WO2013018240A1 - ランプ - Google Patents
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- Publication number
- WO2013018240A1 WO2013018240A1 PCT/JP2012/000490 JP2012000490W WO2013018240A1 WO 2013018240 A1 WO2013018240 A1 WO 2013018240A1 JP 2012000490 W JP2012000490 W JP 2012000490W WO 2013018240 A1 WO2013018240 A1 WO 2013018240A1
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- WO
- WIPO (PCT)
- Prior art keywords
- base
- lamp
- insulating member
- wall
- receiving terminal
- Prior art date
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
- F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the present invention relates to a lamp using a semiconductor light emitting module such as an LED module as a light source, and more particularly to a connection structure between a semiconductor light emitting module and a circuit unit.
- a semiconductor light emitting module such as an LED module as a light source
- a lamp 900 shown in FIG. 12 which is an example of a conventional lamp has a structure in which an LED module 902 is mounted on the upper surface of a base 901 and a circuit unit 903 is disposed below the base 901.
- the electrical connection between the circuit unit 902 and the circuit unit 903 leads the electric wires 904 and 905 of the circuit unit 903 to the upper side of the base 901 through the through holes 906 and 907 provided in the base 901, and the LED This is performed by connecting to the power receiving terminal of the module 902.
- a so-called covered wire in which the surface of a lead is covered with an insulating covering layer such as a resin is used as the electric wires 904 and 905, and thereby insulation with the base 901 formed of a metal such as aluminum is performed. Is planned.
- the electric wires 904 and 905 be wired so as not to bend as much as possible, but if doing so, the electric wires 904 and 905 easily come in contact with the base 901. In particular, the electrical wires 904 and 905 easily come in contact with the upper peripheral edge portions 908 and 909 of the through holes 906 and 907 in the base 901.
- the base 901 at the time of lamp lighting becomes relatively high temperature due to the heat generation of the LED module 902, when the electric wires 904 and 905 are in contact with the base 901, the insulating coating layer is melted and the electric wire 904, The 905 may be damaged. Although such breakage may lead to disconnection of the electrical wires 904 and 905, it has recently become clear that the disconnection of the electrical wires 904 and 905 is one of the major causes of the reduction in lamp life.
- an object of the present invention is to provide a lamp in which the electrical wiring of the circuit unit connected to the semiconductor light emitting module is not easily damaged.
- a lamp according to the present invention comprises a semiconductor light emitting module as a light source, a base on which the semiconductor light emitting module is mounted, a circuit unit disposed below the base, the base, and the circuit unit And an electric wire of the circuit unit is led out to the upper side of the base through the penetration parts respectively provided in the base and the insulating member; It is a lamp connected to a power receiving terminal, and the wall part which penetrates the penetration part of the above-mentioned pedestal from the upper surface of the above-mentioned insulating member, and whose upper end projects above the upper surface of the above-mentioned pedestal is It extends so as to be interposed between the penetrating portion and the power receiving terminal of the semiconductor light emitting module, and the electrical wiring crosses the wall portion and is connected to the power receiving terminal.
- the wall portion which penetrates the penetration portion of the base and the upper end portion protrudes upward relative to the upper surface of the base is between the penetration portion of the insulating member and the power receiving terminal of the semiconductor light emitting module Since it intervenes and the electrical wiring passes over the wall and is connected to the power receiving terminal, the electrical wiring does not easily come in contact with the upper peripheral edge portion of the through portion in the base. Therefore, the electrical wiring is less likely to be damaged by the heat of the base, and the lamp life is less likely to be reduced due to the disconnection of the electrical wiring.
- Sectional view showing a lamp according to the present embodiment Sectional view showing a lamp according to the present embodiment Top view showing the lamp with the glove removed Perspective view of the lamp with the glove removed
- An enlarged sectional view showing a portion surrounded by a two-dot chain line in FIG. 1 A plan view for explaining an aspect of a penetration portion, a wall portion and an electrical wiring Top view for explaining a wall according to a modification
- Sectional drawing for demonstrating the wall part which concerns on a modification The perspective view for demonstrating the LED module which concerns on a modification Top view for explaining an LED module according to a modification
- FIG. 1 and 2 are cross-sectional views showing a lamp according to the present embodiment.
- FIG. 3 is a plan view showing the lamp with the glove removed. 1 is a cross-sectional view taken along the line AA in FIG. 3, and FIG. 2 is a cross-sectional view taken along the line BB in FIG.
- the lamp 1 is a so-called ball bulb-shaped G-shaped lamp, and an LED module 10 as a light source and the LED module 10 are mounted on the upper surface 21 Base 20, the globe 30 covering the upper side of the LED module 10, the circuit unit 40 disposed below the base 20, the base 50 electrically connected to the circuit unit 40, and the circuit unit 40. And a case 70 covering the side surfaces of the base 20 and the circuit holder 60, and an insulating member 80 disposed between the base 20 and the circuit unit 40.
- the LED module 10 includes, for example, a substantially square plate-shaped mounting substrate 11, a plurality of substantially rectangular LED 12 mounted on the upper surface of the mounting substrate 11, and a plurality of lengths covering the LEDs 12. And a sealing member 13.
- the LED 12 is preferably mounted on the upper surface of the mounting substrate 11 using COB (Chip on Board) technology, but may be mounted using an SMD (Surface Mount Device) type.
- COB Chip on Board
- SMD Surface Mount Device
- the semiconductor light emitting element may be, for example, an LD (laser diode) or an EL element (electric luminescence element) Also good.
- the mounting substrate 11 is, for example, a metal base substrate composed of a resin plate and a metal plate, and a power receiving terminal 14 for receiving power for driving the LED 12 is provided on the top surface.
- Each of the LEDs 12 is, for example, a blue-emitting GaN-based LED, and 25 LEDs are arranged in a matrix of 5 columns and 5 rows.
- Each sealing member 13 is formed of, for example, a transparent silicone resin mixed with phosphor particles for converting blue light into yellow light, and each set of five sealing members 13 arranged in five rows is one set The element rows of the LED 12 configured by the above are individually sealed one by one.
- the mounting substrate 11 is not limited to a metal base substrate, and may be an existing mounting substrate other than a metal base substrate, such as a resin substrate or a ceramic substrate.
- the LED 12 and the sealing member 13 are not limited to a GaN-based LED that emits blue light and a sealing member that converts blue light to yellow light, and a sealing member that performs other wavelength conversion of LEDs of other luminescent colors It may be
- the wavelength conversion material does not necessarily have to be mixed in the sealing member, and white light is mixed by using three types of LEDs, that is, blue light emission, red light emission, and green light emission. If so, mixing of the wavelength conversion material is not necessary.
- a wavelength conversion layer may be formed on the surface of the sealing member, or a wavelength conversion layer may be formed on the inner surface 33 of the globe 30.
- the base 20 has, for example, a substantially disc shape and is disposed to close the opening of the glove 30.
- the LED module 10 is mounted substantially at the center of the upper surface 21 which is the main surface on the glove 30 side. There is. As shown in FIG. 2, when the LED module 10 is attached to the base 20, for example, a screw 15 penetrating through a through hole 11 a provided in the mounting substrate 11 of the LED module 10 is attached to the upper surface 21 of the base 20. It is performed by screwing into the provided screw holes 21a.
- the LED module 10 may be attached to the base 20 using an adhesive or an engagement structure.
- a substantially annular groove 22 is provided on the upper surface 21 of the base 20 so as to surround the LED module 10, and as shown in FIG. 2, the base 20 and the globe 30
- the adhesive is bonded by the adhesive 90 filled in the groove 22.
- the groove width of the groove 22 gradually widens upward as it goes upward, and the opening side end 31 of the glove 30 can be easily inserted into the groove 22.
- FIG. 4 is a perspective view showing the lamp with the glove removed.
- recesses 23 are provided on the wall surface 22a of the groove 22 at four locations (two of which are visible in FIG. 4) at equal intervals along the circumferential direction of the wall surface 22a.
- a part of the adhesive 90 is in the recess 23. Therefore, even if a force is applied to pull out the opening-side end 31 together with the adhesive 90 from the base 20, the portion of the adhesive 90 which has entered the recess 23 is caught on the base 20, and the glove 30 is obtained by the anchor effect. Falling off is prevented.
- a hole 25 communicating with the recess 23 is provided on the lower surface 24 of the base 20, and when the adhesive 90 enters the recess 23, the air in the recess 23 passes from the hole 25 to the base 20. The adhesive 90 easily enters the recess 23 because the adhesive 90 is pulled downward.
- each of the through parts 26 is a slit shape which is cut inward from the side surface 27 of the base 20, and in a plan view, the through parts 26 are the lamp axes J (the rotation axis when screwing the lamp 1 into the socket 1 and 2 are also provided on the same imaginary straight line L passing through.
- the lower side region of the side surface 27 of the base 20 has a tapered surface in accordance with the shape of the inner surface 75 of the main body portion 71 of the case 70. Therefore, the side surface 27 of the base 20 and the inner surface 75 of the case 70 are in surface contact over a wide range, and the heat of the base 20 is easily conducted to the case 70.
- the heat generated by the LED 12 is conducted mainly to the base 50 via the base 20 and the case 70 and further to the base 50 via the circuit holder 60, and from the base 50 to a wall or ceiling via a lighting fixture (not shown) Heat is dissipated.
- the substantially square mounting substrate 11 is attached to the upper surface 21 of the base 20 in a posture inclined with respect to the imaginary straight line L, whereby the pair of long sides of the mounting substrate 11 is also a pair. All short sides are also inclined at an angle with respect to the imaginary straight line L.
- the angle inclined with respect to the virtual straight line L is neither perpendicular nor parallel to the virtual straight line L, that is, an angle of more than 0 ° and less than 90 °.
- the connector 45 is also at an angle inclined with respect to the virtual straight line L.
- the extension base end 44 a is also inclined at an angle with respect to the imaginary straight line L.
- the two-dot chain line M shown in FIG. 3 is a line overlapping the extension base end 44 a of the electric wiring 44, but the two-dot chain line M is also inclined at an angle with respect to the virtual straight line L.
- the angle ⁇ between the imaginary straight line L and the two-dot chain line M is preferably more than 0 ° and not more than 75 °.
- the globe 30 is a G-shaped lamp having a substantially cylindrical opening end 31 and a substantially spherical portion 32 extending above the opening end 31.
- a light diffusion film (not shown) for improving light distribution characteristics is formed on the inner surface 33 of the spherical portion 32.
- the globe 30 is not limited to the shape for the G-shaped lamp, and may have another shape such as the shape for the A-shaped lamp.
- the circuit unit 40 includes, for example, a circuit board 41 having a substantially disk shape and various electronic components 42 and 43 mounted on the circuit board 41 to cause the LED module 10 to emit light.
- the circuit holder 60 and the insulating member 80 It is housed in the space enclosed by. There are electronic components other than those with reference numerals "42" and "43".
- each electric wire 44 on the output side of the circuit unit 40 is electrically connected to the power receiving terminal 14 of the LED module 10. Specifically, each electric wire 44 is led out above the base 20 through the through portion 84 provided in the insulating member 80 and the through portion 26 provided in the base 20. It connects with the receiving terminal 14 of the LED module 10 using the connector 45 attached to the front-end
- Each electrical wiring 44 is, for example, a lead wire covered with an insulating covering layer such as a resin.
- the electric wires 46 and 47 on the input side of the circuit unit 40 are electrically connected to the base 50.
- the electrical wiring 46 is drawn out of the through hole 63 provided in the small diameter portion 62 of the circuit holder 60 to the outside of the circuit holder 60, and is connected to the shell portion 51 of the base 50.
- the electrical wiring 47 is drawn out of the lower side opening 64 of the small diameter portion 62 of the circuit holder 60 to the outside of the circuit holder 60, and is connected to the eyelet portion 52 of the base 50.
- Each of the electric wires 46 and 47 is, for example, a lead wire covered with an insulating covering layer of resin or the like.
- the base 50 is a so-called Edison-type base and is for receiving power from the socket of the lighting apparatus when the LED lamp 1 is attached to the lighting apparatus and turned on, and is cylindrical and has a circumferential shape. It has a shell portion 51 whose surface is an external thread, and an eyelet portion 52 attached to the shell portion 51 via an insulating material 53.
- the base 50 is not limited to the Edison type, and may be, for example, a pin type (specifically, a G type such as GY or GX).
- the circuit holder 60 has, for example, a substantially cylindrical shape with both sides open, and is configured of a large diameter portion 61 located on the upper side and a small diameter portion 62 located on the lower side. Most are housed.
- the base 50 is externally fitted to the small diameter portion 62, whereby the lower side opening 64 of the circuit holder 60 is closed.
- the circuit holder 60 is preferably made of, for example, an insulating material such as a resin.
- An insulating member 80 is attached to the large diameter portion 61 of the circuit holder 60 so as to close the upper opening, and in the attached state, the plurality of ribs 65 provided on the inner surface of the large diameter portion 61 and the insulating member
- the circuit board 41 is held by the plurality of ribs 80 a provided on the inner surface of the circuit board 80, and the circuit unit 40 is held.
- the method of holding the circuit unit 40 may be, for example, a method using a screw, an adhesive, an engagement structure, or the like, or a method combining a plurality of methods.
- the case 70 has, for example, a cylindrical shape with both ends opened and reduced in diameter from the upper side, and is externally fitted to the base 20 and the large diameter portion 61 of the circuit holder 60.
- the main body 71 has an extension 72 extending from the main body 71 so as to protrude above the outer peripheral edge of the upper surface 21 of the base 20.
- the opening side end portion 31 of the globe 30, most of the circuit unit 40 and the insulating member 80 are accommodated.
- the case 70 is made of, for example, a metal material.
- the metal material include Al, Ag, Au, Ni, Rh, Pd, an alloy of two or more of them, or an alloy of Cu and Ag.
- Such a metal material has good thermal conductivity, so that the heat conducted to the case 70 can be efficiently conducted to the base 50 side.
- the material of case 70 is not limited to a metal, For example, resin etc. with high heat conductivity may be sufficient.
- the case 70 is attached to the base 20 by caulking. Specifically, as shown in FIG. 3, a plurality of recessed portions 28 provided at intervals along the circumferential direction on the side surface 27 of the base 20 are provided. It is attached by forming the caulking part 73 in the position corresponding to these recessed parts 28 using.
- the extension portion 72 of the case 70 protrudes above the outer peripheral edge of the top surface 21 of the base 20 and is in contact with the outer surface 34 of the glove 30.
- the adhesive 90 protruding is a space 74 surrounded by the base 20, the glove 30 and the case 70. Since it is contained inside and does not leak outside the case 70, the design of the lamp 1 is not impaired by the leaked adhesive 90.
- the glove 30 and the base 20, or the glove 30 and the case 70 may be bonded together with the adhesive 90 that has run out into the space 74.
- the light distribution characteristics of the lamp 1 can be improved because the extending portion 72 can cover the portion of the globe 30 where light unevenness easily occurs, that is, the boundary between the spherical portion 32 and the opening side end portion 31.
- the insulating member 80 has a bottomed cylindrical shape including a substantially cylindrical tube portion 81 and a substantially disc-like lid portion 82 closing the upper opening of the tube portion 81, and the lower surface of the base 20 It is fitted into a substantially cylindrical recess 29 provided substantially at the center of the reference numeral 24.
- the outer diameter of the cylindrical portion 81 is slightly smaller than the inner diameter of the recess 29 of the base 20, but the outer peripheral surface of the cylindrical portion 81 is provided with a plurality of ribs 81a at intervals in the circumferential direction.
- the insulating member 80 is formed of an insulating material such as resin, and mainly insulates the base 20 located above and the circuit unit 40 located below from the lid portion 82. As shown in FIG. 3, the upper surface of lid 82 (also upper surface 80b of insulating member 80) is made to correspond to the position of a pair of penetrating portions 26 of base 20, more specifically, the base in a plan view. Protrusions 83, penetrations 84 and walls 85 are provided in pairs so as to be located in penetrations 26 of platform 20.
- Each protrusion 83 has a substantially cylindrical shape, and the diameter thereof is slightly smaller than the slit width of the penetration portion 26 of the base 20.
- FIG. 5 is an enlarged sectional view showing a portion surrounded by a two-dot chain line in FIG.
- each through portion 84 is a through hole penetrating the lid 82 in the vertical direction, and is disposed closer to the LED module 10 (the lamp axis J side) than the protrusion 83, When connecting the wiring 44 to the LED module 10, the protrusion 83 does not get in the way.
- the penetration part 84 is not limited to the penetration hole which penetrates the cover part 82 in the up-down direction, It may be a slit which penetrates the cover part 82 in the up-down direction. The shape of the through hole or the slit is arbitrary.
- Each wall portion 85 extends upward from the upper surface 80 b of the insulating member 80, penetrates the penetration portion 26 of the base 20, and the upper end portion protrudes above the upper surface 21 of the base 20. More strictly, the height level H1 of the upper end portion of the wall 85 is higher than the height level H2 of the upper surface 21 of the base 20.
- Each wall portion 85 is disposed closer to the LED module 10 (the lamp axis J side) than the penetrating portion 84, and is interposed between the penetrating portion 84 and the power receiving terminal 14 of the LED module 10. Then, the electrical wiring 44 is connected to the power receiving terminal 14 so as to pass over the wall 85. Therefore, in the portion of the electrical wiring 44 leading out from the through portion 84 and going over the wall portion 85, the wall portion 85 interposed between them prevents the contact with the base 20. On the other hand, the portion of electric wiring 44 from passing over wall portion 85 to reaching power receiving terminal 14 extends from the upper end portion of wall portion 85 to the power receiving terminal 14 across the air to reach power receiving terminal 14. It is difficult to contact the upper surface 21 of the base 20 located below.
- the electric wiring 44 is hard to contact the base 20, the heat of the base 20 is not easily conducted to the electric wiring 44, and the base 20 has a relatively high temperature due to the heat generation of the LED module 10 when the lamp is lit Even in the case where the electric wiring 44 is formed, the electric wiring 44 is hard to be damaged by the influence of heat. In addition, since the surface of the electrical wiring 44 is not scratched by the contact with the base 20, the electrical wiring 44 is also less likely to be damaged by this.
- FIG. 6 is a plan view for explaining an aspect of the penetration portion, the wall portion, and the electrical wiring.
- the wall 85 is a plate having a U-shape in plan view, and a half arc-shaped bent portion 85 a bent along the upper outer periphery of the penetrating portion 84 of the insulating member 80 and the bent portion It has a pair of linear extending portions 85b and 85c extending from both ends of 85a.
- the electrical wiring 44 passes over the bent portion 85a, and the bent shape of the bent portion 85a makes it difficult for the electric wire 44 to be misaligned from the overriding position. Furthermore, since the extending portions 85b and 85c are provided at both ends of the bending portion 85a, the electric wiring 44 can not easily be detached from the wall 85 even when the electric wiring 44 is displaced from the bending portion 85a Hard to touch stand 20.
- FIG. 7 is a plan view for explaining a wall according to a modification.
- a wall 185 as shown in FIG. 7A may be employed instead of the wall 85.
- the wall portion 185 is a plate having a U-shape in plan view, and has a semicircular arc bent portion 185a bent along the upper outer periphery of the penetrating portion 84, and a pair of straight lines extending from both ends of the bent portion 185a.
- the extension parts 185b and 185c extend beyond the penetration part 84, and the penetration part 84 is disposed between the extension parts 185b and 185c. With such a configuration, the electrical wiring 44 is more unlikely to come off the wall 185, and the electrical wiring 44 is less likely to contact the base 20.
- a wall portion 285 as shown in FIG. 7B may be employed instead of the wall portion 85.
- the wall portion 285 has a plate shape of a C shape in plan view, has an arc-shaped bent portion 285a bent along the upper outer periphery of the penetrating portion 284 and corresponds to the extended portions 85b and 85c of the wall portion 85. There is no part.
- the central angle (180 ° to 270 °) of the bent portion 285a is equal to or greater than the central angle (about 180 °) of the bent portion 85a of the wall 85, and covers most of the outer periphery of the upper end of the penetrating portion 284.
- the wall according to the present invention is not limited to a U-shape in plan view or a C-shape in plan view, and may have any shape, for example, an electric wiring 44 such as a V-shape in plan view or a U-shape in plan view. It is preferable that the shape is difficult to be displaced.
- a gap is provided between the inner surface 26 a of the through portion 26 and the wall 85, and the wall 85 is not in contact with the base 20. Therefore, it is difficult for the heat of the base 20 to be conducted to the wall portion 85, and the wall portion 85 is repeatedly expanded and contracted under the influence of the heat from the base 20, and it is hard to break. Therefore, the possibility of the electrical wiring 44 and the base 20 coming into contact with each other due to the cracking of the wall portion 85 hardly occurs.
- the wall portion 85 has a plate shape, it is less likely to break than when the wall portion is cylindrical. That is, for example, as shown in FIG. 7B, if the wall 285 is a plate having a C shape in plan view, even if the wall 285 thermally expands in the direction of the arrow, the planar view of the wall 285 Since there is a gap 285c between the end portions 285a and 285b, stress can be released by the gap 285c. However, if the wall portion is a tubular shape having an O-shape in plan view, there is no gap through which the stress escapes, so the stress may remain in the wall portion and the wall portion may be damaged.
- a portion of the wall 85 over which the electric wiring 44 passes that is, a bent portion 85 a is present at a height level closer to the upper surface 21 of the base 20 than the power receiving terminal 14 of the LED module 10. That is, the height level H1 of the upper end of the bent portion 85a is lower than the height level H3 of the lower end of the power receiving terminal 14 of the LED module 10 of the base 20 (the same as the height level of the upper surface of the mounting substrate 11). Therefore, the portion of the electrical wiring 44 after passing over the wall portion 85 extends in the direction away from the upper surface 21 of the base 20 and is connected to the power receiving terminal 14, so the electrical wiring 44 does not easily contact the base 20.
- FIG. 8 is a perspective view for explaining a wall according to a modification.
- FIG. 9 is an enlarged cross-sectional view for explaining a wall according to a modification.
- the insulating member 380 according to the modification shown in FIG. 8 is different from the insulating member 80 according to the present embodiment only in the wall portion 385.
- the wall portion 385 is a flat plate having a U shape in plan view, and a bent portion 385a bent along the upper outer periphery of the penetrating portion 84 of the insulating member 380, and a pair of extensions extending from both ends of the bent portion 385a.
- a concave portion 385d is provided at the upper end of the bent portion 385a.
- the electrical wiring 44 passes over the bent portion 385a in a state of being fitted into the recess 385d. With such a configuration, the electrical wiring 44 is less likely to be misaligned.
- the electric wiring 44 is mounted on the base 20.
- the electric wiring 44 is less likely to contact the base 20.
- the height level H5 of the highest portion of the recess 385d is higher than the height level H3 of the power receiving terminal 14, the electrical wiring 44 is not easily removed from the recess 385d.
- the lamp concerning the present invention was concretely explained based on an embodiment, the lamp concerning the present invention is not limited to the above-mentioned embodiment, In the range which does not deviate from the technical idea of the present invention suitably It may be modified.
- the materials, numerical values, and the like in the above-described embodiment merely exemplify preferable ones, and the present invention is not limited thereto.
- the structure of the package of the LED may be any structure such as a shell type, a surface mounted device (SMD) type, a chip on board (COB) type, or a power LED type.
- SMD surface mounted device
- COB chip on board
- the LED module may have the following configuration.
- FIG. 10 is a perspective view for explaining an LED module according to a modification.
- FIG. 11 is a plan view for explaining an LED module according to a modification. 10 shows the lamp in a state in which the globe is removed and the screws for fixing the LED module are also removed, and
- FIG. 11 shows the lamp in a state in which the fixing member for fixing the LED module is also removed.
- the lamp according to the modification differs from the lamp 1 according to the above-described embodiment in the configuration of the LED module and the mounting structure of the LED module.
- the other points are basically the same as those of the lamp 1 according to the above-described embodiment, and therefore the description thereof is omitted.
- symbol same as the said embodiment is used as it is.
- the LED module 110 is mounted at the center of the upper surface of the base 20, and as shown in FIG. 11, for example, a substantially square plate mounting substrate 111 and mounting substrate 111. And a plurality of LEDs (not shown) mounted on the upper surface of the upper and the sealing member 113 covering the LEDs.
- the mounting substrate 111 is, for example, a metal base substrate consisting of a resin plate and a metal plate, and on the top surface, for example, a total of 72 GaN-based LEDs emitting blue light are arranged in a matrix of 12 rows and 6 rows. It is done.
- the sealing member 113 is formed of, for example, a transparent silicone resin mixed with phosphor particles for converting blue light into yellow light, and connects the pair of elongated frame portions 113a and the frame portions 113a. Twelve LEDs are respectively sealed in six case parts 113b arranged in equal intervals in a ladder shape including a plurality of long case parts 113b and 113c.
- the LED is sealed only in the six case parts 113b located near the center of the mounting substrate 111, and other case parts 113c and a pair of case parts The LED is not sealed in the frame portion 113a.
- a connector 45 attached to the tip of the electrical wiring 44 of the circuit unit 40 is connected to the LED module 110, and an annular fixing member 114 is placed from above the LED module 110 and the connector 45 as shown in FIG.
- the LED module 110 is screwed to the base 20 together with the fixing member 114.
- the fixing member 114 is provided with a through hole 115 at a position communicating with the screw hole 21 a of the base 20, and a screw is penetrated through the through hole 115 and further screwed into the screw hole 21 a of the base 20. 110 is fixed.
- the substantially square mounting substrate 111 is attached to the upper surface 21 of the base 20 in a posture inclined with respect to the imaginary straight line L, and the connector 45 is also Since the angle is inclined with respect to the virtual straight line L, the electric wiring 44 is hard to break as in the case of the lamp 1 according to the above-described embodiment.
- the present invention is applicable to LED lamps in general.
Abstract
Description
以下、本実施の形態に係るランプについて、図面を参照しながら説明する。図1および図2は、本実施の形態に係るランプを示す断面図である。図3は、グローブを外した状態のランプを示す平面図である。なお、図1は、図3におけるA-A線に沿った断面図、図2は、図3におけるB-B線に沿った断面図である。
図1および図2に示すように、本実施の形態に係るランプ1は、所謂ボール電球形であるG形のランプであって、光源としてのLEDモジュール10と、LEDモジュール10が上面21に搭載された基台20と、LEDモジュール10の上方を覆うグローブ30と、前記基台20の下方に配置された回路ユニット40と、回路ユニット40と電気的に接続された口金50と、回路ユニット40が収容された回路ホルダ60と、基台20および回路ホルダ60の側面を覆うケース70と、基台20と回路ユニット40との間に配置された絶縁部材80と、を備える。
図3に示すように、LEDモジュール10は、例えば、略方形板状の実装基板11と、実装基板11の上面に実装された複数の略直方体形状のLED12と、それらLED12を被覆する複数の長尺状の封止部材13とを有する。LED12は、実装基板11の上面にCOB(Chip on Board)技術を用いて実装されたものが好ましいが、SMD(Surface Mount Device)型のものを用いて実装されたものであっても良い。なお、本実施の形態では、半導体発光素子としてLEDを利用する例について説明するが、半導体発光素子は、例えば、LD(レーザダイオード)であっても良く、EL素子(エレクトリックルミネッセンス素子)であっても良い。
基台20は、たとえば、略円板状であって、グローブ30の開口を塞ぐように配置されており、グローブ30側の主面である上面21の略中央に、LEDモジュール10が搭載されている。図2に示すように、LEDモジュール10の基台20への取り付けは、例えば、LEDモジュール10の実装基板11に設けられた貫通孔11aに貫通させたねじ15を、基台20の上面21に設けられたネジ穴21aにねじ込むことによって行なわれている。なお、LEDモジュール10は、接着剤や係合構造を利用して基台20に取り付けられていても良い。
図1および図2に示すように、グローブ30は、略円筒状の開口側端部31と、開口側端部31の上側に延設された略球状の球状部32とを有するG形のランプ用の形状であって、球状部32の内面33には、配光特性を改善するための光拡散膜(不図示)が形成されている。なお、グローブ30は、G形のランプ用の形状に限定されず、A形のランプ用の形状など他の形状であっても良い。
回路ユニット40は、LEDモジュール10を発光させるため例えば略円板状の回路基板41と、回路基板41に実装された各種の電子部品42,43とを有し、回路ホルダ60と絶縁部材80とで囲まれた空間内に収容されている。なお、電子部品は、符号「42」、「43」を付したもの以外も存在する。
口金50は、所謂エジソンタイプの口金であって、LEDランプ1が照明器具に取着されて点灯された際に、照明器具のソケットから電力を受けるためのものであり、筒状であって周面が雄ねじとなっているシェル部51と、シェル部51に絶縁材料53を介して装着されたアイレット部52とを有する。なお、口金50は、エジソンタイプに限定されず、例えば、ピンタイプ(具体的にはGY、GX等のGタイプ)であっても良い。
回路ホルダ60は、例えば、両側が開口した略円筒形状であって、上方側に位置する大径部61と下方側に位置する小径部62とで構成され、大径部61に回路ユニット40の大半が収容されている。一方、小径部62には、口金50が外嵌されおり、これによって回路ホルダ60の下方側開口64が塞がれている。回路ホルダ60は、例えば、樹脂などの絶縁性材料で形成されていることが好ましい。
図1および図2に示すように、ケース70は、例えば、両端が開口し上方から下方へ向けて縮径した円筒形状であって、基台20および回路ホルダ60の大径部61に外嵌された本体部71と、基台20の上面21における外周縁よりも上方に迫り出すように本体部71から延出した延出部72とを有する。本体部71内には、基台20と回路ホルダ60の大径部61の他、グローブ30の開口側端部31、回路ユニット40の大部分および絶縁部材80が収容されている。
絶縁部材80は、略円筒状の筒部81と、当該筒部81の上方側開口を塞ぐ略円板状の蓋部82とで構成される有底筒状であって、基台20の下面24の略中央に設けられた略円柱状の凹部29内に嵌め込まれている。筒部81の外径は基台20の凹部29の内径よりも僅かに小さいが、筒部81の外周面には周方向に間隔を空けて複数のリブ81aが設けられているため、絶縁部材80を凹部29に嵌め込むと、それらリブ81aが凹部29の内壁に当たって絶縁部材80は凹部29に圧入された状態となる。
以上、本発明に係るランプを実施の形態に基づいて具体的に説明してきたが、本発明に係るランプは、上記実施の形態に限定されず、本発明の技術的思想を逸脱しない範囲で適宜変更を加えたものであっても良い。例えば、上記実施の形態における材料、数値等は好ましいものを例示したに過ぎず、それらに限定されるものではない。
10 半導体発光モジュール
14 受電端子
20 基台
21 上面
26 貫通部
26a 貫通孔の内面
27 貫通孔の側面
40 回路ユニット
44 電気配線
80 絶縁部材
80a 絶縁部材の上面
84 貫通部
85,185,285,385 壁部
85a,185a,385a 屈曲部分
85b,85c、185b,185c,385b,385c 延出部分
385d 凹部
Claims (7)
- 光源としての半導体発光モジュールと、当該半導体発光モジュールが上面に搭載された基台と、当該基台の下方に配置された回路ユニットと、前記基台と前記回路ユニットとの間に配置された絶縁部材とを備え、前記回路ユニットの電気配線を、前記基台および絶縁部材にそれぞれ設けられた貫通部を介して前記基台の上方に導出させ、前記半導体発光モジュールの受電端子に接続したランプであって、
前記絶縁部材の上面からは、前記基台の貫通部を貫通し且つ上端部が前記基台の上面よりも上方に突出する壁部が、前記絶縁部材の貫通部と前記半導体発光モジュールの受電端子との間に介在するよう延出しており、前記電気配線は、前記壁部を乗り越えて前記受電端子に接続されていることを特徴とすることを特徴とするランプ。 - 前記基台の貫通孔の内面と前記壁部との間には隙間が設けられていることを特徴とする請求項1記載のランプ。
- 前記壁部は前記絶縁部材の貫通部の上端外周に沿って屈曲した屈曲部分を有し、前記電気配線は前記屈曲部を乗り越えて前記受電端子に接続されていることを特徴とする請求項1または2に記載のランプ。
- 前記壁部は、平面視U字形の板状であって、半円弧状の前記屈曲部分と当該屈曲部分の両端から延出した一対の直線状の延出部分とを有し、前記一対の延出部分間に前記絶縁部材の貫通部が配置されていることを特徴とする請求項3記載のランプ。
- 前記基台の貫通部は、前記基台の側面から内側に向けて切り込まれたスリット状であることを特徴とする請求項1から4のいずれかに記載のランプ。
- 前記壁部における前記電気配線が乗り越える部分は、前記半導体発光モジュールの受電端子よりも前記基台の上面に近い高さレベルに存在することを特徴とする請求項1から5のいずれかに記載のランプ。
- 前記壁部の上端部には凹部が設けられており、前記電気配線は前記凹部に嵌まり込んだ状態で前記壁部を乗り越えていることを特徴とする請求項1から6のいずれかに記載のランプ。
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JP2014207112A (ja) * | 2013-04-12 | 2014-10-30 | パナソニック株式会社 | 照明器具 |
JP2014222632A (ja) * | 2013-05-14 | 2014-11-27 | パナソニック株式会社 | ランプ |
JP2015185390A (ja) * | 2014-03-24 | 2015-10-22 | 東芝ライテック株式会社 | ランプ装置および照明器具 |
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