WO2012163229A1 - 防伪电子标签的设计制作方法及其防伪电子标签和防伪包装 - Google Patents

防伪电子标签的设计制作方法及其防伪电子标签和防伪包装 Download PDF

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Publication number
WO2012163229A1
WO2012163229A1 PCT/CN2012/075767 CN2012075767W WO2012163229A1 WO 2012163229 A1 WO2012163229 A1 WO 2012163229A1 CN 2012075767 W CN2012075767 W CN 2012075767W WO 2012163229 A1 WO2012163229 A1 WO 2012163229A1
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WO
WIPO (PCT)
Prior art keywords
antenna
electronic tag
chip
fragile paper
paper substrate
Prior art date
Application number
PCT/CN2012/075767
Other languages
English (en)
French (fr)
Inventor
王刚
Original Assignee
上海商格信息科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上海商格信息科技有限公司 filed Critical 上海商格信息科技有限公司
Priority to US14/123,182 priority Critical patent/US20140239074A1/en
Publication of WO2012163229A1 publication Critical patent/WO2012163229A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07798—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card part of the antenna or the integrated circuit being adapted for rupturing or breaking, e.g. record carriers functioning as sealing devices for detecting not-authenticated opening of containers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • G06K19/0776—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole

Definitions

  • the invention relates to an application technology in the field of radio frequency identification, in particular to an anti-detonation ultra-high frequency electronic label designing method for resisting metal surface interference and an anti-counterfeit electronic label obtained by the method, and an anti-counterfeit packaging with the same .
  • Background technique
  • Radio Frequency Identification technology has been widely used in many fields such as logistics and retail, which has effectively improved management efficiency and greatly reduced labor costs.
  • RFID Radio Frequency Identification
  • the RFID system consists of an RFID electronic tag and an RFID reader. The working process is that the RFID reader generates electromagnetic waves of a specific frequency and transmits them through spatial coupling (also called sending a question signal). When the RFID tag enters When the RFID reader reads the reading distance, the RFID electronic tag receives the question signal and backscatters the electromagnetic wave sent by the RFID reader to return to the RFID reader (ie, the response signal).
  • Radio frequency identification technology has great application potential in the field of anti-counterfeiting.
  • Paper-based printing anti-counterfeiting technology (such as laser anti-counterfeiting, digital anti-counterfeiting, etc.) is not unique and exclusive, easy to copy, and difficult to play a real anti-counterfeiting effect.
  • Radio frequency identification anti-counterfeiting technology has become the new favorite in the above industry with its excellent anti-counterfeiting ability.
  • RFID anti-counterfeiting technology it is necessary to set one on each protected item. Passive RFID tags, each RFID tag has a globally unique ID number stored in the chip's read-only memory, which ensures that it cannot be modified and cannot be counterfeited, greatly improving anti-counterfeiting performance.
  • the protected articles are not bulky, and most of them are packaged in aluminum foil or aluminized paper. If the ordinary electronic labels are attached to the packaging surface, they cannot be read at all.
  • the RFID antenna usually uses a symmetrical vibrator, and the corresponding RFID tag basically adopts a split structure in which the antenna and the chip are separated to realize the anti-counterfeiting purpose.
  • Ultra-high frequency electronic tags communicate with readers using radio waves in the 900MHz range, enabling remote reading distances, but they are greatly affected by metal and liquid environments. Attaching to the surface of metal materials may even cause communication failure. .
  • aluminum foil or vacuum aluminized materials are commonly used for packaging and printing in the food, beverage, pharmaceutical, cigarette, and electrical industries. Therefore, electronic labels cannot be used to realize effective management of anti-counterfeiting and anti-smuggling products.
  • most of the existing anti-counterfeiting labels are made of fragile materials, which have the effect of tearing or ruining, but directly Used for anti-counterfeit electronic labels, which can easily lead to the destruction of electronic labels during attachment and transportation.
  • the object of the present invention is to provide a method for manufacturing an ultra-high frequency electronic label attached to a tamper-proof surface of a packaging surface containing a metal component, and the tamper-proof anti-counterfeit electronic label obtained by the method can be reliably read on a metal surface. It can avoid or reduce the probability of accidental damage of the label during attachment and transportation, and effectively improve the anti-counterfeiting performance.
  • the design and manufacturing method of the invention are ingenious, simple and feasible, low in cost and large in productivity.
  • a second object of the present invention is to provide an ultra-high frequency electronic tag attached to a tamper-evident sticker of a surface containing a metal component obtained by the above-described design and production method.
  • a third object of the present invention is to disclose an electronic security package comprising the above-mentioned tamper-evident electronic tag and a metal surface marker.
  • a method for manufacturing an ultra-high frequency electronic tag with anti-metal surface interference against metal surface interference comprising the following steps:
  • the tag antenna design uses a folded symmetrical vibrator antenna.
  • the antenna and the fragile paper substrate are firmly combined into one body to ensure that the antenna and the fragile material are broken and torn together when they are peeled off from the attachment.
  • the size of the composite gasket should be less than or equal to the size of the fragile paper substrate, thereby making the electron
  • the antenna forms an arched spatial structure at the center of the chip.
  • An anti-metal surface interference-resistant UHF electronic tag obtained by the above method is specifically a composite structure RFID electronic tag, and the RFID electronic tag of the composite structure includes a self-adhesive bottom layer from bottom to bottom.
  • "Island” type composite gasket, fragile paper substrate, folded symmetrical vibrator antenna and chip, self-adhesive surface layer and surface layer material, the antenna and the fragile paper substrate are firmly integrated into one body, and the chip is electrically connected with the antenna, " The island “type composite gasket is facing the position of the chip, and the size of the composite gasket is less than or equal to the size of the fragile paper substrate.
  • the tamper-proof ultra-high frequency electronic tag and the metal surface identifier interfered by the above-mentioned anti-metal surface constitute the electronic anti-counterfeiting packaging technical solution of the present invention, and the structure thereof comprises an RFID electronic tag having a composite structure and a marker body, and the composite structure
  • the RFID electronic tag includes a self-adhesive bottom layer, an "island” type composite gasket, a fragile paper substrate, a folded symmetrical vibrator antenna and a chip, a self-adhesive surface layer and a surface layer, and an antenna and a fragile paper substrate.
  • the chip is electrically connected to the antenna, and the "island" type composite gasket is opposite to the position of the chip.
  • the size of the composite gasket is less than or equal to the size of the fragile paper substrate; the surface of the marker body is made of aluminized paper. Covering, and the surface of the body has a gap space, the entire electronic label is attached to the surface of the identifier body, and the antenna structure with the label symmetry is symmetric with the slit, and the chip portion of the label is aligned with the position of the slit.
  • the antenna structure design uses a sheet-shaped folded symmetrical vibrator, which comprises a sheet-shaped folded symmetrical vibrator conductor at a central position and a load pole conductor at a side position, and the sheet-like folded symmetrical vibrator conductor is folded and connected with the IC chip. a closed loop, the load pole conductor and the sheet-like folding pair The vibrator conductor is electrically connected, and the load pole conductor is a curved load pole.
  • the sheet-like folded symmetrical vibrator conductor is rectangular or annular.
  • the loading poles are designed in multiple pairs, and each pair of loading poles is symmetrically disposed on the sheet-shaped folded symmetrical vibrator conductor.
  • a straight line is printed on the upper surface of the watchboard at the chip position as a mark to facilitate alignment of the appropriate position attached to the gap of the package surface.
  • the RFID tag antenna of the invention uses a folded symmetric vibrator antenna to make the antenna structure compact, and is better adapted to the label applied to the surface of the small volume marker.
  • the antenna can be selected from conventional forms such as wire, metal foil or printed wire.
  • the material can be selected from conventional conductors such as silver, aluminum and copper.
  • the antenna is combined with the fragile paper by conventional methods such as printing, vacuum plating, lamination, etc. in the prior art, as long as the antenna and the fragile paper are broken and torn together when they are peeled off from the attached marker.
  • the fragile paper material is commercially available, and the raw material source belongs to the prior art, and the label substrate is made of the fragile material, which has the effect of tearing or ruining.
  • the direct electrical connection between the chip and the RFID antenna is achieved by using an existing ACP conductive adhesive back-up package, strap strip bonding or wire bonding. Further strengthening, the electrical connection between the chip and the RFID antenna is cured by using a material such as UV glue.
  • a spacer is placed under the chip to form a partially convex "island" type structure, so that the metal antenna forms a three-dimensional arched space structure at the center of the chip, which is a key technology for solving the UHF band RFID tag can adapt to the metal environment. Measures.
  • the material of the protective surface layer material may be various films such as PE film or paper, and the surface layer material plays a key protective role when the label is attached to the product packaging, because the surface layer material is larger than the fragile paper.
  • the antenna area on the substrate that is, the surface layer completely covers the RFID antenna and the chip, so that the RFID antenna and the chip are completely protected. Effectively protect the RFID antenna and the chip from damage under normal conditions, and avoid the antenna from being broken due to external force stretching.
  • the design is simple and ingenious, and the effect is extremely remarkable.
  • an anti-counterfeiting pattern can be printed on the inner side surface of the surface layer material, so that when attempting to peel off the anti-counterfeit electronic label on the surface of the marking object, the surface layer material will fall off from the surface of the electronic label and leave the anti-counterfeiting pattern damage mark. Indicates that the tag has been used.
  • the bottom surface of the fragile paper substrate is coated with self-adhesive glue and adhered to the bottom paper, and the "island" type composite gasket is fixed to the position specified on the label substrate by the self-adhesive paper, and the bottom paper is applied to the fragile paper substrate. Play a protective role.
  • the electronic label is attached to the marking object, just peel off the bottom layer of the bottom paper and directly attach the electronic label to the surface of the object.
  • the surface of the package body is covered by aluminized paper and has a gap space.
  • the anti-counterfeit electronic label obtained by the invention is attached to the surface of the package body at the position of the chip portion alignment slit to form the anti-counterfeit package of the present invention.
  • the anti-counterfeiting package is provided to the manufacturer, and only needs to be fixed by sealing after the product is loaded, and the anti-counterfeit electronic tag is activated. When the consumer opens the package, it needs to tear from the gap, thus destroying the security electronic tag.
  • the ultra-high frequency UHF passive FRID tag obtained by the method of the invention is specially applied to such marking objects which are commonly used for packaging and printing of aluminum foil or vacuum aluminized material such as food, alcohol, beverage, medicine, cigarette, electric appliance, etc. The invention can effectively manage the items of these identification objects and prevent counterfeiting and stockpiling.
  • the anti-counterfeit electronic tag obtained by the method of the invention uses a single layer or a plurality of layers of fragile material of appropriate thickness as the antenna dielectric, and the outer surface material
  • the dielectric layer (with chip and antenna), the island composite pad, and the self-adhesive to form a composite label structure simplifying the structure, producing a flexible metal-resistant electronic tag, and having a tamper-proof function, integrating various anti-counterfeiting technologies, Excellent anti-counterfeiting effect, surface layering
  • the electronic anti-counterfeiting package of the invention has built-in antenna and chip integrated RFID tag in advance, and seals the RFID tag on the package, thereby reducing the overall cost, reducing the difficulty of implementation of the manufacturer, and helping to reduce the security of the production factory.
  • the probability of accidental damage when the electronic tag is used, and the anti-counterfeiting performance can be effectively improved.
  • FIG. 1 is a schematic front view showing the structure of an RFID tag in the first embodiment.
  • Figure 2 is a side elevational view of the RFID composite tag structure of the invention. It is only used to facilitate the description of the structure and positional relationship between the layers in the label. The size, thickness and shape are not indicative.
  • Figure 3 is a schematic view showing the position of the RFID tag adhered to the surface of the marker.
  • Marking instructions 100-label thickness layer, 1-sheet folded symmetrical vibrator conductor, 2-loaded pole conductor, 3-chip, 4-"island" spacer, 5-sheet laminate, 6-back paper, 7- Gap, 8-mark metal surface. 9-layer, 10-layer. detailed description
  • the UHF UHF passive FRID tag is attached to a foil or aluminized paper printed box. There will be a gap in the middle of the box, and the label will cover the sides of the gap, as shown in Figure 3.
  • Antenna material Low temperature curing printing silver paste (thickness 3-20um) (90 degrees Celsius for half an hour) Printing network 280Mesh.
  • Antenna substrate Fragile paper 100um ⁇ 200um (dielectric constant Er ⁇ 3), storage temperature 5 ⁇ 40 degrees Celsius, humidity: greater than 40%.
  • the label surface will be laminated with an ultra-thin anti-counterfeit printing paper. There is a layer of release film between the paper and the label.
  • the reading distance is greater than 5 ⁇ 10cm.
  • the antenna structure is designed with a sheet-shaped folded symmetrical vibrator including a sheet-like folded symmetrical vibrator conductor 1 at a center position and a load pole conductor 2 at a side position, the sheet shape
  • the folded symmetrical vibrator conductor is folded and joined to the IC chip 3 to form a closed loop.
  • two pairs of load poles 2 are added on the outer side of the symmetric folded frame, and a pair of load poles are bent to reduce the overall antenna area.
  • the actual working frequency determines the size of the vibrator. This not only reduces the characteristic impedance of the antenna, but also makes the impedance curve change smoothly, and can widen the working frequency band. At the same time, it plays an important role in greatly increasing the radar cross section of the tag, which is extremely critical in the microwave RFID system.
  • the input resistance of the antenna can be changed by adjusting the spacing of the sheet-shaped folded symmetrical vibrator conductor loops.
  • Anti-resistance used to achieve impedance matching between the antenna and the tag chip, to achieve maximum transmission of energy into and out of the tag chip.
  • the input impedance of the chip IC may be an arbitrary value, and the design of the antenna is difficult to achieve the optimum.
  • the specific parameters of the spacing of the chip-shaped symmetrical vibrator conductor loop are determined by actual needs, so that the sensing capability of the tag can be improved and the tag can be improved. The sensitivity of the label.
  • the curved design of the loading pole 2 may be rectangular right angle bending, triangular bending, curved bending or trapezoidal bending, etc., which is not necessarily limited in the embodiment.
  • the sheet-shaped symmetrical vibrator conductor is rectangular or annular, and its horizontal width ranges from 2 to 50.8 mm, and its vertical length ranges from 2 to 80 mm, which is suitable for practical application.
  • an "island” type composite spacer 4 is placed under the fragile paper substrate and at the center of the alignment chip 3, and the antenna forms an arched space structure at the center of the chip.
  • the "island” type composite mat has a thickness of between 0.05 mm and 0.3 mm.
  • the RFID electronic tag obtained by the method of the present invention is an RFID electronic tag having a composite structure.
  • the bottom to the surface includes a self-adhesive bottom layer, an "island” type composite gasket 4, a fragile paper substrate, and Folding symmetrical vibrator antenna and chip, self-adhesive surface layer and surface layer material 5.
  • the antenna is firmly integrated with the fragile paper substrate, and the chip is electrically connected to the antenna.
  • the antenna and the chip layer, the substrate layer, and the two layers of the adhesive layer are laminated into the label thickness layer 100)
  • the spacer 4 faces the position of the chip 3, and the size of the composite spacer is smaller than the size of the fragile paper substrate.
  • the surface of the identifier body is covered by aluminized paper, and the body surface 8 has a gap 7 space, and the entire electronic label is attached to the surface of the identifier body, and the symmetrical antenna structure is symmetric with the gap.
  • the chip 3 portion of the label is aligned with the position of the slit 7.
  • the anti-counterfeit electronic label is attached to the surface 8 of the package body at the position where the chip 3 is aligned with the slit 7.
  • the obtained anti-counterfeit package is provided to the manufacturer, and only needs to be fixed by the sealing after the product is loaded, and the anti-counterfeit electronic label is activated, when the consumer opens the package. It is necessary to tear from the slit 7, and at the same time, destroy the security electronic tag.
  • the substrate, the antenna and the sticker in the label constitute the thickness layer 100 of the label, and the thickness is set to 0.05 mm.
  • the dielectric substrate is composed of one or more layers of fragile material having a dielectric constant of between 1 and 100.
  • the thickness of the label thickness layer 100 is larger than 1 mm, since the label is too thick, it is easily peeled off and reused from the attached matter, and there is no anti-counterfeiting meaning. Due to the extremely pulverizing nature of the shredded paper, it is difficult to construct a normal electronic label when the thickness of the thickness layer 100 is less than 0.05 mm.
  • the thickness of the RFID antenna and the self-adhesive layer is 0.2 mm, and the recognition and anti-counterfeiting effect are optimal.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Details Of Aerials (AREA)

Abstract

一种防伪电子标签的设计制作方法及其防伪电子标签和防伪包装，属于无线射频识别领域的应用技术。标签天线设计采用折合对称振子天线形式，以易碎纸作为天线的基板，将天线与易碎纸基板牢固结合成一体，在易碎纸基板底面且对准芯片的中央位置处叠加一个"岛"型复合垫片，使天线在芯片所在的中央处形成拱形的空间结构，在易碎纸基板面层涂敷不干胶，该不干胶上面再复合上涂布有成膜剂的表层面材，表层面材和不干胶尺寸大于易碎纸基板的面积。通过该方法获得的防揭贴防伪电子标签能实现在金属表面可靠读取，能避免或减少标签在粘附及运输过程中意外损毁的概率，有效提高防伪性能。

Description

说明书 防伪电子标签的设计制作方法及其防伪电子标签和防伪包装 技术领域
本发明涉及无线射频识别领域的应用技术， 特别是涉及一种抗金属表 面干扰的防揭贴超高频电子标签设计制作方法和该方法获得的防伪电子 标签， 及其内置该电子标签的防伪包装。 背景技术
无线射频识别 （Radio Frequency Identification; 简称 RFID) 技术已广 泛应用于物流业及零售业等诸多领域， 其有效提高了管理效率， 并大大节 约了人力成本。 射频识别系统由 RFID电子标签与 RFID读写器组成， 其 工作过程是， RFID 读写器产生特定频率的电磁波并通过空间耦合的方式 发送出去 （也称作发送提问信号）， 当 RFID电子标签进入 RFID读写器的 读取距离时， RFID电子标签即会接收到该提问信号并将 RFID读写器发送 的电磁波进行反向散射偶合后返回给 RFID读写器 （即回复应答信号）。
射频识别技术在防伪领域有着巨大的应用潜力。 在酒类、 烟草和药品 等行业中， 一旦出现仿冒产品， 将会给社会和个人带来不可估量的损失。 这些产品的生产流通使用， 需要有安全有效的防伪措施。 纸基印刷防伪技 术 （例如激光防伪、 数字防伪等） 不具备唯一性和独占性， 易复制， 难以 起到真正的防伪作用。 射频识别防伪技术以其优异的防伪能力而成为上述 行业中的新宠。 在射频识别防伪技术中， 需要在每个被保护物品上设置一 个被动式的 RFID电子标签， 每个 RFID电子标签都有一个全球唯一的 ID 号码，该 ID号码存储在芯片的只读存储器中， 如此可确保无法修改和无法 仿造， 大大提高了防伪性能。
但在上述酒类、 烟草或药品行业中被保护物品体积不大， 而且大多釆 用铝箔纸或镀铝纸印刷包装盒的包装方式， 普通电子标签如果贴在包装表 面， 根本无法有效读取。 现有技术中的 RFID天线通常釆用对称振子， 相 应的 RFID 标签基本都釆用天线与芯片分离的分体式结构来实现防伪目 的。 2007年 6月 20日公开的专利申请号为 200510126482.6的"基于射频识 别技术的酒类防伪系统及方法"的中国专利就揭示了一种分体式 RFID 防 伪标签， 其天线本体位于酒瓶本体的外侧， 芯片设置在瓶盖内侧， 天线本 体与芯片之间的连接通路是由两者对应的引线及悍点 （或者附加金属带） 对应连接实现。 由此导致了 RFID防伪标签占用空间大、 结构复杂、 制造 成本较高和易在包装运输过程中损坏等诸多问题。 也有专利揭示把电子标 签设计到瓶盖内部或贴在瓶盖表面的方法。 但是由于产品外包装由铝箔覆 盖， 该标签在包装不打开的情况下无法有效读取， 而打开外包装又破坏了 产品的完整性， 降低了 RFID电子标签防伪的作用。
超高频电子标签由于使用 900MHz 范围的无线电波与读写器进行通 讯， 能够实现较远的读取距离， 但受金属和液体环境的影响很大， 贴附在 金属材料表面甚至会导致无法通讯。 而当前在食品、 饮料、 药品、 香烟、 电器行业中普遍使用铝箔或真空镀铝材料进行包装和印刷， 因此无法应用 电子标签实现对单品有关防伪、 防窜货的有效管理。 另外， 目前外贴的防 伪标识大多数釆用易碎材料制作， 具有一撕即毁的效果， 但是将之直接应 用于防伪电子标签， 在贴附和运输过程中极易导致电子标签损毁 发明内容
本发明的目的是提供一种贴附在含有金属成分的包装表面的防揭贴 的超高频电子标签设计制作方法， 通过该方法获得的防揭贴防伪电子标签 能实现在金属表面可靠读取， 能避免或减少标签在贴附及运输过程中意外 损毁的概率， 有效提高防伪性能。 本发明设计及制作方法巧妙、 简单可 行、 成本低廉、 产能大。
本发明第二个目的在于提供由上述设计制作方法获得的贴附在含有 金属成分的包装表面的防揭贴的超高频电子标签。
本发明第三个目的是公开了由上述防揭贴电子标签与金属表面标识 物构成的电子防伪包装。
以上三个发明目的依次通过如下三个技术方案实现：
一种抗金属表面干扰的防揭贴超高频电子标签设计制作方法， 该方法 技术方案包括如下步骤：
( 1 ) 标签天线设计釆用折合对称振子天线形式。
( 2 ) 以易碎纸作为天线的基板， 将天线与易碎纸基板牢固结合成一 体， 保证天线与易碎材料从附着物上被剥离的时两者一起被破碎撕毁。
( 3 ) 将芯片放置于折合对称振子天线中间的供电部分， 实现天线和 芯片之间的电性连接。
( 4 ) 在易碎纸基板底面且对准芯片的中央位置处叠加一个 "岛"型 复合垫片， 该复合垫片的尺寸应小于等于易碎纸基板的尺寸， 从而使电子 标签黏贴于标识物表面后天线在芯片所在的中央处形成拱形的空间结构。
(5 )在上述易碎纸基板面层涂敷不干胶， 该不干胶上面再复合上涂布 有成膜剂的表层面材， 表层面材和不干胶尺寸大于易碎纸基板面积。 由此 表层面材完全覆盖 RFID天线和芯片， 并在四周留出空白。
由上述方法获得的一种抗金属表面干扰的防揭贴超高频电子标签， 具 体为一种复合结构的 RFID电子标签， 所述复合结构的 RFID电子标签由 底至面依次包括不干胶底层、 "岛"型复合垫片、 易碎纸基板、 折合对称 振子天线及芯片、 不干胶面层和表层面材， 天线与易碎纸基板牢固结合成 一体， 芯片与天线电性连接， "岛"型复合垫片正对芯片所在位置， 该复 合垫片的尺寸小于等于易碎纸基板的尺寸。
由上述抗金属表面干扰的防揭贴超高频电子标签与金属表面标识物构 成了本发明电子防伪包装技术方案， 其结构包括具有复合结构的 RFID电 子标签和标识物本体， 所述复合结构的 RFID电子标签由底至面依次包括 不干胶底层、 "岛"型复合垫片、 易碎纸基板、 折合对称振子天线及芯片、 不干胶面层和表层面材， 天线与易碎纸基板牢固结合成一体， 芯片与天线 电性连接， "岛"型复合垫片正对芯片所在位置， 该复合垫片的尺寸小于 等于易碎纸基板的尺寸； 所述标识物本体表面由镀铝纸覆盖， 且本体表面 具有一个缝隙空间， 将整个电子标签贴附在标识物本体表面， 标签对称的 天线结构以缝隙为对称线， 标签的芯片部位对准缝隙位置处。
所述天线结构设计釆用片状折合对称振子， 它包括处于中心位置的片 状折合对称振子导体和处于边侧位置的加载极导体， 所述片状折合对称振 子导体折合并与 IC 芯片连接呈闭合回路， 所述加载极导体与片状折合对 称振子导体电性连接， 加载极导体为呈弯曲状的加载极。 所述片状折合对 称振子导体为矩形或环形。 所述加载极设计成多对， 每对加载极对称设置 于片状折合对称振子导体上。
在所述表层面材的上表面在芯片位置处印制一条直线作为标识， 便于 对齐贴附在包装表面缝隙的合适位置。
进一步加强防伪措施， 在所述天线上设有模切刀口线， 揭起时将必然 破坏芯片和天线之间的电性连接， 导致电子标签失效， 防止回收造假。
本发明 RFID标签天线釆用折合对称振子天线， 使天线结构小型化， 更好得适应标签应用于小体积标识物表面上。 天线可以选择金属丝、 金属 箔或者印刷导线等常规的形式， 材质可以选择银、铝、铜等常规的导电体。 釆用现有技术中印刷、 真空镀、 复合等常规方式将天线与易碎纸结合， 只 要保证天线与易碎纸从附着标识物上被剥离的时一起破碎撕毁。 易碎纸材 料为市售， 原料来源属现有技术， 选用易碎材料制作标签基板， 具有一撕 即毁的效果。 釆用现有技术已有的 ACP导电胶倒扣封装、 strap条带贴合 或引线键合等方式实现芯片与 RFID天线之间直接电性连接。进一步强化， 芯片与所述 RFID天线电性连接部位以 UV胶等材料加以固化保护。 隔着 基板在芯片下放置垫片形成局部凸出的 "岛"型结构， 使金属天线在芯片 所在的中央处形成立体的拱形空间结构，是解决 UHF频段 RFID标签能适 应金属环境的关键技术措施。 起保护作用的表层面材的材料可以是各种薄 膜如 PE膜或纸张， 标签贴附到产品包装上面时该表层面材起到的关键的 保护作用， 由于使表层面材尺寸大于易碎纸基板上的天线面积， 即表层面 材完全覆盖 RFID天线和芯片， 即可使 RFID天线和芯片得到完全保护， 有效保护 RFID天线和芯片正常情况下不易损坏， 避免由于外力拉伸导致 天线断裂， 该设计简单而巧妙， 而达到的效果极其显著。 为了进一步强化 防伪效果， 在表层面材内侧面上可印刷有防伪图案， 由此在试图剥离标识 物表面的防伪电子标签时， 表层面材会从电子标签表面脱落并留下防伪图 案损坏印记， 表明该标签已经使用过。
为便于储藏和运输， 易碎纸基板底面涂敷不干胶并黏附有底纸， 不干 胶对 "岛"型复合垫片限位在标签基板规定的位置， 且底纸对易碎纸基板 起到保护作用。 电子标签被黏贴于标识物体时， 只要揭掉最底层的底纸， 直接将电子标签黏贴于对象物表面即可。 包装本体表面由镀铝纸覆盖， 具 有一个缝隙空间， 本发明获得的防伪电子标签以芯片部位对齐缝隙位置贴 附在包装本体表面， 形成本发明防伪包装。 该防伪包装提供给生产厂家， 在装入产品以后只需要通过加封固定， 启动防伪电子标签。 消费者打开包 装的时候需要从缝隙处撕裂， 如此， 同时破坏防伪电子标签。 通过本发明 方法制作获得的超高频 UHF无源 FRID标签，特应用于食品、酒类、饮料、 药品、 香烟、 电器等普遍使用铝箔或真空镀铝材料进行包装和印刷的这类 标识物体， 本发明能实现对这些标识物体单品的有效管理， 防止出现伪造 和窜货。
与现有技术中釆用特殊设计硬质天线的抗金属 RFID标签相比， 本发 明方法获得的防伪电子标签釆用了恰当厚度的单层或多层易碎材料为天 线电介质， 由外表层面材、 电介质层 （附设有芯片及天线）、 岛型复合垫、 不干胶形成复合型标签结构， 简化结构， 制作出柔性抗金属电子标签， 并 具有防揭贴功能， 集成多种防伪技术， 具有极佳的防伪效果， 表层面材的 使用有效保护了易碎纸防伪电子标签， 并可以釆用机械化设备大批量生 产， 降低了成本。
本发明的电子防伪包装事先内置了天线与芯片一体式的 RFID标签， 且将 RFID标签密封在了包装上， 降低了整体成本， 减少生产厂家的实施 难度， 有助于减小生产工厂贴附防伪电子标签时意外损坏的概率， 并可有 效提高防伪性能。 附图说明
图 1为本实施例 1中 RFID标签主视结构示意图。
图 2为发明 RFID复合型标签结构的侧面示意图。 仅用以方便描述标 签内各层之间的构造和位置关系， 大小、 厚度和形状不具有表征意义。
图 3发明 RFID标签黏贴于标示物表面的位置示意图。
标记说明： 100-标签厚度层， 1-片状折合对称振子导体， 2-加载极导 体， 3-芯片， 4- "岛型"垫片， 5-表层面材， 6-底纸， 7-缝隙， 8-标识物金 属表面。 9-面层， 10-底层。 具体实施方式
以下为本发明的一个具体应用例， 为一款关于釆用易碎纸制作抗金属 的超高频 UHF无源 RFID标签：
1. 所标识物体的形状及物理特性： 该超高频 UHF无源 FRID标签， 贴附到铝箔或镀铝纸印刷的包装盒上。 盒子中间会有一道缝隙 7， 标签覆 盖在缝隙两侧，如图 3所示。
2.应用需达到的使用效果： 盒子打开时该易碎纸标签的天线要完全毁 坏。
3.天线材质： 低温固化印刷银浆 （厚度 3-20um) (90摄氏度半小时） 印刷网 280Mesh。
4.天线基材：易碎纸 100um〜200um (介电常数 Er < 3)， 保存温度 5~40 摄氏度， 湿度： 大于 40% 。
5.尺寸： 长方形，20mm*40mm，"岛 "型复合垫 4尺寸：正方形 18*18mm
6.倒扣封装， 釆用 SONYACP - BP304E 导电胶。
7.芯片： NXP G2il
8.标签表面会复合一层超薄的防伪印刷面纸 6， 面纸与标签之间有一 层离型胶膜。
9.读取距离大于 5〜10cm。
如图 1所示的本实施例天线， 天线结构设计釆用片状折合对称振子， 它包括处于中心位置的片状折合对称振子导体 1和处于边侧位置的加载极 导体 2，所述片状折合对称振子导体 1折合并与 IC芯片 3连接呈闭合回路。 共有两对加载极导体， 它们分别与片状折合对称振子导体 1电性连接， 加 载极导体 2为呈弯曲状的加载极。
为了减小其物理尺寸， 本实施例在对称折合阵子的外面再加两对加载 极 2， 并对其中一对加载极进行弯曲设计 ， 目的是减小整体天线面积， 实 际工作频率决定了振子大小， 这样不仅可以降低天线的特性阻抗， 使其阻 抗曲线变化平缓， 还可以展宽工作频带， 同时它的一个重要作用是大大增 加了标签的雷达散射截面， 这在微波 RFID系统中是极为关键的。
通过调节片状折合对称振子导体回路内间距可以改变天线的输入阻 抗， 用于实现天线与标签芯片之间的阻抗匹配， 实现传输最大的能量进出 标签芯片。 在 RFID应用中， 芯片 IC的输入阻抗可能是任意值， 天线的设 计难以达到最佳， 片状折合对称振子导体回路内间距的具体参数由实际需 要来确定， 如此可以提高标签的感应能力， 提高标签的灵敏度。
本实施例中，加载极 2的弯曲设计可以为矩形直角弯曲、三角形弯曲、 弧形弯曲或梯形弯曲等， 实施例中不必要作具体限定。
优选， 所述片状折合对称振子导体为矩形或环形， 其水平宽度范围为 2〜50.8mm， 其垂直长度范围为 2〜80mm， 以适应实际应用需要为准。
如图 2所示， 在易碎纸基板下面且对准芯片 3的中央位置处叠加一个 "岛"型复合垫片 4， 天线在芯片所在的中央处形成拱形的空间结构。 所 述 "岛"型复合垫的厚度为 0.05mm至 0.3mm之间。 电子标签启用时， 揭 去底纸 6， 将标签如图 3所示黏贴于标识物表面， 天线在芯片所在的中央 处形成拱形的空间结构同时感应标识物金属表面， 标识物金属表面接入天 线的组成部分。
由本发明方法获得的 RFID电子标签为一种具有复合结构的 RFID电 子标签， 如图 2所示， 由底至面依次包括不干胶底层、"岛"型复合垫片 4、 易碎纸基板、 折合对称振子天线及芯片、 不干胶面层和表层面材 5。 天线 与易碎纸基板牢固结合成一体， 芯片与天线电性连接， （图 2 中将天线及 芯片层、 基板层、 两层不干胶层合为标签厚度层 100)， "岛"型复合垫片 4正对芯片 3所在位置， 该复合垫片的尺寸小于易碎纸基板的尺寸。 所述 标识物本体表面由镀铝纸覆盖， 且本体表面 8具有一个缝隙 7空间， 将整 个电子标签贴附在标识物本体表面， 标签对称的天线结构以缝隙为对称 线， 标签的芯片 3部位对准缝隙 7位置处。 防伪电子标签以芯片 3部位对 齐缝隙 7位置贴附在包装本体表面 8， 得到的防伪包装提供给生产厂家， 在装入产品以后只需要通过加封固定， 启动防伪电子标签， 消费者打开包 装的时候需要从缝隙 7处撕裂， 如此， 同时破坏防伪电子标签。
为更好的适应实际应用效果， 对技术方案作进一步限定， 如图 2所示 的侧视示意图， 标签中基板、 天线和不干胶构成了标签的厚度层 100， 该 厚度设定为 0.05mm至 1mm之间较为适宜，所述电介质基板由一层或多层 易碎材料构成，介电常数为 1到 100之间。通过实施例知，标签厚度层 100 的厚度大于 1mm时， 由于标签过厚易于从附着物上被剥离重用， 没有防 伪意义。 由于易碎纸的极易粉碎的性质， 厚度层 100的厚度小于 0.05mm 时很难构建正常的电子标签。优选， RFID天线与不干胶层的厚度为 0.2mm， 识别兼防伪效果最佳。

Claims

权利要求
1、 一种抗金属表面干扰的防揭贴超高频电子标签设计制作方法， 其 特征在于， 该方法包括如下步骤：
( 1 ) 标签天线设计釆用折合对称振子天线形式；
(2) 以易碎纸作为天线的基板， 将天线与易碎纸基板牢固结合成一 体；
(3 ) 将芯片放置于折合对称振子天线中间的供电部分， 实现天线和 芯片之间的电性连接；
(4) 在易碎纸基板底面且对准芯片的中央位置处叠加一个 "岛"型 复合垫片， 该复合垫片的尺寸应小于或者等于易碎纸基板的尺寸， 从而使 天线在芯片所在的中央处形成拱形的空间结构；
(5 )在上述易碎纸基板面层涂敷不干胶， 该不干胶上面再复合上涂布 有成膜剂的表层面材， 表层面材和不干胶尺寸大于易碎纸基板面积。
2、一种由权利要求 1方法获得的抗金属表面干扰的防揭贴超高频电子 标签， 其特征在于， 具体为一种复合结构的 RFID电子标签， 所述复合结 构的 RFID电子标签由底至面依次包括不干胶底层、 "岛"型复合垫片、 易 碎纸基板、 折合对称振子天线及芯片、 不干胶面层和表层面材， 天线与易 碎纸基板牢固结合成一体， 芯片与天线电性连接， "岛"型复合垫片正对 芯片所在位置， 该复合垫片的尺寸小于等于易碎纸基板的尺寸。
3、 一种由权利要求 1方法获得的 RFID电子标签与金属表面标识物构 成防伪包装， 其特征在于， 包括具有复合结构的 RFID电子标签和标识物 本体，所述复合结构的 RFID电子标签由底至面依次包括不干胶底层、 "岛" 型复合垫片、 易碎纸基板、 折合对称振子天线及芯片、 不干胶面层和表层 面材， 天线与易碎纸基板牢固结合成一体， 芯片与天线电性连接， "岛" 型复合垫片正对芯片所在位置， 该复合垫片的尺寸小于或等于易碎纸基板 的尺寸； 所述标识物本体表面由铝箔或镀铝纸覆盖， 且本体表面具有一个 缝隙空间， 将整个电子标签贴附在标识物本体表面， 标签对称的天线结构 以缝隙为对称线， 标签的芯片部位对准缝隙位置处。
4、 如权利要求 2所述的抗金属表面干扰的防揭贴超高频电子标签， 其 特征在于， 所述天线结构设计釆用片状折合对称振子， 它包括处于中心位 置的片状折合对称振子导体和处于边侧位置的加载极导体， 所述片状折合 对称振子导体折合并与 IC 芯片连接呈闭合回路， 所述加载极导体与片状 折合对称振子导体电性连接， 加载极导体为呈弯曲状的加载极。
5、 如权利要求 4所述的抗金属表面干扰的防揭贴超高频电子标签， 其 特征在于， 所述片状折合对称振子导体为矩形或环形。
6、 如权利要求 4所述的抗金属表面干扰的防揭贴超高频电子标签， 其 特征在于， 所述加载极设计成多对， 每对加载极对称设置于片状折合对称 振子导体上。
7、 如权利要求 2所述的抗金属表面干扰的防揭贴超高频电子标签， 其 特征在于， 在所述天线上设有模切刀口线。
8、 如权利要求 2所述的抗金属表面干扰的防揭贴超高频电子标签， 其 特征在于， 在所述表层面材的上表面在芯片位置处印制一条直线作为标
9、 如权利要求 2所述的抗金属表面干扰的防揭贴超高频电子标签， 其 特征在于， 在表层面材内侧面上可印刷有防伪图案。
10、 如权利要求 2所述的抗金属表面干扰的防揭贴超高频电子标签， 其特征在于， 所述 "岛"型复合垫的厚度为 0.05mm至 0.3mm之间。
11、 如权利要求 2所述的抗金属表面干扰的防揭贴超高频电子标签， 其特征在于， 标签中基板、 天线和不干胶构成了标签的厚度层， 该厚度层 设定为 0.05mm至 1mm之间。
12、 如权利要求 11所述的抗金属表面干扰的防揭贴超高频电子标签， 其特征在于， 所述厚度层为 0.2mm。
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