WO2011092903A1 - Unité de prise d'image pour endoscope - Google Patents

Unité de prise d'image pour endoscope Download PDF

Info

Publication number
WO2011092903A1
WO2011092903A1 PCT/JP2010/068197 JP2010068197W WO2011092903A1 WO 2011092903 A1 WO2011092903 A1 WO 2011092903A1 JP 2010068197 W JP2010068197 W JP 2010068197W WO 2011092903 A1 WO2011092903 A1 WO 2011092903A1
Authority
WO
WIPO (PCT)
Prior art keywords
image sensor
imaging unit
electronic circuit
endoscope
heat
Prior art date
Application number
PCT/JP2010/068197
Other languages
English (en)
Japanese (ja)
Inventor
裕之 永水
浩一 塩谷
Original Assignee
オリンパスメディカルシステムズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オリンパスメディカルシステムズ株式会社 filed Critical オリンパスメディカルシステムズ株式会社
Publication of WO2011092903A1 publication Critical patent/WO2011092903A1/fr

Links

Images

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • A61B1/05—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by the image sensor, e.g. camera, being in the distal end portion
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00064—Constructional details of the endoscope body
    • A61B1/00071—Insertion part of the endoscope body
    • A61B1/0008—Insertion part of the endoscope body characterised by distal tip features
    • A61B1/00096—Optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/2407—Optical details
    • G02B23/2423—Optical details of the distal end
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/2407—Optical details
    • G02B23/2423—Optical details of the distal end
    • G02B23/243—Objectives for endoscopes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/2476—Non-optical details, e.g. housings, mountings, supports
    • G02B23/2484—Arrangements in relation to a camera or imaging device

Definitions

  • the present invention relates to an imaging unit for an endoscope, which is provided in an endoscope apparatus, and particularly has a refractive optical system prism.
  • endoscopes are widely used in the medical field and the industrial field.
  • an image guide is used, and what can observe the inside of a patient's body cavity, the inside of a jet engine, or the like at an eyepiece portion where a user looks into has been the mainstream.
  • an imaging unit is incorporated at the distal end of the insertion section, and images the inside of a patient's body cavity, the inside of a jet engine, etc., and displays an endoscopic image on a display device such as an external monitor.
  • Electronic endoscope devices have appeared.
  • Such an imaging unit is provided with an image sensor that photoelectrically converts detected light into an electrical signal.
  • This image sensor is mainly used in which a solid-state imaging device, an electronic circuit, and the like are packaged as one electronic component.
  • an imaging unit used for an electronic endoscope is required to have a size that can be accommodated in a distal end portion that has been reduced in size as the insertion portion is reduced in diameter. Therefore, the imaging unit disposed at the distal end portion of the endoscope apparatus having a small accommodation space has a structure in which refracted light is incident on the image sensor in order to prevent the distal end portion from increasing in size in the outer diameter direction. Some use a prism.
  • JP JP-A-2009-49549 discloses an imaging device technology that suppresses the temperature rise of a solid-state imaging device by covering the surface of a three-color separation prism with a heat dissipation layer formed of copper or a graphite sheet. Is disclosed.
  • a cover glass and an air gap are provided between a prism and a solid-state image sensor to conduct heat generated from a peripheral circuit arranged in the vicinity of the solid-state image sensor.
  • a technique of an imaging apparatus for an endoscope that prevents fogging of a cover glass is disclosed.
  • JP-A-7-255004 an elastic member formed of silicon rubber having high thermal conductivity is coated along the shape of a prism on which a heating element such as a solid-state imaging device or a substrate is mounted. Furthermore, a technology of a three-plate TV camera device having a heat dissipation structure in which a heat dissipation plate is provided on an elastic member is disclosed.
  • JP 2008-278382 A a thermally conductive silicon rubber sheet containing a temperature sensor is tightly sandwiched between the ground pattern portion of the substrate and the outer surface of the shield plate of the liquid crystal monitor by thermal bonding.
  • An image sensor module technique for detecting an abnormal temperature rise is disclosed.
  • the imaging unit having a structure that suppresses the temperature rise as in the prior art cannot be accommodated in the small distal end portion, or it becomes a cause of inhibiting the miniaturization of the distal end portion because it is accommodated in the distal end portion. It was. For this reason, in particular, an imaging unit used in an endoscope apparatus has been desired to prevent an increase in size and to sufficiently dissipate heat from the image sensor to suppress an increase in temperature.
  • the present invention has been made in view of the above circumstances, and provides an imaging unit for an endoscope that prevents an increase in size and that easily diffuses the temperature of an image sensor to improve heat dissipation and suppresses a high temperature.
  • the purpose is to do.
  • the first endoscope imaging unit of the present invention includes an objective optical system that collects a light beam of an optical image of an incident subject, an image sensor in which a photoelectric conversion unit and an electronic circuit unit are packaged, A refractive optical system provided on one surface of the image sensor and provided with a reflective film that refracts a light beam of the optical image and forms an image on the photoelectric conversion unit; and the refractive optical system to protect the reflective film. And a protective member having a thermal conductivity higher than that of the refractive optical system.
  • the second endoscope imaging unit includes: an objective optical system that collects a light beam of an optical image of an incident subject; an image sensor in which a photoelectric conversion unit and an electronic circuit unit are packaged; A substrate electrically connected to the image sensor and having a ground layer formed on the entire surface, and the substrate is disposed so as to overlap the image sensor up to a portion where the electronic circuit unit is provided. It is characterized by.
  • the perspective view showing the configuration of the imaging unit Sectional view showing the configuration of the imaging unit The top view showing the configuration of the imaging unit
  • FIG. 11 is a rear perspective view showing the connection state between the cooling means and the protection member of the second modification of FIG. 11.
  • Sectional drawing which shows the structure of the imaging unit concerning the 3rd Embodiment of this invention. Same as above, enlarged view of the part circled in FIG. 13A Sectional drawing which shows the structure of the imaging unit of a 1st modification similarly Same as above, enlarged view of the circled part in FIG.
  • FIG. 18 is a cross-sectional view showing a configuration of a tip portion provided with an imaging unit along the line XIX-XIX in FIG. Sectional drawing which shows the structure of the front-end
  • FIG. 1 is a view showing an electronic endoscope system including an electronic endoscope apparatus
  • FIG. 2 is an inside of a distal end portion of an insertion portion
  • FIG. 3 is a perspective view showing the inside of the distal end portion where the imaging unit is disposed
  • FIG. 4 is a sectional view of the distal end portion where the imaging unit is disposed
  • FIG. 7 is a top view showing the configuration of the imaging unit
  • FIG. 8 is a bottom view showing the configuration of the imaging unit.
  • the electronic endoscope system 1 mainly includes an electronic endoscope device 2, a light source device 3, a video processor 4, and a monitor 5.
  • the electronic endoscope apparatus 2 includes a long and narrow insertion section 9, an operation section 10, an electric cable, and a universal cable 17 that is a composite cable through which a light guide bundle for transmitting illumination light is inserted, It is comprised.
  • the insertion portion 9 of the electronic endoscope apparatus 2 includes a distal end portion 6, a bending portion 7, and a flexible tube portion 8 in order from the distal end.
  • the operation unit 10 is connected to one end of the flexible tube unit 8 of the insertion unit 9, and a treatment instrument channel through which various treatment instruments disposed in the insertion unit 9 and the rear mouth unit 11 that is a folding prevention unit are inserted.
  • the treatment instrument channel insertion portion 12 that is an opening of the operation portion and the operation portion main body 13 are configured.
  • the operation section main body 13 is provided with a bending operation knob 16 for bending the bending section 7 of the insertion section 9, and is provided with switches for various endoscope functions.
  • a UD bending operation knob 14 for bending the bending portion 7 in the vertical direction and an RL bending operation knob 15 for bending the bending portion 7 in the left-right direction are superimposed. It is arranged.
  • the universal cable 17 extended from the operation unit 10 has an endoscope connector 18 that is detachable from the light source device 3 at the extended end.
  • the electronic endoscope apparatus 2 of this Embodiment transmits illumination light from the light source device 3 to the front-end
  • the endoscope connector 18 is provided with a coiled coil cable 19, and an electric connector 19 a detachably attached to the video processor 4 is provided at the extended end of the coil cable 19.
  • the video processor 4 is electrically connected to a monitor 5 that displays an endoscopic image, and is photoelectrically converted by an endoscope imaging unit (hereinafter simply referred to as an imaging unit) 20 of the electronic endoscope device 2 described later.
  • the electrical signal is processed and output to the monitor 5 as an image signal.
  • a plurality of substantially circular metal bending pieces 20a which are adjacent to each other, are rotatably connected. 20b and 20c are provided. Further, the leading edge bending piece 20a is fixed to the distal end portion 6, and here, a distal end rigid portion (also referred to as a distal end constituting portion) 30 which is a distal end frame having a substantially metal outer shape is disposed. .
  • gum which is not shown here is coat
  • the distal end hard portion 30 and the bending pieces 20a, 20b, and 20c are provided with a treatment instrument channel 21, a light guide bundle 22, and various electric cables 23 that are inserted into the insertion portion 9.
  • the distal end hard portion 30 has holes 31 and 32 into which the treatment instrument channel 21 and the light guide bundle 22 are individually inserted and fixed via a metal holding tube (not shown), and the imaging unit 40. And a space portion 33 in which is disposed.
  • the hole portions 31 and 32 and the space portion 33 are formed from the distal end to the proximal end of the distal end hard portion 30, and an opening is formed at the distal end surface and the proximal end surface of the distal end rigid portion 30.
  • the imaging unit 40 is a substantially cylindrical lens frame 41 formed of metal or the like, a substantially cylindrical holding tube 42 formed of metal or the like, and an objective optical system.
  • the lens frame 41 is disposed at the forefront of the imaging unit 40, and internally holds a lens group 43 that collects a light beam of an optical image of an incident subject.
  • the tip portion of the holding tube 42 is fitted, and the lens frame 41 and the holding tube 42 are fixed by an adhesive 41a.
  • a cover glass 42 a adhered to the distal end surface of the prism 44 and an optical adhesive is inserted and fixed to the proximal end portion of the holding tube 42.
  • the light beam of the optical image indicated by the optical axis O in the drawing which is incident from the tip surface side through the lens group 43, is refracted by about 90 ° and reflected toward the lower surface.
  • a protection member 45 which is a block body attached with an adhesive, is fixed to protect the reflecting film on the reflecting surface 44a. The configuration of the protection member 45 will be described in detail later.
  • the image sensor 46 is joined to the lower surface of the prism 44 by an optical adhesive, and a photoelectric conversion unit 46a such as a CCD or CMOS is disposed on the surface of the upper surface of the image sensor 46 facing the lower surface of the prism 44.
  • the image sensor 46 is provided with an electronic circuit unit 46b including an amplifier such as a transistor in the middle of the base end side, and the electronic circuit unit 46b is packaged together with the photoelectric conversion unit 46a. It is.
  • a front end portion of the FPC 47 is electrically connected to the upper surface portion on the base end side of the image sensor 46.
  • the FPC 47 extends rearward from the image sensor 46, and has a plurality of connection lands 47a (see FIG. 7) on the upper surface of the base end portion. Further, the FPC 47 is provided with an electronic component 48 on the lower surface portion of the base end portion.
  • the core 25a of the cable 25 is electrically connected to each connection land 47a and the electronic component 48 by soldering or the like.
  • the electric cable 23 described above is a cable in which a plurality of cables 25 are bundled and covered with an outer sheath.
  • the prism 44 and the cover body 50 that is a light shielding member formed of metal or the like around the upper portion and the side portion of the protective member 45 have a predetermined distance. So as to be separated from each other.
  • the imaging unit 40 is modularized with the adhesive layer 49 (see FIG. 4) formed by applying a reinforcing adhesive around the components after the components are assembled. Thereafter, the imaging unit 40 is arranged in the space 33 of the distal end hard portion 30 with the lens frame 41 fitted and fixed to the distal end hard portion 30. Further, the imaging unit 40 is fixed in the distal end hard portion 30 by filling the gap between the imaging unit 40 and the distal end hard portion 30 forming the space portion 33 with an adhesive 51 (see FIG. 4). Note that the adhesive layer 49 and the adhesive 51 may not be illustrated.
  • the space portion 33 of the distal end portion 6 where the imaging unit 40 is disposed is formed with a recess 33 a in the outer diameter direction so as not to contact the electronic component 48 disposed on the lower surface of the proximal end side of the FPC 47. (See FIGS. 3 and 4).
  • photographing light indicated by the optical axis O refracted by the reflecting surface 44a of the prism 44 is incident on the photoelectric conversion unit 46a of the image sensor 46 to form an image.
  • the photoelectric conversion unit 46a performs photoelectric conversion by generating electric charges according to the brightness of light incident on the light receiving element.
  • the CCD photoelectric conversion unit 46a when used for the image sensor 46, a high-voltage analog circuit constituted by the electronic circuit unit 46b is required, and a large amount of power is required.
  • the CMOS photoelectric conversion unit 46a when used, the image sensor 46 can be driven with lower power consumption than the CCD photoelectric conversion unit 46a, but noise is generated in the captured image at low illuminance. Therefore, it is necessary to further provide a circuit for correcting noise in the electronic circuit unit 46b including the amplifier.
  • the photoelectric conversion unit 46a is required to have a higher pixel, and the driving frequency becomes higher and the frequency becomes higher.
  • the electronic circuit unit 46b of the image sensor 46 is driven by the photoelectric conversion unit 46a at a high frequency, and a circuit that requires large power consumption or a circuit that corrects noise is provided. There is a case. Therefore, in addition to causing the function of the image sensor 46 to deteriorate, in particular, in the electronic endoscope device 2, the heat of the electronic circuit portion 46 b of the image sensor 46 causes the prism 44, the cover glass 42 a, the holding tube 42, and the lens frame 41 to be heated. Therefore, heat is transferred to the distal end hard portion 30, and the distal end portion 6 of the insertion portion 9 may be heated.
  • the distal end portion 6 may be warmed by the ambient temperature in the living body.
  • the light guide bundle 22 when the light guide bundle 22 is configured to transmit illumination light, the light guide bundle 22 is heated by the transmission of illumination light.
  • the tip 6 is also warmed by heat transfer.
  • the imaging unit 40 of the present embodiment instead of a conventional protective member formed of the same material as the prism 44 formed of glass or the like that protects the reflecting surface 44a of the prism 44, glass or the like is used.
  • the thermal conductivity of the formed prism 44 is higher than that of, for example, a sintered body such as ceramics, a synthetic resin such as silicon, a metal such as pure copper, brass, or aluminum, or ore such as sapphire or diamond.
  • the protection member 45 is formed of a high (large) material, and the heat absorption and heat dissipation from the image sensor 46 that generates heat is enhanced.
  • the imaging unit 40 has a configuration in which heat generated in the electronic circuit portion 46 b of the image sensor 46 that is a heat generating portion is easily transferred to the protective member 45 formed of a material having a higher thermal conductivity than the prism 44.
  • the protection member 45 of the present embodiment can be configured to absorb heat generated by the electronic circuit unit 46b of the image sensor 46 from the prism 44 and diffuse and dissipate the heat absorbed around the prism 44.
  • the imaging unit 40 can form the protective member 45 with substantially the same size as the conventional one, an increase in size in the outer diameter direction is prevented. As a result, the enlargement of the outer shape of the distal end portion 6 in which the imaging unit 40 is incorporated is also prevented.
  • the imaging unit 40 of the present embodiment can be configured to prevent an increase in size, to easily diffuse the temperature of the image sensor 46, to improve heat dissipation, and to suppress a high temperature.
  • FIG. 9 is a cross-sectional view showing the configuration of the imaging unit
  • FIG. 10 shows a first modification
  • cooling means is provided.
  • FIG. 11 is a sectional view showing the configuration of the imaging unit
  • FIG. 11 is a sectional view showing a connection state between the cooling means and the protection member
  • FIG. 12 is a cooling means and protection member according to the second modification of FIG. It is a back perspective view which shows the connection state of.
  • the same components as those in the first embodiment are denoted by the same reference numerals for the convenience of description, and detailed description and operational effects of those components are omitted.
  • the imaging unit 40 of the present embodiment is provided with a protective member 45 having a length that overlaps the upper surface of the image sensor 46 in the portion where the electronic circuit portion 46 b is provided. .
  • the protective member 45 of the present embodiment has a higher thermal conductivity than the prism 44 made of a transparent member such as glass, for example, sintered ceramics or the like.
  • Body a synthetic resin such as silicon, a metal such as pure copper or aluminum, or an ore such as sapphire, and has a length up to a position covering the electronic circuit portion 46b, and is provided on the upper surface of the image sensor 46. .
  • the protective member 45 has a configuration in which only the length in the longitudinal axis direction parallel to the longitudinal direction of the imaging unit 40 is extended with respect to the configuration of the first embodiment, and the size around the longitudinal axis. (Outer shape of the distal end portion 6 in the outer diameter direction) has the same dimensions as in the first embodiment.
  • the protective member 45 made of a material having a higher thermal conductivity than the material of the prism 44 is placed on the upper surface of the image sensor 46 to a position where it covers the electronic circuit portion 46b. Since the heat of the electronic circuit unit 46b is directly transferred to the protection member 45 by providing the heat absorption and heat dissipation of the heat from the electronic circuit unit 46b of the image sensor 46 as compared with the first embodiment. The configuration can be improved.
  • the imaging unit 40 is formed of a material having a higher thermal conductivity than the prism 44, which is disposed in the vicinity so as to cover the electronic circuit unit 46 b so that the heat of the electronic circuit unit 46 b serving as the heat generating unit in the image sensor 46.
  • the protection member 45 is configured to easily transfer heat directly.
  • the protection member 45 of the present embodiment further directly absorbs the heat generated by the electronic circuit unit 46b of the image sensor 46 and absorbs it in the surroundings as compared to the configuration of the first embodiment. It is possible to dissipate the generated heat and dissipate it.
  • the imaging unit 40 does not change the size of the protective member 45 around the longitudinal axis, the enlargement in the outer diameter direction is prevented as in the first embodiment. Therefore, similarly to the effect of the first embodiment, the enlargement of the outer shape of the distal end portion 6 in which the imaging unit 40 is built is prevented.
  • the cooling member 55 which is cooling means, such as a heat pipe and a heat radiating wire, may be connected to the base end surface.
  • the cooling member 55 is extended rearward by a predetermined length, and the whole excluding the tip end portion is covered with an outer sheath 56.
  • tip part of the cooling member 55 is connected with the base end surface of the protection member 45 by the adhesive part 57 with high heat conductivity which is solder or brazing, for example.
  • a hole 45 a is formed in the base end surface of the protection member 45, and the distal end portion of the cooling member 55 is press-fitted into the hole 45 a, or the distal end portion of the cooling member 55. May be connected by soldering or brazing with high thermal conductivity, for example.
  • the imaging unit 40 includes the cooling member 55 that moves the heat of the protection member 45 that absorbs heat generated by the electronic circuit unit 46b of the image sensor 46 to the rear, in addition to the above-described effects. Furthermore, heat can be moved to the cooling member 55 to enhance the heat diffusibility, and the heat from the image sensor 46 can be prevented from moving to the tip side. Needless to say, the cooling member 55 has a sufficient heat diffusing effect even if it is provided in the configuration of the imaging unit 40 of the first embodiment.
  • FIG. 13A is a cross-sectional view showing the configuration of the imaging unit
  • FIG. 13B is an enlarged view of a portion surrounded by a circle in FIG. 13A
  • FIG. FIG. 14B is an enlarged view of a portion surrounded by a circle in FIG. 14A
  • FIG. 15 is a cross-sectional view showing the configuration of the imaging unit showing the second modification
  • FIG. 16 is a cross-sectional view showing a configuration of an imaging unit showing a third modification
  • FIG. 17 is a cross-sectional view showing a configuration of an imaging unit showing a fourth modification.
  • the same components as those in the first embodiment are denoted by the same reference numerals for the sake of convenience of description, and detailed descriptions and operational effects of those components are omitted.
  • the FPC 47 is disposed up to a position where it overlaps the upper surface of the image sensor 46 in the portion where the electronic circuit portion 46 b is provided.
  • the FPC 47 is provided with a ground layer 62a and a signal line 62b which are covered with an insulating film on a cover lay 61 such as a polyimide film.
  • the ground layer 62a is patterned on substantially the entire surface of the FPC 47. That is, the FPC 47 is disposed so as to overlap the upper surface of the image sensor 46 so as to cover the electronic circuit portion 46b of the image sensor 46 including the ground layer 62a.
  • the ground layer 62a is provided on the upper surface of the image sensor 46 to the position where the tip portion of the FPC 47 in which the ground layer 62a is patterned on the entire surface covers the electronic circuit portion 46b. Since the heat from the electronic circuit unit 46b is directly transferred to the layer 62a, the heat absorption and heat dissipation of the heat from the electronic circuit unit 46b that generates heat in the image sensor 46 is further improved as compared with the first embodiment. It can be configured.
  • the imaging unit 40 directly transfers heat generated in the electronic circuit unit 46b of the image sensor 46, which is a heat generating unit, to the ground layer 62a of the FPC 47 disposed in the vicinity so as to cover the electronic circuit unit 46b. It is configured to be heated.
  • the protection member 45 absorbs and dissipates heat from the image sensor 46 transferred to the prism 44.
  • the imaging unit 40 of the present embodiment further absorbs heat generated by the electronic circuit unit 46b of the image sensor 46 directly by the ground layer 62a of the FPC 47, as compared with the configuration of the first embodiment.
  • the heat moves to the rear side of the FPC 47, and the heat absorbed by the ground layer 62a is diffused around the FPC 47 to dissipate it.
  • the imaging unit 40 of the present embodiment absorbs the heat generated by the electronic circuit unit 46b of the image sensor 46 by the ground layer 62a of the FPC 47 and transfers it to the rear of the FPC 47, and the heat is transferred to the periphery of the FPC 47.
  • the heat of the image sensor 46 that has not been absorbed by the ground layer 62 a of the FPC 47 is absorbed and dissipated by the protective member 45 through the prism 44. Therefore, in addition to the effects of the first embodiment, the imaging unit 40 can further increase the heat diffusibility and prevent the heat of the image sensor 46 from moving to the front end side.
  • the imaging unit 40 may be provided with FPCs 47 each having a ground layer 62 a patterned on substantially the entire surface, on both upper and lower surfaces of the image sensor 46.
  • the FPC 47 on which the electronic component 48 is mounted on the lower surface is disposed on the lower surface of the image sensor 46 until the tip portion covers the electronic circuit portion 46b.
  • the newly provided FPC 63 simply has a structure in which a ground layer 65 with an insulating coating is provided on a cover lay 64 such as a polyimide film, and the image is such that the tip portion overlaps to a position covering the electronic circuit portion 46b.
  • the sensor 46 is disposed on the upper surface.
  • the new FPC 63 only the ground layer 65 is patterned on almost the entire surface, and here, no other circuit configuration is mounted, and no wiring pattern is formed therefor.
  • the core 25a of the cable 25 is connected to the FPC 63 by soldering or the like so as to be electrically connected to the ground layer 65.
  • the heat generated in the electronic circuit portion 46b of the image sensor 46 which is a heat generating portion, is directly applied to the ground layers 62 and 65 of the two FPCs 47 and 63, respectively. Heat is transferred. Then, the heat moves to the rear side of each FPC 47, 63 by the ground layers 62, 65 of the two FPCs 47, 63 that directly absorb the heat generated by the electronic circuit portion 46b of the image sensor 46, and the absorbed heat is absorbed. It diffuses and radiates heat around each FPC 47, 63.
  • the imaging unit 40 of the present modification can further improve the heat diffusibility, and can prevent the heat of the image sensor 46 from moving to the tip side. Also in this configuration, the protection member 45 absorbs and dissipates heat from the image sensor 46 transferred to the prism 44.
  • the configuration in which the FPCs 47 and 63 are arranged on two different surfaces (upper and lower surfaces) of the image sensor 46 is shown, but the image sensor 46 is overlapped to a position where the tip portion covers the electronic circuit portion 46b.
  • the FPC 63 may be provided on the other surface (side surface).
  • such a configuration including the FPC 47 (FPC 63) in which the ground layer 62a (65) is patterned on substantially the entire surface may be provided in the configuration of the imaging unit 40 of the second embodiment.
  • the protective member 45 is sufficiently made of the same material as that of the prism 44 as in the prior art, and even if only the configuration including the FPC 47 (FPC 63) of the present embodiment is provided, it has a sufficient heat diffusing effect as compared with the prior art.
  • the protective member 45 is sufficiently made of the same material as that of the prism 44 as in the prior art, and even if only the configuration including the FPC 47 (FPC 63) of the present embodiment is provided, it has a sufficient heat diffusing effect as compared with the prior art.
  • the present invention can also be applied to an imaging unit including various image sensors 46.
  • the FPC 47 (FPC 63) may be a rigid substrate.
  • the FPC 47 and the FPC 63 which are provided so as to overlap the top and bottom surfaces of the image sensor 46 up to a position where the tip portion covers the electronic circuit portion 46b, are shown in FIG. It may be provided upside down with respect to the configuration.
  • the imaging unit 40 is arranged on a position where an electronic component 48 such as a capacitor constituting an electric passive element disposed in the FPC 47 covers the electronic circuit unit 46 b of the image sensor 46. It may be provided. In such a configuration, the heat of the electronic circuit unit 46, which is an electrically active element, is also transferred to the electronic component 48, so that the heat dissipation diffusivity of the imaging unit 40 can be further increased.
  • an electronic component 48 such as a capacitor constituting an electric passive element disposed in the FPC 47 covers the electronic circuit unit 46 b of the image sensor 46. It may be provided.
  • the heat of the electronic circuit unit 46 which is an electrically active element, is also transferred to the electronic component 48, so that the heat dissipation diffusivity of the imaging unit 40 can be further increased.
  • the imaging unit 40 may be provided on the base end side with respect to the image sensor 46, and a heat radiating member 58 may be provided between the FPC 47 and the FPC 63.
  • the heat radiating member 58 absorbs the heat of the electronic component 48 of the image sensor 46 which is absorbed by the FPC 47 and the FPC 63 and is transferred to the base end side to dissipate the heat. be able to.
  • FIG. 18 is a cross-sectional view showing the configuration of the tip portion provided with the imaging unit
  • FIG. 19 is taken along line XIX-XIX in FIG.
  • FIG. 20 is a cross-sectional view showing the configuration of the distal end portion provided with the imaging unit and provided with cooling means.
  • the same components as those in the first embodiment are denoted by the same reference numerals for the sake of convenience of description, and detailed descriptions and operational effects of those components are omitted.
  • the distal end portion 6 of the electronic endoscope apparatus 2 of the present embodiment is provided with a cylindrical resin frame 70 on the outer peripheral portion of the distal end hard portion 30.
  • the resin frame 70 is fitted and bonded to the outer peripheral portion of the distal end hard portion 30 at the distal end portion.
  • the base end portion of the resin frame 70 is bonded and bonded so that the inner peripheral surface thereof is in surface contact with the outer peripheral surface of the distal end hard portion 30 (not shown).
  • the distal end hard portion 30 is formed with a concave portion in the circumferential direction by scraping the outer peripheral portion of the portion to which the resin frame 70 is fitted out by a predetermined thickness around the longitudinal axis within a predetermined length range in the longitudinal direction. .
  • an air layer 71 is formed between the tip hard portion 30 and the resin frame 70 in a state where the resin frame 70 is externally fitted to the tip hard portion 30.
  • the resin frame 70 and the hard tip portion 30 are hermetically fitted and bonded with an adhesive or the like.
  • the distal end portion 6 of the electronic endoscope apparatus 2 is insulated by the air layer 71 from the heat of the imaging unit 40 serving as a heating element disposed in the distal end hard portion 30. Due to the effect, it is difficult to be transmitted to the resin frame 70 which is the outer surface, and a temperature rise due to heat from the inside is suppressed. Thereby, the high temperature of the front-end
  • a cooling member 72 that is a cooling means such as a heat pipe or a heat radiating wire may be provided in the distal end hard portion 30.
  • the cooling member 72 extends rearward with a predetermined length, and is entirely covered with an outer sheath 73 except for the distal end portion.
  • tip part of the cooling member 72 is connected with the inner surface of the front-end
  • the distal end portion 6 of the electronic endoscope apparatus 2 of the present modification is provided with the cooling member 72 that moves the heat of the distal end hard portion 30 heated by the heat transfer from the imaging unit 40 to the rear. Since the heat is diffused by this, the internal temperature can be suppressed to a certain value or less, and in addition to the above-described effects, it is possible to further prevent the temperature from rising.
  • the configuration of the distal end portion 6 of the electronic endoscope of the present embodiment described above can be used together with the imaging unit 40 described in the above-described embodiments. Further, the configuration of the FPC 47 of each of the above-described embodiments is not limited to this, and a TAB tape may be used.
  • each embodiment includes various stages of the invention, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements.

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Optics & Photonics (AREA)
  • Surgery (AREA)
  • Astronomy & Astrophysics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Medical Informatics (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Biophysics (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Veterinary Medicine (AREA)
  • Molecular Biology (AREA)
  • Animal Behavior & Ethology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Public Health (AREA)
  • Multimedia (AREA)
  • Endoscopes (AREA)

Abstract

L'unité de prise d'image (40) pour endoscope selon l'invention comprend : un système optique de type objectif (43) qui collecte le flux de lumière incident sur une image optique d'un sujet ; un capteur d'images (46) renfermant une partie conversion photoélectrique (46a) et une partie circuit électronique (46b) ; un système dioptrique (44) qui se trouve sur une surface du capteur d'images (46) et est pourvu d'un film réfléchissant (44a) pour réfracter le flux de lumière de l'image optique et focaliser l'image optique sur la partie conversion photoélectrique (46a) ; et un élément protecteur (45) qui est fixé au système dioptrique (44) de manière à protéger le film réfléchissant (44a) et qui a une conductivité thermique supérieure à celle du système dioptrique (44). Par conséquent, toute augmentation de taille est impossible, et la température du capteur d'images est plus facile à diffuser, ce qui accroît la performance de dégagement de chaleur, supprimant ainsi tout risque d'échauffement.
PCT/JP2010/068197 2010-02-01 2010-10-15 Unité de prise d'image pour endoscope WO2011092903A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010020495 2010-02-01
JP2010-020495 2010-08-25

Publications (1)

Publication Number Publication Date
WO2011092903A1 true WO2011092903A1 (fr) 2011-08-04

Family

ID=44318904

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/068197 WO2011092903A1 (fr) 2010-02-01 2010-10-15 Unité de prise d'image pour endoscope

Country Status (1)

Country Link
WO (1) WO2011092903A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012071064A (ja) * 2010-09-29 2012-04-12 Fujifilm Corp 内視鏡装置及びその撮像素子放熱方法
WO2014208171A1 (fr) * 2013-06-28 2014-12-31 オリンパスメディカルシステムズ株式会社 Module d'imagerie et dispositif d'endoscope
JP2015042219A (ja) * 2013-08-26 2015-03-05 オリンパスメディカルシステムズ株式会社 内視鏡
WO2015045616A1 (fr) * 2013-09-30 2015-04-02 オリンパス株式会社 Unité d'imagerie et dispositif d'endoscope
JP2016190007A (ja) * 2015-03-31 2016-11-10 株式会社フジクラ 撮像モジュール及び内視鏡
WO2016185554A1 (fr) * 2015-05-19 2016-11-24 オリンパス株式会社 Unité de capture d'image et endoscope
WO2021238239A1 (fr) * 2020-05-25 2021-12-02 卓外（上海）医疗电子科技有限公司 Structure de dissipation de chaleur de partie d'insertion d'endoscope

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04317622A (ja) * 1991-04-15 1992-11-09 Asahi Optical Co Ltd 内視鏡の先端部
JP2000183541A (ja) * 1998-12-11 2000-06-30 Toshiba Iyo System Engineering Kk 多層プリント基板
JP2001275022A (ja) * 2000-03-23 2001-10-05 Sony Corp ビデオカメラ
JP2008029597A (ja) * 2006-07-28 2008-02-14 Olympus Corp 内視鏡装置
JP2009058807A (ja) * 2007-08-31 2009-03-19 Olympus Medical Systems Corp 撮像ユニット

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04317622A (ja) * 1991-04-15 1992-11-09 Asahi Optical Co Ltd 内視鏡の先端部
JP2000183541A (ja) * 1998-12-11 2000-06-30 Toshiba Iyo System Engineering Kk 多層プリント基板
JP2001275022A (ja) * 2000-03-23 2001-10-05 Sony Corp ビデオカメラ
JP2008029597A (ja) * 2006-07-28 2008-02-14 Olympus Corp 内視鏡装置
JP2009058807A (ja) * 2007-08-31 2009-03-19 Olympus Medical Systems Corp 撮像ユニット

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012071064A (ja) * 2010-09-29 2012-04-12 Fujifilm Corp 内視鏡装置及びその撮像素子放熱方法
WO2014208171A1 (fr) * 2013-06-28 2014-12-31 オリンパスメディカルシステムズ株式会社 Module d'imagerie et dispositif d'endoscope
CN104684455A (zh) * 2013-06-28 2015-06-03 奥林巴斯医疗株式会社 摄像模块和内窥镜装置
US9345395B2 (en) 2013-06-28 2016-05-24 Olympus Corporation Imaging module and endoscope device
JP2015042219A (ja) * 2013-08-26 2015-03-05 オリンパスメディカルシステムズ株式会社 内視鏡
WO2015045616A1 (fr) * 2013-09-30 2015-04-02 オリンパス株式会社 Unité d'imagerie et dispositif d'endoscope
JP2015066300A (ja) * 2013-09-30 2015-04-13 オリンパス株式会社 撮像ユニットおよび内視鏡装置
US10574866B2 (en) 2013-09-30 2020-02-25 Olympus Corporation Imaging unit and endoscope apparatus
JP2016190007A (ja) * 2015-03-31 2016-11-10 株式会社フジクラ 撮像モジュール及び内視鏡
WO2016185554A1 (fr) * 2015-05-19 2016-11-24 オリンパス株式会社 Unité de capture d'image et endoscope
JPWO2016185554A1 (ja) * 2015-05-19 2018-03-08 オリンパス株式会社 撮像ユニットおよび内視鏡
WO2021238239A1 (fr) * 2020-05-25 2021-12-02 卓外（上海）医疗电子科技有限公司 Structure de dissipation de chaleur de partie d'insertion d'endoscope

Similar Documents

Publication Publication Date Title
JP5080695B2 (ja) 内視鏡用撮像ユニット
WO2011092903A1 (fr) Unité de prise d'image pour endoscope
JP4757358B2 (ja) 内視鏡装置
JP3875505B2 (ja) 撮像装置
WO2010064506A1 (fr) Dispositif d’imagerie et endoscope
WO2015019671A1 (fr) Unité d'imagerie pour endoscope
WO2013031276A1 (fr) Unité de capture d'images d'endoscope
JP5143634B2 (ja) 撮像装置
JP5341279B2 (ja) 内視鏡装置
US11122969B2 (en) Endoscopic device
US20120075446A1 (en) Endoscope apparatus and method for releasing heat generated by imaging element of the endoscope apparatus
JP2010069217A (ja) 電子内視鏡用撮像装置、および電子内視鏡
WO2019044609A1 (fr) Endoscope
JP5377085B2 (ja) 内視鏡
JP2008079823A (ja) 撮像装置
WO2019176601A1 (fr) Unité d'imagerie et endoscope oblique
JP4709870B2 (ja) 撮像装置
JP4127776B2 (ja) 撮像装置
JP3548467B2 (ja) 撮像装置
JPH03118021A (ja) 内視鏡装置
JP7385736B2 (ja) 内視鏡撮像装置
JP2013099469A (ja) 撮像装置、内視鏡
WO2011092904A1 (fr) Structure pour extrémité d'endoscope
JP4286086B2 (ja) 内視鏡装置
JP2022142206A (ja) 撮像モジュール

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10844658

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10844658

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP