WO2011096416A1 - Dispositif d'antenne et dispositif de communication - Google Patents
Dispositif d'antenne et dispositif de communication Download PDFInfo
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- WO2011096416A1 WO2011096416A1 PCT/JP2011/052102 JP2011052102W WO2011096416A1 WO 2011096416 A1 WO2011096416 A1 WO 2011096416A1 JP 2011052102 W JP2011052102 W JP 2011052102W WO 2011096416 A1 WO2011096416 A1 WO 2011096416A1
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- WIPO (PCT)
- Prior art keywords
- circuit board
- electrode
- signal line
- printed circuit
- antenna device
- Prior art date
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
Definitions
- the present invention relates to an antenna device that performs information communication by electromagnetic field coupling between a pair of opposed electrodes, and a communication device in which the antenna device is incorporated.
- Transferjet (registered trademark) can be achieved by electromagnetic coupling of the corresponding high-frequency couplers at a very short distance, and the signal quality depends on the performance of the high-frequency coupler.
- a high-frequency coupler described in Patent Document 1 includes a printed circuit board in which a ground is formed on one surface, a stub having a microstrip structure formed on the other surface of the printed circuit board, a coupling electrode, and this coupling It consists of a metal wire that connects the electrode and the stub.
- a transmission / reception circuit is also formed on a printed circuit board constituting the high frequency coupler.
- the transmitter / receiver circuit assembled by surface mounting and the three-dimensionally configured high-frequency coupler are arranged on the same printed circuit board from the viewpoint of the mounting process. There is a problem that production efficiency deteriorates because the process is complicated and handling is required. Further, in the communication device described in Patent Document 1, when a high-frequency coupler is separately created and the coupling electrode is more freely arranged without being restricted by the arrangement position of the transmission / reception circuit, and connected to the transmission / reception circuit. However, in order to connect the high-frequency coupler to the transmission / reception circuit, a connection means such as a connection cable is newly required in addition to the printed board, and there is a problem that the number of parts and processes increases.
- the present invention has been proposed in view of such a situation, and while maintaining high connectivity with a transmission / reception circuit that performs transmission / reception processing while achieving high production efficiency, the present invention is limited by the position of the transmission / reception circuit.
- An object of the present invention is to provide an antenna device in which coupling electrodes can be freely arranged without any problem.
- Another object of the present invention is to provide a communication device in which this antenna device is incorporated.
- an antenna device is an antenna device that performs information communication by electromagnetic coupling between a pair of opposed electrodes.
- a printed circuit board on which a ground layer is formed in a layer and a signal line through which a signal is transmitted is formed on the conductive layer on the other side, and a substantially planar conductor, and another antenna device disposed at an opposing position.
- the coupling electrode that is electromagnetically coupled to the electrode and can communicate, and the signal line formed on the printed board and the coupling electrode are electrically connected at a predetermined distance in the thickness direction of the printed board.
- connection terminal portion electrically connectable to a transmission / reception device that performs signal transmission / reception processing is formed at one end of the signal line, and at least the contact of the printed circuit board.
- Terminal forming portion which use the terminal portion is formed, characterized in that flexible.
- the communication device is a communication device that performs information communication by electromagnetic coupling between electrodes of another communication device arranged at an opposing position, and a conductive layer on one surface via a dielectric. And a printed circuit board on which a signal line for transmitting a signal is formed on the conductive layer on the other side, and an electrode of another antenna device made of a substantially planar conductor and disposed at an opposing position A coupling electrode that can be communicated with each other by electromagnetic coupling, and a signal line formed on the printed circuit board and the coupling electrode are electrically connected at a predetermined distance in the thickness direction of the printed circuit board.
- An electrode column; and a transmission / reception processing unit that is electrically connected via a connection terminal formed at one end of the signal line and performs signal transmission / reception processing, and at least the connection terminal unit of the printed circuit board Formed Terminal formation portion, and having flexibility.
- the signal line and the coupling electrode are electrically connected by the electrode column, and at least the terminal forming portion in which the connecting terminal portion is formed has flexibility in the printed circuit board. While realizing, it is possible to freely arrange the coupling electrode without being limited by the arrangement position of the transmission / reception circuit while maintaining good connectivity with the transmission / reception circuit performing the transmission / reception processing.
- FIG. 1 is a diagram showing a configuration of a communication system in which an antenna device to which the present invention is applied is incorporated.
- FIG. 2A is a diagram showing a configuration of a high-frequency coupler according to the first embodiment which is an antenna device to which the present invention is applied
- FIG. 2B is a first embodiment which is an antenna device to which the present invention is applied. It is a figure which shows the structure of the high frequency coupler which concerns on the modification of form.
- FIG. 3A is a diagram illustrating a terminal structure of the high-frequency coupler according to the first embodiment
- FIG. 3B is a diagram illustrating a terminal structure of the high-frequency coupler according to the first embodiment.
- FIG. 3A is a diagram illustrating a terminal structure of the high-frequency coupler according to the first embodiment
- FIG. 3B is a diagram illustrating a terminal structure of the high-frequency coupler according to the first embodiment.
- FIG. 4 is a simplified diagram showing an arrangement in which a high-frequency coupler is connected to a transmission / reception circuit via a connector.
- FIG. 5 is a simplified diagram showing another arrangement in which the high-frequency coupler is connected to the transmission / reception circuit via a connector.
- FIG. 6 is a simplified diagram showing an arrangement in which a high-frequency coupler is connected to a transmission / reception circuit with a conductive adhesive.
- FIG. 7A is a diagram illustrating another terminal structure of the high-frequency coupler according to the first embodiment
- FIG. 7B is a diagram illustrating another terminal structure of the high-frequency coupler according to the first embodiment.
- FIG. 8 is a simplified diagram showing another arrangement in which the high-frequency coupler is connected to the transmission / reception circuit with a conductive adhesive.
- FIG. 9 is a perspective view showing a communication state between the high-frequency couplers.
- FIG. 10 is a frequency characteristic diagram showing the analysis result of the coupling strength between the high-frequency couplers.
- FIG. 11 is a diagram showing a configuration of a high-frequency coupler according to the second embodiment which is an antenna device to which the present invention is applied.
- FIG. 12 is a frequency characteristic diagram showing an analysis result of the coupling strength between the high-frequency couplers according to the second embodiment.
- An antenna device to which the present invention is applied is a device that performs information communication by electromagnetic coupling between a pair of opposed electrodes, and is a communication system that enables high-speed transfer of about 560 Mbps, for example, as shown in FIG. 100 is used by being incorporated.
- the communication system 100 includes communication devices 101 and 105 that perform two data communications.
- the communication apparatus 101 includes a high-frequency coupler 102 having an electrode 103 and a transmission / reception circuit 104.
- the communication device 105 includes a high frequency coupler 106 having an electrode 107 and a transmission / reception circuit 108.
- the two electrodes 103 and 107 operate as one capacitor, and as a whole a band-pass filter.
- a high frequency signal in a 4 to 5 GHz band for realizing high-speed transfer of about 560 Mbps can be efficiently transmitted between the two high frequency couplers 102 and 106, for example.
- the transmitting and receiving electrodes 103 and 107 included in the high-frequency couplers 102 and 106 are arranged to face each other with a spacing of, for example, about 3 cm, and can be coupled to each other.
- the transmission / reception circuit unit 104 connected to the high-frequency coupler 102 generates a high-frequency transmission signal based on the transmission data when a transmission request is issued from a host application, and sends a signal from the electrode 103 to the electrode 107. Propagate. Then, the transmission / reception circuit unit 108 connected to the reception-side high-frequency coupler 106 demodulates and decodes the received high-frequency signal, and passes the reproduced data to the higher-level application.
- the antenna device to which the present invention is applied is not limited to the above-described one that transmits a high frequency signal in the 4 to 5 GHz band, and can be applied to signal transmission in other frequency bands, but in the following specific examples, A high frequency signal in the 4 to 5 GHz band will be described as a transmission target.
- the high-frequency coupler 110 includes a flexible printed circuit board 1, a coupling electrode 8, and an electrode column 7 that electrically connects the signal line 3 formed on the flexible printed circuit board 1 and the coupling electrode 8. .
- the flexible printed circuit board 1 is a flexible double-sided printed circuit board in which copper foils are disposed on both surfaces of a base material 4 functioning as a dielectric.
- the conductive layer on one surface is a ground 2 and the conductive layer on the other surface.
- the signal line 3 is formed by patterning.
- the base material 4 of the flexible printed circuit board 1 is a substance having a dielectric property superior to that of the conductive layer.
- it is a flexible dielectric material having a thickness of 25 to 125 ⁇ m, and in particular, polyimide, liquid crystal polymer, Teflon (registered)
- the coupling electrode 8 is made of a substantially planar conductor, and is electromagnetically coupled to electrodes of other antenna devices arranged at opposing positions so that communication is possible.
- a coupling electrode 8 is a substantially planar conductor as described above, and can have a circular, square, polygonal shape, etc., and the material is a good conductor having rigidity such as copper, brass, and stainless steel. It is preferable to use it.
- the electrode column 7 is electrically spaced from the signal line 3 formed on the flexible printed circuit board 1 and the coupling electrode 8 by being separated by a predetermined distance in the thickness direction H of the flexible printed circuit board 1.
- Such an electrode column 7 is a good conductor having the same rigidity as the coupling electrode 8, and is joined to the coupling electrode 8 and the signal line 3 by a bonding material having conductivity such as solder.
- the line width of the signal line 3 is made wider than the diameter of the electrode column 7 at the bonded portion, and a sufficient bonding strength is obtained with a conductive material. It is also preferable to take measures such as reinforcing the periphery of the joined portion with an organic adhesive or the like.
- the electrode column 7 may be produced and connected separately from the coupling electrode 8, or a part of the coupling electrode 8 may be processed and produced as an integral body with the coupling electrode 8. Further, in the high-frequency coupler 110 shown in FIG. 2A, the number of electrode columns 7 is one. However, since the role of supporting the coupling electrode 8 is also fulfilled, a plurality of electrodes may be used to improve the strength. In addition, the electrode column 7 is bonded to the vicinity of the center of the coupling electrode 8, but it is preferable to bond the electrode column 7 to the vicinity of the center of the coupling electrode 8 even when a plurality of the electrode columns 7 are used. For example, as shown in FIG.
- connection width between the electrode columns 71 and 72 and the signal line 3 is considered and the line width of the signal line 3 is narrow.
- the width of the joint 3b of the signal lines 3 is partially increased to join them.
- the configuration of the signal line 3 formed on the flexible printed circuit board 1 will be specifically described.
- One end of the signal line 3 is formed with a connection terminal portion 9 that can be electrically connected to a transmission / reception circuit portion that performs signal transmission / reception processing on the terminal formation portion 1a of the flexible printed circuit board 1, and the other end.
- the signal line 3 is short-circuited by passing through the base material 4 and joining to the ground 2 with a conductive plating film or conductive paste provided in the through hole 5.
- the connection to the ground 2 is for electrical short-circuiting, and the signal line 3 and the ground 2 may be connected by a conductive column such as a through bump.
- the distance from the end of the signal line 3 that is short-circuited by the through hole 5 to the connection point with the electrode column 7 in order to increase the communication sensitivity is also considered as a resonance line 3a that is separated by an integral multiple of approximately a quarter wavelength of the communication frequency.
- the resonance line 3a is used to increase the coupling efficiency between the coupling electrode provided in another high-frequency coupler and the coupling electrode 8 of the high-frequency coupler 110, and is connected to the ground 2 as described above. By connecting it, it becomes a short stub, and the voltage becomes 0 in this part. Therefore, when the electrode column 7 is connected to the distance of about a quarter wavelength of the communication frequency on the line from this part, the voltage at the connection point Is maximized and the coupling efficiency is improved. In this way, the resonance line 3a plays a role of increasing the coupling efficiency between the high frequency couplers.
- the end of the signal line 3 on the resonance line 3a side is a short stub via the through hole 5, but may be an open stub having an open end.
- this open stub it is necessary to adjust the length of the resonance line 3a as described above so that the voltage is maximized at the junction between the resonance line 3a and the electrode column 7.
- one resonance line 3a short-stubbed via the through hole 5 is formed on the flexible printed board 1, but a plurality of resonance lines 3a may be used. Thereby, a stronger resonance can be caused.
- the line shape of the signal line 3 does not necessarily need to be a straight line, and may be a curved line with a curvature, or may be bent as shown in FIGS. 2A and 2B.
- connection terminal portion 9 is formed at one end portion of the signal line 3 and is formed at the terminal formation portion 1a on the flexible printed board 1 having flexibility. Connection with the substrate of the transmission / reception circuit connected to the device 110 is facilitated.
- connection terminal portion 9 is designed in accordance with the connection method with the transmission / reception circuit portion.
- the terminal shape of the connecting terminal portion 9 is preferably a terminal structure corresponding to connection by a connector as shown in FIGS. 3A and 3B, for example, from the viewpoint of realizing good connectivity.
- connection terminal portion 29 corresponds to a connector having a GSG (ground / signal / ground) arrangement, and the ground and the signal line are arranged on the same plane.
- the signal terminal 50, the ground terminal 51, and the reinforcing plate 20 are provided for the purpose of use.
- the signal terminal 50 is formed at the end of the signal line 23 formed on one side of the flexible printed circuit board 21 by adjusting the line width for connector connection.
- the ground terminal 51 is electrically connected from a ground 22 formed on one surface of the flexible printed board 21 via a conductive material formed inside the through hole 25.
- the reinforcing plate 20 is bonded to the ground 22 in order to give the connecting terminal portion 29 mechanical strength, facilitating insertion / removal to / from the connector and maintaining stability and reliability of fitting. it can.
- a material of the reinforcing plate 20 a hard resin, ceramics, or the like is generally used.
- connection terminal portion 29 configured as described above has a characteristic impedance at the connection terminal portion 29 when the line widths of the signal terminal 50 and the ground terminal 51 are constant in order to achieve good connection with the connector pin.
- the characteristic impedance of the connection terminal portion 29 is adjusted by providing notches 27 at an appropriate ratio in the ground 22 immediately below the signal terminal 50. A reduction in efficiency of the high-frequency coupler can be prevented.
- the high-frequency coupler 110 thus manufactured is connected to the transmission / reception circuit unit via a connector arranged in the transmission / reception circuit unit. Specific connection examples are shown in FIGS. 4 and 5.
- FIG. 4 and 5 Specific connection examples are shown in FIGS. 4 and 5.
- FIG. 4 shows a case where the high-frequency coupler 110 and the transmission / reception circuit board 112 connected to the high-frequency coupler 110 via the connector 111 are arranged in the same direction.
- FIG. 5 shows a case where the high frequency coupler 110 and the transmission / reception circuit board 112 connected to the high frequency coupler 110 via the connector 111 are arranged back to back.
- the high-frequency coupler 110 is configured using the flexible printed circuit board 1 having flexibility, so that it can be freely bent and used, and the degree of freedom with respect to the installation location is extremely high. high.
- the signal line 3 formed on one surface of the flexible printed circuit board 1 and the coupling electrode 8 are electrically connected by the electrode pillar 7, Since the connecting terminal portion 9 is formed on the flexible printed circuit board 1 having flexibility, the transmission / reception circuit for performing transmission / reception processing and the good connection with the transmission / reception circuit are maintained while realizing high production efficiency.
- the coupling electrode can be freely arranged without being limited by the above.
- the high-frequency coupler 110 can be freely bent and used, and in order to realize a high degree of freedom with respect to the installation location, at least a connection terminal of the printed circuit board on which the signal line is mounted.
- the terminal forming portion 1a on which the portion 9 is formed only needs to be formed on a flexible substrate.
- a rigid flexible board using a board that is a composite of a hard material such as epoxy resin and a flexible material, mount electrode columns on the rigid board and mount the connection terminal on the flexible board. You may make it do.
- a rigid flexible board can be used in this way, the high-frequency coupler 110 uses the flexible printed board 1 having flexibility as a printed board, thereby simplifying the manufacturing process by sharing the members. It is particularly preferable in that
- an anisotropic conductive film (ACF), an anisotropic conductive paste (ACP), or the like is used. It can join by the method using an electrically conductive paste.
- ACF anisotropic conductive film
- ACP anisotropic conductive paste
- the use of such a conductive paste is preferable because it is not necessary to ensure the rigidity of the terminals, and the thickness can be reduced by omitting the reinforcing plate 20.
- the transmission / reception circuit board 112 and the high-frequency coupler 110 are oriented in the same direction as in the arrangement shown in FIG. 6, it is necessary to connect the bottom surface 112 b opposite to the mounting surface 112 a of the transmission / reception circuit board 112 as a joint portion 113 as shown in FIG. 6.
- connection terminal cannot be mounted on the surface opposite to the mounting surface, or the joint 113 is desired to be the mounting surface 112a of the transmission / reception circuit board 112 due to the problem of the arrangement of the high frequency coupler 110.
- 7A and 7B can be used to switch the front and back of the terminal surface by using the connection terminal portion 39 as shown in FIGS.
- connection terminal portion 39 has the following terminal structure. That is, as shown in FIGS. 7A and 7B, the connection terminal portion 39 is produced by patterning the signal terminal 60 and the ground terminal 61 with the ground 32, and the signal terminal 60 is formed by the conductor in the through hole 35. It is connected to a signal line 33 formed on the surface facing the ground 32. Also in the connection terminal portion 39, it is preferable to match the characteristic impedance in order to increase the coupling efficiency of the high-frequency coupler 110, and the distance between the signal terminal 60 and the ground terminal 61 is determined in consideration of this characteristic impedance.
- connection terminal portion 39 has a coplanar terminal structure, and when the characteristic impedance matching is difficult because the distance between the terminals is narrowed, it is joined to the same surface as the signal line 33 by the ground 32 and the through hole.
- the characteristic impedance can be adjusted by providing a ground terminal.
- the connection with ACF or the like reduces the buried portion of the adhesive material and cannot secure sufficient connection strength. It is preferable that the terminal 60 and the ground terminal 61 have a bifurcated structure or the like so as to increase the embedded portion of the adhesive material.
- connection terminal portion 39 having such a terminal structure enables connection facing the connection portion 113 prepared on the mounting surface 112a of the transmission / reception circuit board 112, and a case where a connector is used. A similar arrangement can be made.
- the communication characteristics were analyzed using a three-dimensional electromagnetic field simulator HFSS manufactured by Ansoft.
- the flexible printed circuit board 1 is a double-sided copper foil substrate using a liquid crystal polymer of 50 ⁇ m for the base material 4
- the coupling electrode 8 is a thin copper plate having a diameter of 10 mm
- the electrode pillar 7 is 0.4 mm in diameter and 2.4 mm in height.
- An iron pillar is assumed.
- the connection terminal portion 9 is structured to be fitted to a low profile connector with a pitch of 0.5 mm.
- the two high-frequency couplers 110a and 110b configured as described above are opposed to each other as shown in FIG. 9, an input signal is applied to the terminal of one high-frequency coupler 110a, and a signal is output from the terminal of the other high-frequency coupler 110b.
- the bond strength in the case of receiving was analyzed.
- the bond strength was evaluated using the transmission characteristic S21 of the S parameter.
- FIG. 10 shows the frequency characteristics of the coupling strength S21 when the opposing distances between the coupling electrodes of the opposing high frequency coupler of FIG. 9 are 15 mm and 100 mm, respectively.
- TransferJet registered trademark
- S21 is ⁇ 18 dB to ⁇ 20 dB in a coupled state with a facing distance of 15 mm, and is flat in the vicinity of the communication frequency. Frequency characteristics are obtained. Further, in a non-coupled state with a facing distance of 100 mm, S21 is ⁇ 42 dB, and communication blocking is obtained.
- the high-frequency coupler 110 is information using electromagnetic field coupling at a short distance of about 15 mm while preventing interference in a state separated by about 100 mm. Communication is possible.
- the high frequency coupler 120 is coupled to the flexible printed circuit board 1, the coupling electrode 8, and the signal line 3 formed on the flexible printed circuit board 1 in the same manner as the high frequency coupler 110 according to the first embodiment described above.
- An electrode column 7 that electrically connects the electrode 8 is provided.
- the high-frequency coupler 120 includes an upper substrate 16 as a fixing member that holds the coupling electrode 8.
- the coupling electrode 8 is held through the thin electrode column 7, the strength is weak, and care must be taken when moving the finished product.
- the coupling electrode 8 is firmly held by the upper substrate 16, so that the physical strength of the coupling electrode 8 is increased, and impact, pressurization, and the like are performed. It is possible to prevent deformation due to. That is, handling related to the movement of the high-frequency coupler 120 is facilitated.
- the high-frequency coupler 120 according to the present embodiment is the same as the configuration of the high-frequency coupler 110 according to the first embodiment described above except that the high-frequency coupler 120 includes the upper substrate 16, and thus the same reference numerals are given in FIG. The description of each element will be omitted.
- the coupling electrode 8 is held by the upper substrate 16, so that the coupling electrode 8 and the signal line 3 are connected by, for example, the following connection method.
- the coupling electrode 8 is formed by performing plating or the like on one surface of the upper substrate 16, that is, the upper surface 16a shown in FIG. Subsequently, in the high frequency coupler 120, the through hole 7 a is formed by a through hole drilling process with the upper substrate 16 at the center of the coupling electrode 8. The other surface of the upper substrate 16, that is, the lower surface 16 b of FIG. 11 is bonded to the flexible printed circuit board 1 so that the through hole 7 a is aligned with a predetermined position of the signal line 3.
- the electrode columns 7 formed by plating through the through holes 7a or conductive paste or the like electrically connect the coupling electrodes 8 and the signal lines 3.
- connection method is an example of an electrical connection method.
- a needle-like electrode column connected to the coupling electrode 8 in a through hole portion of the upper substrate 16 having a plated through hole 7a. 7 may be inserted and connected to the signal line 3 with solder or conductive paste.
- the coupling electrode 8 is directly formed on the upper surface 16a of the upper substrate 16.
- the coupling electrode 8 is coupled to the conductive layer of the flexible substrate having a conductive layer such as copper foil formed on one side.
- the electrode 8 for forming may be formed and attached to the upper surface 16a, or as shown in FIGS. 2A and 2B, a conductive metal thin plate may be attached to the upper surface 16a as the coupling electrode 8.
- any connection method can be used as long as the coupling electrode 8 and the signal line 3 can be electrically connected in a state of being separated by a predetermined distance across the upper substrate 16 that is a dielectric substrate. Good.
- the material of the upper substrate 16 it is particularly preferable to use a material having a low relative dielectric constant.
- a material having a low relative dielectric constant For example, in FIG. 12, when the relative dielectric constant of the upper substrate 16 is set to 1.5 and 2.0, and the other conditions are the same as the results obtained in FIG.
- the frequency characteristics of From this analysis result it can be seen that when the relative dielectric constant of the upper substrate 16 is increased, the frequency at which the coupling intensity reaches a peak shifts to the low frequency side and the coupling intensity S21 decreases due to the wavelength shortening effect.
- the peak frequency can be adjusted to be around 4.48 GHz by changing the resonance line 3a and other dimensions, but the level of the coupling strength S21 when the relative permittivity of the upper substrate 16 is high is set to the upper substrate. It cannot be increased to the same level as when the relative dielectric constant of 16 is low.
- a material having as low a relative dielectric constant as possible for the upper substrate 16.
- Teflon registered trademark
- a liquid crystal polymer, etc. having a relative dielectric constant of one significant digit are used.
- Candidates are listed, but especially when it is desired to improve the bond strength, a low dielectric material such as fluororesin, polyethylene, polyimide, etc. is used to produce a porous material with a single dielectric constant with a single significant digit. It is preferable to use it.
- the coupling electrode 8 and the signal line 3 are electrically connected with a predetermined distance therebetween with the upper substrate 16 interposed therebetween. , The physical strength of the coupling electrode 8 can be increased, and deformation due to impact or pressure can be prevented.
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- Computer Networks & Wireless Communication (AREA)
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- Near-Field Transmission Systems (AREA)
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- Combinations Of Printed Boards (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011800166247A CN102823149A (zh) | 2010-02-02 | 2011-02-02 | 天线装置及通信装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2010021518A JP2011160294A (ja) | 2010-02-02 | 2010-02-02 | アンテナ装置、及び、通信装置 |
JP2010-021518 | 2010-02-02 |
Publications (1)
Publication Number | Publication Date |
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WO2011096416A1 true WO2011096416A1 (fr) | 2011-08-11 |
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Application Number | Title | Priority Date | Filing Date |
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PCT/JP2011/052102 WO2011096416A1 (fr) | 2010-02-02 | 2011-02-02 | Dispositif d'antenne et dispositif de communication |
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JP (1) | JP2011160294A (fr) |
CN (1) | CN102823149A (fr) |
TW (1) | TWI460922B (fr) |
WO (1) | WO2011096416A1 (fr) |
Cited By (1)
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CN113728405A (zh) * | 2019-04-26 | 2021-11-30 | 松下知识产权经营株式会社 | 无线电力数据传输装置以及传输模块 |
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KR101301064B1 (ko) * | 2013-05-29 | 2013-08-28 | (주)드림텍 | 플렉서블 안테나 탑재형 pcb 모듈 |
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Also Published As
Publication number | Publication date |
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TWI460922B (zh) | 2014-11-11 |
TW201145672A (en) | 2011-12-16 |
CN102823149A (zh) | 2012-12-12 |
JP2011160294A (ja) | 2011-08-18 |
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