WO2012011410A1 - 機能部品の製造方法及び機能部品 - Google Patents

機能部品の製造方法及び機能部品 Download PDF

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Publication number
WO2012011410A1
WO2012011410A1 PCT/JP2011/065864 JP2011065864W WO2012011410A1 WO 2012011410 A1 WO2012011410 A1 WO 2012011410A1 JP 2011065864 W JP2011065864 W JP 2011065864W WO 2012011410 A1 WO2012011410 A1 WO 2012011410A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder
ceramic substrate
solder foil
saw filter
cap
Prior art date
Application number
PCT/JP2011/065864
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
信一 埜本
鈴木　道雄
Original Assignee
千住金属工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 千住金属工業株式会社 filed Critical 千住金属工業株式会社
Priority to CN201180035099.3A priority Critical patent/CN103003935B/zh
Publication of WO2012011410A1 publication Critical patent/WO2012011410A1/ja

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a method of manufacturing a functional part and a functional part in which a lid is covered on a functional element fixed to a ceramic substrate for sealing.
  • solder is previously attached to the entire inner surface of a cap, which is an example of a lid, and the functional element die-bonded to the substrate is covered with the cap and heated to melt the solder on the inner surface of the cap.
  • the cap and the substrate are soldered to seal the functional element (see, for example, Patent Document 1).
  • the solder used at this time is a sealing solder, for example, a high temperature solder having a melting point of 260 degrees or more.
  • the high temperature solder is used because the functional element is sealed and then mounted on a printed circuit board or the like. That is, for solder for mounting a functional element on a printed circuit board, for example, Sn-3.0% Ag-0.5% Cu solder whose melting point is about 220 ° C. is generally used, and Sn-3.0% instead of high temperature solder for sealing When Ag-0.5% Cu solder is used, when the functional element is mounted on a printed circuit board, the solder is remelted.
  • the cap used for sealing is formed by attaching a sealing solder to a metal hoop substrate in advance, and then drawing it at the same time as punching by press processing or prior to press punching to form the shape of the cap Molding.
  • the sealing solder should be able to withstand drawing.
  • Bi-Sn-based solder which is a sealing solder (here, Bi-Sn-based solder means a solder composed of Bi and Sn, or a solder composed of Bi and Sn, Ag, Cu, Fe, Ni , Co, Sb, In, and Zn), which are hard and brittle, can crack or peel off from the cap due to drawing, because they are hard and brittle. There is sex. If cracking or peeling from the cap occurs, the amount of solder adhering to the cap may be reduced to form a gap between the cap and the substrate, which may cause sealing failure.
  • the present invention solves such problems, and it is possible to reliably shield (seal) a functional element from the outside using lead-free solder, and to manufacture a functional component having excellent productivity.
  • the purpose is to provide methods and functional parts.
  • the present inventors do not attach a Bi-Sn-based high-temperature solder to a metal hoop substrate in advance, but combine a cap whose surface is surface-treated and a foil-shaped Bi-Sn-based solder. It has been found that the desired sealing can be realized.
  • the method of manufacturing a functional component according to the present invention comprises: a first step of fixing a predetermined number of functional elements surrounded by the electrode portion on a ceramic substrate having an electrode portion formed at a predetermined position; and exposing the functional element A second step of forming a solder foil provided with a predetermined number of opening holes in a ceramic substrate, a third step of covering a functional element exposed by the opening holes of the solder foil with a lid opened at the bottom, And (4) heating the solder foil to a temperature higher than the melting temperature while pressing it toward the ceramic substrate.
  • a predetermined number of functional elements surrounded by the electrode portion are fixed to the ceramic substrate having the electrode portions formed at predetermined positions, and the fixed functional elements are exposed.
  • a solder foil provided with an open hole is formed on the ceramic substrate, the functional element exposed by the open hole of the solder foil is covered with a lid opened at the lower side, and the lid is pressed against the ceramic substrate, It heats above the temperature which solder foil fuses.
  • the solder foil is composed of Bi—Sn-based solder.
  • the molten solder foil gathers on the electrode portion formed on the ceramic substrate, and the ceramic substrate and the lid are fixed and can be soldered.
  • a first step of fixing a predetermined number of functional elements surrounded by the electrode portion on a ceramic substrate having the electrode portion formed at a predetermined position, and exposing the functional element A second step of forming a solder foil provided with a number of opening holes in the ceramic substrate, a third step of covering the functional element exposed by the opening holes of the solder foil with a lid opened at the bottom, It manufactures at the 4th process of heating above the temperature which solder foil fuses, pressurizing to a ceramic substrate.
  • the method for producing a functional part and the functional part according to the present invention even if hard and brittle Bi-Sn solder is used for the solder for bonding the ceramic substrate and the lid, the conventional crack is generated in the solder. No peeling from the cap occurs. As a result, a reduction in the amount of solder attached to the cap can be prevented, and a functional component with excellent productivity can be provided in which the functional element is shielded (sealed) from the outside.
  • FIG. 1 is a front cross-sectional view showing a configuration example of a SAW filter device 1; It is an explanatory view showing the manufacture example (the 1) of solder foil 5. It is an explanatory view showing the manufacture example (the 2) of solder foil 5.
  • FIG. 7 is an exploded perspective view showing a production example (No. 1) of the SAW filter device 1; It is a disassembled perspective view which shows the manufacture example (the 2) of SAW filter apparatus 1.
  • FIG. 18 is an exploded perspective view showing a production example (No. 3) of the SAW filter device 1;
  • a SAW filter device 1 which is an example of a functional component according to the present embodiment includes a ceramic substrate 2, a SAW filter element 3 which is an example of a functional element, a cap 4 which is an example of a lid, and a solder foil. It consists of five.
  • the SAW filter device 1 bites and fixes the foil-shaped solder foil 5 composed of lead-free solder between the ceramic substrate 2 and the cap 4 without forming the solder in advance in the cap, as in the prior art There are no cracks in the solder from the cap 4.
  • the SAW filter device 1 can shield (seal) the SAW filter element 3 from the outside using lead-free solder, and can prevent sealing failure caused by cracks in the solder.
  • the ceramic substrate 2 is made of a ceramic that is an electrically insulating material that can withstand the heating temperature at the time of melting the solder.
  • the ceramic is, for example, a material such as alumina, aluminum nitride, mullite and glass ceramic.
  • Electrode portions 2 a and 2 b are formed at predetermined positions on the surface of ceramic substrate 2.
  • the electrode portions 2a and 2b are formed, for example, by metalizing with a high melting point metal such as W or Mo, and then performing Ni plating and Au plating.
  • the electrode portion 2 a is formed so as to surround the periphery of the SAW filter element 3, and is for joining the ceramic substrate 2 and the cap 4.
  • the electrode portion 2 b is formed at a fixed position of the SAW filter element 3 and becomes a ground electrode of the SAW filter element 3.
  • the SAW filter element 3 is mounted on the ceramic substrate 2 by ultrasonic vibration or the like.
  • the SAW filter element 3 is also called a surface acoustic wave element, has a function of transmitting only radio waves of a predetermined frequency, and is used to remove noise that is a frequency component other than the frequency.
  • the solder foil 5 is formed on the ceramic substrate 2.
  • the solder foil 5 has a foil shape with a thickness of about 30 ⁇ m, is a lead-free solder, and is made of a Bi—Sn-based high-temperature solder.
  • the solder foil 5 is composed of 90% or more of Bi and the remainder of Sn, or 90% or more of Bi and 5% or less of Sn, and the remainder is Ag, Cu, Fe, Ni, Co, Sb, In, and Zn. And one or more of them.
  • the solder foil 5 is provided with a plurality of opening holes 5 a described later in FIG. 4.
  • the opening 5 a is slightly larger than the outer shape of the SAW filter 3 for exposing the SAW filter 3 (for example, the size of the opening 5 a may be the same size as the inner periphery of the electrode portion 2 a When the distance between the inner periphery and the outer periphery of the electrode portion 2a is a width, it may be a size that extends from the inner periphery of the electrode portion 2a to about 1/3 of the width.
  • the molten solder foils 5 are opened so as to be gathered only at the flanges at the outer peripheral portion. Incidentally, in the SAW filter device 1 of FIG. 1, the solder foil 5 is melted and soldered, so it is not exactly a foil shape.
  • the cap 4 is a lid (functional device lid) for the SAW filter device which is opened at the lower side and covers the SAW filter device 3. Further, a flange is provided on the outer peripheral portion of the cap 4, and the flange abuts on the solder foil 5. An electrode portion 2 a is formed below the solder foil 5, and the cap 4 is bonded to the ceramic substrate 2 via the electrode portion 2 a and the solder foil 5 to seal the SAW filter element 3.
  • the size of the cap 4 is about 2 mm in length, about 3 mm in width, about 0.5 mm in height, and less than 0.1 mm in thickness.
  • the cap 4 squeezes a flat plate which has been subjected to surface treatment (treatment to prevent surface oxidation) to make it easy to attach molten solder, and then punched out to a predetermined size, as shown in FIG. It forms in a shape like FIG. 6 mentioned later.
  • the material used for the cap 4 preferably has a thermal expansion coefficient close to that of the ceramic substrate 2.
  • 42 alloy Fe-42 Ni alloy
  • 45 alloy Fe-45 Ni alloy
  • Kovar Fe-29 Ni-17 Co alloy
  • the SAW filter device 1 configured as above seals the SAW filter element 3 by soldering the electrode portion 2a formed on the ceramic substrate 2 and the cap 4 with the solder foil 5 in a foil shape.
  • the SAW filter device 1 can prevent a reduction in the amount of solder adhering to the cap, and shield the SAW filter element 3 from the outside, thereby preventing sealing defects caused by cracks in the solder. .
  • solder foil manufacturing apparatus 50 includes a nozzle 51, a heater 52, a roller 53 and a scraper 54. These constituent members are accommodated in the solder foil manufacturing apparatus 50.
  • the nozzle 51 has a discharge part 51b discharging the molten solder at one end, and an intake part 51a taking in an inert gas such as solder, argon gas or nitrogen gas at the other end.
  • the nozzle 51 is made of, for example, a heat-resistant material such as quartz glass.
  • the discharge part 51b of the nozzle 51 has a narrowed shape, it is not limited to this.
  • a heater 52 is provided in the vicinity of the discharge portion 51 b of the nozzle 51.
  • the heater 52 heats and melts the solder introduced into the nozzle 51. Therefore, the heater 52 has a heating capacity equal to or higher than the melting point of the solder.
  • a high frequency heating device, a halogen heater or the like can be mentioned.
  • a roller 53 is provided below the nozzle 51 and the heater 52.
  • the roller 53 rotates around the shaft 53a.
  • the roller 53 is made of a material having good thermal conductivity, and is made of, for example, copper or the like.
  • the roller 53 has a forming surface 53 b for forming the solder foil 5 on the outer peripheral surface. In order to make the thickness of the solder foil 5 constant, the formation surface 53 b is almost uniform without unevenness.
  • a scraper 54 is provided on the forming surface 53 b of the roller 53.
  • the scraper 54 is for scraping off the solder foil 5 generated on the forming surface 53 b with its tip 54 a.
  • the forming surface 53b and the scraper 54 are very close but not in contact with each other. The reason is that if the forming surface 53b and the scraper 54 come in contact with each other, the forming surface 53b may be damaged or the scraper 54 may be damaged, making it impossible to form the solder foil 5 of uniform thickness. It depends.
  • solder foil manufacturing apparatus 50 is depressurized and filled with an inert gas such as argon gas or nitrogen gas, and the Bi—Sn solder put into the intake portion 51 a of the nozzle 51 stands by in the vicinity of the discharge portion 51 b. It assumes that you are doing.
  • an inert gas such as argon gas or nitrogen gas
  • the roller 53 is rotated at high speed at a predetermined speed counterclockwise.
  • the heater 52 is turned on to heat the nozzle 51, and the solder in the nozzle is melted into a molten solder state.
  • the nozzle 51 is rapidly lowered to a predetermined position on the roller 53, and an inert gas of a predetermined flow rate is ejected from the intake portion 51a. Then, the molten solder waiting on the nozzle 51 is discharged from the discharge part 51b onto the roller 53 by being pushed by the inert gas from the intake part 51a, and forms a molten solder in a bowl shape called paddle 5b. Do.
  • the paddle 5b forms the solder foil 5 as shown in FIG. 3 continuously while rapidly cooling and solidifying the formation surface 53b of the roller 53 rotating at high speed.
  • the thickness of the solder foil 5 is determined by the pressure of the inert gas ejected to the intake portion 51 a of the nozzle 51 and the rotational speed of the roller 53.
  • the solder foil 5 formed on the forming surface 53 b reaches the scraper 54 by the rotation of the roller 53.
  • the roller 53 is made of a material having good thermal conductivity, it is cooled and becomes a foil-shaped solid.
  • the solder foil 5 that has reached the scraper 54 is scraped off by the tip end 54 a of the scraper 54 and collected in a not-shown solder foil recovery unit at the other end of the scraper 54.
  • the same number as the number of the SAW filter elements 3 fixed to the ceramic substrate 2 is used to form the opening holes 5a shown in FIG.
  • the solder foil 5 according to the invention is completed.
  • the electrode portion 2 a is formed on the ceramic substrate 2, and a predetermined number of SAW filter elements 3 are fixed to the ceramic substrate 2 by being surrounded by the electrode portion 2 a. It is assumed that a predetermined number of opening holes 5a for exposing the elements 3 are provided. Further, in order to solder the ceramic substrate 2 and the cap 4 without using a flux, the atmosphere is a low oxygen concentration atmosphere. Incidentally, the electrode portion 2a formed in the ceramic substrate 2, the SAW filter element 3 fixed in the ceramic substrate 2, and the opening hole 5a formed in the solder foil 5 are shown in FIGS. The number of has been omitted.
  • the solder foil 5 is placed from above on the ceramic substrate 2 on which the SAW filter element 3 is fixed at a predetermined position. At this time, the ceramic substrate 2 and the solder foil 5 are positioned so that the SAW filter element 3 is exposed from the opening 5 a of the solder foil 5. Thereby, the solder foil 5 is formed on the ceramic substrate 2.
  • each of the SAW filter elements 3 of the ceramic substrate 2 on which the solder foil 5 is placed is covered with a cap 4 whose lower side is opened.
  • the pressure device 60 is lowered from above the cap 4, and while heating the cap 4 toward the ceramic substrate (in the direction of the arrow), heating is performed at a temperature higher than the melting temperature of the solder foil.
  • This heating may be performed by a conveyor-type reflow furnace or a batch-type heating furnace.
  • the heating temperature is set to be equal to or higher than the melting point of the high temperature solder (in this example, the heating temperature is set to about 350 ° C.) because the solder foil is formed of a Bi—Sn based high temperature solder.
  • the solder foil 5 When the solder foil 5 is heated, it will be in a molten solder state. The molten solder hardly gets wet to the ceramic substrate 2, and thus gathers to the electrode portion 2 a without being soldered to the ceramic substrate 2. Therefore, even if the size of the opening 5a of the solder foil 5 is not the same size as the inner circumference of the electrode section 2a, when the distance between the inner circumference and the outer circumference of the electrode section 2a is a width, It may be a size that extends from the inner periphery to about 1/3 of the width.
  • the ceramic substrate 2 and the cap 4 are fixed by the solder foil 5 (molten solder) through the electrode portion 2a, and sealing can be performed.
  • the SAW filter device 1 After sealing the SAW filter element 3 with the cap 4, various inspections (inspection of sealing, electrical inspection, etc.) are carried out, and dicing into individual pieces, the SAW filter device 1 is completed.
  • the ceramic substrate 2 in which the electrode portions 2a and 2b are formed at predetermined positions is surrounded by the electrode portions 2a and the predetermined number of SAWs
  • the filter element 3 is fixed, and a solder foil 5 provided with a predetermined number of opening holes 5a for exposing the fixed SAW filter element 3 is formed (placed) on the ceramic substrate 2, and the opening holes 5a of the solder foil 5 are formed.
  • the SAW filter element 3 exposed by the above is covered with a cap 4 opened at the lower side, and while pressing the cap 4 toward the ceramic substrate 2, heating is performed at a temperature at which the solder foil 5 melts.
  • the molten solder foil 5 gathers on the electrode portion 2a formed on the ceramic substrate 2, and the ceramic substrate 2 and the cap 4 are fixed and can be soldered.
  • the SAW filter device 1 As described above, according to the SAW filter device 1 according to the present embodiment, even if hard and brittle Bi-Sn solder is used for the solder for fixing the ceramic substrate 2 and the cap 4 as in the related art. Crack does not occur and peeling from the cap 4 does not occur. As a result, it is possible to prevent the amount of the solder attached to the cap 4 from being reduced, and to provide a functional component with excellent productivity in which the SAW filter element 3 is shielded (sealed) from the outside.
  • the functional element is described as the SAW filter element in the present embodiment, the present invention is not limited to this, and can be applied to a quartz oscillator, an IC chip, and the like.
  • SAW filter device functional parts
  • 2 ceramic substrate 2a 2b electrode part 3
  • SAW filter element functional element
  • DESCRIPTION OF SYMBOLS 4 cap 5 solder foil 5a opening hole 5b paddle 50 solder foil manufacturing apparatus 51 nozzle 52 heater 53 roller 54 scraper 60 pressurization apparatus

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
PCT/JP2011/065864 2010-07-20 2011-07-12 機能部品の製造方法及び機能部品 WO2012011410A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201180035099.3A CN103003935B (zh) 2010-07-20 2011-07-12 功能部件的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010163266A JP5459127B2 (ja) 2010-07-20 2010-07-20 機能部品の製造方法及び機能部品
JP2010-163266 2010-07-20

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Publication Number Publication Date
WO2012011410A1 true WO2012011410A1 (ja) 2012-01-26

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JP (1) JP5459127B2 (zh)
CN (1) CN103003935B (zh)
TW (1) TWI550781B (zh)
WO (1) WO2012011410A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10378731B2 (en) 2015-10-09 2019-08-13 Signify Holding B.V. Lighting system and a method of generating a light output

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002210552A (ja) * 2001-01-15 2002-07-30 Senju Metal Ind Co Ltd 部分はんだ付着金属片の製造方法
JP2010021563A (ja) * 2003-02-06 2010-01-28 Neomax Material:Kk 気密封止用キャップおよびその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1269612C (zh) * 2000-12-21 2006-08-16 株式会社日立制作所 焊锡箔、半导体器件、电子器件、半导体组件及功率组件
JP3960156B2 (ja) * 2002-07-19 2007-08-15 千住金属工業株式会社 板状基板封止用リッドの製造方法
CN1291069C (zh) * 2003-05-31 2006-12-20 香港科技大学 微细间距倒装焊凸点电镀制备方法
JP2005286279A (ja) * 2004-03-03 2005-10-13 Takara Seisakusho:Kk 樹脂封止装置
JP4723540B2 (ja) * 2007-07-04 2011-07-13 アキム株式会社 電子部品パッケージ製造方法
JP5194326B2 (ja) * 2008-12-27 2013-05-08 千住金属工業株式会社 Ｂｉ−Ｓｎ系リール巻きはんだ線およびはんだ線の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002210552A (ja) * 2001-01-15 2002-07-30 Senju Metal Ind Co Ltd 部分はんだ付着金属片の製造方法
JP2010021563A (ja) * 2003-02-06 2010-01-28 Neomax Material:Kk 気密封止用キャップおよびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10378731B2 (en) 2015-10-09 2019-08-13 Signify Holding B.V. Lighting system and a method of generating a light output

Also Published As

Publication number Publication date
CN103003935B (zh) 2015-11-25
CN103003935A (zh) 2013-03-27
TWI550781B (zh) 2016-09-21
JP2012028414A (ja) 2012-02-09
JP5459127B2 (ja) 2014-04-02
TW201205727A (en) 2012-02-01

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