CN1282050A - 非接触式电子防伪识别标签 - Google Patents
非接触式电子防伪识别标签 Download PDFInfo
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- CN1282050A CN1282050A CN 99110297 CN99110297A CN1282050A CN 1282050 A CN1282050 A CN 1282050A CN 99110297 CN99110297 CN 99110297 CN 99110297 A CN99110297 A CN 99110297A CN 1282050 A CN1282050 A CN 1282050A
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- circuit
- integrated circuit
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Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB991102975A CN1141668C (zh) | 1999-07-27 | 1999-07-27 | 非接触式电子防伪识别标签 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB991102975A CN1141668C (zh) | 1999-07-27 | 1999-07-27 | 非接触式电子防伪识别标签 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1282050A true CN1282050A (zh) | 2001-01-31 |
CN1141668C CN1141668C (zh) | 2004-03-10 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB991102975A Expired - Fee Related CN1141668C (zh) | 1999-07-27 | 1999-07-27 | 非接触式电子防伪识别标签 |
Country Status (1)
Country | Link |
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CN (1) | CN1141668C (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1525393B (zh) * | 2003-02-24 | 2011-05-04 | 株式会社半导体能源研究所 | 智能标签及具备其的容器 |
CN102165467A (zh) * | 2008-09-30 | 2011-08-24 | 德国电信股份有限公司 | 用于根据授权来控制非接触式接口设备的方法和通信系统 |
CN102719141A (zh) * | 2012-06-12 | 2012-10-10 | 中山市中益油墨涂料有限公司 | 水性易碎纸淋涂白墨的制备方法 |
WO2012163229A1 (zh) * | 2011-06-02 | 2012-12-06 | 上海商格信息科技有限公司 | 防伪电子标签的设计制作方法及其防伪电子标签和防伪包装 |
CN103400185A (zh) * | 2013-08-03 | 2013-11-20 | 重庆中科智联电子有限公司 | 带防拆功能的uhf rfid电子标签及其制作方法 |
-
1999
- 1999-07-27 CN CNB991102975A patent/CN1141668C/zh not_active Expired - Fee Related
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1525393B (zh) * | 2003-02-24 | 2011-05-04 | 株式会社半导体能源研究所 | 智能标签及具备其的容器 |
US7973313B2 (en) | 2003-02-24 | 2011-07-05 | Semiconductor Energy Laboratory Co., Ltd. | Thin film integrated circuit device, IC label, container comprising the thin film integrated circuit, manufacturing method of the thin film integrated circuit device, manufacturing method of the container, and management method of product having the container |
US8193532B2 (en) | 2003-02-24 | 2012-06-05 | Semiconductor Energy Laboratory Co., Ltd. | Thin film integrated circuit device, IC label, container comprising the thin film integrated circuit, manufacturing method of the thin film integrated circuit device, manufacturing method of the container, and management method of product having the container |
CN102165467A (zh) * | 2008-09-30 | 2011-08-24 | 德国电信股份有限公司 | 用于根据授权来控制非接触式接口设备的方法和通信系统 |
WO2012163229A1 (zh) * | 2011-06-02 | 2012-12-06 | 上海商格信息科技有限公司 | 防伪电子标签的设计制作方法及其防伪电子标签和防伪包装 |
CN102719141A (zh) * | 2012-06-12 | 2012-10-10 | 中山市中益油墨涂料有限公司 | 水性易碎纸淋涂白墨的制备方法 |
CN102719141B (zh) * | 2012-06-12 | 2014-06-04 | 中山市中益油墨涂料有限公司 | 水性易碎纸淋涂白墨的制备方法 |
CN103400185A (zh) * | 2013-08-03 | 2013-11-20 | 重庆中科智联电子有限公司 | 带防拆功能的uhf rfid电子标签及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
CN1141668C (zh) | 2004-03-10 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: SHENZHEN HUAYANG MICROTRONICS A/S Free format text: FORMER OWNER: SHENZHEN AIKE ELECTRONIC CO., LTD. Effective date: 20020513 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20020513 Address after: High tech Industrial Park in Nanshan District Shenzhen City, Guangdong province 518057 high-tech South Road, Building 29, South Tower on the third floor of B Applicant after: Shenzhen Huayang Microelectronics Co., Ltd. Address before: 518040, Guangdong, Shenzhen, Futian District Che Kung Temple Industrial Zone, 201, one of the 7 floor West Applicant before: Aike Electronic Co. Ltd. Shenzhen City |
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C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN HYAN MICROELECTRONICS CO., LTD. Free format text: FORMER NAME: HUAYANG MICROELECTRONICS CO., LTD., SHENZHEN |
|
CP03 | Change of name, title or address |
Address after: 518108 Guangdong city of Shenzhen province Baoan District Shiyan street community on AI Qun Lu with rich industrial area 1-2 building three or four floor Patentee after: Shenzhen Hyan Microelectronics Co., Ltd. Address before: High tech Industrial Park in Nanshan District Shenzhen City, Guangdong province 518057 high-tech South Road, Building 29, South Tower on the third floor of B Patentee before: Shenzhen Huayang Microelectronics Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040310 Termination date: 20170727 |