Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B3/00—Ohmic-resistance heating
  • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
  • B23K35/24—Selection of soldering or welding materials proper
  • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
  • B23K35/262—Sn as the principal constituent
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
  • B23K35/24—Selection of soldering or welding materials proper
  • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
  • B23K35/264—Bi as the principal constituent
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B15/00—Layered products comprising a layer of metal
  • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
  • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C12/00—Alloys based on antimony or bismuth
• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C13/00—Alloys based on tin
• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C38/00—Ferrous alloys, e.g. steel alloys
  • C22C38/08—Ferrous alloys, e.g. steel alloys containing nickel
• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C38/00—Ferrous alloys, e.g. steel alloys
  • C22C38/10—Ferrous alloys, e.g. steel alloys containing cobalt
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/02—Contact members
  • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R2201/00—Connectors or connections adapted for particular applications
  • H01R2201/02—Connectors or connections adapted for particular applications for antennas
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R2201/00—Connectors or connections adapted for particular applications
  • H01R2201/26—Connectors or connections adapted for particular applications for vehicles
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
  • H01R4/02—Soldered or welded connections
  • H01R4/028—Soldered or welded connections comprising means for preventing flowing or wicking of solder or flux in parts not desired
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
  • H05B2203/016—Heaters using particular connecting means

Definitions

• the invention relates to a disc with an electrical connection element and an economical and environmentally friendly method for their production.
• the invention further relates to a disc with an electrical connection element for vehicles with electrically conductive structures such as heating conductors or antenna conductors.
• the electrically conductive structures are usually connected via soldered electrical connection elements with the on-board electrical system. Due to different thermal expansion coefficients of the materials used, mechanical stresses occur during manufacture and in operation, which can stress the disks and cause the disk to break.
• Lead-containing solders have a high ductility, which can compensate occurring mechanical stresses between the electrical connection element and the disc by plastic deformation.
• the Directive is collectively referred to as the ELV (End of Life Vehicles).
• the goal is to eliminate extremely problematic components from the products as a result of the massive expansion of disposable electronics.
• the substances involved are lead, mercury, cadmium and chromium. This includes, among other things, the enforcement of lead-free solders in electrical applications on glass and the introduction of appropriate replacement products for this purpose.
• EP 1942703 A2 discloses an electric connector element to windows of vehicles, wherein the difference in the coefficient of thermal expansion of disc and electrical connection element is ⁇ 5 x " ⁇ ⁇ 6 / ⁇ .
• a Lotmassenüberschuss To The surplus of solder mass emerges from the space between the connection element and the electrically conductive structure The excess solder mass causes high mechanical stresses in the glass pane These mechanical stresses ultimately lead to the breakage of the pane.
• the object of the present invention is to provide a disk with an electrical connection element and an economical and environmentally friendly method for the same To provide manufacturing, whereby critical mechanical stresses in the disc can be avoided.
• a disk with a connection element which comprises the following features:
• an electrically conductive structure (2) with a layer thickness of 5 ⁇ m to 40 ⁇ m, preferably 5 ⁇ m to 20 ⁇ m, on a region of the substrate (1),
• connection element (3) having a second coefficient of thermal expansion, the difference between the first and the second expansion coefficients being> 5 ⁇ 10 -6 / ⁇ €, and
• connection element (3) with portions of the electrically conductive structure (2).
• an electrically conductive structure On the disc an electrically conductive structure is applied.
• An electrical connection element is electrically connected to a solder mass on portions with the electrically conductive structure.
• the solder mass emerges with an exit width of ⁇ 1 mm from the gap between the connection element and the electrically conductive structure.
• the maximum exit width is preferably less than 0.5 mm and in particular about 0 mm.
• the maximum exit width can also be negative, that is to say retracted into the intermediate space formed by the electrical connection element and the electrically conductive structure, preferably in a concave meniscus.
• the maximum exit width is defined as the distance between the outer edges of the connection element and the point of the Lotmasseübertritts, at which the solder mass falls below a layer thickness of 50 ⁇ .
• the advantage lies in the reduction of the mechanical stresses in the disk, in particular in the critical region which is present during a large mass transfer of solder.
• the first thermal expansion coefficient is preferably from 8 ⁇ 10 -6 / ° C to 9 ⁇ 10 -6 / ° C.
• the substrate is preferably glass, preferably a thermal Coefficient of expansion of 8.3 x J ⁇ 0 ⁇ 6 / ° C to 9 x J ⁇ 0 ⁇ 6 / ° C in a temperature range of
• the second thermal expansion coefficient is preferably from 8 ⁇ 10 -6 / ° C to
• the thermal expansion coefficient of the connection element can be ⁇ 4 ⁇ 10 -6 / ° C.
• the electrically conductive structure according to the invention preferably has a layer thickness of 8 ⁇ m to 15 ⁇ m, more preferably of 10 ⁇ m to 12 ⁇ m.
• the electrically conductive structure according to the invention preferably contains silver, particularly preferably silver particles and glass frits.
• the layer thickness of the solder according to the invention is ⁇ 3.0 ⁇ 10 -4 m.
• the solder mass according to the invention preferably contains tin and bismuth, indium, zinc, copper, silver or compositions thereof.
• the proportion of tin in the solder composition according to the invention is from 3 wt .-% to 99.5 wt .-%, preferably from 10 wt .-% to 95.5 wt .-%, particularly preferably from 15 wt .-% to 60 wt .-%.
• the proportion of bismuth, indium, zinc, copper, silver or compositions thereof in the solder composition according to the invention from 0.5 wt .-% to 97 wt .-%, preferably
• the solder composition according to the invention may contain nickel, germanium, aluminum or phosphorus in a proportion of 0 wt .-% to 5 wt .-%.
• the solder composition of the present invention most preferably contains Bi40Sn57Ag3, Sn40Bi57Ag3, Bi59Sn40Ag1, Bi57Sn42Ag1, ln97Ag3, Sn95.5Ag3.8Cu0.7, Bi67ln33, Bi33ln50Sn17, Sn77,2ln20Ag2,8, Sn95Ag4Cu1, SN99Cu1, Sn96,5Ag3,5 or mixtures thereof.
• the connecting element according to the invention preferably contains at least 50% by weight to 75% by weight of iron, 25% by weight to 50% by weight of nickel, 0% by weight to 20% by weight of cobalt, 0% by weight. to 1, 5 wt .-% magnesium, 0 wt .-% to 1 wt .-% silicon, 0 wt .-% to
• the connecting element according to the invention preferably contains chromium, niobium, aluminum, vanadium, tungsten and titanium in a proportion of 0 wt .-% to 1 wt .-%, molybdenum in a proportion of 0 wt .-% to 5 wt .-%, and production-related admixtures.
• the connecting element according to the invention preferably contains at least 55% by weight to 70% by weight of iron, 30% by weight to 45% by weight of nickel, 0% by weight to 5% by weight of cobalt,
• connection element according to the invention more preferably contains at least 50 wt .-% to 60 wt .-% iron, 25 wt .-% to 35 wt .-% nickel, 15 wt .-% to 20 wt .-% cobalt, 0 wt. % to 0.5 wt .-% silicon, 0 wt .-% to 0.1 wt .-% carbon or 0 wt .-% to 0.5 wt .-% manganese.
• connection element according to the invention is particularly preferably coated with nickel, tin, copper and / or silver.
• the connecting element according to the invention is very particularly preferably coated with 0.1 ⁇ m to 0.3 ⁇ m nickel and / or 3 ⁇ m to 10 ⁇ m silver.
• the connection element can be nickel-plated, tin-plated, copper-plated and / or silver-plated. Ni and Ag improve the ampacity and corrosion stability of the terminal and wetting with the solder mass.
• the connecting element according to the invention preferably contains Kovar (FeCoNi) and / or Invar (FeNi) with a thermal expansion coefficient of Invar of 0.1 xl O "6 / ⁇ to 4 x 10 " 6 / q C or a maximum difference of Kovar of 5 x 10 "6 / ° C to the coefficient of expansion of the disc.
• Kovar is an iron-nickel-cobalt alloy, the thermal expansion coefficients of usually about 5 x 10 "6 / ° C has, which is therefore less than the coefficient of typical metals.
• the composition contains, for example, 54 wt .-% iron, 29 wt
• Kovar is used as a housing material or as a submount Submounts lie on the sandwich principle between the actual carrier material and the material with usually much larger expansion coefficients Kovar thus serves as a compensating element , which absorbs and reduces the thermo-mechanical stresses caused by the different thermal expansion coefficients of the other materials Metal-glass penetrations of electronic components, material transitions in vacuum chambers.
• Invar is an iron-nickel alloy containing 36% nickel by weight (FeNi36). It is a group of alloys and compounds which have the property of having abnormally small or sometimes negative coefficients of thermal expansion in certain temperature ranges. Fe65Ni35 Invar contains 65% by weight iron and 35% by weight nickel. Up to 1% by weight of magnesium, silicon and carbon are usually alloyed to alter the mechanical properties. By alloying 5 wt .-% cobalt, the thermal expansion coefficient ⁇ can be further reduced. A term for the alloy is Inovco, FeNi33Co4.5 having an expansion coefficient ⁇ (20 ° C to 100 ° C) of 0.55 x 10 "6 / ° C.
• Kovar and / or Invar can also be welded, crimped or glued as a compensating plate on a connecting element made of, for example, steel, aluminum, titanium, copper.
• a connecting element made of, for example, steel, aluminum, titanium, copper.
• the balance plate is preferably hat-shaped.
• the electrical connection element contains, on the surface oriented toward the solder mass, a coating which contains copper, zinc, tin, silver, gold or a combination thereof, preferably silver. This prevented the spread of solder mass across the coating and limited the exit width.
• the electrical connection element can be configured in bridge form with at least two contact surfaces, but also as a connection element with a contact surface.
• the connecting elements are in the plan view, for example, preferably 1 mm to 50 mm long and wide and more preferably 3 mm to 30 mm long and wide and most preferably 2 mm to 4 mm wide and 12 mm to 24 mm long.
• the shape of the electrical connection element can form solder deposits in the intermediate space of connection element and electrically conductive structure.
• the solder deposits and wetting properties of the solder on the connecting element prevent the escape of the solder mass from the intermediate space.
• Lotdepots can be rectangular, rounded or polygonal configured.
• the distribution of the solder heat and thus the distribution of the solder mass in the soldering process can be defined by the shape of the connection element. Lot mass flows to the warmest point.
• the bridge may have a single or double hat shape to advantageously distribute the heat during the soldering process in the connection element.
• the introduction of energy in the electrical connection of electrical connection element and electrically conductive structure is preferably carried out with stamp, thermodes, bulb soldering, preferably laser brazing, hot air soldering, induction brazing, resistance brazing and / or ultrasound.
• the object of the invention is further achieved by a method for producing a disk with a connection element, wherein
• solder mass is arranged and applied on the connection element as a plate with a defined layer thickness, volume, shape and arrangement,
• connection element is arranged with the solder mass on the electrically conductive structure
• connection element is soldered to the electrically conductive structure.
• connection elements preferably as platelets with a defined layer thickness, volume, shape and arrangement on the connection element.
• the connecting element is welded or crimped with an unillustrated sheet metal, stranded wire, braid of, for example, copper and connected to the on-board electrical system, also not shown.
• the connection element is preferably used in heating disks or in panes with antennas in buildings, in particular in automobiles, railways, aircraft or maritime vehicles.
• the connecting element serves to connect the conductive structures of the disc with electrical systems which are arranged outside the disc.
• the electrical systems are amplifiers, control units or voltage sources.
• FIG. 1 is a perspective view of a first embodiment of the disc according to the invention
• FIG. 6 is a perspective view of an alternative embodiment of the disc according to the invention.
• Fig. 7 shows a section B-B through the disc according to the figure 6 and
• Fig. 8 is a detailed flowchart of the method according to the invention.
• the pane 1 and 2 each show a detail of a heatable pane 1 according to the invention in the region of the electrical connection element 3.
• the pane 1 was a 3 mm thick thermally toughened tempered safety glass made of soda lime glass.
• the disc 1 had a width of 150 cm and a height of 80 cm.
• an electrically conductive structure 2 in the form of a heat conductor structure 2 was printed on the disc 1.
• the electrically conductive structure 2 contained silver particles and glass frits.
• the electrically conductive structure 2 was widened to a width of 10 mm and formed a contact surface for the electrical connection element 3.
• In the edge region of the disk 1 was still a Abdecksiebdruck not shown.
• soldering compound 4 was applied, which caused a permanent electrical and mechanical connection between the electrical connection element 3 and the electrically conductive structure 2.
• the solder mass 4 contained 57 wt .-% bismuth, 42 wt .-% tin and 1 wt .-% silver.
• the solder mass 4 was complete by a given volume and shape disposed between the electrical connection element 3 and the electrically conductive structure 2.
• the solder mass 4 had a thickness of 250 ⁇ .
• the electrical connection element 3 was an alloy containing 65 wt .-% iron and 35 wt .-% nickel.
• the electrical connection element 3 was designed bridge-shaped and had a width of 4 mm and a length of 24 mm.
• the material thickness of the connecting element 3 was 0.8 mm.
• the contact surface of the connection element 3 had a width of 4 mm and a length of 4 mm. Due to the arrangement of the solder mass 4, predefined by the connection element 3 and the electrically conductive structure 2, no critical mechanical stresses were observed in the pane 1.
• the connection of the disc 1 with the electrical connection element 3 was permanently stable via the electrically conductive structure 2.
• Fig. 3 shows in continuation of the embodiment of Figures 1 and 2, an alternative embodiment of the connecting element according to the invention 3.
• the electrical connection element 3 was provided on the solder mass 4 aligned surface with a silver-containing coating 5. As a result, a spread of the solder mass was prevented over the coating 5 and the exit width b limited. The exit width b of the solder mass 4 was below 1 mm. Due to the arrangement of the solder mass 4, no critical mechanical stresses in the disk 1 were observed.
• the connection of the disc 1 with the electrical connection element 3 was permanently stable via the electrically conductive structure 2.
• Fig. 4 shows in continuation of the embodiment of Figures 1 and 2, a further alternative embodiment of the connecting element according to the invention 3.
• the electrical connection element 3 contained on the surface facing the solder mass 4 a recess with a depth of 250 ⁇ , which is a solder deposit for the solder mass 4 made up. An exit of the solder mass 4 from the gap could be completely prevented.
• the thermal stresses in the disc 1 were not critical and a permanent electrical and mechanical connection between the connection element 3 and the disc 1 was provided via the electrically conductive structure 2.
• Fig. 5 shows in continuation of the embodiment of Figures 1 and 2, a further alternative embodiment of the connecting element according to the invention 3.
• the electrical Connecting element 3 was bent at the edge areas.
• the height of the bend of the edge regions of the glass sheet 1 was a maximum of 400 ⁇ .
• a space for the solder mass 4 was formed.
• the predetermined solder mass 4 formed between the electrical connection element 3 and the electrically conductive structure 2 a concave meniscus. An escape of solder mass 4 from the gap could be completely prevented.
• the exit width b was approximately zero, largely below zero due to the meniscus formed.
• the thermal stresses in the disc 1 were not critical and it was a permanent electrical and mechanical connection between the connection element 3 and the disc 1 via the electrically conductive structure 2 is provided.
• FIGS. 6 and 7 show a further embodiment of the pane 1 according to the invention with connection element 3 in bridge form.
• the connection element 3 contained an iron-containing alloy with a coefficient of thermal expansion of 8 ⁇ 10 -6 / ° C.
• the material thickness was 2 mm
• hat-shaped compensation bodies 6 with an iron-nickel-cobalt alloy were applied.
• the maximum layer thickness of the hat-shaped compensating bodies 6 was 4 mm.
• FIG. 8 shows in detail a method according to the invention for producing a pane 1 with an electrical connection element 3.
• an example of the method according to the invention for producing a pane with an electrical connection element 3 is shown.
• As a first step it was necessary to portion the solder mass 4 according to shape and volume.
• the portioned solder mass 4 was arranged on the electrical connection element 3.
• the electrical connection element 3 was arranged with the solder mass 3 on the electrically conductive structure 2.
• Test samples were made with the disc 1 (thickness 3 mm, width 150 cm and height 80 cm) of the electrically conductive structure 2 in the form of a heat conductor structure, the electrical connection element 3, the silver layer on the contact surfaces of the connection element 3 and the solder mass 4.
• the solder mass 4 was previously applied as platelets with a defined layer thickness, volume and shape on the contact surface of the connection element 3.
• the connection element 3 was attached with the attached solder mass on the electrically conductive structure 2.
• the connection element was soldered on the electrically conductive structure 2 at a temperature of 200 ° C. and a treatment time of 2 seconds.
• connection element (m) 8.0 x 1 0 -4
• Thickness of the layer (m) 7.0 x 1 0 -6
• test samples were performed with a second composition of the electrical connection element 3.
• the dimensions and compositions of the electrically conductive structure 2, the electrical connection element 3, the silver layer on the contact surfaces of the connection element 3 and the solder mass 4 detailed values are shown in Table 2. Again, it could be observed that at a temperature difference of +80 ° C to -30 ' ⁇ no glass substrate 1 broke or showed damage. It could be shown that shortly after soldering these disks 1 with soldered connection element 3 were stable against sudden temperature drop.
• connection element (m) 8.0 x 1 0 -4
• Thickness of the layer (m) 7.0 x 1 0 -6
• test samples having the second composition of the electrical connection element 3 and a second composition of the solder mass 4 were performed.
• the dimensions and compositions of the electrically conductive structure 2, the electrical connection element 3, the silver layer on the contact surfaces of the connection element 3 and the solder mass 4 detailed values are shown in Table 3. Again, it could be observed that at a temperature difference of +80 ° C to -30 ' ⁇ no glass substrate 1 broke or showed damage. It could be shown that shortly after soldering these disks 1 with soldered connection element 3 were stable against sudden temperature drop.
• connection element (m) 8.0 x 1 0 -4
• Thickness of the layer (m) 7.0 x 1 0 -6
• Comparative Example 1 was carried out in the same way as the example with the following differences.
• the dimensions and components of the electrically conductive structure 2, the electrical connection element 3, the metal layer on the contact surfaces of the connection element 3 and the solder mass 4 are shown in Table 4.
• the solder mass 4 has not previously been attached as a platelet on the contact surface of the connection element 3 according to the prior art.
• Titanium (wt.%) 100
• connection element (m) 8.0 x 1 0 -4
• Thickness of the layer (m) 7.0 x 1 0 -6
• Comparative Example 2 was carried out in the same way as the example with the following differences.
• the dimensions and components of the electrically conductive structure 2, the electrical connection element 3, the metal layer on the contact surfaces of the connection element 3 and the solder mass 4 are shown in Table 5.
• the solder mass 4 has not previously been attached as a platelet on the contact surface of the connection element 3 according to the prior art.
• panes according to the invention with glass substrates 1 and electrical connection elements 3 according to the invention have a better stability against sudden temperature differences. This result was unexpected and surprising to the skilled person. LIST OF REFERENCE NUMBERS

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• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Materials Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
• Joining Of Glass To Other Materials (AREA)
• Surface Treatment Of Glass (AREA)
• Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

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• 2010
  • 2010-03-02 EP EP10157516A patent/EP2367399A1/de not_active Withdrawn
  • 2010-03-02 EP EP10155181A patent/EP2365730A1/de not_active Withdrawn
• 2011
  • 2011-02-15 WO PCT/EP2011/052196 patent/WO2011107342A1/de not_active Ceased
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  • 2011-02-15 WO PCT/EP2011/052195 patent/WO2011107341A1/de not_active Ceased
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  • 2011-02-15 EP EP11703677.2A patent/EP2543229B1/de active Active
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  • 2011-02-15 CN CN2011800117819A patent/CN102771182A/zh active Pending
• 2015
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