JP5577161B2 - 接続構造およびその製造方法 - Google Patents

接続構造およびその製造方法 Download PDF

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Publication number
JP5577161B2
JP5577161B2 JP2010131596A JP2010131596A JP5577161B2 JP 5577161 B2 JP5577161 B2 JP 5577161B2 JP 2010131596 A JP2010131596 A JP 2010131596A JP 2010131596 A JP2010131596 A JP 2010131596A JP 5577161 B2 JP5577161 B2 JP 5577161B2
Authority
JP
Japan
Prior art keywords
lead
connection
ultrasonic
connection structure
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010131596A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011258732A (ja
JP2011258732A5 (https=
Inventor
伸一 藤原
内山　　薫
時人 諏訪
雅彦 浅野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Astemo Ltd
Original Assignee
Hitachi Automotive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Priority to JP2010131596A priority Critical patent/JP5577161B2/ja
Priority to PCT/JP2011/002345 priority patent/WO2011155115A1/ja
Publication of JP2011258732A publication Critical patent/JP2011258732A/ja
Publication of JP2011258732A5 publication Critical patent/JP2011258732A5/ja
Application granted granted Critical
Publication of JP5577161B2 publication Critical patent/JP5577161B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/029—Welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP2010131596A 2010-06-09 2010-06-09 接続構造およびその製造方法 Expired - Fee Related JP5577161B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010131596A JP5577161B2 (ja) 2010-06-09 2010-06-09 接続構造およびその製造方法
PCT/JP2011/002345 WO2011155115A1 (ja) 2010-06-09 2011-04-22 接続構造およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010131596A JP5577161B2 (ja) 2010-06-09 2010-06-09 接続構造およびその製造方法

Publications (3)

Publication Number Publication Date
JP2011258732A JP2011258732A (ja) 2011-12-22
JP2011258732A5 JP2011258732A5 (https=) 2012-10-18
JP5577161B2 true JP5577161B2 (ja) 2014-08-20

Family

ID=45097737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010131596A Expired - Fee Related JP5577161B2 (ja) 2010-06-09 2010-06-09 接続構造およびその製造方法

Country Status (2)

Country Link
JP (1) JP5577161B2 (https=)
WO (1) WO2011155115A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5755601B2 (ja) * 2012-06-07 2015-07-29 株式会社日立製作所 パワーモジュールおよびその製造方法
KR101584765B1 (ko) * 2013-01-16 2016-01-22 주식회사 잉크테크 인쇄회로기판의 제조 방법 및 인쇄회로기판
DE102013209407B4 (de) 2013-05-22 2023-08-31 Robert Bosch Gmbh Verfahren zur lötfreien elektrischen Einpresskontaktierung von elektrisch leitfähigen Einpress-Stiften in Leiterplatten
JP6087214B2 (ja) * 2013-05-29 2017-03-01 矢崎総業株式会社 電線の端子接合構造及び端子接合方法
JP2014241680A (ja) * 2013-06-11 2014-12-25 矢崎総業株式会社 電線の端子接合構造及び抵抗溶接用電極
GB2559146A (en) * 2017-01-26 2018-08-01 Sensata Technologies Inc Integrated circuit wire formed for welding
JP2019145263A (ja) 2018-02-19 2019-08-29 矢崎総業株式会社 端子付き電線
JP7643186B2 (ja) * 2021-05-31 2025-03-11 富士電機株式会社 半導体モジュールおよび半導体モジュールの製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0636852A (ja) * 1992-07-15 1994-02-10 Matsushita Electric Works Ltd プリント配線板への端子の接続法
JPH097856A (ja) * 1995-06-19 1997-01-10 Taiyo Yuden Co Ltd 回路部品
US7339114B2 (en) * 2002-04-04 2008-03-04 Fujikura Ltd. Cable, cable connection method and cable welder
JP4927391B2 (ja) * 2005-11-25 2012-05-09 東京エレクトロン株式会社 接合方法

Also Published As

Publication number Publication date
JP2011258732A (ja) 2011-12-22
WO2011155115A1 (ja) 2011-12-15

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