WO2012114406A1 - 電子部品実装装置および電子部品実装装置における画像読取り方法 - Google Patents
電子部品実装装置および電子部品実装装置における画像読取り方法 Download PDFInfo
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- WO2012114406A1 WO2012114406A1 PCT/JP2011/006648 JP2011006648W WO2012114406A1 WO 2012114406 A1 WO2012114406 A1 WO 2012114406A1 JP 2011006648 W JP2011006648 W JP 2011006648W WO 2012114406 A1 WO2012114406 A1 WO 2012114406A1
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- Prior art keywords
- image
- electronic component
- mounting head
- image reading
- scanning operation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
Definitions
- the present invention relates to an electronic component mounting apparatus for mounting an electronic component on a substrate and an image reading method for reading an image of the electronic component in the electronic component mounting apparatus.
- an image sensor such as a CCD has conventionally been arranged in a row as an image reading device for correcting misalignment between the electronic component and the substrate during mounting by image recognition.
- a camera using a line sensor arranged in the above is widely used.
- the line sensor When an image is read by the line sensor, it is necessary to perform a scanning operation in which the electronic component to be read and the line sensor are relatively moved in a direction orthogonal to the element arrangement direction. For this reason, when the line sensor is arranged in the layout in the electronic component mounting apparatus, it is necessary to set in advance the moving direction of the mounting head when performing the scanning operation.
- the line sensor aligns the element arrangement direction with the board conveyance direction (first direction) or is orthogonal to the first direction. Arranged in two directions.
- first direction the board conveyance direction
- any of the above-described line sensor arrangements has advantages and disadvantages from the viewpoint of optimizing the efficiency of component mounting operation by the mounting head.
- the scanning operation for image reading is performed by moving the mounting head in the second direction.
- the mounting head can move from the component supply unit toward the substrate along the shortest path, there is an advantage that the moving distance is shortened.
- interference between the mounting heads may occur depending on the operation status of the opposing mounting heads. The operation cannot always be executed at an arbitrary timing. In such a case, a loss time is generated for a waiting time until the opposing mounting head completes the component mounting operation and retracts from the board.
- the scanning operation for image reading is performed by moving the mounting head in the first direction.
- the mounting head since the mounting head performs the scanning operation by moving along the substrate conveyance path, there is an advantage that the scanning operation can be performed regardless of the operation state of the opposing mounting head.
- the movement distance of the mounting head in the scanning operation is inevitably increased, resulting in an increase in the time required for image reading.
- a configuration using a camera having a configuration in which two line sensors are combined in a cross shape has been proposed (see Patent Document 1).
- the present invention provides an electronic component mounting apparatus and an electronic device that can reduce the time required for image reading by eliminating restrictions on the operation of the mounting head due to the arrangement direction of the line sensors by an image reading unit having a simple configuration.
- An object is to provide an image reading method in a component mounting apparatus.
- An electronic component mounting apparatus includes a substrate transport mechanism that transports a substrate on which an electronic component is mounted in a first direction, a substrate positioning unit that is provided in a transport path by the substrate transport mechanism, and positions the substrate, and the substrate A component supply unit arranged on a side in a second direction orthogonal to the first direction of the transport mechanism, and a mounting head for taking out the electronic component from the component supply unit are arranged in the first direction and the second direction.
- a head moving mechanism that moves in two directions, and an electronic component that is provided on the moving path of the mounting head by the head moving mechanism and that is held by the mounting head when the mounting head performs a scanning operation for image reading
- An image reading unit that reads the image from below and an image reading control unit that controls the image reading unit, wherein the image reading unit is predetermined in the first direction.
- a first direction scanning operation having a line sensor arranged obliquely by an arrangement angle and reading the image by moving the mounting head in the first direction and the second direction above the line sensor.
- the image reading control unit In order to read the image of the electronic component, it is set in advance whether the mounting head performs the first direction scanning operation or the second direction scanning operation. Selected based on the scanning operation selection conditions, and controls the image reading unit on the basis of the selection result.
- An image reading method in an electronic component mounting apparatus includes a substrate transport mechanism that transports a substrate on which an electronic component is mounted in a first direction, and a substrate positioning unit that is provided in a transport path by the substrate transport mechanism and positions the substrate.
- a component supply unit disposed on a side in a second direction orthogonal to the first direction of the substrate transport mechanism, and a mounting head for taking out the electronic component from the component supply unit, the first direction and the A head moving mechanism that moves in two directions of the second direction, and a line that is provided in a moving path of the mounting head by the head moving mechanism and is inclined at a predetermined arrangement angle with respect to the first direction.
- An image reading unit that includes a sensor and reads an image of an electronic component held by the mounting head from below by performing a scanning operation for reading the image by the mounting head;
- An electronic component mounting apparatus comprising: an image reading control unit that controls the image reading unit; and an image reading method in an electronic component mounting apparatus that reads an image of an electronic component held by the mounting head, the mounting head comprising: Setting in advance whether to take out the electronic component from each component supply unit and whether the mounting head performs the first direction scanning operation or the second direction scanning operation in order to read the image of the electronic component
- a scanning operation selection step for selecting based on the scanning operation selection condition, and an image acquisition step for acquiring an image signal from the image reading unit by causing the mounting head to perform the selected scanning operation, In the image acquisition step, a one-dimensional image obtained by converting one-dimensional images sequentially output from the line sensor based on the arrangement angle. The in parallel to perform an image conversion process for generating a two-dimensional image.
- the mounting head in order to read an image of an electronic component by a line sensor arranged obliquely by a predetermined arrangement angle with respect to the board conveyance direction in a component extraction process in which the mounting head extracts the electronic component from the component supply unit.
- it is selected based on a preset scanning operation selection condition whether the mounting head performs the first direction scanning operation or the second direction scanning operation, and the selected scanning operation is performed on the mounting head.
- the image acquisition process of acquiring an image signal from the image reading unit two-dimensional images are generated by parallelly converting the one-dimensional images sequentially output from the line sensor based on the arrangement angle of the line sensor.
- the perspective view of the electronic component mounting apparatus of one embodiment of this invention The top view of the electronic component mounting apparatus of one embodiment of this invention 1 is an exploded perspective view showing a configuration of an image reading apparatus used in an electronic component mounting apparatus according to an embodiment of the present invention.
- the block diagram which shows the structure of the control system of the electronic component mounting apparatus of one embodiment of this invention (A) (b) (c) Explanatory drawing of the image taking-in range of the image reader in the electronic component mounting apparatus of one embodiment of this invention (A) (b) (c) The top view of the image reader used for the electronic component mounting apparatus of one embodiment of this invention
- the flowchart which shows the image reading method in the electronic component mounting apparatus of one embodiment of this invention (A) (b) (c) Operation
- the electronic component mounting apparatus 1 is used in an electronic component mounting line for manufacturing a mounting board, and an electronic component mounting line is configured by connecting a plurality of electronic component mounting apparatuses 1 having the same structure.
- a substrate transport mechanism 2 is disposed in the X direction at the center of a base 1a.
- the board transport mechanism 2 transports the board 3 on which electronic components are mounted in the X direction (first direction).
- a substrate positioning unit that positions and holds the substrate at the mounting position is provided in the transport path by the substrate transport mechanism 2, and electronic components are mounted on the substrate 3 positioned by the substrate positioning unit.
- a first component supply unit 4A and a second component supply unit 4B are arranged on both sides in the Y direction (second direction) with the substrate transport mechanism 2 interposed therebetween, and the first component supply unit 4A, A plurality of tape feeders 5 are arranged in parallel in the second component supply unit 4B.
- the tape feeder 5 pitches a carrier tape containing electronic components, and supplies the electronic components to a component mounting mechanism described below, that is, a component mounting mechanism including a mounting head and a head moving mechanism that moves the mounting head.
- a Y axis moving table 8 having a Y axis linear drive mechanism is disposed horizontally in the Y direction.
- the Y-axis moving table 8 is mainly composed of a beam member 8a provided in an elongated shape in the horizontal direction, and a linear rail 8b is disposed in the horizontal direction on the beam member 8a.
- a linear block 9 coupled to two rectangular coupling brackets 10A and 10B arranged in a vertical posture is fitted to the linear rail 8b so as to be slidable in the Y direction.
- a first X-axis movement table 11A and a second X-axis movement table 11B each having an X-axis linear drive mechanism are coupled to the two coupling brackets 10A and 10B.
- Each of the first X-axis moving table 11A and the second X-axis moving table 11B mainly includes a beam member 11a provided in an elongated shape in the X direction, and the linear rail 12 is arranged in the horizontal direction on the beam member 11a. It is installed.
- a rectangular coupling bracket 13 arranged in a vertical posture is mounted on the linear rail 12 so as to be slidable in the X direction via a linear block (not shown).
- a first mounting head 14A and a second mounting head 14B are mounted on the coupling brackets 13 of the first X-axis moving table 11A and the second X-axis moving table 11B, respectively. 14A and the second mounting head 14B move in the X direction by the linear drive mechanism coupled to the coupling bracket 13, respectively.
- the first mounting head 14 ⁇ / b> A and the second mounting head 14 ⁇ / b> B are multiple heads each having a plurality of unit mounting heads 15, and the nozzle mounting portion provided at the lower end of each unit mounting head 15 includes A suction nozzle 15a for sucking and holding electronic components is mounted.
- the suction nozzle 15 a is moved up and down by a nozzle lifting mechanism built in the unit mounting head 15.
- the first mounting head 14A moves in the X direction and the Y direction, whereby each unit mounting head 15 supplies the first component.
- the electronic component is taken out from the tape feeder 5 of the section 4A and transferred and mounted on the substrate 3 positioned by the substrate transport mechanism 2.
- the second mounting head 14B moves in the X direction and the Y direction, whereby each unit mounting head 15 is moved to the second direction.
- the electronic component is taken out from the tape feeder 5 of the component supply unit 4B, and is transferred and mounted on the substrate 3 positioned by the substrate transfer mechanism 2.
- the Y-axis movement table 8 and the first X-axis movement table 11A are arranged in the X direction (first direction) and the Y direction with respect to the first mounting head 14A that takes out electronic components from the first component supply unit 4A.
- the first head moving mechanism 7A is configured to move in two directions (second direction).
- the Y-axis movement table 8 and the second X-axis movement table 11B are arranged so that the second mounting head 14B that takes out electronic components from the second component supply unit 4B is moved in the X direction (first direction) and the Y direction (first direction).
- the second head moving mechanism 7B is configured to move in two directions (two directions).
- a first image reading device 6A (first image reading unit) and a second image reading device 6B (second image reading unit) are disposed in the movement path of the mounting head 14B.
- the first image reading device 6A and the second image reading device 6B have the same configuration, and the first mounting head 14A and the second mounting head 14B, which have taken out the electronic components P from the respective component supply units, read the image.
- the image of the electronic component P held by the mounting head is read from below.
- the positional deviation of the electronic component P in the state held by the mounting head is detected.
- the first mounting head 14A and the second mounting head 14B include a substrate recognition camera unit 16 that moves together as a first X-axis movement table 11A and a second X-axis movement table 11B. It is attached to the position below.
- the substrate recognition camera unit 16 is attached to the coupling bracket 13 in a posture in which the imaging optical axis is directed downward.
- the substrate recognition camera unit 16 moves above the substrate 3 together with the first mounting head 14A and the second mounting head 14B and images the substrate 3. To do.
- the positional deviation of the mounting point on the substrate 3 is detected.
- position correction at the time of component mounting is performed based on the detection result of the positional deviation of the electronic component P and the detection result of the positional deviation of the mounting point.
- the first image reading device 6A and the second image reading device 6B have a configuration in which a lens optical system 21 is combined above the line sensor unit 20, and an illumination unit 22 is mounted above the lens optical system 21. It has become.
- the line sensor unit 20 reads the imaging light reflected from the image reading target (here, the electronic component P held by the first mounting head 14A and the second mounting head 14B) as a one-dimensional image by the line sensor. It has a function of outputting a signal.
- the line sensor unit 20 includes a sensor substrate 23 on which a line sensor 24 is mounted.
- the line sensor 24 is configured by linearly arranging a plurality of imaging elements such as CCDs, and each imaging element receives imaging light and outputs an image signal of a one-dimensional image.
- the line sensor 24 is arranged obliquely with respect to the X direction (first direction) by a predetermined arrangement angle ⁇ (here 45 °), and the length size of the line sensor 24 is It is set according to the image reading width required in one scanning operation.
- ⁇ arrangement angle
- the line sensor 24 is arranged obliquely at the same angle in both the X direction and the Y direction, and a scanning operation for image reading is performed as described later. Regardless of the X direction or Y direction, it is possible to acquire a one-dimensional image with the same conditions.
- the lens optical system 21 includes a lens for imaging the imaging light on the light receiving surface of the line sensor 24.
- the imaging light incident from above is refracted by the lens optical system 21 and is imaged on the light receiving surface of the line sensor 24.
- An image of an object is formed.
- the illumination unit 22 includes an illumination board 22a in which light emitting elements such as LEDs are assembled in four directions, and the illumination light is irradiated obliquely upward by operating the illumination board 22a.
- the illuminated illumination light is reflected downward by the electronic component P held by the suction nozzle 15a provided in each unit mounting head 15 in the first mounting head 14A and the second mounting head 14B, and the first mounting head 14A and the second mounting head 14B. Are incident on the image reading device 6A and the second image reading device 6B from above.
- the incident imaging light is refracted by the lens optical system 21 and travels downward, and forms an image on the imaging element that constitutes the light receiving surface of the line sensor 24. That is, the lens optical system 21 and the line sensor unit 20 function as a camera that reads an image of the electronic component P.
- the line sensor 24 is connected to an imaging control unit 26A (imaging control unit 26B) and an image conversion processing unit 25 which are camera controllers.
- the imaging control unit 26A (imaging control unit 26B) has a function of controlling the imaging process by the line sensor 24 and the image conversion process by the image conversion processing unit 25 and outputting the imaging result as an image signal.
- Image reading by the first image reading device 6A and the second image reading device 6B will be described with reference to FIGS. 5 (a) to 5 (c) and FIGS. 6 (a) to 6 (c).
- First, the first direction scanning operation in which the scanning direction is set to the X direction will be described with reference to FIGS.
- the first mounting head 14A (second mounting head 14B) holding the electronic component P to be read by the unit mounting head 15 is the first mounting head 14A.
- the image reading device 6A and the second image reading device 6B are moved in the X direction (arrow a).
- a plurality of one-dimensional images 24a corresponding to the image capturing range by the line sensor 24 are sequentially displayed from the line sensor 24 at predetermined intervals as shown in FIG. 5B. Is output for.
- the line sensor 24 is arranged obliquely with respect to the X direction by the arrangement angle ⁇
- the one-dimensional image 24a acquired by the line sensor 24 is inclined by the arrangement angle ⁇ with respect to the X direction. It has become.
- the image conversion processing unit 25 performs conversion processing on the sequentially output one-dimensional image 24a.
- the converted one-dimensional image 24a * is obtained by rotating the one-dimensional image 24a by the conversion angle ⁇ set based on the arrangement angle ⁇ (arrow b). Then, as shown in FIG. 5C, the converted one-dimensional image 24a * is juxtaposed in the X direction to generate a two-dimensional image 27 of the electronic component P that is the imaging target. In the two-dimensional image 27 generated in this way, the image of the electronic component P is in a position rotated with respect to the original coordinate system by the conversion angle ⁇ . Therefore, in the recognition processing based on the two-dimensional image 27, conversion is performed. An XY coordinate system converted by an angle ⁇ is used.
- FIGS. 6 (a) to (c) a second direction scanning operation in which the scanning direction is set to the Y direction will be described with reference to FIGS. 6 (a) to (c).
- the first mounting head 14A second mounting head 14B holding the electronic component P to be read by the unit mounting head 15 is the first mounting head 14A.
- the image reading device 6A and the second image reading device 6B are moved in the Y direction (arrow c).
- a plurality of one-dimensional images 24a corresponding to the image capturing range by the line sensor 24 are sequentially converted from the line sensor 24 at predetermined intervals as shown in FIG. 6B. Is output for.
- the one-dimensional image 24a acquired by the line sensor 24 is an example shown in FIGS. 5 (a) to 5 (c). Similarly to the X direction, it is inclined by the arrangement angle ⁇ . For this reason, the image conversion processing unit 25 performs conversion processing on the sequentially output one-dimensional image 24a.
- the converted one-dimensional image 24a * is obtained by rotating the one-dimensional image 24a by the conversion angle ⁇ set based on the arrangement angle ⁇ (arrow d). Then, as shown in FIG. 6C, the converted one-dimensional image 24a * is juxtaposed in the Y direction to generate a two-dimensional image 27 of the electronic component P that is the imaging target. In the two-dimensional image 27 generated in this way, the image of the electronic component P is at a position rotated with respect to the original coordinate system by the conversion angle ⁇ , as in the example shown in FIG. In the recognition processing based on 27, an XY coordinate system converted by the conversion angle ⁇ is used.
- the first image reading device 6A and the second image reading device 6B have a line sensor 24 arranged obliquely by a predetermined arrangement angle ⁇ with respect to the X direction (first direction).
- the first mounting head 14A and the second mounting head 14B are moved above the line sensor 24 in the X direction and the Y direction, respectively, and the first direction scanning operation and the second direction scanning operation for reading an image are performed.
- a camera capable of reading an image is included.
- the first image reading device 6A and the second image reading device 6B further add two parallel one-dimensional images 24a * obtained by converting the one-dimensional images sequentially output from the line sensor 24 based on the arrangement angle ⁇ .
- the image conversion processing unit 25 that generates the dimensional image 27 is included.
- the apparatus main body control unit 30 includes a position detection unit 31, an image reading control unit 32, a recognition processing unit 33, a position correction calculation unit 34, and a mechanism control unit 35.
- the position detector 31 receives signals from the X-axis encoder 11AE and the Y-axis encoder 8AE respectively provided in the X-axis linear drive mechanism 11AL and the Y-axis linear drive mechanism 8AL constituting the first head moving mechanism 7A. Thus, the position of the first mounting head 14A is detected.
- the position detection unit 31 receives signals from the X-axis encoder 11BE and the Y-axis encoder 8BE provided in the X-axis linear drive mechanism 11BL and the Y-axis linear drive mechanism 8BL constituting the second head moving mechanism 7B, respectively. By doing so, the position of the second mounting head 14B is detected.
- the image reading control unit 32 controls the imaging control unit 26A and the imaging control unit 26B of the first image reading device 6A and the second image reading device 6B based on the position detection result of the position detection unit 31. That is, the first image reading device 6A and the second image reading device 6B move the first mounting head 14A and the second mounting head 14B in the scanning direction, and thereby the first mounting head 14A and the second mounting head 14B.
- a scanning operation for reading an image of the electronic component held by the mounting head 14B is performed. In this scanning operation, the image reading control unit 32 determines the timing at which the X-row line sensor 24X or the Y-row line sensor 24Y starts to output an image signal according to the first mounting head 14A and the second mounting timing by the position detection unit 31. Based on the position detection result of the head 14B, the imaging control unit 26A and the imaging control unit 26B are instructed.
- the image reading control unit 32 selects the direction in which the electronic component P is moved with respect to the line sensor 24 for the scanning operation for reading the image of the electronic component. That is, the image reading control unit 32 selects which one of the first direction scanning operation and the second direction scanning operation is selected according to the operation state of the first mounting head 14A and the second mounting head 14B.
- the image pickup control unit 26A and the image pickup control unit 26B This operation state is determined based on the positions of the first mounting head 14A and the second mounting head 14B detected by the position detector 31. This selection is performed based on scanning operation selection conditions that are set in advance and stored in the storage device of the apparatus main body control unit 30.
- the first mounting head 14A and the second mounting head 14B transfer the electronic components P taken out from the respective component supply units (the first component supply unit 4A and the second component supply unit 4B) to the board.
- a component mounting operation for transporting and mounting on the substrate 3 positioned in the substrate positioning portion of the mechanism 2 is performed. That is, in this component mounting operation, the image reading control unit 32 applies the first direction scanning operation and the second direction scanning operation to the first mounting head 14A and the second mounting head 14B in order to read the image of the electronic component. Which of these is to be performed is selected based on a preset scanning operation selection condition.
- the recognition processing unit 33 receives the image signals output from the imaging control unit 26A and the imaging control unit 26B of the first image reading device 6A and the second image reading device 6B, and performs recognition processing to thereby perform the mounting head. In this state, the electronic component is identified and misalignment is detected.
- the position correction calculation unit 34 performs calculations necessary for position correction when the electronic component is mounted on the substrate by the mounting head based on the positional deviation information of the electronic component obtained by the recognition processing unit 33.
- FIG. 4 a configuration example in which the image reading control unit 32 and the recognition processing unit 33 are included in the apparatus main body control unit 30 is shown, but the image reading control unit 32 and the recognition processing unit 33 are controlled by the apparatus main body control. You may make it provide as a separate image recognition process part independent of the part 30.
- FIG. 4 a configuration example in which the image reading control unit 32 and the recognition processing unit 33 are included in the apparatus main body control unit 30 is shown, but the image reading control unit 32 and the recognition processing unit 33 are controlled by the apparatus main body control
- the mechanism control unit 35 controls the first head moving mechanism 7A, the first mounting head 14A, the second head moving mechanism 7B, and the second mounting head 14B, so that the electrons taken out from the respective component supply units A component mounting operation for transferring and mounting the component P on the substrate 3 is executed. At this time, each mounting head is caused to perform either the first direction scanning operation or the second direction scanning operation selected by the image reading control unit 32.
- the first mounting head 14 ⁇ / b> A and the second mounting head 14 ⁇ / b> B are aligned based on the positional deviation correction calculation result obtained by the position correction calculation unit 34. I do.
- the electronic component mounting apparatus 1 is configured as described above.
- images of the electronic components P held by the first mounting head 14A and the second mounting head 14B are displayed.
- An image reading method in the electronic component mounting apparatus for reading will be described with reference to the drawings along the flow of FIG.
- the first mounting head 14A and the second mounting head 14B extract the electronic component P from the respective component supply units (ST1) (component extraction step).
- the first mounting head 14A is moved to take out the electronic component P by the plurality of unit mounting heads 15 in the first component supply unit 4A (arrow e), and the second component supply is performed.
- the second mounting head 14B holds the electronic component P in all of the plurality of unit mounting heads 15 and shows a state in which the component extraction process is completed.
- scanning operation selection is performed (ST2). That is, it is selected based on a preset scanning operation selection condition whether the second mounting head 14B that has completed the component extraction process is to perform the first direction scanning operation or the second direction scanning operation ( Scanning operation selection step).
- the scanning operation selection condition is set in advance so as to select the first direction scanning operation.
- the second direction scanning operation is selected as the scanning operation to be performed by the second mounting head 14B that has completed the component extraction process.
- the second mounting head 14B can move from the second component supply unit 4B toward the substrate 3 by the shortest path, and the movement tact time can be shortened by shortening the moving distance in the component mounting operation. it can.
- a scanning operation is executed (ST3).
- an image signal is acquired from the second image reading device 6B by causing the second mounting head 14B to perform the selected second direction scanning operation (image acquisition step). That is, in this image acquisition process, as shown in FIG. 8B, the second mounting head 14B holding the electronic component P to be scanned is moved in the Y direction and reaches the substrate 3. (Arrow g). During the movement in the Y direction, the second mounting head 14B moves above the second image reading device 6B at a prescribed scanning speed. At this time, as shown in FIG. A plurality of one-dimensional images 24a of the electronic component P to be imaged are sequentially read at predetermined intervals and output to the image conversion processing unit 25 (ST4).
- the image conversion processing unit 25 Upon receiving the one-dimensional image 24a, the image conversion processing unit 25 performs image conversion processing on the one-dimensional image 24a sequentially output from the line sensor 24, as shown in FIGS. 6B and 6C. (ST5). In this image conversion process, a process of generating a two-dimensional image 27 in parallel with the converted one-dimensional image 24a * obtained by converting the one-dimensional image 24a based on the arrangement angle ⁇ of the line sensor 24 is performed. The two-dimensional image 27 generated in this way is output to the recognition processing unit 33 as an image signal of the electronic component P to be imaged.
- a scanning operation targeting the first mounting head 14A is executed.
- the first direction scanning operation is selected.
- the first mounting head 14A that has completed the component extraction process in the first component supply unit 4A is shown in FIG. 8B.
- the first image reading device 6A is moved to the side (arrow f).
- a first direction scanning operation (arrow i) that moves upward in the X direction at a prescribed scanning speed is performed in the same manner as in the examples shown in FIGS. That is, an image conversion process is performed in which the one-dimensional image 24a sequentially output from the line sensor 24 is converted based on the arrangement angle ⁇ of the line sensor 24, and then the converted one-dimensional image 24a * after the image conversion is performed in parallel. Processing for generating the two-dimensional image 27 is executed. The two-dimensional image 27 generated in this way is output to the recognition processing unit 33 as an image signal of the electronic component P to be imaged.
- the first mounting head 14A After completing the first direction scanning operation, the first mounting head 14A stands by at the side of the first image reading device 6A. Since such a first direction scanning operation can be performed without interfering with the component mounting operation of the second mounting head 14B facing the first scanning head 14A, the first mounting head 14A performs the first component supply unit. It is possible to prevent occurrence of a loss time for waiting without moving at 4A.
- the second mounting head 14B that has finished the component mounting operation on the substrate 3 moves to the second component supply unit 4B to execute the next component extraction process.
- Arrow j the first mounting head 14A in the standby state immediately moves above the substrate 3 (arrow k), and the second component supply unit 4B 2 mounting head 14B is moved to take out the component (arrow l).
- the second mounting head 14B completes the component picking process.
- the first mounting head 14A is present on the substrate 3, and the component mounting operation ( When the arrow m) is being executed, the first direction scanning operation is selected as the scanning operation to be performed by the second mounting head 14B.
- the second mounting head 14B moves to the side of the second image reading device 6B in order to execute the first direction scanning operation that moves in the X direction above the second image reading device 6B (arrow n). ).
- the component mounting operation is repeatedly executed by the first mounting head 14A and the second mounting head 14B.
- the electronic component P is taken out from the first component supply unit 4A and the second component supply unit 4B, and moved above the first image reading device 6A and the second image reading device 6B.
- a scanning operation for reading an image of the electronic component P is executed. In this scanning operation, one of the first direction scanning operation and the second direction scanning operation is selected in accordance with the operation state of the component mounting mechanism facing each other with the substrate transport mechanism 2 interposed therebetween.
- the first mounting head 14 ⁇ / b> A and the second mounting head 14 ⁇ / b> B perform the component taking-out process in which the electronic component P is extracted from each component supply unit, and the first mounting head 14 ⁇ / b> A for reading the image of the electronic component.
- a scanning operation selection step of selecting whether the first mounting head 14A and the second mounting head 14B are to perform the first direction scanning operation or the second direction scanning operation based on preset scanning operation selection conditions;
- the second direction scanning operation is selected when the component mounting operation by the opposing mounting head is not performed on the substrate 3 positioned on the substrate transport mechanism 2 at the time when the component extraction step is completed.
- the first direction scanning operation is selected.
- image acquisition step image conversion for generating a two-dimensional image 27 in parallel with the converted one-dimensional image 24a * obtained by converting the one-dimensional image 24a sequentially output from the line sensor 24 based on the arrangement angle ⁇ of the line sensor. The process is executed.
- the electronic component mounting apparatus 1 shown in the present embodiment includes the first component supply unit 4A, the second component supply unit 4B, and the first mounting head on both sides of the board conveyance mechanism 2, respectively.
- images of the electronic components held by the first mounting head 14A and the second mounting head 14B A first image reading device 6A and a second image reading device 6B are provided.
- the first image reading device 6A and the second image reading device 6B have the first mounting head 14A above the line sensor 24 arranged obliquely by a predetermined arrangement angle with respect to the first direction.
- the first image reading device 6A and the second image reading device 6B parallelly convert the converted one-dimensional image 24a * obtained by converting the one-dimensional image 24a sequentially output from the line sensor 24 based on the arrangement angle ⁇ .
- the image conversion processing unit 25 that generates the two-dimensional image 27 is provided.
- one of the first direction scanning operation and the second direction scanning operation which has no tact time loss can be selected according to the operating state of the opposing component mounting mechanism.
- the tact time loss can be eliminated as much as possible, the time required for image reading can be shortened, and the tact time of the component mounting operation can be improved.
- the first image reading device 6A (second image reading device 6B) shown in FIG.
- the effect of using a configuration having a camera capable of reading an image by either the first direction scanning operation or the second direction scanning operation as an image reading unit sandwiches the substrate transport mechanism.
- the present invention is not limited to an electronic component mounting apparatus having a component mounting mechanism on both sides.
- the electronic component mounting apparatus and the image reading method in the electronic component mounting apparatus according to the present invention eliminate the restriction on the operation of the mounting head caused by the arrangement direction of the line sensors by an image reading unit having a simple configuration. This has the effect that the time can be shortened, and is useful in the component mounting field in which an image of an electronic component taken out from the component supply unit is read and the position is recognized, and then the mounting operation is performed on the board.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
2 基板搬送機構
3 基板
4A 第1の部品供給部
4B 第2の部品供給部
6A 第1の画像読取り装置
6B 第2の画像読取り装置
7A 第1のヘッド移動機構
7B 第2のヘッド移動機構
14A 第1の搭載ヘッド
14B 第2の搭載ヘッド
20 ラインセンサユニット
24 ラインセンサ
24a 1次元画像
24a* 変換後1次元画像
27 2次元画像
Claims (2)
- 電子部品が実装される基板を第1方向に搬送する基板搬送機構と、この基板搬送機構による搬送経路に設けられ前記基板を位置決めする基板位置決め部と、
前記基板搬送機構の前記第1方向と直交する第2方向への側方に配置された部品供給部と、
前記部品供給部から前記電子部品を取り出す搭載ヘッドを、前記第1方向および前記第2方向の2つの方向へ移動させるヘッド移動機構と、
前記ヘッド移動機構による前記搭載ヘッドの移動経路に設けられ、前記搭載ヘッドが画像読取り用の走査動作を行うことにより、前記搭載ヘッドに保持された電子部品の画像を下方から読み取る画像読取り部と、
前記画像読み取り部を制御する画像読取り制御部とを備え、
前記画像読取り部は、前記第1方向に対して所定の配置角度だけ斜めに向けて配置されたラインセンサを有し、このラインセンサの上方で前記搭載ヘッドを前記第1方向、前記第2方向へそれぞれ移動させて画像の読み取りを行う第1方向走査動作、第2方向走査動作のいずれによっても前記画像の読み取りが可能なカメラと、前記ラインセンサから順次出力される1次元画像を前記配置角度に基づいて変換した1次元画像を並列して2次元画像を生成する画像変換処理部とを有し、
前記画像読取り制御部は、前記搭載ヘッドが前記部品供給部から取り出した電子部品を前記基板位置決め部に位置決めされた基板に移送搭載する部品搭載動作において、当該電子部品の画像を読み取るために前記搭載ヘッドに、前記第1方向走査動作、第2方向走査動作のいずれを行わせるかを、予め設定された走査動作選択条件に基づいて選択し、この選択結果に基づいて前記画像読取り部を制御することを特徴とする電子部品実装装置。 - 電子部品が実装される基板を第1方向に搬送する基板搬送機構と、この基板搬送機構による搬送経路に設けられ前記基板を位置決めする基板位置決め部と、前記基板搬送機構の前記第1方向と直交する第2方向への側方に配置された部品供給部と、前記部品供給部から前記電子部品を取り出す搭載ヘッドを、前記第1方向および前記第2方向の2つの方向へ移動させるヘッド移動機構と、前記ヘッド移動機構による前記搭載ヘッドの移動経路に設けられ、前記第1方向に対して所定の配置角度だけ斜めに向けて配置されたラインセンサを有し、前記搭載ヘッドが画像読取り用の走査動作を行うことにより前記搭載ヘッドに保持された電子部品の画像を下方から読み取る画像読取り部と、前記画像読み取り部を制御する画像読取り制御部とを備えた電子部品実装装置において、前記搭載ヘッドに保持された電子部品の画像を読み取る電子部品実装装置における画像読取り方法であって、
前記搭載ヘッドがそれぞれの部品供給部から電子部品を取り出す部品取り出し工程と、
当該電子部品の画像を読み取るために前記搭載ヘッドに、第1方向走査動作、第2方向走査動作のいずれを行わせるかを、予め設定された走査動作選択条件に基づいて選択する走査動作選択工程と、
前記選択された走査動作を前記搭載ヘッドに行わせることにより、前記画像読取り部から画像信号を取得する画像取得工程とを含み、
前記画像取得工程において、前記ラインセンサから順次出力される1次元画像を前記配置角度に基づいて変換した1次元画像を並列して2次元画像を生成する画像変換処理を実行することを特徴とする電子部品実装装置における画像読取り方法。
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US13/980,207 US9370135B2 (en) | 2011-02-21 | 2011-11-29 | Electronic component mounting device and image reading method used by electronic component mounting device |
CN201180067978.4A CN103370997B (zh) | 2011-02-21 | 2011-11-29 | 电子组件安装装置和电子组件安装装置所使用的图像读取方法 |
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JP5830644B2 (ja) * | 2011-12-06 | 2015-12-09 | パナソニックIpマネジメント株式会社 | 下受けピン配置判定装置および下受けピン配置判定方法 |
DE102013207598A1 (de) * | 2013-04-25 | 2014-10-30 | Finetech Gmbh & Co.Kg | Platziervorrichtung und Platzierverfahren |
JP6280812B2 (ja) * | 2014-05-21 | 2018-02-14 | ヤマハ発動機株式会社 | 部品実装装置 |
DE102015220746A1 (de) * | 2015-10-23 | 2017-04-27 | Ersa Gmbh | Verfahren und Vorrichtung zur Platzierung elektronischer Bauteile |
WO2018127972A1 (ja) * | 2017-01-06 | 2018-07-12 | ヤマハ発動機株式会社 | 被実装物作業装置 |
CN108090896B (zh) * | 2017-12-14 | 2021-01-01 | 北京木业邦科技有限公司 | 木板平整度检测及其机器学习方法、装置及电子设备 |
JP6920548B2 (ja) * | 2018-04-18 | 2021-08-18 | ヤマハ発動機株式会社 | 部品認識装置、部品実装機および部品認識方法 |
JP7523060B2 (ja) | 2020-08-04 | 2024-07-26 | パナソニックIpマネジメント株式会社 | 部品装着装置および部品装着方法 |
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