JP4494849B2 - パッケージ用ロー材付き封着板およびその製造方法 - Google Patents
パッケージ用ロー材付き封着板およびその製造方法 Download PDFInfo
- Publication number
- JP4494849B2 JP4494849B2 JP2004116650A JP2004116650A JP4494849B2 JP 4494849 B2 JP4494849 B2 JP 4494849B2 JP 2004116650 A JP2004116650 A JP 2004116650A JP 2004116650 A JP2004116650 A JP 2004116650A JP 4494849 B2 JP4494849 B2 JP 4494849B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing material
- sealing plate
- package
- sealing
- flow prevention
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 title claims description 177
- 238000005219 brazing Methods 0.000 title claims description 167
- 238000007789 sealing Methods 0.000 title claims description 87
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 230000004927 fusion Effects 0.000 claims description 37
- 230000002265 prevention Effects 0.000 claims description 36
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 8
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 claims description 7
- 238000001953 recrystallisation Methods 0.000 claims description 7
- 230000003746 surface roughness Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 16
- 239000000919 ceramic Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000013078 crystal Substances 0.000 description 9
- 229910000833 kovar Inorganic materials 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000003405 preventing effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
図3〜図6は本発明によるパッケージ用ロー材付き封着板の製造方法を説明するための概略工程図である。図3は本発明で使用する封着板の材料であるコバール材の帯材の部分上面図と側面図である。帯材40の厚さは封着板の必要な厚さと同じ(例えば0.1mm)である。まず、この帯材40が準備される。
2 水晶片
3 蓋体(封着板)
4 セラミック基板
5 内部配線
6 配線層
7 導電ペースト
8 配線層
9 メタライズ層
10 接合層(ロー材)
11 内部空間
20 金属製基板
21 封着板
22 連結バー
23 外周フレーム
24 位置決め穴
25 ロー材
30 封着板
30a ロー材流れ防止帯
30b ロー材流れ防止帯
30c ロー材融着部
30d 溝
30e 溝
30f 粗面
40 帯材
41 搬送位置決めよう穴
42 リング状ロー材
Claims (4)
- 平板状の封着板の封着面にリング状にロー材を融着するパッケージ用ロー材付き封着板であって、該パッケージ用ロー材付き封着板のリング状ロー材融着部の内周、又は内周及び外周に、粗面又は溝からなるロー材流れ防止帯を備え、前記リング状ロー材融着部を平滑面としたことを特徴とするパッケージ用ロー材付き封着板。
- 前記ロー材の融着温度は、前記封着板の再結晶温度より低いことを特徴とする請求項1記載のパッケージ用ロー材付き封着板。
- 前記ロー材は金−錫合金であり、前記封着板のリング状ロー材融着部の表面粗さは凹凸の平均間隔Smが35μmであり、前記ロー材流れ防止帯は粗面であって、該粗面の表面粗さは凹凸の平均間隔Smが40μm〜50μmであることを特徴とする請求項1または2に記載のパッケージ用ロー材付き封着板。
- 少なくとも、平板状の封着板のリング状ロー材融着部の内周及び外周に粗面又は溝からなるロー材流れ防止帯を形成する工程と、該ロー材流れ防止帯を形成した前記封着板のリング状ロー材融着部にロー材を形成又は載置する工程と、前記封着板の再結晶温度より低い融着温度で該ロー材を前記封着板に融着する工程と、を有することを特徴とするパッケージ用ロー材付き封着板の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004116650A JP4494849B2 (ja) | 2004-04-12 | 2004-04-12 | パッケージ用ロー材付き封着板およびその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004116650A JP4494849B2 (ja) | 2004-04-12 | 2004-04-12 | パッケージ用ロー材付き封着板およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005302990A JP2005302990A (ja) | 2005-10-27 |
JP4494849B2 true JP4494849B2 (ja) | 2010-06-30 |
Family
ID=35334135
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004116650A Expired - Lifetime JP4494849B2 (ja) | 2004-04-12 | 2004-04-12 | パッケージ用ロー材付き封着板およびその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4494849B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4947618B2 (ja) * | 2005-12-19 | 2012-06-06 | エヌイーシー ショット コンポーネンツ株式会社 | 電子部品用パッケージ |
US7790988B2 (en) | 2006-02-15 | 2010-09-07 | Neomax Materials Co., Ltd. | Hermetic sealing cap, electronic component accommodation package, and method for producing hermetic sealing cap |
JP2008193581A (ja) * | 2007-02-07 | 2008-08-21 | Epson Toyocom Corp | 圧電振動子及びその製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01174939U (ja) * | 1988-05-31 | 1989-12-13 | ||
JPH0395657U (ja) * | 1990-01-17 | 1991-09-30 | ||
JPH1167946A (ja) * | 1997-08-21 | 1999-03-09 | Ngk Spark Plug Co Ltd | 電子部品パッケージ用金属製リッド基板、金属製リッド及びその製造方法 |
JP2001148438A (ja) * | 1999-11-22 | 2001-05-29 | Ngk Spark Plug Co Ltd | 金属蓋及びパッケージ |
-
2004
- 2004-04-12 JP JP2004116650A patent/JP4494849B2/ja not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01174939U (ja) * | 1988-05-31 | 1989-12-13 | ||
JPH0395657U (ja) * | 1990-01-17 | 1991-09-30 | ||
JPH1167946A (ja) * | 1997-08-21 | 1999-03-09 | Ngk Spark Plug Co Ltd | 電子部品パッケージ用金属製リッド基板、金属製リッド及びその製造方法 |
JP2001148438A (ja) * | 1999-11-22 | 2001-05-29 | Ngk Spark Plug Co Ltd | 金属蓋及びパッケージ |
Also Published As
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JP2005302990A (ja) | 2005-10-27 |
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