Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D8/00—Diodes
  • H10D8/60—Schottky-barrier diodes 
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
  • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
  • H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
  • H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
  • H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
  • H10D62/106—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
  • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
  • H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D64/00—Electrodes of devices having potential barriers
  • H10D64/60—Electrodes characterised by their materials
  • H10D64/62—Electrodes ohmically coupled to a semiconductor
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
  • H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
  • H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
  • H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
  • H10F30/227—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a Schottky barrier
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
  • H10F39/80—Constructional details of image sensors
  • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
  • H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F77/00—Constructional details of devices covered by this subclass
  • H10F77/20—Electrodes
  • H10F77/206—Electrodes for devices having potential barriers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F99/00—Subject matter not provided for in other groups of this subclass
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
  • H10F39/10—Integrated devices
  • H10F39/12—Image sensors
  • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors

Definitions

• he present invention relates to a diode element for
• terahertz wave electromagnetic wave in a frequency band from a millimeter wave band to a terahertz wave band (30 GHz or more and 30 THz or less) and an image forming apparatus using such an element.
• microbolometer a-Si, VO x , etc.
• a pyroelectric a-Si, VO x , etc.
• thermo type detection element LiTa0 3 , TGS, etc.
• Golay cell Such a thermal type detection element converts a physical change caused by energy of an electromagnetic wave into heat, and then converts a temperature change into a ⁇ thermoelectromotive force or a resistance for detection. Cooling is not always required, but a response is relatively slow because heat exchange is used.
• quantum type detection element examples include an intrinsic semiconductor element (MCT (HgCdTe)
• QWIP quantum well infrared photodetector
• detection element captures the electromagnetic wave as photons, and then detects a photovoltaic power or resistance change of a semiconductor having a small band gap.
• the response is relatively fast, but cooling is required because a thermal energy of a room
• Patent Literature 2 discloses such a diode element.
• the element described in Patent Literature 2 includes a guard ring along a
• the first conductive type low carrier concentration layer has a carrier concentration that is lower than a carrier concentration of the first conductive type high carrier concentration layer
• the diode element includes a first conductive type impurity introducing region that is formed immediately below the ohmic electrode;
• the diode element includes a second conductive type impurity introducing region having a conductive type that is different from the first conductive type, the second conductive type impurity introducing region being formed so as not to be in electrical contact with the Schottky electrode on the semiconductor surface between the Schottky electrode and the ohmic electrode; and
• conductive type low carrier concentration layer in which :
• the first conductive type low carrier concentration layer has a carrier concentration that is lower than a carrier concentration of the first conductive type high carrier concentration layer
• the diode element includes a first conductive type impurity introducing region that is formed immediately below the ohmic electrode;
• the diode element includes a second conductive type impurity introducing region having a conductive type - that is different from the first conductive type, the second conductive type impurity introducing region being formed so as to be spaced from the Schottky electrode on the semiconductor surface between the Schottky electrode and the ohmic electrode; and
• the second conductive type impurity introducing region is in contact with the first conductive type impurity introducing region.
• a diode element including:
• the first conductive type low carrier concentration layer has a carrier concentration that is lower than a carrier concentration of the first conductive type high carrier concentration layer
• the diode element includes a first conductive type impurity introducing region that is formed immediately below . the ohmic electrode;
• the diode element includes a second conductive type impurity introducing region having a conductive type that is different from the first conductive type, the second conductive type impurity introducing region being formed on the semiconductor surface between the Schottky electrode and the ohmic electrode;
• the diode element has a contact resistance value between the Schottky electrode and the second
• the second conductive type impurity introducing region is in contact with the first conductive type impurity introducing region.
• a current path between the two electrodes on the semiconductor surface of the diode element may be caused to detour around the semiconductor surface. Therefore, noise caused when carriers (electrons or holes) are trapped by or
• the second conductive type impurity introducing region is provided . so as not to be in electrical contact with the Schottky electrode, so as to be spaced from the Schottky
• an electromagnetic wave detecting device for use in a super-high frequency band, for example, from a millimeter wave band to a terahertz wave band (30 GHz or more and 30 THz or less) may also be provided.
• a lateral type diode element in which two electrodes are arranged on the semiconductor surface and noise is reduced, a detecting device including the diode element, and an image forming apparatus using such an element may be provided.
• FIG. 1 illustrates a structure of a diode element
• FIG. 2 illustrates a correspondence between the structure of the diode element according to Embodiment 1 of the present invention and an equivalent circuit element.
• FIG. 3A illustrates a structure of a diode element according to Embodiment 2 of the present invention.
• FIG. 3B illustrates another structure of a diode element according to Embodiment 2 of the present invention.
• FIG. 4 illustrates a structure of a detecting device according to Embodiment 3 of the present invention.
• FIG. 6 illustrates a structure of a detecting device according to Example 1 of the present invention.
• FIG. 8B is a graph showing noise characteristics of a conventional lateral type diode element.
• the diode element according to this embodiment includes a
• the contact resistor Rc 204 have a resistance which is ........ larger than the resistance of the Schottky barrier diode 201.
• a state in which there is no electrical contact as used herein refers to a state in which electrical insulation is made with an electrical
• the delay time may be reduced and the cut-off frequency may be caused to be higher.
• the mobility may also be selected by selecting the
• Si- based semiconductors Si- based semiconductors, GaAs-based semiconductors, InP- based semiconductors (including InGaAs-based
• InAs-based semiconductors InSb-based semiconductors, and the like may be selected.
• the above-mentioned list of the semiconductors is arranged . in ascending order of mobility of the carriers, and thus, it is preferred to select the semiconductor that is ordered later in the list.
• an amplifier including MOSFETs of a CMOS and an HBT of a BiCMOS may be integrated on the same substrate, which is preferred.
• the current path may be caused to detour around the semiconductor surface, and noise caused when the carriers are
• an increase in capacitance by the pn diode - structure may be suppressed and lowering of the cut-off frequency of an RC low-pass filter may be suppressed to realize an electromagnetic wave detecting device for use in a super-high frequency band, for example, from a millimeter wave band to a terahertz wave band (30 GHz or more and 30 THz or less) .
• Embodiment 2 A diode element according to Embodiment 2 of the present invention is described with reference to FIGS. 3A and 3B. This embodiment is a modified example of Embodiment 1. This embodiment is different from
• the diode element according to this embodiment includes a substrate 301, a high carrier concentration layer 302, and a low carrier concentration layer 303.
• the second conductive type impurity introducing region 307 may have any structure insofar as the second conductive type impurity
• introducing region 306 does not pass through the high - carrier concentration . layer 302, but the structure may be arbitrary insofar as the first conductive type impurity introducing region 306 and the high carrier concentration layer 302 are in contact with each other.
• the first conductive type is the n type and the second conductive type is the p type.
• the current which flows into the ohmic electrode 305 mostly flows in the n-type region 306 on the p-type region 307 side. Therefore, by providing the ohmic electrode 305 so as to cover the pn junction (between the n-type region 306 and the p- type region 307), current does not flow through the semiconductor surface other than the metal- — semiconductor interface, which is desired for the purpose of reducing noise.
• the Schottky electrode 304 has a circular shape, the diameter thereof is 0.3 pm, and the contact resistivity pc between the Schottky electrode 304 and the p-type region 307 is 0.1 ⁇ 2 (10 ⁇ 3 Qcm 2 ) . Then, A is calculated to be about 0.01 im 2 or less.
• the """ Schottky electrode 304 may be provided so as to be spaced from the p-type region 307.
• the configuration illustrated in FIG. 3A has a higher margin of dimensional accuracy, and thus, is more desired.
• both of. the configurations illustrated in FIGS. 3A and 3B have the effect of reducing noise.
• a detecting device according to Embodiment 3 of the
• Embodiment 1 This embodiment is different from
• Embodiment 1 in that a semi-insulating substrate 401 is used, and conductive layers (a high carrier
• concentration layer and a low carrier concentration layer 402 and 403 are separated in an island-like manner by a dielectric 408. More specifically,
• the detecting device includes a first conductive type impurity ' introducing region 406 and a second conductive type impurity introducing region 407.
• a diode element portion is formed in an island-like manner.
• an island 409 is sufficiently smaller than the wavelength of an electromagnetic wave to be detected, an approximation as a lumped-parameter element is possible.
• the island 409 having a size of about several micrometers may be manufactured, and thus, is preferred as a detecting device for use in a band from a millimeter wave band to a terahertz wave band. Therefore, all the regions, including air, except for the sufficiently small
• ⁇ - ⁇ conductive portions 402, 403, 404, 405,.406, and 407 are dielectric, and the field (electric field) may be easily controlled by the conductive patterns 4041 and 4051.
• the antennas 4041 and 4051 a resonance type dipole antenna or a slot antenna may be integrated, or a wide-band log-periodic antenna may be integrated. The number of kinds of such balanced antennas is large, and thus, a balanced antenna is suitable for the detecting device.
• a transmission line may also be provided in a part of the conductive patterns 4041 and 4051. Further, an existing microwave technology such as impedance matching between the diode element and the antenna may also be used.
• he substrate 401 behaves as a dielectric in a
• the substrate 401 does not absorb a large number of free carriers, and, in addition to semi- insulating GaAs and InP substrates, an FZ-Si substrate having a relatively high resistivity may also be used.
• an FZ-Si substrate having a relatively high resistivity may also be used.
• the frequency region is 1 THz or more
• a CZ(MCZ)- Si substrate having a resistivity of 20 Gem or more may also be used.
• the dielectric 408 a dielectric having a small dielectric loss in a
• BCB - benzocyclobutene
• FIG. 5 illustrates a modified, example of this embodiment.
• the ohmic electrode 405 is used as a ground conductor pattern 5051.
• the resistivity of the substrate 401 may be low or may be high.
• the ground electrode is formed so as to include the ground conductor pattern 5051, the high carrier
• a conductor pattern 5041 as a top electrode may be formed so as to be opposed to such a ground electrode so that an — unbalanced antenna can be formed easily.
• a resonance type patch antenna may be integrated.
• detecting devices are described by way of examples.
• Example 1 of the present invention which corresponds to and which is more specific than Embodiment 3, is described.
• a detecting device according to this
• FIG. 6 This example illustrated in FIG. 6 is an example of a
• an Si substrate is used as a substrate 601.
• electrons are
• n-type carrier concentration and the thickness of a high carrier concentration layer are adopted.
• (epitaxial layer) 602 are 5> ⁇ 10 19 cm -3 and 400 nm,
• n-type carrier concentration and the thickness of a low carrier concentration layer are respectively.
• epi layer 603 are 5*10 17 cm -3 and 100 nm,
• phosphorus (P) is injected to the depth of 200 nm from the semiconductor surface, and the region 606 is of the n type. In the region 606, the number of the electrons is 5*10 19 cm -3 or more in terms of concentration. It is to be understood that arsenic (As) may also be injected.
• boron (B) is injected to the depth of 50 nm from the
• the region 607 is of the p type.
• the number of the holes is about 5 * 10 18 cm -3 in terms of concentration.
• Those regions 606 and 607 are arranged so as to be in contact with each other.
• An ohmic electrode 605 is placed so that the first ion implanted region 606 is immediately below the ohmic electrode 605, and is in ohmic contact with the p-type region 607 having a relatively high concentration.
• Ti is used as the electrode material for the ohmic electrode 605.
• a Schottky electrode 604 is placed so as not to be in electrical contact with the second ion implanted region 607, and, together with the low carrier concentration layer 603 having a relatively low concentration, forms a Schottky barrier.
• Ti is used as the electrode material for the Schottky electrode 604.
• each of the Schottky electrode 604 and the ohmic electrode 605, which are formed of Ti is 200 nm, but the present invention is not limited thereto, and the thickness may be smaller or larger. In this way, the diode element - to which the present invention may be applied is formed.
• the size of the island was about 50 ⁇ 2 or less for the purpose of detecting an electromagnetic wave in a frequency band of 0.5 THz or more and 3 THz or less, and a side thereof was designed to be about 7 ⁇ .
• the island 609 was buried in a dielectric 608 of Si0 2 , and the Schottky electrode 604 and the ohmic electrode 605 were connected to metal patterns (antennas) 6041 and 6051 of Ti/Al or the like via contact holes, respectively.
• the diameter of the Schottky electrode 604 was designed. to be 0.6..urn and the distance between the Schottky electrode 604. and the ohmic electrode 605 was designed to be 1 ⁇ so that the cut-off frequency of the RC low-pass filter was about 3 THz .
• a log-periodic antenna is used in this example (lower part of FIG. 6) .
• Each of the antennas 6041 and 6051 were designed so that the diameter to the outside was '" 250 ⁇ , the diameter to the innermost side was 10 ⁇ , the number of comb teeth having a log period of 0.7 was 9, and the angle of the comb teeth was 45 deg.
• Such a structure was simulated using a high frequency entire.. electromagnetic simulator HFSS vl2 (manufactured by Ansoft Corporation) . It was confirmed that an
• the detecting device including the diode element and the antennas for inducing, between the Schottky electrode and the ohmic electrode, an electric field component of an
• the Schottky electrode and the ohmic electrode are used as the output ports of the antenna.
• detection current is read via readout lines 6052a and 6052b by, for example, a current measuring unit (not shown).
• bias voltage may be applied to the readout lines 6052a and 6052b by a voltage applying unit or the like (not shown) to set the voltage at an operating point of the diode element.
• the diode element of this example when the voltage is biased to around 0 V, the sensitivity is high.
• the optimum bias voltage depends on the electrode material of the Schottky electrode 604 and the like.
• the optimum bias is forward bias of around 0 V, while, when the Schottky electrode 604 is formed of the electrode material having a relatively high work function such as Pt or Pd, the optimum bias is forward bias of about 0.3 to 0.5 V.
• he detecting device of this example may be
• epitaxial layers 602 and 603 are stacked on the Si substrate 601.
• CVD chemical vapor deposition
• MBE metal-organic chemical vapor deposition
• a plasma CVD oxide film is formed at a thickness of 100 nm.
• patterning is carried out so that a resist remains in a portion corresponding to a region in which the island 609 is to be formed. After the resist is formed in the portion in which the island 609 is to be formed through
• the plasma oxide film as an underlayer is etched out with use of the resist as the mask.
• a reactive ion etching (RIE) apparatus or the like may be applied and a gas mixture of CF 4 and O2 or the like may be used so that the oxide film can be easily removed.
• RIE reactive ion etching
• concentration layer 603 are etched out with use of the patterned plasma oxide film as the mask.
• the etching may be easily realized through dry etching with a halogen-based gas such as SF 6 or CI. In this case, it is preferred that the etching reaches the substrate 601 in order to obtain electrical insulation with an adjacent device.
• the hard mask which is the plasma oxide film
• the hard mask is removed by immersion in buffered hydrofluoric acid or the like.
• the reasons why a plasma oxide film is used as a hard mask in the process of etching the island 609 are that it is easy to obtain a selection ratio in an etching process with use of a resist as the mask, and that a plasma oxide film is suitable for . reducing knock-on of a component of the resist caused by the high carrier concentration layer 602 and the low carrier concentration layer 603.
• a resist is patterned so that a portion in which the ion implanted region 607 is to be formed is removed.
• the region 606 overlap the region 607 to some extent.
• the reason is that the absence of a gap between the region 607 and the region 606 is preferred from the viewpoint of limiting an inflow of the n-type carriers more into the region 606.
• a high concentration n- type impurity region 606 is formed at an impurity density of about 5 10 19 cm -3 so as to be in contact with the high carrier concentration layer 602. .
• the amount of the n-type impurities in the region 606 is about ten times as much as the amount of the p-type impurities in the region 607, and thus, the conductive type in that region completely becomes the n type.
• a resist is patterned so that portions in which the electrodes 604 and 605 are to be formed are removed.
• electron beam deposition is used to form a Ti film at a thickness of 200 nm.
• the electrodes 604 and 605 are formed by so-called lift-off in which immersion in an organic solvent is carried out to remove Ti except for the portions in which the electrodes 604 and 605 are to be formed. Lift-off is . used in the process of forming the electrodes for the purpose of avoiding induction of defects in the low carrier concentration layer 603 due to damage in the processing.
• the insulating film (dielectric) 608 of a plasma oxide film is formed.
• the following process may be performed. Specifically, after burying in the plasma oxide film is carried out, the oxide film may be planarized through chemical mechanical polishing (CMP) . After that, a resist is patterned so as to remove over the electrodes 604 and 605 and through hole etching is carried out.
• CMP chemical mechanical polishing
• RIE reactive ion etching
• CF 4 fluorine etching
• Ti/Al films are continuously formed by sputtering at thicknesses of 10 nm and 200 nm, respectively.
• a resist is patterned so that the log-periodic antennas 6041 and 6051 are formed, and, the above-mentioned RIE apparatus or an electron cyclotron resonance (ECR) etching apparatus with higher plasma density is used and a halogen-based gas is applied to remove
• FIG. 8A is a graph showing noise
• FIG. 8B is a graph showing noise characteristics of a conventional lateral type diode element having
• the horizontal axis indicates the frequency of detection current. Measurements were made with regard to a range of 10 Hz to 1,000 Hz in which 1/f noise frequently, appears by using a Fourier transform spectrum analyzer.
• the vertical axis indicates noise current, which was measured by using a relatively low-noise current
• multiple detecting devices may be arranged in an array to form an image forming apparatus including an image forming portion for forming an image of an electric field distribution based on electric fields of electromagnetic waves detected by each of the multiple . detecting devices.
• the detecting devices according to this example (or the present invention) having different antenna directions may be arranged to provide the image forming apparatus accommodating to different polarized waves.
• resonance antennas for different frequencies may be arranged to provide the image forming apparatus accommodating to different frequencies .
• FIG. 7 This example illustrated in FIG. 7 is a modified
• Example 1 This example is an example of a suitable detecting device which may be used for the purpose of amplifying a detecting signal, and a
• defecting signal may be amplified by a MOSFET
• the MOSFET according to this example includes a gate
• the Schottky electrode 604 is connected to wiring 706 so that a detecting signal is input to the gate electrode 701 of the MOSFET, and a rectified voltage converted by a resistor of the
• the amplified detecting signal output from the MOSFET is output from a remaining electrode which is not connected to any of the Schottky electrode 604 and the ohmic electrode 605. In this way, it is possible to form the detecting device including the diode element and the transistor for outputting the detecting signal, in which the detecting device and the transistor are arranged on the same substrate.
• the detecting device of this example is manufactured as follows. First, selective epitaxial growth is used to carry out crystal growth of the epitaxial layers 602 and 603 only in the portion of the island 609. Then, a process similar to that of Example 1 is used to form the detecting device in the portion of the island 609. After that, a standard CMOS process or the like is used to form the MOSFET on the Si substrate 601. Such a configuration in which a MOSFET as an amplifier of the detecting device is placed on the same substrate may be formed through a standard CMOS process, and thus, the cost is low. Further, as the wiring 706 becomes shorter, less noise is induced in the detecting signal, and thus, integration on the same substrate in this way is also convenient and suitable for the purpose of reducing NF.
• the detecting device may be connected to a matrix wiring and the MOSFET may also be used as an active matrix switching element to form an image forming apparatus including an image forming portion for forming an image of an electric field distribution based on electric fields of
• first conductive type for example, n type

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• 2012
  • 2012-05-30 JP JP2012122572A patent/JP6087520B2/ja active Active
  • 2012-06-27 US US14/125,561 patent/US9349881B2/en active Active
  • 2012-06-27 CN CN201280033860.4A patent/CN103650167A/zh active Pending
  • 2012-06-27 EP EP12741393.8A patent/EP2732476A1/en not_active Withdrawn
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