WO2012066925A1 - 電子機器 - Google Patents

電子機器 Download PDF

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Publication number
WO2012066925A1
WO2012066925A1 PCT/JP2011/075122 JP2011075122W WO2012066925A1 WO 2012066925 A1 WO2012066925 A1 WO 2012066925A1 JP 2011075122 W JP2011075122 W JP 2011075122W WO 2012066925 A1 WO2012066925 A1 WO 2012066925A1
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WO
WIPO (PCT)
Prior art keywords
heat
circuit board
heat radiating
insulating sheet
fixing
Prior art date
Application number
PCT/JP2011/075122
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
理 丸山
均 上甲
雅哉 倉本
Original Assignee
日本電産サンキョー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電産サンキョー株式会社 filed Critical 日本電産サンキョー株式会社
Priority to CN201180014580.4A priority Critical patent/CN102812790B/zh
Priority to JP2012515269A priority patent/JP5670447B2/ja
Publication of WO2012066925A1 publication Critical patent/WO2012066925A1/ja

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Definitions

  • the present invention relates to an electronic device including a circuit board on which a heat generating component is mounted.
  • Patent Literature 1 An electronic device described in Patent Literature 1 includes a metal plate having an L-shaped cross section, an insulating sheet attached to the metal plate, and a circuit board attached in parallel to the metal plate via the insulating sheet. Yes.
  • a connector or the like is mounted on the front surface of the circuit board, and a plurality of surface mount resistors are mounted on the back surface of the circuit board.
  • the circuit board is fixed to the metal plate so that the surface mounting resistance is in close contact with the insulating sheet, and the heat generated by the surface mounting resistance is conducted to the metal plate through the insulating sheet and from the back surface of the metal plate. Dissipated.
  • the heat generated by the surface mounting resistance is dissipated from the back surface of the metal plate through the insulating sheet by bringing the surface mounting resistance into close contact with the insulating sheet attached to the metal plate. Yes. Therefore, in this electronic device, when various electronic components with different thicknesses are mounted on the back surface of the circuit board, the surface mount resistance cannot be brought into close contact with the insulating sheet, and is generated by the surface mount resistance that is a heat generating component. It may be difficult to dissipate heat efficiently.
  • an object of the present invention is to provide an electronic device that can efficiently dissipate heat generated by a heat-generating component mounted on a circuit board even if electronic components having different thicknesses are mounted on the back surface of the circuit board. Is to provide.
  • an electronic device of the present invention includes a circuit board on which a heat generating component is mounted and a board fixing member to which the circuit board is fixed, and the back surface of the circuit board is generated by the heat generating component.
  • a heat dissipating part is formed to dissipate heat
  • the board fixing member is disposed with a predetermined distance from the back surface of the circuit board, and the heat dissipating part protrudes from the base part toward the circuit board. It is characterized by being formed of a heat dissipating material having heat dissipating properties.
  • a heat radiating part for radiating heat generated by the heat-generating component is formed on the back surface of the circuit board, and the heat radiating part is fixed to the fixing part of the board fixing member formed of a heat radiating material.
  • the fixing part of the board fixing member protrudes from the base part toward the circuit board, and a predetermined gap is formed between the back surface of the circuit board and the base part. Therefore, various electronic components having different thicknesses can be mounted on the back surface of the circuit board. As described above, according to the present invention, even when electronic components having different thicknesses are mounted on the back surface of the circuit board, it is possible to efficiently dissipate heat generated by the heat generating components.
  • the terminals of the electronic components mounted on the surface of the circuit board are projected from the back surface of the circuit board.
  • the substrate fixing member is formed of, for example, a metal material, and an insulating sheet formed of an insulating material is disposed between the heat dissipation portion and the fixing portion.
  • the insulating sheet is formed of an insulating material having a heat dissipation property, and a heat dissipation gel having a heat dissipation property between the heat dissipation portion and the insulating sheet and / or between the fixing portion and the insulating sheet.
  • the thermal radiation grease is arrange
  • the heat radiation between the heat radiating part and the insulating sheet is improved by the heat radiating gel or the heat radiating grease to improve the adhesion between the heat radiating part and the insulating sheet and / or the adhesion between the fixing part and the insulating sheet. It becomes possible to reduce resistance and thermal resistance between the fixing portion and the insulating sheet. Therefore, even if an insulating sheet is arranged between the heat radiating part and the fixing part, it is possible to efficiently transmit the heat generated by the heat-generating component to the board fixing member and dissipate it efficiently from the board fixing member. become.
  • the insulating sheet is preferably formed of an insulating material having a heat dissipation property and has elasticity. If comprised in this way, by arrange
  • a heat radiating member formed of a heat radiating material having a heat radiating property is detachable from the substrate fixing member. If comprised in this way, it will become possible to attach a heat radiating member to a board
  • the heat dissipating member is formed with a plurality of heat dissipating fins, and the thickness of the fin is preferably narrowed from the base end of the fin toward the tip of the fin. If comprised in this way, it will become possible to enlarge the surface area of a fin and to improve the thermal radiation efficiency of a thermal radiation member.
  • the heat dissipating member can be attached to and detached from the side of the base that is opposite to the surface on which the fixing portion is formed, and is opposite to the protruding direction of the fixing portion. It is preferable that a heat dissipating member mounting portion is formed so that the heat dissipating member comes into contact with the heat dissipating member. If comprised in this way, the area of the part which is going to contact
  • the flatness of the portion to be brought into contact with the heat radiating member is relatively easily compared with the case where the entire surface of the side opposite the substrate is brought into contact with the heat radiating member (that is, the plane of the heat radiating member mounting portion).
  • the substrate fixing member and the heat dissipation member can be reliably brought into contact with each other, and heat can be efficiently transferred from the substrate fixing member to the heat dissipation member.
  • the heat dissipating member mounting portion is preferably formed so as to correspond to the fixed portion. If comprised in this way, it will become possible to shorten the distance of a fixing
  • a plurality of second fins for heat dissipation are formed on all or a part of the side where the heat dissipating member mounting portion is not formed on the side surface of the substrate. If comprised in this way, it will become possible to improve the thermal radiation efficiency of a board
  • the thickness of the second fin becomes narrower from the proximal end of the second fin toward the distal end of the second fin. If comprised in this way, it will become possible to enlarge the surface area of a 2nd fin and to improve the thermal radiation efficiency of a board
  • the substrate fixing member is preferably formed with a plurality of second fins for heat dissipation. If comprised in this way, it will become possible to improve the thermal radiation efficiency of a board
  • the boundary between the fixed portion and the base portion is preferably formed in a curved surface shape. If comprised in this way, it will become possible to enlarge the area of the part to which heat is transmitted from a fixing
  • the heat-generating component is surface-mounted on the surface of the circuit board and connected to the heat dissipation portion via a heat dissipation pattern formed between the front surface and the back surface of the circuit board.
  • the terminal of the heat generating component is inserted into the through hole formed in the circuit board and the heat generating component is mounted on the circuit board, it is necessary to mount the heat generating component manually, but if configured in this way, Since the heat generating component is surface-mounted on the circuit board, the heat generating component can be mounted by a machine, and the mounting operation of the heat generating component can be simplified.
  • an insulating sheet formed of an insulating material having a heat dissipation property is disposed between the heat dissipation portion and the fixing portion, and a heat dissipation grease having a heat dissipation property is provided between the heat dissipation portion and the insulating sheet.
  • the circuit board is provided with a through-hole penetrating the circuit board, the heat radiation pattern is formed on the inner peripheral surface of the through-hole, and the heat radiation grease enters the through-hole. If comprised in this way, it will become possible to reduce the thermal resistance in a through-hole with the thermal radiation grease which has entered into the through-hole. Therefore, it is possible to efficiently transfer the heat generated in the heat generating component to the heat radiating portion.
  • the circuit board is formed with a high voltage circuit on which a heat generating component is mounted and a low voltage circuit to which a lower voltage is applied than the high voltage circuit. If comprised in this way, the number of parts of an electronic device can be reduced compared with the case where the circuit for high voltage and the circuit for low voltage are each formed in the separate circuit board. Therefore, the configuration of the electronic device can be simplified.
  • the high voltage circuit is a motor drive circuit for driving a motor
  • the low voltage circuit is a motor control circuit for controlling the motor
  • the heat generated by the heat generating components mounted on the circuit board can be efficiently dissipated. It becomes possible.
  • Embodiment 1 of this invention It is a perspective view of the electronic device concerning Embodiment 1 of this invention. It is a perspective view which shows the electronic device shown in FIG. 1 from the back surface side. It is a perspective view which shows the circuit board shown in FIG. 1 from the back surface side. It is a perspective view of the board
  • FIG. 10 is a perspective view of a state in which a heat dissipation member is attached to the electronic device illustrated in FIG. 9.
  • FIG. 10 is a perspective view of a state where another heat radiating member is attached to the electronic device shown in FIG. 9.
  • FIG. 1 is a perspective view of an electronic apparatus 1 according to the first embodiment of the present invention.
  • FIG. 2 is a perspective view showing the electronic device 1 shown in FIG. 1 from the back side.
  • FIG. 3 is a perspective view showing the circuit board 2 shown in FIG. 1 from the back surface 2d side.
  • FIG. 4 is a perspective view of the substrate fixing member 3 shown in FIG.
  • FIG. 5 is a perspective view of the electronic device 1 shown in FIG. 1 with the heat dissipation member 5 attached thereto.
  • FIG. 6 is a perspective view of the electronic device 1 shown in FIG. 1 with the heat dissipation member 6 attached thereto.
  • FIG. 7 is a perspective view of the heat dissipation member 5 shown in FIG.
  • FIG. 8 is a perspective view of the heat dissipation member 6 shown in FIG.
  • the electronic device 1 of this embodiment is a device for driving an industrial servo motor (not shown), and includes a circuit board 2 and a board fixing member 3 to which the circuit board 2 is fixed. As shown in FIGS. 5 and 6, heat radiating members (heat sinks) 5 and 6 can be attached to and detached from the substrate fixing member 3.
  • the circuit board 2 is, for example, a glass epoxy board and is formed in a rectangular plate shape.
  • the circuit board 2 is formed with a motor drive circuit for driving the servo motor and a motor control circuit for controlling the servo motor.
  • the motor drive circuit is formed in one of the two regions 2a and 2b divided in the short direction of the circuit board 2 formed in a rectangular shape, and the motor control circuit is formed in the other region 2b. Is formed.
  • the motor drive circuit supplies a drive current for driving the servo motor to the servo motor. Therefore, a high voltage is applied to the motor drive circuit.
  • the motor drive circuit of this embodiment is a high voltage circuit to which a high voltage is applied.
  • the motor control circuit of this embodiment is a low voltage circuit to which a voltage lower than that of the motor drive circuit is applied.
  • a plurality of heat generating components 7 constituting a motor drive circuit are mounted on the front surface 2c of the circuit board 2 at a predetermined pitch in the longitudinal direction of the rectangular circuit board 2.
  • the heat generating component 7 is an electronic component that generates heat when energized.
  • the heat generating component 7 of this embodiment is an insulated gate bipolar transistor (Insulated Gate Bipolar Transistor (IGBT)).
  • IGBT Insulated Gate Bipolar Transistor
  • the heat generating component 7 of the present embodiment is a surface mounting component and is surface mounted on the surface 2 c of the circuit board 2.
  • other electronic components (not shown) constituting the motor drive circuit, electronic components (not shown) constituting the motor control circuit, and the like are mounted on the front surface 2c of the circuit board 2 and the back surface 2d of the circuit board 2.
  • a heat radiating portion 2e for radiating heat generated in the heat generating component 7 is formed on the back surface 2d of the circuit board 2 corresponding to the mounting position of the heat generating component 7.
  • the heat dissipating part 2e is formed in a band shape with a metal foil such as a copper foil, and is exposed on the back surface 2d. Between the front surface 2c and the back surface 2d, a heat radiation pattern (not shown) for conducting the heat of the heat generating component 7 to the heat radiation portion 2e is formed.
  • the heat radiation pattern is plating (that is, vias) applied to the inner peripheral surface of a plurality of through holes (not shown) penetrating from the front surface 2c to the back surface 2d, and the heat generating component 7 is connected thereto.
  • the circuit wiring pattern on the front surface 2c and the heat radiating part 2e on the back surface 2d are connected.
  • the circuit board 2 has a plurality of fixing holes 2 f for fixing the circuit board 2 to the board fixing member 3.
  • the fixing hole 2 f is formed so as to penetrate the circuit board 2.
  • the fixing hole 2f is formed so as to correspond to the mounting position of the heat generating component 7. That is, the fixing hole 2f is formed so as to correspond to the formation position of the heat radiating portion 2e.
  • the substrate fixing member 3 is formed of a heat dissipating material having heat dissipating properties.
  • the board fixing member 3 is formed of a metal material such as aluminum having higher heat dissipation than the circuit board 2.
  • the substrate fixing member 3 includes a base portion 3a formed in a rectangular flat plate shape, a rectangular parallelepiped fixing portion 3b to which the circuit board 2 is fixed, and a support portion 3c that supports an end surface of the circuit board 2 in the short direction.
  • the base part 3a, the fixing part 3b, and the support part 3c are integrally formed.
  • the fixing portion 3b is formed so as to protrude toward the circuit board 2 from the surface 3j of the base portion 3a.
  • This fixed part 3b is formed in the whole area of the longitudinal direction of the base part 3a formed in a rectangle.
  • fixed part 3b is formed in the intermediate position of the base part 3a in the transversal direction of the base part 3a.
  • the width of the fixed portion 3b in the short direction of the base portion 3a is, for example, substantially equal to the width of the heat radiating portion 2e.
  • a plurality of screw holes 3d for fixing the circuit board 2 are formed on the end face of the fixing portion 3b (upper end face in FIG. 4).
  • fixed part 3b in the transversal direction of the base part 3a may be wider than the width
  • the back surface 3k of the base portion 3a is formed in a planar shape.
  • the support portion 3c is formed in a flat plate shape that rises toward the circuit board 2 from the end surface in the short direction of the base portion 3a formed in a rectangular shape.
  • a contact portion 3e that contacts the surface 2c of the circuit board 2 is formed so as to be bent at a right angle from the end surface of the support portion 3c.
  • a plurality of screw holes 3f for fixing the heat radiating members 5 and 6 are formed in the back surface 3k of the base portion 3a.
  • the screw hole 3f is formed so as to correspond to the formation position of the fixing portion 3b.
  • the fixing hole 2f of the circuit board 2 is formed so as to correspond to the formation position of the heat radiating portion 2e, and is fixed to the fixing portion 3b in a state where the heat radiating portion 2e is placed on the end surface of the fixing portion 3b. ing. Specifically, the heat radiating part 2e is fixed to the fixing part 3b by a screw (not shown) inserted through the fixing hole 2f and screwed into the screw hole 3d. An insulating sheet 4 formed of an insulating material is disposed between the end face of the fixed part 3b and the heat radiating part 2e.
  • the insulating sheet 4 is made of an insulating material having heat dissipation (excellent heat transfer). Further, the insulating sheet 4 has elasticity.
  • the insulating sheet 4 is formed of a silicon-based insulating material having heat dissipation properties and elasticity.
  • the insulating sheet 4 is formed with a through hole through which a screw inserted into the fixing hole 2f and screwed into the screw hole 3d is inserted.
  • the insulating sheet 4 is inserted into the fixing hole 2f and screwed into the screw hole 3d.
  • the screw is fixed in a state of being sandwiched between the heat dissipating part 2e and the fixing part 3b.
  • the insulating sheet 4 is sandwiched between the heat radiating part 2e and the fixing part 3b in a compressed state.
  • a heat radiating gel or a heat radiating grease having heat radiating properties is disposed, and the heat radiating part 2e is interposed between the heat radiating gel or the heat radiating grease. It is in close contact with the surface.
  • a heat radiating gel or heat radiating grease is also disposed between the end face of the fixing portion 3b and the insulating sheet 4, and the end face of the fixing portion 3b is in close contact with the back surface of the insulating sheet 4 via the heat radiating gel or heat radiating grease. is doing. That is, the end surface of the fixing portion 3 b and the heat radiating portion 2 e are in close contact with each other via the insulating sheet 4.
  • heat radiation grease is disposed between the heat radiation portion 2e and the insulating sheet 4.
  • This heat radiation grease is, for example, silicon-based oil.
  • the heat dissipating grease enters the through hole of the circuit board 2 where the heat dissipating pattern is formed on the inner peripheral surface thereof.
  • heat radiation grease is also disposed between the end face of the fixed portion 3b and the insulating sheet 4. This heat radiation grease is, for example, silicon-based oil.
  • the fixing portion 3b is formed so as to protrude from the surface 3j of the base portion 3a toward the circuit board 2, and in the state where the circuit board 2 is fixed to the board fixing member 3, the circuit A gap S is formed between the back surface 2d of the substrate 2 and the base portion 3a. Further, in a state where the circuit board 2 is fixed to the board fixing member 3, the support portion 3 c comes into contact with the end face in the short direction of the circuit board 2, and is close to the end face in the short direction of the circuit board 2 on the surface 2 c. The contact portion 3e is in contact.
  • the back surface 2d of the circuit board 2 may be in contact with the end surface of the support portion 3c without forming the contact portion 3e on the end surface of the support portion 3c.
  • a second fixing portion for fixing the circuit board 2 may be formed on the end surface of the support portion 3c.
  • the heat dissipating members 5 and 6 are formed of a heat dissipating material having heat dissipating properties. Specifically, the heat dissipating members 5 and 6 are formed of a metal material such as aluminum having higher heat dissipation than the circuit board 2. As shown in FIGS. 5 to 8, the heat dissipating members 5 and 6 are formed with a plurality of fins 5a and 6a. The fins 6 a of the heat radiating member 6 are longer than the fins 5 a of the heat radiating member 5. That is, the heat dissipation performance of the heat dissipation member 6 is superior to the heat dissipation performance of the heat dissipation member 5.
  • the heat radiating members 5 and 6 are formed with insertion holes (not shown) through which screws (not shown) screwed into the screw holes 3f of the substrate fixing member 3 are inserted.
  • the heat radiating members 5 and 6 can be attached to and detached from the back surface of the substrate fixing member 3 (that is, the back surface 3k of the base portion 3a) by screws.
  • the back surface 3k of the base portion 3a is formed in a planar shape.
  • the contact surfaces 5c and 6c (see FIGS. 7 and 8) of the heat radiating members 5 and 6 that contact the back surface 3k of the base portion 3a are also formed in a planar shape.
  • the back surface 3k of the base portion 3a and the contact surfaces 5c, 6c of the heat dissipating members 5, 6 are formed in substantially the same shape, and the entire back surface 3k of the base portion 3a is formed by the heat dissipating members 5, 6
  • the contact surfaces 5c and 6c can contact the entire surface.
  • the electronic device 1 of this embodiment is configured to be able to be driven regardless of whether it is used for a servo motor having a relatively small capacity or a servo motor having a relatively large capacity.
  • the electronic device 1 is configured to be able to drive a 50 W to 750 W servo motor.
  • the heat generation amount of the heat generating component 7 is small because the drive current supplied to the servo motor is small. Therefore, when the electronic device 1 is used for a servo motor having a relatively small capacity, the electronic device 1 is used in a state where the heat radiating members 5 and 6 are not attached as shown in FIG. In addition, when the capacity of the servo motor is increased, the drive current supplied to the servo motor is increased, and the heat generation amount of the heat generating component 7 is increased. Therefore, as shown in FIG.
  • the heat radiating portion 2e is formed on the back surface 2d of the circuit board 2, and the heat radiating portion 2e via the insulating sheet 4 is fixed to the fixing portion 3b of the substrate fixing member 3 formed of a metal material.
  • the heat generated in the heat generating component 7 can be transmitted to the board fixing member 3 via the heat radiating part 2 e and the like, and can be efficiently dissipated from the board fixing member 3.
  • the heat radiating members 5 and 6 can be attached to and detached from the board fixing member 3, when the heat generation amount of the heat generating component 7 is large, the heat generated in the heat generating component 7 is transferred to the heat radiating portion 2e and the like. Can be efficiently transmitted to the substrate fixing member 3 and the heat radiating members 5 and 6 from the substrate fixing member 3 and the heat radiating members 5 and 6.
  • the common board fixing member 3 is used and the heat generation amount of the heat generating component 7 is determined (that is, the electronic device).
  • the heat radiating members 5 and 6 can be attached to the substrate fixing member 3, and the heat radiating members 5 and 6 can be removed from the substrate fixing member 3.
  • any one of the heat radiating members 5 and 6 can be selected and attached to the substrate fixing member 3 in accordance with the heat generation amount of the heat generating component 7.
  • the fixing part 3b of the board fixing member 3 protrudes from the base part 3a toward the circuit board 2, and a gap S is formed between the back surface 2d of the circuit board 2 and the base part 3a. . Therefore, in this embodiment, various electronic components can be mounted on the back surface 2d of the circuit board 2 using the gap S.
  • the gap S is formed between the back surface 2d of the circuit board 2 and the base portion 3a, for example, terminals of electronic components mounted on the front surface 2c of the circuit board 2 protrude from the back surface 2d. Even if it is a case, it becomes possible to ensure the distance of the front-end
  • the heat generating component 7 is a surface mounting component. Therefore, the heat generating component 7 can be mounted by a machine. Therefore, it is possible to simplify the mounting operation of the heat generating component 7.
  • a motor drive circuit and a motor control circuit are formed on one circuit board 2. Therefore, in this embodiment, compared with the case where the motor drive circuit and the motor control circuit are formed on separate circuit boards, the number of parts of the electronic device 1 can be reduced, and the configuration of the electronic device 1 is simplified. It becomes possible to become.
  • heat dissipating grease is disposed between the heat dissipating part 2e and the insulating sheet 4, and between the end face of the fixed part 3b and the insulating sheet 4. Therefore, it is possible to improve the adhesion between the heat radiation part 2e and the insulating sheet 4 and the adhesion between the fixing part 3b and the insulation sheet 4 by the heat radiation grease. That is, in this embodiment, the insulating sheet 4 is fixed in a state of being sandwiched between the heat radiating portion 2e and the fixing portion 3b by a screw inserted into the fixing hole 2f and screwed into the screw hole 3d.
  • the adhesiveness between the heat radiating part 2e and the insulating sheet 4 and the adhesiveness between the fixing part 3b and the insulating sheet 4 are increased, but in other parts, the adhesiveness between the heat radiating part 2e and the insulating sheet 4; And the adhesiveness of the fixing
  • the heat dissipating grease is disposed between the heat dissipating part 2e and the insulating sheet 4 and between the end face of the fixed part 3b and the insulating sheet 4, the heat dissipating part 2e and the insulating sheet 4
  • the insulating sheet 4 has elasticity and is sandwiched between the heat radiating portion 2e and the fixing portion 3b in a compressed state. Therefore, the adhesiveness between the heat radiating part 2e and the insulating sheet 4 and the adhesiveness between the fixing part 3b and the insulating sheet 4 are effectively enhanced, and the thermal resistance and the fixing part between the heat radiating part 2e and the insulating sheet 4 are improved. It becomes possible to effectively reduce the thermal resistance between 3b and the insulating sheet 4. Therefore, in this embodiment, even when the insulating sheet 4 is disposed between the heat radiating part 2e and the fixing part 3b, the heat generated by the heat generating component 7 is efficiently transmitted by the board fixing member 3. It becomes possible to dissipate more efficiently from the substrate fixing member 3.
  • the heat dissipating grease arranged between the heat dissipating part 2e and the insulating sheet 4 enters the through hole of the circuit board 2 in which the heat dissipating pattern is formed on the inner peripheral surface thereof. Therefore, the thermal resistance in the through hole can be reduced by the heat dissipating grease entering the through hole. In other words, although the thermal resistance of the inner peripheral surface of the through hole where the heat radiation pattern is formed is low, if the heat radiation grease does not enter the through hole, the heat of the entire through hole is affected by the air in the through hole. Resistance increases. However, in this embodiment, since the heat dissipating grease enters the through hole, the heat resistance in the through hole can be reduced by the heat dissipating grease in the through hole. Therefore, in this embodiment, it is possible to efficiently transfer the heat generated in the heat generating component 7 to the heat radiating portion 2e.
  • FIG. 9 is a perspective view of the electronic device 21 according to the second embodiment of the present invention.
  • FIG. 10 is a perspective view of the substrate fixing member 23 shown in FIG.
  • FIG. 11 is a perspective view showing the substrate fixing member 23 shown in FIG. 10 from the back side.
  • FIG. 12 is a side view of the electronic device 21 shown in FIG. 9 with the heat dissipation member 25 attached thereto.
  • FIG. 13 is a perspective view of the electronic device 21 shown in FIG. 9 with the heat dissipation member 25 attached thereto.
  • FIG. 14 is a perspective view of the electronic device 21 shown in FIG. 9 with the heat dissipation member 26 attached thereto.
  • the electronic device 21 of the present embodiment is a device for driving an industrial servo motor (not shown), and the circuit board 22 and the circuit board 22 are fixed. And a substrate fixing member 23. As shown in FIGS. 12 to 14, heat radiating members 25 and 26 can be attached to and detached from the substrate fixing member 23.
  • the circuit board 22 is a glass epoxy board, for example, and is formed in a rectangular plate shape. Similar to the circuit board 2, a motor drive circuit and a motor control circuit are formed on the circuit board 22.
  • the motor drive circuit is formed in one region 22a of the two regions 22a and 22b divided in the short direction of the rectangular circuit board 22, and the motor control circuit is formed in the other region 22b. Is formed.
  • the heat-generating components 7 that are surface-mounted components are mounted at a predetermined pitch in the longitudinal direction of the rectangular circuit board 22.
  • other electronic components (not shown) constituting the motor drive circuit, electronic components (not shown) constituting the motor control circuit, and the like are mounted. .
  • a heat dissipating part (not shown) for radiating heat generated in the heat generating component 7 is formed on the back surface of the circuit board 22 corresponding to the mounting position of the heat generating component 7 in the same manner as the circuit board 2.
  • a heat radiation pattern (not shown) for conducting heat of the heat generating component 7 to the heat radiation portion is formed.
  • This heat radiation pattern is plating applied to the inner peripheral surface of a plurality of through holes (not shown) penetrating from the front surface 22c to the back surface, and the circuit wiring pattern on the front surface 22c to which the heat generating component 7 is connected and the heat radiation of the back surface. Are connected.
  • a plurality of fixing holes 22 f for fixing the circuit board 22 to the board fixing member 23 are formed in the circuit board 22.
  • the fixing hole 22 f is formed so as to penetrate the circuit board 22.
  • the fixing holes 22 f are formed at two positions corresponding to the mounting positions of the heat generating components 7 and two adjacent positions among the four corners of the circuit board 22. Specifically, as the positions corresponding to the mounting positions of the heat generating components 7, fixing holes 22f are formed at two positions, that is, the left end side of the circuit board 22 in FIG. 9 and the intermediate position of the circuit board 22 in the left-right direction in FIG. In addition, fixing holes 22f are formed at two corners on the right end of FIG.
  • the board fixing member 23 is formed of a heat radiating material having heat radiating properties as in the case of the board fixing member 3. Yes.
  • the substrate fixing member 23 includes a base portion 23a formed in a flat and substantially rectangular parallelepiped shape, and a flat and substantially rectangular parallelepiped fixing portion 23b to which the circuit board 22 is fixed, and the base portion 23a and the fixing portion 23b. Are integrally formed. Wall portions 23c rising to the circuit board 22 side are formed at both ends in the short direction of the base portion 23a formed in a flat and substantially rectangular parallelepiped shape.
  • the fixing portion 23b is formed so as to protrude from the surface 23j of the base portion 23a toward the circuit board 22.
  • the fixing portion 23b is formed in the entire area in the longitudinal direction of the base portion 23a formed in a flat and substantially rectangular parallelepiped shape.
  • fixed part 23b is formed in the intermediate position of the base part 23a in the transversal direction of the base part 23a.
  • a plurality of screw holes 23d for fixing the circuit board 22 are formed on the end face of the fixing portion 23b (upper end face in FIG. 10).
  • the surface 23j of the base portion 23a and the side surface of the fixing portion 23b are smoothly connected by a concave curved surface 23e. That is, the boundary between the base portion 23a and the fixed portion 23b is formed in a curved surface shape.
  • the concave curved surface 23e is formed in a 1/4 arc shape as shown in FIG.
  • One of the two wall portions 23c (the right wall portion in FIG. 12) 23c is formed to cover one end of the circuit board 22 in the short direction.
  • the other end of the circuit board 22 in the short direction is placed on the other wall (the left wall in FIG. 12) 23c of the two walls 23c.
  • a heat dissipating member attaching portion 23g to which the heat dissipating members 25 and 26 are attached is formed on the back surface 23k of the base portion 23a.
  • the heat dissipating member attaching portion 23g is formed so as to slightly protrude from the back surface 23k of the base portion 23a in a direction opposite to the protruding direction of the fixing portion 23b (downward direction in FIG. 12).
  • the heat dissipating member mounting portion 23g is formed in the entire lengthwise direction of the base portion 23a and has a substantially rectangular shape. Further, the heat dissipating member attaching portion 23g is formed at an intermediate position of the base portion 23a in the short direction of the base portion 23a so as to correspond to the fixing portion 23b.
  • the heat dissipating member mounting portion 23g is formed on the back side of the fixing portion 23b, and the fixing portion 23b and the heat dissipating member mounting portion 23g overlap when viewed from the thickness direction of the base portion 23a.
  • the width of the heat radiating member mounting portion 23g in the short direction of the base portion 23a is wider than the width of the fixed portion 23b.
  • a plurality of screw holes 23f for fixing the heat radiating members 25 and 26 are formed on the end surface (the lower end surface in FIG. 10) of the heat radiating member mounting portion 23g.
  • a plurality of heat radiation fins 23h are formed on the back surface 23k of the base portion 23a.
  • the fin 23h is formed on a part of the back surface 23k of the base portion 23a where the heat dissipating member mounting portion 23g is not formed.
  • the fins 23h are formed between the other wall portion 23c on which the circuit board 22 is placed and the heat radiating member mounting portion 23g.
  • the fins 23h are formed on the back surface 23k of the base portion 23a by forming a plurality of concave portions recessed from the back surface 23k of the base portion 23a toward the front side at regular intervals in the short side direction of the base portion 23a. Yes. As shown in FIG.
  • the thickness of the fin 23h increases from the proximal end (upper end in FIG. 12) of the fin 23h toward the distal end (lower end in FIG. 12) of the fin 23h. It is narrower.
  • the two side surfaces 23m of the fin 23h are formed in a flat shape and are inclined so as to approach each other as they go from the base end of the fin 23h toward the tip of the fin 23h.
  • the back surface 23k of the base portion 23a is the opposite side surface of the base portion 23a that is the surface opposite to the surface on which the fixing portion 23b is formed (that is, the surface 23j of the base portion 23a).
  • the fins 23h in this embodiment are second fins.
  • the heat radiation part of the circuit board 22 is fixed to the fixing part 23b in a state of being placed on the end face of the fixing part 23b.
  • screws (not shown) inserted into the fixing holes 22 f formed at two positions corresponding to the mounting positions of the heat generating components 7 and screwed into the screw holes 23 d
  • the heat radiating portion of the circuit board 22 is fixed to the fixing portion 23b by screws (not shown) that are inserted into the fixing holes 22f formed at two adjacent positions and screwed into the screw holes formed in the base portion 23a.
  • An insulating sheet 24 formed of an insulating material is disposed between the heat dissipation part of the circuit board 22 and the end face of the fixing part 23b.
  • the insulating sheet 24 is formed of an insulating material having heat dissipation (excellent heat transfer) like the insulating sheet 4. Moreover, the insulating sheet 24 has elasticity.
  • the insulating sheet 24 is formed of a silicon-based insulating material having heat dissipation properties and elasticity.
  • the insulating sheet 24 is formed with a through-hole through which a screw inserted into the fixing hole 22f is inserted.
  • the insulating sheet 24 is configured such that the heat radiating portion and the fixing portion of the circuit board 22 are formed by the screw inserted through the fixing hole 22f. It is fixed in a state sandwiched between 23b.
  • the insulating sheet 24 is sandwiched between the heat radiating portion and the fixing portion 23b of the circuit board 22 in a compressed state.
  • a heat radiating gel or heat radiating grease is disposed between the heat radiating portion of the circuit board 22 and the insulating sheet 24, and the heat radiating portion of the circuit board 22 is interposed via the heat radiating gel or the heat radiating grease. In close contact with the surface of the insulating sheet 24. Further, a heat radiating gel or heat radiating grease is also disposed between the end face of the fixing portion 23b and the insulating sheet 24, and the end face of the fixing portion 23b is in close contact with the back surface of the insulating sheet 24 via the heat radiating gel or heat radiating grease. is doing. That is, the heat radiating part of the circuit board 22 and the end surface of the fixing part 23 b are in close contact with each other through the insulating sheet 24.
  • heat radiation grease is disposed between the heat radiation portion of the circuit board 22 and the insulating sheet 24.
  • This heat radiation grease is, for example, silicon-based oil.
  • the heat dissipating grease enters the through hole of the circuit board 22 in which the heat dissipating pattern is formed on the inner peripheral surface thereof.
  • heat radiation grease is also disposed between the end face of the fixing portion 23 b and the insulating sheet 24. This heat radiation grease is, for example, silicon-based oil.
  • the fixing portion 23 b is formed so as to protrude from the surface 23 j of the base portion 23 a toward the circuit board 22, and in a state where the circuit board 22 is fixed to the board fixing member 23, the circuit board 22.
  • a gap S ⁇ b> 1 is formed between the back surface and the base portion 23 a.
  • the heat radiating members 25 and 26 are made of a heat radiating material having heat radiating properties. Specifically, the heat radiating members 25 and 26 are formed of a metal material such as aluminum having higher heat dissipation than the circuit board 22. As shown in FIGS. 13 and 14, the heat dissipating members 25 and 26 are formed with a plurality of fins 25 a and 26 a. The fins 25a and 26a are formed so as to rise from the base portions 25b and 26b of the heat dissipation members 25 and 26.
  • the thickness of the fin 25a increases from the proximal end (upper end in FIG. 12) of the fin 25a toward the distal end of the fin 25a (lower end in FIG. 12). It is narrower.
  • the two side surfaces 25d of the fin 25a are formed in a planar shape and are inclined so as to approach each other as they go from the base end of the fin 25a toward the tip of the fin 25a.
  • the thickness of the fin 26a (the thickness of the base portion 23a in the short direction) becomes narrower from the proximal end of the fin 26a toward the distal end of the fin 26a.
  • the two side surfaces of the fin 26a are formed in a planar shape, similar to the two side surfaces 25d of the fin 25a, and are inclined so as to approach each other from the base end of the fin 26a toward the front end of the fin 26a. Yes.
  • the fins 26 a of the heat dissipation member 26 are longer than the fins 25 a of the heat dissipation member 25. That is, the heat dissipation performance of the heat dissipation member 26 is superior to the heat dissipation performance of the heat dissipation member 25.
  • the heat radiating members 25 and 26 are formed with insertion holes (not shown) through which screws (not shown) screwed into the screw holes 23f of the board fixing member 23 are inserted.
  • the heat radiating members 25 and 26 can be attached to and detached from the heat radiating member mounting portion 23g with screws, and a part of the base portions 25b and 26b of the heat radiating members 25 and 26 can come into contact with the end surface of the heat radiating member mounting portion 23g. It has become. That is, a gap is formed between the back surface 23k of the base portion 23a and the base portions 25b and 26b.
  • the electronic device 21 is configured to be capable of being driven regardless of whether it is used for a servo motor having a relatively small capacity or a servo motor having a relatively large capacity.
  • the electronic device 21 when the electronic device 21 is used in a servo motor having a relatively small capacity, the electronic device 21 is not attached with the heat radiating members 25 and 26 as shown in FIG. Used in state. Further, when the capacity of the servo motor is increased, as shown in FIG. 13, the electronic device 21 is used in a state where the heat radiating member 25 is attached. Further, when the capacity of the servo motor is further increased, as shown in FIG. 14, the electronic device 21 is used with the heat dissipation member 26 attached.
  • the heat dissipating member attaching portion 23g to which the heat dissipating members 25 and 26 are attached is formed so as to protrude from the back surface 23k of the base portion 23a in the direction opposite to the protruding direction of the fixing portion 23b. Therefore, compared with the case where the entire back surface 23k of the base portion 23a is to be brought into contact with the heat radiating members 25 and 26, the area of the portion of the base portion 23a that is to be brought into contact with the heat radiating members 25 and 26 is reduced. Can be reduced.
  • the flatness of the portion to be brought into contact with the heat radiating members 25 and 26 is relatively easy as compared with the case where the entire rear surface 23k of the base portion 23a is brought into contact with the heat radiating members 25 and 26. (That is, the flatness of the end face of the heat dissipating member mounting portion 23g) can be ensured.
  • the substrate fixing member 23 and the heat radiating members 25 and 26 can be reliably brought into contact with each other, and heat can be efficiently transferred from the substrate fixing member 23 to the heat radiating members 25 and 26. become.
  • the heat radiating member mounting portion 23g is formed on the back side of the fixing portion 23b, and the fixing portion 23b and the heat radiating member mounting portion 23g overlap when viewed from the thickness direction of the base portion 23a. . Therefore, the distance between the fixing portion 23b and the heat radiating member mounting portion 23g can be shortened. Therefore, in this embodiment, even if the area of the portion of the base portion 23a to be brought into contact with the heat dissipation members 25 and 26 is reduced, the heat transmitted to the fixing portion 23b to which the heat dissipation portion of the circuit board 22 is fixed. Can be efficiently transmitted to the heat radiating members 25 and 26 via the heat radiating member mounting portion 23g.
  • a plurality of fins 23h are formed on the back surface 23k of the base portion 23a. Therefore, it is possible to increase the heat dissipation efficiency of the substrate fixing member 23.
  • the thickness of the fin 23h becomes narrower from the base end of the fin 23h toward the tip of the fin 23h, the surface area of the fin 23h can be increased. Therefore, in this embodiment, the heat radiation efficiency of the substrate fixing member 23 can be effectively increased.
  • the plurality of fins 25a, 26a formed on the heat dissipation members 25, 26 are also narrowed from the base ends of the fins 25a, 26a toward the tips of the fins 25a, 26a. The surface area of 26a can be increased to effectively increase the heat dissipation efficiency of the heat dissipation members 25 and 26.
  • the surface 23j of the base portion 23a and the side surface of the fixed portion 23b are smoothly connected by the concave curved surface 23e. Therefore, in this embodiment, it is possible to increase the area of the portion where heat is transferred from the fixing portion 23b to the base portion 23a, and to efficiently transfer heat from the fixing portion 23b to the base portion 23a.
  • heat radiating members 5 and 6 are described as heat radiating members that can be attached to and detached from the substrate fixing member 3, but various heat dissipations other than the heat radiating members 5 and 6 are included in the substrate fixing member 3.
  • the member is also detachable.
  • the heat radiating members 5 and 6 can be attached to and detached from the board fixing member 3.
  • the board fixing is performed.
  • the heat radiating members 5 and 6 may not be detachable from the member 3.
  • various heat radiating members other than the heat radiating members 25 and 26 can be attached to and detached from the substrate fixing member 23. Further, if the range of the capacity of the servo motor in which the electronic device 21 is used is limited, the heat radiating members 25 and 26 may not be detachable from the substrate fixing member 23.
  • the heat generating component 7 is mounted on the front surface 2c of the circuit board 2, but the heat generating component 7 may be mounted on the back surface 2d of the circuit board 2.
  • the heat generating component 7 is mounted on the front surface 22 c of the circuit board 22, but the heat generating component 7 may be mounted on the back surface of the circuit board 22.
  • the heat generating component 7 is a surface mounting component.
  • the heat generating component 7 may be a so-called insertion component in which a terminal is inserted into a through hole formed in the circuit board 2 and mounted. good. In these cases, for example, the terminals of the heat generating component 7 are directly connected to the heat radiating portion 2e of the circuit board 2 or the heat radiating portion of the circuit board 22.
  • the heat radiating gel or the heat radiating grease is arranged between the heat radiating part 2e and the insulating sheet 4 and between the end face of the fixing part 3b and the insulating sheet 4, but the heat radiating part 2e and the insulating sheet are arranged. 4, and between the end surface of the fixing
  • a heat radiating gel or heat radiating grease is disposed between the heat radiating portion of the circuit board 22 and the insulating sheet 24 and between the end face of the fixing portion 23b and the insulating sheet 24.
  • the heat radiating gel and the heat radiating grease may not be disposed between the heat radiating portion of the circuit board 22 and the insulating sheet 24 and between the end face of the fixing portion 23b and the insulating sheet 24.
  • the heat dissipating member attaching portion 23g is formed on the back side of the fixing portion 23b, and the fixing portion 23b and the heat dissipating member attaching portion 23g overlap when viewed from the thickness direction of the base portion 23a.
  • the heat radiating member mounting portion 23g may be formed so as not to overlap the fixing portion 23b when viewed from the thickness direction of the base portion 23a.
  • the fin 23h is formed on a part of the back surface 23k of the base portion 23a where the heat radiating member mounting portion 23g is not formed.
  • the fin 23h is formed on the back surface of the base portion 23a. It may be formed on the entire portion of 23k where the heat dissipating member mounting portion 23g is not formed. Further, the fins 23h may not be formed on the back surface 23k of the base portion 23a.
  • the insulating sheets 4 and 24 are formed of a silicon-based insulating material having heat dissipation and elasticity.
  • the insulating sheets 4 and 24 may be formed of an epoxy resin, PET (polyethylene terephthalate), or the like.
  • the motor drive circuit and the motor control circuit are formed on one circuit board 2 and 22.
  • the motor drive circuit and the motor control circuit may be formed on separate circuit boards.
  • the electronic devices 1 and 21 are devices for driving an industrial servo motor.
  • the electronic device to which the configuration of the present invention is applied is used for purposes other than servo motor driving. May be used.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
PCT/JP2011/075122 2010-11-15 2011-11-01 電子機器 WO2012066925A1 (ja)

Priority Applications (2)

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CN201180014580.4A CN102812790B (zh) 2010-11-15 2011-11-01 电子设备
JP2012515269A JP5670447B2 (ja) 2010-11-15 2011-11-01 電子機器

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JP2010-254457 2010-11-15
JP2010254457 2010-11-15

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JP2014054017A (ja) * 2012-09-05 2014-03-20 Asmo Co Ltd 車両用モータユニット
JP2014093854A (ja) * 2012-11-02 2014-05-19 Asmo Co Ltd 車両用モータユニット
CN111133572A (zh) * 2017-09-28 2020-05-08 Ｋｙｂ株式会社 部件装配体以及电子设备
CN113395849A (zh) * 2020-03-12 2021-09-14 欧姆龙株式会社 电源单元

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DE102015200548A1 (de) * 2015-01-15 2016-07-21 Zf Friedrichshafen Ag Anordnung zum Entwärmen von zumindest einem elektronischen Bauteil
CN106654645A (zh) * 2016-12-30 2017-05-10 上海航天科工电器研究院有限公司 一种互联转接的板卡集成与散热一体化控制盒

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JPWO2012066925A1 (ja) 2014-05-12
CN102812790A (zh) 2012-12-05
JP5670447B2 (ja) 2015-02-18

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