WO2013042663A1 - Feuille de cuivre pour carte de câblage imprimée souple - Google Patents

Feuille de cuivre pour carte de câblage imprimée souple Download PDF

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Publication number
WO2013042663A1
WO2013042663A1 PCT/JP2012/073846 JP2012073846W WO2013042663A1 WO 2013042663 A1 WO2013042663 A1 WO 2013042663A1 JP 2012073846 W JP2012073846 W JP 2012073846W WO 2013042663 A1 WO2013042663 A1 WO 2013042663A1
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WO
WIPO (PCT)
Prior art keywords
copper foil
surface roughness
rolling
avg
printed wiring
Prior art date
Application number
PCT/JP2012/073846
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English (en)
Japanese (ja)
Inventor
習太郎 西田
大輔 鮫島
嘉一郎 中室
Original Assignee
Jx日鉱日石金属株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx日鉱日石金属株式会社 filed Critical Jx日鉱日石金属株式会社
Priority to KR1020147009943A priority Critical patent/KR101522148B1/ko
Priority to CN201280044983.8A priority patent/CN103828491B/zh
Publication of WO2013042663A1 publication Critical patent/WO2013042663A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Definitions

  • the present invention relates to a copper foil for a flexible printed wiring board that is required to be flexible, and particularly to a copper foil used for a flexible printed wiring board subjected to fine wiring processing.
  • a flexible printed circuit board is a structure in which a metal that is a conductive layer and a flexible insulating substrate typified by a resin film are joined together.
  • a copper foil is used for the conductive layer, and a rolled copper foil having excellent flexibility is used particularly for applications that require flexibility.
  • General FPC manufacturing process is as follows. First, the copper foil is bonded to the resin film. For joining, there are a method of imidizing by applying heat treatment to a varnish applied on a copper foil, and a method of laminating a resin film with an adhesive and a copper foil. The copper foil with a resin film joined by these steps is called CCL (copper-clad laminate). The copper foil is recrystallized by the heat treatment in the CCL manufacturing process.
  • FPC is manufactured by applying a photoresist to the copper foil surface of the manufactured CCL, baking the wiring pattern, performing UV exposure and development, and removing unnecessary copper foil by etching.
  • the wiring pattern to be formed tends to be miniaturized, and accordingly, high etching properties are required for copper foil.
  • Japanese Patent Laid-Open No. 2006-283146 describes a technique for improving the orientation of a copper foil as a technique for obtaining a high etching factor.
  • the (100) plane X-ray diffraction intensity I of the rolled copper foil and the (100) plane X-ray diffraction intensity I of the fine powder copper The ratio of 0 is 10 ⁇ I / I 0 ⁇ 60, preferably 40 ⁇ I / I 0 ⁇ 60.
  • Japanese Patent Application Laid-Open No. 2011-12297 describes a method of covering at least a part of the copper layer surface with a Cu—Zn alloy layer or Zn layer and a Cr layer on the copper foil surface.
  • the flow of the etching solution into the etching portion is restricted, so that the rate limiting process of the etching reaction is mainly the chemical reaction rate at the interface. Therefore, etching proceeds in the circuit width direction at the same time as etching proceeds in the thickness direction of the copper foil. Therefore, if there is variation in the copper foil thickness, if the etching conditions are determined so that the circuit width is constant, the copper foil cannot be removed at the thick copper foil, and the circuit is short-circuited. On the other hand, if the etching is performed under the condition that the etching residue of the copper foil does not occur, the circuit width becomes non-uniform. That is, a slight variation in the thickness of the copper foil greatly affects the processing accuracy of the circuit. Therefore, a copper foil excellent in plate thickness accuracy is desired.
  • an object of the present invention is to provide a copper foil for a flexible printed wiring board suitable for fine pitch processing. Moreover, this invention makes it another subject to provide the manufacturing method of such a copper foil.
  • Copper foil is roughly divided into rolled copper foil and electrolytic copper foil.
  • the plate thickness accuracy often depends on the function (capability) of the rolling mill, but in the current rolling mill, the plate thickness accuracy is limited to ⁇ 1.6% at a target plate thickness of 10 ⁇ m. .
  • remodeling and development of rolling mills is also desired, but it requires a large amount of research and development and is difficult to do immediately.
  • the present inventor has conducted research to solve the above-described problems.
  • many of the rolling operations are performed in order to control the thickness of the product in the feed forward.
  • thickness accuracy paying attention to the fact that the variation in surface roughness before the final pass of the final cold rolling is one of the factors affecting the sheet thickness control, reduce the surface roughness before the final pass, It has been found that the plate thickness accuracy is improved by reducing the variation of the surface roughness. Specifically, using a work roll having a small surface roughness for rolling before the final pass, and using a work roll having a desired surface roughness in the final pass, the plate thickness accuracy is finally good and the desired surface roughness is obtained. It has been found that a copper foil with can be obtained.
  • Copper foil for flexible printed wiring boards requires a certain surface roughness in consideration of adhesion to a flexible insulating substrate such as a resin film, but the surface roughness can be allowed before the final pass of final cold rolling. By making it as small as possible, it is possible to have a desired surface roughness while improving the plate thickness accuracy.
  • the thickness of the copper foil is 5 to 20 ⁇ m.
  • the difference between the maximum value (t max ) of the copper foil and the average value (t avg ) of the copper foil, or the minimum value is 1.3% or less.
  • the present invention is a flexible printed wiring board using the copper foil according to the present invention as a conductor layer.
  • the surface roughness Ra of the work roll used for the final pass is 0.03 ⁇ m or more in the final cold rolling step, and the surface of the work roll used for one pass immediately before the final pass.
  • Roughness Ra is less than 0.03 micrometer
  • the copper foil according to the present invention is excellent in plate thickness accuracy, it is possible to suppress an error in etching amount, so that the linearity of a flexible printed wiring board to be mass-produced can be improved. Therefore, the copper foil according to the present invention can be suitably used for fine pitch processing.
  • the copper foil base material used in the present invention is a rolled copper foil.
  • “Copper foil” includes copper alloy foil. There is no restriction
  • the rolled copper foil is excellent in that it has high strength, can cope with an environment in which vibration continuously occurs, and has high bending resistance.
  • the thickness of the copper foil is not particularly limited and may be appropriately selected depending on the required characteristics. Generally, the thickness is 1 to 100 ⁇ m, but when used as a conductor layer of a flexible printed wiring board, higher flexibility can be obtained by reducing the thickness of the copper foil. From such a viewpoint, it is typically 2 to 50 ⁇ m, more typically about 5 to 20 ⁇ m.
  • Ra is a value obtained by folding the roughness curve from the center line and dividing the area obtained by the roughness curve and the center line by the reference length L, and is measured according to JIS B0601: 2001.
  • the average (Ra avg ) of the surface roughness Ra is an average of arbitrary 10 points.
  • ⁇ Ra is the maximum value Ra max and the minimum value among the measured 10 points Ra. is the difference of the Ra min is.
  • the arbitrary 10 points here do not mean 10 points in the vicinity of each measurement point.
  • the rolling direction depends on the obtained length.
  • 10 points are selected at an interval of at least 50 mm, preferably at least 100 mm, more preferably at least 500 mm.
  • Ra at each measurement point is given by an average value obtained by measuring the vicinity of the measurement point three times.
  • Each measurement point is the center in the width direction.
  • interval of 50 mm or more can be ensured, the surface roughness can be measured with respect to the sheet
  • the copper foil according to the present invention is characterized in that the average (Ra avg ) of the surface roughness Ra in the rolling parallel direction satisfies 0.01 to 0.15 ⁇ m.
  • the condition of 0.01 ⁇ m ⁇ Ra avg ⁇ 0.15 ⁇ m is that when Ra avg is less than 0.01 ⁇ m, the surface is smooth and sufficient adhesion to the resin layer cannot be obtained, but exceeds 0.15 ⁇ m. For example, even if the roughness is reduced by rolling before the final pass and the variation in surface roughness is small, the rolling of the final pass varies.
  • Ra avg is preferably 0.03 ⁇ m or more from the viewpoint of stably producing appearance quality with few surface defects such as surface scratches, and 0.03 ⁇ m ⁇ Ra avg ⁇ 0.1 ⁇ m is a more preferable range.
  • ⁇ Ra Ra max ⁇ Ra min satisfies 0.025 ⁇ m or less.
  • ⁇ Ra exceeds 0.025 ⁇ m
  • ⁇ Ra before the final pass of the final rolling often exceeds 0.25 ⁇ m.
  • the surface roughness is large between the surface roughness and the surface roughness is small.
  • ⁇ Ra is preferably 0.025 ⁇ m or less, more preferably 0.020 ⁇ m or less, and typically 0.001 to 0.025 ⁇ m.
  • the oil pit is a depression generated when the rolling oil is pushed into the material to be rolled, and the density of the oil pit on the surface varies depending on the thickness of the oil film of the rolling oil. If the density of the oil pits on the surface is different, the thickness of the copper foil required by the gravimetric method is also affected, which causes variation. Therefore, it is desirable that the oil pits are uniformly distributed on the copper foil surface.
  • the amount of oil pits generated can be determined using the surface roughness RSm in the rolling parallel direction as an index.
  • RSm surface roughness
  • RSm max the number of oil pits on the surface
  • a smaller ⁇ RSm / RSm avg indicates that the oil pits are uniformly distributed on the copper foil surface.
  • the reason for dividing by RSm avg is that the variation in distribution is not necessarily large because ⁇ RSm is large. That is, even with the same ⁇ RSm, if RSm avg is large, the variation in distribution is not large and the influence is small. If RSm avg is small, the distribution is large and the influence is large.
  • RSm is an average value of the interval between the peaks and valleys obtained from the intersection where the roughness curve intersects the average line, and is measured in accordance with JIS B0601: 2001.
  • the average surface roughness RSm (RSm avg ) is an average of 10 arbitrary points
  • ⁇ RSm is the difference between RSm max which is the maximum value and RSm min which is the minimum value among 10 measured Ras. It is.
  • the arbitrary 10 points here do not mean 10 points in the vicinity of each measurement point.
  • the rolling direction depends on the obtained length. 10 points are selected at an interval of at least 50 mm, preferably at least 100 mm, more preferably at least 500 mm.
  • RSm at each measurement point is given as an average value obtained by measuring the vicinity of the measurement point three times.
  • Each measurement point is RSm at the center in the width direction. Moreover, even if it is the state laminated
  • ⁇ RSm / RSm avg is 0.5 or less, typically 0.3 to 0.5.
  • the proportion of the average value of the larger one of the values of the difference between (t avg), for the thickness of the average value (t avg) can be 1.3% or less. This proportion can be preferably 1.2% or less, more preferably 1.1% or less, and typically 0.05 to 1.2%.
  • the surface roughness Ra can be controlled by adjusting the surface roughness of the work roll. For example, if a work roll having a large Ra is used, Ra of the rolled copper foil is increased, and conversely, a work having a small Ra is performed. If a roll is used, Ra of the rolled copper foil obtained will also become small.
  • the variation value itself increases as the average value increases. The same applies to the variation value of the surface roughness Ra. The larger the average value of the surface roughness Ra, the larger the variation value. Therefore, the average value of the surface roughness Ra is reduced in order to reduce the variation value of the surface roughness Ra. Should be reduced.
  • the surface roughness should be rough to some extent from the viewpoint of rolling efficiency that the rolling speed can be set high. Therefore, for example, a copper foil having a small surface roughness, that is, a smooth surface is formed by using a work roll having a small surface roughness for only one pass immediately before the final pass of the final cold rolling, and the surface roughness is obtained in the final pass.
  • the desired surface roughness Ra is made using a large work roll.
  • a roll having a surface roughness Ra may be used up to two passes before the final pass, and a roll having a smaller roughness than the previous pass and the final pass is used for only one pass immediately before the final pass.
  • Work rolls with a small surface roughness may be used not only for the first pass just before the final pass, but also for the passes before that.
  • a roll with a small surface roughness cannot be rolled up, so it can be produced. Not desirable from a gender perspective. Therefore, the surface roughness is usually reduced only for the work roll used in the pass immediately before the final pass.
  • the effect of reducing the variation in surface roughness is higher when a roll having a smaller surface roughness is used in the pass before the first pass immediately before the final pass. For example, it is effective to use a roll having a small surface roughness for two passes immediately before the final pass.
  • a work roll having a surface roughness Ra exceeding 0.01 ⁇ m is used so that an average (Ra avg ) of Ra in the rolling parallel direction of the copper foil is 0.01 to 0.15 ⁇ m. Therefore, in order to reduce the variation value of the surface roughness, the surface roughness Ra of the work roll used for one pass immediately before the final pass must be smaller than the work roll used for the final pass. Therefore, the surface roughness Ra of the work roll used in one pass immediately before the final pass is desirably 0.01 ⁇ m or less.
  • the work roll used in the final pass preferably has a surface roughness Ra of 0.03 ⁇ m or more. Therefore, the surface roughness Ra of the work roll used in one pass immediately before the final pass is less than 0.03 ⁇ m. It is desirable.
  • the oil pit distribution uniform In order to reduce the variation in the surface roughness RSm, it is important to make the oil pit distribution uniform. In order to make the oil pit distribution uniform, among other factors, it is important to keep the viscosity of the rolling oil constant during rolling.
  • the viscosity of the rolling oil is basically determined by the type of the rolling oil, but the viscosity is lowered by gradually increasing the rolling oil by the processing heat during rolling. As the viscosity of the rolling oil changes, if the degree to which the rolling oil is pushed into the copper foil surface changes, it leads to variations in the oil pit distribution. For example, when the rolling oil is kept at around 25 ° C.
  • a flexible printed wiring board can be produced by a conventional means using a conductor layer made of a rolled copper foil according to the present invention. Examples of the production method are shown below.
  • a copper clad laminate is manufactured by laminating a copper foil and a flexible insulating substrate.
  • the flexible insulating substrate on which the copper foil is laminated is not particularly limited as long as it has characteristics applicable to flexible printed wiring boards.
  • a resin film such as a polyester film or a polyimide film can be used. .
  • Polyimide film or polyester film and copper foil can be bonded using an epoxy or acrylic adhesive (three-layer structure).
  • a polyimide varnish (polyamic acid varnish), which is a polyimide precursor, is applied to a copper foil and heated to form an imidization or on a polyimide film.
  • a laminating method in which a thermoplastic polyimide is applied to the substrate, a copper foil is overlaid thereon, and heated and pressed.
  • an anchor coating material such as thermoplastic polyimide in advance before applying the polyimide varnish.
  • the process for producing a printed wiring board from a copper clad laminate may be performed by a method well known to those skilled in the art. For example, an etching resist is applied only to a necessary portion as a conductor pattern on the copper foil surface of the copper clad laminate, and an etching solution By spraying on the copper foil surface, the unnecessary copper foil can be removed to form a conductor pattern, and then the etching resist can be peeled and removed to expose the conductor pattern.
  • Example 1 Effect of variation in surface roughness Ra
  • Table 1 shows the surface roughness of the work roll used for only one pass immediately before the final pass and the work roll surface roughness used for the final pass in the final cold rolling.
  • the viscosity of the rolling oil used was 7.0 cSt (40 ° C.), and the temperature of the rolling oil in the final cold rolling was controlled around 40 ° C.
  • the surface roughness of the work roll was measured with a contact-type surface roughness meter according to JIS B0601: 2001.
  • the resulting rolled copper foil was fixed put on a glass plate, using a Lasertec Corporation confocal microscope HD100D, Ra avg, ⁇ Ra, RSm avg ( Example 2 only), and the measurement previously described the DerutaRSm (Example 2 only) Calculated based on the method.
  • the results are shown in Table 1.
  • the interval between the measurement points was 50 mm in the rolling direction.
  • the plate thickness of the rolled copper foil was measured according to the weight method (IPC-TM-650). An arbitrary length of 10 m in the rolling direction was selected from the obtained copper foil, and the thickness was measured at 10 points every 1 m. The plate thickness T at each measurement point was an average value measured three times. The average value of T at 10 points was T avg , the maximum value of T at 10 points was T max , and the minimum value of T at 10 points was T min . In Table 1, the larger of (T avg ⁇ T min ) / T avg and (T max ⁇ T avg ) / T avg is described as “plate thickness variation (%)”.
  • No. 1-No. No. 4 is an invention example, and the variation of the plate thickness could be suppressed to 1.3% or less.
  • No. In No. 5 since the surface roughness of one pass immediately before the final pass was large, ⁇ Ra could not be controlled sufficiently.
  • Example 6 instead of increasing the surface roughness of the work roll of one pass immediately before the final pass, the surface roughness of the work roll of the final pass was reduced, but ⁇ Ra could not be sufficiently controlled.
  • the circuit after etching was observed with a microscope from above, and the outline of the peripheral portion of the circuit was visually evaluated.
  • ⁇ When observed with a microscope, undulation is observed in half or less of the observation length of the outline of the peripheral portion of the circuit.
  • ⁇ When observed with a microscope, undulation is observed in more than half of the observation length of the outline of the peripheral portion of the circuit, but there is a portion where no undulation is observed.
  • X When observed with a microscope, the entire contour of the peripheral edge of the circuit is wavy with waviness.
  • Example 2 Effect of oil pit distribution
  • a tough pitch copper ingot After hot rolling a tough pitch copper ingot, annealing and cold rolling were repeated, and finally, cold rolling was performed to obtain a rolled copper foil (No. 7 to 12) having a set thickness of 10 ⁇ m or more in a rolling direction length of 10 m or more. Obtained.
  • the surface roughness Ra of the work roll used before the final pass was 0.010 ⁇ m
  • the work roll surface roughness Ra used for the final pass was 0.050 ⁇ m.
  • the viscosity of the rolling oil used was 7.0 cSt (40 ° C.), and in the inventive examples, the temperature of the rolling oil during the final cold rolling was adjusted to be around 40 ° C.
  • Various characteristics were evaluated in the same manner as in Example 1. The test results are shown in Table 2.
  • Invention Example No. 10 to 12 are invention example Nos. Except for controlling the temperature of the rolling oil in the final cold rolling mill. The test was carried out under the same conditions as in 7-9. Here, since the temperature of the rolling oil in the final cold rolling mill was not sufficiently controlled, the temperature rose from 40 ° C. to about 45 ° C. As a result, the distribution of oil pits could not be made uniform, and there was a case where the variation in thickness exceeded 1.2%.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Metal Rolling (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

L'invention concerne une feuille de cuivre destinée à une carte de câblage imprimée souple dont l'épaisseur présente une précision élevée. La rugosité de surface (Ra) dans la direction parallèle au laminage présente une valeur moyenne (Raavg) de 0,01 à 0,15 µm, et ΔRa=Ramax-Ramin est égal à 0,025 µm ou moins.
PCT/JP2012/073846 2011-09-21 2012-09-18 Feuille de cuivre pour carte de câblage imprimée souple WO2013042663A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020147009943A KR101522148B1 (ko) 2011-09-21 2012-09-18 플렉시블 프린트 배선판용 동박
CN201280044983.8A CN103828491B (zh) 2011-09-21 2012-09-18 挠性印刷布线板用铜箔

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-206352 2011-09-21
JP2011206352A JP5676401B2 (ja) 2011-09-21 2011-09-21 フレキシブルプリント配線板用銅箔

Publications (1)

Publication Number Publication Date
WO2013042663A1 true WO2013042663A1 (fr) 2013-03-28

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PCT/JP2012/073846 WO2013042663A1 (fr) 2011-09-21 2012-09-18 Feuille de cuivre pour carte de câblage imprimée souple

Country Status (5)

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JP (1) JP5676401B2 (fr)
KR (1) KR101522148B1 (fr)
CN (1) CN103828491B (fr)
TW (1) TWI528875B (fr)
WO (1) WO2013042663A1 (fr)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
WO2018012297A1 (fr) * 2016-07-12 2018-01-18 古河電気工業株式会社 Matériau d'alliage de cuivre laminé, procédé permettant de le produire et composant électrique/électronique

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TWI679132B (zh) * 2014-10-30 2019-12-11 日商大日本印刷股份有限公司 印刷物、使用該印刷物而成之容器、印刷物之製造方法及印刷物之選擇方法
TWI712511B (zh) * 2014-10-30 2020-12-11 日商大日本印刷股份有限公司 印刷物、使用該印刷物而成之容器、印刷物之製造方法及印刷物之選擇方法
JP6703878B2 (ja) * 2016-03-31 2020-06-03 Ｊｘ金属株式会社 チタン銅箔および、その製造方法

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JP2009164588A (ja) * 2007-12-10 2009-07-23 Furukawa Electric Co Ltd:The 表面処理銅箔及び回路基板
JP2009226435A (ja) * 2008-03-21 2009-10-08 Kobe Steel Ltd 反射異方性の少ない電子部品用銅合金板
JP2011136357A (ja) * 2009-12-28 2011-07-14 Jx Nippon Mining & Metals Corp 銅箔及びそれを用いた銅張積層板

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JPH0328389A (ja) * 1989-06-23 1991-02-06 Meiko Denshi Kogyo Kk 銅張積層板用銅箔層、その製造方法およびそれに用いるめっき浴
JP2003193211A (ja) * 2001-12-27 2003-07-09 Nippon Mining & Metals Co Ltd 銅張積層板用圧延銅箔
JP2006016690A (ja) * 2004-06-04 2006-01-19 Nikko Metal Manufacturing Co Ltd プリント配線基板用金属材料
JP2006283146A (ja) * 2005-04-01 2006-10-19 Nikko Kinzoku Kk 圧延銅箔及びその製造方法
JP2006336045A (ja) * 2005-05-31 2006-12-14 Nikko Kinzoku Kk プリント配線基板用金属材料
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JP2008248331A (ja) * 2007-03-30 2008-10-16 Nikko Kinzoku Kk 圧延銅箔
JP2009164588A (ja) * 2007-12-10 2009-07-23 Furukawa Electric Co Ltd:The 表面処理銅箔及び回路基板
JP2009226435A (ja) * 2008-03-21 2009-10-08 Kobe Steel Ltd 反射異方性の少ない電子部品用銅合金板
JP2011136357A (ja) * 2009-12-28 2011-07-14 Jx Nippon Mining & Metals Corp 銅箔及びそれを用いた銅張積層板

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018012297A1 (fr) * 2016-07-12 2018-01-18 古河電気工業株式会社 Matériau d'alliage de cuivre laminé, procédé permettant de le produire et composant électrique/électronique
JP2018009206A (ja) * 2016-07-12 2018-01-18 古河電気工業株式会社 銅合金圧延材及びその製造方法並びに電気電子部品

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CN103828491B (zh) 2016-12-21
CN103828491A (zh) 2014-05-28
KR101522148B1 (ko) 2015-05-20
TW201325333A (zh) 2013-06-16

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