WO2013065430A1 - 導電シート及びその製造方法 - Google Patents
導電シート及びその製造方法 Download PDFInfo
- Publication number
- WO2013065430A1 WO2013065430A1 PCT/JP2012/074956 JP2012074956W WO2013065430A1 WO 2013065430 A1 WO2013065430 A1 WO 2013065430A1 JP 2012074956 W JP2012074956 W JP 2012074956W WO 2013065430 A1 WO2013065430 A1 WO 2013065430A1
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- pattern
- conductive sheet
- nanofiber
- conductive
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- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 239000002121 nanofiber Substances 0.000 claims abstract description 126
- 229910052751 metal Inorganic materials 0.000 claims abstract description 66
- 239000002184 metal Substances 0.000 claims abstract description 66
- 239000000758 substrate Substances 0.000 claims abstract description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 64
- 238000010438 heat treatment Methods 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 22
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 20
- 229910052709 silver Inorganic materials 0.000 claims description 20
- 239000004332 silver Substances 0.000 claims description 20
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000013508 migration Methods 0.000 abstract description 12
- 230000005012 migration Effects 0.000 abstract description 12
- 230000015572 biosynthetic process Effects 0.000 description 13
- 239000000463 material Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 238000001514 detection method Methods 0.000 description 10
- 238000005259 measurement Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 8
- 238000002474 experimental method Methods 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000007646 gravure printing Methods 0.000 description 5
- -1 zirconium phosphate compound Chemical class 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000007645 offset printing Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 229920002635 polyurethane Polymers 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
- 229920000915 polyvinyl chloride Polymers 0.000 description 4
- 239000004800 polyvinyl chloride Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 244000126211 Hericium coralloides Species 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/06—Contacts characterised by the shape or structure of the contact-making surface, e.g. grooved
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/029—Composite material comprising conducting material dispersed in an elastic support or binding material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2201/00—Contacts
- H01H2201/022—Material
- H01H2201/03—Composite
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2209/00—Layers
- H01H2209/024—Properties of the substrate
- H01H2209/038—Properties of the substrate transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Definitions
- the present invention relates to a conductive sheet used for a touch panel or the like and a manufacturing method thereof.
- a conductive sheet in which a layer containing conductive nanofibers, particularly metal nanofibers, is formed in a predetermined pattern on the surface of a substrate made of resin, glass, or the like (see, for example, Patent Document 1).
- FIG. 8A is a plan view of a conventional conductive sheet.
- FIG. 8B is an enlarged cross-sectional view of the conductive sheet, and shows a cut surface along a plane indicated by an arrow 76 in FIG.
- the conductive sheet 110 has a sheet terminal portion 131a at its peripheral edge.
- the sheet terminal portion 131a has a plurality of individual sheet terminals 132a, 132b, and 132c.
- the sheet terminal portion 131a is realized by a conventional visible conductive pattern 116. That is, the conventional visible conductive pattern 116 is obtained by forming a lower layer pattern on the base material 26 with the second nanofiber layer 17 and laminating the lower layer pattern to form an upper layer pattern composed of the paste layer 18.
- the second nanofiber layer 17 is a layer containing, for example, silver nanofibers.
- the paste layer 18 is a layer containing, for example, a silver paste.
- the reason for forming the paste layer 18 in addition to the second nanofiber layer is to assist the second nanofiber layer constituting the sheet terminal portion 131a to increase the electrical conductivity (reduce the electrical resistance). Another reason is that the periphery of the conductive sheet 110 is concealed in a frame shape when incorporated in the touch panel, and the line of sight is blocked. This is because there is no effect on sex.
- a second heating insulating layer 127 exists between the adjacent second nanofiber layers 17.
- the second heating insulating layer 127 has a function of preventing an electrical short circuit between the second nanofiber layers 17.
- the second heating insulating layer 127 is a portion in which the metal nanofibers are cut to a minimum size by energy beam irradiation processing to eliminate the electrical conductivity function.
- the flexible printed wiring board is connected to the sheet terminal portion 131a.
- the connection is performed by, for example, an anisotropic conductive adhesive.
- the second nanofiber layer which is a conductive portion, is adjacent to the sheet terminal portion with the second heating insulating layer interposed therebetween.
- the second heating insulating layer is a short distance.
- the second heating insulating layer has lost its electrical conductivity function, the second heating insulating layer has metal nanofibers cut to a minimum size. For this reason, when the conductive sheet is used for a long period of time, the metal nanofibers having a minimum size included in the second heating insulating layer are ionized, and metal migration occurs at the sheet terminal portion. As a result, there is a risk of a short circuit between the individual sheet terminals.
- the anisotropic conductive adhesive and the second heating insulating layer are in direct contact with each other at the sheet terminal portion.
- electricity is passed between the individual sheet terminals through the minimized metal nanofibers existing in the second heating insulating layer and the anisotropic conductive adhesive. A small amount of electricity is conducted, and the insulation resistance decreases between the individual sheet terminals. As a result, there is a risk of a short circuit between the individual sheet terminals.
- the distance between the individual sheet terminals in the sheet terminal portion for example, the distance between the individual sheet terminal 132a and the individual sheet terminal 132b, must be increased, which is an obstacle to miniaturization of flexible printed wiring boards and the like. Become. This is because the risk of metal migration increases when the distance between the individual sheet terminals is shortened. Another reason is that the paste pattern is formed on the pattern composed of the second nanofiber layer by printing, so the distance between the individual sheet terminals must be designed to be large in consideration of misalignment during printing. Because.
- an object of the present invention is to eliminate metal migration in a visible conductive pattern in a conductive sheet using metal nanofibers, and to reduce the interval between conductive portions (individual sheet terminals). is there. Moreover, it exists in obtaining the manufacturing method of such a conductive sheet.
- the conductive sheet according to the present invention is A conductive sheet having a transparent conductive pattern and a visible conductive pattern formed on a substrate, wherein the transparent conductive pattern is a layer containing metal nanofibers and a first heating insulation adjacent to the first nanofiber layer
- the visible conductive pattern is formed of a second nanofiber layer including metal nanofibers and a second heating insulating layer adjacent to the second nanofiber layer, and a lower layer pattern is formed on the lower layer pattern to form a metal paste.
- the second heating insulating layer is a layer including metal nanofibers cut to a minimum size
- a water shielding layer covering the lower layer pattern was formed on the lower layer pattern, and the upper layer pattern was formed on the water shielding layer.
- the metal nanofiber may be a silver nanofiber
- the metal paste may be a silver paste
- a lead wire portion in the conductive sheet may be composed of the visible conductive pattern.
- the conductive sheet with wiring according to the present invention is a conductive sheet with wiring composed of a conductive sheet and a flexible printed wiring board.
- a sheet terminal portion in the conductive sheet is formed of the visible conductive pattern, and a connection terminal portion of a flexible printed wiring board is electrically connected to the sheet terminal portion.
- the touch panel input device uses the conductive sheet with wiring according to the present invention as an electrode of the touch panel input device.
- the manufacturing method of the electrically conductive sheet concerning this invention is a manufacturing method of the electrically conductive sheet concerning this invention,
- the said visible conductive pattern is manufactured according to the following processes.
- (B) Forming a second nanofiber layer, which is a layer containing metal nanofibers, on the substrate Formed in the step (h), forming a water shielding layer on the second nanofiber layer formed in the step (b).
- the paste layer is formed on the substrate on which the second nanofiber layer formed in the step of forming the paste layer, which is a layer containing a metal paste on the water shielding layer, and the water shielding layer and the paste layer are formed.
- the conductive sheet according to the present invention together with other invention constituent elements, forms a lower layer pattern by the second nanofiber layer and the second heating insulating layer and forms a water shielding layer covering the lower layer pattern. Moisture permeation into the layer and the second heating insulating layer can be suppressed. For this reason, generation
- the conductive sheet with wiring according to the present invention uses the conductive sheet according to the present invention, it is excellent in durability, and the sheet terminal portion and the wiring board terminal portion of the flexible printed wiring board can be miniaturized.
- the touch panel input device uses the conductive sheet with wiring according to the present invention, the touch panel input device is excellent in durability, and the electric circuit connecting portion can be downsized.
- the method for producing a conductive sheet according to the present invention includes a second nanofiber layer, a water-impervious layer and a paste layer which are laminated in addition to the elements constituting the other invention, and the paste layer and the second nanofiber layer are simultaneously baked. Since the visible conductive pattern is formed by cutting, the water shielding layer is easily and effectively formed. Therefore, there is an advantage that metal migration does not occur and a conductive sheet having a short interval between visible conductive patterns can be manufactured.
- FIG. 1 is an exploded view of a touch panel input device according to the present invention.
- 2A and 2B are explanatory views of the conductive sheet, in which FIG. 2A is a plan view, FIG. 2B is an enlarged cross-sectional view, FIG. 2A shows a cut surface at a plane indicated by an arrow 73, and FIG. It is sectional drawing of this, and the cut surface in the plane shown by the arrow 75 is shown to (a).
- FIG. 3 is an exploded view of the conductive sheet.
- FIG. 4 is an enlarged cross-sectional view of the conductive sheet, showing a contact portion between the paste layer 18 and the second nanofiber layer 17.
- FIG. 5 is an explanatory view showing a method for producing a visible conductive pattern on a conductive sheet.
- FIG. 6 is a plan view of the conductive sheet model 81 according to Experiment 1.
- FIG. FIG. 7 is a plan view of the conductive sheet model 98 according to Experiment 2.
- FIG. 8A and 8B are explanatory views of a conventional conductive sheet, in which FIG. 8A is a plan view, FIG. 8B is an enlarged cross-sectional view, and shows a cut surface in a plane indicated by an arrow 76 in FIG.
- FIG. 1 is an exploded view of the touch panel input device 1.
- the second detection conductive sheet 10 b, the first detection conductive sheet 10 a, and the protective film 61 are sequentially stacked on the display plate 63.
- the display plate 63 is a liquid crystal display device.
- the display plate 63 is not limited to a liquid crystal display device, and other known display devices can be used.
- the second detection conductive sheet 10b has a transparent conductive pattern 11b.
- the transparent conductive pattern 11b has three strip-shaped electrode portions parallel to the long side of the second detection conductive sheet 10b.
- the lead wire portion 33b is drawn from each of the three electrode portions and is electrically connected to the sheet terminal portion 31b.
- the sheet terminal portion 31b is made of a visible conductive pattern 16b.
- transparent means a property of transmitting visible light rays
- visible means a property of absorbing visible light rays.
- the first detection conductive sheet 10a has a transparent conductive pattern 11a.
- the transparent conductive pattern 11a has three strip-shaped electrode portions parallel to the short side of the first detection conductive sheet 10a.
- a lead wire portion 33a is drawn from each of the three electrode portions and is electrically connected to the sheet terminal portion 31a.
- the sheet terminal portion 31a is made of a visible conductive pattern 16a.
- the electrodes of the touch panel and the control circuit are connected through flexible printed wiring boards (hereinafter referred to as FPC) 41a and 41b.
- Wiring board terminal portions 42a and 42b at one end of the FPCs 41a and 41b are connected to sheet terminal portions 31a and 31b at the respective conductive sheets.
- the FPCs 41a and 41b and the sheet terminal portions 31a and 31b are respectively bonded by an anisotropic conductive adhesive.
- the protective film 61 and the first detection conductive sheet 10a are provided with a notch 62 at a position corresponding to the FPC bonding portion to facilitate the bonding of the FPC and the sheet terminal portion.
- the FPC 41 has a band shape, only the peripheral portion of the wiring board terminal portion 42 is shown in FIG.
- a well-known method can be used for the touch panel control method.
- the control method is a capacitance detection method.
- the control circuit is not shown.
- FIG. 2 is an explanatory diagram of the conductive sheet 10.
- FIG. 2A is a plan view of the conductive sheet 10.
- 2B is an enlarged cross-sectional view taken along a plane indicated by an arrow 73 in FIG. 2A
- FIG. 2C is a cross-sectional view taken along a plane indicated by an arrow 75 in FIG. 2A.
- FIG. 3 is an exploded view of the conductive sheet.
- a sheet terminal portion 31 a is provided at the peripheral edge of the conductive sheet 10.
- Transparent electrodes 111, 112, and 113 are provided at the center of the conductive sheet 10.
- the three transparent electrodes 111, 112, 113 have a strip shape parallel to the short side of the conductive sheet 10.
- the three transparent electrodes 111, 112, and 113 are formed of a transparent conductive pattern.
- the transparent electrodes 111, 112, 113 and the individual sheet terminals 32 a, 32 b, 32 c are electrically connected through the lead wire portion 33.
- the sheet terminal portion 31 a is formed by the visible conductive pattern 16.
- the lead wire portion 33 may be formed of a transparent conductive pattern or a visible conductive pattern.
- the configuration of the visible conductive pattern will be described with reference to FIG. 2 (b) and FIG.
- the visible conductive pattern 16 is composed of three layers.
- the first layer is the second nanofiber layer 17 and the second heating insulating layer 27 formed on the substrate 26.
- the second nanofiber layer 17 and the second heating insulating layer 27 are adjacent on the same plane.
- the second nanofiber layer 17 forms a lower layer pattern having a constant planar shape.
- the second layer is the water shielding layer 21 and is formed on the second nanofiber layer 17 and the second heating insulating layer 27.
- a paste layer 18 and a gap insulating layer 28 are formed on the water shielding layer 21.
- the water shielding layer 21 covers the lower layer pattern.
- the third layer is a paste layer 18 formed on the water shielding layer 21.
- the paste layer 18 forms an upper layer pattern having a planar shape that matches the planar shape of the lower layer pattern.
- a layer adjacent to the paste layer 18 in the same plane is a void insulating layer 28.
- the gap insulating layer 28 is a gap.
- FIG. 2B illustrates a state in which three paste layers 18 are separated by a gap insulating layer 28 that is a gap.
- the paste layer 18 does not necessarily match the planar shape of the lower layer pattern.
- the paste layer 18 has a conducting wire function independently of the second nanofiber layer without depending on the second nanofiber layer 17. For this reason, the upper layer pattern may be formed in a planar shape different from the planar shape of the lower layer pattern.
- the upper layer pattern and the lower layer pattern supplement each other with an electric conduction function and cooperate with each other to perform a conductive line function. For this reason, the upper layer pattern needs to match the planar shape of the lower layer pattern as much as possible. If they do not match, the width (region) composed of the paste layer 18 and the second metal nanofiber layer 17 is expanded. As a result, the width of the sheet terminal portion is increased, which causes a problem that the range occupied by the sheet terminal portion on the substrate is increased.
- the water shielding layer 21 is provided between the lower layer pattern and the upper layer pattern. If a portion where the second nanofiber layer 17 and the paste layer 18 are brought into contact with each other at a position where the water shielding layer does not exist is provided, the conductive layer function is solely performed by the paste layer. Therefore, the upper layer pattern can be a unique pattern regardless of the planar shape of the lower layer pattern.
- the transparent conductive pattern 11 includes a first nanofiber layer 12 and a first heating insulating layer 29 formed on the substrate 26.
- the first nanofiber layer 12 has a certain planar shape and forms the transparent electrode.
- the first nanofiber layer 12 is adjacent to the first heating insulating layer 29 in the same plane.
- the visible conductive pattern 16 and the transparent conductive pattern 11 are on the same plane.
- the water shielding layer 21 prevents moisture from entering the lower layer pattern. For this reason, it is ideal that the water shielding layer 21 covers the entire surface of the lower layer pattern. In other words, it is ideal that the contour line of the water shielding layer exists outside the contour line of the lower layer pattern by a certain distance.
- the water shielding layer 21 not only prevents moisture transfer but also prevents electrical conduction, if the water shielding layer 21 covers the entire surface, electrical conduction between the paste layer 18 and the second nanofiber layer 17 is also prevented. . For this reason, it is preferable that a part of the direct contact between the paste layer 18 and the second nanofiber layer 17 is provided and the other part is covered with a water shielding layer.
- FIG. 4 is an enlarged cross-sectional view of the conductive sheet, showing a direct contact portion between the paste layer 18 and the second nanofiber layer 17.
- the contour line of the water shielding layer 21 is inside the contour line of the second nanofiber layer 17, and a part of the second nanofiber layer 17 is exposed without being covered by the water shielding layer 21.
- the paste layer 18 exceeds the contour of the water shielding layer 21, reaches the outside of the water shielding layer, and is in direct contact with the second nanofiber 17.
- “inside” means a region surrounded by the outline, and “outside” means a region outside the outline.
- Metal migration occurs when the following two conditions are satisfied: (1) presence of moisture (2) potential difference.
- the visible conductive pattern according to the present invention has a water shielding layer, and moisture does not enter the second nanofiber layer and the second heating insulating layer, so that metal migration does not occur.
- FIG. 5 is an explanatory view showing a method for producing a visible conductive pattern.
- a lead wire portion of a conductive sheet can be manufactured.
- a second nanofiber layer 17 that is a layer containing metal nanofibers is formed on a substrate.
- the water shielding layer 21 is formed on the second nanofiber layer 17.
- the paste layer 18 is formed on the water shielding layer 21.
- a laser beam is irradiated from above the paste layer 18 onto the substrate on which the second nanofiber layer 17, the water shielding layer 21 and the paste layer 18 are formed.
- the metal nanofibers in the second nanofiber layer 17 are cut by laser beam irradiation, and the paste layer 18 is partially removed to form a lower layer pattern and an upper layer pattern. Thereby, a visible conductive pattern is manufactured.
- the manufacturing method of the visible conductive pattern was demonstrated, the conductive sheet which contains both a transparent conductive pattern and a visible conductive pattern with the said manufacturing method can be manufactured. This will be described below.
- the first nanofiber layer is formed simultaneously with the second nanofiber layer.
- the first nanofiber layer 12 is formed in an arbitrary region on the substrate 26 except the second nanofiber layer 17 formation region.
- the first nanofiber layer and the second nanofiber layer have the same material, formation method, thickness, and the like, and both can be formed by a single operation.
- Steps shown in FIGS. 5B and 5C are applied to the visible conductive pattern 16 portion, that is, the second nanofiber layer 17 forming portion.
- the second heating insulating layer 27 and the like are formed by laser beam irradiation, and the laser beam is irradiated to the transparent conductive pattern 11 portion, that is, the first nanofiber layer 12 forming portion.
- a heating insulating layer 29 is formed.
- An example of a laser line is a YAG laser having a spot diameter of several tens of ⁇ m.
- the wavelength of the YAG laser used is 1200 nm to 350 nm, more preferably 1100 nm to 400 nm. If it is the said wavelength range, a water-shielding layer and a board
- Laser beam irradiation is performed to apply a suitable energy (heat) to the metal nanofibers, so that a part of the metal nanofibers is cut, and at the same time, a part of the paste layer is burned off and removed.
- the laser beam can be replaced with other energy beams.
- the water shielding layer 21 is preferably transparent.
- the water shielding layer 21 transmits the energy of the laser, so that the water shielding layer is left even if the laser beam processing is performed.
- the water shielding layer is opaque, the water shielding layer absorbs the energy of the laser. As a result, the water shielding layer is baked by the YAG laser.
- the material of the water shielding layer is acrylic resin, vinyl chloride resin, urethane resin, epoxy resin, melamine resin or the like. Of these resins, urethane resin, epoxy resin, and melamine resin are preferable from the viewpoints of transparency and water shielding.
- the water shielding layer may be formed by a gravure coating method, a roll coating method, a comma coating method, a gravure printing method, a screen printing method, an offset printing method, or the like.
- the thickness range of the water shielding layer 21 is usually 1 ⁇ m to 30 ⁇ m, preferably 5 ⁇ m to 20 ⁇ m.
- production of metal migration can be suppressed because the thickness of the water-impervious layer 21 shall be 1 micrometer or more.
- the protective film 61 is stuck on the conductive sheet by setting the thickness of the water shielding layer 21 to 30 ⁇ m or less, the water shielding layer 21 is composed of a water shielding layer and a paste layer in the vicinity of the contour of the water shielding layer 21.
- a protective film can follow the steps. As a result, it can prevent that a space
- the thickness range of the water shielding layer 21 is more preferably less than 10 times, preferably less than 4 times the thickness of the paste layer 18. If the thickness of the water-impervious layer 21 is within this range, the occurrence of cracks can be suppressed at the connection between the second nanofiber layer 17 and the paste layer 18 in the contour of the water-impervious layer 21.
- the second nanofiber layer 17 is composed of metal nanofibers and a binder resin such as acrylic, polyester, polyurethane, and polyvinyl chloride.
- the second nanofiber layer 17 can be provided by various general printing methods such as gravure printing, offset printing, and screen printing, and by a method such as coating by a die coater.
- Metal nanofibers are metal nanofibers such as gold, silver, platinum, copper, and palladium.
- the metal nanofiber is prepared, for example, by preparing a precursor in which metal ions such as gold, silver, platinum, copper, and palladium are supported on the surface of a base made of a zirconium phosphate compound, and then the precursor obtained above. A needle is applied by applying a current or voltage to the body.
- silver nanofibers are preferred because of their high conductivity, relatively low cost, and transparency.
- the metal nanofibers have a diameter of 10 nm to 100 nm and a length of 1 ⁇ m to 200 ⁇ m.
- the thickness of the second nanofiber layer 17 can be appropriately set within a range of several tens of nm to several hundreds of nm. This is because if the thickness is within this range, the strength as a layer is satisfied, and the flexibility as a layer makes it easy to process.
- the material and the formation method of the first nanofiber layer 12 are the same as the material and the formation method of the second nanofiber layer 17.
- the second heating insulating layer 27 is made of metal nanofibers and a binder resin.
- a binder resin acrylic, polyester, polyurethane, polyvinyl chloride, or the like can be used.
- the size of the metal nanofibers constituting the second heating insulating layer 27 is 1/10 to 1/1000 the size of the metal nanofibers constituting the first and second metal nanofiber layers. And each metal nanofiber which comprises the 2nd heating insulating layer 27 exists independently. Due to this existence mode, the electric conductivity of the second heating insulating layer 27 is small. On the other hand, the metal nanofibers constituting the first nanofiber layer are intertwined with each other. Similarly, the metal nanofibers constituting the second nanofiber layer are intertwined with each other.
- the second heating insulating layer 27 is formed by first applying the same material as that of the second nanofiber layer on the substrate by various general printing methods such as gravure printing, offset printing, and screen printing, or application by a die coater. Apply. Subsequently, the layer is formed by heat-treating the metal nanofibers in the layer using an energy ray such as a YAG laser.
- the thickness of the second heating insulating layer 27 is the same as that of the first nanofiber layer and the second metal nanofiber layer.
- the paste layer 18 is made of metal particles and a binder resin.
- the binder resin acrylic, polyester, polyurethane, polyvinyl chloride, or the like can be used.
- the metal particles silver is most preferred. This is because it has excellent conductivity and is low in cost.
- the thickness of the paste layer is 1 ⁇ m to 30 ⁇ m.
- the paste layer is formed by a gravure coating method, a roll coating method, a comma coating method, a gravure printing method, a screen printing method, an offset printing method, or the like.
- Examples of the material of the substrate 26 include resin films such as acrylic, polycarbonate, polyester, polybutylene terephthalate, polypropylene, polyamide, polyurethane, polyvinyl chloride, and polyvinyl fluoride, and glass.
- the thickness of the substrate 26 can be appropriately set in the range of 5 to 800 ⁇ m. This is because, within this thickness range, the required strength can be obtained, and processing can be easily performed with appropriate flexibility.
- the visible conductive pattern including the water shielding layer described above can be used not only to form the sheet terminal portion but also to form, for example, a lead wire portion. If a visible conductive pattern including a water shielding layer is used for the lead wire portion, the area of the frame portion of the conductive sheet can be reduced without fear of metal migration.
- a conductive sheet model 81 according to Experiment 1 was created as follows.
- the conductive sheet model 81 is Example 1.
- the base sheet was a biaxially stretched polyethylene terephthalate film having a thickness of 50 ⁇ m.
- a metal nanofiber layer was formed on the entire surface of the base sheet using a silver nanofiber material (Cambrios: ClearOhm).
- FIG. 6 is a plan view of the conductive sheet model 81.
- a water shielding layer is not formed in the electrode formation regions 82a and 82b.
- two electrode forming regions 82a and 82b were formed so as to face the vicinity of both ends of the sheet.
- the size of the electrode formation regions 82a and 82b was 10 mm ⁇ 30 mm.
- the linear distance between the two electrode formation regions 82a and 82b was 80 mm.
- electrodes were formed on the electrode formation regions 82a and 82b using a silver paste (Toyobo: DW-114L-1) so as to cover the electrode formation regions 82a and 82b.
- the thickness of the silver paste was 5 ⁇ m.
- the metal nanofiber layer was etched into a comb shape to form a heating insulating wire 83.
- One comb tooth (the length is indicated by an arrow 84) constituting the comb shape was formed every 5 mm, and the width (the length is indicated by an arrow 85) was 5 mm.
- the line width of the heating insulating wire 83 was 0.1 mm.
- the conductive sheet model according to Example 1 was obtained through the above steps. All the processes of applying the silver nanofiber material, the epoxy resin, and the silver paste on the base sheet were performed by using a gravure printing machine. The wavelength of the YAG laser used was 1064 ⁇ m.
- Example 2 and Example 3 A conductive sheet model was created in the same manner as in Example 1 except that the thickness of the water shielding layer and the resin constituting the water shielding layer were changed. In Comparative Example 1, no water shielding layer is formed.
- Examples 1, 2, and 3 and Comparative Examples 1 and 2 were evaluated based on the following evaluation criteria. Both electrodes of the conductive sheet were connected to a power source, a voltage of 20 V was applied to both electrodes, and the time until the conductive sheet was short-circuited was measured. The measurement was performed at room temperature of 60 ° C. and humidity of 95% RH. The results are shown in Table 1.
- a conductive sheet model 98 according to Experiment 2 was created as follows.
- the conductive sheet model 98 is Example 4.
- the base sheet was a biaxially stretched polyethylene terephthalate film having a thickness of 50 ⁇ m.
- a metal nanofiber layer was formed on the entire surface of the base sheet using a silver nanofiber material (Cambrios: ClearOhm).
- FIG. 7 is a plan view of the conductive sheet model 98.
- Two water shielding layers 86 and 87 were formed on the metal nanofiber layer using a urethane-based polymer resin.
- the water shielding layers 86 and 87 had a thickness of 15 ⁇ m, a planar shape of a rectangle (20 mm (arrow 94) ⁇ 50 mm (arrow 95)), and were arranged at an interval of 1 mm (arrow 96).
- a water shielding layer is not formed in the periphery of the base sheet and the electrode forming regions 88, 89, 90.
- the planar shape of the electrode formation regions 88, 89, 90 was a rectangle (0.1 mm ⁇ 21 mm), and the length of the overlapping portion with the water shielding layer 87 (arrow 97) was 10 mm.
- An electrode was formed using silver paste (Toyobo: DW-114L-1) so as to cover the electrode formation regions 88, 89, 90.
- the thickness of the silver paste was 5 ⁇ m.
- Example 5 and Comparative Examples 3, 4, 5> A conductive sheet model was created in the same manner as in Example 4 except that the thickness of the water shielding layer and the resin constituting the water shielding layer were changed.
- the resistance value of the electrode was measured for each conductive sheet model.
- the resistance value is measured between the resistance measurement points 91a and 91b, between the resistance measurement points 92a and 92b, and between the resistance measurement points 93a and 93b, and an arithmetic average of the three resistance measurement values is obtained, and this value is set as the initial resistance value. .
- the conductive sheet model was wound around a cylinder having a diameter of 8 mm, and the unwinding process was repeated 10 times. Thereafter, the resistance value of the electrode was measured as in the initial resistance measurement. The resistance value is measured between the resistance measurement points 91a and 91b, between the resistance measurement points 92a and 92b, and between the resistance measurement points 93a and 93b, and an arithmetic average of the three resistance measurement values is obtained. did.
- R / R0 resistance value after experiment (R) / initial resistance value (R 0 ) Based on the R / R 0 value, cracks generated in the electrodes were evaluated according to the following classification. The results are shown in Table 2. ⁇ : 1 ⁇ R / R 0 ⁇ 1.1 ⁇ : 1.1 ⁇ R / R 0 ⁇ 1.2 ⁇ : 1.2 ⁇ R / R 0
- the occurrence position of the crack was the contact portion between the electrode (silver paste layer) and the silver nanofiber layer in the contour of the water shielding layer.
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Abstract
Description
基板上に透明導電パターンと可視導電パターンを形成した導電シートであって、前記透明導電パターンは金属ナノファイバーを含む層である第一ナノファイバー層と第一ナノファイバー層に隣接した第一加熱絶縁層からなり、前記可視導電パターンは金属ナノファイバーを含む第二ナノファイバー層と第二ナノファイバー層に隣接した第二加熱絶縁層により下層パターンを形成し、前記下層パターンに積層して金属ペーストを含むペースト層からなる上層パターンを形成して構成されていて、第二加熱絶縁層は極小サイズに切断された金属ナノファイバーを含む層である導電シートにおいて、
前記可視導電パターンは、前記下層パターンの上に、前記下層パターンを覆う遮水層を形成し、前記遮水層の上に前記上層パターンを形成した。
本発明にかかる導電シートであって、前記導電シートにおけるシート端子部が前記可視導電パターンから構成されていて、前記シート端子部にフレキシブルプリント配線板の接続端子部を電気的に接続した。
イ 基板上に金属ナノファイバーを含む層である第二ナノファイバー層を形成する工程
ロ イの工程で形成した第二ナノファイバー層の上に遮水層を形成する工程
ハ ロの工程で形成した遮水層の上に金属ペーストを含む層であるペースト層を形成する工程
ニ ハの工程で形成された第二ナノファイバー層、遮水層とペースト層が形成された基板に、前記ペースト層の上方からエネルギー線を照射して、第二ナノファイバー層中の金属ナノファイバーを切断し、ペースト層中の金属ペーストを焼き切って、前記下層パターンと前記上層パターンを形成する工程。
実験1にかかる導電シートモデル81を以下のように作成した。導電シートモデル81は実施例1である。
遮水層の厚み、遮水層を構成する樹脂を変更したこと以外は、実施例1と同様の方法で導電シートモデルを作成した。また比較例1は遮水層を形成していない。
実施例1、2、3及び比較例1、2は、以下の評価基準に基づいて評価した。導電シートの両電極を電源と接続し、20Vの電圧を両電極にかけて導電シートが短絡するまでの
時間を測定した。なお、測定は室温60℃、湿度95%RHの下で行った。その結果を表1に示す。
実験2にかかる導電シートモデル98を以下のように作成した。導電シートモデル98は実施例4である。
遮水層の厚み、遮水層を構成する樹脂を変更したこと以外は、実施例4と同様の方法で導電シートモデルを作成した。
実施例4、5及び比較例3、4、5は、以下の評価基準に基づいて評価した。
R/R0=実験後抵抗値(R)/初期抵抗値(R0)
上記R/R0の値に基づき、電極に発生したクラックを以下の分類に従い評価した。結果を表2に示す。
○: 1≦ R/R0 < 1.1
△: 1.1≦ R/R0 < 1.2
×: 1.2≦ R/R0
10 導電シート
10a 第一検出導電シート
10b 第二検出導電シート
11 透明導電パターン
12 第一ナノファイバー層
16 可視導電パターン
17 第二ナノファイバー層
18 ペースト層
21 遮水層
26 基板
27 第二加熱絶縁層
28 空隙絶縁層
29 第一加熱絶縁層
31、31a、31b シート端子部
32a、32b、32c 個別シート端子
33、33a、33b 引き回し導線部
41a、41b フレキシブルプリント配線板
42 配線板端子部
51 レーザー照射器
61 保護フィルム
62 切り欠き部
63 表示板
81 導電シートモデル
82a、82b 電極形成領域
83 加熱絶縁線
86、87 遮水層
88、89、90 電極形成領域
98 導電シートモデル
110 従来の導電シート
116 従来の可視導電パターン
Claims (6)
- 基板上に透明導電パターンと可視導電パターンを形成した導電シートであって、前記透明導電パターンは金属ナノファイバーを含む層である第一ナノファイバー層と第一ナノファイバー層に隣接した第一加熱絶縁層からなり、前記可視導電パターンは金属ナノファイバーを含む第二ナノファイバー層と第二ナノファイバー層に隣接した第二加熱絶縁層により下層パターンを形成し、前記下層パターンに積層して金属ペーストを含むペースト層からなる上層パターンを形成して構成されていて、第二加熱絶縁層は極小サイズに切断された金属ナノファイバーを含む層である導電シートにおいて、
前記可視導電パターンは、前記下層パターンの上に、前記下層パターンを覆う遮水層を形成し、前記遮水層の上に前記上層パターンを形成した導電シート。 - 請求項1に記載した導電シートにおいて、
前記金属ナノファイバーが銀ナノファイバーであり、
前記金属ペーストが銀ペーストであることを特徴とする請求項1に記載した導電シート。 - 請求項1又は2いずれかに記載した導電シートにおいて、
導電シートにおける引き回し導線部が前記可視導電パターンから構成されている導電シート。 - 導電シートとフレキシブルプリント配線板からなる配線付導電シートにおいて、
請求項1又は2いずれかに記載した導電シートであって、前記導電シートにおけるシート端子部が前記可視導電パターンから構成されていて、前記シート端子部にフレキシブルプリント配線板の接続端子部を電気的に接続した配線付導電シート。 - 請求項4に記載した配線付導電シートをタッチパネル入力装置の電極に使用するタッチパネル入力装置。
- 請求項1にかかる導電シートの製造方法において、
前記可視導電パターンは、以下の工程により製造される導電シートの製造方法。
イ 基板上に金属ナノファイバーを含む層である第二ナノファイバー層を形成する工程
ロ イの工程で形成した第二ナノファイバー層の上に遮水層を形成する工程
ハ ロの工程で形成した遮水層の上に金属ペーストを含む層であるペースト層を形成する工程
ニ ハの工程で形成された第二ナノファイバー層、遮水層とペースト層が形成された基板に、前記ペースト層の上方からエネルギー線を照射して、第二ナノファイバー層中の金属ナノファイバーを切断し、ペースト層中の金属ペーストを焼き切って、前記下層パターンと前記上層パターンを形成する工程。
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US20140262443A1 (en) * | 2013-03-14 | 2014-09-18 | Cambrios Technologies Corporation | Hybrid patterned nanostructure transparent conductors |
WO2014147943A1 (ja) | 2013-03-18 | 2014-09-25 | ソニー株式会社 | センサ装置、入力装置および電子機器 |
JP6142745B2 (ja) * | 2013-09-10 | 2017-06-07 | ソニー株式会社 | センサ装置、入力装置及び電子機器 |
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Publication number | Publication date |
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US20140299360A1 (en) | 2014-10-09 |
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CN104025227B (zh) | 2016-06-15 |
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TWI525490B (zh) | 2016-03-11 |
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