WO2013027542A1 - Carte de circuit imprimé souple et procédé de production de carte de circuit imprimé souple - Google Patents

Carte de circuit imprimé souple et procédé de production de carte de circuit imprimé souple Download PDF

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Publication number
WO2013027542A1
WO2013027542A1 PCT/JP2012/069307 JP2012069307W WO2013027542A1 WO 2013027542 A1 WO2013027542 A1 WO 2013027542A1 JP 2012069307 W JP2012069307 W JP 2012069307W WO 2013027542 A1 WO2013027542 A1 WO 2013027542A1
Authority
WO
WIPO (PCT)
Prior art keywords
insulating layer
flexible printed
wiring board
printed wiring
covering region
Prior art date
Application number
PCT/JP2012/069307
Other languages
English (en)
Japanese (ja)
Inventor
上田　宏
航 野口
澄人 上原
Original Assignee
住友電工プリントサーキット株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友電工プリントサーキット株式会社 filed Critical 住友電工プリントサーキット株式会社
Priority to CN201280040897.XA priority Critical patent/CN103748975B/zh
Publication of WO2013027542A1 publication Critical patent/WO2013027542A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0594—Insulating resist or coating with special shaped edges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Definitions

  • the present invention solves the above-described conventional problems and designs the end face shape of the insulating layer made of a photosensitive resin in consideration of the relationship with the circuit direction of the wiring circuit (laying direction of the wiring circuit). Accordingly, the flexible printed wiring board and the method for manufacturing the flexible printed wiring board can effectively prevent the occurrence of coating defects such as cracks in the region where the insulating layer is formed in the manufacturing stage of the flexible printed wiring board. Offering is an issue.
  • the intersection angle is not less than 15 degrees and less than 90 degrees. It is possible to effectively prevent the occurrence of coating defects such as cracks in the region where the insulating layer is formed. Therefore, it is possible to obtain a flexible printed wiring board with higher production efficiency and better yield.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

La présente invention a trait à une carte de circuit imprimé souple (10) qui comprend une couche de substrat (11), un circuit de câblage (12a) et une couche isolante (13) comprenant une résine photosensible, et qui est dotée d'une région recouverte d'une couche isolante (Q1), qui est recouverte par la couche isolante (13), et d'une région non recouverte d'une couche isolante (Q2), qui n'est pas recouverte par la couche isolante (13). Lorsqu'ils sont vus dans la direction perpendiculaire à la surface (H) de la carte de circuit imprimé souple (10), les angles d'intersection (A1-A4) des intersections de la ligne limite (K1) entre la région recouverte d'une couche isolante (Q1) et la région non recouverte d'une couche isolante (Q2) et la ligne (T2) représentant la surface latérale (12a-1) du circuit de câblage (12a) recouvert par la région recouverte d'une couche isolante (Q1) sont formés de manière à obtenir des angles aigus.
PCT/JP2012/069307 2011-08-23 2012-07-30 Carte de circuit imprimé souple et procédé de production de carte de circuit imprimé souple WO2013027542A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201280040897.XA CN103748975B (zh) 2011-08-23 2012-07-30 挠性印刷配线板及该挠性印刷配线板的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011181133A JP5703525B2 (ja) 2011-08-23 2011-08-23 フレキシブルプリント配線板及び該フレキシブルプリント配線板の製造方法
JP2011-181133 2011-08-23

Publications (1)

Publication Number Publication Date
WO2013027542A1 true WO2013027542A1 (fr) 2013-02-28

Family

ID=47746293

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/069307 WO2013027542A1 (fr) 2011-08-23 2012-07-30 Carte de circuit imprimé souple et procédé de production de carte de circuit imprimé souple

Country Status (3)

Country Link
JP (1) JP5703525B2 (fr)
CN (1) CN103748975B (fr)
WO (1) WO2013027542A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106536384B (zh) * 2014-07-04 2019-12-20 盖茨优霓塔亚洲有限公司 多功能带
CN106918938B (zh) * 2017-04-28 2020-06-16 上海中航光电子有限公司 一种显示基板、其制作方法及显示装置
JP6959066B2 (ja) * 2017-08-14 2021-11-02 住友電気工業株式会社 フレキシブルプリント配線板
WO2020175476A1 (fr) * 2019-02-27 2020-09-03 住友電工プリントサーキット株式会社 Carte de circuit imprimé et procédé de fabrication de carte de circuit imprimé
CN117337617A (zh) * 2021-06-09 2024-01-02 三菱电机株式会社 柔性印刷基板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03230595A (ja) * 1990-02-05 1991-10-14 Nitto Denko Corp フレキシブルプリント基板
JPH04121777U (ja) * 1991-04-19 1992-10-30 信越ポリマー株式会社 フレキシブルプリント回路基板
JP2006073761A (ja) * 2004-09-01 2006-03-16 Nitto Denko Corp 配線回路基板
WO2008059571A1 (fr) * 2006-11-15 2008-05-22 Panasonic Corporation Structure de connexion de carte de circuit imprimé et carte de circuit imprimé

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4063533B2 (ja) * 2001-12-10 2008-03-19 日本碍子株式会社 フレキシブル配線板
JP2005268593A (ja) 2004-03-19 2005-09-29 Fujikura Ltd プリント配線板およびその製造方法
JP2007279489A (ja) 2006-04-10 2007-10-25 Hitachi Chem Co Ltd 感光性樹脂組成物、レジストパターンの製造方法、フレキシブル基板及び電子部品

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03230595A (ja) * 1990-02-05 1991-10-14 Nitto Denko Corp フレキシブルプリント基板
JPH04121777U (ja) * 1991-04-19 1992-10-30 信越ポリマー株式会社 フレキシブルプリント回路基板
JP2006073761A (ja) * 2004-09-01 2006-03-16 Nitto Denko Corp 配線回路基板
WO2008059571A1 (fr) * 2006-11-15 2008-05-22 Panasonic Corporation Structure de connexion de carte de circuit imprimé et carte de circuit imprimé

Also Published As

Publication number Publication date
JP2013045818A (ja) 2013-03-04
JP5703525B2 (ja) 2015-04-22
CN103748975B (zh) 2016-08-24
CN103748975A (zh) 2014-04-23

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