WO2011155115A1 - 接続構造およびその製造方法 - Google Patents

接続構造およびその製造方法 Download PDF

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Publication number
WO2011155115A1
WO2011155115A1 PCT/JP2011/002345 JP2011002345W WO2011155115A1 WO 2011155115 A1 WO2011155115 A1 WO 2011155115A1 JP 2011002345 W JP2011002345 W JP 2011002345W WO 2011155115 A1 WO2011155115 A1 WO 2011155115A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead
connection
metal body
ultrasonic
connection structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2011/002345
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
伸一 藤原
薫 内山
時人 諏訪
雅彦 浅野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Astemo Ltd
Original Assignee
Hitachi Automotive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Publication of WO2011155115A1 publication Critical patent/WO2011155115A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/029—Welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment

Definitions

  • This invention relates to the connection structure which connects the lead
  • One of the main electronic components is a coil, which is an essential component for high-frequency circuits and switching power supplies.
  • the coil is mainly made of a cylindrical metal wire, and the coil is connected to the wiring on the board by passing both ends of the coil through a through-hole formed in the board, and connecting the wiring on the board and the coil end. Often soldered.
  • FIG. 10 shows an example of the connection between the coil and the wiring on the substrate. 11 is a pad on the substrate, 12 is a substrate, 13 is solder, and 21 is a coil. In this soldering method, first, the end portion of the coil 21 is inserted and fixed in the through hole of the substrate 12 in which the pad 11 on the substrate is formed.
  • soldering is completed by taking it out from the soldering apparatus and cooling it.
  • soldering may be performed manually. As described above, soldering is performed by melting and connecting the solder while holding the coil so that it does not leave the through-hole. Therefore, soldering must be performed while holding the coil. The problem is that it needs to be formed. In this connection method, soldering may be performed by a thermal process, which is considered to have a large environmental load, and development of a soldering alternative technology is urgent.
  • connection by conductive resin can be made at a temperature lower than the soldering temperature.
  • the caulking contact connection is a mechanical contact connection, and thus can be realized at room temperature.
  • the conductive resin connection requires a heat load and a high connection resistance, and the contact connection has a high contact resistance and requires a caulking member.
  • the ultrasonic connection is a method in which a member to be connected is metal-connected at room temperature with energy by ultrasonic waves and pressure, and a low resistance room temperature connection can be realized.
  • Patent Document 1 As a method for connecting a wiring and a pad on a substrate using ultrasonic waves, in Patent Document 1, a plurality of bumps are formed on a conductive pattern in advance, wiring is placed so as to be sandwiched between the bumps, and then applied from above. There has been proposed a method of connecting a wiring and a conductive pattern by applying ultrasonic waves while pressing. In addition, as a method of connecting the printed circuit board electrode and the metal terminal, Patent Document 2 discloses that the printed circuit board electrode formed on the printed circuit board end is sandwiched from above and below by the metal terminal formed on the flexible substrate, and ultrasonic waves are applied to the sandwiched portion. There has been proposed a method of metal-connecting an electrode on a printed circuit board and a metal substrate by applying. These methods are examples in which metal connection at room temperature, which is a feature of ultrasonic connection, is proposed.
  • a metal on the ultrasonic tool side for example, a cylindrical metal wire, metal A
  • a metal on the anvil side for example, a pad on the substrate, metal B
  • the tip of the ultrasonic connection tool is provided with a protrusion for preventing slippage between the ultrasonic tool and the metal A during ultrasonic vibration. Since the protrusion is hard to get into the metal A, the metal A is held so as to follow the movement of the ultrasonic tool.
  • the curved surface is pressed by the protrusion at the tip of the ultrasonic tool, so that the contact position varies, and the position shift and the metal wire move. If misalignment occurs, there is a concern about the effect on connection reliability.
  • the area where the metal body contacts the ultrasonic tool at the start of ultrasonic connection It was larger than the contact area.
  • the ultrasonic tool contacts the metal body with a large area, the displacement and rotation of the metal column during pressurization can be suppressed, and the contact area between the metal body and the conductor layer is small.
  • the power tends to concentrate on the contact portion, and the connection can be made with less energy.
  • reed and electrode concerning one Example of this invention It is a schematic diagram of the Example of an ultrasonic connection to the coil concerning one Example of this invention. It is a schematic diagram of the Example of an ultrasonic connection to the coil concerning one Example of this invention. It is an enlarged view of the lead tip before ultrasonic connection concerning one example of the present invention. It is an enlarged view of the lead tip after ultrasonic connection concerning one example of the present invention.
  • FIG. 1 shows a connection form of a coil 21 and a substrate 12 according to an embodiment of the present invention.
  • the coil 21 is formed by winding a lead and has two leads 1 for electrical and mechanical connection to the substrate.
  • a plurality of electrode pads 11 made of a conductor layer are formed on the substrate 12, and the lead 1 is bent about 90 degrees, and the side surfaces thereof are connected to the electrode pads 11 by ultrasonic connection.
  • connection method between the coil and the substrate according to this embodiment will be described with reference to FIGS. 1 and 2A and 2B.
  • the coil 21 is placed on the substrate such that the side surface of the lead 1 faces the electrode pad 11.
  • an ultrasonic tool 20 is prepared.
  • the ultrasonic tool 20 is pressed from the lead 1 to the electrode pad 11 side while applying a force.
  • the lead 1 and the metal of the electrode pad 11 are rubbed together to remove the surface oxide film and the like on the contact surface, and the new metal surface comes into contact.
  • the coil 21 and the substrate 12 are connected.
  • FIG. 3A, FIG. 4A, and FIG. 5A are diagrams showing a state before connection.
  • Reference numeral 1 denotes a lead
  • 3 denotes a processed portion on the lead
  • 11 denotes an electrode pad
  • 20 denotes an ultrasonic tool.
  • the lead 1 is disposed on the electrode pad 11. At this time, the electrode pad 11 and the side surface of the cylindrical portion of the lead 1 are in contact.
  • Processing is performed on the side surface portion of the lead opposite to the contact portion to form a processed portion 3 on the lead.
  • the on-lead processed portion 3 is processed so that the vibration surface of the ultrasonic tool 20 has a larger area than the region in contact with the lead 1.
  • the processed surface shape of the R-soil processed portion 3 is a flat surface, it is not limited to a flat surface, and there are some irregularities on a substantially flat surface, or other portions (particularly a contact surface that contacts the electrode pad 11). It may be a curved surface with a smaller curvature.
  • press processing, cutting, blasting, or the like is performed from the lead 1 having a circular cross section, or the cross section is partially cut to have a circular shape so as to have the processed portion on the lead.
  • the lead 1 may be cast, but any method may be used as long as the above-mentioned processed portion 3 on the lead is formed.
  • the ultrasonic tool 20 is pressed against the processed area 3 on the lead, and the lead 1 and the electrode pad 11 are connected by applying ultrasonic waves.
  • the protrusion formed on the vibration surface of the ultrasonic tool 20 increases the restraining force of the lead 1 when applying ultrasonic waves, and concentrates the ultrasonic power on the connection surface.
  • FIG. 4B is a schematic cross-sectional view of the connecting portion when the lead 1 being connected is viewed from the tip direction of the lead, but as shown in FIG. 5B, on the lead where the ultrasonic tool 20 is in contact.
  • the processing point 3 is deformed following the shape of the tip protrusion of the ultrasonic tool 20 and suppresses slippage between the ultrasonic tool 20 and the lead 1 when an ultrasonic wave is applied. Further, the lead 1 is crushed in the thickness direction by pressurization.
  • the contact surface 30 is rubbed at the initial contact location, so that the surface oxide film and the like on the contact surface between the lead 1 and the substrate pad 11 are removed, and the metal newly connected surface comes into contact with the metal.
  • the connection surface 30 spreads from the initial connection surface toward the side surface of the lead 1 as the lead 1 is deformed as the ultrasonic wave is applied and pressurized.
  • 3 (b), 4 (c), and 5 (c) are external views of the lead 1 and the electrode 10 after connection.
  • a trace of the shape of the tip of the ultrasonic tool 20 remains in the pressurized part 2 on the lead pressed by the ultrasonic tool 20 in the processed part 3 on the lead.
  • Most of the upper machining location 3 remains the initial machining surface.
  • the lead 1 and the electrode 10 are connected by ultrasonic connection.
  • FIG. 6 (a) and 6 (b) are diagrams for explaining conventional ultrasonic connection.
  • a lead 1a having a circular cross section or a square lead 1b has been used.
  • FIG. 6A is a diagram showing connection in the case of the lead 1a having a circular cross section.
  • the pressure contact surface of the ultrasonic tool 20 and the surface where the lead 1 is initially contacted are curved surfaces, so that the initial contact area between the ultrasonic tool 20 and the lead 1 is large. Get smaller. Therefore, when pressure is applied, stress is applied as shown by the arrows in the figure, and there is a high possibility that the lead 1 is displaced or rotated with respect to the electrode 11.
  • connection area between the lead 1 and the electrode 10 varies, so that the connection reliability is lowered, and when the other end of the lead is fixed, stress is generated at the connecting portion at the other end. There is concern about reducing reliability.
  • the lead 1b having a square cross section is used as shown in FIG. 6B, the lead is not easily displaced or rotated, but the contact area between the lead 1b and the electrode pad 11 is large at the start of ultrasonic application, The power applied to the connection location is dispersed, and a large power is required for the connection.
  • the on-lead processed portion 3 by forming the on-lead processed portion 3, variation in the initial contact area when the ultrasonic tool 20 contacts the lead 1 is suppressed, and the curved surface on the side surface of the circular lead is pressed. Compared to the case, the initial contact area between the ultrasonic tool 20 and the lead 1 can be increased. In addition, since a load can be applied uniformly from the initial state, the displacement and rotation of the lead 1 can be suppressed.
  • the area of the tip of the ultrasonic tool 20 and the lead 1 in the initial state of ultrasonic vibration can be made larger than the initial contact area of the lead 1 and the electrode 10, it is possible to connect with less input energy from the initial connection stage. Power can be concentrated on the surface. Further, when the curved surface is pressurized and vibrated without forming the processed portion 3 on the lead, the shape along the tip of the ultrasonic tool 20 from the curved surface is applied by pressing the surface where the ultrasonic tool 20 and the lead 1 are in contact with each other. However, energy required for deformation can be reduced by forming the on-lead processed portion 3.
  • the lead 1 may be made of any material, but is preferably a metal containing at least one of copper, aluminum, iron and nickel as a main component.
  • the surface of the lead 1 may be coated with a metal (including solder) whose main component is tin, gold, nickel, copper or the like.
  • the electrode 11 may be made of any material, but is preferably a metal containing at least one of copper, aluminum, iron, and nickel as a main component. Further, the surface of the electrode 11 may be coated with a metal (including solder) whose main component is tin, gold, nickel, copper or the like.
  • the cross-sectional shape of the lead may be an ellipse, a polygon such as a triangle, a quadrangle, or an octagon.
  • the direction in which the ultrasonic tool is vibrated when applying ultrasonic waves is preferably the longitudinal direction of the lead, but it may be the short direction, the licking direction, or the circumferential direction.
  • the area where the ultrasonic tool 20 is pressed when viewed from the side is processed on the lead.
  • the area where the ultrasonic tool 20 is pressed is the machining area on the lead in FIGS. 4 (a), (b), (c) and FIGS. 5 (a), (b), and (c). If the lead other than 3 is not pressed, it may be equal to or less than the total length of the processed portion 3 on the lead, and the same effect can be obtained by pressing the tip of the lead 1.
  • the length of the ultrasonic tool 20 in the horizontal direction in FIGS. 5A, 5B, and 5C is depicted as being approximately the same as the diameter of the lead 1, but FIG.
  • the lateral lengths in a), (b), and (c) may be longer or shorter than the diameter of the lead 1, and are not limited to those shown in FIGS. 5 (a), (b), and (c).
  • the lead 1 formed with the tip shape of the ultrasonic tool 20 and the substrate pad 11 are connected to the pressurizing portion. Shape.
  • the lead 1 and the substrate pad 11 are connected by ultrasonic connection.
  • FIG. 5C which is a cross section in the radial direction
  • the lead 1 is similarly crushed from the upper side and the lower side, so the upper side of the lead 1 than the connection area between the lead 1 and the electrode pad 11 The area of the substantially flat portion is large.
  • FIG. 7 is an enlarged view of the cross-sectional shape of the connecting portion when viewed from the tip end direction of the lead after being connected using the present embodiment.
  • Reference numeral 1 denotes a lead
  • 11 denotes a pad on the substrate
  • 12 denotes a substrate
  • 31 denotes an outer peripheral portion near the connection surface.
  • the contact area between the lead 1 and the substrate pad 11 is very small at the initial stage of connection, and the contact location is near the center of the substrate pad 11.
  • the contact surfaces of the lead 1 and the pad 11 on the substrate are rubbed to expose each new metal surface, and the connection proceeds by metal bonding.
  • the surface film such as an oxide film on the connection surface is pushed out of the connection portion, and is easily deposited near the outer peripheral portion 31 in the vicinity of the connection surface.
  • the outer peripheral portion 31 near the connection surface also moves outward compared to the initial connection surface, and when the connection is completed, it becomes the location of the outer peripheral portion 31 near the connection surface shown in FIG.
  • surface films such as oxide films tend to deposit.
  • FIG. 8 is a schematic view of the fracture surface of the pad on the substrate after the shear test of this embodiment of the present invention.
  • 11 is a pad on a substrate
  • 12 is a substrate
  • 30 is a connection surface
  • 31 is an outer peripheral portion near the connection surface
  • 32 is a shear test mark.
  • FIG. 8 shows an example in which the shear test mark 32 is formed in the vertical direction.
  • the shear test mark 32 tends to be formed in the same direction as the ultrasonic wave application direction, the direction of the shear test mark 32 is any direction. It does not matter if it is in the direction.
  • a surface film such as an oxide film is likely to be deposited on the outer peripheral portion 31 in the vicinity of the connection surface after connection, when the shear test of the test piece of FIG. It is estimated that
  • FIG. 9 is a cross-sectional view of the state before connection when the present invention is applied to the connection of the coil according to the second embodiment of the present invention, as viewed from the leading end side of the lead 1.
  • Reference numeral 1 is a lead
  • 3 is a processing location on the lead
  • 4 is a lead initial contact location
  • 11 is a pad on the substrate
  • 12 is a substrate
  • 20 is an ultrasonic tool
  • 30 is a connection surface.
  • the rotation and displacement of the lead 1 when the ultrasonic tool 20 and the lead 1 are in contact can be suppressed.
  • the initial contact area between the lead 1 and the pad 11 on the substrate is smaller than the area of the lead processing portion 3 where the ultrasonic tool 20 pressurizes, the power applied to the connection portion tends to concentrate. Therefore, initial connection is possible with less energy, and fine powder generated at the time of connection can be suppressed.
  • the unevenness 4 is formed in the lead initial contact portion 4 where the pad 11 on the substrate and the lead 1 are in contact.
  • the unevenness is formed by forming a groove along the longitudinal direction of the lead 1.
  • a line connecting the tips of the irregularities 4 is formed so as to be substantially parallel to the processed portion 3 on the lead, and a plurality of the tips of the irregularities 4 are in contact with the electrode pads 11 in the initial stage of ultrasonic application.
  • the concavo-convex shape may be any shape as long as two or more fulcrums can be formed. However, the concavo-convex shape is in a region immediately below the processed portion 3 on the concavo-convex tip lead, and the center of gravity of the cross section of the lead 1 is surrounded by a plurality of concavo-convex tips. It is desirable to lie on a designated area. Concavities and convexities may be formed at the time of manufacture, applied to a press or mold, applied by physical processing such as laser processing or blasting, or processed by chemical processing such as etching. But it ’s okay.
  • the cross-sectional view after the start of connection is the same as in Example 1, and is as shown in FIG. 5B during connection and as shown in FIG. 5C after connection.
  • the same is true for the on-lead processed portion 3, the material of the lead 1, and the connection process of ultrasonic connection.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
PCT/JP2011/002345 2010-06-09 2011-04-22 接続構造およびその製造方法 Ceased WO2011155115A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010131596A JP5577161B2 (ja) 2010-06-09 2010-06-09 接続構造およびその製造方法
JP2010-131596 2010-06-09

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9357656B2 (en) 2013-05-22 2016-05-31 Robert Bosch Gmbh Method for solderless electrical press-fit contacting of electrically conductive press-fit pins in circuit boards
GB2559146A (en) * 2017-01-26 2018-08-01 Sensata Technologies Inc Integrated circuit wire formed for welding
JP2019145263A (ja) * 2018-02-19 2019-08-29 矢崎総業株式会社 端子付き電線

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5755601B2 (ja) * 2012-06-07 2015-07-29 株式会社日立製作所 パワーモジュールおよびその製造方法
KR101584765B1 (ko) * 2013-01-16 2016-01-22 주식회사 잉크테크 인쇄회로기판의 제조 방법 및 인쇄회로기판
JP6087214B2 (ja) * 2013-05-29 2017-03-01 矢崎総業株式会社 電線の端子接合構造及び端子接合方法
JP2014241680A (ja) * 2013-06-11 2014-12-25 矢崎総業株式会社 電線の端子接合構造及び抵抗溶接用電極
JP7643186B2 (ja) * 2021-05-31 2025-03-11 富士電機株式会社 半導体モジュールおよび半導体モジュールの製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0636852A (ja) * 1992-07-15 1994-02-10 Matsushita Electric Works Ltd プリント配線板への端子の接続法
JPH097856A (ja) * 1995-06-19 1997-01-10 Taiyo Yuden Co Ltd 回路部品
WO2003085787A1 (en) * 2002-04-04 2003-10-16 Fujikura Ltd. Cable, cable connection method, and cable welder
JP2007144449A (ja) * 2005-11-25 2007-06-14 Tokyo Electron Ltd 接合装置及び接合方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0636852A (ja) * 1992-07-15 1994-02-10 Matsushita Electric Works Ltd プリント配線板への端子の接続法
JPH097856A (ja) * 1995-06-19 1997-01-10 Taiyo Yuden Co Ltd 回路部品
WO2003085787A1 (en) * 2002-04-04 2003-10-16 Fujikura Ltd. Cable, cable connection method, and cable welder
JP2007144449A (ja) * 2005-11-25 2007-06-14 Tokyo Electron Ltd 接合装置及び接合方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9357656B2 (en) 2013-05-22 2016-05-31 Robert Bosch Gmbh Method for solderless electrical press-fit contacting of electrically conductive press-fit pins in circuit boards
GB2559146A (en) * 2017-01-26 2018-08-01 Sensata Technologies Inc Integrated circuit wire formed for welding
JP2019145263A (ja) * 2018-02-19 2019-08-29 矢崎総業株式会社 端子付き電線
US10673150B2 (en) 2018-02-19 2020-06-02 Yazaki Corporation Terminal-bonded cable

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JP5577161B2 (ja) 2014-08-20
JP2011258732A (ja) 2011-12-22

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