JP5577161B2 - 接続構造およびその製造方法 - Google Patents
接続構造およびその製造方法 Download PDFInfo
- Publication number
- JP5577161B2 JP5577161B2 JP2010131596A JP2010131596A JP5577161B2 JP 5577161 B2 JP5577161 B2 JP 5577161B2 JP 2010131596 A JP2010131596 A JP 2010131596A JP 2010131596 A JP2010131596 A JP 2010131596A JP 5577161 B2 JP5577161 B2 JP 5577161B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- connection
- ultrasonic
- connection structure
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000758 substrate Substances 0.000 claims description 39
- 229910052751 metal Inorganic materials 0.000 claims description 38
- 239000002184 metal Substances 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 238000002604 ultrasonography Methods 0.000 claims 1
- 238000012545 processing Methods 0.000 description 10
- 238000005476 soldering Methods 0.000 description 10
- 238000012360 testing method Methods 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000012141 concentrate Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 235000014676 Phragmites communis Nutrition 0.000 description 2
- 238000005422 blasting Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 238000012993 chemical processing Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/029—Welded connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Description
Claims (4)
- リードを金属体上に配置する工程と、
前記リードの金属体側と反対側の側面を超音波ツールにより超音波を印加しながら押圧して、前記リードと前記金属体とを超音波接続する工程と、
を含む接続構造の製造方法において、
前記超音波印加開始の際に前記超音波ツールとの接触面積が前記金属体との接触面積よりも大きくなるように、断面が略円形または略楕円形であるリードの側面を平坦化する加工または曲率を小さくする加工を行う工程と、
前記加工を行った領域に前記超音波ツールを接触させて押圧しながら超音波印加を行うことで前記略円形または略楕円形であるリードの外周を平面化しつつ前記金属体に超音波接続する工程と、
を含むことを特徴とする接続構造の製造方法。 - 基板と、
前記基板上に設けられた電極パッドと、
前記電極パッドに超音波接続にて接続されたリードとを備えた接続構造において、
前記リードは、略円筒形状であって、前記電極パッドと接続された面とは反対面に略平面部を有し、
前記略平面部の面積は、前記リードの略円筒形状の一部が前記超音波接続により加圧され平面状となって電極パッドと接続されている領域の面積よりも大きいことを特徴とする接続構造。 - 請求項2記載の接続構造において、
前記リードがコイルを形成していることを特徴とする接続構造。 - 請求項3記載の接続構造において、前記リードと前記電極パッドの表面の材質が銅、ニッケル、アルミニウム、錫の少なくともひとつを主成分としていることを特徴とする接続構造。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010131596A JP5577161B2 (ja) | 2010-06-09 | 2010-06-09 | 接続構造およびその製造方法 |
PCT/JP2011/002345 WO2011155115A1 (ja) | 2010-06-09 | 2011-04-22 | 接続構造およびその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010131596A JP5577161B2 (ja) | 2010-06-09 | 2010-06-09 | 接続構造およびその製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011258732A JP2011258732A (ja) | 2011-12-22 |
JP2011258732A5 JP2011258732A5 (ja) | 2012-10-18 |
JP5577161B2 true JP5577161B2 (ja) | 2014-08-20 |
Family
ID=45097737
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010131596A Expired - Fee Related JP5577161B2 (ja) | 2010-06-09 | 2010-06-09 | 接続構造およびその製造方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5577161B2 (ja) |
WO (1) | WO2011155115A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5755601B2 (ja) * | 2012-06-07 | 2015-07-29 | 株式会社日立製作所 | パワーモジュールおよびその製造方法 |
KR101584765B1 (ko) * | 2013-01-16 | 2016-01-22 | 주식회사 잉크테크 | 인쇄회로기판의 제조 방법 및 인쇄회로기판 |
DE102013209407B4 (de) | 2013-05-22 | 2023-08-31 | Robert Bosch Gmbh | Verfahren zur lötfreien elektrischen Einpresskontaktierung von elektrisch leitfähigen Einpress-Stiften in Leiterplatten |
JP6087214B2 (ja) * | 2013-05-29 | 2017-03-01 | 矢崎総業株式会社 | 電線の端子接合構造及び端子接合方法 |
JP2014241680A (ja) * | 2013-06-11 | 2014-12-25 | 矢崎総業株式会社 | 電線の端子接合構造及び抵抗溶接用電極 |
GB2559146A (en) * | 2017-01-26 | 2018-08-01 | Sensata Technologies Inc | Integrated circuit wire formed for welding |
JP2019145263A (ja) * | 2018-02-19 | 2019-08-29 | 矢崎総業株式会社 | 端子付き電線 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0636852A (ja) * | 1992-07-15 | 1994-02-10 | Matsushita Electric Works Ltd | プリント配線板への端子の接続法 |
JPH097856A (ja) * | 1995-06-19 | 1997-01-10 | Taiyo Yuden Co Ltd | 回路部品 |
JP3975201B2 (ja) * | 2002-04-04 | 2007-09-12 | 株式会社フジクラ | ケーブル |
JP4927391B2 (ja) * | 2005-11-25 | 2012-05-09 | 東京エレクトロン株式会社 | 接合方法 |
-
2010
- 2010-06-09 JP JP2010131596A patent/JP5577161B2/ja not_active Expired - Fee Related
-
2011
- 2011-04-22 WO PCT/JP2011/002345 patent/WO2011155115A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2011258732A (ja) | 2011-12-22 |
WO2011155115A1 (ja) | 2011-12-15 |
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