WO2012165147A1 - 樹脂組成物、並びにこれを用いたプリプレグ及び金属箔張積層板 - Google Patents
樹脂組成物、並びにこれを用いたプリプレグ及び金属箔張積層板 Download PDFInfo
- Publication number
- WO2012165147A1 WO2012165147A1 PCT/JP2012/062516 JP2012062516W WO2012165147A1 WO 2012165147 A1 WO2012165147 A1 WO 2012165147A1 JP 2012062516 W JP2012062516 W JP 2012062516W WO 2012165147 A1 WO2012165147 A1 WO 2012165147A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- mass
- parts
- resin composition
- sio
- silicone compound
- Prior art date
Links
- 0 CC(C)(*N(C(N*N(C(C)=O)C(C)=O)=O)C(N(*N(C(*1C(O)=O)=O)C1=O)C(C)=O)=O)NC(*(C(N1*N(C(N(*C(C)(C)N(C(C)=O)C(C)=O)C(N2*N(C(C)=O)C(CC(O)=O)=O)=O)=O)C2=O)=O)C1=O)=O Chemical compound CC(C)(*N(C(N*N(C(C)=O)C(C)=O)=O)C(N(*N(C(*1C(O)=O)=O)C1=O)C(C)=O)=O)NC(*(C(N1*N(C(N(*C(C)(C)N(C(C)=O)C(C)=O)C(N2*N(C(C)=O)C(CC(O)=O)=O)=O)=O)C2=O)=O)C1=O)=O 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
- C08G73/0644—Poly(1,3,5)triazines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
- C08G73/065—Preparatory processes
- C08G73/0655—Preparatory processes from polycyanurates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1085—Polyimides with diamino moieties or tetracarboxylic segments containing heterocyclic moieties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
- C08J2383/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
- C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
Definitions
- the present invention relates to a resin composition, and a prepreg and a metal foil-clad laminate using the resin composition, and in particular, a resin composition that can be suitably used for printed wiring board materials, especially printed wiring boards for mounting light emitting diodes (LEDs).
- the present invention relates to a product, a prepreg, and a metal foil-clad laminate.
- a laminated board obtained by impregnating a glass woven fabric with an epoxy resin containing titanium dioxide and then heat-curing it (see, for example, Patent Document 1) is known. It has been.
- a laminated board using this type of epoxy resin is usually low in heat resistance, the substrate surface is subject to heat treatment or light irradiation during heat treatment in a printed wiring board manufacturing process or LED mounting process, or after use after LED mounting. Can be discolored, which can cause the problem of a significant reduction in reflectivity.
- a silicone laminate obtained by impregnating glass cloth with an addition-curable silicone resin composition containing an organopolysiloxane or organohydrogenpolysiloxane having a specific resin structure, a platinum group metal catalyst, and a filler. It is known that the substrate is excellent in mechanical properties, heat resistance and discoloration resistance, has little surface tack, and has little decrease in light reflectance upon heating and light irradiation (for example, Patent Document 3). reference.).
- a laminate for a printed wiring board requires high adhesion (peel strength) with a metal foil laminated when used as a metal foil-clad laminate, and is high when performing reflow with lead-free solder. Heat resistance is required.
- a resin composition that can realize a printed wiring board excellent in all of these characteristics has not been developed yet.
- the present invention has been made in view of the above problems, and its purpose is to have high light reflectance in the ultraviolet light region and visible light region, and there is little reduction in light reflectance due to heat treatment and light irradiation treatment,
- An object of the present invention is to provide a resin composition having good peel strength with a metal foil and excellent heat resistance, and a prepreg and a metal foil-clad laminate using the resin composition.
- an aliphatic epoxy-modified silicone compound a polybranched imide resin having an isocyanurate ring and a carboxyl group, titanium dioxide, and a resin composition containing at least a dispersant.
- the light reflectance is high in the ultraviolet light region and the visible light region, there is little decrease in the light reflectance due to heat treatment and light irradiation treatment, the peel strength with the metal foil is good, and the heat resistance is also excellent.
- the present inventors have found that a prepreg and a metal foil-clad laminate can be obtained, and have reached the present invention.
- the present invention provides the following ⁇ 1> to ⁇ 13>.
- ⁇ 1> Containing an aliphatic epoxy-modified silicone compound (A), a multi-branched imide resin (B) having an isocyanurate ring and a carboxyl group, titanium dioxide (C) and a dispersant (D); Resin composition.
- the aliphatic epoxy-modified silicone compound (A) is a silicone compound having a repeating unit represented by the following formula (1), having at least 3 R ′ in one molecule, and not containing an alkoxy group.
- R is a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group
- R ′ is an organic group having an epoxy group
- the multi-branched imide resin (B) is represented by the following formula (6).
- R 1 is each independently a divalent alicyclic group
- R 2 is each independently a trivalent alicyclic group
- m is 1 (It is an integer of ⁇ 10)
- the content of the aliphatic epoxy-modified silicone compound (A) is 20 to 90 parts by mass with respect to a total of 100 parts by mass of the aliphatic epoxy-modified silicone compound (A) and the multi-branched imide resin (B). is there,
- the content of the multi-branched imide resin (B) is 10 to 80 parts by mass with respect to a total of 100 parts by mass of the aliphatic epoxy-modified silicone compound (A) and the multi-branched imide resin (B).
- the titanium dioxide (C) content is 10 to 250 parts by mass with respect to a total of 100 parts by mass of the aliphatic epoxy-modified silicone compound (A) and the multi-branched imide resin (B).
- the average particle diameter of the titanium dioxide (C) is 5 ⁇ m or less,
- the titanium dioxide (C) is surface-treated with SiO 2 , Al 2 O 3 , ZrO 2 , and / or ZnO, and SiO 2 with respect to 100 parts by mass of the total amount of the titanium dioxide (C). 0.5 to 15 parts by mass, Al 2 O 3 0.5 to 15 parts by mass, ZrO 2 0.5 to 15 parts by mass, and / or ZnO 0.5 to 15 parts by mass.
- the resin composition according to any one of 1> to ⁇ 7>.
- the dispersant (D) is a polymer wetting dispersant having an acid value of 20 to 200 mgKOH / g.
- the content of the dispersant (D) is 0.05 to 5 parts by mass with respect to a total of 100 parts by mass of the aliphatic epoxy-modified silicone compound (A) and the multi-branched imide resin (B).
- the substrate is impregnated or coated with the resin composition according to any one of ⁇ 1> to ⁇ 11> above, Prepreg.
- the resin composition of the present invention By using the resin composition of the present invention, the light reflectance is high in the ultraviolet light region and the visible light region, there is little decrease in light reflectance due to heat treatment and light irradiation treatment, and the peel strength with the metal foil is good.
- the prepreg and metal foil-clad laminate having excellent heat resistance can be easily and reliably realized with good reproducibility. Therefore, the resin composition, the prepreg and the metal foil-clad laminate of the present invention can be suitably used for a printed wiring board for LED mounting and the like, and industrial practicality is extremely high.
- the resin composition of the present embodiment is a so-called thermosetting resin composition that is cured by heat, and includes an aliphatic epoxy-modified silicone compound (A), a multi-branched imide resin (B) having an isocyanurate ring and a carboxyl group, Titanium dioxide (C) and a dispersing agent (D) are contained.
- A aliphatic epoxy-modified silicone compound
- B multi-branched imide resin
- C Titanium dioxide
- D dispersing agent
- the aliphatic epoxy-modified silicone compound (A) used in this embodiment is a substituted or unsubstituted aliphatic hydrocarbon group having an epoxy group on a silicone compound having a siloxane bond (Si—O—Si bond) in the main skeleton. Is introduced.
- the aliphatic epoxy-modified silicone compound (A) together with the multi-branched imide resin (B), titanium dioxide (C) and the dispersant (D) the light reflectance in the ultraviolet light region and the visible light region is increased.
- the reduction in light reflectance due to the heat treatment and light irradiation treatment is not only suppressed, but the peel strength and heat resistance with the metal foil tend to be particularly enhanced.
- the silicone compound which has a repeating unit represented by following formula (1) has at least 3 R 'in 1 molecule, and does not contain an alkoxy group It is preferable that In particular, a liquid material is preferable from the viewpoint of excellent workability.
- having a repeating unit represented by the following formula (1) includes not only one having a plurality of units (preferably 3 or more) having the same R and / or R ′, but also R and / Or, it is an implication including both those having a plurality of units (preferably 3 or more) in which R ′ is different.
- R is a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group, and R ′ is an organic group having an epoxy group
- specific examples of the monovalent hydrocarbon group represented by R include a substituted or unsubstituted aliphatic hydrocarbon group, preferably having 1 to 20 carbon atoms, Those having 1 to 8 are more preferred. More specifically, for example, alkyl groups such as a methyl group, an ethyl group, a propyl group, a butyl group, a hexyl group, and an octyl group, or a part or all of hydrogen atoms of these monovalent hydrocarbon groups are glycidyl groups.
- groups substituted with a methacryl group, an acryl group, a mercapto group, an amino group, and the like can be mentioned, but are not particularly limited thereto.
- R a methyl group, an ethyl group, and a hydrogen atom are preferable, and a methyl group is more preferable.
- R ′ examples of the organic group having an epoxy group represented by R ′ include a substituted or unsubstituted aliphatic hydrocarbon group having an epoxy group and having 1 to 20 carbon atoms. And those having 1 to 12 carbon atoms are more preferred. More specifically, for example, a glycidoxypropyl group, a 3,4-epoxycyclohexylethyl group, and the like can be mentioned, but not limited thereto.
- R ′ is preferably an organic group having a 3,4-epoxycyclohexyl group.
- the silicone compound having a repeating unit represented by the above formula (1) preferably has 3 to 8 R's in one molecule.
- R ′ When the silicone compound having a unit represented by the above formula (1) has R ′ within this range, a cured product having high hardness and excellent toughness tends to be obtained.
- the silicone compound having a repeating unit represented by the above formula (1) preferably has a degree of polymerization of 3 to 100. Those having a polymerization degree in this range are easily available because they are easily synthesized industrially. In addition to these characteristics, the degree of polymerization is more preferably from 3 to 50, and even more preferably from 3 to 10 from the viewpoint of further suppressing cure shrinkage.
- the silicone compound having a repeating unit represented by the above formula (1) does not contain an alkoxy group. Therefore, there is no curing shrinkage due to dealcoholization reaction, and excellent dielectric breakdown characteristics can be obtained when used in combination with the multi-branched imide resin (B).
- silicone compound having a repeating unit represented by the above formula (1) include, for example, those having a linear structure or a ring structure.
- Examples of the ring structure include a cyclic silicone compound represented by the following formula (2).
- the cyclic silicone compound represented by the formula (2) is preferable from the viewpoint of small cure shrinkage.
- R and R ′ have the same meaning as in the above formula (1), c represents an integer of 3 to 5, d represents an integer of 0 to 2, and c and d Is an integer of 3 to 5, and each polymerized unit can be polymerized at random)
- c is an integer of 3 to 4
- d is an integer of 0 to 1
- the sum of c and d is 4.
- cyclic silicone compounds represented by the above formula (2) a cyclic silicone compound represented by the following formula (2 ′) is more preferable.
- the linear silicone compound represented by following formula (3) is mentioned, for example.
- R and R ′ have the same meaning as in the above formula (1)
- R ′′ represents R or R ′
- R, R ′ and R ′′ are the same as each other.
- A represents an integer of 1 to 10
- b represents an integer of 0 to 8
- a is an integer of 4 to 8
- b is an integer of 0 to 4
- the sum of a and b is 4 to 8.
- a linear silicone compound represented by the following formula (3 ′) is more preferable.
- R, R ′, R ′′, a and b are as defined above
- a linear silicone compound represented by the following formula (4) is more preferable.
- R ' has the same meaning as above, and e represents an integer of 3 to 10.
- e is preferably an integer of 3 to 8.
- the silicone compound having a repeating unit represented by the above formula (1) is more preferably a cyclic silicone compound represented by the following formula (5).
- R ′ has the same meaning as in the above formula (1), and f represents an integer of 3 to 5)
- f is preferably 4.
- the aliphatic epoxy-modified silicone compound (A) particularly preferably contains 50% by mass or more of the compound in which f is 4 in the above formula (5).
- aliphatic epoxy-modified silicone compound (A) examples include, for example, (CH 3 ) 3 SiO (R′CH 3 SiO) 5 Si (CH 3 ) 3 , (CH 3 ) 3 SiO (R′CH 3 SiO) 6 Si (CH 3 ) 3 , (CH 3 ) 3 SiO (R′CH 3 SiO) 7 Si (CH 3 ) 3 , (CH 3 ) 3 SiO (R′CH 3 SiO) 8 Si (CH 3 ) 3 , (CH 3 ) 3 SiO (R′CH 3 SiO) 9 Si (CH 3 ) 3 , (CH 3 ) 3 SiO (R′CH 3 SiO) 10 Si (CH 3 ) 3 , R ′ (CH 3 ) 2 SiO (R′CH 3 SiO) Si (CH 3 ) 2 R ′, R ′ (CH 3 ) 2 SiO (R′CH 3 SiO) 2 Si (CH 3 ) 2 R ′, R ′ (CH 3 ) 2 SiO (R′CH 3 SiO
- R ′ (CH 3 ) 2 SiO (R′CH 3 SiO) 6 ((CH 3 ) 2 SiO) 2 Si (CH 3 ) 2 R ′, R ′ (CH 3 ) 2 SiO (R′CH 3 SiO) 6 ((CH 3 ) 2 SiO) 3 Si (CH 3 ) 2 R ′, R ′ (CH 3 ) 2 SiO (R′CH 3 SiO) 7 ((CH 3 ) 2 SiO) Si (CH 3 ) 2 R ′ R ′ (CH 3 ) 2 SiO (R′CH 3 SiO) 7 ((CH 3 ) 2 SiO) 2 Si (CH 3 ) 2 R ′, R ′ (CH 3 ) 2 SiO (R′CH 3 SiO) 7 ((CH 3 ) 2 SiO) 3 Si (CH 3 ) 2 R ′, R ′ (CH 3 ) 2 SiO (R′CH 3 SiO) 7 ((CH 3 ) 2 SiO) 3 Si (CH 3 ) 2 R ′, R ′ (
- the above-described aliphatic epoxy-modified silicone compound (A) can be produced by a known method. Specifically, it can be obtained, for example, by subjecting an organohydrogenpolysiloxane to an addition reaction (hydrosilylation) with an allyl epoxy compound (eg, 4-vinylcyclohexene oxide) using a catalyst such as a platinum compound.
- a commercial item can also be used for the aliphatic epoxy modified silicone compound (A) mentioned above.
- X-40-2670 manufactured by Shin-Etsu Chemical Co., Ltd.
- SE-02CM manufactured by Nagase ChemteX Corporation
- the content of the aliphatic epoxy-modified silicone compound (A) in the resin composition of the present embodiment is not particularly limited, but the aliphatic epoxy-modified silicone compound (A) and the multi-branched imide resin (B) in the resin composition are not limited. ) Is preferably 20 to 90 parts by weight, and more preferably 30 to 80 parts by weight.
- the multi-branched imide resin (B) used in the present embodiment is not particularly limited as long as it has an isocyanurate ring, a carboxyl group, and an imide group.
- it is a multi-branched imide resin having an isocyanurate ring and a plurality of cyclic imides having a carboxyl group, and a large number of these cyclic imides bonded to the isocyanurate ring.
- the multi-branched imide resin (B) is more preferably an imide resin having an alicyclic structure, that is, an alicyclic imide resin (having no aromatic ring).
- Such an alicyclic imide resin has an isocyanurate ring and a plurality of aliphatic cyclic imides having a carboxylic acid group bonded to each nitrogen atom of the isocyanurate ring via an aliphatic ring. And a multi-branched alicyclic imide resin.
- a multi-branched imide resin (B) having an isocyanurate ring and a carboxyl group together with an aliphatic epoxy-modified silicone compound (A), titanium dioxide (C) and a dispersant (D), a peel with a metal foil is obtained.
- the strength and heat resistance particularly improved, the light reflectance in the ultraviolet light region and the visible light region is particularly enhanced, and the decrease in light reflectance due to heat treatment and light irradiation treatment tends to be remarkably suppressed. .
- each R 1 independently represents a divalent alicyclic group
- each R 2 independently represents a trivalent alicyclic group
- m represents 1 to (It is an integer of 10.)
- the alicyclic group represented by R 1 is a divalent group having 6 to 20 carbon atoms, preferably containing an aliphatic ring, and is a starting material alicyclic diamine or alicyclic group. It is a residue of diisocyanate.
- alicyclic diamine examples include 4,4′-diamino-dicyclohexylmethane, 3,3′-dimethyl-4,4′-diamino-dicyclohexylmethane, 3,3′-diethyl-4,4′-diamino- Dicyclohexylmethane, 3,3 ′, 5,5′-tetramethyl-4,4′-diamino-dicyclohexylmethane, 3,3 ′, 5,5′-tetraethyl-4,4′-diamino-dicyclohexylmethane, 3, 5-diethyl-3 ′, 5′-dimethyl-4,4′-diaminodicyclohexylmethane, 1,4-cyclohexanediamine, 1,3-cyclohexanediamine, isophoronediamine, 2,2-bis [4- (4-amino Cyclohexyloxy) cyclohexyl
- the alicyclic group represented by R 2 is an aliphatic ring-containing group having preferably 6 to 20 carbon atoms, and is a residue of the starting alicyclic tricarboxylic acid or anhydride. It is.
- Examples of the alicyclic tricarboxylic acid include cyclohexane-1,2,3-tricarboxylic acid, cyclohexane-1,2,4-tricarboxylic acid, cyclohexane-1,3,5-tricarboxylic acid, 5-methylcyclohexane-1, Examples include 2,4-tricarboxylic acid, 6-methylcyclohexane-1,2,4-tricarboxylic acid, and 3-methylcyclohexane-1,2,4-tricarboxylic acid, but are not particularly limited thereto.
- the acid value of the multi-branched imide resin (B) is preferably 30 to 80 mgKOH / g, more preferably 40 to 70 mgKOH in terms of solid content, from the viewpoint of solubility in organic solvents and curing characteristics. / G.
- the multi-branched imide resin (B) can be used singly or in combination of two or more. Further, the content of the multi-branched imide resin (B) in the resin composition of the present embodiment is not particularly limited, but a total of 100 of the aliphatic epoxy-modified silicone compound (A) and the multi-branched imide resin (B). The amount is preferably 10 to 80 parts by mass, more preferably 20 to 70 parts by mass with respect to parts by mass. By setting the content of the multi-branched imide resin (B) within such a preferable range, the metal foil-clad laminate is obtained without causing excessive reduction in reflectance due to discoloration due to heat treatment or light irradiation treatment. The peel strength and heat resistance with the foil tend to be further enhanced.
- the resin composition of the present embodiment contains titanium dioxide (C) as an essential inorganic filler. From the viewpoint of further improving the light reflectance in the ultraviolet light region and the visible light region, titanium dioxide having a crystal structure of rutile type or anatase type is preferable.
- the average particle diameter (D50) of titanium dioxide (C) is not particularly limited, but is preferably 5 ⁇ m or less, more preferably 0.5 ⁇ m or less. Titanium dioxide (C) can be used individually by 1 type or in combination of 2 or more types, For example, what has a different particle size distribution and average particle diameter can also be used in combination as appropriate.
- titanium dioxide (C) is surface-treated with SiO 2 , Al 2 O 3 , ZrO 2 and / or ZnO, in other words In this case, it is preferable to have a coating layer containing SiO 2 , Al 2 O 3 , ZrO 2 and / or ZnO.
- titanium dioxide (C) is surface-treated with SiO 2 , Al 2 O 3 , ZrO 2 and / or ZnO and then treated with polyol, silane coupling agent and / or amine, in other words , SiO 2 , Al 2 O 3 , ZrO 2 and / or ZnO, and more preferably have a coating layer treated with polyol, silane coupling agent and / or amine.
- the surface-treated titanium dioxide (C) When the surface-treated titanium dioxide (C) is used, 0.5 to 15 parts by mass of SiO 2 and 0.5 to 15 of Al 2 O 3 with respect to 100 parts by mass of the total amount of titanium dioxide (C).
- 0.5 to 15 parts by mass of ZrO 2 and / or 0.5 to 15 parts by mass of ZnO are included, more preferably 1 to 11 parts by mass of SiO 2 and 1 of Al 2 O 3.
- To 11 parts by mass 1 to 11 parts by mass of ZrO 2 , and / or 1 to 11 parts by mass of ZnO.
- the surface treatment amount By making the surface treatment amount within such a preferable range, discoloration due to heat treatment or light irradiation treatment is further suppressed without causing an excessive decrease in light reflectance in the ultraviolet light region and visible light region, and the light reflectance is reduced. The decrease tends to be further suppressed.
- the titanium dioxide (C) contains 3 to 11 parts by mass of SiO 2 and 1 to 3 parts by mass of Al 2 O 3 with respect to 100 parts by mass of the total amount of titanium dioxide (C). preferable.
- the content of titanium dioxide (C) in the resin composition of the present embodiment is not particularly limited, but is 100 parts by mass in total of the aliphatic epoxy-modified silicone compound (A) and the multi-branched imide resin (B).
- the amount is preferably 10 to 250 parts by mass, and more preferably 25 to 200 parts by mass.
- the dispersion stabilizer currently used for coating materials can be used suitably.
- a polymer wetting and dispersing agent having an acid group is preferable, and a polymer wetting and dispersing agent having an acid value of 20 to 200 mgKOH / g is more preferable.
- Specific examples thereof include polymer wetting and dispersing agents manufactured by BYK Japan, Inc.
- a dispersing agent (D) can be used individually by 1 type or in combination of 2 or more types.
- content of the dispersing agent (D) in the resin composition of this embodiment is not specifically limited, With respect to a total of 100 mass parts of an aliphatic epoxy-modified silicone compound (A) and a multibranched imide resin (B). 0.05 to 5 parts by mass, more preferably 0.1 to 4.0 parts by mass, and still more preferably 0.5 to 3.0 parts by mass.
- content of the dispersant (D) within such a preferable range, the heat resistance is further improved, and the resin in the resin composition, titanium dioxide (C), and other inorganic fillers which are optional components described later. Dispersibility is further improved, and molding unevenness tends to be suppressed.
- the resin composition of the present embodiment may contain an epoxy resin other than the aliphatic epoxy-modified silicone compound (A) (hereinafter referred to as “other epoxy resin”) as a component other than the above.
- Other epoxy resins include, for example, bisphenol A type epoxy resin, bisphenol E type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol A novolac type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy.
- the resin composition of this embodiment may contain other inorganic fillers in addition to the above-described titanium dioxide (C).
- specific examples of other inorganic fillers include, for example, silicas such as natural silica, synthetic silica, fused silica, amorphous silica, and hollow silica, molybdenum compounds such as boehmite, molybdenum oxide, and zinc molybdate, zinc borate, and tin.
- the resin composition of the present embodiment may contain a curing accelerator for adjusting the curing rate as needed.
- a curing accelerator for adjusting the curing rate as needed.
- This type of curing accelerator is known in the art, and for example, those generally used as curing accelerators for epoxy resins and phenol resins can be suitably used.
- Specific examples of the curing accelerator include, but are not particularly limited to, organic metal salts such as copper, zinc, cobalt, nickel, and platinum, imidazoles and derivatives thereof, and tertiary amines.
- a hardening accelerator can be used individually by 1 type or in combination of 2 or more types.
- the resin composition of the present embodiment may contain a solvent as necessary.
- a solvent for example, when an organic solvent is used, the viscosity at the time of preparing the resin composition is lowered, the handling property is improved, and the impregnation property to the glass cloth is enhanced.
- the type of the solvent is not particularly limited as long as it can dissolve the mixture of the aliphatic epoxy-modified silicone compound (A) and the multi-branched imide resin (B).
- Specific examples thereof include ketones such as acetone, methyl ethyl ketone and methyl cellosolve, aromatic hydrocarbons such as toluene and xylene, amides such as dimethylformamide, propylene glycol methyl ether and acetate thereof.
- a solvent can be used individually by 1 type or in combination of 2 or more types.
- the resin composition of the present embodiment may contain components other than those described above as long as the desired properties are not impaired.
- examples of such an arbitrary formulation include various thermosetting compounds other than those described above, thermoplastic resins and oligomers thereof, various polymer compounds such as elastomers, flame retardant compounds, and various additives. . These are not particularly limited as long as they are commonly used in the industry.
- specific examples of flame retardant compounds include nitrogen-containing compounds such as melamine and benzoguanamine, and oxazine ring-containing compounds.
- additives include ultraviolet absorbers, antioxidants, photopolymerization initiators, fluorescent brighteners, photosensitizers, dyes, pigments, thickeners, lubricants, antifoaming agents, dispersants, and leveling agents. , Brighteners, polymerization inhibitors, silane coupling agents and the like. These arbitrary formulations can be used singly or in combination of two or more.
- the resin composition of this embodiment substantially comprises only the above-described aliphatic epoxy-modified silicone compound (A), multi-branched imide resin (B), titanium dioxide (C), and dispersant (D). It is preferable. As described above, by constituting the resin composition with only these four components (A) to (D), various performances tend to be expressed in a high-dimensional and well-balanced manner. Especially, since the carboxyl group in the molecular structure of the multi-branched imide resin (B) has a curing accelerating function in the curing reaction, the resin composition of this embodiment can be sufficiently thermally cured even in an aspect not containing a catalyst.
- substantially consisting of only these components (A) to (D) means that components other than these components (A) to (D) are 10% by mass or less in terms of solid content of the total amount of the resin composition, More preferably, it means 5% by mass or less, further preferably 3% by mass or less, particularly preferably 1% by mass or less, and most preferably 0.5% by mass or less.
- the resin composition in this embodiment can be prepared according to a conventional method, and includes an aliphatic epoxy-modified silicone compound (A), a multi-branched imide resin (B), titanium dioxide (C), a dispersant (D) and If it is a method by which the resin composition which contains the other arbitrary components mentioned above uniformly is obtained, the preparation method will not be specifically limited.
- an aliphatic epoxy-modified silicone compound, a multi-branched imide resin, titanium dioxide, a polymer wetting and dispersing agent having an acid group, and other inorganic fillers are sequentially blended in a solvent and sufficiently stirred, A resin composition can be easily prepared.
- an organic solvent can be used as necessary.
- the kind of the organic solvent is not particularly limited as long as it can dissolve the mixture of the aliphatic epoxy-modified silicone compound (A) and the multi-branched imide resin (B). Specific examples thereof are as described above.
- the dispersibility with respect to the resin composition is enhanced by performing the stirring and dispersing treatment using a stirring tank provided with a stirrer having an appropriate stirring ability.
- the above stirring, mixing, and kneading treatment can be appropriately performed using, for example, a known apparatus such as a ball mill or a bead mill for mixing, or a revolution / spinning mixing apparatus.
- the prepreg of the present embodiment can be obtained by combining the above resin composition with a substrate, specifically, impregnating or applying the above resin composition to the substrate.
- the method for producing the prepreg can be performed according to a conventional method, and is not particularly limited.
- a resin composition comprising an aliphatic epoxy-modified silicone compound, a multi-branched imide resin, titanium dioxide, a polymeric wetting and dispersing agent having an acid group, and an inorganic filler, 100 to 200
- the prepreg of this embodiment can be produced by semi-curing (B stage formation), for example, by heating in a dryer at 0 ° C. for 1 to 30 minutes.
- the prepreg of this embodiment is not particularly limited, but the amount of the resin composition (including titanium dioxide (C) and other inorganic fillers) relative to the total amount of prepreg is in the range of 30 to 90% by mass. It is preferable.
- the substrate used in the present embodiment is not particularly limited, and known materials used for various printed wiring board materials may be appropriately selected and used depending on the intended use and performance. it can. Specific examples thereof include glass fibers such as E glass, D glass, S glass, Q glass, spherical glass, NE glass and T glass, inorganic fibers other than glass such as quartz, and organic materials such as polyimide, polyamide and polyester. Although a fiber is mentioned, it is not specifically limited to these.
- a base material can be used individually by 1 type or in combination of 2 or more types.
- the weaving method of the woven fabric is known as plain weave, Nanako weave, twill weave, etc. Depending on the intended use and performance, it can be appropriately selected and used, and those obtained by fiber opening treatment or glass woven fabric surface-treated with a silane coupling agent or the like are preferably used.
- the thickness and mass of the base material are not particularly limited, but usually about 0.01 to 0.3 mm is preferably used.
- the base material is preferably a glass woven fabric having a thickness of 200 ⁇ m or less and a mass of 250 g / m 2 or less, and more preferably a glass woven fabric made of E-glass glass fibers.
- the metal foil-clad laminate of this embodiment can be obtained by laminating at least one prepreg as described above and laminating and molding the metal foil on one or both sides. Specifically, one or a plurality of the prepregs described above are stacked, and a metal foil such as copper or aluminum is arranged on one or both sides as desired, and this is laminated and formed as necessary.
- the metal foil-clad laminate of this embodiment can be produced.
- the metal foil used here will not be specifically limited if it is used for printed wiring board material, Well-known copper foils, such as a rolled copper foil and an electrolytic copper foil, are preferable.
- the thickness of the metal foil is not particularly limited, but is preferably 2 to 70 ⁇ m, more preferably 2 to 35 ⁇ m.
- a multi-stage press machine a multi-stage vacuum press machine, a continuous molding machine, an autoclave molding machine, etc. can be used for forming a metal foil-clad laminate
- the temperature is 100 to 300 ° C.
- the pressure is a surface pressure of 2 to 100 kgf / cm 2
- the heating time is generally in the range of 0.05 to 5 hours.
- post-curing can be performed at a temperature of 150 to 300 ° C., if necessary.
- a multilayer board can be formed by combining and molding the prepreg of the present embodiment and a separately prepared wiring board for an inner layer.
- the metal foil-clad laminate of the present embodiment described above can be suitably used as a printed wiring board by forming a predetermined wiring pattern.
- the metal foil-clad laminate of this embodiment has a high light reflectance in the ultraviolet light region and the visible light region, there is little decrease in light reflectance due to heat treatment and light irradiation treatment, and peel strength with the metal foil. Therefore, it can be used particularly effectively as a printed wiring board for LED mounting that requires such performance.
- Example 1 45 parts by mass of a multi-branched imide resin (V-8002, manufactured by DIC Corporation), 55 parts by mass of an aliphatic epoxy-modified silicone compound (X-40-2670, manufactured by Shin-Etsu Chemical Co., Ltd.), titanium dioxide (CR90 ( 1 to 5 parts by mass of SiO 2 and 1 to 3 parts by mass of Al 2 O 3 are included with respect to 100 parts by mass in total.), 75 parts by mass of Ishihara Sangyo Co., Ltd., dispersant (BYK-W903, 1.75 parts by mass of Big Chemie Japan Co., Ltd.) was stirred and mixed with a homomixer to obtain a varnish.
- V-8002 multi-branched imide resin
- X-40-2670 manufactured by Shin-Etsu Chemical Co., Ltd.
- titanium dioxide CR90 ( 1 to 5 parts by mass of SiO 2 and 1 to 3 parts by mass of Al 2 O 3 are included with respect to 100 parts by mass in total.
- dispersant BYK-
- This varnish was diluted 0.6 times by mass with methyl ethyl ketone, impregnated into 0.08 mm thick E glass cloth, and heated at 150 ° C. for 3 minutes to obtain a prepreg having a resin composition amount of 48 mass%. .
- two prepregs were stacked, and 12 ⁇ m electrolytic copper foil (JTC-LPZ foil, manufactured by Nikko Materials Co., Ltd.) was placed on the upper and lower surfaces of the laminate, and the temperature was 220 ° C. and the surface pressure was 30 kgf / cm 2. And pressure molding using a vacuum press machine under a vacuum of 30 mmHg or less for 150 minutes to obtain a double-sided copper clad laminate having a thickness of 0.2 mm.
- Example 2 The blending amount of the multi-branched imide resin is 50 parts by mass, and instead of 55 parts by mass of the aliphatic epoxy-modified silicone compound (X-40-2670, manufactured by Shin-Etsu Chemical Co., Ltd.), the aliphatic epoxy-modified silicone compound (Nagase Chem) A varnish was prepared in the same manner as in Example 1 except that 50 parts by mass of Tex Co., Ltd. SE-02CM) was used, and a prepreg and a double-sided copper-clad laminate were obtained in the same manner.
- the aliphatic epoxy-modified silicone compound X-40-2670, manufactured by Shin-Etsu Chemical Co., Ltd.
- Example 3 The amount of the multi-branched imide resin was 50 parts by mass, the amount of the aliphatic epoxy-modified silicone compound (X-40-2670) was 25 parts by mass, and the aliphatic epoxy-modified silicone compound was used in Example 2.
- a varnish was prepared in the same manner as in Example 1 except that 25 parts by mass of SE-02CM was blended, and a prepreg and a double-sided copper-clad laminate were obtained in the same manner.
- Comparative Example 1 42 parts by mass of bisphenol A type cyanate (2,2-bis (4-cyanatephenyl) propane prepolymer, CA210, manufactured by Mitsubishi Gas Chemical Co., Ltd.) as a resin component, aliphatic epoxy-modified silicone compound used in Example 1 58 parts by mass, 75 parts by mass of titanium dioxide used in Example 1, 1.75 parts by mass of the dispersant used in Example 1, and 0.15 parts by mass of zinc octylate were stirred and mixed with a homomixer to obtain a varnish. Obtained. Except using this varnish, it carried out similarly to Example 1 and obtained the prepreg and the double-sided copper clad laminated board.
- Comparative Example 2 As a resin component, 22 parts by mass of a phenol novolac resin (TD2090, manufactured by DIC Corporation) represented by the following formula (7), 78 parts by mass of an aliphatic epoxy-modified silicone compound used in Example 1, and used in Example 1 In a homomixer, 75 parts by mass of titanium dioxide, 1.75 parts by mass of the dispersant used in Example 1, and 0.01 parts by mass of 2-ethyl-4-methylimidazole (2E4MZ, manufactured by Shikoku Kasei Kogyo Co., Ltd.) were used. The mixture was stirred and mixed to obtain a varnish. Except using this varnish, it carried out similarly to Example 1 and obtained the prepreg and the double-sided copper clad laminated board.
- a phenol novolac resin TD2090, manufactured by DIC Corporation
- a homomixer 75 parts by mass of titanium dioxide, 1.75 parts by mass of the dispersant used in Example 1, and 0.01 parts by mass of 2-ethyl-4-methylimidazo
- Comparative Example 3 20 parts by mass of a solution of 1,2,4-cyclohexanetricarboxylic acid-1,2-anhydride obtained in Comparative Preparation Example 1 (10 parts by mass as 1,2,4-cyclohexanetricarboxylic acid-1,2-anhydride) ), 90 parts by mass of the aliphatic epoxy-modified silicone compound used in Example 1, 75 parts by mass of titanium dioxide used in Example 1, and 1.75 parts by mass of the dispersant used in Example 1 were stirred and mixed with a homomixer. To obtain a varnish. Except using this varnish, it carried out similarly to Example 1 and obtained the prepreg and the double-sided copper clad laminated board.
- Comparative Example 4 45 parts by mass of an aromatic imide resin (V-8000, manufactured by DIC Corporation), 55 parts by mass of the aliphatic epoxy-modified silicone compound used in Example 1, 75 parts by mass of titanium dioxide used in Example 1, Example 1 1.75 parts by mass of the dispersant used in the above was stirred and mixed with a homomixer to obtain a varnish. Except using this varnish, it carried out similarly to Example 1 and obtained the prepreg and the double-sided copper clad laminated board.
- V-8000 aromatic imide resin
- DIC Corporation an aromatic imide resin
- Example 1 75 parts by mass of titanium dioxide used in Example 1
- Example 1 1.75 parts by mass of the dispersant used in the above was stirred and mixed with a homomixer to obtain a varnish. Except using this varnish, it carried out similarly to Example 1 and obtained the prepreg and the double-sided copper clad laminated board.
- Example 5 35 parts by mass of a multi-branched imide resin used in Example 1, 65 parts by mass of an aromatic epoxy-modified silicone compound (X-41-1053, manufactured by Shin-Etsu Chemical Co., Ltd.), 75 parts by mass of titanium dioxide used in Example 1 Parts, 1.75 parts by mass of the dispersant used in Example 1 were stirred and mixed with a homomixer to obtain a varnish. Except using this varnish, it carried out similarly to Example 1 and obtained the prepreg and the double-sided copper clad laminated board.
- an aromatic epoxy-modified silicone compound X-41-1053, manufactured by Shin-Etsu Chemical Co., Ltd.
- Example 6 35 parts by mass of a multi-branched imide resin used in Example 1, 65 parts by mass of an aliphatic methacryl-modified silicone resin (X-40-9272B, manufactured by Shin-Etsu Chemical Co., Ltd.), 75 parts by mass of titanium dioxide used in Example 1 Parts, 1.75 parts by mass of the dispersant used in Example 1 were stirred and mixed with a homomixer to obtain a varnish. Except using this varnish, it carried out similarly to Example 1 and obtained the prepreg and the double-sided copper clad laminated board.
- X-40-9272B aliphatic methacryl-modified silicone resin
- Example 7 40 parts by mass of a multi-branched imide resin used in Example 1, 60 parts by mass of an aliphatic acrylic-modified silicone resin (KR-513, manufactured by Shin-Etsu Chemical Co., Ltd.), 75 parts by mass of titanium dioxide used in Example 1, 1.75 parts by mass of the dispersant used in Example 1 was stirred and mixed with a homomixer to obtain a varnish. Except using this varnish, it carried out similarly to Example 1 and obtained the prepreg and the double-sided copper clad laminated board.
- KR-513 aliphatic acrylic-modified silicone resin
- Example 8 20 parts by mass of the multi-branched imide resin used in Example 1, 80 parts by mass as an aromatic epoxy-modified silicone resin (KHE-2033, Nippon Kayaku Co., Ltd.), 75 parts by mass of titanium dioxide used in Example 1 Then, 1.75 parts by mass of the dispersant used in Example 1 was stirred and mixed with a homomixer to obtain a varnish. Except using this varnish, it carried out similarly to Example 1 and obtained the prepreg and the double-sided copper clad laminated board.
- KHE-2033 aromatic epoxy-modified silicone resin
- the double-sided copper-clad laminates of Examples 1 to 3 each have high reflectance, and there is little reduction in light reflectance due to heat treatment and light irradiation treatment, and peel with copper foil. It was confirmed that the strength was good and the heat resistance was also excellent. Further, by using a combination of the aliphatic epoxy-modified silicone compound (A) and the multi-branched imide resin (B) having an isocyanurate ring and a carboxyl group, there is no appearance abnormality of the prepreg and the double-sided copper-clad laminate, It was confirmed that peel strength, Tg and heat resistance were improved.
- the present invention can be used widely and effectively in various applications such as electric / electronic materials, machine tool materials, and aviation materials that require light resistance and heat resistance.
- the present invention can be effectively used in the fields of printed wiring boards and printed wiring boards for LED mounting, which require high peel strength with respect to heat resistance and heat resistance.
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
Abstract
Description
脂肪族エポキシ変性シリコーン化合物(A)、イソシアヌレート環及びカルボキシル基を有する多分枝型イミド樹脂(B)、二酸化チタン(C)及び分散剤(D)を含有する、
樹脂組成物。
前記脂肪族エポキシ変性シリコーン化合物(A)が、下記式(1)で表される繰り返し単位を有し、1分子中に少なくとも3個のR′を有し、アルコキシ基を含有しないシリコーン化合物である、
上記<1>に記載の樹脂組成物。
前記多分枝型イミド樹脂(B)が、下記式(6)で表される
上記<1>又は<2>に記載の樹脂組成物。
前記脂肪族エポキシ変性シリコーン化合物(A)の含有量が、前記脂肪族エポキシ変性シリコーン化合物(A)及び前記多分枝型イミド樹脂(B)の合計100質量部に対して、20~90質量部である、
上記<1>~<3>のいずれか一項に記載の樹脂組成物。
前記多分枝型イミド樹脂(B)の含有量が、前記脂肪族エポキシ変性シリコーン化合物(A)及び前記多分枝型イミド樹脂(B)の合計100質量部に対して、10~80質量部である、
上記<1>~<4>のいずれか一項に記載の樹脂組成物。
前記二酸化チタン(C)の含有量が、前記脂肪族エポキシ変性シリコーン化合物(A)及び前記多分枝型イミド樹脂(B)の合計100質量部に対して、10~250質量部である、
上記<1>~<5>のいずれか一項に記載の樹脂組成物。
前記二酸化チタン(C)の平均粒径が、5μm以下である、
上記<1>~<6>のいずれか一項に記載の樹脂組成物。
前記二酸化チタン(C)は、SiO2、Al2O3、ZrO2、及び/または、ZnOで表面処理されたものであり、前記二酸化チタン(C)の総量100質量部に対して、SiO2が0.5~15質量部、Al2O3が0.5~15質量部、ZrO2が0.5~15質量部、及び/または、ZnOが0.5~15質量部含まれる
上記<1>~<7>のいずれか一項に記載の樹脂組成物。
前記分散剤(D)が、酸価が20~200mgKOH/gである高分子湿潤分散剤である、
上記<1>~<8>のいずれか一項に記載の樹脂組成物。
前記分散剤(D)の含有量が、前記脂肪族エポキシ変性シリコーン化合物(A)及び前記多分枝型イミド樹脂(B)の合計100質量部に対して、0.05~5質量部である、
上記<1>~<9>のいずれか一項に記載の樹脂組成物。
上記<1>~<10>のいずれか一項に記載のLED実装用プリント配線板用の樹脂組成物。
上記<1>~<11>のいずれか一項に記載の樹脂組成物を基材に含浸または塗布してなる、
プリプレグ。
上記<12>に記載のプリプレグを少なくとも1枚以上重ね、その片面もしくは両面に金属箔を配して積層成形して得られる、
金属箔張積層板。
多分枝型イミド樹脂(V-8002、DIC(株)製)45質量部、脂肪族エポキシ変性シリコーン化合物(X-40-2670、信越化学工業(株)製)55質量部、二酸化チタン(CR90(総量100質量部に対して、SiO2を1~5質量部、及びAl2O3を1~3質量部含む。)、石原産業(株)製)75質量部、分散剤(BYK-W903、ビックケミー・ジャパン(株)製)1.75質量部をホモミキサーにて攪拌混合して、ワニスを得た。
このワニスをメチルエチルケトンで質量基準にて0.6倍希釈し、厚さ0.08mmのEガラスクロスに含浸させ、150℃で3分加熱させて、樹脂組成物量が48質量%のプリプレグを得た。
次に、このプリプレグを2枚重ね、その積層体の上下面に12μmの電解銅箔(JTC-LPZ箔、(株)日鉱マテリアルズ製)を配置し、温度220℃、面圧30kgf/cm2、30mmHg以下の真空下で150分間、真空プレス機を用いて加圧成型し、厚さ0.2mmの両面銅張積層板を得た。
多分枝型イミド樹脂の配合量を50質量部とし、脂肪族エポキシ変性シリコーン化合物(X-40-2670、信越化学工業(株)製)55質量部に代えて脂肪族エポキシ変性シリコーン化合物(ナガセケムテックス(株)製、SE-02CM)50質量部を用いること以外は、実施例1と同様にしてワニスを調製し、同様にプリプレグ及び両面銅張積層板を得た。
多分枝型イミド樹脂の配合量を50質量部とし、脂肪族エポキシ変性シリコーン化合物(X-40-2670)の配合量を25質量部とし、さらに脂肪族エポキシ変性シリコーン化合物として実施例2で使用したSE-02CMを25質量部配合すること以外は、実施例1と同様にして、ワニスを調製し、同様にプリプレグ及び両面銅張積層板を得た。
ステンレス製半月型攪拌翼、窒素導入管、冷却管を取り付けたディーンスターク、温度計及びガラス製エンドキャップを備えた300mlの五つ口ガラス製丸底フラスコ中に、1,2,4-シクロヘキサントリカルボン酸-1,2-無水物(H-TMAn、三菱瓦斯化学(株)製)100g、メチルエチルケトン100gをそれぞれ一括で加えた後、マントルヒーターで加熱し、約10分かけて反応系内温度を80℃まで上げ、60分攪拌して均一な溶液とし、50℃まで10分程度で空冷し、固形分濃度50質量%の溶液を得た。
樹脂成分としてビスフェノールA型シアネート(2,2-ビス(4-シアネートフェニル)プロパンのプレポリマー、CA210、三菱瓦斯化学(株)製)42質量部、実施例1で使用した脂肪族エポキシ変性シリコーン化合物58質量部、実施例1で使用した二酸化チタン75質量部、実施例1で使用した分散剤1.75質量部、オクチル酸亜鉛0.15質量部をホモミキサーにて攪拌混合して、ワニスを得た。このワニスを使用すること以外は、実施例1と同様に行い、プリプレグ及び両面銅張積層板を得た。
樹脂成分として、下記式(7)で表されるフェノールノボラック樹脂(TD2090、DIC(株)製)22質量部、実施例1で使用した脂肪族エポキシ変性シリコーン化合物78質量部、実施例1で使用した二酸化チタン75質量部、実施例1で使用した分散剤1.75質量部、2-エチル-4-メチルイミダゾール(2E4MZ、四国化成工業(株)製)0.01質量部をホモミキサーにて攪拌混合して、ワニスを得た。このワニスを使用すること以外は、実施例1と同様に行い、プリプレグ及び両面銅張積層板を得た。
比較調製例1で得られた1,2,4-シクロヘキサントリカルボン酸-1,2-無水物の溶液20質量部(1,2,4-シクロヘキサントリカルボン酸-1,2-無水物として10質量部)、実施例1で使用した脂肪族エポキシ変性シリコーン化合物90質量部、実施例1で使用した二酸化チタン75質量部、実施例1で使用した分散剤1.75質量部をホモミキサーにて攪拌混合して、ワニスを得た。このワニスを使用すること以外は、実施例1と同様に行い、プリプレグ及び両面銅張積層板を得た。
芳香族イミド樹脂(V-8000、DIC(株)製)45質量部、実施例1で使用した脂肪族エポキシ変性シリコーン化合物55質量部、実施例1で使用した二酸化チタン75質量部、実施例1で使用した分散剤1.75質量部をホモミキサーにて攪拌混合して、ワニスを得た。このワニスを使用すること以外は、実施例1と同様に行い、プリプレグ及び両面銅張積層板を得た。
実施例1で使用した多分枝型イミド樹脂35質量部、芳香族エポキシ変性シリコーン化合物(X-41-1053、信越化学工業(株)製)65質量部、実施例1で使用した二酸化チタン75質量部、実施例1で使用した分散剤1.75質量部をホモミキサーにて攪拌混合して、ワニスを得た。このワニスを使用すること以外は、実施例1と同様に行い、プリプレグ及び両面銅張積層板を得た。
実施例1で使用した多分枝型イミド樹脂35質量部、脂肪族メタクリル変性シリコーン樹脂(X-40-9272B、信越化学工業(株)製)65質量部、実施例1で使用した二酸化チタン75質量部、実施例1で使用した分散剤1.75質量部をホモミキサーにて攪拌混合して、ワニスを得た。このワニスを使用すること以外は、実施例1と同様に行い、プリプレグ及び両面銅張積層板を得た。
実施例1で使用した多分枝型イミド樹脂40質量部、脂肪族アクリル変性シリコーン樹脂(KR-513、信越化学工業(株)製)60質量部、実施例1で使用した二酸化チタン75質量部、実施例1で使用した分散剤1.75質量部をホモミキサーにて攪拌混合して、ワニスを得た。このワニスを使用すること以外は、実施例1と同様に行い、プリプレグ及び両面銅張積層板を得た。
実施例1で使用した多分枝型イミド樹脂20質量部、芳香族エポキシ変性シリコーン樹脂として(KHE-2033、日本化薬(株)製)80質量部、実施例1で使用した二酸化チタン75質量部、実施例1で使用した分散剤1.75質量部をホモミキサーにて攪拌混合して、ワニスを得た。このワニスを使用すること以外は、実施例1と同様に行い、プリプレグ及び両面銅張積層板を得た。
なお、各試験方法の測定方法及び評価方法は、以下の通りである。
(測定方法)
1)プリプレグ外観:得られたプリプレグ表面のタック性を指触にて確認した。
2)銅張積層板内観:得られた両面銅張積層板をダイシングソーでサイズ50×50mmに切断後、研磨機を用いて、両面銅張積層板断面の研磨を行い、測定用サンプルを得た。この測定用サンプルを、光学顕微鏡を用いて、断面状態の観察を実施した。
3)反射率:両面銅張積層板をダイシングソーでサイズ50×50mmに切断後、表面の銅箔をエッチングにより除去し、測定用サンプルを得た。この測定用サンプルを、JIS Z-8722に基づき、分光測色計(コニカミノルタホールディングス(株)製:CM3610d)を用いて、457nmでの反射率を測定(n=5の平均値)した。
4)加熱後反射率:上記3)で得られたサンプルを、180℃の熱風乾燥機で24時間加熱処理した後、上記反射率の測定と同様にして反射率を測定(n=5の平均値)した。
5)光照射後反射率:上記3)で得られたサンプルを、耐候試験機乾燥機(SUV-F11、岩崎電気(株)製)で紫外線(波長:295~450nm)照射強度100mW/cm2、24時間光照射処理した後、上記反射率の測定と同様にして反射率を測定(n=5の平均値)した。
6)ピール強度:得られた両面銅張積層板をダイシングソーでサイズ10×100mmに切断後、表面の銅箔を残した測定用サンプルを得た。この測定用サンプルを、オートグラフ((株)島津製作所製:AG-IS)を用いて、JIS C6481に基づき銅箔の引き剥がし強度を測定(n=5の平均値)した。
7)Tg:両面銅張積層板をダイシングソーでサイズ12.7×2.5mmに切断後、表面の銅箔をエッチングにより除去し、測定用サンプルを得た。この測定用サンプルを、DMA法によりガラス転移温度を測定(n=3の平均値)した。
8)はんだ耐熱性:得られた両面銅張積層板をダイシングソーでサイズ50mm×50mmに切断後、表面の銅箔を残した測定用サンプルを得た。この測定用サンプルを、280℃の半田槽の中に30分浸漬した後の外観変化を、目視で観察(フクレ発生数/試験数:n=3)した。
評価結果を表1、2に示す。
Claims (13)
- 脂肪族エポキシ変性シリコーン化合物(A)、イソシアヌレート環及びカルボキシル基を有する多分枝型イミド樹脂(B)、二酸化チタン(C)及び分散剤(D)を含有する、
樹脂組成物。 - 前記脂肪族エポキシ変性シリコーン化合物(A)の含有量が、前記脂肪族エポキシ変性シリコーン化合物(A)及び前記多分枝型イミド樹脂(B)の合計100質量部に対して、20~90質量部である、
請求項1~3のいずれか一項に記載の樹脂組成物。 - 前記多分枝型イミド樹脂(B)の含有量が、前記脂肪族エポキシ変性シリコーン化合物(A)及び前記多分枝型イミド樹脂(B)の合計100質量部に対して、10~80質量部である、
請求項1~4のいずれか一項に記載の樹脂組成物。 - 前記二酸化チタン(C)の含有量が、前記脂肪族エポキシ変性シリコーン化合物(A)及び前記多分枝型イミド樹脂(B)の合計100質量部に対して、10~250質量部である、
請求項1~5のいずれか一項に記載の樹脂組成物。 - 前記二酸化チタン(C)の平均粒径が、5μm以下である、
請求項1~6のいずれか一項に記載の樹脂組成物。 - 前記二酸化チタン(C)は、SiO2、Al2O3、ZrO2、及び/または、ZnOで表面処理されたものであり、前記二酸化チタン(C)の総量100質量部に対して、SiO2が0.5~15質量部、Al2O3が0.5~15質量部、ZrO2が0.5~15質量部、及び/または、ZnOが0.5~15質量部含まれる
請求項1~7のいずれか一項に記載の樹脂組成物。 - 前記分散剤(D)が、酸価が20~200mgKOH/gである高分子湿潤分散剤である、
請求項1~8のいずれか一項に記載の樹脂組成物。 - 前記分散剤(D)の含有量が、前記脂肪族エポキシ変性シリコーン化合物(A)及び前記多分枝型イミド樹脂(B)の合計100質量部に対して、0.05~5質量部である、
請求項1~9のいずれか一項に記載の樹脂組成物。 - 請求項1~10のいずれか一項に記載のLED実装用プリント配線板用の樹脂組成物。
- 請求項1~11のいずれか一項に記載の樹脂組成物を基材に含浸または塗布してなる、
プリプレグ。 - 請求項12に記載のプリプレグを少なくとも1枚以上重ね、その片面もしくは両面に金属箔を配して積層成形して得られる、
金属箔張積層板。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20137031571A KR20140043735A (ko) | 2011-05-31 | 2012-05-16 | 수지 조성물, 그리고 이것을 사용한 프리프레그 및 금속박 피복 적층판 |
CN201280026527.0A CN103635530B (zh) | 2011-05-31 | 2012-05-16 | 树脂组合物、以及使用其的预浸料和覆金属箔层压板 |
JP2013516878A JP5397797B2 (ja) | 2011-05-31 | 2012-05-16 | 樹脂組成物、並びにこれを用いたプリプレグ及び金属箔張積層板 |
EP12793957.7A EP2716710B1 (en) | 2011-05-31 | 2012-05-16 | Resin composition and prepreg and metal foil clad laminate using same |
KR1020187016589A KR101920605B1 (ko) | 2011-05-31 | 2012-05-16 | 수지 조성물, 그리고 이것을 사용한 프리프레그 및 금속박 피복 적층판 |
US14/122,867 US20140162071A1 (en) | 2011-05-31 | 2012-05-16 | Resin composition, and prepreg and metal foil-clad laminate using the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011121924 | 2011-05-31 | ||
JP2011-121924 | 2011-05-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012165147A1 true WO2012165147A1 (ja) | 2012-12-06 |
Family
ID=47259010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2012/062516 WO2012165147A1 (ja) | 2011-05-31 | 2012-05-16 | 樹脂組成物、並びにこれを用いたプリプレグ及び金属箔張積層板 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20140162071A1 (ja) |
EP (1) | EP2716710B1 (ja) |
JP (1) | JP5397797B2 (ja) |
KR (2) | KR101920605B1 (ja) |
CN (1) | CN103635530B (ja) |
SG (1) | SG10201602082QA (ja) |
TW (1) | TWI535790B (ja) |
WO (1) | WO2012165147A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013137257A1 (ja) * | 2012-03-13 | 2013-09-19 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ及び金属箔張積層板 |
CN104448820A (zh) * | 2013-09-17 | 2015-03-25 | 深圳光启创新技术有限公司 | 氰酸酯改性组合物、氰酸酯预浸料、超材料基板、其制备方法及包括其的超材料 |
WO2015056723A1 (ja) * | 2013-10-16 | 2015-04-23 | 日本化薬株式会社 | 硬化性樹脂組成物およびその硬化物 |
US20150210832A1 (en) * | 2012-08-16 | 2015-07-30 | Mitsubishi Gas Chemical Company, Inc. | Resin sheet, support with resin layer, laminate and metal foil-clad laminate |
JP6089144B1 (ja) * | 2016-03-30 | 2017-03-01 | 日本タングステン株式会社 | 銅張積層板およびその製造方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9902851B2 (en) | 2012-10-19 | 2018-02-27 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, laminate, and printed wiring board |
JP6696988B2 (ja) * | 2015-08-17 | 2020-05-20 | 住友電気工業株式会社 | プリント配線板及び電子部品 |
JP6934225B2 (ja) * | 2017-04-27 | 2021-09-15 | 日亜化学工業株式会社 | 積層体 |
Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6121139A (ja) * | 1984-07-09 | 1986-01-29 | Hitachi Chem Co Ltd | 砥石成形用材料 |
JPH02155950A (ja) * | 1988-12-08 | 1990-06-15 | Sumitomo Bakelite Co Ltd | 封止用樹脂組成物 |
JPH10202789A (ja) | 1997-01-22 | 1998-08-04 | Shin Kobe Electric Mach Co Ltd | 積層板 |
WO2004072150A1 (ja) * | 2003-02-12 | 2004-08-26 | Nippon Kayaku Kabushiki Kaisha | エポキシ基含有ケイ素化合物及び熱硬化性樹脂組成物 |
JP2007138002A (ja) * | 2005-11-17 | 2007-06-07 | Yokohama Rubber Co Ltd:The | 熱硬化性樹脂組成物 |
JP2007231125A (ja) * | 2006-02-28 | 2007-09-13 | Kaneka Corp | 熱硬化性樹脂組成物およびその利用 |
JP2008001880A (ja) | 2005-10-21 | 2008-01-10 | Mitsubishi Gas Chem Co Inc | プリプレグおよび銅張積層板 |
JP2008094927A (ja) * | 2006-10-11 | 2008-04-24 | Kaneka Corp | 新規な熱硬化性樹脂組成物 |
JP2008274004A (ja) * | 2007-04-25 | 2008-11-13 | Kaneka Corp | 硬化性樹脂組成物およびその硬化物 |
JP2008297536A (ja) * | 2006-10-18 | 2008-12-11 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物、これを用いたフレキシブル基板及び電子部品 |
WO2009078129A1 (ja) * | 2007-12-17 | 2009-06-25 | Mitsui Chemicals, Inc. | 樹脂組成物、該樹脂組成物から得られる透明部材およびその用途 |
JP2010037442A (ja) * | 2008-08-05 | 2010-02-18 | Sekisui Plastics Co Ltd | 光反射材用帯電防止性ポリオレフィン系樹脂組成物及び光反射材 |
JP2010089493A (ja) | 2008-09-11 | 2010-04-22 | Shin-Etsu Chemical Co Ltd | シリコーン積層基板、その製造方法、シリコーン積層基板製造用シリコーン樹脂組成物及びled装置 |
JP2011005714A (ja) * | 2009-06-25 | 2011-01-13 | Toray Ind Inc | フィルムベース白色基板 |
JP2011035110A (ja) * | 2009-07-31 | 2011-02-17 | Kaneka Corp | 半導体パッケージ用樹脂組成物 |
JP2011093966A (ja) * | 2009-10-27 | 2011-05-12 | Panasonic Electric Works Co Ltd | 透明フィルム |
JP2011121924A (ja) | 2009-12-14 | 2011-06-23 | Hiro Hiyama | 歯型模型製作方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3928057A (en) * | 1974-05-30 | 1975-12-23 | Du Pont | TiO{HD 2 {B Pigment coated with porous alumina/silica and dense silica |
JPH07133351A (ja) * | 1993-11-08 | 1995-05-23 | Shin Etsu Chem Co Ltd | エポキシ変性シリコーンの製造方法 |
JP4371211B2 (ja) * | 2003-12-09 | 2009-11-25 | 信越化学工業株式会社 | 熱硬化性樹脂組成物及び光半導体封止剤 |
EP1760116B1 (en) * | 2004-06-24 | 2017-08-09 | Ishihara Sangyo Kaisha, Ltd. | Titanium dioxide pigments, process for the production thereof, and resin compositions containing the pigments |
JP4831992B2 (ja) * | 2005-04-08 | 2011-12-07 | ヘンケルエイブルスティックジャパン株式会社 | 透光性樹脂組成物 |
JP5470680B2 (ja) * | 2007-02-06 | 2014-04-16 | 日亜化学工業株式会社 | 発光装置及びその製造方法並びに成形体 |
JPWO2010107045A1 (ja) * | 2009-03-18 | 2012-09-20 | Dic株式会社 | ポリイミド樹脂、硬化性樹脂組成物及びその硬化物 |
JP2010254919A (ja) | 2009-04-28 | 2010-11-11 | Hitachi Chem Co Ltd | 光反射用熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
JP2011074355A (ja) * | 2009-09-07 | 2011-04-14 | Nitto Denko Corp | 光半導体装置用樹脂組成物およびそれを用いて得られる光半導体装置用リードフレーム、ならびに光半導体装置 |
-
2012
- 2012-05-16 KR KR1020187016589A patent/KR101920605B1/ko active IP Right Grant
- 2012-05-16 US US14/122,867 patent/US20140162071A1/en not_active Abandoned
- 2012-05-16 KR KR20137031571A patent/KR20140043735A/ko not_active Application Discontinuation
- 2012-05-16 EP EP12793957.7A patent/EP2716710B1/en active Active
- 2012-05-16 WO PCT/JP2012/062516 patent/WO2012165147A1/ja active Application Filing
- 2012-05-16 SG SG10201602082QA patent/SG10201602082QA/en unknown
- 2012-05-16 CN CN201280026527.0A patent/CN103635530B/zh active Active
- 2012-05-16 JP JP2013516878A patent/JP5397797B2/ja active Active
- 2012-05-29 TW TW101119165A patent/TWI535790B/zh active
Patent Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6121139A (ja) * | 1984-07-09 | 1986-01-29 | Hitachi Chem Co Ltd | 砥石成形用材料 |
JPH02155950A (ja) * | 1988-12-08 | 1990-06-15 | Sumitomo Bakelite Co Ltd | 封止用樹脂組成物 |
JPH10202789A (ja) | 1997-01-22 | 1998-08-04 | Shin Kobe Electric Mach Co Ltd | 積層板 |
WO2004072150A1 (ja) * | 2003-02-12 | 2004-08-26 | Nippon Kayaku Kabushiki Kaisha | エポキシ基含有ケイ素化合物及び熱硬化性樹脂組成物 |
JP2008001880A (ja) | 2005-10-21 | 2008-01-10 | Mitsubishi Gas Chem Co Inc | プリプレグおよび銅張積層板 |
JP2007138002A (ja) * | 2005-11-17 | 2007-06-07 | Yokohama Rubber Co Ltd:The | 熱硬化性樹脂組成物 |
JP2007231125A (ja) * | 2006-02-28 | 2007-09-13 | Kaneka Corp | 熱硬化性樹脂組成物およびその利用 |
JP2008094927A (ja) * | 2006-10-11 | 2008-04-24 | Kaneka Corp | 新規な熱硬化性樹脂組成物 |
JP2008297536A (ja) * | 2006-10-18 | 2008-12-11 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物、これを用いたフレキシブル基板及び電子部品 |
JP2008274004A (ja) * | 2007-04-25 | 2008-11-13 | Kaneka Corp | 硬化性樹脂組成物およびその硬化物 |
WO2009078129A1 (ja) * | 2007-12-17 | 2009-06-25 | Mitsui Chemicals, Inc. | 樹脂組成物、該樹脂組成物から得られる透明部材およびその用途 |
JP2010037442A (ja) * | 2008-08-05 | 2010-02-18 | Sekisui Plastics Co Ltd | 光反射材用帯電防止性ポリオレフィン系樹脂組成物及び光反射材 |
JP2010089493A (ja) | 2008-09-11 | 2010-04-22 | Shin-Etsu Chemical Co Ltd | シリコーン積層基板、その製造方法、シリコーン積層基板製造用シリコーン樹脂組成物及びled装置 |
JP2011005714A (ja) * | 2009-06-25 | 2011-01-13 | Toray Ind Inc | フィルムベース白色基板 |
JP2011035110A (ja) * | 2009-07-31 | 2011-02-17 | Kaneka Corp | 半導体パッケージ用樹脂組成物 |
JP2011093966A (ja) * | 2009-10-27 | 2011-05-12 | Panasonic Electric Works Co Ltd | 透明フィルム |
JP2011121924A (ja) | 2009-12-14 | 2011-06-23 | Hiro Hiyama | 歯型模型製作方法 |
Non-Patent Citations (4)
Title |
---|
"Data Sheet W208, BYK Japan Kabushiki Kaisha", DISPERBYK-180, 2008, XP055157810, Retrieved from the Internet <URL:http://www.byk.co.jp/datasheet/data/pdf/W208.pdf> [retrieved on 20120803] * |
"Data Sheet W216, BYK Japan Kabushiki Kaisha", DISPERBYK-110, DISPERBYK-11, 2008, XP008173865, Retrieved from the Internet <URL:http://www.byk.co.jp/datasheet/data/pdf/W216.pdf> [retrieved on 20120803] * |
"Data Sheet W508, BYK Japan Kabushiki Kaisha", BYK-W903, 2008, XP008173867, Retrieved from the Internet <URL:http://www.byk.co.jp/datasheet/data/pdf/W508.pdf> [retrieved on 20120803] * |
"Data Sheet W510, BYK Japan Kabushiki Kaisha", BYK-W996, 2008, XP008173866, Retrieved from the Internet <URL:http://www.byk.co.jp/datasheet/data/pdf/W510_.pdf> [retrieved on 20120803] * |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013137257A1 (ja) * | 2012-03-13 | 2013-09-19 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ及び金属箔張積層板 |
KR20140133853A (ko) * | 2012-03-13 | 2014-11-20 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 프리프레그 및 금속박 피복 적층판 |
KR101944577B1 (ko) | 2012-03-13 | 2019-01-31 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 프리프레그 및 금속박 피복 적층판 |
JPWO2013137257A1 (ja) * | 2012-03-13 | 2015-08-03 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ及び金属箔張積層板 |
US20150210832A1 (en) * | 2012-08-16 | 2015-07-30 | Mitsubishi Gas Chemical Company, Inc. | Resin sheet, support with resin layer, laminate and metal foil-clad laminate |
CN104448820A (zh) * | 2013-09-17 | 2015-03-25 | 深圳光启创新技术有限公司 | 氰酸酯改性组合物、氰酸酯预浸料、超材料基板、其制备方法及包括其的超材料 |
CN105637008A (zh) * | 2013-10-16 | 2016-06-01 | 日本化药株式会社 | 固化性树脂组合物及其固化物 |
KR20160072095A (ko) * | 2013-10-16 | 2016-06-22 | 닛뽄 가야쿠 가부시키가이샤 | 경화성 수지 조성물 및 그 경화물 |
JPWO2015056723A1 (ja) * | 2013-10-16 | 2017-03-09 | 日本化薬株式会社 | 硬化性樹脂組成物およびその硬化物 |
WO2015056723A1 (ja) * | 2013-10-16 | 2015-04-23 | 日本化薬株式会社 | 硬化性樹脂組成物およびその硬化物 |
KR102188989B1 (ko) | 2013-10-16 | 2020-12-09 | 닛뽄 가야쿠 가부시키가이샤 | 경화성 수지 조성물 및 그 경화물 |
JP6089144B1 (ja) * | 2016-03-30 | 2017-03-01 | 日本タングステン株式会社 | 銅張積層板およびその製造方法 |
WO2017169138A1 (ja) * | 2016-03-30 | 2017-10-05 | 日本タングステン株式会社 | 銅張積層板およびその製造方法 |
JP2017185780A (ja) * | 2016-03-30 | 2017-10-12 | 日本タングステン株式会社 | 銅張積層板およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20140043735A (ko) | 2014-04-10 |
EP2716710B1 (en) | 2019-02-27 |
EP2716710A4 (en) | 2015-05-20 |
CN103635530A (zh) | 2014-03-12 |
CN103635530B (zh) | 2016-05-18 |
KR20180071382A (ko) | 2018-06-27 |
TWI535790B (zh) | 2016-06-01 |
EP2716710A1 (en) | 2014-04-09 |
SG10201602082QA (en) | 2016-04-28 |
US20140162071A1 (en) | 2014-06-12 |
JP5397797B2 (ja) | 2014-01-22 |
TW201307484A (zh) | 2013-02-16 |
JPWO2012165147A1 (ja) | 2015-02-23 |
KR101920605B1 (ko) | 2018-11-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5397797B2 (ja) | 樹脂組成物、並びにこれを用いたプリプレグ及び金属箔張積層板 | |
JP6120102B2 (ja) | 樹脂組成物、プリプレグ及び金属箔張積層板 | |
JP5888513B2 (ja) | 樹脂組成物、プリプレグ及び金属箔張積層板 | |
JP6164500B2 (ja) | 樹脂シート、樹脂層付き支持体、積層板及び金属箔張積層板 | |
JPWO2012132965A1 (ja) | 樹脂組成物、プリプレグ及び金属箔張積層板 | |
JPWO2017006891A1 (ja) | 樹脂組成物、プリプレグ、金属箔張積層板、及びプリント配線板 | |
KR102039874B1 (ko) | 프리프레그 및 이것을 사용한 적층판 그리고 프린트 배선판 | |
JP4940680B2 (ja) | 樹脂組成物並びにそれを用いたプリプレグ及び積層板 | |
JP2010065092A (ja) | 樹脂組成物並びにこれを用いたプリプレグ及び積層板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 12793957 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2013516878 Country of ref document: JP Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 20137031571 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14122867 Country of ref document: US |