WO2012029355A1 - インジウムターゲット及びその製造方法 - Google Patents
インジウムターゲット及びその製造方法 Download PDFInfo
- Publication number
- WO2012029355A1 WO2012029355A1 PCT/JP2011/060969 JP2011060969W WO2012029355A1 WO 2012029355 A1 WO2012029355 A1 WO 2012029355A1 JP 2011060969 W JP2011060969 W JP 2011060969W WO 2012029355 A1 WO2012029355 A1 WO 2012029355A1
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- WO
- WIPO (PCT)
- Prior art keywords
- indium
- target
- average roughness
- less
- indium target
- Prior art date
Links
- 229910052738 indium Inorganic materials 0.000 title claims abstract description 55
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 title claims abstract description 55
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000005520 cutting process Methods 0.000 claims description 7
- 238000005266 casting Methods 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 230000002159 abnormal effect Effects 0.000 abstract description 14
- 229910001220 stainless steel Inorganic materials 0.000 description 11
- 239000010935 stainless steel Substances 0.000 description 10
- 238000004544 sputter deposition Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 238000005477 sputtering target Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D7/00—Casting ingots, e.g. from ferrous metals
- B22D7/005—Casting ingots, e.g. from ferrous metals from non-ferrous metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D21/00—Casting non-ferrous metals or metallic compounds so far as their metallurgical properties are of importance for the casting procedure; Selection of compositions therefor
- B22D21/02—Casting exceedingly oxidisable non-ferrous metals, e.g. in inert atmosphere
- B22D21/027—Casting heavy metals with low melting point, i.e. less than 1000 degrees C, e.g. Zn 419 degrees C, Pb 327 degrees C, Sn 232 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D23/00—Casting processes not provided for in groups B22D1/00 - B22D21/00
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a sputtering target and a manufacturing method thereof, and more particularly to an indium target and a manufacturing method thereof.
- Indium is used as a sputtering target for forming a light absorption layer of a Cu—In—Ga—Se (CIGS) thin film solar cell.
- CGS Cu—In—Ga—Se
- an indium target is manufactured by pouring indium into a mold after casting an indium alloy or the like on a backing plate.
- an indium target is manufactured by such a melting casting method
- an oxide film is formed on the surface of an indium ingot obtained by casting indium into a mold unless surface processing is performed.
- indium is a very soft metal, so that the surface becomes rough.
- Such roughness of the surface of the indium target causes an abnormal discharge during sputtering.
- an object of the present invention is to provide an indium target capable of satisfactorily suppressing the occurrence of abnormal discharge and a method for manufacturing the indium target.
- the present inventor has intensively studied to solve the above problems, and by cutting the surface of the indium target produced by the melt casting method, the arithmetic average roughness (Ra) of the target surface is 1.6 ⁇ m or less, It has also been found that the occurrence of abnormal discharge can be satisfactorily suppressed by further setting the 10-point average roughness (Rz) of the target surface to 15 ⁇ m or less.
- the present invention completed on the basis of the above knowledge is, in one aspect, an indium target having an arithmetic average roughness (Ra) of the target surface of 1.6 ⁇ m or less.
- the indium target according to the present invention has an arithmetic average roughness (Ra) of 1.2 ⁇ m or less.
- the 10-point average roughness (Rz) of the target surface is 15 ⁇ m or less.
- the ten-point average roughness (Rz) is 10 ⁇ m or less.
- the present invention is a method for producing an indium target in which the indium target of the present invention is produced by performing a cutting process with a scraper after melting and casting an indium raw material.
- an indium target capable of satisfactorily suppressing the occurrence of abnormal discharge and a method for manufacturing the indium target.
- the indium target according to the present invention is characterized in that the arithmetic average roughness (Ra) of the target surface is 1.6 ⁇ m or less.
- the arithmetic average roughness (Ra) of the target surface is preferably 1.2 ⁇ m or less, and more preferably 1.0 ⁇ m or less.
- “arithmetic mean roughness (Ra)” is defined according to JIS B0601-1994.
- the indium target according to the present invention is characterized in that the ten-point average roughness (Rz) of the target surface is 15 ⁇ m or less.
- the ten-point average roughness (Rz) of the target surface is preferably 10 ⁇ m or less, and more preferably 8 ⁇ m or less.
- the “ten-point average roughness (Rz)” is defined according to JIS B0601-1994.
- indium which is a raw material is dissolved and poured into a mold.
- the raw material indium to be used preferably has a high purity because the conversion efficiency of a solar cell produced from the raw material is reduced when impurities are contained.
- the purity of the material indium is 99.99. More than mass% indium can be used.
- it cools to room temperature and forms an indium ingot.
- the cooling rate may be natural cooling with air.
- an indium target is produced by cutting the surface using a scraper with a blade width of 5 to 100 mm, for example.
- the scraper is not particularly limited as long as it has a hardness that can withstand the cutting of the surface of the indium target and has excellent wear resistance.
- a scraper made of metal such as stainless steel or high chromium steel, or possible. If necessary, a ceramic scraper can also be used.
- the arithmetic average roughness (Ra) of the target surface is processed to 1.6 ⁇ m or less, preferably 1.2 ⁇ m or less, more preferably 1.0 ⁇ m or less. Further, the 10-point average roughness (Rz) of the target surface is also processed to 15 ⁇ m or less, preferably 10 ⁇ m or less, more preferably 8 ⁇ m or less.
- the indium target thus obtained can be suitably used as a sputtering target for the light absorption layer for CIGS thin film solar cells.
- Example 1 The circumference of a copper backing plate having a diameter of 250 mm and a thickness of 5 mm is surrounded by a cylindrical mold having a diameter of 205 mm and a height of 7 mm, and an indium raw material (purity 5N) dissolved at 160 ° C. is poured into the interior, and then room temperature To form a disk-shaped indium ingot (diameter 204 mm ⁇ thickness 6 mm). Subsequently, the surface of the indium ingot was cut with a stainless steel scraper having a blade width of 20 mm to obtain an indium target.
- an indium raw material purity 5N
- Example 2 An indium target was produced under the same conditions as in Example 1 except that the blade width of the stainless steel scraper was 40 mm.
- Example 3 An indium target was prepared under the same conditions as in Example 1 except that the blade width of the stainless steel scraper was changed to 10 mm.
- Example 4 An indium target was produced under the same conditions as in Example 1 except that the blade width of the stainless steel scraper was changed to 5 mm.
- Example 1 An indium target was produced under the same conditions as in Example 1 except that the target surface was not cut.
- Example 2 An indium target was produced under the same conditions as in Example 1 except that milling was performed instead of cutting the target surface with a stainless steel scraper.
- Example 1 the target surface was cut with a stainless steel scraper having a blade width of 20 mm, the arithmetic average roughness (Ra) was 1.3 ⁇ m, and the ten-point average roughness (Rz) was 12 ⁇ m. For this reason, abnormal discharge was not confirmed.
- Example 2 the target surface was cut by a stainless steel scraper having a blade width of 40 mm wider than that of Example 1, and the arithmetic average roughness (Ra) was 1.6 ⁇ m and the ten-point average roughness (Rz). ) was 15 ⁇ m, which was slightly rougher than the surface of Example 1, but no abnormal discharge was confirmed.
- Example 3 the target surface was cut by a stainless steel scraper having a narrower blade width of 10 mm compared to Example 1, and the arithmetic average roughness (Ra) was 1.2 ⁇ m and the ten-point average roughness (Rz). ) was 10 ⁇ m, the surface was flatter than in Example 1, and abnormal discharge was not confirmed.
- Example 4 the target surface was cut by a stainless steel scraper having a narrower blade width of 5 mm than in Examples 1 and 3, and the arithmetic average roughness (Ra) was 0.8 ⁇ m and the ten-point average roughness. (Rz) was 8 ⁇ m, the surface was smoother than in Examples 1 and 3, and abnormal discharge was not confirmed.
- Comparative Example 1 the target surface was not cut, the arithmetic average roughness (Ra) was 2 ⁇ m, the ten-point average roughness (Rz) was 20 ⁇ m, and abnormal discharge was 80 times.
- Comparative Example 2 since the surface treatment is performed by milling instead of cutting the target surface with a scraper, the arithmetic average roughness (Ra) is 50 ⁇ m and the ten-point average roughness (Rz) is 150 ⁇ m, which is abnormal. There were many discharges of 250 times.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
直径250mm、厚さ5mmの銅製のバッキングプレート上の周囲を直径205mm、高さ7mmの円柱状の鋳型で囲い、その内部に160℃で溶解させたインジウム原料(純度5N)を流し込んだ後、室温まで冷却して、円盤状のインジウムインゴット(直径204mm×厚み6mm)を形成した。続いて、このインジウムインゴットの表面を、刃幅20mmのステンレス製スクレーパーによって切削加工し、インジウムターゲットを得た。
ステンレス製スクレーパーの刃幅を40mmとした以外は、実施例1と同様の条件でインジウムターゲットを作製した。
ステンレス製スクレーパーの刃幅を10mmとした以外は、実施例1と同様の条件でインジウムターゲットを作製した。
(実施例4)
ステンレス製スクレーパーの刃幅を5mmとした以外は、実施例1と同様の条件でインジウムターゲットを作製した。
ターゲット表面の切削を行わなかった以外は、実施例1と同様の条件でインジウムターゲットを作製した。
ステンレス製スクレーパーによるターゲット表面の切削加工に代えて、フライス加工を行った以外は、実施例1と同様の条件でインジウムターゲットを作製した。
実施例及び比較例で得られたインジウムターゲットについて、JIS B0601-1994の規定による「算術平均粗さ(Ra)」及び「十点平均粗さ(Rz)」を測定した。
また、これら実施例及び比較例のインジウムターゲットを、ANELVA製SPF-313Hスパッタ装置で、スパッタ開始前のチャンバー内の到達真空度圧力を1×10-4Pa、スパッタ時の圧力を0.5Pa、アルゴンスパッタガス流量を5SCCM、スパッタパワーを650Wで30分間スパッタし、目視により観察されたスパッタ中の異常放電の回数を計測した。
各測定結果を表1に示す。
実施例2は、ターゲット表面を、実施例1に比べて刃幅が40mmと広いステンレス製スクレーパーによって切削加工しており、算術平均粗さ(Ra)が1.6μmで十点平均粗さ(Rz)が15μmと実施例1より表面がやや粗かったが、異常放電は確認されなかった。
実施例3は、ターゲット表面を、実施例1に比べて刃幅が10mmと狭いステンレス製スクレーパーによって切削加工しており、算術平均粗さ(Ra)が1.2μmで十点平均粗さ(Rz)が10μmと実施例1より表面が平坦で、異常放電は確認されなかった。
実施例4は、ターゲット表面を、実施例1及び3に比べて刃幅が5mmと狭いステンレス製スクレーパーによって切削加工しており、算術平均粗さ(Ra)が0.8μmで十点平均粗さ(Rz)が8μmと実施例1及び3より表面が滑らかで、異常放電は確認されなかった。
比較例1は、ターゲット表面の切削を行っておらず、算術平均粗さ(Ra)が2μmで十点平均粗さ(Rz)が20μmと粗く、異常放電も80回と多かった。
比較例2は、スクレーパーによるターゲット表面の切削加工に代えてフライス加工により表面処理を行っているため、算術平均粗さ(Ra)が50μmで十点平均粗さ(Rz)が150μmと粗く、異常放電も250回と多かった。
Claims (5)
- ターゲット表面の算術平均粗さ(Ra)が1.6μm以下であるインジウムターゲット。
- 前記算術平均粗さ(Ra)が1.2μm以下である請求項1に記載のインジウムターゲット。
- ターゲット表面の十点平均粗さ(Rz)が15μm以下である請求項1又は2に記載のインジウムターゲット。
- 前記十点平均粗さ(Rz)が10μm以下である請求項3に記載のインジウムターゲット。
- インジウム原料を溶解鋳造後、スクレーパーによる切削加工を行うことにより請求項1~4のいずれかに記載のインジウムターゲットを作製するインジウムターゲットの製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020127013556A KR101274385B1 (ko) | 2010-08-31 | 2011-05-12 | 인듐 타깃 및 그 제조 방법 |
US13/809,296 US20130105311A1 (en) | 2010-08-31 | 2011-05-12 | Indium Target And Method For Producing The Same |
EP11821373.5A EP2612952B1 (en) | 2010-08-31 | 2011-05-12 | Indium target and method for producing same |
CN2011800048448A CN102652185A (zh) | 2010-08-31 | 2011-05-12 | 铟靶材及其制造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2010-194532 | 2010-08-31 | ||
JP2010194532A JP4948633B2 (ja) | 2010-08-31 | 2010-08-31 | インジウムターゲット及びその製造方法 |
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WO2012029355A1 true WO2012029355A1 (ja) | 2012-03-08 |
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PCT/JP2011/060969 WO2012029355A1 (ja) | 2010-08-31 | 2011-05-12 | インジウムターゲット及びその製造方法 |
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US (1) | US20130105311A1 (ja) |
EP (1) | EP2612952B1 (ja) |
JP (1) | JP4948633B2 (ja) |
KR (1) | KR101274385B1 (ja) |
CN (2) | CN104480435A (ja) |
TW (1) | TW201209203A (ja) |
WO (1) | WO2012029355A1 (ja) |
Families Citing this family (9)
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JP4948634B2 (ja) | 2010-09-01 | 2012-06-06 | Jx日鉱日石金属株式会社 | インジウムターゲット及びその製造方法 |
JP5140169B2 (ja) | 2011-03-01 | 2013-02-06 | Jx日鉱日石金属株式会社 | インジウムターゲット及びその製造方法 |
JP5026611B1 (ja) | 2011-09-21 | 2012-09-12 | Jx日鉱日石金属株式会社 | 積層構造体及びその製造方法 |
JP5074628B1 (ja) | 2012-01-05 | 2012-11-14 | Jx日鉱日石金属株式会社 | インジウム製スパッタリングターゲット及びその製造方法 |
WO2014030362A1 (ja) | 2012-08-22 | 2014-02-27 | Jx日鉱日石金属株式会社 | インジウム製円筒型スパッタリングターゲット及びその製造方法 |
JP5855319B2 (ja) | 2013-07-08 | 2016-02-09 | Jx日鉱日石金属株式会社 | スパッタリングターゲット及び、それの製造方法 |
WO2016002633A1 (ja) * | 2014-07-03 | 2016-01-07 | 住友金属鉱山株式会社 | スパッタリング用ターゲット材とその製造方法 |
CN108165936A (zh) * | 2017-12-21 | 2018-06-15 | 清远先导材料有限公司 | 制备铟靶材的方法 |
CN112030119A (zh) * | 2020-08-27 | 2020-12-04 | 苏州思菲科新材料科技有限公司 | 一种铟管靶及其制备方法 |
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JP2005002364A (ja) * | 2003-06-09 | 2005-01-06 | Mitsui Mining & Smelting Co Ltd | スパッタリングターゲット及びその製造方法 |
JP2010024474A (ja) * | 2008-07-16 | 2010-02-04 | Sumitomo Metal Mining Co Ltd | インジウムターゲットの製造方法 |
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JP3152108B2 (ja) * | 1994-06-13 | 2001-04-03 | 東ソー株式会社 | Itoスパッタリングターゲット |
US5630918A (en) * | 1994-06-13 | 1997-05-20 | Tosoh Corporation | ITO sputtering target |
WO2003025247A1 (fr) * | 2001-09-18 | 2003-03-27 | Mitsui Mining & Smelting Co., Ltd. | Cible de pulverisation et procede de production |
JP2006257510A (ja) * | 2005-03-17 | 2006-09-28 | Mitsui Mining & Smelting Co Ltd | スパッタリングターゲットの製造方法およびスパッタリングターゲット |
US8003432B2 (en) * | 2008-06-25 | 2011-08-23 | Stion Corporation | Consumable adhesive layer for thin film photovoltaic material |
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2010
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2011
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JPS6344820A (ja) | 1986-08-11 | 1988-02-25 | 萩原工業株式会社 | 植物を直接被覆する保護シ−ト |
JPH08281208A (ja) * | 1995-04-07 | 1996-10-29 | Sumitomo Light Metal Ind Ltd | アルミニウム合金研削部の塗装前処理方法 |
JP2003089869A (ja) * | 2001-09-18 | 2003-03-28 | Mitsui Mining & Smelting Co Ltd | スパッタリングターゲットおよびその製造方法 |
JP2005002364A (ja) * | 2003-06-09 | 2005-01-06 | Mitsui Mining & Smelting Co Ltd | スパッタリングターゲット及びその製造方法 |
JP2010024474A (ja) * | 2008-07-16 | 2010-02-04 | Sumitomo Metal Mining Co Ltd | インジウムターゲットの製造方法 |
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Also Published As
Publication number | Publication date |
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EP2612952B1 (en) | 2014-11-12 |
JP2012052173A (ja) | 2012-03-15 |
EP2612952A4 (en) | 2014-02-12 |
US20130105311A1 (en) | 2013-05-02 |
CN104480435A (zh) | 2015-04-01 |
EP2612952A1 (en) | 2013-07-10 |
TW201209203A (en) | 2012-03-01 |
JP4948633B2 (ja) | 2012-06-06 |
KR20120091246A (ko) | 2012-08-17 |
TWI372186B (ja) | 2012-09-11 |
CN102652185A (zh) | 2012-08-29 |
KR101274385B1 (ko) | 2013-06-17 |
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