WO2012066925A1 - Electronic device - Google Patents

Electronic device Download PDF

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Publication number
WO2012066925A1
WO2012066925A1 PCT/JP2011/075122 JP2011075122W WO2012066925A1 WO 2012066925 A1 WO2012066925 A1 WO 2012066925A1 JP 2011075122 W JP2011075122 W JP 2011075122W WO 2012066925 A1 WO2012066925 A1 WO 2012066925A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
circuit board
heat radiating
insulating sheet
fixing
Prior art date
Application number
PCT/JP2011/075122
Other languages
French (fr)
Japanese (ja)
Inventor
理 丸山
均 上甲
雅哉 倉本
Original Assignee
日本電産サンキョー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電産サンキョー株式会社 filed Critical 日本電産サンキョー株式会社
Priority to JP2012515269A priority Critical patent/JP5670447B2/en
Priority to CN201180014580.4A priority patent/CN102812790B/en
Publication of WO2012066925A1 publication Critical patent/WO2012066925A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Definitions

  • the present invention relates to an electronic device including a circuit board on which a heat generating component is mounted.
  • Patent Literature 1 An electronic device described in Patent Literature 1 includes a metal plate having an L-shaped cross section, an insulating sheet attached to the metal plate, and a circuit board attached in parallel to the metal plate via the insulating sheet. Yes.
  • a connector or the like is mounted on the front surface of the circuit board, and a plurality of surface mount resistors are mounted on the back surface of the circuit board.
  • the circuit board is fixed to the metal plate so that the surface mounting resistance is in close contact with the insulating sheet, and the heat generated by the surface mounting resistance is conducted to the metal plate through the insulating sheet and from the back surface of the metal plate. Dissipated.
  • the heat generated by the surface mounting resistance is dissipated from the back surface of the metal plate through the insulating sheet by bringing the surface mounting resistance into close contact with the insulating sheet attached to the metal plate. Yes. Therefore, in this electronic device, when various electronic components with different thicknesses are mounted on the back surface of the circuit board, the surface mount resistance cannot be brought into close contact with the insulating sheet, and is generated by the surface mount resistance that is a heat generating component. It may be difficult to dissipate heat efficiently.
  • an object of the present invention is to provide an electronic device that can efficiently dissipate heat generated by a heat-generating component mounted on a circuit board even if electronic components having different thicknesses are mounted on the back surface of the circuit board. Is to provide.
  • an electronic device of the present invention includes a circuit board on which a heat generating component is mounted and a board fixing member to which the circuit board is fixed, and the back surface of the circuit board is generated by the heat generating component.
  • a heat dissipating part is formed to dissipate heat
  • the board fixing member is disposed with a predetermined distance from the back surface of the circuit board, and the heat dissipating part protrudes from the base part toward the circuit board. It is characterized by being formed of a heat dissipating material having heat dissipating properties.
  • a heat radiating part for radiating heat generated by the heat-generating component is formed on the back surface of the circuit board, and the heat radiating part is fixed to the fixing part of the board fixing member formed of a heat radiating material.
  • the fixing part of the board fixing member protrudes from the base part toward the circuit board, and a predetermined gap is formed between the back surface of the circuit board and the base part. Therefore, various electronic components having different thicknesses can be mounted on the back surface of the circuit board. As described above, according to the present invention, even when electronic components having different thicknesses are mounted on the back surface of the circuit board, it is possible to efficiently dissipate heat generated by the heat generating components.
  • the terminals of the electronic components mounted on the surface of the circuit board are projected from the back surface of the circuit board.
  • the substrate fixing member is formed of, for example, a metal material, and an insulating sheet formed of an insulating material is disposed between the heat dissipation portion and the fixing portion.
  • the insulating sheet is formed of an insulating material having a heat dissipation property, and a heat dissipation gel having a heat dissipation property between the heat dissipation portion and the insulating sheet and / or between the fixing portion and the insulating sheet.
  • the thermal radiation grease is arrange
  • the heat radiation between the heat radiating part and the insulating sheet is improved by the heat radiating gel or the heat radiating grease to improve the adhesion between the heat radiating part and the insulating sheet and / or the adhesion between the fixing part and the insulating sheet. It becomes possible to reduce resistance and thermal resistance between the fixing portion and the insulating sheet. Therefore, even if an insulating sheet is arranged between the heat radiating part and the fixing part, it is possible to efficiently transmit the heat generated by the heat-generating component to the board fixing member and dissipate it efficiently from the board fixing member. become.
  • the insulating sheet is preferably formed of an insulating material having a heat dissipation property and has elasticity. If comprised in this way, by arrange
  • a heat radiating member formed of a heat radiating material having a heat radiating property is detachable from the substrate fixing member. If comprised in this way, it will become possible to attach a heat radiating member to a board
  • the heat dissipating member is formed with a plurality of heat dissipating fins, and the thickness of the fin is preferably narrowed from the base end of the fin toward the tip of the fin. If comprised in this way, it will become possible to enlarge the surface area of a fin and to improve the thermal radiation efficiency of a thermal radiation member.
  • the heat dissipating member can be attached to and detached from the side of the base that is opposite to the surface on which the fixing portion is formed, and is opposite to the protruding direction of the fixing portion. It is preferable that a heat dissipating member mounting portion is formed so that the heat dissipating member comes into contact with the heat dissipating member. If comprised in this way, the area of the part which is going to contact
  • the flatness of the portion to be brought into contact with the heat radiating member is relatively easily compared with the case where the entire surface of the side opposite the substrate is brought into contact with the heat radiating member (that is, the plane of the heat radiating member mounting portion).
  • the substrate fixing member and the heat dissipation member can be reliably brought into contact with each other, and heat can be efficiently transferred from the substrate fixing member to the heat dissipation member.
  • the heat dissipating member mounting portion is preferably formed so as to correspond to the fixed portion. If comprised in this way, it will become possible to shorten the distance of a fixing
  • a plurality of second fins for heat dissipation are formed on all or a part of the side where the heat dissipating member mounting portion is not formed on the side surface of the substrate. If comprised in this way, it will become possible to improve the thermal radiation efficiency of a board
  • the thickness of the second fin becomes narrower from the proximal end of the second fin toward the distal end of the second fin. If comprised in this way, it will become possible to enlarge the surface area of a 2nd fin and to improve the thermal radiation efficiency of a board
  • the substrate fixing member is preferably formed with a plurality of second fins for heat dissipation. If comprised in this way, it will become possible to improve the thermal radiation efficiency of a board
  • the boundary between the fixed portion and the base portion is preferably formed in a curved surface shape. If comprised in this way, it will become possible to enlarge the area of the part to which heat is transmitted from a fixing
  • the heat-generating component is surface-mounted on the surface of the circuit board and connected to the heat dissipation portion via a heat dissipation pattern formed between the front surface and the back surface of the circuit board.
  • the terminal of the heat generating component is inserted into the through hole formed in the circuit board and the heat generating component is mounted on the circuit board, it is necessary to mount the heat generating component manually, but if configured in this way, Since the heat generating component is surface-mounted on the circuit board, the heat generating component can be mounted by a machine, and the mounting operation of the heat generating component can be simplified.
  • an insulating sheet formed of an insulating material having a heat dissipation property is disposed between the heat dissipation portion and the fixing portion, and a heat dissipation grease having a heat dissipation property is provided between the heat dissipation portion and the insulating sheet.
  • the circuit board is provided with a through-hole penetrating the circuit board, the heat radiation pattern is formed on the inner peripheral surface of the through-hole, and the heat radiation grease enters the through-hole. If comprised in this way, it will become possible to reduce the thermal resistance in a through-hole with the thermal radiation grease which has entered into the through-hole. Therefore, it is possible to efficiently transfer the heat generated in the heat generating component to the heat radiating portion.
  • the circuit board is formed with a high voltage circuit on which a heat generating component is mounted and a low voltage circuit to which a lower voltage is applied than the high voltage circuit. If comprised in this way, the number of parts of an electronic device can be reduced compared with the case where the circuit for high voltage and the circuit for low voltage are each formed in the separate circuit board. Therefore, the configuration of the electronic device can be simplified.
  • the high voltage circuit is a motor drive circuit for driving a motor
  • the low voltage circuit is a motor control circuit for controlling the motor
  • the heat generated by the heat generating components mounted on the circuit board can be efficiently dissipated. It becomes possible.
  • Embodiment 1 of this invention It is a perspective view of the electronic device concerning Embodiment 1 of this invention. It is a perspective view which shows the electronic device shown in FIG. 1 from the back surface side. It is a perspective view which shows the circuit board shown in FIG. 1 from the back surface side. It is a perspective view of the board
  • FIG. 10 is a perspective view of a state in which a heat dissipation member is attached to the electronic device illustrated in FIG. 9.
  • FIG. 10 is a perspective view of a state where another heat radiating member is attached to the electronic device shown in FIG. 9.
  • FIG. 1 is a perspective view of an electronic apparatus 1 according to the first embodiment of the present invention.
  • FIG. 2 is a perspective view showing the electronic device 1 shown in FIG. 1 from the back side.
  • FIG. 3 is a perspective view showing the circuit board 2 shown in FIG. 1 from the back surface 2d side.
  • FIG. 4 is a perspective view of the substrate fixing member 3 shown in FIG.
  • FIG. 5 is a perspective view of the electronic device 1 shown in FIG. 1 with the heat dissipation member 5 attached thereto.
  • FIG. 6 is a perspective view of the electronic device 1 shown in FIG. 1 with the heat dissipation member 6 attached thereto.
  • FIG. 7 is a perspective view of the heat dissipation member 5 shown in FIG.
  • FIG. 8 is a perspective view of the heat dissipation member 6 shown in FIG.
  • the electronic device 1 of this embodiment is a device for driving an industrial servo motor (not shown), and includes a circuit board 2 and a board fixing member 3 to which the circuit board 2 is fixed. As shown in FIGS. 5 and 6, heat radiating members (heat sinks) 5 and 6 can be attached to and detached from the substrate fixing member 3.
  • the circuit board 2 is, for example, a glass epoxy board and is formed in a rectangular plate shape.
  • the circuit board 2 is formed with a motor drive circuit for driving the servo motor and a motor control circuit for controlling the servo motor.
  • the motor drive circuit is formed in one of the two regions 2a and 2b divided in the short direction of the circuit board 2 formed in a rectangular shape, and the motor control circuit is formed in the other region 2b. Is formed.
  • the motor drive circuit supplies a drive current for driving the servo motor to the servo motor. Therefore, a high voltage is applied to the motor drive circuit.
  • the motor drive circuit of this embodiment is a high voltage circuit to which a high voltage is applied.
  • the motor control circuit of this embodiment is a low voltage circuit to which a voltage lower than that of the motor drive circuit is applied.
  • a plurality of heat generating components 7 constituting a motor drive circuit are mounted on the front surface 2c of the circuit board 2 at a predetermined pitch in the longitudinal direction of the rectangular circuit board 2.
  • the heat generating component 7 is an electronic component that generates heat when energized.
  • the heat generating component 7 of this embodiment is an insulated gate bipolar transistor (Insulated Gate Bipolar Transistor (IGBT)).
  • IGBT Insulated Gate Bipolar Transistor
  • the heat generating component 7 of the present embodiment is a surface mounting component and is surface mounted on the surface 2 c of the circuit board 2.
  • other electronic components (not shown) constituting the motor drive circuit, electronic components (not shown) constituting the motor control circuit, and the like are mounted on the front surface 2c of the circuit board 2 and the back surface 2d of the circuit board 2.
  • a heat radiating portion 2e for radiating heat generated in the heat generating component 7 is formed on the back surface 2d of the circuit board 2 corresponding to the mounting position of the heat generating component 7.
  • the heat dissipating part 2e is formed in a band shape with a metal foil such as a copper foil, and is exposed on the back surface 2d. Between the front surface 2c and the back surface 2d, a heat radiation pattern (not shown) for conducting the heat of the heat generating component 7 to the heat radiation portion 2e is formed.
  • the heat radiation pattern is plating (that is, vias) applied to the inner peripheral surface of a plurality of through holes (not shown) penetrating from the front surface 2c to the back surface 2d, and the heat generating component 7 is connected thereto.
  • the circuit wiring pattern on the front surface 2c and the heat radiating part 2e on the back surface 2d are connected.
  • the circuit board 2 has a plurality of fixing holes 2 f for fixing the circuit board 2 to the board fixing member 3.
  • the fixing hole 2 f is formed so as to penetrate the circuit board 2.
  • the fixing hole 2f is formed so as to correspond to the mounting position of the heat generating component 7. That is, the fixing hole 2f is formed so as to correspond to the formation position of the heat radiating portion 2e.
  • the substrate fixing member 3 is formed of a heat dissipating material having heat dissipating properties.
  • the board fixing member 3 is formed of a metal material such as aluminum having higher heat dissipation than the circuit board 2.
  • the substrate fixing member 3 includes a base portion 3a formed in a rectangular flat plate shape, a rectangular parallelepiped fixing portion 3b to which the circuit board 2 is fixed, and a support portion 3c that supports an end surface of the circuit board 2 in the short direction.
  • the base part 3a, the fixing part 3b, and the support part 3c are integrally formed.
  • the fixing portion 3b is formed so as to protrude toward the circuit board 2 from the surface 3j of the base portion 3a.
  • This fixed part 3b is formed in the whole area of the longitudinal direction of the base part 3a formed in a rectangle.
  • fixed part 3b is formed in the intermediate position of the base part 3a in the transversal direction of the base part 3a.
  • the width of the fixed portion 3b in the short direction of the base portion 3a is, for example, substantially equal to the width of the heat radiating portion 2e.
  • a plurality of screw holes 3d for fixing the circuit board 2 are formed on the end face of the fixing portion 3b (upper end face in FIG. 4).
  • fixed part 3b in the transversal direction of the base part 3a may be wider than the width
  • the back surface 3k of the base portion 3a is formed in a planar shape.
  • the support portion 3c is formed in a flat plate shape that rises toward the circuit board 2 from the end surface in the short direction of the base portion 3a formed in a rectangular shape.
  • a contact portion 3e that contacts the surface 2c of the circuit board 2 is formed so as to be bent at a right angle from the end surface of the support portion 3c.
  • a plurality of screw holes 3f for fixing the heat radiating members 5 and 6 are formed in the back surface 3k of the base portion 3a.
  • the screw hole 3f is formed so as to correspond to the formation position of the fixing portion 3b.
  • the fixing hole 2f of the circuit board 2 is formed so as to correspond to the formation position of the heat radiating portion 2e, and is fixed to the fixing portion 3b in a state where the heat radiating portion 2e is placed on the end surface of the fixing portion 3b. ing. Specifically, the heat radiating part 2e is fixed to the fixing part 3b by a screw (not shown) inserted through the fixing hole 2f and screwed into the screw hole 3d. An insulating sheet 4 formed of an insulating material is disposed between the end face of the fixed part 3b and the heat radiating part 2e.
  • the insulating sheet 4 is made of an insulating material having heat dissipation (excellent heat transfer). Further, the insulating sheet 4 has elasticity.
  • the insulating sheet 4 is formed of a silicon-based insulating material having heat dissipation properties and elasticity.
  • the insulating sheet 4 is formed with a through hole through which a screw inserted into the fixing hole 2f and screwed into the screw hole 3d is inserted.
  • the insulating sheet 4 is inserted into the fixing hole 2f and screwed into the screw hole 3d.
  • the screw is fixed in a state of being sandwiched between the heat dissipating part 2e and the fixing part 3b.
  • the insulating sheet 4 is sandwiched between the heat radiating part 2e and the fixing part 3b in a compressed state.
  • a heat radiating gel or a heat radiating grease having heat radiating properties is disposed, and the heat radiating part 2e is interposed between the heat radiating gel or the heat radiating grease. It is in close contact with the surface.
  • a heat radiating gel or heat radiating grease is also disposed between the end face of the fixing portion 3b and the insulating sheet 4, and the end face of the fixing portion 3b is in close contact with the back surface of the insulating sheet 4 via the heat radiating gel or heat radiating grease. is doing. That is, the end surface of the fixing portion 3 b and the heat radiating portion 2 e are in close contact with each other via the insulating sheet 4.
  • heat radiation grease is disposed between the heat radiation portion 2e and the insulating sheet 4.
  • This heat radiation grease is, for example, silicon-based oil.
  • the heat dissipating grease enters the through hole of the circuit board 2 where the heat dissipating pattern is formed on the inner peripheral surface thereof.
  • heat radiation grease is also disposed between the end face of the fixed portion 3b and the insulating sheet 4. This heat radiation grease is, for example, silicon-based oil.
  • the fixing portion 3b is formed so as to protrude from the surface 3j of the base portion 3a toward the circuit board 2, and in the state where the circuit board 2 is fixed to the board fixing member 3, the circuit A gap S is formed between the back surface 2d of the substrate 2 and the base portion 3a. Further, in a state where the circuit board 2 is fixed to the board fixing member 3, the support portion 3 c comes into contact with the end face in the short direction of the circuit board 2, and is close to the end face in the short direction of the circuit board 2 on the surface 2 c. The contact portion 3e is in contact.
  • the back surface 2d of the circuit board 2 may be in contact with the end surface of the support portion 3c without forming the contact portion 3e on the end surface of the support portion 3c.
  • a second fixing portion for fixing the circuit board 2 may be formed on the end surface of the support portion 3c.
  • the heat dissipating members 5 and 6 are formed of a heat dissipating material having heat dissipating properties. Specifically, the heat dissipating members 5 and 6 are formed of a metal material such as aluminum having higher heat dissipation than the circuit board 2. As shown in FIGS. 5 to 8, the heat dissipating members 5 and 6 are formed with a plurality of fins 5a and 6a. The fins 6 a of the heat radiating member 6 are longer than the fins 5 a of the heat radiating member 5. That is, the heat dissipation performance of the heat dissipation member 6 is superior to the heat dissipation performance of the heat dissipation member 5.
  • the heat radiating members 5 and 6 are formed with insertion holes (not shown) through which screws (not shown) screwed into the screw holes 3f of the substrate fixing member 3 are inserted.
  • the heat radiating members 5 and 6 can be attached to and detached from the back surface of the substrate fixing member 3 (that is, the back surface 3k of the base portion 3a) by screws.
  • the back surface 3k of the base portion 3a is formed in a planar shape.
  • the contact surfaces 5c and 6c (see FIGS. 7 and 8) of the heat radiating members 5 and 6 that contact the back surface 3k of the base portion 3a are also formed in a planar shape.
  • the back surface 3k of the base portion 3a and the contact surfaces 5c, 6c of the heat dissipating members 5, 6 are formed in substantially the same shape, and the entire back surface 3k of the base portion 3a is formed by the heat dissipating members 5, 6
  • the contact surfaces 5c and 6c can contact the entire surface.
  • the electronic device 1 of this embodiment is configured to be able to be driven regardless of whether it is used for a servo motor having a relatively small capacity or a servo motor having a relatively large capacity.
  • the electronic device 1 is configured to be able to drive a 50 W to 750 W servo motor.
  • the heat generation amount of the heat generating component 7 is small because the drive current supplied to the servo motor is small. Therefore, when the electronic device 1 is used for a servo motor having a relatively small capacity, the electronic device 1 is used in a state where the heat radiating members 5 and 6 are not attached as shown in FIG. In addition, when the capacity of the servo motor is increased, the drive current supplied to the servo motor is increased, and the heat generation amount of the heat generating component 7 is increased. Therefore, as shown in FIG.
  • the heat radiating portion 2e is formed on the back surface 2d of the circuit board 2, and the heat radiating portion 2e via the insulating sheet 4 is fixed to the fixing portion 3b of the substrate fixing member 3 formed of a metal material.
  • the heat generated in the heat generating component 7 can be transmitted to the board fixing member 3 via the heat radiating part 2 e and the like, and can be efficiently dissipated from the board fixing member 3.
  • the heat radiating members 5 and 6 can be attached to and detached from the board fixing member 3, when the heat generation amount of the heat generating component 7 is large, the heat generated in the heat generating component 7 is transferred to the heat radiating portion 2e and the like. Can be efficiently transmitted to the substrate fixing member 3 and the heat radiating members 5 and 6 from the substrate fixing member 3 and the heat radiating members 5 and 6.
  • the common board fixing member 3 is used and the heat generation amount of the heat generating component 7 is determined (that is, the electronic device).
  • the heat radiating members 5 and 6 can be attached to the substrate fixing member 3, and the heat radiating members 5 and 6 can be removed from the substrate fixing member 3.
  • any one of the heat radiating members 5 and 6 can be selected and attached to the substrate fixing member 3 in accordance with the heat generation amount of the heat generating component 7.
  • the fixing part 3b of the board fixing member 3 protrudes from the base part 3a toward the circuit board 2, and a gap S is formed between the back surface 2d of the circuit board 2 and the base part 3a. . Therefore, in this embodiment, various electronic components can be mounted on the back surface 2d of the circuit board 2 using the gap S.
  • the gap S is formed between the back surface 2d of the circuit board 2 and the base portion 3a, for example, terminals of electronic components mounted on the front surface 2c of the circuit board 2 protrude from the back surface 2d. Even if it is a case, it becomes possible to ensure the distance of the front-end
  • the heat generating component 7 is a surface mounting component. Therefore, the heat generating component 7 can be mounted by a machine. Therefore, it is possible to simplify the mounting operation of the heat generating component 7.
  • a motor drive circuit and a motor control circuit are formed on one circuit board 2. Therefore, in this embodiment, compared with the case where the motor drive circuit and the motor control circuit are formed on separate circuit boards, the number of parts of the electronic device 1 can be reduced, and the configuration of the electronic device 1 is simplified. It becomes possible to become.
  • heat dissipating grease is disposed between the heat dissipating part 2e and the insulating sheet 4, and between the end face of the fixed part 3b and the insulating sheet 4. Therefore, it is possible to improve the adhesion between the heat radiation part 2e and the insulating sheet 4 and the adhesion between the fixing part 3b and the insulation sheet 4 by the heat radiation grease. That is, in this embodiment, the insulating sheet 4 is fixed in a state of being sandwiched between the heat radiating portion 2e and the fixing portion 3b by a screw inserted into the fixing hole 2f and screwed into the screw hole 3d.
  • the adhesiveness between the heat radiating part 2e and the insulating sheet 4 and the adhesiveness between the fixing part 3b and the insulating sheet 4 are increased, but in other parts, the adhesiveness between the heat radiating part 2e and the insulating sheet 4; And the adhesiveness of the fixing
  • the heat dissipating grease is disposed between the heat dissipating part 2e and the insulating sheet 4 and between the end face of the fixed part 3b and the insulating sheet 4, the heat dissipating part 2e and the insulating sheet 4
  • the insulating sheet 4 has elasticity and is sandwiched between the heat radiating portion 2e and the fixing portion 3b in a compressed state. Therefore, the adhesiveness between the heat radiating part 2e and the insulating sheet 4 and the adhesiveness between the fixing part 3b and the insulating sheet 4 are effectively enhanced, and the thermal resistance and the fixing part between the heat radiating part 2e and the insulating sheet 4 are improved. It becomes possible to effectively reduce the thermal resistance between 3b and the insulating sheet 4. Therefore, in this embodiment, even when the insulating sheet 4 is disposed between the heat radiating part 2e and the fixing part 3b, the heat generated by the heat generating component 7 is efficiently transmitted by the board fixing member 3. It becomes possible to dissipate more efficiently from the substrate fixing member 3.
  • the heat dissipating grease arranged between the heat dissipating part 2e and the insulating sheet 4 enters the through hole of the circuit board 2 in which the heat dissipating pattern is formed on the inner peripheral surface thereof. Therefore, the thermal resistance in the through hole can be reduced by the heat dissipating grease entering the through hole. In other words, although the thermal resistance of the inner peripheral surface of the through hole where the heat radiation pattern is formed is low, if the heat radiation grease does not enter the through hole, the heat of the entire through hole is affected by the air in the through hole. Resistance increases. However, in this embodiment, since the heat dissipating grease enters the through hole, the heat resistance in the through hole can be reduced by the heat dissipating grease in the through hole. Therefore, in this embodiment, it is possible to efficiently transfer the heat generated in the heat generating component 7 to the heat radiating portion 2e.
  • FIG. 9 is a perspective view of the electronic device 21 according to the second embodiment of the present invention.
  • FIG. 10 is a perspective view of the substrate fixing member 23 shown in FIG.
  • FIG. 11 is a perspective view showing the substrate fixing member 23 shown in FIG. 10 from the back side.
  • FIG. 12 is a side view of the electronic device 21 shown in FIG. 9 with the heat dissipation member 25 attached thereto.
  • FIG. 13 is a perspective view of the electronic device 21 shown in FIG. 9 with the heat dissipation member 25 attached thereto.
  • FIG. 14 is a perspective view of the electronic device 21 shown in FIG. 9 with the heat dissipation member 26 attached thereto.
  • the electronic device 21 of the present embodiment is a device for driving an industrial servo motor (not shown), and the circuit board 22 and the circuit board 22 are fixed. And a substrate fixing member 23. As shown in FIGS. 12 to 14, heat radiating members 25 and 26 can be attached to and detached from the substrate fixing member 23.
  • the circuit board 22 is a glass epoxy board, for example, and is formed in a rectangular plate shape. Similar to the circuit board 2, a motor drive circuit and a motor control circuit are formed on the circuit board 22.
  • the motor drive circuit is formed in one region 22a of the two regions 22a and 22b divided in the short direction of the rectangular circuit board 22, and the motor control circuit is formed in the other region 22b. Is formed.
  • the heat-generating components 7 that are surface-mounted components are mounted at a predetermined pitch in the longitudinal direction of the rectangular circuit board 22.
  • other electronic components (not shown) constituting the motor drive circuit, electronic components (not shown) constituting the motor control circuit, and the like are mounted. .
  • a heat dissipating part (not shown) for radiating heat generated in the heat generating component 7 is formed on the back surface of the circuit board 22 corresponding to the mounting position of the heat generating component 7 in the same manner as the circuit board 2.
  • a heat radiation pattern (not shown) for conducting heat of the heat generating component 7 to the heat radiation portion is formed.
  • This heat radiation pattern is plating applied to the inner peripheral surface of a plurality of through holes (not shown) penetrating from the front surface 22c to the back surface, and the circuit wiring pattern on the front surface 22c to which the heat generating component 7 is connected and the heat radiation of the back surface. Are connected.
  • a plurality of fixing holes 22 f for fixing the circuit board 22 to the board fixing member 23 are formed in the circuit board 22.
  • the fixing hole 22 f is formed so as to penetrate the circuit board 22.
  • the fixing holes 22 f are formed at two positions corresponding to the mounting positions of the heat generating components 7 and two adjacent positions among the four corners of the circuit board 22. Specifically, as the positions corresponding to the mounting positions of the heat generating components 7, fixing holes 22f are formed at two positions, that is, the left end side of the circuit board 22 in FIG. 9 and the intermediate position of the circuit board 22 in the left-right direction in FIG. In addition, fixing holes 22f are formed at two corners on the right end of FIG.
  • the board fixing member 23 is formed of a heat radiating material having heat radiating properties as in the case of the board fixing member 3. Yes.
  • the substrate fixing member 23 includes a base portion 23a formed in a flat and substantially rectangular parallelepiped shape, and a flat and substantially rectangular parallelepiped fixing portion 23b to which the circuit board 22 is fixed, and the base portion 23a and the fixing portion 23b. Are integrally formed. Wall portions 23c rising to the circuit board 22 side are formed at both ends in the short direction of the base portion 23a formed in a flat and substantially rectangular parallelepiped shape.
  • the fixing portion 23b is formed so as to protrude from the surface 23j of the base portion 23a toward the circuit board 22.
  • the fixing portion 23b is formed in the entire area in the longitudinal direction of the base portion 23a formed in a flat and substantially rectangular parallelepiped shape.
  • fixed part 23b is formed in the intermediate position of the base part 23a in the transversal direction of the base part 23a.
  • a plurality of screw holes 23d for fixing the circuit board 22 are formed on the end face of the fixing portion 23b (upper end face in FIG. 10).
  • the surface 23j of the base portion 23a and the side surface of the fixing portion 23b are smoothly connected by a concave curved surface 23e. That is, the boundary between the base portion 23a and the fixed portion 23b is formed in a curved surface shape.
  • the concave curved surface 23e is formed in a 1/4 arc shape as shown in FIG.
  • One of the two wall portions 23c (the right wall portion in FIG. 12) 23c is formed to cover one end of the circuit board 22 in the short direction.
  • the other end of the circuit board 22 in the short direction is placed on the other wall (the left wall in FIG. 12) 23c of the two walls 23c.
  • a heat dissipating member attaching portion 23g to which the heat dissipating members 25 and 26 are attached is formed on the back surface 23k of the base portion 23a.
  • the heat dissipating member attaching portion 23g is formed so as to slightly protrude from the back surface 23k of the base portion 23a in a direction opposite to the protruding direction of the fixing portion 23b (downward direction in FIG. 12).
  • the heat dissipating member mounting portion 23g is formed in the entire lengthwise direction of the base portion 23a and has a substantially rectangular shape. Further, the heat dissipating member attaching portion 23g is formed at an intermediate position of the base portion 23a in the short direction of the base portion 23a so as to correspond to the fixing portion 23b.
  • the heat dissipating member mounting portion 23g is formed on the back side of the fixing portion 23b, and the fixing portion 23b and the heat dissipating member mounting portion 23g overlap when viewed from the thickness direction of the base portion 23a.
  • the width of the heat radiating member mounting portion 23g in the short direction of the base portion 23a is wider than the width of the fixed portion 23b.
  • a plurality of screw holes 23f for fixing the heat radiating members 25 and 26 are formed on the end surface (the lower end surface in FIG. 10) of the heat radiating member mounting portion 23g.
  • a plurality of heat radiation fins 23h are formed on the back surface 23k of the base portion 23a.
  • the fin 23h is formed on a part of the back surface 23k of the base portion 23a where the heat dissipating member mounting portion 23g is not formed.
  • the fins 23h are formed between the other wall portion 23c on which the circuit board 22 is placed and the heat radiating member mounting portion 23g.
  • the fins 23h are formed on the back surface 23k of the base portion 23a by forming a plurality of concave portions recessed from the back surface 23k of the base portion 23a toward the front side at regular intervals in the short side direction of the base portion 23a. Yes. As shown in FIG.
  • the thickness of the fin 23h increases from the proximal end (upper end in FIG. 12) of the fin 23h toward the distal end (lower end in FIG. 12) of the fin 23h. It is narrower.
  • the two side surfaces 23m of the fin 23h are formed in a flat shape and are inclined so as to approach each other as they go from the base end of the fin 23h toward the tip of the fin 23h.
  • the back surface 23k of the base portion 23a is the opposite side surface of the base portion 23a that is the surface opposite to the surface on which the fixing portion 23b is formed (that is, the surface 23j of the base portion 23a).
  • the fins 23h in this embodiment are second fins.
  • the heat radiation part of the circuit board 22 is fixed to the fixing part 23b in a state of being placed on the end face of the fixing part 23b.
  • screws (not shown) inserted into the fixing holes 22 f formed at two positions corresponding to the mounting positions of the heat generating components 7 and screwed into the screw holes 23 d
  • the heat radiating portion of the circuit board 22 is fixed to the fixing portion 23b by screws (not shown) that are inserted into the fixing holes 22f formed at two adjacent positions and screwed into the screw holes formed in the base portion 23a.
  • An insulating sheet 24 formed of an insulating material is disposed between the heat dissipation part of the circuit board 22 and the end face of the fixing part 23b.
  • the insulating sheet 24 is formed of an insulating material having heat dissipation (excellent heat transfer) like the insulating sheet 4. Moreover, the insulating sheet 24 has elasticity.
  • the insulating sheet 24 is formed of a silicon-based insulating material having heat dissipation properties and elasticity.
  • the insulating sheet 24 is formed with a through-hole through which a screw inserted into the fixing hole 22f is inserted.
  • the insulating sheet 24 is configured such that the heat radiating portion and the fixing portion of the circuit board 22 are formed by the screw inserted through the fixing hole 22f. It is fixed in a state sandwiched between 23b.
  • the insulating sheet 24 is sandwiched between the heat radiating portion and the fixing portion 23b of the circuit board 22 in a compressed state.
  • a heat radiating gel or heat radiating grease is disposed between the heat radiating portion of the circuit board 22 and the insulating sheet 24, and the heat radiating portion of the circuit board 22 is interposed via the heat radiating gel or the heat radiating grease. In close contact with the surface of the insulating sheet 24. Further, a heat radiating gel or heat radiating grease is also disposed between the end face of the fixing portion 23b and the insulating sheet 24, and the end face of the fixing portion 23b is in close contact with the back surface of the insulating sheet 24 via the heat radiating gel or heat radiating grease. is doing. That is, the heat radiating part of the circuit board 22 and the end surface of the fixing part 23 b are in close contact with each other through the insulating sheet 24.
  • heat radiation grease is disposed between the heat radiation portion of the circuit board 22 and the insulating sheet 24.
  • This heat radiation grease is, for example, silicon-based oil.
  • the heat dissipating grease enters the through hole of the circuit board 22 in which the heat dissipating pattern is formed on the inner peripheral surface thereof.
  • heat radiation grease is also disposed between the end face of the fixing portion 23 b and the insulating sheet 24. This heat radiation grease is, for example, silicon-based oil.
  • the fixing portion 23 b is formed so as to protrude from the surface 23 j of the base portion 23 a toward the circuit board 22, and in a state where the circuit board 22 is fixed to the board fixing member 23, the circuit board 22.
  • a gap S ⁇ b> 1 is formed between the back surface and the base portion 23 a.
  • the heat radiating members 25 and 26 are made of a heat radiating material having heat radiating properties. Specifically, the heat radiating members 25 and 26 are formed of a metal material such as aluminum having higher heat dissipation than the circuit board 22. As shown in FIGS. 13 and 14, the heat dissipating members 25 and 26 are formed with a plurality of fins 25 a and 26 a. The fins 25a and 26a are formed so as to rise from the base portions 25b and 26b of the heat dissipation members 25 and 26.
  • the thickness of the fin 25a increases from the proximal end (upper end in FIG. 12) of the fin 25a toward the distal end of the fin 25a (lower end in FIG. 12). It is narrower.
  • the two side surfaces 25d of the fin 25a are formed in a planar shape and are inclined so as to approach each other as they go from the base end of the fin 25a toward the tip of the fin 25a.
  • the thickness of the fin 26a (the thickness of the base portion 23a in the short direction) becomes narrower from the proximal end of the fin 26a toward the distal end of the fin 26a.
  • the two side surfaces of the fin 26a are formed in a planar shape, similar to the two side surfaces 25d of the fin 25a, and are inclined so as to approach each other from the base end of the fin 26a toward the front end of the fin 26a. Yes.
  • the fins 26 a of the heat dissipation member 26 are longer than the fins 25 a of the heat dissipation member 25. That is, the heat dissipation performance of the heat dissipation member 26 is superior to the heat dissipation performance of the heat dissipation member 25.
  • the heat radiating members 25 and 26 are formed with insertion holes (not shown) through which screws (not shown) screwed into the screw holes 23f of the board fixing member 23 are inserted.
  • the heat radiating members 25 and 26 can be attached to and detached from the heat radiating member mounting portion 23g with screws, and a part of the base portions 25b and 26b of the heat radiating members 25 and 26 can come into contact with the end surface of the heat radiating member mounting portion 23g. It has become. That is, a gap is formed between the back surface 23k of the base portion 23a and the base portions 25b and 26b.
  • the electronic device 21 is configured to be capable of being driven regardless of whether it is used for a servo motor having a relatively small capacity or a servo motor having a relatively large capacity.
  • the electronic device 21 when the electronic device 21 is used in a servo motor having a relatively small capacity, the electronic device 21 is not attached with the heat radiating members 25 and 26 as shown in FIG. Used in state. Further, when the capacity of the servo motor is increased, as shown in FIG. 13, the electronic device 21 is used in a state where the heat radiating member 25 is attached. Further, when the capacity of the servo motor is further increased, as shown in FIG. 14, the electronic device 21 is used with the heat dissipation member 26 attached.
  • the heat dissipating member attaching portion 23g to which the heat dissipating members 25 and 26 are attached is formed so as to protrude from the back surface 23k of the base portion 23a in the direction opposite to the protruding direction of the fixing portion 23b. Therefore, compared with the case where the entire back surface 23k of the base portion 23a is to be brought into contact with the heat radiating members 25 and 26, the area of the portion of the base portion 23a that is to be brought into contact with the heat radiating members 25 and 26 is reduced. Can be reduced.
  • the flatness of the portion to be brought into contact with the heat radiating members 25 and 26 is relatively easy as compared with the case where the entire rear surface 23k of the base portion 23a is brought into contact with the heat radiating members 25 and 26. (That is, the flatness of the end face of the heat dissipating member mounting portion 23g) can be ensured.
  • the substrate fixing member 23 and the heat radiating members 25 and 26 can be reliably brought into contact with each other, and heat can be efficiently transferred from the substrate fixing member 23 to the heat radiating members 25 and 26. become.
  • the heat radiating member mounting portion 23g is formed on the back side of the fixing portion 23b, and the fixing portion 23b and the heat radiating member mounting portion 23g overlap when viewed from the thickness direction of the base portion 23a. . Therefore, the distance between the fixing portion 23b and the heat radiating member mounting portion 23g can be shortened. Therefore, in this embodiment, even if the area of the portion of the base portion 23a to be brought into contact with the heat dissipation members 25 and 26 is reduced, the heat transmitted to the fixing portion 23b to which the heat dissipation portion of the circuit board 22 is fixed. Can be efficiently transmitted to the heat radiating members 25 and 26 via the heat radiating member mounting portion 23g.
  • a plurality of fins 23h are formed on the back surface 23k of the base portion 23a. Therefore, it is possible to increase the heat dissipation efficiency of the substrate fixing member 23.
  • the thickness of the fin 23h becomes narrower from the base end of the fin 23h toward the tip of the fin 23h, the surface area of the fin 23h can be increased. Therefore, in this embodiment, the heat radiation efficiency of the substrate fixing member 23 can be effectively increased.
  • the plurality of fins 25a, 26a formed on the heat dissipation members 25, 26 are also narrowed from the base ends of the fins 25a, 26a toward the tips of the fins 25a, 26a. The surface area of 26a can be increased to effectively increase the heat dissipation efficiency of the heat dissipation members 25 and 26.
  • the surface 23j of the base portion 23a and the side surface of the fixed portion 23b are smoothly connected by the concave curved surface 23e. Therefore, in this embodiment, it is possible to increase the area of the portion where heat is transferred from the fixing portion 23b to the base portion 23a, and to efficiently transfer heat from the fixing portion 23b to the base portion 23a.
  • heat radiating members 5 and 6 are described as heat radiating members that can be attached to and detached from the substrate fixing member 3, but various heat dissipations other than the heat radiating members 5 and 6 are included in the substrate fixing member 3.
  • the member is also detachable.
  • the heat radiating members 5 and 6 can be attached to and detached from the board fixing member 3.
  • the board fixing is performed.
  • the heat radiating members 5 and 6 may not be detachable from the member 3.
  • various heat radiating members other than the heat radiating members 25 and 26 can be attached to and detached from the substrate fixing member 23. Further, if the range of the capacity of the servo motor in which the electronic device 21 is used is limited, the heat radiating members 25 and 26 may not be detachable from the substrate fixing member 23.
  • the heat generating component 7 is mounted on the front surface 2c of the circuit board 2, but the heat generating component 7 may be mounted on the back surface 2d of the circuit board 2.
  • the heat generating component 7 is mounted on the front surface 22 c of the circuit board 22, but the heat generating component 7 may be mounted on the back surface of the circuit board 22.
  • the heat generating component 7 is a surface mounting component.
  • the heat generating component 7 may be a so-called insertion component in which a terminal is inserted into a through hole formed in the circuit board 2 and mounted. good. In these cases, for example, the terminals of the heat generating component 7 are directly connected to the heat radiating portion 2e of the circuit board 2 or the heat radiating portion of the circuit board 22.
  • the heat radiating gel or the heat radiating grease is arranged between the heat radiating part 2e and the insulating sheet 4 and between the end face of the fixing part 3b and the insulating sheet 4, but the heat radiating part 2e and the insulating sheet are arranged. 4, and between the end surface of the fixing
  • a heat radiating gel or heat radiating grease is disposed between the heat radiating portion of the circuit board 22 and the insulating sheet 24 and between the end face of the fixing portion 23b and the insulating sheet 24.
  • the heat radiating gel and the heat radiating grease may not be disposed between the heat radiating portion of the circuit board 22 and the insulating sheet 24 and between the end face of the fixing portion 23b and the insulating sheet 24.
  • the heat dissipating member attaching portion 23g is formed on the back side of the fixing portion 23b, and the fixing portion 23b and the heat dissipating member attaching portion 23g overlap when viewed from the thickness direction of the base portion 23a.
  • the heat radiating member mounting portion 23g may be formed so as not to overlap the fixing portion 23b when viewed from the thickness direction of the base portion 23a.
  • the fin 23h is formed on a part of the back surface 23k of the base portion 23a where the heat radiating member mounting portion 23g is not formed.
  • the fin 23h is formed on the back surface of the base portion 23a. It may be formed on the entire portion of 23k where the heat dissipating member mounting portion 23g is not formed. Further, the fins 23h may not be formed on the back surface 23k of the base portion 23a.
  • the insulating sheets 4 and 24 are formed of a silicon-based insulating material having heat dissipation and elasticity.
  • the insulating sheets 4 and 24 may be formed of an epoxy resin, PET (polyethylene terephthalate), or the like.
  • the motor drive circuit and the motor control circuit are formed on one circuit board 2 and 22.
  • the motor drive circuit and the motor control circuit may be formed on separate circuit boards.
  • the electronic devices 1 and 21 are devices for driving an industrial servo motor.
  • the electronic device to which the configuration of the present invention is applied is used for purposes other than servo motor driving. May be used.

Abstract

Provided is an electronic device that is capable of effectively dissipating heat generated by heat-generating components mounted on a circuit board even if electronic components of different thicknesses are mounted on the bottom surface of the circuit board. In particular, the electronic device (1) is provided with a circuit board (2) on which heat-generating components (7) are mounted and a board fixation member (3) to which the circuit board (2) is fixed. A heat-dissipating section is formed on the back surface of the circuit board (2) in order to dissipate heat generated by the heat-generating components (7), and the board fixation member (3) is made of a heat-dissipating material that has heat dissipation properties. The board fixation member (3) has a base section (3a) that is positioned with a prescribed space from the bottom surface of the circuit board (2) and a fixation section (3b) that protrudes from the base section (3a) toward the circuit board (2) and has the heat-dissipating section fixed thereto.

Description

電子機器Electronics
　本発明は、発熱部品が実装される回路基板を備える電子機器に関する。 The present invention relates to an electronic device including a circuit board on which a heat generating component is mounted.
　従来、回路基板に実装されるとともに通電状態になると熱を発生する電子部品（発熱部品）の放熱対策が種々、提案されている（たとえば、特許文献１参照）。特許文献１に記載の電子機器は、Ｌ形状の断面を有する金属板と、金属板に貼り付けられた絶縁シートと、絶縁シートを介して金属板に平行に取り付けられた回路基板とを備えている。この電子機器では、回路基板の表面にコネクタ等が実装され、回路基板の裏面に複数の面実装抵抗が実装されている。また、面実装抵抗が絶縁シートに密着するように回路基板が金属板に固定されており、面実装抵抗で発生した熱は、絶縁シートを介して金属板に伝導して、金属板の背面から放散される。 Conventionally, various countermeasures for heat dissipation of electronic components (heat generating components) that are mounted on a circuit board and generate heat when energized have been proposed (see, for example, Patent Document 1). An electronic device described in Patent Literature 1 includes a metal plate having an L-shaped cross section, an insulating sheet attached to the metal plate, and a circuit board attached in parallel to the metal plate via the insulating sheet. Yes. In this electronic device, a connector or the like is mounted on the front surface of the circuit board, and a plurality of surface mount resistors are mounted on the back surface of the circuit board. In addition, the circuit board is fixed to the metal plate so that the surface mounting resistance is in close contact with the insulating sheet, and the heat generated by the surface mounting resistance is conducted to the metal plate through the insulating sheet and from the back surface of the metal plate. Dissipated.
特開２００３－８２６２号公報JP 2003-8262 A
　特許文献１に記載の電子機器では、金属板に貼り付けられた絶縁シートに面実装抵抗を密着させることで、面実装抵抗で発生した熱を絶縁シートを介して金属板の背面から放散している。そのため、この電子機器では、厚さの異なる様々な電子部品が回路基板の裏面に実装されると、面実装抵抗を絶縁シートに密着させることができず、発熱部品である面実装抵抗で発生した熱を効率的に放散させることが困難になるおそれがある。 In the electronic device described in Patent Document 1, the heat generated by the surface mounting resistance is dissipated from the back surface of the metal plate through the insulating sheet by bringing the surface mounting resistance into close contact with the insulating sheet attached to the metal plate. Yes. Therefore, in this electronic device, when various electronic components with different thicknesses are mounted on the back surface of the circuit board, the surface mount resistance cannot be brought into close contact with the insulating sheet, and is generated by the surface mount resistance that is a heat generating component. It may be difficult to dissipate heat efficiently.
　そこで、本発明の課題は、厚さの異なる電子部品が回路基板の裏面に実装されたとしても、回路基板に実装される発熱部品で発生した熱を効率的に放散させることが可能な電子機器を提供することにある。 Thus, an object of the present invention is to provide an electronic device that can efficiently dissipate heat generated by a heat-generating component mounted on a circuit board even if electronic components having different thicknesses are mounted on the back surface of the circuit board. Is to provide.
　上記の課題を解決するため、本発明の電子機器は、発熱部品が実装される回路基板と、回路基板が固定される基板固定部材とを備え、回路基板の裏面には、発熱部品で発生した熱を放散するための放熱部が形成され、基板固定部材は、回路基板の裏面と所定の間隔をあけた状態で配置されるベース部と、ベース部から回路基板に向かって突出するとともに放熱部が固定される固定部とを備え、放熱性を有する放熱性材料で形成されていることを特徴とする。 In order to solve the above problems, an electronic device of the present invention includes a circuit board on which a heat generating component is mounted and a board fixing member to which the circuit board is fixed, and the back surface of the circuit board is generated by the heat generating component. A heat dissipating part is formed to dissipate heat, and the board fixing member is disposed with a predetermined distance from the back surface of the circuit board, and the heat dissipating part protrudes from the base part toward the circuit board. It is characterized by being formed of a heat dissipating material having heat dissipating properties.
　本発明の電子機器では、回路基板の裏面に、発熱部品で発生した熱を放散するための放熱部が形成されており、放熱性材料で形成された基板固定部材の固定部に放熱部が固定されている。そのため、発熱部品で発生した熱を、放熱部を介して基板固定部材に伝達して、基板固定部材から効率的に放散させることが可能になる。また、本発明では、基板固定部材の固定部は、ベース部から回路基板に向かって突出しており、回路基板の裏面とベース部との間に所定の隙間が形成されている。そのため、厚さの異なる様々な電子部品を回路基板の裏面に実装することが可能になる。このように、本発明では、厚さの異なる電子部品が回路基板の裏面に実装されたとしても、発熱部品で発生した熱を効率的に放散させることが可能になる。 In the electronic device of the present invention, a heat radiating part for radiating heat generated by the heat-generating component is formed on the back surface of the circuit board, and the heat radiating part is fixed to the fixing part of the board fixing member formed of a heat radiating material. Has been. For this reason, the heat generated by the heat generating component can be transmitted to the board fixing member via the heat radiating portion, and efficiently dissipated from the board fixing member. In the present invention, the fixing part of the board fixing member protrudes from the base part toward the circuit board, and a predetermined gap is formed between the back surface of the circuit board and the base part. Therefore, various electronic components having different thicknesses can be mounted on the back surface of the circuit board. As described above, according to the present invention, even when electronic components having different thicknesses are mounted on the back surface of the circuit board, it is possible to efficiently dissipate heat generated by the heat generating components.
　また、本発明では、回路基板の裏面とベース部との間に隙間が形成されているため、回路基板の表面に実装される電子部品の端子が回路基板の裏面から突出している場合であっても、端子の先端とベース部との距離を確保することが可能になる。したがって、本発明では、たとえば、基板固定部材が金属材料で形成されている場合であっても、電子機器の耐電圧性を確保することが可能になる。 Further, in the present invention, since a gap is formed between the back surface of the circuit board and the base portion, the terminals of the electronic components mounted on the surface of the circuit board are projected from the back surface of the circuit board. In addition, it is possible to ensure the distance between the tip of the terminal and the base portion. Therefore, in the present invention, for example, even when the substrate fixing member is formed of a metal material, it is possible to ensure the voltage resistance of the electronic device.
　本発明において、基板固定部材は、たとえば、金属材料で形成され、放熱部と固定部との間には、絶縁性材料で形成される絶縁シートが配置されている。この場合には、絶縁シートは、放熱性を有する絶縁性材料で形成され、放熱部と絶縁シートとの間、および／または、固定部と絶縁シートとの間には、放熱性を有する放熱ゲルまたは放熱グリースが配置されていることが好ましい。このように構成すると、放熱ゲルまたは放熱グリースによって、放熱部と絶縁シートとの密着性、および／または、固定部と絶縁シートとの密着性を高めて、放熱部と絶縁シートとの間の熱抵抗や固定部と絶縁シートとの間の熱抵抗を低減することが可能になる。したがって、放熱部と固定部との間に絶縁シートが配置されていても、発熱部品で発生した熱を基板固定部材に効率的に伝達して、基板固定部材から効率的に放散させることが可能になる。 In the present invention, the substrate fixing member is formed of, for example, a metal material, and an insulating sheet formed of an insulating material is disposed between the heat dissipation portion and the fixing portion. In this case, the insulating sheet is formed of an insulating material having a heat dissipation property, and a heat dissipation gel having a heat dissipation property between the heat dissipation portion and the insulating sheet and / or between the fixing portion and the insulating sheet. Or it is preferable that the thermal radiation grease is arrange | positioned. With this configuration, the heat radiation between the heat radiating part and the insulating sheet is improved by the heat radiating gel or the heat radiating grease to improve the adhesion between the heat radiating part and the insulating sheet and / or the adhesion between the fixing part and the insulating sheet. It becomes possible to reduce resistance and thermal resistance between the fixing portion and the insulating sheet. Therefore, even if an insulating sheet is arranged between the heat radiating part and the fixing part, it is possible to efficiently transmit the heat generated by the heat-generating component to the board fixing member and dissipate it efficiently from the board fixing member. become.
　本発明において、絶縁シートは、放熱性を有する絶縁性材料で形成されるとともに、弾力性を備えていることが好ましい。このように構成すると、放熱部と固定部との間に圧縮された状態の絶縁シートを配置することで、放熱部と絶縁シートとの密着性、および、固定部と絶縁シートとの密着性を高めて、放熱部と絶縁シートとの間の熱抵抗、および、固定部と絶縁シートとの間の熱抵抗を効果的に低減することが可能になる。したがって、放熱部と固定部との間に絶縁シートが配置されていても、発熱部品で発生した熱を基板固定部材により効率的に伝達して、基板固定部材からより効率的に放散させることが可能になる。 In the present invention, the insulating sheet is preferably formed of an insulating material having a heat dissipation property and has elasticity. If comprised in this way, by arrange | positioning the compressed insulating sheet between a heat radiating part and a fixing | fixed part, the adhesiveness of a heat radiating part and an insulating sheet and the adhesiveness of a fixing | fixed part and an insulating sheet are improved. As a result, it is possible to effectively reduce the thermal resistance between the heat radiating portion and the insulating sheet and the thermal resistance between the fixed portion and the insulating sheet. Therefore, even if the insulating sheet is arranged between the heat radiating part and the fixing part, the heat generated by the heat generating component can be efficiently transmitted by the board fixing member and more efficiently dissipated from the board fixing member. It becomes possible.
　本発明において、基板固定部材には、放熱性を有する放熱性材料で形成される放熱部材が着脱可能となっていることが好ましい。このように構成すると、共通の基板固定部材を使用しつつ、発熱部品の発熱量に応じて、基板固定部材に放熱部材を取り付けたり、基板固定部材から放熱部材を取り外したりすることが可能になる。また、共通の基板固定部材を使用しつつ、発熱部品の発熱量に応じて、放熱性能の異なる種々の放熱部材を基板固定部材に取り付けることが可能になる。 In the present invention, it is preferable that a heat radiating member formed of a heat radiating material having a heat radiating property is detachable from the substrate fixing member. If comprised in this way, it will become possible to attach a heat radiating member to a board | substrate fixing member, or to remove a heat radiating member from a board | substrate fixing member according to the emitted-heat amount of a heat-emitting component, using a common board | substrate fixing member. . In addition, it is possible to attach various heat radiating members having different heat radiating performance to the substrate fixing member according to the heat generation amount of the heat generating component while using the common substrate fixing member.
　本発明において、放熱部材には、複数の放熱用のフィンが形成され、フィンの厚みは、フィンの基端からフィンの先端に向かうにしたがって狭くなっていることが好ましい。このように構成すると、フィンの表面積を大きくして、放熱部材の放熱効率を高めることが可能になる。 In the present invention, the heat dissipating member is formed with a plurality of heat dissipating fins, and the thickness of the fin is preferably narrowed from the base end of the fin toward the tip of the fin. If comprised in this way, it will become possible to enlarge the surface area of a fin and to improve the thermal radiation efficiency of a thermal radiation member.
　本発明において、放熱部材は、ベース部の、固定部が形成される面と反対側の面である反基板側面に着脱可能となっており、反基板側面には、固定部の突出方向と反対の方向へ突出するとともに、放熱部材が当接するように取り付けられる放熱部材取付部が形成されていることが好ましい。このように構成すると、反基板側面の全面を放熱部材に当接させようとする場合と比較して、ベース部の、放熱部材に当接させようとする部分の面積を低減することができる。したがって、反基板側面の全面を放熱部材に当接させようとする場合と比較して、比較的容易に、放熱部材に当接させようとする部分の平面度（すなわち、放熱部材取付部の平面度）を確保することが可能になる。その結果、基板固定部材と放熱部材とを確実に当接させることが可能になり、基板固定部材から放熱部材に効率良く熱を伝達することが可能になる。 In the present invention, the heat dissipating member can be attached to and detached from the side of the base that is opposite to the surface on which the fixing portion is formed, and is opposite to the protruding direction of the fixing portion. It is preferable that a heat dissipating member mounting portion is formed so that the heat dissipating member comes into contact with the heat dissipating member. If comprised in this way, the area of the part which is going to contact | abut to a heat radiating member of a base part can be reduced compared with the case where the whole surface of a non-board | substrate is made to contact | abut to a heat radiating member. Therefore, the flatness of the portion to be brought into contact with the heat radiating member is relatively easily compared with the case where the entire surface of the side opposite the substrate is brought into contact with the heat radiating member (that is, the plane of the heat radiating member mounting portion). Degree). As a result, the substrate fixing member and the heat dissipation member can be reliably brought into contact with each other, and heat can be efficiently transferred from the substrate fixing member to the heat dissipation member.
　本発明において、放熱部材取付部は、固定部に対応するように形成されていることが好ましい。このように構成すると、固定部と放熱部材取付部との距離を短くすることが可能になる。したがって、ベース部の、放熱部材に当接させようとする部分の面積を低減しても、放熱部が固定される固定部に伝達された熱を、放熱部材取付部を介して効率良く放熱部材に伝達することが可能になる。 In the present invention, the heat dissipating member mounting portion is preferably formed so as to correspond to the fixed portion. If comprised in this way, it will become possible to shorten the distance of a fixing | fixed part and a thermal radiation member attaching part. Therefore, even if the area of the base portion to be brought into contact with the heat radiating member is reduced, the heat transmitted to the fixing portion to which the heat radiating portion is fixed can be efficiently transmitted through the heat radiating member mounting portion. Can be communicated to.
　本発明において、反基板側面の、放熱部材取付部が形成されていない部分の全部または一部には、複数の放熱用の第２のフィンが形成されていることが好ましい。このように構成すると、基板固定部材の放熱効率を高めることが可能になる。 In the present invention, it is preferable that a plurality of second fins for heat dissipation are formed on all or a part of the side where the heat dissipating member mounting portion is not formed on the side surface of the substrate. If comprised in this way, it will become possible to improve the thermal radiation efficiency of a board | substrate fixing member.
　本発明において、第２のフィンの厚みは、第２のフィンの基端から第２のフィンの先端に向かうにしたがって狭くなっていることが好ましい。このように構成すると、第２のフィンの表面積を大きくして、基板固定部材の放熱効率を高めることが可能になる。 In the present invention, it is preferable that the thickness of the second fin becomes narrower from the proximal end of the second fin toward the distal end of the second fin. If comprised in this way, it will become possible to enlarge the surface area of a 2nd fin and to improve the thermal radiation efficiency of a board | substrate fixing member.
　本発明において、基板固定部材には、複数の放熱用の第２のフィンが形成されていることが好ましい。このように構成すると、基板固定部材の放熱効率を高めることが可能になる。 In the present invention, the substrate fixing member is preferably formed with a plurality of second fins for heat dissipation. If comprised in this way, it will become possible to improve the thermal radiation efficiency of a board | substrate fixing member.
　本発明において、固定部とベース部との境界は、曲面状に形成されていることが好ましい。このように構成すると、固定部からベース部へ熱が伝達される部分の面積を広くして、固定部からベース部へ効率良く熱を伝達することが可能になる。 In the present invention, the boundary between the fixed portion and the base portion is preferably formed in a curved surface shape. If comprised in this way, it will become possible to enlarge the area of the part to which heat is transmitted from a fixing | fixed part to a base part, and to transfer heat | fever efficiently from a fixing | fixed part to a base part.
　本発明において、発熱部品は、回路基板の表面に面実装され、回路基板の表面と裏面との間に形成される放熱用パターンを介して放熱部に接続されていることが好ましい。回路基板に形成されるスルーホールに発熱部品の端子が差し込まれて、発熱部品が回路基板に実装される場合には、手作業で発熱部品を実装する必要があるが、このように構成すると、発熱部品が回路基板に面実装されるため、機械による発熱部品の実装が可能となり、発熱部品の実装作業を簡素化することが可能になる。 In the present invention, it is preferable that the heat-generating component is surface-mounted on the surface of the circuit board and connected to the heat dissipation portion via a heat dissipation pattern formed between the front surface and the back surface of the circuit board. When the terminal of the heat generating component is inserted into the through hole formed in the circuit board and the heat generating component is mounted on the circuit board, it is necessary to mount the heat generating component manually, but if configured in this way, Since the heat generating component is surface-mounted on the circuit board, the heat generating component can be mounted by a machine, and the mounting operation of the heat generating component can be simplified.
　本発明において、放熱部と固定部との間には、放熱性を有する絶縁性材料で形成される絶縁シートが配置され、放熱部と絶縁シートとの間には、放熱性を有する放熱グリースが配置され、回路基板には、回路基板を貫通する貫通孔が形成され、放熱用パターンは、貫通孔の内周面に形成され、放熱グリースは、貫通孔の中に入り込んでいることが好ましい。このように構成すると、貫通孔の中に入り込んでいる放熱グリースによって、貫通孔における熱抵抗を低減することが可能になる。したがって、発熱部品で発生した熱を放熱部へ効率的に伝達することが可能になる。 In the present invention, an insulating sheet formed of an insulating material having a heat dissipation property is disposed between the heat dissipation portion and the fixing portion, and a heat dissipation grease having a heat dissipation property is provided between the heat dissipation portion and the insulating sheet. It is preferable that the circuit board is provided with a through-hole penetrating the circuit board, the heat radiation pattern is formed on the inner peripheral surface of the through-hole, and the heat radiation grease enters the through-hole. If comprised in this way, it will become possible to reduce the thermal resistance in a through-hole with the thermal radiation grease which has entered into the through-hole. Therefore, it is possible to efficiently transfer the heat generated in the heat generating component to the heat radiating portion.
　本発明において、回路基板には、発熱部品が実装される高電圧用回路と、高電圧用回路よりも低い電圧が印加される低電圧用回路とが形成されていることが好ましい。このように構成すると、高電圧用回路と低電圧用回路とがそれぞれ別個の回路基板に形成されている場合と比較して、電子機器の部品点数を低減することができる。したがって、電子機器の構成を簡素化することが可能になる。 In the present invention, it is preferable that the circuit board is formed with a high voltage circuit on which a heat generating component is mounted and a low voltage circuit to which a lower voltage is applied than the high voltage circuit. If comprised in this way, the number of parts of an electronic device can be reduced compared with the case where the circuit for high voltage and the circuit for low voltage are each formed in the separate circuit board. Therefore, the configuration of the electronic device can be simplified.
　本発明において、たとえば、高電圧用回路は、モータを駆動するためのモータ駆動回路であり、低電圧用回路は、モータを制御するためのモータ制御回路である。 In the present invention, for example, the high voltage circuit is a motor drive circuit for driving a motor, and the low voltage circuit is a motor control circuit for controlling the motor.
　以上のように、本発明の電子機器では、厚さの異なる電子部品が回路基板の裏面に実装されたとしても、回路基板に実装される発熱部品で発生した熱を効率的に放散させることが可能になる。 As described above, in the electronic device of the present invention, even when electronic components having different thicknesses are mounted on the back surface of the circuit board, the heat generated by the heat generating components mounted on the circuit board can be efficiently dissipated. It becomes possible.
本発明の実施の形態１にかかる電子機器の斜視図である。It is a perspective view of the electronic device concerning Embodiment 1 of this invention. 図１に示す電子機器を裏面側から示す斜視図である。It is a perspective view which shows the electronic device shown in FIG. 1 from the back surface side. 図１に示す回路基板を裏面側から示す斜視図である。It is a perspective view which shows the circuit board shown in FIG. 1 from the back surface side. 図１に示す基板固定部材の斜視図である。It is a perspective view of the board | substrate fixing member shown in FIG. 図１に示す電子機器に放熱部材を取り付けた状態の斜視図である。It is a perspective view of the state which attached the heat radiating member to the electronic device shown in FIG. 図１に示す電子機器に他の放熱部材を取り付けた状態の斜視図である。It is a perspective view of the state which attached the other heat radiating member to the electronic device shown in FIG. 図５に示す放熱部材の斜視図である。It is a perspective view of the heat radiating member shown in FIG. 図６に示す放熱部材の斜視図である。It is a perspective view of the heat radiating member shown in FIG. 本発明の実施の形態２にかかる電子機器の斜視図である。It is a perspective view of the electronic device concerning Embodiment 2 of this invention. 図９に示す基板固定部材の斜視図である。It is a perspective view of the board | substrate fixing member shown in FIG. 図１０に示す基板固定部材を裏面側から示す斜視図である。It is a perspective view which shows the board | substrate fixing member shown in FIG. 10 from the back surface side. 図９に示す電子機器に放熱部材を取り付けた状態の側面図である。It is a side view of the state which attached the heat radiating member to the electronic device shown in FIG. 図９に示す電子機器に放熱部材を取り付けた状態の斜視図である。FIG. 10 is a perspective view of a state in which a heat dissipation member is attached to the electronic device illustrated in FIG. 9. 図９に示す電子機器に他の放熱部材を取り付けた状態の斜視図である。FIG. 10 is a perspective view of a state where another heat radiating member is attached to the electronic device shown in FIG. 9.
　以下、図面を参照しながら、本発明の実施の形態を説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
　［実施の形態１］
　（電子機器の構成）
　図１は、本発明の実施の形態１にかかる電子機器１の斜視図である。図２は、図１に示す電子機器１を裏面側から示す斜視図である。図３は、図１に示す回路基板２を裏面２ｄ側から示す斜視図である。図４は、図１に示す基板固定部材３の斜視図である。図５は、図１に示す電子機器１に放熱部材５を取り付けた状態の斜視図である。図６は、図１に示す電子機器１に放熱部材６を取り付けた状態の斜視図である。図７は、図５に示す放熱部材５の斜視図である。図８は、図６に示す放熱部材６の斜視図である。 [Embodiment 1]
(Configuration of electronic equipment)
FIG. 1 is a perspective view of an electronic apparatus 1 according to the first embodiment of the present invention. FIG. 2 is a perspective view showing the electronic device 1 shown in FIG. 1 from the back side. FIG. 3 is a perspective view showing the circuit board 2 shown in FIG. 1 from the back surface 2d side. FIG. 4 is a perspective view of the substrate fixing member 3 shown in FIG. FIG. 5 is a perspective view of the electronic device 1 shown in FIG. 1 with the heat dissipation member 5 attached thereto. FIG. 6 is a perspective view of the electronic device 1 shown in FIG. 1 with the heat dissipation member 6 attached thereto. FIG. 7 is a perspective view of the heat dissipation member 5 shown in FIG. FIG. 8 is a perspective view of the heat dissipation member 6 shown in FIG.
　本形態の電子機器１は、産業用のサーボモータ（図示省略）を駆動するための機器であり、回路基板２と、回路基板２が固定される基板固定部材３とを備えている。基板固定部材３には、図５、図６に示すように、放熱部材（ヒートシンク）５、６が着脱可能となっている。 The electronic device 1 of this embodiment is a device for driving an industrial servo motor (not shown), and includes a circuit board 2 and a board fixing member 3 to which the circuit board 2 is fixed. As shown in FIGS. 5 and 6, heat radiating members (heat sinks) 5 and 6 can be attached to and detached from the substrate fixing member 3.
　回路基板２は、たとえば、ガラスエポキシ基板であり、長方形の板状に形成されている。この回路基板２には、サーボモータを駆動するためのモータ駆動回路と、サーボモータを制御するためのモータ制御回路とが形成されている。モータ駆動回路は、長方形状に形成される回路基板２の短手方向で分割される２個の領域２ａ、２ｂのうちの一方の領域２ａに形成され、モータ制御回路は、他方の領域２ｂに形成されている。モータ駆動回路は、サーボモータを駆動するための駆動電流をサーボモータへ供給する。そのため、モータ駆動回路には高い電圧が印加される。本形態のモータ駆動回路は、高い電圧が印加される高電圧用回路である。一方、本形態のモータ制御回路は、モータ駆動回路よりも低い電圧が印加される低電圧用回路である。 The circuit board 2 is, for example, a glass epoxy board and is formed in a rectangular plate shape. The circuit board 2 is formed with a motor drive circuit for driving the servo motor and a motor control circuit for controlling the servo motor. The motor drive circuit is formed in one of the two regions 2a and 2b divided in the short direction of the circuit board 2 formed in a rectangular shape, and the motor control circuit is formed in the other region 2b. Is formed. The motor drive circuit supplies a drive current for driving the servo motor to the servo motor. Therefore, a high voltage is applied to the motor drive circuit. The motor drive circuit of this embodiment is a high voltage circuit to which a high voltage is applied. On the other hand, the motor control circuit of this embodiment is a low voltage circuit to which a voltage lower than that of the motor drive circuit is applied.
　回路基板２の表面２ｃには、モータ駆動回路を構成する複数の発熱部品７が、長方形状の回路基板２の長手方向に所定のピッチで実装されている。発熱部品７は、通電状態になると熱を発生する電子部品である。具体的には、本形態の発熱部品７は、絶縁ゲートバイポーラトランジスタ（Ｉｎｓｕｌａｔｅｄ　Ｇａｔｅ　Ｂｉｐｏｌａｒ　Ｔｒａｎｓｉｓｔｏｒ（ＩＧＢＴ））である。また、本形態の発熱部品７は、面実装部品であり、回路基板２の表面２ｃに面実装されている。また、回路基板２の表面２ｃおよび回路基板２の裏面２ｄには、モータ駆動回路を構成するその他の電子部品（図示省略）やモータ制御回路を構成する電子部品（図示省略）等が実装されている。 A plurality of heat generating components 7 constituting a motor drive circuit are mounted on the front surface 2c of the circuit board 2 at a predetermined pitch in the longitudinal direction of the rectangular circuit board 2. The heat generating component 7 is an electronic component that generates heat when energized. Specifically, the heat generating component 7 of this embodiment is an insulated gate bipolar transistor (Insulated Gate Bipolar Transistor (IGBT)). Further, the heat generating component 7 of the present embodiment is a surface mounting component and is surface mounted on the surface 2 c of the circuit board 2. Further, on the front surface 2c of the circuit board 2 and the back surface 2d of the circuit board 2, other electronic components (not shown) constituting the motor drive circuit, electronic components (not shown) constituting the motor control circuit, and the like are mounted. Yes.
　発熱部品７の実装位置に対応する回路基板２の裏面２ｄには、図３に示すように、発熱部品７で発生した熱を放散するための放熱部２ｅが形成されている。放熱部２ｅは、銅箔等の金属箔によって帯状に形成されており、裏面２ｄに露出している。表面２ｃと裏面２ｄとの間には、発熱部品７の熱を放熱部２ｅへ伝導するための放熱用パターン（図示省略）が形成されている。具体的には、放熱用パターンは、表面２ｃから裏面２ｄまで貫通する複数の貫通孔（図示省略）の内周面に施されたメッキ（すなわち、ビア）であり、発熱部品７が接続される表面２ｃの回路配線パターンと裏面２ｄの放熱部２ｅとを接続している。 As shown in FIG. 3, a heat radiating portion 2e for radiating heat generated in the heat generating component 7 is formed on the back surface 2d of the circuit board 2 corresponding to the mounting position of the heat generating component 7. The heat dissipating part 2e is formed in a band shape with a metal foil such as a copper foil, and is exposed on the back surface 2d. Between the front surface 2c and the back surface 2d, a heat radiation pattern (not shown) for conducting the heat of the heat generating component 7 to the heat radiation portion 2e is formed. Specifically, the heat radiation pattern is plating (that is, vias) applied to the inner peripheral surface of a plurality of through holes (not shown) penetrating from the front surface 2c to the back surface 2d, and the heat generating component 7 is connected thereto. The circuit wiring pattern on the front surface 2c and the heat radiating part 2e on the back surface 2d are connected.
　回路基板２には、基板固定部材３に回路基板２を固定するための複数の固定孔２ｆが形成されている。固定孔２ｆは、回路基板２を貫通するように形成されている。また、固定孔２ｆは、発熱部品７の実装位置に対応するように形成されている。すなわち、固定孔２ｆは、放熱部２ｅの形成位置に対応するように形成されている。 The circuit board 2 has a plurality of fixing holes 2 f for fixing the circuit board 2 to the board fixing member 3. The fixing hole 2 f is formed so as to penetrate the circuit board 2. The fixing hole 2f is formed so as to correspond to the mounting position of the heat generating component 7. That is, the fixing hole 2f is formed so as to correspond to the formation position of the heat radiating portion 2e.
　基板固定部材３は、放熱性を有する放熱性材料で形成されている。具体的には、基板固定部材３は、回路基板２よりも放熱性の高いアルミ等の金属材料で形成されている。この基板固定部材３は、長方形の平板状に形成されるベース部３ａと、回路基板２が固定される直方体状の固定部３ｂと、回路基板２の短手方向の端面を支持する支持部３ｃとを備えており、ベース部３ａ、固定部３ｂおよび支持部３ｃは、一体で形成されている。 The substrate fixing member 3 is formed of a heat dissipating material having heat dissipating properties. Specifically, the board fixing member 3 is formed of a metal material such as aluminum having higher heat dissipation than the circuit board 2. The substrate fixing member 3 includes a base portion 3a formed in a rectangular flat plate shape, a rectangular parallelepiped fixing portion 3b to which the circuit board 2 is fixed, and a support portion 3c that supports an end surface of the circuit board 2 in the short direction. The base part 3a, the fixing part 3b, and the support part 3c are integrally formed.
　固定部３ｂは、ベース部３ａの表面３ｊから回路基板２に向かって突出するように形成されている。この固定部３ｂは、長方形に形成されるベース部３ａの長手方向の全域に形成されている。また、固定部３ｂは、ベース部３ａの短手方向におけるベース部３ａの中間位置に形成されている。ベース部３ａの短手方向における固定部３ｂの幅は、たとえば、放熱部２ｅの幅とほぼ等しくなっている。固定部３ｂの端面（図４の上端面）には、回路基板２を固定するための複数のネジ孔３ｄが形成されている。なお、ベース部３ａの短手方向における固定部３ｂの幅は、放熱部２ｅの幅より広くても良いし、狭くても良い。また、ベース部３ａの裏面３ｋは、平面状に形成されている。 The fixing portion 3b is formed so as to protrude toward the circuit board 2 from the surface 3j of the base portion 3a. This fixed part 3b is formed in the whole area of the longitudinal direction of the base part 3a formed in a rectangle. Moreover, the fixing | fixed part 3b is formed in the intermediate position of the base part 3a in the transversal direction of the base part 3a. The width of the fixed portion 3b in the short direction of the base portion 3a is, for example, substantially equal to the width of the heat radiating portion 2e. A plurality of screw holes 3d for fixing the circuit board 2 are formed on the end face of the fixing portion 3b (upper end face in FIG. 4). In addition, the width | variety of the fixing | fixed part 3b in the transversal direction of the base part 3a may be wider than the width | variety of the thermal radiation part 2e, and may be narrow. The back surface 3k of the base portion 3a is formed in a planar shape.
　支持部３ｃは、長方形状に形成されるベース部３ａの短手方向の端面から回路基板２に向かって立ち上る平板状に形成されている。支持部３ｃの端面（図４の上端面）には、回路基板２の表面２ｃに当接する当接部３ｅが、支持部３ｃの端面から直角に折れ曲がるように形成されている。 The support portion 3c is formed in a flat plate shape that rises toward the circuit board 2 from the end surface in the short direction of the base portion 3a formed in a rectangular shape. On the end surface of the support portion 3c (upper end surface in FIG. 4), a contact portion 3e that contacts the surface 2c of the circuit board 2 is formed so as to be bent at a right angle from the end surface of the support portion 3c.
　ベース部３ａの裏面３ｋには、図２に示すように、放熱部材５、６を固定するための複数のネジ孔３ｆが形成されている。ネジ孔３ｆは、固定部３ｂの形成位置に対応するように形成されている。 As shown in FIG. 2, a plurality of screw holes 3f for fixing the heat radiating members 5 and 6 are formed in the back surface 3k of the base portion 3a. The screw hole 3f is formed so as to correspond to the formation position of the fixing portion 3b.
　上述のように、回路基板２の固定孔２ｆは、放熱部２ｅの形成位置に対応するように形成されており、放熱部２ｅが固定部３ｂの端面に載った状態で固定部３ｂに固定されている。具体的には、固定孔２ｆに挿通されネジ孔３ｄに螺合されるネジ（図示省略）によって、放熱部２ｅが固定部３ｂに固定されている。固定部３ｂの端面と放熱部２ｅとの間には、絶縁性材料で形成される絶縁シート４が配置されている。 As described above, the fixing hole 2f of the circuit board 2 is formed so as to correspond to the formation position of the heat radiating portion 2e, and is fixed to the fixing portion 3b in a state where the heat radiating portion 2e is placed on the end surface of the fixing portion 3b. ing. Specifically, the heat radiating part 2e is fixed to the fixing part 3b by a screw (not shown) inserted through the fixing hole 2f and screwed into the screw hole 3d. An insulating sheet 4 formed of an insulating material is disposed between the end face of the fixed part 3b and the heat radiating part 2e.
　絶縁シート４は、放熱性を有する（伝熱性に優れる）絶縁性材料で形成されている。また、絶縁シート４は、弾力性を備えている。たとえば、絶縁シート４は、放熱性と弾力性とを有するシリコン系の絶縁性材料で形成されている。絶縁シート４には、固定孔２ｆに挿通されネジ孔３ｄに螺合されるネジが挿通される貫通孔が形成されており、絶縁シート４は、固定孔２ｆに挿通されネジ孔３ｄに螺合されるネジによって、放熱部２ｅと固定部３ｂとに挟まれた状態で固定されている。また、絶縁シート４は、圧縮された状態で放熱部２ｅと固定部３ｂとに挟まれている。 The insulating sheet 4 is made of an insulating material having heat dissipation (excellent heat transfer). Further, the insulating sheet 4 has elasticity. For example, the insulating sheet 4 is formed of a silicon-based insulating material having heat dissipation properties and elasticity. The insulating sheet 4 is formed with a through hole through which a screw inserted into the fixing hole 2f and screwed into the screw hole 3d is inserted. The insulating sheet 4 is inserted into the fixing hole 2f and screwed into the screw hole 3d. The screw is fixed in a state of being sandwiched between the heat dissipating part 2e and the fixing part 3b. The insulating sheet 4 is sandwiched between the heat radiating part 2e and the fixing part 3b in a compressed state.
　放熱部２ｅと絶縁シート４との間には、放熱性を有する（伝熱性に優れる）放熱ゲルまたは放熱グリースが配置されており、放熱部２ｅは、放熱ゲルまたは放熱グリースを介して絶縁シート４の表面に密着している。また、固定部３ｂの端面と絶縁シート４との間にも、放熱ゲルまたは放熱グリースが配置されており、固定部３ｂの端面は、放熱ゲルまたは放熱グリースを介して絶縁シート４の裏面に密着している。すなわち、固定部３ｂの端面と放熱部２ｅとは、絶縁シート４を介して密着している。 Between the heat radiating part 2e and the insulating sheet 4, a heat radiating gel or a heat radiating grease having heat radiating properties (excelling in heat transfer) is disposed, and the heat radiating part 2e is interposed between the heat radiating gel or the heat radiating grease. It is in close contact with the surface. Further, a heat radiating gel or heat radiating grease is also disposed between the end face of the fixing portion 3b and the insulating sheet 4, and the end face of the fixing portion 3b is in close contact with the back surface of the insulating sheet 4 via the heat radiating gel or heat radiating grease. is doing. That is, the end surface of the fixing portion 3 b and the heat radiating portion 2 e are in close contact with each other via the insulating sheet 4.
　本形態では、放熱部２ｅと絶縁シート４との間には、放熱グリースが配置されている。この放熱グリースは、たとえば、シリコン系のオイルである。また、放熱グリースは、放熱用パターンがその内周面に形成される回路基板２の貫通孔の中に入り込んでいる。また、固定部３ｂの端面と絶縁シート４との間にも、放熱グリースが配置されている。この放熱グリースは、たとえば、シリコン系のオイルである。 In this embodiment, heat radiation grease is disposed between the heat radiation portion 2e and the insulating sheet 4. This heat radiation grease is, for example, silicon-based oil. Further, the heat dissipating grease enters the through hole of the circuit board 2 where the heat dissipating pattern is formed on the inner peripheral surface thereof. Further, heat radiation grease is also disposed between the end face of the fixed portion 3b and the insulating sheet 4. This heat radiation grease is, for example, silicon-based oil.
　また、上述のように、固定部３ｂは、ベース部３ａの表面３ｊから回路基板２に向かって突出するように形成されており、基板固定部材３に回路基板２が固定された状態では、回路基板２の裏面２ｄとベース部３ａとの間に隙間Ｓが形成されている。また、基板固定部材３に回路基板２が固定された状態では、回路基板２の短手方向の端面に支持部３ｃが当接し、表面２ｃの、回路基板２の短手方向の端面の近傍に当接部３ｅが当接している。なお、支持部３ｃの端面に当接部３ｅが形成されずに、回路基板２の裏面２ｄが支持部３ｃの端面に当接していても良い。また、当接部３ｅに代えて、回路基板２を固定するための第２の固定部が支持部３ｃの端面に形成されても良い。 In addition, as described above, the fixing portion 3b is formed so as to protrude from the surface 3j of the base portion 3a toward the circuit board 2, and in the state where the circuit board 2 is fixed to the board fixing member 3, the circuit A gap S is formed between the back surface 2d of the substrate 2 and the base portion 3a. Further, in a state where the circuit board 2 is fixed to the board fixing member 3, the support portion 3 c comes into contact with the end face in the short direction of the circuit board 2, and is close to the end face in the short direction of the circuit board 2 on the surface 2 c. The contact portion 3e is in contact. Note that the back surface 2d of the circuit board 2 may be in contact with the end surface of the support portion 3c without forming the contact portion 3e on the end surface of the support portion 3c. Further, instead of the contact portion 3e, a second fixing portion for fixing the circuit board 2 may be formed on the end surface of the support portion 3c.
　放熱部材５、６は、放熱性を有する放熱材料で形成されている。具体的には、放熱部材５、６は、回路基板２よりも放熱性の高いアルミ等の金属材料で形成されている。図５～図８に示すように、放熱部材５、６には、複数のフィン５ａ、６ａが形成されている。放熱部材６のフィン６ａは、放熱部材５のフィン５ａよりも長くなっている。すなわち、放熱部材６の放熱性能は、放熱部材５の放熱性能よりも優れている。また、放熱部材５、６には、基板固定部材３のネジ孔３ｆに螺合するネジ（図示省略）が挿通される挿通孔（図示省略）が形成されている。放熱部材５、６は、ネジによって、基板固定部材３の裏面（すなわち、ベース部３ａの裏面３ｋ）に着脱可能となっている。 The heat dissipating members 5 and 6 are formed of a heat dissipating material having heat dissipating properties. Specifically, the heat dissipating members 5 and 6 are formed of a metal material such as aluminum having higher heat dissipation than the circuit board 2. As shown in FIGS. 5 to 8, the heat dissipating members 5 and 6 are formed with a plurality of fins 5a and 6a. The fins 6 a of the heat radiating member 6 are longer than the fins 5 a of the heat radiating member 5. That is, the heat dissipation performance of the heat dissipation member 6 is superior to the heat dissipation performance of the heat dissipation member 5. The heat radiating members 5 and 6 are formed with insertion holes (not shown) through which screws (not shown) screwed into the screw holes 3f of the substrate fixing member 3 are inserted. The heat radiating members 5 and 6 can be attached to and detached from the back surface of the substrate fixing member 3 (that is, the back surface 3k of the base portion 3a) by screws.
　上述のように、ベース部３ａの裏面３ｋは平面状に形成されている。また、ベース部３ａの裏面３ｋに当接する放熱部材５、６の当接面５ｃ、６ｃ（図７、図８参照）も平面状に形成されている。本形態では、ベース部３ａの裏面３ｋと放熱部材５、６の当接面５ｃ、６ｃとが略同形状に形成されており、ベース部３ａの裏面３ｋの全面は、放熱部材５、６の当接面５ｃ、６ｃの全面に当接可能となっている。 As described above, the back surface 3k of the base portion 3a is formed in a planar shape. Further, the contact surfaces 5c and 6c (see FIGS. 7 and 8) of the heat radiating members 5 and 6 that contact the back surface 3k of the base portion 3a are also formed in a planar shape. In this embodiment, the back surface 3k of the base portion 3a and the contact surfaces 5c, 6c of the heat dissipating members 5, 6 are formed in substantially the same shape, and the entire back surface 3k of the base portion 3a is formed by the heat dissipating members 5, 6 The contact surfaces 5c and 6c can contact the entire surface.
　本形態の電子機器１は、比較的容量の小さなサーボモータに用いられても比較的容量の大きなサーボモータに用いられても、その駆動が可能となるように構成されている。たとえば、電子機器１は、５０Ｗ～７５０Ｗのサーボモータの駆動が可能となるように構成されている。 The electronic device 1 of this embodiment is configured to be able to be driven regardless of whether it is used for a servo motor having a relatively small capacity or a servo motor having a relatively large capacity. For example, the electronic device 1 is configured to be able to drive a 50 W to 750 W servo motor.
　比較的容量の小さなサーボモータに電子機器１が用いられる場合には、サーボモータに供給される駆動電流が小さいため、発熱部品７の発熱量が小さい。したがって、比較的容量の小さなサーボモータに電子機器１が用いられる場合には、電子機器１は、図１に示すように、放熱部材５、６が取り付けられていない状態で使用される。また、サーボモータの容量が大きくなると、サーボモータに供給される駆動電流が大きくなり、発熱部品７の発熱量が大きくなるため、図５に示すように、電子機器１は、放熱部材５が取り付けられた状態で使用される。また、さらにサーボモータの容量が大きくなると、サーボモータに供給される駆動電流がさらに大きくなり、発熱部品７の発熱量がさらに大きくなるため、図６に示すように、電子機器１は、放熱部材６が取り付けられた状態で使用される。 When the electronic device 1 is used for a servo motor having a relatively small capacity, the heat generation amount of the heat generating component 7 is small because the drive current supplied to the servo motor is small. Therefore, when the electronic device 1 is used for a servo motor having a relatively small capacity, the electronic device 1 is used in a state where the heat radiating members 5 and 6 are not attached as shown in FIG. In addition, when the capacity of the servo motor is increased, the drive current supplied to the servo motor is increased, and the heat generation amount of the heat generating component 7 is increased. Therefore, as shown in FIG. Is used in the Further, when the capacity of the servo motor is further increased, the drive current supplied to the servo motor is further increased, and the amount of heat generated by the heat generating component 7 is further increased. Therefore, as shown in FIG. 6 is used in an attached state.
　（本形態の主な効果）
　以上説明したように、本形態では、回路基板２の裏面２ｄに放熱部２ｅが形成されており、金属材料で形成された基板固定部材３の固定部３ｂに絶縁シート４を介して放熱部２ｅが密着している。そのため、本形態では、発熱部品７で発生した熱を、放熱部２ｅ等を介して基板固定部材３に伝達して、基板固定部材３から効率的に放散させることができる。また、本形態では、基板固定部材３に放熱部材５、６が着脱可能となっているため、発熱部品７の発熱量が大きい場合には、発熱部品７で発生した熱を、放熱部２ｅ等を介して基板固定部材３および放熱部材５、６に伝達して、基板固定部材３および放熱部材５、６から効率的に放散させることができる。 (Main effects of this form)
As described above, in this embodiment, the heat radiating portion 2e is formed on the back surface 2d of the circuit board 2, and the heat radiating portion 2e via the insulating sheet 4 is fixed to the fixing portion 3b of the substrate fixing member 3 formed of a metal material. Are in close contact. Therefore, in this embodiment, the heat generated in the heat generating component 7 can be transmitted to the board fixing member 3 via the heat radiating part 2 e and the like, and can be efficiently dissipated from the board fixing member 3. Further, in this embodiment, since the heat radiating members 5 and 6 can be attached to and detached from the board fixing member 3, when the heat generation amount of the heat generating component 7 is large, the heat generated in the heat generating component 7 is transferred to the heat radiating portion 2e and the like. Can be efficiently transmitted to the substrate fixing member 3 and the heat radiating members 5 and 6 from the substrate fixing member 3 and the heat radiating members 5 and 6.
　また、本形態では、基板固定部材３に放熱部材５、６が着脱可能となっているため、共通の基板固定部材３を使用しつつ、発熱部品７の発熱量に応じて（すなわち、電子機器１が用いられるサーボモータの容量に応じて）、上述のように、基板固定部材３に放熱部材５、６を取り付けたり、基板固定部材３から放熱部材５、６を取り外したりすることができる。また、共通の基板固定部材３を使用しつつ、発熱部品７の発熱量に応じて、放熱部材５、６のいずれかを選択して、基板固定部材３に取り付けることができる。 In this embodiment, since the heat radiating members 5 and 6 can be attached to and detached from the board fixing member 3, the common board fixing member 3 is used and the heat generation amount of the heat generating component 7 is determined (that is, the electronic device). As described above, the heat radiating members 5 and 6 can be attached to the substrate fixing member 3, and the heat radiating members 5 and 6 can be removed from the substrate fixing member 3. In addition, while using the common substrate fixing member 3, any one of the heat radiating members 5 and 6 can be selected and attached to the substrate fixing member 3 in accordance with the heat generation amount of the heat generating component 7.
　本形態では、基板固定部材３の固定部３ｂは、ベース部３ａから回路基板２に向かって突出しており、回路基板２の裏面２ｄとベース部３ａとの間には隙間Ｓが形成されている。そのため、本形態では、隙間Ｓを利用して様々な電子部品を回路基板２の裏面２ｄに実装することが可能になる。また、本形態では、回路基板２の裏面２ｄとベース部３ａとの間に隙間Ｓが形成されているため、たとえば、回路基板２の表面２ｃに実装される電子部品の端子が裏面２ｄから突出している場合であっても、この端子の先端とベース部３ａとの距離を確保することが可能になる。したがって、基板固定部材３が金属材料で形成されている場合であっても、電子機器１の耐電圧性を確保することが可能になる。 In this embodiment, the fixing part 3b of the board fixing member 3 protrudes from the base part 3a toward the circuit board 2, and a gap S is formed between the back surface 2d of the circuit board 2 and the base part 3a. . Therefore, in this embodiment, various electronic components can be mounted on the back surface 2d of the circuit board 2 using the gap S. In this embodiment, since the gap S is formed between the back surface 2d of the circuit board 2 and the base portion 3a, for example, terminals of electronic components mounted on the front surface 2c of the circuit board 2 protrude from the back surface 2d. Even if it is a case, it becomes possible to ensure the distance of the front-end | tip of this terminal and the base part 3a. Therefore, even when the substrate fixing member 3 is formed of a metal material, it is possible to ensure the voltage resistance of the electronic device 1.
　本形態では、発熱部品７は、面実装部品である。そのため、機械による発熱部品７の実装が可能になる。したがって、発熱部品７の実装作業を簡素化することが可能になる。 In this embodiment, the heat generating component 7 is a surface mounting component. Therefore, the heat generating component 7 can be mounted by a machine. Therefore, it is possible to simplify the mounting operation of the heat generating component 7.
　本形態では、モータ駆動回路とモータ制御回路とが１枚の回路基板２に形成されている。そのため、本形態では、モータ駆動回路とモータ制御回路とがそれぞれ別個の回路基板に形成される場合と比較して、電子機器１の部品点数を低減することができ、電子機器１の構成を簡素化することが可能になる。 In this embodiment, a motor drive circuit and a motor control circuit are formed on one circuit board 2. Therefore, in this embodiment, compared with the case where the motor drive circuit and the motor control circuit are formed on separate circuit boards, the number of parts of the electronic device 1 can be reduced, and the configuration of the electronic device 1 is simplified. It becomes possible to become.
　本形態では、放熱部２ｅと絶縁シート４との間、および、固定部３ｂの端面と絶縁シート４との間に、放熱グリースが配置されている。そのため、放熱グリースによって、放熱部２ｅと絶縁シート４との密着性、および、固定部３ｂと絶縁シート４との密着性を高めることが可能になる。すなわち、本形態では、絶縁シート４は、固定孔２ｆに挿通されネジ孔３ｄに螺合されるネジによって、放熱部２ｅと固定部３ｂとに挟まれた状態で固定されているため、ネジの周辺では、放熱部２ｅと絶縁シート４との密着性、および、固定部３ｂと絶縁シート４との密着性は高くなるが、その他の部分では、放熱部２ｅと絶縁シート４との密着性、および、固定部３ｂと絶縁シート４との密着性が低下しやすい。しかしながら、本形態では、放熱部２ｅと絶縁シート４との間、および、固定部３ｂの端面と絶縁シート４との間に、放熱グリースが配置されているため、放熱部２ｅと絶縁シート４との密着性が低下した部分、および、固定部３ｂと絶縁シート４との密着性が低下した部分に配置される放熱グリースによって、放熱部２ｅと絶縁シート４との密着性、および、固定部３ｂと絶縁シート４との密着性を高めることが可能になる。したがって、放熱部２ｅと絶縁シート４との間の熱抵抗および固定部３ｂと絶縁シート４との間の熱抵抗を低減することが可能になる。その結果、本形態では、放熱部２ｅと固定部３ｂとの間に絶縁シート４が配置されている場合であっても、発熱部品７で発生した熱を基板固定部材３に効率的に伝達して、基板固定部材３から効率的に放散させることが可能になる。 In this embodiment, heat dissipating grease is disposed between the heat dissipating part 2e and the insulating sheet 4, and between the end face of the fixed part 3b and the insulating sheet 4. Therefore, it is possible to improve the adhesion between the heat radiation part 2e and the insulating sheet 4 and the adhesion between the fixing part 3b and the insulation sheet 4 by the heat radiation grease. That is, in this embodiment, the insulating sheet 4 is fixed in a state of being sandwiched between the heat radiating portion 2e and the fixing portion 3b by a screw inserted into the fixing hole 2f and screwed into the screw hole 3d. In the periphery, the adhesiveness between the heat radiating part 2e and the insulating sheet 4 and the adhesiveness between the fixing part 3b and the insulating sheet 4 are increased, but in other parts, the adhesiveness between the heat radiating part 2e and the insulating sheet 4; And the adhesiveness of the fixing | fixed part 3b and the insulating sheet 4 tends to fall. However, in this embodiment, since the heat dissipating grease is disposed between the heat dissipating part 2e and the insulating sheet 4 and between the end face of the fixed part 3b and the insulating sheet 4, the heat dissipating part 2e and the insulating sheet 4 The heat-dissipating grease disposed in the portion where the adhesion between the heat-dissipating part 2b and the insulating sheet 4 is reduced, and the heat-dissipating grease disposed in the part where the adhesion between the fixing part 3b and the insulating sheet 4 is reduced, and the fixing part 3b It becomes possible to improve the adhesiveness with the insulating sheet 4. Therefore, it becomes possible to reduce the thermal resistance between the heat radiation part 2e and the insulating sheet 4 and the thermal resistance between the fixing part 3b and the insulating sheet 4. As a result, in this embodiment, even when the insulating sheet 4 is disposed between the heat radiating part 2e and the fixing part 3b, the heat generated in the heat generating component 7 is efficiently transmitted to the board fixing member 3. Thus, it is possible to efficiently dissipate from the substrate fixing member 3.
　特に本形態では、絶縁シート４は、弾力性を備えており、圧縮された状態で放熱部２ｅと固定部３ｂとに挟まれている。そのため、放熱部２ｅと絶縁シート４との密着性、および、固定部３ｂと絶縁シート４との密着性を効果的に高めて、放熱部２ｅと絶縁シート４との間の熱抵抗および固定部３ｂと絶縁シート４との間の熱抵抗を効果的に低減することが可能になる。したがって、本形態では、放熱部２ｅと固定部３ｂとの間に絶縁シート４が配置されている場合であっても、発熱部品７で発生した熱を基板固定部材３により効率的に伝達して、基板固定部材３からより効率的に放散させることが可能になる。 Particularly in this embodiment, the insulating sheet 4 has elasticity and is sandwiched between the heat radiating portion 2e and the fixing portion 3b in a compressed state. Therefore, the adhesiveness between the heat radiating part 2e and the insulating sheet 4 and the adhesiveness between the fixing part 3b and the insulating sheet 4 are effectively enhanced, and the thermal resistance and the fixing part between the heat radiating part 2e and the insulating sheet 4 are improved. It becomes possible to effectively reduce the thermal resistance between 3b and the insulating sheet 4. Therefore, in this embodiment, even when the insulating sheet 4 is disposed between the heat radiating part 2e and the fixing part 3b, the heat generated by the heat generating component 7 is efficiently transmitted by the board fixing member 3. It becomes possible to dissipate more efficiently from the substrate fixing member 3.
　本形態では、放熱部２ｅと絶縁シート４との間に配置される放熱グリースは、放熱用パターンがその内周面に形成される回路基板２の貫通孔の中に入り込んでいる。そのため、貫通孔の中に入り込んでいる放熱グリースによって、貫通孔における熱抵抗を低減することが可能になる。すなわち、放熱用パターンが形成される貫通孔の内周面の熱抵抗は低いが、貫通孔の中に放熱グリースが入り込んでいないと、貫通孔の中の空気の影響で、貫通孔全体の熱抵抗が高くなる。しかし、本形態では、放熱グリースが貫通孔の中に入り込んでいるため、貫通孔の中の放熱グリースによって、貫通孔における熱抵抗を低減することが可能になる。したがって、本形態では、発熱部品７で発生した熱を放熱部２ｅへ効率的に伝達することが可能になる。 In this embodiment, the heat dissipating grease arranged between the heat dissipating part 2e and the insulating sheet 4 enters the through hole of the circuit board 2 in which the heat dissipating pattern is formed on the inner peripheral surface thereof. Therefore, the thermal resistance in the through hole can be reduced by the heat dissipating grease entering the through hole. In other words, although the thermal resistance of the inner peripheral surface of the through hole where the heat radiation pattern is formed is low, if the heat radiation grease does not enter the through hole, the heat of the entire through hole is affected by the air in the through hole. Resistance increases. However, in this embodiment, since the heat dissipating grease enters the through hole, the heat resistance in the through hole can be reduced by the heat dissipating grease in the through hole. Therefore, in this embodiment, it is possible to efficiently transfer the heat generated in the heat generating component 7 to the heat radiating portion 2e.
　［実施の形態２］
　（電子機器の構成）
　図９は、本発明の実施の形態２にかかる電子機器２１の斜視図である。図１０は、図９に示す基板固定部材２３の斜視図である。図１１は、図１０に示す基板固定部材２３を裏面側から示す斜視図である。図１２は、図９に示す電子機器２１に放熱部材２５を取り付けた状態の側面図である。図１３は、図９に示す電子機器２１に放熱部材２５を取り付けた状態の斜視図である。図１４は、図９に示す電子機器２１に放熱部材２６を取り付けた状態の斜視図である。 [Embodiment 2]
(Configuration of electronic equipment)
FIG. 9 is a perspective view of the electronic device 21 according to the second embodiment of the present invention. FIG. 10 is a perspective view of the substrate fixing member 23 shown in FIG. FIG. 11 is a perspective view showing the substrate fixing member 23 shown in FIG. 10 from the back side. FIG. 12 is a side view of the electronic device 21 shown in FIG. 9 with the heat dissipation member 25 attached thereto. FIG. 13 is a perspective view of the electronic device 21 shown in FIG. 9 with the heat dissipation member 25 attached thereto. FIG. 14 is a perspective view of the electronic device 21 shown in FIG. 9 with the heat dissipation member 26 attached thereto.
　本形態の電子機器２１は、実施の形態１の電子機器１と同様に、産業用のサーボモータ（図示省略）を駆動するための機器であり、回路基板２２と、回路基板２２が固定される基板固定部材２３とを備えている。基板固定部材２３には、図１２～図１４に示すように、放熱部材２５、２６が着脱可能となっている。 Similar to the electronic device 1 of the first embodiment, the electronic device 21 of the present embodiment is a device for driving an industrial servo motor (not shown), and the circuit board 22 and the circuit board 22 are fixed. And a substrate fixing member 23. As shown in FIGS. 12 to 14, heat radiating members 25 and 26 can be attached to and detached from the substrate fixing member 23.
　回路基板２２は、たとえば、ガラスエポキシ基板であり、長方形の板状に形成されている。この回路基板２２には、回路基板２と同様に、モータ駆動回路とモータ制御回路とが形成されている。モータ駆動回路は、長方形状に形成される回路基板２２の短手方向で分割される２個の領域２２ａ、２２ｂのうちの一方の領域２２ａに形成され、モータ制御回路は、他方の領域２２ｂに形成されている。回路基板２２の表面２２ｃには、実施の形態１と同様に、面実装部品である発熱部品７が、長方形状の回路基板２２の長手方向に所定のピッチで実装されている。また、回路基板２２の表面２２ｃおよび回路基板２２の裏面には、モータ駆動回路を構成するその他の電子部品（図示省略）やモータ制御回路を構成する電子部品（図示省略）等が実装されている。 The circuit board 22 is a glass epoxy board, for example, and is formed in a rectangular plate shape. Similar to the circuit board 2, a motor drive circuit and a motor control circuit are formed on the circuit board 22. The motor drive circuit is formed in one region 22a of the two regions 22a and 22b divided in the short direction of the rectangular circuit board 22, and the motor control circuit is formed in the other region 22b. Is formed. On the surface 22c of the circuit board 22, as in the first embodiment, the heat-generating components 7 that are surface-mounted components are mounted at a predetermined pitch in the longitudinal direction of the rectangular circuit board 22. Further, on the front surface 22c of the circuit board 22 and the back surface of the circuit board 22, other electronic components (not shown) constituting the motor drive circuit, electronic components (not shown) constituting the motor control circuit, and the like are mounted. .
　発熱部品７の実装位置に対応する回路基板２２の裏面には、回路基板２と同様に、発熱部品７で発生した熱を放散するための放熱部（図示省略）が形成されている。回路基板２２の表面２２ｃと裏面との間には、発熱部品７の熱を放熱部へ伝導するための放熱用パターン（図示省略）が形成されている。この放熱用パターンは、表面２２ｃから裏面まで貫通する複数の貫通孔（図示省略）の内周面に施されたメッキであり、発熱部品７が接続される表面２２ｃの回路配線パターンと裏面の放熱部とを接続している。 A heat dissipating part (not shown) for radiating heat generated in the heat generating component 7 is formed on the back surface of the circuit board 22 corresponding to the mounting position of the heat generating component 7 in the same manner as the circuit board 2. Between the front surface 22c and the back surface of the circuit board 22, a heat radiation pattern (not shown) for conducting heat of the heat generating component 7 to the heat radiation portion is formed. This heat radiation pattern is plating applied to the inner peripheral surface of a plurality of through holes (not shown) penetrating from the front surface 22c to the back surface, and the circuit wiring pattern on the front surface 22c to which the heat generating component 7 is connected and the heat radiation of the back surface. Are connected.
　回路基板２２には、基板固定部材２３に回路基板２２を固定するための複数の固定孔２２ｆが形成されている。固定孔２２ｆは、回路基板２２を貫通するように形成されている。また、固定孔２２ｆは、発熱部品７の実装位置に対応する位置の２箇所と、回路基板２２の四隅のうちの隣り合う２箇所に形成されている。具体的には、発熱部品７の実装位置に対応する位置として、図９における回路基板２２の左端側と、図９の左右方向における回路基板２２の中間位置との２箇所に固定孔２２ｆが形成されるとともに、図９の右端の２箇所の隅に固定孔２２ｆが形成されている。 A plurality of fixing holes 22 f for fixing the circuit board 22 to the board fixing member 23 are formed in the circuit board 22. The fixing hole 22 f is formed so as to penetrate the circuit board 22. Further, the fixing holes 22 f are formed at two positions corresponding to the mounting positions of the heat generating components 7 and two adjacent positions among the four corners of the circuit board 22. Specifically, as the positions corresponding to the mounting positions of the heat generating components 7, fixing holes 22f are formed at two positions, that is, the left end side of the circuit board 22 in FIG. 9 and the intermediate position of the circuit board 22 in the left-right direction in FIG. In addition, fixing holes 22f are formed at two corners on the right end of FIG.
　基板固定部材２３は、基板固定部材３と同様に、放熱性を有する放熱性材料で形成されており、具体的には、回路基板２２よりも放熱性の高いアルミ等の金属材料で形成されている。この基板固定部材２３は、扁平な略直方体状に形成されるベース部２３ａと、回路基板２２が固定される扁平な略直方体状の固定部２３ｂとを備えており、ベース部２３ａおよび固定部２３ｂは、一体で形成されている。扁平な略直方体状に形成されるベース部２３ａの短手方向の両端には、回路基板２２側へ立ち上る壁部２３ｃが形成されている。 The board fixing member 23 is formed of a heat radiating material having heat radiating properties as in the case of the board fixing member 3. Yes. The substrate fixing member 23 includes a base portion 23a formed in a flat and substantially rectangular parallelepiped shape, and a flat and substantially rectangular parallelepiped fixing portion 23b to which the circuit board 22 is fixed, and the base portion 23a and the fixing portion 23b. Are integrally formed. Wall portions 23c rising to the circuit board 22 side are formed at both ends in the short direction of the base portion 23a formed in a flat and substantially rectangular parallelepiped shape.
　固定部２３ｂは、ベース部２３ａの表面２３ｊから回路基板２２に向かって突出するように形成されている。この固定部２３ｂは、扁平な略直方体状に形成されるベース部２３ａの長手方向の全域に形成されている。また、固定部２３ｂは、ベース部２３ａの短手方向におけるベース部２３ａの中間位置に形成されている。固定部２３ｂの端面（図１０の上端面）には、回路基板２２を固定するための複数のネジ孔２３ｄが形成されている。ベース部２３ａの表面２３ｊと固定部２３ｂの側面とは、凹曲面２３ｅによって滑らかに繋がっている。すなわち、ベース部２３ａと固定部２３ｂとの境界は、曲面状に形成されている。凹曲面２３ｅは、図１２に示すように、１／４円弧状に形成されている。 The fixing portion 23b is formed so as to protrude from the surface 23j of the base portion 23a toward the circuit board 22. The fixing portion 23b is formed in the entire area in the longitudinal direction of the base portion 23a formed in a flat and substantially rectangular parallelepiped shape. Moreover, the fixing | fixed part 23b is formed in the intermediate position of the base part 23a in the transversal direction of the base part 23a. A plurality of screw holes 23d for fixing the circuit board 22 are formed on the end face of the fixing portion 23b (upper end face in FIG. 10). The surface 23j of the base portion 23a and the side surface of the fixing portion 23b are smoothly connected by a concave curved surface 23e. That is, the boundary between the base portion 23a and the fixed portion 23b is formed in a curved surface shape. The concave curved surface 23e is formed in a 1/4 arc shape as shown in FIG.
　２個の壁部２３ｃのうちの一方の壁部（図１２の右側の壁部）２３ｃは、回路基板２２の短手方向の一端を覆うように形成されている。一方、２個の壁部２３ｃのうちの他方の壁部（図１２の左側の壁部）２３ｃには、回路基板２２の短手方向の他端側が載っている。 One of the two wall portions 23c (the right wall portion in FIG. 12) 23c is formed to cover one end of the circuit board 22 in the short direction. On the other hand, the other end of the circuit board 22 in the short direction is placed on the other wall (the left wall in FIG. 12) 23c of the two walls 23c.
　ベース部２３ａの裏面２３ｋには、放熱部材２５、２６が取り付けられる放熱部材取付部２３ｇが形成されている。放熱部材取付部２３ｇは、ベース部２３ａの裏面２３ｋから、固定部２３ｂの突出方向と反対方向（図１２の下方向）へわずかに突出するように形成されている。この放熱部材取付部２３ｇは、ベース部２３ａの長手方向の全域に形成されるとともに略長方形状に形成されている。また、放熱部材取付部２３ｇは、固定部２３ｂに対応するように、ベース部２３ａの短手方向におけるベース部２３ａの中間位置に形成されている。すなわち、放熱部材取付部２３ｇは、固定部２３ｂの裏側に形成されており、ベース部２３ａの厚さ方向から見たときに、固定部２３ｂと放熱部材取付部２３ｇとが重なっている。本形態では、ベース部２３ａの短手方向における放熱部材取付部２３ｇの幅は、固定部２３ｂの幅よりも広くなっている。放熱部材取付部２３ｇの端面（図１０の下端面）には、図１１に示すように、放熱部材２５、２６を固定するための複数のネジ孔２３ｆが形成されている。 A heat dissipating member attaching portion 23g to which the heat dissipating members 25 and 26 are attached is formed on the back surface 23k of the base portion 23a. The heat dissipating member attaching portion 23g is formed so as to slightly protrude from the back surface 23k of the base portion 23a in a direction opposite to the protruding direction of the fixing portion 23b (downward direction in FIG. 12). The heat dissipating member mounting portion 23g is formed in the entire lengthwise direction of the base portion 23a and has a substantially rectangular shape. Further, the heat dissipating member attaching portion 23g is formed at an intermediate position of the base portion 23a in the short direction of the base portion 23a so as to correspond to the fixing portion 23b. That is, the heat dissipating member mounting portion 23g is formed on the back side of the fixing portion 23b, and the fixing portion 23b and the heat dissipating member mounting portion 23g overlap when viewed from the thickness direction of the base portion 23a. In this embodiment, the width of the heat radiating member mounting portion 23g in the short direction of the base portion 23a is wider than the width of the fixed portion 23b. As shown in FIG. 11, a plurality of screw holes 23f for fixing the heat radiating members 25 and 26 are formed on the end surface (the lower end surface in FIG. 10) of the heat radiating member mounting portion 23g.
　また、ベース部２３ａの裏面２３ｋには、複数の放熱用のフィン２３ｈが形成されている。フィン２３ｈは、ベース部２３ａの裏面２３ｋの、放熱部材取付部２３ｇが形成されていない部分の一部に形成されている。具体的には、フィン２３ｈは、回路基板２２が載っている他方の壁部２３ｃと放熱部材取付部２３ｇとの間に形成されている。また、フィン２３ｈは、ベース部２３ａの裏面２３ｋから表側に向かって窪む複数の凹部がベース部２３ａの短手方向において一定間隔で形成されることで、ベース部２３ａの裏面２３ｋに形成されている。フィン２３ｈの厚み（ベース部２３ａの短手方向における厚み）は、図１２に示すように、フィン２３ｈの基端（図１２の上端）からフィン２３ｈの先端（図１２の下端）に向かうにしたがって狭くなっている。本形態では、フィン２３ｈの２つの側面２３ｍは、平面状に形成されるとともに、フィン２３ｈの基端からフィン２３ｈの先端に向かうにしたがって互いに近づくように傾斜している。 Further, a plurality of heat radiation fins 23h are formed on the back surface 23k of the base portion 23a. The fin 23h is formed on a part of the back surface 23k of the base portion 23a where the heat dissipating member mounting portion 23g is not formed. Specifically, the fins 23h are formed between the other wall portion 23c on which the circuit board 22 is placed and the heat radiating member mounting portion 23g. In addition, the fins 23h are formed on the back surface 23k of the base portion 23a by forming a plurality of concave portions recessed from the back surface 23k of the base portion 23a toward the front side at regular intervals in the short side direction of the base portion 23a. Yes. As shown in FIG. 12, the thickness of the fin 23h (thickness in the short direction of the base portion 23a) increases from the proximal end (upper end in FIG. 12) of the fin 23h toward the distal end (lower end in FIG. 12) of the fin 23h. It is narrower. In this embodiment, the two side surfaces 23m of the fin 23h are formed in a flat shape and are inclined so as to approach each other as they go from the base end of the fin 23h toward the tip of the fin 23h.
　なお、本形態では、ベース部２３ａの裏面２３ｋは、ベース部２３ａの、固定部２３ｂが形成される面（すなわち、ベース部２３ａの表面２３ｊ）と反対側の面である反基板側面である。また、本形態のフィン２３ｈは、第２のフィンである。 In the present embodiment, the back surface 23k of the base portion 23a is the opposite side surface of the base portion 23a that is the surface opposite to the surface on which the fixing portion 23b is formed (that is, the surface 23j of the base portion 23a). Further, the fins 23h in this embodiment are second fins.
　回路基板２２の放熱部は、固定部２３ｂの端面に載った状態で固定部２３ｂに固定されている。具体的には、発熱部品７の実装位置に対応する位置の２箇所に形成された固定孔２２ｆに挿通されネジ孔２３ｄに螺合されるネジ（図示省略）と、回路基板２２の四隅のうちの隣り合う２箇所に形成された固定孔２２ｆに挿通されベース部２３ａに形成されるネジ孔に螺合されるネジ（図示省略）とによって、回路基板２２の放熱部が固定部２３ｂに固定されている。回路基板２２の放熱部と固定部２３ｂの端面との間には、絶縁性材料で形成される絶縁シート２４が配置されている。 The heat radiation part of the circuit board 22 is fixed to the fixing part 23b in a state of being placed on the end face of the fixing part 23b. Specifically, among the four corners of the circuit board 22, screws (not shown) inserted into the fixing holes 22 f formed at two positions corresponding to the mounting positions of the heat generating components 7 and screwed into the screw holes 23 d The heat radiating portion of the circuit board 22 is fixed to the fixing portion 23b by screws (not shown) that are inserted into the fixing holes 22f formed at two adjacent positions and screwed into the screw holes formed in the base portion 23a. ing. An insulating sheet 24 formed of an insulating material is disposed between the heat dissipation part of the circuit board 22 and the end face of the fixing part 23b.
　絶縁シート２４は、絶縁シート４と同様に、放熱性を有する（伝熱性に優れる）絶縁性材料で形成されている。また、絶縁シート２４は、弾力性を備えている。たとえば、絶縁シート２４は、放熱性と弾力性とを有するシリコン系の絶縁性材料で形成されている。絶縁シート２４には、固定孔２２ｆに挿通されるネジが挿通される貫通孔が形成されており、絶縁シート２４は、固定孔２２ｆに挿通されるネジによって、回路基板２２の放熱部と固定部２３ｂとに挟まれた状態で固定されている。また、絶縁シート２４は、圧縮された状態で回路基板２２の放熱部と固定部２３ｂとに挟まれている。 The insulating sheet 24 is formed of an insulating material having heat dissipation (excellent heat transfer) like the insulating sheet 4. Moreover, the insulating sheet 24 has elasticity. For example, the insulating sheet 24 is formed of a silicon-based insulating material having heat dissipation properties and elasticity. The insulating sheet 24 is formed with a through-hole through which a screw inserted into the fixing hole 22f is inserted. The insulating sheet 24 is configured such that the heat radiating portion and the fixing portion of the circuit board 22 are formed by the screw inserted through the fixing hole 22f. It is fixed in a state sandwiched between 23b. The insulating sheet 24 is sandwiched between the heat radiating portion and the fixing portion 23b of the circuit board 22 in a compressed state.
　実施の形態１と同様に、回路基板２２の放熱部と絶縁シート２４との間には、放熱ゲルまたは放熱グリースが配置されており、回路基板２２の放熱部は、放熱ゲルまたは放熱グリースを介して絶縁シート２４の表面に密着している。また、固定部２３ｂの端面と絶縁シート２４との間にも、放熱ゲルまたは放熱グリースが配置されており、固定部２３ｂの端面は、放熱ゲルまたは放熱グリースを介して絶縁シート２４の裏面に密着している。すなわち、回路基板２２の放熱部と固定部２３ｂの端面とは、絶縁シート２４を介して密着している。 As in the first embodiment, a heat radiating gel or heat radiating grease is disposed between the heat radiating portion of the circuit board 22 and the insulating sheet 24, and the heat radiating portion of the circuit board 22 is interposed via the heat radiating gel or the heat radiating grease. In close contact with the surface of the insulating sheet 24. Further, a heat radiating gel or heat radiating grease is also disposed between the end face of the fixing portion 23b and the insulating sheet 24, and the end face of the fixing portion 23b is in close contact with the back surface of the insulating sheet 24 via the heat radiating gel or heat radiating grease. is doing. That is, the heat radiating part of the circuit board 22 and the end surface of the fixing part 23 b are in close contact with each other through the insulating sheet 24.
　本形態でも、実施の形態１と同様に、回路基板２２の放熱部と絶縁シート２４との間には、放熱グリースが配置されている。この放熱グリースは、たとえば、シリコン系のオイルである。また、放熱グリースは、放熱用パターンがその内周面に形成される回路基板２２の貫通孔の中に入り込んでいる。また、固定部２３ｂの端面と絶縁シート２４との間にも、放熱グリースが配置されている。この放熱グリースは、たとえば、シリコン系のオイルである。 Also in the present embodiment, as in the first embodiment, heat radiation grease is disposed between the heat radiation portion of the circuit board 22 and the insulating sheet 24. This heat radiation grease is, for example, silicon-based oil. Further, the heat dissipating grease enters the through hole of the circuit board 22 in which the heat dissipating pattern is formed on the inner peripheral surface thereof. Further, heat radiation grease is also disposed between the end face of the fixing portion 23 b and the insulating sheet 24. This heat radiation grease is, for example, silicon-based oil.
　上述のように、固定部２３ｂは、ベース部２３ａの表面２３ｊから回路基板２２に向かって突出するように形成されており、基板固定部材２３に回路基板２２が固定された状態では、回路基板２２の裏面とベース部２３ａとの間に隙間Ｓ１が形成されている。 As described above, the fixing portion 23 b is formed so as to protrude from the surface 23 j of the base portion 23 a toward the circuit board 22, and in a state where the circuit board 22 is fixed to the board fixing member 23, the circuit board 22. A gap S <b> 1 is formed between the back surface and the base portion 23 a.
　放熱部材２５、２６は、放熱性を有する放熱材料で形成されている。具体的には、放熱部材２５、２６は、回路基板２２よりも放熱性の高いアルミ等の金属材料で形成されている。図１３、図１４に示すように、放熱部材２５、２６には、複数のフィン２５ａ、２６ａが形成されている。フィン２５ａ、２６ａは、放熱部材２５、２６のベース部２５ｂ、２６ｂから立ち上がるように形成されている。 The heat radiating members 25 and 26 are made of a heat radiating material having heat radiating properties. Specifically, the heat radiating members 25 and 26 are formed of a metal material such as aluminum having higher heat dissipation than the circuit board 22. As shown in FIGS. 13 and 14, the heat dissipating members 25 and 26 are formed with a plurality of fins 25 a and 26 a. The fins 25a and 26a are formed so as to rise from the base portions 25b and 26b of the heat dissipation members 25 and 26.
　フィン２５ａの厚み（ベース部２３ａの短手方向における厚み）は、図１２に示すように、フィン２５ａの基端（図１２の上端）からフィン２５ａの先端（図１２の下端）に向かうにしたがって狭くなっている。本形態では、フィン２５ａの２つの側面２５ｄは、平面状に形成されるとともに、フィン２５ａの基端からフィン２５ａの先端に向かうにしたがって互いに近づくように傾斜している。同様に、フィン２６ａの厚み（ベース部２３ａの短手方向における厚み）は、フィン２６ａの基端からフィン２６ａの先端に向かうにしたがって狭くなっている。また、フィン２６ａの２つの側面は、フィン２５ａの２つの側面２５ｄと同様に、平面状に形成されるとともに、フィン２６ａの基端からフィン２６ａの先端に向かうにしたがって互いに近づくように傾斜している。 As shown in FIG. 12, the thickness of the fin 25a (the thickness in the short direction of the base portion 23a) increases from the proximal end (upper end in FIG. 12) of the fin 25a toward the distal end of the fin 25a (lower end in FIG. 12). It is narrower. In this embodiment, the two side surfaces 25d of the fin 25a are formed in a planar shape and are inclined so as to approach each other as they go from the base end of the fin 25a toward the tip of the fin 25a. Similarly, the thickness of the fin 26a (the thickness of the base portion 23a in the short direction) becomes narrower from the proximal end of the fin 26a toward the distal end of the fin 26a. In addition, the two side surfaces of the fin 26a are formed in a planar shape, similar to the two side surfaces 25d of the fin 25a, and are inclined so as to approach each other from the base end of the fin 26a toward the front end of the fin 26a. Yes.
　放熱部材２６のフィン２６ａは、放熱部材２５のフィン２５ａよりも長くなっている。すなわち、放熱部材２６の放熱性能は、放熱部材２５の放熱性能よりも優れている。また、放熱部材２５、２６には、基板固定部材２３のネジ孔２３ｆに螺合するネジ（図示省略）が挿通される挿通孔（図示省略）が形成されている。放熱部材２５、２６は、ネジによって、放熱部材取付部２３ｇに着脱可能となっており、放熱部材２５、２６のベース部２５ｂ、２６ｂの一部が放熱部材取付部２３ｇの端面に当接可能となっている。すなわち、ベース部２３ａの裏面２３ｋと、ベース部２５ｂ、２６ｂとの間には、隙間が形成されている。 The fins 26 a of the heat dissipation member 26 are longer than the fins 25 a of the heat dissipation member 25. That is, the heat dissipation performance of the heat dissipation member 26 is superior to the heat dissipation performance of the heat dissipation member 25. The heat radiating members 25 and 26 are formed with insertion holes (not shown) through which screws (not shown) screwed into the screw holes 23f of the board fixing member 23 are inserted. The heat radiating members 25 and 26 can be attached to and detached from the heat radiating member mounting portion 23g with screws, and a part of the base portions 25b and 26b of the heat radiating members 25 and 26 can come into contact with the end surface of the heat radiating member mounting portion 23g. It has become. That is, a gap is formed between the back surface 23k of the base portion 23a and the base portions 25b and 26b.
　電子機器１と同様に、電子機器２１は、比較的容量の小さなサーボモータに用いられても比較的容量の大きなサーボモータに用いられても、その駆動が可能となるように構成されている。また、実施の形態１と同様に、比較的容量の小さなサーボモータに電子機器２１が用いられる場合には、電子機器２１は、図９に示すように、放熱部材２５、２６が取り付けられていない状態で使用される。また、サーボモータの容量が大きくなると、図１３に示すように、電子機器２１は、放熱部材２５が取り付けられた状態で使用される。また、さらにサーボモータの容量が大きくなると、図１４に示すように、電子機器２１は、放熱部材２６が取り付けられた状態で使用される。 As with the electronic device 1, the electronic device 21 is configured to be capable of being driven regardless of whether it is used for a servo motor having a relatively small capacity or a servo motor having a relatively large capacity. Similarly to the first embodiment, when the electronic device 21 is used in a servo motor having a relatively small capacity, the electronic device 21 is not attached with the heat radiating members 25 and 26 as shown in FIG. Used in state. Further, when the capacity of the servo motor is increased, as shown in FIG. 13, the electronic device 21 is used in a state where the heat radiating member 25 is attached. Further, when the capacity of the servo motor is further increased, as shown in FIG. 14, the electronic device 21 is used with the heat dissipation member 26 attached.
　（本形態の主な効果）
　本形態では、実施の形態１で説明した効果に加え、以下の効果を得ることができる。すなわち、本形態では、放熱部材２５、２６が取り付けられる放熱部材取付部２３ｇが、ベース部２３ａの裏面２３ｋから固定部２３ｂの突出方向と反対方向へ突出するように形成されている。そのため、ベース部２３ａの裏面２３ｋの全面を放熱部材２５、２６に当接させようとする場合と比較して、ベース部２３ａの、放熱部材２５、２６に当接させようとする部分の面積を低減することができる。したがって、ベース部２３ａの裏面２３ｋの全面を放熱部材２５、２６に当接させようとする場合と比較して、比較的容易に、放熱部材２５、２６に当接させようとする部分の平面度（すなわち、放熱部材取付部２３ｇの端面の平面度）を確保することが可能になる。その結果、本形態では、基板固定部材２３と放熱部材２５、２６とを確実に当接させることが可能になり、基板固定部材２３から放熱部材２５、２６へ効率良く熱を伝達することが可能になる。 (Main effects of this form)
In this embodiment, in addition to the effects described in Embodiment 1, the following effects can be obtained. In other words, in this embodiment, the heat dissipating member attaching portion 23g to which the heat dissipating members 25 and 26 are attached is formed so as to protrude from the back surface 23k of the base portion 23a in the direction opposite to the protruding direction of the fixing portion 23b. Therefore, compared with the case where the entire back surface 23k of the base portion 23a is to be brought into contact with the heat radiating members 25 and 26, the area of the portion of the base portion 23a that is to be brought into contact with the heat radiating members 25 and 26 is reduced. Can be reduced. Accordingly, the flatness of the portion to be brought into contact with the heat radiating members 25 and 26 is relatively easy as compared with the case where the entire rear surface 23k of the base portion 23a is brought into contact with the heat radiating members 25 and 26. (That is, the flatness of the end face of the heat dissipating member mounting portion 23g) can be ensured. As a result, in this embodiment, the substrate fixing member 23 and the heat radiating members 25 and 26 can be reliably brought into contact with each other, and heat can be efficiently transferred from the substrate fixing member 23 to the heat radiating members 25 and 26. become.
　また、本形態では、放熱部材取付部２３ｇが固定部２３ｂの裏側に形成されており、ベース部２３ａの厚さ方向から見たときに、固定部２３ｂと放熱部材取付部２３ｇとが重なっている。そのため、固定部２３ｂと放熱部材取付部２３ｇとの距離を短くすることが可能になる。したがって、本形態では、ベース部２３ａの、放熱部材２５、２６に当接させようとする部分の面積を低減しても、回路基板２２の放熱部が固定される固定部２３ｂに伝達された熱を、放熱部材取付部２３ｇを介して効率良く放熱部材２５、２６に伝達することが可能になる。 Further, in this embodiment, the heat radiating member mounting portion 23g is formed on the back side of the fixing portion 23b, and the fixing portion 23b and the heat radiating member mounting portion 23g overlap when viewed from the thickness direction of the base portion 23a. . Therefore, the distance between the fixing portion 23b and the heat radiating member mounting portion 23g can be shortened. Therefore, in this embodiment, even if the area of the portion of the base portion 23a to be brought into contact with the heat dissipation members 25 and 26 is reduced, the heat transmitted to the fixing portion 23b to which the heat dissipation portion of the circuit board 22 is fixed. Can be efficiently transmitted to the heat radiating members 25 and 26 via the heat radiating member mounting portion 23g.
　本形態では、ベース部２３ａの裏面２３ｋに、複数のフィン２３ｈが形成されている。そのため、基板固定部材２３の放熱効率を高めることが可能になる。特に本形態では、フィン２３ｈの厚みが、フィン２３ｈの基端からフィン２３ｈの先端に向かうにしたがって狭くなっているため、フィン２３ｈの表面積を大きくすることが可能になる。したがって、本形態では、基板固定部材２３の放熱効率を効果的に高めることが可能になる。また、本形態では、放熱部材２５、２６に形成される複数のフィン２５ａ、２６ａも、フィン２５ａ、２６ａの基端からフィン２５ａ、２６ａの先端に向かうにしたがって狭くなっているため、フィン２５ａ、２６ａの表面積を大きくして、放熱部材２５、２６の放熱効率を効果的に高めることが可能になる。 In this embodiment, a plurality of fins 23h are formed on the back surface 23k of the base portion 23a. Therefore, it is possible to increase the heat dissipation efficiency of the substrate fixing member 23. In particular, in this embodiment, since the thickness of the fin 23h becomes narrower from the base end of the fin 23h toward the tip of the fin 23h, the surface area of the fin 23h can be increased. Therefore, in this embodiment, the heat radiation efficiency of the substrate fixing member 23 can be effectively increased. In the present embodiment, the plurality of fins 25a, 26a formed on the heat dissipation members 25, 26 are also narrowed from the base ends of the fins 25a, 26a toward the tips of the fins 25a, 26a. The surface area of 26a can be increased to effectively increase the heat dissipation efficiency of the heat dissipation members 25 and 26.
　本形態では、ベース部２３ａの表面２３ｊと固定部２３ｂの側面とは、凹曲面２３ｅによって滑らかに繋がっている。そのため、本形態では、固定部２３ｂからベース部２３ａへ熱が伝達される部分の面積を広くして、固定部２３ｂからベース部２３ａへ効率良く熱を伝達することが可能になる。 In this embodiment, the surface 23j of the base portion 23a and the side surface of the fixed portion 23b are smoothly connected by the concave curved surface 23e. Therefore, in this embodiment, it is possible to increase the area of the portion where heat is transferred from the fixing portion 23b to the base portion 23a, and to efficiently transfer heat from the fixing portion 23b to the base portion 23a.
　［他の実施の形態］
　上述した形態は、本発明の好適な形態の一例ではあるが、これに限定されるものではなく本発明の要旨を変更しない範囲において種々変形実施が可能である。 [Other embodiments]
The above-described embodiment is an example of a preferred embodiment of the present invention, but is not limited to this, and various modifications can be made without departing from the scope of the present invention.
　実施の形態１では、基板固定部材３に着脱可能な放熱部材として、２種類の放熱部材５、６を説明しているが、基板固定部材３には、放熱部材５、６以外の様々な放熱部材も着脱可能である。また、実施の形態１では、基板固定部材３に放熱部材５、６が着脱可能となっているが、電子機器１が用いられるサーボモータの容量の範囲が限定されているのであれば、基板固定部材３に放熱部材５、６が着脱可能となっていなくても良い。同様に、実施の形態２において、基板固定部材２３には、放熱部材２５、２６以外の様々な放熱部材も着脱可能である。また、電子機器２１が用いられるサーボモータの容量の範囲が限定されているのであれば、基板固定部材２３に放熱部材２５、２６が着脱可能となっていなくても良い。 In the first embodiment, two types of heat radiating members 5 and 6 are described as heat radiating members that can be attached to and detached from the substrate fixing member 3, but various heat dissipations other than the heat radiating members 5 and 6 are included in the substrate fixing member 3. The member is also detachable. In the first embodiment, the heat radiating members 5 and 6 can be attached to and detached from the board fixing member 3. However, if the capacity range of the servo motor in which the electronic apparatus 1 is used is limited, the board fixing is performed. The heat radiating members 5 and 6 may not be detachable from the member 3. Similarly, in the second embodiment, various heat radiating members other than the heat radiating members 25 and 26 can be attached to and detached from the substrate fixing member 23. Further, if the range of the capacity of the servo motor in which the electronic device 21 is used is limited, the heat radiating members 25 and 26 may not be detachable from the substrate fixing member 23.
　実施の形態１では、発熱部品７は、回路基板２の表面２ｃに実装されているが、発熱部品７は、回路基板２の裏面２ｄに実装されても良い。同様に、実施の形態２では、発熱部品７は、回路基板２２の表面２２ｃに実装されているが、発熱部品７は、回路基板２２の裏面に実装されても良い。また、上述した形態では、発熱部品７は、面実装部品であるが、発熱部品７は、その端子が回路基板２に形成されるスルーホールに差し込まれて実装されるいわゆる差し部品であっても良い。これらの場合には、たとえば、発熱部品７の端子は直接、回路基板２の放熱部２ｅ、あるいは、回路基板２２の放熱部に接続される。 In the first embodiment, the heat generating component 7 is mounted on the front surface 2c of the circuit board 2, but the heat generating component 7 may be mounted on the back surface 2d of the circuit board 2. Similarly, in the second embodiment, the heat generating component 7 is mounted on the front surface 22 c of the circuit board 22, but the heat generating component 7 may be mounted on the back surface of the circuit board 22. In the above-described embodiment, the heat generating component 7 is a surface mounting component. However, the heat generating component 7 may be a so-called insertion component in which a terminal is inserted into a through hole formed in the circuit board 2 and mounted. good. In these cases, for example, the terminals of the heat generating component 7 are directly connected to the heat radiating portion 2e of the circuit board 2 or the heat radiating portion of the circuit board 22.
　実施の形態１では、放熱部２ｅと絶縁シート４との間、および、固定部３ｂの端面と絶縁シート４との間に放熱ゲルまたは放熱グリースが配置されているが、放熱部２ｅと絶縁シート４との間、および、固定部３ｂの端面と絶縁シート４との間に放熱ゲルおよび放熱グリースが配置されていなくても良い。同様に、実施の形態２では、回路基板２２の放熱部と絶縁シート２４との間、および、固定部２３ｂの端面と絶縁シート２４との間に放熱ゲルまたは放熱グリースが配置されているが、回路基板２２の放熱部と絶縁シート２４との間、および、固定部２３ｂの端面と絶縁シート２４との間に放熱ゲルおよび放熱グリースが配置されていなくても良い。 In the first embodiment, the heat radiating gel or the heat radiating grease is arranged between the heat radiating part 2e and the insulating sheet 4 and between the end face of the fixing part 3b and the insulating sheet 4, but the heat radiating part 2e and the insulating sheet are arranged. 4, and between the end surface of the fixing | fixed part 3b and the insulating sheet 4, the thermal radiation gel and thermal radiation grease do not need to be arrange | positioned. Similarly, in the second embodiment, a heat radiating gel or heat radiating grease is disposed between the heat radiating portion of the circuit board 22 and the insulating sheet 24 and between the end face of the fixing portion 23b and the insulating sheet 24. The heat radiating gel and the heat radiating grease may not be disposed between the heat radiating portion of the circuit board 22 and the insulating sheet 24 and between the end face of the fixing portion 23b and the insulating sheet 24.
　実施の形態２では、放熱部材取付部２３ｇは、固定部２３ｂの裏側に形成されており、ベース部２３ａの厚さ方向から見たときに、固定部２３ｂと放熱部材取付部２３ｇとが重なっている。この他にもたとえば、ベース部２３ａの厚さ方向から見たときに、固定部２３ｂと重ならないように、放熱部材取付部２３ｇが形成されても良い。また、実施の形態２では、フィン２３ｈは、ベース部２３ａの裏面２３ｋの、放熱部材取付部２３ｇが形成されていない部分の一部に形成されているが、フィン２３ｈは、ベース部２３ａの裏面２３ｋの、放熱部材取付部２３ｇが形成されていない部分の全部に形成されても良い。また、ベース部２３ａの裏面２３ｋにフィン２３ｈが形成されていなくても良い。 In the second embodiment, the heat dissipating member attaching portion 23g is formed on the back side of the fixing portion 23b, and the fixing portion 23b and the heat dissipating member attaching portion 23g overlap when viewed from the thickness direction of the base portion 23a. Yes. In addition, for example, the heat radiating member mounting portion 23g may be formed so as not to overlap the fixing portion 23b when viewed from the thickness direction of the base portion 23a. In the second embodiment, the fin 23h is formed on a part of the back surface 23k of the base portion 23a where the heat radiating member mounting portion 23g is not formed. However, the fin 23h is formed on the back surface of the base portion 23a. It may be formed on the entire portion of 23k where the heat dissipating member mounting portion 23g is not formed. Further, the fins 23h may not be formed on the back surface 23k of the base portion 23a.
　上述した形態では、絶縁シート４、２４は、放熱性と弾力性とを有するシリコン系の絶縁性材料で形成されている。この他にもたとえば、絶縁シート４、２４は、エポキシ樹脂やＰＥＴ（ポリエチレンテレフタレート）等で形成されても良い。 In the above-described form, the insulating sheets 4 and 24 are formed of a silicon-based insulating material having heat dissipation and elasticity. In addition, for example, the insulating sheets 4 and 24 may be formed of an epoxy resin, PET (polyethylene terephthalate), or the like.
　上述した形態では、モータ駆動回路とモータ制御回路とが１枚の回路基板２、２２に形成されている。この他にもたとえば、モータ駆動回路とモータ制御回路とがそれぞれ別個の回路基板に形成されても良い。また、上述した形態では、電子機器１、２１は、産業用のサーボモータを駆動するための機器であるが、本発明の構成が適用される電子機器は、サーボモータ駆動用以外の他の用途に使用されても良い。 In the above-described form, the motor drive circuit and the motor control circuit are formed on one circuit board 2 and 22. In addition, for example, the motor drive circuit and the motor control circuit may be formed on separate circuit boards. In the above-described embodiment, the electronic devices 1 and 21 are devices for driving an industrial servo motor. However, the electronic device to which the configuration of the present invention is applied is used for purposes other than servo motor driving. May be used.
　１、２１　電子機器
　２、２２　回路基板
　２ｃ、２２ｃ　表面
　２ｄ　裏面
　２ｅ　放熱部
　３　基板固定部材
　３ａ　ベース部
　３ｂ　固定部
　４、２４　絶縁シート
　５、６　放熱部材
　７　発熱部品
　２３　基板固定部材
　２３ａ　ベース部
　２３ｂ　固定部
　２３ｇ　放熱部材取付部
　２３ｈ　フィン（第２のフィン）
　２３ｊ　表面（固定部が形成される面）
　２３ｋ　裏面（反基板側面）
　２５、２６　放熱部材
　２５ａ、２６ａ　フィン DESCRIPTION OF SYMBOLS 1, 21 Electronic device 2, 22 Circuit board 2c, 22c Front surface 2d Back surface 2e Heat radiation part 3 Substrate fixing member 3a Base part 3b Fixing part 4, 24 Insulation sheet 5, 6 Heat radiation member 7 Heat generating component 23 Substrate fixing member 23a Base part 23b Fixed part 23g Heat radiation member mounting part 23h Fin (second fin)
23j Surface (surface on which the fixing part is formed)
23k reverse side (side of the non-board)
25, 26 Heat dissipation member 25a, 26a Fin

Claims (16)

  1. 　発熱部品が実装される回路基板と、前記回路基板が固定される基板固定部材とを備え、
    　前記回路基板の裏面には、前記発熱部品で発生した熱を放散するための放熱部が形成され、
    　前記基板固定部材は、前記回路基板の裏面と所定の間隔をあけた状態で配置されるベース部と、前記ベース部から前記回路基板に向かって突出するとともに前記放熱部が固定される固定部とを備え、放熱性を有する放熱性材料で形成されていることを特徴とする電子機器。     A circuit board on which a heat generating component is mounted, and a board fixing member to which the circuit board is fixed,
    On the back surface of the circuit board, a heat dissipating part is formed to dissipate heat generated by the heat-generating component,
    The substrate fixing member includes a base portion disposed in a state spaced apart from the back surface of the circuit board, a fixing portion that protrudes from the base portion toward the circuit substrate and to which the heat dissipation portion is fixed. An electronic device comprising: a heat dissipating material having heat dissipating properties.
  2. 　前記基板固定部材は、金属材料で形成され、
    　前記放熱部と前記固定部との間には、絶縁性材料で形成される絶縁シートが配置されていることを特徴とする請求項１記載の電子機器。     The substrate fixing member is formed of a metal material,
    The electronic device according to claim 1, wherein an insulating sheet formed of an insulating material is disposed between the heat radiating portion and the fixing portion.
  3. 　前記絶縁シートは、放熱性を有する絶縁性材料で形成され、
    　前記放熱部と前記絶縁シートとの間、および／または、前記固定部と前記絶縁シートとの間には、放熱性を有する放熱ゲルまたは放熱グリースが配置されていることを特徴とする請求項２記載の電子機器。     The insulating sheet is formed of an insulating material having heat dissipation,
    The heat dissipating gel or heat dissipating grease is disposed between the heat dissipating part and the insulating sheet and / or between the fixing part and the insulating sheet. The electronic device described.
  4. 　前記絶縁シートは、放熱性を有する絶縁性材料で形成されるとともに、弾力性を備えていることを特徴とする請求項２または３記載の電子機器。 4. The electronic device according to claim 2, wherein the insulating sheet is formed of an insulating material having heat dissipation properties and has elasticity.
  5. 　前記基板固定部材には、放熱性を有する放熱性材料で形成される放熱部材が着脱可能となっていることを特徴とする請求項１から３のいずれかに記載の電子機器。 4. The electronic apparatus according to claim 1, wherein a heat radiating member formed of a heat radiating material having a heat radiating property is detachably attached to the substrate fixing member.
  6. 　前記放熱部材には、複数の放熱用のフィンが形成され、
    　前記フィンの厚みは、前記フィンの基端から前記フィンの先端に向かうにしたがって狭くなっていることを特徴とする請求項５記載の電子機器。     The heat dissipating member is formed with a plurality of heat dissipating fins,
    The electronic apparatus according to claim 5, wherein the fin has a thickness that decreases from a base end of the fin toward a tip of the fin.
  7. 　前記放熱部材は、前記ベース部の、前記固定部が形成される面と反対側の面である反基板側面に着脱可能となっており、
    　前記反基板側面には、前記固定部の突出方向と反対の方向へ突出するとともに、前記放熱部材が当接するように取り付けられる放熱部材取付部が形成されていることを特徴とする請求項５記載の電子機器。     The heat radiating member can be attached to and detached from the side of the base opposite to the side opposite to the surface on which the fixed portion is formed,
    6. The heat radiating member mounting portion is formed on the side surface of the substrate opposite to the direction in which the fixing portion protrudes and is mounted so that the heat radiating member comes into contact therewith. Electronic equipment.
  8. 　前記放熱部材取付部は、前記固定部に対応するように形成されていることを特徴とする請求項７記載の電子機器。 The electronic device according to claim 7, wherein the heat dissipating member mounting portion is formed to correspond to the fixed portion.
  9. 　前記反基板側面の、前記放熱部材取付部が形成されていない部分の全部または一部には、複数の放熱用の第２のフィンが形成されていることを特徴とする請求項７または８記載の電子機器。 9. A plurality of second fins for heat dissipation are formed on all or a part of the side surface of the non-substrate on which the heat dissipating member mounting portion is not formed. Electronic equipment.
  10. 　前記第２のフィンの厚みは、前記第２のフィンの基端から前記第２のフィンの先端に向かうにしたがって狭くなっていることを特徴とする請求項９記載の電子機器。 10. The electronic apparatus according to claim 9, wherein a thickness of the second fin is narrowed from a proximal end of the second fin toward a distal end of the second fin.
  11. 　前記基板固定部材には、複数の放熱用の第２のフィンが形成されていることを特徴とする請求項１から３のいずれかに記載の電子機器。 4. The electronic device according to claim 1, wherein a plurality of second fins for heat dissipation are formed on the substrate fixing member.
  12. 　前記固定部と前記ベース部との境界は、曲面状に形成されていることを特徴とする請求項１から３のいずれかに記載の電子機器。 4. The electronic apparatus according to claim 1, wherein a boundary between the fixed portion and the base portion is formed in a curved surface shape.
  13. 　前記発熱部品は、前記回路基板の表面に面実装され、前記回路基板の表面と裏面との間に形成される放熱用パターンを介して前記放熱部に接続されていることを特徴とする請求項１から３のいずれかに記載の電子機器。 The heat-generating component is surface-mounted on the front surface of the circuit board and connected to the heat dissipation portion via a heat dissipation pattern formed between the front surface and the back surface of the circuit board. The electronic device according to any one of 1 to 3.
  14. 　前記放熱部と前記固定部との間には、放熱性を有する絶縁性材料で形成される絶縁シートが配置され、
    　前記放熱部と前記絶縁シートとの間には、放熱性を有する放熱グリースが配置され、
    　前記回路基板には、前記回路基板を貫通する貫通孔が形成され、
    　前記放熱用パターンは、前記貫通孔の内周面に形成され、
    　前記放熱グリースは、前記貫通孔の中に入り込んでいることを特徴とする請求項１３記載の電子機器。     Between the heat radiating part and the fixed part, an insulating sheet formed of an insulating material having heat radiating properties is disposed,
    Between the heat dissipating part and the insulating sheet, a heat dissipating grease having heat dissipating properties is disposed,
    The circuit board is formed with a through-hole penetrating the circuit board,
    The heat dissipation pattern is formed on the inner peripheral surface of the through hole,
    The electronic device according to claim 13, wherein the heat dissipating grease enters the through hole.
  15. 　前記回路基板には、前記発熱部品が実装される高電圧用回路と、前記高電圧用回路よりも低い電圧が印加される低電圧用回路とが形成されていることを特徴とする請求項１から３のいずれかに記載の電子機器。 2. The circuit board is formed with a high voltage circuit on which the heat generating component is mounted and a low voltage circuit to which a voltage lower than the high voltage circuit is applied. 4. The electronic device according to any one of 3 to 3.
  16. 　前記高電圧用回路は、モータを駆動するためのモータ駆動回路であり、
    　前記低電圧用回路は、前記モータを制御するためのモータ制御回路であることを特徴とする請求項１５記載の電子機器。     The high voltage circuit is a motor drive circuit for driving a motor,
    16. The electronic apparatus according to claim 15, wherein the low voltage circuit is a motor control circuit for controlling the motor.
PCT/JP2011/075122 2010-11-15 2011-11-01 Electronic device WO2012066925A1 (en)

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