WO2012017644A1 - 光部品 - Google Patents
光部品 Download PDFInfo
- Publication number
- WO2012017644A1 WO2012017644A1 PCT/JP2011/004375 JP2011004375W WO2012017644A1 WO 2012017644 A1 WO2012017644 A1 WO 2012017644A1 JP 2011004375 W JP2011004375 W JP 2011004375W WO 2012017644 A1 WO2012017644 A1 WO 2012017644A1
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- WO
- WIPO (PCT)
- Prior art keywords
- waveguide
- optical element
- connection surface
- waveguide type
- optical
- Prior art date
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/30—Optical coupling means for use between fibre and thin-film device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/38—Mechanical coupling means having fibre to fibre mating means
- G02B6/3807—Dismountable connectors, i.e. comprising plugs
- G02B6/3897—Connectors fixed to housings, casing, frames or circuit boards
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4267—Reduction of thermal stress, e.g. by selecting thermal coefficient of materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12035—Materials
- G02B2006/1204—Lithium niobate (LiNbO3)
Definitions
- the present invention relates to an optical component, and more particularly to an optical component including a waveguide type optical element.
- a waveguide type optical device can realize various lightwave circuits by forming an optical waveguide on a substrate, and is used as a component of an optical module.
- a hybrid optical module in which waveguide optical elements having different functions are integrated has been realized.
- Specific examples of the optical module include an RZ-DQPSK (Return to Zero Differential Quadrature Phase Shift Keying) module.
- the RZ-DQPSK module uses, for example, a PLC (Planar Lightwave Circuit) waveguide in which an optical waveguide is formed of silica glass on a Si substrate or a quartz substrate, and titanium (Ti) diffusion on an LN (lithium niobate) substrate.
- the LN waveguide having the waveguide is butt-connected so as to be optically coupled, and the LN waveguide is fixed to the mount (see FIGS. 1A and 1B).
- the mount plays a role of a package that houses a PLC waveguide, an LN waveguide, and a fiber alignment member.
- the optical fiber is aligned with the fiber alignment member and butt-connected to optically couple with the PLC waveguide.
- the connecting portion between the fiber alignment member and the PLC waveguide and the connecting portion between the PLC waveguide and the LN waveguide are fixed by an adhesive.
- the optical fiber is fixed to the mount with solder or the like where it passes through the mount. In such a structure, when the temperature around the optical module fluctuates, heat is generated due to the difference in thermal expansion of each material at the connection portion between the fiber alignment member and the PLC waveguide and between the PLC waveguide and the LN waveguide. Distortion occurs and the adhesive is easily peeled off.
- a difference in thermal expansion occurs between the PLC waveguide and the LN waveguide and the mount, and tensile stress is applied to the optical fiber.
- the tensile stress increases, the optical fiber breaks.
- the material of the mount (package) is made of stainless steel, for example, SUS303, and the difference in thermal expansion coefficient from LN is reduced, there is a large difference in thermal expansion coefficient between the PLC, optical fiber, etc. and the package material.
- Table 1 shows values of thermal expansion coefficients.
- a soft adhesive is used for the connection portion between the fiber alignment member and the PLC waveguide and the connection portion between the PLC waveguide and the LN waveguide in order to reduce thermal stress. Prevents peeling.
- FIG. 1B a method is employed in which the thermal stress applied to the optical fiber is relaxed by buckling the optical fiber.
- connection portion between the PLC waveguide and the fiber alignment member has a structure in which the end face is inclined to prevent reflection. Therefore, a buckling stress of the fiber is generated, and a component parallel to the connection surface between the PLC waveguide using the soft adhesive and the fiber alignment member is generated, and an optical axis shift (optical axis shift) occurs. ) (See FIG. 2).
- P b is a buckling stress applied from the fiber to the fiber alignment member, and is expressed by Expression (1).
- L is the fiber length
- E is the Young's modulus
- I is the cross-sectional secondary moment (a quantity representing the difficulty of deformation of the object with respect to the bending moment)
- d is the diameter
- the RZ-DQPSK module in which the PLC-LN chip composed of the PLC waveguide and the LN waveguide is attached to the mount has been described as an example, but a plurality of waveguide type optical elements having different thermal expansion coefficients are butt-connected. The same problem occurs with respect to the optical element chip.
- the present invention has been made in view of such problems, and the object thereof is to fix an optical element chip and an optical fiber in which a plurality of waveguide-type optical elements having different thermal expansion coefficients are butt-connected to a mount. In an optical component, it is in suppressing the fall of the reliability by a thermal stress.
- a first waveguide type optical element is butt-connected so as to be optically coupled to one end of the first waveguide type optical element.
- An optical element having a second waveguide type optical element having a thermal expansion coefficient different from that of the first waveguide type optical element, and a fiber alignment member butt-connected so as to be optically coupled to the second waveguide type optical element An optical component comprising a chip, a mount to which the optical element chip is attached, and an optical fiber aligned with the fiber alignment member and fixed in a buckled state, wherein the second waveguide type light
- the connection surface between the element and the fiber alignment member is an oblique structure
- the connection surface between the first waveguide type optical element and the second waveguide type optical element is a right angle structure, which is used for the connection surface of the oblique structure.
- the Young's modulus of the adhesive is higher than the Young's modulus of the adhesive to be used, suppresses the optical axis shift in the connection surface of the oblique structure due to the buckling stress of the optical fiber, and the connection surface of the right-angle structure
- the adhesive used in the step suppresses peeling of the adhesive surface between the first waveguide type optical element and the second waveguide type optical element due to thermal strain.
- the Young's modulus of the adhesive used for the connection surface of the oblique structure is 1 ⁇ 10 7 Pa or more, and the adhesive used for the connection surface of the right-angle structure The Young's modulus is less than 1 ⁇ 10 7 Pa.
- a difference in thermal expansion coefficient between the second waveguide type optical element and the fiber alignment member is the first waveguide type light. It is smaller than the difference in thermal expansion coefficient between the element and the second waveguide type optical element.
- the substrate of the first waveguide optical element is lithium niobate, indium phosphide, or KTN, and the second waveguide
- the substrate of the mold optical element is characterized by being quartz or silicon.
- connection surface is an oblique structure
- connection surface between waveguide optical elements is a right angle structure
- Young's modulus of the adhesive used for the connection surface of the oblique structure is higher than the Young's modulus of the adhesive used for the connection surface of the right angle structure.
- FIG. 1A is a top view of a conventional optical component.
- FIG. 1B is a cross-sectional view of the conventional optical component taken along line IB-IB.
- FIG. 2 is a diagram for explaining the buckling load of the optical fiber.
- FIG. 3 is a diagram illustrating an optical component according to an embodiment of the present invention.
- FIG. 4 is a diagram for explaining the angle of the optical waveguide at the connection surface between the LN waveguide and the PLC waveguide.
- FIG. 3 shows an optical component according to an embodiment of the present invention.
- the optical component 300 has many parts similar to those of the optical component 100 of FIG. 1, but the connection surface between the PLC waveguide and the LN waveguide and the connection surface between the PLC waveguide and the fiber alignment member are different.
- the optical component 300 includes an LN waveguide 311 (corresponding to a “first waveguide type optical element”) and a first PLC waveguide 312 (“first” waveguide connected to one end of the LN waveguide 311 so as to be optically coupled. 2), the second PLC waveguide 313 butt-connected so as to be optically coupled to the other end of the LN waveguide 311 and the first PLC waveguide 312 so as to be optically coupled.
- the optical element chip 310 having the fiber alignment member 314 butt-connected to the optical element chip 310, the mount 320 to which the optical element chip 310 is attached, and the optical fiber 330 aligned with the fiber alignment member 314.
- the LN waveguide 311 is fixed to the mount 320, but the first and second PLC waveguides 312 and 313 and the fiber alignment member 314 may be fixed.
- buckling load Pb is generated by buckling of the optical fiber 330, and the direction parallel to the connection surface between the first PLC waveguide 312 and the fiber alignment member 314, that is, the optical component 300 receives light.
- the optical axis deviation is suppressed by connecting with an adhesive having a high Young's modulus E (for example, 1 ⁇ 10 7 Pa or more).
- the fiber alignment member 314 is preferably made of a material that matches the thermal expansion coefficient of the first PLC waveguide 312 so that there is no difference in thermal expansion coefficient between both sides of the connection surface.
- Pyrex (registered trademark) glass may be used for the fiber alignment member 314.
- connection surface between the LN waveguide 311 and the first and second PLC waveguides 312 and 313 has a right-angle structure perpendicular to the optical axis direction. Since the connection surface between the first PLC waveguide 312 and the fiber alignment member 314 has a tilted structure, a weighting component parallel to the connection surface is generated. Disappear. In this case, it is preferable to connect with an adhesive (for example, less than 1 ⁇ 10 7 Pa) having a Young's modulus E lower than the connection surface between the first PLC waveguide 312 and the fiber alignment member 314.
- an adhesive for example, less than 1 ⁇ 10 7 Pa
- the thermal expansion coefficients of the LN waveguide 311 and the first and second PLC waveguides 312 and 313 are different, if an adhesive having a high Young's modulus E is used, the adhesive surface may peel off due to thermal strain. is there. In other words, when a difference in thermal expansion coefficient exists between both sides of the connection surface, it is preferable to use an adhesive having a lower Young's modulus as the difference increases.
- connection surface between the PLC waveguide and the LN waveguide may be inclined.
- the LN waveguide 311 and the optical waveguides of the first and second PLC waveguides 312, 313 may be designed so as to have a predetermined angle at the end face. Focusing on the interface between the first PLC waveguide 312 and the LN waveguide 311 will be described with reference to FIG. (1) First, the first angle ⁇ 1 is determined so that the Fresnel reflection R represented by the equation (2) is not coupled to the optical waveguide of the first PLC waveguide 312 as return light.
- the first angle ⁇ 1 is an angle of the optical waveguide included in the first PLC waveguide 312 with respect to the normal of the connection surface, and is generally 4 degrees to 12 degrees.
- n1 and n2 are the refractive indexes of the first PLC waveguide 312 and the LN waveguide 311 respectively.
- quartz or silicon can be used as the substrate of the first and second PLC waveguides 312 and 313.
- a waveguide type optical element formed on an indium phosphorus substrate or a KTN substrate may be used.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
Abstract
Description
Claims (4)
- 第1の導波路型光素子、前記第1の導波路型光素子の一端に光結合するように突き合わせ接続された、前記第1の導波路型光素子と熱膨張係数の異なる第2の導波路型光素子、及び前記第2の導波路型光素子に光結合するように突き合わせ接続されたファイバ整列部材を有する光素子チップと、
前記光素子チップが取り付けられたマウントと、
前記ファイバ整列部材に整列され、座屈された状態で固定された光ファイバと
を備える光部品であって、
前記第2の導波路型光素子と前記ファイバ整列部材との接続面を斜め構造、前記第1の導波路型光素子と前記第2の導波路型光素子との接続面を直角構造とし、
前記斜め構造の接続面に用いる接着剤のヤング率は、前記直角構造の接続面に用いる接着剤のヤング率よりも高く、
前記斜め構造の接続面に用いる接着剤は、前記光ファイバの座屈応力による前記斜め構造の接続面における光軸ずれを抑制し、
前記直角構造の接続面に用いる接着剤は、熱歪みによる前記第1の導波路型光素子と前記第2の導波路型光素子との接着面の剥離を抑制することを特徴とする光部品。 - 前記斜め構造の接続面に用いる接着剤のヤング率は、1×107Pa以上であり、
前記直角構造の接続面に用いる接着剤のヤング率は、1×107Pa未満であることを特徴とする請求項1に記載の光部品。 - 前記第2の導波路型光素子と前記ファイバ整列部材との間の熱膨張係数の差が、前記第1の導波路型光素子と前記第2の導波路型光素子との間の熱膨張係数の差よりも小さいことを特徴とする請求項2に記載の光部品。
- 前記第1の導波路型光素子の基板が、ニオブ酸リチウム、インジウムリン又はKTNであり、
前記第2の導波路型光素子の基板が、石英またはシリコンであることを特徴とする請求項2又は3に記載の光部品。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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CN201180038328.7A CN103052901B (zh) | 2010-08-06 | 2011-08-02 | 光学部件 |
US13/813,388 US8721191B2 (en) | 2010-08-06 | 2011-08-02 | Optical component |
CA2807122A CA2807122C (en) | 2010-08-06 | 2011-08-02 | Optical component |
Applications Claiming Priority (2)
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JP2010-177979 | 2010-08-06 | ||
JP2010177979A JP5319624B2 (ja) | 2010-08-06 | 2010-08-06 | 光部品 |
Publications (1)
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WO2012017644A1 true WO2012017644A1 (ja) | 2012-02-09 |
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Family Applications (1)
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PCT/JP2011/004375 WO2012017644A1 (ja) | 2010-08-06 | 2011-08-02 | 光部品 |
Country Status (5)
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US (1) | US8721191B2 (ja) |
JP (1) | JP5319624B2 (ja) |
CN (1) | CN103052901B (ja) |
CA (1) | CA2807122C (ja) |
WO (1) | WO2012017644A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013161299A1 (ja) * | 2012-04-25 | 2013-10-31 | 日本電信電話株式会社 | 光モジュール |
JP2013238741A (ja) * | 2012-05-15 | 2013-11-28 | Nippon Telegr & Teleph Corp <Ntt> | 光モジュール |
JP2015075632A (ja) * | 2013-10-09 | 2015-04-20 | 三菱電機株式会社 | 光源装置 |
US9678288B2 (en) | 2013-07-10 | 2017-06-13 | Photonics Electronics Technology Research Association | Optical circuit |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201350357A (zh) * | 2012-03-21 | 2013-12-16 | Toppan Printing Co Ltd | 感熱轉印記錄媒體、其製造方法及感熱轉印記錄方法 |
US9473239B2 (en) * | 2013-08-22 | 2016-10-18 | Corning Cable Systems Llc | Systems and methods for aligning an optical interface assembly with an integrated circuit |
JP6556620B2 (ja) * | 2015-12-25 | 2019-08-07 | アズビル株式会社 | 圧力センサ |
WO2020024284A1 (en) | 2018-08-03 | 2020-02-06 | Lumentum Operations Llc | Laser welding for planar lightwave circuit–fiber packaging |
JP2022135003A (ja) * | 2021-03-04 | 2022-09-15 | 住友電気工業株式会社 | 光コネクタケーブル |
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2010
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-
2011
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- 2011-08-02 US US13/813,388 patent/US8721191B2/en active Active
- 2011-08-02 CA CA2807122A patent/CA2807122C/en active Active
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013161299A1 (ja) * | 2012-04-25 | 2013-10-31 | 日本電信電話株式会社 | 光モジュール |
JP5759622B2 (ja) * | 2012-04-25 | 2015-08-05 | 日本電信電話株式会社 | 光モジュール |
US9297961B2 (en) | 2012-04-25 | 2016-03-29 | Nippon Telegraph And Telephone Corporation | Optical module |
JP2013238741A (ja) * | 2012-05-15 | 2013-11-28 | Nippon Telegr & Teleph Corp <Ntt> | 光モジュール |
US9678288B2 (en) | 2013-07-10 | 2017-06-13 | Photonics Electronics Technology Research Association | Optical circuit |
JP2015075632A (ja) * | 2013-10-09 | 2015-04-20 | 三菱電機株式会社 | 光源装置 |
Also Published As
Publication number | Publication date |
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JP5319624B2 (ja) | 2013-10-16 |
CA2807122A1 (en) | 2012-02-09 |
JP2012037731A (ja) | 2012-02-23 |
CN103052901A (zh) | 2013-04-17 |
CA2807122C (en) | 2015-06-09 |
US8721191B2 (en) | 2014-05-13 |
CN103052901B (zh) | 2015-04-08 |
US20130136393A1 (en) | 2013-05-30 |
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