positional relationship between the camera 4 and the end of the semiconductor wafer 1 (that is, neither the semiconductor wafer 1 nor the camera 4 is moved in the horizontal direction). The eccentricity may be corrected accordingly. The region of the broken line portion as shown in FIG. 5 may be made to come to the solid line portion by performing image processing. In this case, the shift in the vertical position is corrected by image processing, but the corrected image lacks image information in any of the upper and lower portions.

  Note that the light source used in the illumination device 5 may be a light source having spectral characteristics in the visible region, but a light source having spectral properties in the infrared region may be used. A light source having spectral characteristics in the ultraviolet region may be used.

  In this embodiment, the camera 4 is installed above the semiconductor wafer 1 and the surface edge of the semiconductor wafer 1 is inspected. However, the camera 4 is installed below the semiconductor wafer 1 and the semiconductor wafer 1 is inspected. It is good also as an apparatus which test | inspects 1 back surface edge part, and is good also as an apparatus which installs a camera in both upper direction and the downward direction, and test | inspects the edge part of both the surface and back surface.

It is a figure which shows the structure of the edge part inspection apparatus by embodiment of this invention. It is a figure for demonstrating imaging of the edge part of the semiconductor wafer 1 by the camera 4 of the edge part inspection apparatus by the 1st Embodiment of this invention. It is a figure for demonstrating how to detect the defect by the imaged image. It is a figure for demonstrating the coordinate system for pinpointing the position of the detected defect. FIG. 5 is a diagram for explaining correction of an eccentric state due to the fact that the center of the semiconductor wafer 1 does not coincide with the rotation center of the holding table 2 when the semiconductor wafer 1 is placed on the holding table 2. It is a figure for demonstrating imaging of the edge part of the semiconductor wafer 1 with the camera 4 of the edge part inspection apparatus by the 2nd Embodiment of this invention. It is a figure for demonstrating imaging of the edge part of the semiconductor wafer 1 by the camera 4 of the edge part inspection apparatus by the 3rd Embodiment of this invention. It is a figure for demonstrating imaging of the edge part of the semiconductor wafer 1 by the camera 4 of the edge part inspection apparatus by the 4th Embodiment of this invention. It is a figure for demonstrating the other example of the defect inspection using the edge part inspection apparatus of this embodiment.

Explanation of symbols

1: Semiconductor wafer, 2: Holding table, 3: Rotation drive unit, 4: Camera, 5: Illumination device, 6: Horizontal drive unit, 7: Control unit.

Claims (8)

  1. An imaging means for imaging an end of a flat test object from a position perpendicular to a surface parallel to the front surface or the back surface of the test object;
    An inspection unit that inspects the state of the end portion of the end portion inclined with respect to the front surface or the back surface by comparing an image obtained by the imaging unit with a reference image stored in advance; A featured edge inspection device.
  2. The end inspection apparatus according to claim 1,
    The edge inspection apparatus, wherein the reference image is an image obtained by imaging an edge of a test object in a good state by the imaging means.
  3. In the edge inspection apparatus according to any one of claims 1 to 2,
    Rotating means for rotating the flat plate-shaped test object,
    The edge inspection apparatus, wherein the imaging means images a plurality of positions of the edge of the object to be examined.
  4. In the edge inspection apparatus according to claim 3,
    Moving means for moving at least one of the imaging means and the test object in a direction parallel to the surface of the test object;
    An end inspection apparatus comprising: a control unit that controls movement by the moving unit according to a rotation angle position of the object to be examined by the rotating unit.
  5. The end inspection device according to claim 4,
    The test object is circular, and the rotating means rotates the test object by rotationally driving a mounting unit on which the test object is mounted, and the center of the test object and the above-mentioned setting position. The amount of deviation from the center of rotation
    The end inspection apparatus, wherein the control unit controls movement by the moving unit according to the deviation amount.
  6. In the edge inspection apparatus according to claim 3,
    The edge inspection apparatus, wherein the inspection unit specifies the position of the defect detected by the inspection based on a coordinate value in an image obtained by the imaging unit and a rotation angle by the rotation unit.
  7. In the edge inspection apparatus according to claim 2,
    Rotating means for rotating the flat plate-shaped test object,
    The imaging means images an end portion at a plurality of rotation angle positions of the test object by rotation by the rotation means,
    The comparison between the image obtained by the imaging means by the inspection means and the reference image stored in advance is that of the object in good condition corresponding to the rotation angle position at the time of imaging of the image obtained by the imaging means. An end portion inspection apparatus using the reference image of an end portion.
  8. An imaging means for imaging an end of a flat test object from a position perpendicular to a surface parallel to the front surface or the back surface of the test object;
    An inspection means for inspecting the state of the inclined portion with respect to the front surface or the back surface of the end portion by comparing the image obtained by the imaging means with a reference image;
    Rotating means for rotating the test object;
    The image pickup means picks up an end portion at a plurality of rotation angle positions of the test object by rotation by the rotation means, and the inspection means uses an image picked up at another rotation angle position as the reference image. An end inspection device.
JP2006129894A 2006-05-09 2006-05-09 End inspection device Pending JP2007303853A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006129894A JP2007303853A (en) 2006-05-09 2006-05-09 End inspection device

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2006129894A JP2007303853A (en) 2006-05-09 2006-05-09 End inspection device
CN 200780016768 CN101443653B (en) 2006-05-09 2007-05-07 Edge inspection apparatus
EP07742906.6A EP2023130B1 (en) 2006-05-09 2007-05-07 Edge inspection apparatus
KR1020087027398A KR101444474B1 (en) 2006-05-09 2007-05-07 Inspection apparatus
PCT/JP2007/059471 WO2007129691A1 (en) 2006-05-09 2007-05-07 End section inspecting apparatus
TW096116471A TWI426261B (en) 2006-05-09 2007-05-09 End inspection device
US12/292,010 US7800748B2 (en) 2006-05-09 2008-11-10 Edge inspection apparatus

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