WO2011043295A1 - 接着装置、板状接着体の製造方法 - Google Patents
接着装置、板状接着体の製造方法 Download PDFInfo
- Publication number
- WO2011043295A1 WO2011043295A1 PCT/JP2010/067369 JP2010067369W WO2011043295A1 WO 2011043295 A1 WO2011043295 A1 WO 2011043295A1 JP 2010067369 W JP2010067369 W JP 2010067369W WO 2011043295 A1 WO2011043295 A1 WO 2011043295A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pair
- plate
- bodies
- liquid crystal
- adhesive
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
- B29C65/1435—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. transmission welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
- B29C65/1448—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface radiating the edges of the parts to be joined, e.g. for curing a layer of adhesive placed between two flat parts to be joined, e.g. for making CDs or DVDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1477—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier
- B29C65/1483—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier coated on the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/524—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by applying the adhesive from an outlet device in contact with, or almost in contact with, the surface of the part to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/32—Measures for keeping the burr form under control; Avoiding burr formation; Shaping the burr
- B29C66/324—Avoiding burr formation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/342—Preventing air-inclusions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/343—Making tension-free or wrinkle-free joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/345—Progressively making the joint, e.g. starting from the middle
- B29C66/3452—Making complete joints by combining partial joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/45—Joining of substantially the whole surface of the articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/733—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the optical properties of the material of the parts to be joined, e.g. fluorescence, phosphorescence
- B29C66/7336—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the optical properties of the material of the parts to be joined, e.g. fluorescence, phosphorescence at least one of the parts to be joined being opaque, transparent or translucent to visible light
- B29C66/73365—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the optical properties of the material of the parts to be joined, e.g. fluorescence, phosphorescence at least one of the parts to be joined being opaque, transparent or translucent to visible light at least one of the parts to be joined being transparent or translucent to visible light
- B29C66/73366—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the optical properties of the material of the parts to be joined, e.g. fluorescence, phosphorescence at least one of the parts to be joined being opaque, transparent or translucent to visible light at least one of the parts to be joined being transparent or translucent to visible light both parts to be joined being transparent or translucent to visible light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/74—Joining plastics material to non-plastics material
- B29C66/746—Joining plastics material to non-plastics material to inorganic materials not provided for in groups B29C66/742 - B29C66/744
- B29C66/7465—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
- B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
- B29C66/8126—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
- B29C66/81266—Optical properties, e.g. transparency, reflectivity
- B29C66/81267—Transparent to electromagnetic radiation, e.g. to visible light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
- B29C66/8322—Joining or pressing tools reciprocating along one axis
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32321—Discharge generated by other radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
- B29C65/1454—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface scanning at least one of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
- B29C65/1464—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface making use of several radiators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
- B29C65/7841—Holding or clamping means for handling purposes
- B29C65/7847—Holding or clamping means for handling purposes using vacuum to hold at least one of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3475—Displays, monitors, TV-sets, computer screens
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
- B32B2310/0831—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/202—LCD, i.e. liquid crystal displays
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
- G02F1/133331—Cover glasses
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
Definitions
- the present invention relates to an adhesive device that fills and adheres liquid between plate-like bodies, for example, fills a photocurable resin liquid between plate-like bodies such as an image display panel and a transparent protective panel,
- the present invention relates to a bonding apparatus and a method for manufacturing a plate-like bonded body.
- the panel surface of the liquid crystal module and a transparent protective cover such as a tempered glass plate or an acrylic plate provided thereon are provided.
- a gap of about 0.5 to 1 mm in between the structure is adopted so that the liquid crystal module is not affected even if the protective cover is broken by an external impact.
- a liquid crystal panel of liquid crystal modules having different refractive indexes, an air layer forming an air gap, and a protective cover made of glass or plastic are sequentially laminated. Therefore, light reflection occurs at each of the interface between the liquid crystal panel and the air layer, the interface between the air layer and the protective cover, and the interface between the surface of the protective cover and the external atmosphere, thereby reducing the luminance.
- the contrast ratio may deteriorate due to a decrease or light scattering. For example, the display from the liquid crystal panel may be difficult to see under sunlight.
- a transparent optical resin with a refractive index close to that of glass or acrylic is sealed between the liquid crystal panel and the protective cover without adopting an air gap structure, and cured by ultraviolet irradiation or the like.
- Technology. By filling the air gap with this optical resin, the interface between the liquid crystal panel and the air layer and the interface between the air layer and the protective cover are substantially eliminated, and reflection and light scattering at these interfaces are eliminated. Thus, the brightness and contrast ratio of display from the liquid crystal panel can be greatly improved.
- the optical resin when the optical resin is filled between the liquid crystal panel and the protective cover, the optical resin is filled in a state where no bubbles are mixed, and between the liquid crystal panel and the protective cover. It is required that there is no unnecessary protrusion from the gap and the surrounding members are not affected.
- Patent Document 1 A method and apparatus for applying and curing such an optical resin have also been developed (see Patent Document 1).
- a transparent optical resin is applied in the vicinity of the outer edge of the protective cover held by the loader, and this optical resin is semi-cured to form a dam.
- optical resin is applied to the entire surface of the protective cover, and the protective cover is inverted and held.
- the liquid crystal panel is placed so as to face the optical resin coating surface of the protective cover, and the optical resin is pushed into the gap between the liquid crystal panel and the protective cover by bringing them into contact with each other.
- the spread optical resin is blocked by a dam previously formed in the vicinity of the outer edge of the protective cover, so that unnecessary protrusion from the gap between the liquid crystal panel and the protective cover is prevented.
- the optical resin is irradiated over the entire surface to cure the optical resin.
- an optical resin is first applied in the vicinity of the outer edge of the protective cover, and a dam is formed by semi-curing, and then an optical resin is further applied to attach the liquid crystal panel and the protective cover.
- the method of matching requires a step of forming a dam before the liquid crystal panel and the protective cover are bonded together, which increases the number of steps for manufacturing the liquid crystal display device. Further, as the number of manufacturing steps increases, a loader for forming a dam and a loader for performing bonding are necessary, and the configuration of the manufacturing apparatus becomes complicated and large.
- the present invention provides a bonding apparatus that prevents unnecessary protrusion of the optical resin from the gap between the liquid crystal panel and the protective cover without increasing the number of manufacturing steps, and without increasing the complexity and size of the apparatus. It aims at providing the manufacturing method of a plate-shaped adhesive body.
- an adhesive device includes a pair of holding bases that hold a pair of plate-like bodies facing each other, a holding base moving mechanism that moves the pair of holding bases close to or apart from each other, and the pair of the bases.
- An irradiation device for irradiating the photocurable filling liquid filled between the pair of plate-like bodies held on the holding table, and the filling liquid between the pair of plate-like bodies.
- a sensor for detecting the degree of wetting and spreading, and the irradiation device irradiates the filling liquid that spreads in the vicinity of the outer edge between the pair of plate-like bodies according to the detection result of the sensor. Is.
- the method for producing a plate-shaped adhesive body according to the present invention includes a step of holding a pair of plate-shaped bodies facing each other with a pair of holding bases, and photocuring between the pair of plate-shaped bodies facing each other.
- a step of filling the filling liquid a step of moving the pair of holding bases by a holding base moving mechanism, bringing the pair of plate-like bodies close to each other, and spreading the filling liquid between the plate-like bodies;
- the step of detecting the wetting and spreading of the filling liquid by a sensor and the irradiation light irradiates the filling liquid that spreads in the vicinity of the outer edges of the pair of plate-like bodies according to the detection result by an irradiation device.
- a step of irradiating the filling liquid wetted and spread over the entire surface of the pair of plate-like bodies with curing light to form an adhesive body to which the pair of plate-like bodies are bonded.
- the irradiating device irradiates the curing light, and the filling liquid that has spread and spreads to the position is halfway. Let it be a cured state or a fully cured state.
- the filling liquid spreads to every corner of the pair of plate-like bodies and the protrusion of the pair of plate-like bodies from the gap can be prevented. .
- FIG. 1 is a side view showing the bonding apparatus.
- FIG. 2 is a plan view showing the bonding apparatus.
- FIG. 3 is a cross-sectional view showing the bonding apparatus.
- FIG. 4 is a plan view showing another example of the protective panel holding base.
- FIG. 5A is a plan view showing the tip of the discharge nozzle, and
- FIG. 5B is a side view showing the tip of the discharge nozzle.
- FIG. 6 is a cross-sectional view showing a discharge nozzle that discharges the filling liquid.
- 7A is a cross-sectional view illustrating a process in which the liquid crystal panel is adsorbed to the liquid crystal panel holding base and the protective panel is adsorbed to the protective panel holding base.
- FIG. 7B is a cross-sectional view of the discharge nozzle between the liquid crystal panel and the protective panel.
- 7C is a cross-sectional view showing a process of holding the liquid crystal panel and the protective panel at a predetermined interval by bringing the liquid crystal panel holding base and the protective panel holding base close to each other
- FIG. FIG. 7E is a cross-sectional view showing a step of discharging an adhesive from the discharge nozzle
- FIG. 7E is a cross-sectional view showing a step of the discharge nozzle discharging an adhesive and drawing a predetermined drawing pattern
- FIG. FIG. 7G is a cross-sectional view showing a step of retracting the discharge nozzle from the gap between the liquid crystal panel and the protective panel
- FIG. 7G is a cross-sectional view showing a step of pressing the liquid crystal panel and the protective panel and spreading the adhesive. That.
- FIG. 8A is a plan view showing a process in which the liquid crystal panel is adsorbed on the liquid crystal panel holding base and the protective panel is adsorbed on the protective panel holding base.
- FIG. 8B is a plan view showing a process of inserting the discharge nozzle into the gap between the liquid crystal panel and the protection panel.
- FIG. 8C is a plan view showing a step of discharging the adhesive from the discharge nozzle.
- FIG. 8D is a plan view showing a process in which the discharge nozzle discharges the adhesive to draw a predetermined drawing pattern.
- FIG. 8A is a plan view showing a process in which the liquid crystal panel is adsorbed on the liquid crystal panel holding base and the protective panel is adsorbed on the protective panel holding base.
- FIG. 8B is a plan view showing a process of inserting the discharge nozzle into the gap between the liquid crystal panel and
- FIG. 8E is a plan view showing a step of pressing the liquid crystal panel and the protective panel and spreading the adhesive.
- FIG. 8F is a plan view showing a process in which the adhesive uniformly fills every corner without protruding from the gap between the liquid crystal panel and the protective panel.
- FIG. 9 is a side view showing another configuration of the bonding apparatus.
- FIG. 10 is a side view showing the bonding apparatus provided with the adjusting mechanism.
- FIG. 11 is a cross-sectional view showing another bonding apparatus.
- FIG. 12 is a diagram showing a bonding process in a conventional bonding apparatus.
- the bonding apparatus 1 uses a liquid crystal panel 2 and a protective panel 3 that protects the surface of the liquid crystal panel 2 as an example of a pair of plate-like bodies, and an adhesive 7 is filled between the liquid crystal panel 2 and the protective panel 3.
- an adhesive 7 is filled between the liquid crystal panel 2 and the protective panel 3.
- the bonding apparatus 1 moves up and down the liquid crystal panel holding base 4 that holds the liquid crystal panel 2, the protective panel holding base 5 that holds the protective panel 3, and the protective panel holding base 5.
- the liquid crystal panel 2 and the protective panel 3 are moved closer to and away from the actuator 6, the irradiation device 8 that radiates the curing light that cures the adhesive 7 filled in the gap between the liquid crystal panel 2 and the protective panel 3, and the liquid crystal panel 2.
- a sensor 9 for detecting the degree of wetting and spreading of the adhesive 7 filled in the gap between the protective panel 3 and the protective panel 3.
- the bonding apparatus 1 includes a filling mechanism 10 that fills the gap between the liquid crystal panel 2 and the protective panel 3 with the adhesive 7.
- the filling mechanism 10 is inserted between the liquid crystal panel 2 and the protective panel 3 and connected to the discharge nozzle 11 for discharging the adhesive 7, the nozzle moving mechanism 12 for moving the discharge nozzle 11, and the discharge nozzle 11. 7 and a pressing mechanism 13 for discharging the adhesive 7 from the discharge port 17 of the discharge nozzle 11, and these are disposed on the table 14.
- the liquid crystal panel 2 is a liquid crystal cell in which liquid crystal is sealed between two upper and lower glass substrates formed in a substantially rectangular shape, and a protective panel 3 is bonded to one substrate facing the viewer side.
- the protective panel 3 improves the visibility of the liquid crystal panel 2 and protects the liquid crystal panel 2 from impacts and scratches.
- a transparent plate such as tempered glass or an acrylic plate is used.
- the liquid crystal panel holding base 4 that holds the liquid crystal panel 2 holds the liquid crystal panel 2 so that the adhesive surface with the protective panel 3 faces up by means of vacuum suction or the like.
- the protective panel holding base 5 for holding the protective panel 3 is supported on the liquid crystal panel holding base 4 by an actuator 6 so that the adhesion surface of the protective panel 3 to the liquid crystal panel 2 faces up by means of vacuum suction or the like. Hold.
- the liquid crystal panel holding base 4 and the protective panel holding base 5 both have the suction surface of the liquid crystal panel 2 or the protective panel 3 set in a substantially vertical direction, and the main surfaces of the liquid crystal panel 2 and the protective panel 3 are substantially vertical. Hold in the direction.
- the protective panel holding stand 5 is formed with a transparent transmitting portion 20 through which the curing light irradiated from the irradiation device 8 is transmitted, corresponding to the vicinity of the outer edge of the held protective panel 3.
- the transmission part 20 is formed by using a transparent material such as quartz glass, for example, or is formed by drilling an opening through which the curing light passes.
- the entire surface of the protective panel holding base 5 may be made of a transparent material such as quartz glass so as to transmit the curing light corresponding to the vicinity of the outer edge of the protective panel 3.
- the transmission part 20 is formed in a slit shape along the outer edge of the protective panel holding base 5. Thereby, the bonding apparatus 1 can irradiate the curing light along the outer edge of the protective panel 3, and can semi-cure or fully cure the adhesive 7 over the entire circumference of the protective panel 3. Further, as shown in FIG. 4, the transmission part 20 may be formed at regular intervals along the outer edge of the protective panel holding base 5. Thereby, the bonding apparatus 1 irradiates the curing light at regular intervals along the outer edge of the protective panel 3, and semi-cures or fully cures the adhesive 7 at regular intervals over the entire circumference of the protective panel 3. be able to. In addition, the bonding apparatus 1 uses the wraparound and diffusion of the curing light by adjusting the formation interval of the transmission part 20, and irradiates the curing light along the outer edge of the protection panel 3. The adhesive 7 can be semi-cured or fully cured.
- the shape and the shape are appropriately designed according to the size of the liquid crystal panel 2 and the protection panel 3, the intensity of the curing light irradiated by the irradiation device 8, the wavelength, and the like.
- the protective panel holding base 5 is closer to the inner surface side than the transmission part 20 and in the vicinity of the transmission part 20, a sensor hole 21 for allowing the sensor 9 for detecting the wet spread of the adhesive 7 to face the liquid crystal panel holding base 4 side. Is formed.
- the sensor hole 21 is also formed by using a transparent material such as quartz glass, as in the case of the transmissive portion 20, or by forming an opening that allows the sensor 9 to face the liquid crystal panel holding base 4.
- the entire surface of the protective panel holding base 5 may be made of a transparent material such as quartz glass so that the sensor 9 faces the liquid crystal panel holding base 4 side.
- the sensor hole 21 is formed in accordance with the location of the protective panel holding base 5 where the wet spread of the adhesive 7 is to be measured.
- the sensor holes 21 may be formed at regular intervals along the outer edge of the protective panel holding base 5.
- the sensor hole 21 may be formed in the vicinity of each corner portion of the protection panel holding base 5 formed in a rectangular shape or in an intermediate position between the sides.
- the formation position and number of sensor holes 21 are the application pattern and viscosity of the adhesive 7 filling the gap between the liquid crystal panel 2 and the protective panel 3, the size of the liquid crystal panel 2 and the protective panel 3, the measuring method and accuracy of the sensor 9, etc. It is determined appropriately according to
- the irradiation device 8 irradiates the photocurable adhesive 7 with curing light.
- the adhesive 7 which is an ultraviolet curable resin is used, the irradiation device 8 irradiates ultraviolet rays.
- the irradiation device 8 is installed above the protective panel holding base 5 and immediately above the transmission part 20, and the irradiation part 8 a for irradiating the curing light is directed to the protective panel holding base 5 side.
- the irradiating device 8 may irradiate the curing light with a spot or a line. Moreover, the irradiation device may scan and irradiate the curing light along one side of the rectangular protection panel holding stand 5, for example.
- the transmission unit 20 is formed in a circular shape or slit shape through which the curing light is transmitted, and when the curing light is irradiated in a line shape or by scanning, It is formed in a slit shape.
- a sensor 9 for detecting the wet spread of the adhesive 7 filled in the gap between the liquid crystal panel 2 and the protective panel 3 indicates that the adhesive 7 has spread to a predetermined position in the gap between the liquid crystal panel 2 and the protective panel 3. It is a sensor to detect.
- the sensor 9 can be a laser displacement sensor that emits laser light, receives the reflected light, and measures a change in the amount of reflected light.
- the sensor 9 irradiates the transparent protective panel 3 with laser light through the sensor hole 21 and receives reflected light from the liquid crystal panel 2. And when the sensor 9 irradiates the adhesive 7 with a laser beam, reflected light will be scattered by the adhesive 7, and the received light quantity of reflected light will reduce. As a result, the sensor 9 can detect that the adhesive 7 has spread to a predetermined position in the gap between the liquid crystal panel 2 and the protective panel 3.
- the bonding apparatus 1 is provided with the sensor 9 and the sensor hole 21 in the vicinity of the outer edge of the protective panel 3 held by the protective panel holding base 5, so that the adhesive 7 is interposed between the liquid crystal panel 2 and the protective panel 3. Can be detected to have spread to the vicinity of the outer edge.
- the adhesive device 1 detects that the adhesive 7 has spread to the position by the sensor 9, the irradiation device 8 irradiates the curing light with the irradiation device 8, and the adhesive 7 spread to the position is semi-cured or fully cured.
- the adhesive device 1 causes the adhesive 7 to spread to every corner of the liquid crystal panel 2 and the protection panel 3 when the liquid crystal panel 2 and the protection panel 3 are pressed, and the gap between the liquid crystal panel 2 and the protection panel 3. It is possible to prevent the protrusions from protruding.
- the adhesive 7 is spread all over the gap between the liquid crystal panel 2 and the protective panel 3, and then the curing light is irradiated over the entire surface to cure the adhesive 7.
- the actuator 6 that supports the protective panel holding base 5 moves the protective panel holding base 5 up and down in the direction of the arrow Z and the counter arrow Z in FIG.
- the actuator 6 raises the protection panel holding base 5 when holding the liquid crystal panel 2 and the protection panel 3 on the stages 4 and 5, and fills the gap between the liquid crystal panel 2 and the protection panel 3 with the adhesive 7.
- the protective panel holding base 5 is lowered.
- the protective panel holding base 5 is lowered so that the discharge nozzle 11 described later can be inserted through the liquid crystal panel 2 and the protective panel 3, and the adhesive 7 is liquid crystal.
- the panel 2 and the protective panel 3 are held at a predetermined interval that can be applied while being in contact.
- the actuator 6 further lowers the protective panel holding base 5, presses the protective panel 3 toward the liquid crystal panel 2 with a predetermined force for a predetermined time, and presses the adhesive 7 to the liquid crystal panel 2. And spread over the entire surface of the protective panel 3.
- the discharge nozzles 11 for discharging the adhesive 7 between the liquid crystal panel 2 and the protective panel 3 are the main surfaces of the liquid crystal panel 2 held by the liquid crystal panel holding base 4 and the protective panel 3 held by the protective panel holding base 5. And a cylindrical body parallel to each other.
- the discharge nozzle 11 is connected to the syringe 15 that supplies the adhesive 7 so that it can advance and retreat in the gap between the liquid crystal panel 2 and the protective panel 3 that are close to each other without contacting the two panels. Supported by height.
- the discharge nozzle 11 is moved by the nozzle moving mechanism 12 in the direction opposite to the arrow X in FIG. 1 and in the direction indicated by the arrow Y in FIG. 2 and in the direction opposite to the arrow Y, and will be described later in the gap between the liquid crystal panel 2 and the protection panel 3.
- a predetermined discharge pattern is drawn.
- the discharge nozzle 11 has the top surface of the tip thereof cut obliquely so that the discharge port 17 faces upward in the vertical direction.
- the discharge nozzle 11 first attaches the adhesive 7 to the protective panel 3 positioned above, and then attaches it to the lower liquid crystal panel 2 by gravity. Then, the discharge nozzle 11 moves in the gap between the liquid crystal panel 2 and the protective panel 3 while discharging the adhesive 7, and the adhesive 7 is always applied to both surfaces of the liquid crystal panel 2 and the protective panel 3 as shown in FIG. 6. Apply while adhering to the surface.
- the bonding apparatus 1 directs the discharge port 17 of the discharge nozzle 11 upward and always applies the adhesive 7 so as to adhere to both surfaces of the liquid crystal panel 2 and the protective panel 3. 7 can be prevented from remaining in the bubbles.
- the discharge nozzle 11 is formed with a diameter ⁇ of, for example, 6 mm ⁇ ⁇ ⁇ 2 mm. This diameter ⁇ is determined according to the gap between the liquid crystal panel 2 and the protective panel 3, and a value that does not contact both panels is selected. Further, the discharge nozzle 11 is formed using metal or industrial plastic, and has rigidity capable of discharging the adhesive 7 without bending. That is, the discharge nozzle 11 applies the adhesive 7 without contacting the liquid crystal panel 2 and the protection panel 3.
- the discharge nozzle 11 is formed such that the angle ⁇ of the discharge port 17 is 90 °> ⁇ ⁇ 30 °.
- the angle ⁇ is 90 ° or more, the discharge nozzle 11 cannot attach the adhesive 7 to the protective panel 3 at the start of discharge, and the adhesive 7 remains in the discharge port 17, and is in an unexpected place. There is a risk that the adhesive will adhere.
- the angle ⁇ is less than 30 °, the discharge nozzle 11 is unlikely to drop the adhesive 7 to the lower liquid crystal panel 2 side at the beginning of discharge, and there is a risk of entraining bubbles.
- the angle ⁇ is determined according to the viscosity of the adhesive 7 within a range of 90 °> ⁇ ⁇ 30 °, and the adhesive 7 first adheres to the upper protective panel 3 and entrains bubbles. Instead, an angle suitable for adhering to the liquid crystal panel 2 and discharging while contacting both panels is selected.
- the nozzle moving mechanism 12 that moves the discharge nozzle 11 includes a first nozzle stage 29 on which the syringe 15 is placed, and a second nozzle stage 30 on which the first nozzle stage 29 is placed.
- the syringe 15 is mounted on the upper surface 29a, and the slider 32 is attached to the lower surface 29b.
- the first nozzle stage 29 is movable in the arrow Y direction and the counter arrow Y direction in FIG. 2 when the slider 32 slides on the first guide rail 33 installed on the second nozzle stage 30. Yes.
- the second nozzle stage 30 has a first guide rail 33 that guides the first nozzle stage 29 on the upper surface 30a, and a slider 35 that fits the second guide rail 34 of the table 14 on the lower surface 30b. Is formed.
- the second nozzle stage 30 is movable in the arrow X direction and the counter arrow X direction in FIG. 1 when the slider 35 slides on the second guide rail 34 formed on the table 14.
- the bonding apparatus 1 includes two first nozzle stages 29 and applies the adhesive 7 with the two discharge nozzles 11.
- the nozzle moving mechanism 12 includes a control unit 31 that controls the movement of the first nozzle stage 29 and the second nozzle stage 30, and in conjunction with the lifting and lowering operations of the liquid crystal panel holding table 4 and the protection panel holding table 5, By moving the discharge nozzle 11 in a substantially horizontal direction, the liquid crystal panel 2 and the protective panel 3 are not contacted with each other, and are inserted into or retracted from the gap between the two panels.
- each discharge nozzle 11 is not limited to two in the bonding apparatus 1, and one or three or more may be mounted. Also in these cases, each discharge nozzle 11 is connected to the syringe 15 placed on the first nozzle stage 29, and each first nozzle stage 29 is slidably supported by the second nozzle stage 30. ing.
- the adhesive 7 discharged from the discharge nozzle 11 is stored.
- the syringe 15 is connected to a pressing mechanism 13 that discharges the stored adhesive 7 from the discharge nozzle 11, and controls the discharge and discharge stop of the adhesive 7 and the discharge pressure.
- a compressed dry air cylinder is used as the pressing mechanism 13, and the supply and supply stop of the gas into the syringe 15 and the supply pressure are controlled by the control unit 31, and the gas is supplied into the syringe 15 at a predetermined pressure.
- the adhesive 7 is discharged from the discharge nozzle 11.
- the adhesive 7 discharged from the discharge nozzle 11 is refracted so as not to impair the visibility of the liquid crystal panel 2 by suppressing light scattering even when it is filled between the liquid crystal panel 2 and the protective panel 3.
- a transparent ultraviolet curable elastic resin with a controlled rate is used.
- the cured resin layer formed in the gap between the liquid crystal panel 2 and the protection panel 3 by curing the adhesive 7 has a transmittance in the visible light region of 90% or more and a storage elastic modulus at 25 ° C. of 1. 0.0 ⁇ 10 7 Pa or less, preferably 1 ⁇ 10 3 to 1 ⁇ 10 6 Pa, and the resin composition for forming the cured resin layer has a cure shrinkage of 5% or less, preferably 4.5%. In the following, those with 0 to 2% are more preferably used.
- the raw material of the adhesive 7 is not particularly limited, but it is preferable to use an ultraviolet curable resin composition from the viewpoint of improving productivity.
- Examples of such a resin composition include one or more polymers such as polyurethane acrylate, polyisoprene acrylate or esterified product thereof, terpene hydrogenated resin, butadiene polymer, isobornyl acrylate, dicyclopentenyloxy, and the like.
- a resin composition containing one or more acrylate monomers such as ethyl methacrylate and 2-hydroxybutyl methacrylate and a photopolymerization initiator such as 1-hydroxy-cyclohexyl-phenyl-ketone can be suitably used.
- the protective panel 3 is often provided with a function of cutting the ultraviolet region from the viewpoint of ultraviolet protection for the liquid crystal panel 2, as the photopolymerization initiator, a photopolymerization initiator that can be cured in the visible light region (for example, it is preferable to use a combination of trade name SpeedCure TPO, Nippon Siber Hegner Co., Ltd., etc.).
- the resin composition constituting the adhesive 7 has a storage elastic modulus (25 ° C.) of a cured resin obtained by curing it by ultraviolet light irradiation of 1 ⁇ 10 7 Pa or less, preferably 1 ⁇ 10 3 to 1 ⁇ . 10 6 Pa, the refractive index of the cured resin is preferably 1.45 or more and 1.55 or less, more preferably 1.51 or more and 1.52 or less, and the thickness of the resin cured product layer is 100 ⁇ m.
- the transmittance is adjusted so that the transmittance in the visible light region is 90% or more.
- the storage elastic modulus (25 ° C.) of the cured resin obtained by curing the resin component is 1 ⁇ 10 7 Pa.
- the resin composition used as such a resin cured material is the resin composition which comprises the adhesive agent 7 which is used for the adhesive device 1 and adhere
- the resin composition constituting the adhesive 7 is adjusted so that the curing shrinkage rate is preferably 5% or less, more preferably 4.5% or less, and further preferably 0 to 2%. Therefore, the internal stress accumulated in the cured resin can be reduced when the resin composition is cured, and the interface between the cured resin layer and the liquid crystal panel 2 or the protective panel 3 can be prevented from being distorted.
- the adhesive 7 when the adhesive 7 is interposed between the liquid crystal panel 2 and the protective panel 3 and the resin composition is cured, the light generated at the interface between the cured resin layer and the liquid crystal panel 2 or the protective panel 3 is generated. Scattering can be reduced, the brightness of the display image can be increased, and visibility can be improved.
- the degree of internal stress accumulated in the cured resin when the adhesive 7 is cured depends on the average surface roughness of the cured resin obtained by dropping the resin composition on a flat plate and curing it. Can be evaluated. For example, if the average surface roughness of a resin cured product obtained by dropping 2 mg of a resin composition onto a glass plate and curing it by UV irradiation at a curing rate of 90% or more is 6 nm or less, although the resin composition is interposed between the protective part 3 and the distortion generated at the interface when it is cured can be ignored in practice, according to the adhesive 7, this average surface roughness is 6 nm or less, Preferably, it can be 1 to 3 nm.
- the adhesive 7 can be filled while adhering to the liquid crystal panel 2 and the protective panel 3 at the same time, and the viscosity is selected so as to maintain the adhering state to both the panels 2 and 3 without flowing out from the outer edges of the both panels 2 and 3 For example, it is used in the range of 1000 mPa to 4000 mPa. Further, the gap dimension between the liquid crystal panel 2 and the protective panel 3 is set in the range of 3.5 mm to 10 mm according to the viscosity of the adhesive 7.
- the bonding apparatus 1 First, in the bonding apparatus 1, the liquid crystal panel holding base 4 and the protective panel holding base 5 are separated by the actuator 6, the liquid crystal panel 2 is adsorbed to the liquid crystal panel holding base 4, and the protective panel 3 is attached to the protective panel holding base 5. Adsorbed (FIG. 7A, FIG. 8A). At this time, the bonding apparatus 1 performs a predetermined alignment for facing the liquid crystal panel 2 and the protection panel 3 by a known method.
- the discharge nozzle 11 is moved in the counter arrow X direction in FIG. 1 by the control means 31 so that the first nozzle stage 29 is retreated from the gap between the liquid crystal panel 2 and the protective panel 3 in the counter arrow X direction. Yes.
- the bonding apparatus 1 causes the control means 31 to slide the two first nozzle stages 29 in the direction of the arrow X, thereby causing the discharge nozzles 11 to move to the liquid crystal panel. 2 and the side surfaces 2a and 3a on one end side in the longitudinal direction of the protection panel 3 are inserted through the gaps (FIGS. 7B and 8B).
- the discharge nozzle 11 is inserted at a height that does not contact both panels when the liquid crystal panel 2 and the protection panel 3 are close to each other (FIG. 7B).
- the discharge nozzle 11 has a discharge port 17 positioned in the vicinity of the side surfaces 2b and 3b on the other end side in the longitudinal direction of the liquid crystal panel 2 and the protective panel 3 (FIG. 8B).
- the bonding apparatus 1 operates the actuator 6 to bring the liquid crystal panel holding base 4 and the protective panel holding base 5 close to each other, and holds the liquid crystal panel 2 and the protective panel 3 at a predetermined interval (FIG. 7C).
- the bonding apparatus 1 discharges the adhesive 7 from the discharge nozzle 11 while moving the first and second nozzle stages 29, 30 by the control means 31, and is predetermined in the gap between the liquid crystal panel 2 and the protection panel 3.
- the filling pattern is drawn (FIGS. 7D and 8C).
- the discharge nozzle 11 discharges the adhesive 7 while moving in the opposite arrow X direction, the arrow Y direction, and the opposite arrow Y direction. Accordingly, the discharge nozzle 11 prevents the discharge port 17 from entering the adhesive 7 filled in the gap between the liquid crystal panel 2 and the protective panel 3, and prevents the adhesive 7 from adhering to the nozzle body.
- the bonding apparatus 1 can prevent a situation where the adhesive 7 adheres to an unexpected location due to the adhesive 7 attached to the discharge nozzle 11.
- the discharge nozzle 11 is formed with the discharge port 17 facing upward, so that when the adhesive 7 starts to be discharged, the adhesive 7 is attached to the upper protective panel 3 and then bonded.
- the agent 7 descends and adheres to the lower liquid crystal panel 2.
- the discharge nozzle 11 discharges the adhesive 7 while moving in the opposite arrow X direction, the arrow Y direction, and the opposite arrow Y direction, and draws a predetermined drawing pattern P1 (FIGS. 7E and 8D).
- the discharge nozzle 11 applies the adhesive 7 while adhering to both the liquid crystal panel 2 and the protective panel 3 at the same time, so that bubbles can be prevented from remaining in the adhesive 7.
- Examples of the resin composition constituting the adhesive 7 include 70 parts by weight of an esterified product of maleic anhydride adduct of polyisoprene polymer and 2-hydroxyethyl methacrylate, 30 parts by weight of dicyclopentenyloxyethyl methacrylate. Kneading machine, 10 parts by weight of 2-hydroxybutyl methacrylate, 30 parts by weight of terpene-based hydrogenated resin, 140 parts by weight of butadiene polymer, 4 parts by weight of photopolymerization initiator, and 0.5 parts by weight of photopolymerization initiator for visible light region The resin composition kneaded in was used.
- the drawing pattern P1 of the adhesive 7 filled in the gap between the liquid crystal panel 2 and the protective panel 3 is a thick line drawn along the longitudinal direction at the center of the liquid crystal panel 2 and the protective panel 3.
- the thick line portion 40 is formed at substantially the center along the longitudinal direction of the liquid crystal panel 2 and the protection panel 3, and the thin line portion 41 is continuously provided from both ends in the longitudinal direction of the thick line portion 40 at the four corners of the liquid crystal panel 2 and the protection panel 3. It is formed toward.
- the drawing pattern P1 is formed by drawing one of the discharge nozzles 11a and the other discharge nozzle 11b of the bonding apparatus 1 including the two discharge nozzles 11a and 11b symmetrically in the short direction via the thick line portion 40.
- one discharge nozzle 11a draws a thick line portion 40a and a thin line portion 41a on one side of the drawing pattern P1
- the other discharge nozzle 11b draws a thick line portion 40b and a thin line portion 41b on the other side of the drawing pattern P1.
- the two discharge nozzles 11a and 11b are moved synchronously by the nozzle moving mechanism 12 and moved in the direction of the arrow Y or the direction of the opposite arrow Y while retreating in the direction of the opposite arrow X, respectively.
- the discharge nozzle 11 makes the discharge amount of the adhesive 7 per unit time constant and controls the moving speed of the first and second nozzle stages 29 and 30 so that the thick line portion 40 and the thin line portion 41 Can be drawn separately.
- the bonding apparatus 1 can draw the drawing pattern P1 simultaneously by moving the two discharge nozzles 11a and 11b in synchronization, and can apply the adhesive 7 in a short time. Further, the bonding apparatus 1 can uniformly fill the adhesive 7 over both the panels 2 and 3 by drawing a symmetrical drawing pattern P1.
- the bonding apparatus 1 includes a thick line portion 40 drawn along the longitudinal direction in the central portion of the liquid crystal panel 2 and the protection panel 3, and a thin line portion 41 extending toward the four corners of the liquid crystal panel 2 and the protection panel 3.
- the sensors 9 are provided, for example, in the vicinity of the four corners of the protective panel holding base 5 and in the vicinity of the intermediate portions of the four sides to detect the wet spread of the adhesive 7.
- the irradiation device 8 is also installed in the vicinity of the installation position of the sensor 9, and the transmission unit 20 and the sensor hole 21 are provided on the protective panel holding base 5 according to the irradiation device 8 and the sensor 9. Is formed (FIG. 4).
- the pattern drawn by the bonding apparatus 1 is not limited to the pattern P1 shown in FIG. 8D, and no bubbles are mixed in depending on the size of the liquid crystal panel 2 and the protective panel 3, the viscosity of the adhesive 7, and the like, for a predetermined time.
- Various patterns to be filled to every corner are selected.
- the bonding apparatus 1 can employ
- the bonding apparatus 1 When the predetermined drawing pattern is completely formed in the gap between the liquid crystal panel 2 and the protective panel 3, the bonding apparatus 1 operates the first and second nozzle stages 29 and 30 by the control means 31 so that the discharge nozzle 11 is liquid crystal. It retracts from the gap between the panel 2 and the protective panel 3 (FIG. 7F).
- the bonding apparatus 1 lowers the protective panel holding base 5 by the actuator 6, presses the liquid crystal panel 2 and the protective panel 3, and spreads the adhesive 7 (FIGS. 7G and 8E).
- the bonding apparatus 1 since the drawing pattern P ⁇ b> 1 is drawn in the target shape in the center of both the panels 2 and 3, the bonding apparatus 1 spreads uniformly over both the panels 2 and 3.
- the bonding apparatus 1 is provided with the thin wire portions 41 extending at the four corners of the both panels 2 and 3, so that the adhesive 7 is surely spread to the four corners of the both panels 2 and 3.
- the pressing force and pressing time by the actuator 6 are determined according to the gap between the liquid crystal panel 2 and the protective panel 3, the viscosity of the adhesive 7, the coating amount, and the like. For example, the pressing force is 2.5 kPa and the pressing time is 0.3 seconds.
- the bonding apparatus 1 releases the pressure applied by the actuator 6 and also releases the adsorption of the liquid crystal panel 4 by the liquid crystal panel holding base 4 and the adsorption of the protective panel 3 by the protective panel holding base 5. Leave for 5 minutes.
- the sensor 9 irradiates the protective panel 3 side with laser light through the sensor hole 21, and receives reflected light from the liquid crystal panel 2.
- the sensor 9 irradiates the adhesive 7 with the laser light wet and spreads the reflected light, thereby reducing the amount of received light.
- the bonding apparatus 1 emits curing light from the irradiation apparatus 8.
- the bonding apparatus 1 is semi-cured or fully cured by irradiating the curing light to the adhesive 7 that has spread to a predetermined position near the outer edges of the liquid crystal panel 2 and the protective panel 3.
- the adhesive device 1 can uniformly fill the gap between the liquid crystal panel 2 and the protective panel 3 with the adhesive 7 and prevent the liquid crystal panel 2 and the protective panel 3 from protruding from the gap (see FIG. 8F).
- the adhesive 7 is semi-cured, the familiarity with the adhesive 7 irradiated with curing light in a later process becomes good. Further, when the adhesive 7 is fully cured, it is possible to reliably prevent the adhesive 7 from protruding between the liquid crystal panel 2 and the protective panel 3.
- the bonding apparatus 1 includes a plurality of irradiation apparatuses 8 and a plurality of sensors 9, one or a plurality of irradiation apparatuses 8 are linked to one sensor 9 to irradiate curing light. That is, when the degree of wetting and spreading of the adhesive 7 varies depending on the location, when a certain sensor 9 detects the arrival of the adhesive 7, one or a plurality of irradiation devices 8 corresponding to the sensor 9 irradiate the curing light.
- the bonding apparatus 1 may vary from place to place with respect to the irradiation timing of the irradiation apparatus 8. However, since the bonding apparatus 1 irradiates the curing light through the transmission part 20 provided on the protective panel holding stand 5, the range of wraparound due to the reflection or scattering of the curing light is narrow, so that the predetermined position is reached. There is almost no risk that the curing light is irradiated over a wide range to the adhesive 7 that has not reached.
- the adhesive device 1 is formed by irradiating the entire surface of the liquid crystal panel 2 and the protective panel 3 with curing light by an irradiation device that irradiates curing light such as ultraviolet rays (not shown) after the adhesive 7 is filled to every corner of the gap.
- an irradiation device that irradiates curing light such as ultraviolet rays (not shown) after the adhesive 7 is filled to every corner of the gap.
- curing light such as ultraviolet rays
- the bonding apparatus 1 may detect the speed of the adhesive 7 spreading through the gap between the liquid crystal panel 2 and the protective panel 3 by the sensor 9. In this case, the bonding apparatus 1 calculates the time for the adhesive 7 to reach a predetermined position in the vicinity of the outer edges of the liquid crystal panel 2 and the protection panel 3 from the speed detected by the sensor 9, and the irradiation apparatus 8 at that time. Irradiate curing light.
- the wetting and spreading speed of the adhesive 7 includes, for example, two laser displacement sensors that emit the laser light described above, receive the reflected light, and measure the change in the amount of reflected light. It can be detected that two detection positions have been reached, and can be calculated from the difference between the distance between the two detection positions and the detected time. Further, the irradiation timing of the curing light by the irradiation device 8 is determined based on the distance between the detection position and a predetermined position near the outer edge of the liquid crystal panel 2 and the protective panel 3 and the speed of the adhesive 7. The time to reach can be calculated and determined.
- the bonding apparatus 1 also includes an irradiating unit 8a for irradiating the curing light with a liquid crystal panel as shown in FIG. 2 and the protective panel 3 may be directed to irradiate the curing light parallel to the liquid crystal panel 2 and the protective panel 3.
- the bonding apparatus 1 has a sensor hole 21 formed in the protective panel holding base 5, and a sensor 9 that detects the wetting and spreading of the adhesive 7 is provided above the sensor hole 21 so that the adhesive 7 gets wet to a predetermined position. The spread or the speed of the adhesive 7 is detected. Then, when the adhesive device 1 detects that the adhesive 7 has spread to a predetermined position or calculates the irradiation timing from the speed of the adhesive 7, the irradiation device 8 irradiates the curing light. The irradiation device 8 makes curing light incident from the gap between the liquid crystal panel 2 and the protection panel 3 and irradiates the adhesive 7 to be in a semi-cured state or a fully cured state.
- the adhesive 7 is predetermined when the irradiation timing is early. There is a possibility that the adhesive 7 may not be filled to every corner of the liquid crystal panel 2 and the protection panel 3 because the liquid crystal panel 2 and the protection panel 3 are in a semi-cured state or a fully cured state before being wet spread to the position.
- the curing light emitted from one irradiation apparatus 8 does not spread to a predetermined position.
- the adhesive 7 may be irradiated. Therefore, the setting of the irradiation timing by the sensor 9 is required to be more accurate than the embodiment in which the curing light is irradiated from above the protective panel holding base 5 through the transmission part 20.
- the curing light is set according to the design of the irradiation unit 8a.
- the curing light can be irradiated more efficiently.
- the bonding apparatus 1 adjusts the inclination of the liquid crystal panel holding base 4 and / or the protective panel holding base 5 in order to eliminate the variation in the wet spread of the adhesive 7 caused by the location of the liquid crystal panel 2 and the protective panel 3.
- An adjusting mechanism 50 may be provided.
- the adjustment mechanism 50 changes the interval between the liquid crystal panel 2 and the protective panel 3 by changing the inclination of the liquid crystal panel holding base 4 and / or the protective panel holding base 5, and wets the adhesive 7 different from place to place. It adjusts the degree of spread.
- the bonding apparatus 1 prevents the adhesive 7 from locally reaching the predetermined position early and prevents the curing light from being irradiated earlier than the other places, and the predetermined position is obtained by reflecting or scattering the curing light. It is possible to prevent the curing light from being applied to the adhesive 7 that has not reached the maximum.
- such an adjustment mechanism 50 specifically includes the contact type digital sensor 51 and the relative relationship between the liquid crystal panel holding base 4 and the protection panel holding base 5 according to the detection result of the digital sensor 51.
- a tilting member 52 that adjusts the tilt is provided.
- the contact-type digital sensor 51 is brought into contact with, for example, the four corners of the liquid crystal panel holding base 4 from the outside, and the amount of expansion / contraction of each of the digital sensors 51 is compared.
- the inclination with respect to is detected.
- the tilting member 52 includes an actuator, contacts the four corners of the liquid crystal panel holding base 4 from the outside, and adjusts the relative tilting of the panels 2 and 3 by making the protruding amounts of the tilting members 52 different. To do.
- the adjustment mechanism 50 detects the degree of wetting and spreading of the adhesive 7 by the sensor 9, and when variation occurs depending on the location, the tilting member 52 is operated to operate the liquid crystal panel holding base 4 and / or the protective panel holding base 5. By finely adjusting the tilt, the distance between the liquid crystal panel 2 and the protective panel 3 is changed depending on the location. As a result, the adjusting mechanism 50 can locally slow down or speed up the speed at which the adhesive 7 spreads out, thereby making the degree of wet spreading of the adhesive 7 almost uniform at any location.
- the bonding apparatus 1 reduces the variation in the timing of irradiating the curing light for each irradiation apparatus 8, and the curing light reaches the adhesive 7 that has not reached the predetermined position near the outer edges of the liquid crystal panel 2 and the protective panel 3. Can be prevented from being irradiated.
- the adjustment mechanism 50 allows the digital sensor 51 to use the liquid crystal panel holder 4 and the protective panel before irradiating the entire surface of the liquid crystal panel 2 and the protective panel 3 with the curing light. While monitoring the relative inclination of the holding base 5, the inclination of the holding bases 4 and 5 is adjusted by the tilting member 52 so that the panels 2 and 3 are parallel to each other.
- any sensor that can detect the relative inclination between the liquid crystal panel holding base 4 and the protective panel holding base 5 can be used as the adjustment mechanism 50.
- the adjusting mechanism 50 can use any mechanism that finely adjusts the tilt of the liquid crystal panel holding base 4 and / or the protective panel holding base 5 as the tilting member 52, and appropriately according to the design constraints of the bonding apparatus 1. Can design.
- the bonding apparatus 1 may be configured such that the protective panel holding base 5 is disposed on the inner side of the outer edge of the protective panel 3 and the transmissive portion 20 is not provided.
- the bonding apparatus 1 does not need to provide the transmission part 20 on the protective panel holding base 5.
- the side surface of the protective panel holding base 5 as a boundary of the irradiation region of the curing light, the side surface can be used as a light shielding portion for the curing light.
- the bonding apparatus 1 makes the liquid crystal panel 2 and the protective panel 3 face each other, and the discharge nozzle 11 is inserted into the gap between the panels 2 and 3 to pass the adhesive 7 between the panels 2 and 3.
- the adhesive panel can be applied to a method of applying the adhesive 7 to the protective panel 3 or the liquid crystal panel 2 and then inverting the panel and bonding it to the other panel.
- the present invention can be used not only for bonding the liquid crystal panel 2 and the protection panel 3 but also for bonding the plasma display and its protection panel. Further, it can be used for bonding various plate-like bodies such as various monitors and protective panels such as a television, a mobile phone, a PDA, a portable game machine, a digital still camera, a video camera, a digital photo frame, an organic EL, and a touch panel.
- various plate-like bodies such as various monitors and protective panels
- various monitors and protective panels such as a television, a mobile phone, a PDA, a portable game machine, a digital still camera, a video camera, a digital photo frame, an organic EL, and a touch panel.
- 1 Adhering device 2 Liquid crystal panel, 3 Protection panel, 4 Liquid crystal panel holding stand, 5 Protection panel holding stand, 6 Actuator, 7 Adhesive, 8 Irradiation device, 9 Sensor, 10 Filling mechanism, 11 Discharge nozzle, 12 Nozzle moving mechanism , 13 pressing mechanism, 14 table, 15 syringe, 17 discharge port, 20 transmission part, 21 sensor hole, 29 first nozzle stage, 30 second nozzle stage, 31 control means, 32 slider, 33 first guide rail 34 Second guide rail, 35 Slider, 40 Thick line part, 41 Thin line part, 50 Adjustment mechanism, 51 Digital sensor, 52 Tilt member
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Electromagnetism (AREA)
- Nonlinear Science (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Mathematical Physics (AREA)
- Liquid Crystal (AREA)
Abstract
Description
本出願は、日本国において2009年10月7日に出願された日本特許出願番号特願2009-232963を基礎として優先権を主張するものであり、この出願を参照することにより、本出願に援用される。
Claims (16)
- 一対の板状体を対向保持する一対の保持台と、
上記一対の保持台を近接又は離間させる保持台移動機構と、
上記一対の保持台に保持されている上記一対の板状体間に充填される光硬化性の充填液に対して硬化光を照射する照射装置と、
上記充填液の上記一対の板状体間での濡れ広がり具合を検知するセンサとを備え、
上記照射装置は、上記センサの検知結果に応じて、上記一対の板状体間の外側縁近傍に濡れ広がった上記充填液に対して硬化光を照射する板状体の接着装置。 - 上記センサは、上記充填液が上記一対の板状体間の所定位置まで濡れ広がったことを検知する請求項1記載の接着装置。
- 上記センサは、上記充填液が濡れ広がる速度を検知する請求項1記載の接着装置。
- 上記照射装置は、上記一対の板状体の外側縁近傍に設けられるとともに上記硬化光を照射する照射部が上記一対の板状体の主面と略直交する方向に向けられている請求項1~3何れか1項に記載の接着装置。
- 上記一対の保持台のうち、上記照射装置が設けられた側の保持台は、上記硬化光を上記板状体側に透光可能とされている請求項4記載の接着装置。
- 上記照射装置は、上記硬化光を照射する照射部が上記一対の板状体の間隙に向けられ、上記硬化光を上記一対の板状体と平行に照射する請求項1~3何れか1項に記載の接着装置。
- 上記保持台移動機構は、上記一対の板状体の相互の傾きを制御することにより、上記充填液の濡れ広がり具合を制御する請求項1~3何れか1項に記載の接着装置。
- 上記一対の保持台に対向して保持された上記一対の板状体の間隙に挿通され、上記充填液を吐出する吐出ノズルと、
上記吐出ノズルを上記一対の板状体の間隙を移動させるノズル移動機構と、
上記吐出ノズルより上記充填液を吐出させる押し出し機構とを有し、
上記充填液を対向して保持されている上記一対の板状体に接触しながら塗布する充填機構を備える請求項1~3何れか1項に記載の接着装置。 - 一対の板状体を、一対の保持台で相対向して保持する工程と、
相対向する上記一対の板状体間に、光硬化性の充填液を充填する工程と、
保持台移動機構によって上記一対の保持台を移動し、上記一対の板状体を近接させ、上記充填液を上記板状体間に濡れ広がらせる工程と、
センサによって上記充填液の濡れ広がり具合を検知する工程と、
照射装置によって上記検知結果に応じて、上記一対の板状体の外側縁近傍に濡れ広がった上記充填液に対して硬化光を照射する工程と、
上記一対の板状体の全面に亘って濡れ広がった上記充填液に対して硬化光を照射して上記一対の板状体が接着された接着体を形成する板状接着体の製造方法。 - 上記センサは、上記充填液が上記一対の板状体間の所定位置まで濡れ広がったことを検知する請求項9記載の板状接着体の製造方法。
- 上記センサは、上記充填液が濡れ広がる速度を検知する請求項9記載の板状接着体の製造方法。
- 上記照射装置は、上記一対の板状体の外側縁近傍に設けられるとともに上記硬化光を照射する照射部が上記一対の板状体の主面と略直交する方向に向けられている請求項9~11何れか1項に記載の板状接着体の製造方法。
- 上記一対の保持台のうち、上記照射装置が設けられた側の保持台は、上記硬化光を上記板状体側に透光可能とされている請求項12記載の板状接着体の製造方法。
- 上記照射装置は、上記硬化光を照射する照射部が上記一対の板状体の間隙に向けられ、上記硬化光を上記一対の板状体と平行に照射する請求項9~11何れか1項に記載の板状接着体の製造方法。
- 上記保持台移動機構は、上記一対の板状体の相互の傾きを制御することにより、上記充填液の濡れ広がり具合を制御する請求項9~11何れか1項に記載の板状接着体の製造方法。
- 上記一対の板状体は、一方が液晶表示装置であり、他方が上記液晶表示装置の表示面上に貼着される保護パネルである請求項9~11何れか1項に記載の板状接着体の製造方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/500,537 US9789674B2 (en) | 2009-10-07 | 2010-10-04 | Bonding device and method for producing plate-shaped bonded assembly |
KR1020127011432A KR101752020B1 (ko) | 2009-10-07 | 2010-10-04 | 접착 장치, 판상 접착체의 제조 방법 |
EP10821965.0A EP2487670B1 (en) | 2009-10-07 | 2010-10-04 | Bonding device and method for manufacturing tabular bonded body |
CN201080055585.7A CN102640201B (zh) | 2009-10-07 | 2010-10-04 | 粘接装置、板状粘接体的制造方法 |
HK13100320.6A HK1174138A1 (en) | 2009-10-07 | 2013-01-09 | Bonding device and method for manufacturing tabular bonded body |
US15/700,785 US10737477B2 (en) | 2009-10-07 | 2017-09-11 | Bonding device and method for producing plate-shaped bonded assembly |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009232963 | 2009-10-07 | ||
JP2009-232963 | 2009-10-07 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/500,537 A-371-Of-International US9789674B2 (en) | 2009-10-07 | 2010-10-04 | Bonding device and method for producing plate-shaped bonded assembly |
US15/700,785 Division US10737477B2 (en) | 2009-10-07 | 2017-09-11 | Bonding device and method for producing plate-shaped bonded assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2011043295A1 true WO2011043295A1 (ja) | 2011-04-14 |
Family
ID=43856750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2010/067369 WO2011043295A1 (ja) | 2009-10-07 | 2010-10-04 | 接着装置、板状接着体の製造方法 |
Country Status (8)
Country | Link |
---|---|
US (2) | US9789674B2 (ja) |
EP (1) | EP2487670B1 (ja) |
JP (1) | JP5740130B2 (ja) |
KR (1) | KR101752020B1 (ja) |
CN (1) | CN102640201B (ja) |
HK (1) | HK1174138A1 (ja) |
TW (1) | TWI421578B (ja) |
WO (1) | WO2011043295A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012241190A (ja) * | 2011-05-18 | 2012-12-10 | Tpk Touch Solutions (Xiamen) Inc | 透明多層板を積層する装置、および、その液状接着剤があふれ出ることを防止する方法 |
CN103149738A (zh) * | 2013-02-22 | 2013-06-12 | 深圳市华星光电技术有限公司 | 液晶显示器基板 |
CN103913875A (zh) * | 2012-12-31 | 2014-07-09 | 乐金显示有限公司 | 液晶显示装置的自动粘合系统以及自动粘合方法 |
CN105182656A (zh) * | 2014-06-16 | 2015-12-23 | 三星电机株式会社 | 相机模块的焦距调节和粘合设备及方法 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103802312B (zh) * | 2009-09-04 | 2016-08-17 | 迪睿合电子材料有限公司 | 填充装置 |
TWI534500B (zh) * | 2009-10-13 | 2016-05-21 | Dexerials Corp | A manufacturing method of a display device, and a transparent resin filler |
JP5345239B1 (ja) * | 2012-11-13 | 2013-11-20 | オリジン電気株式会社 | 接合部材製造方法及び装置 |
JP6011316B2 (ja) * | 2012-12-21 | 2016-10-19 | 旭硝子株式会社 | 粘着層付き透明面材の製造方法 |
KR101633577B1 (ko) * | 2013-01-30 | 2016-06-24 | 오리진 일렉트릭 캄파니 리미티드 | 부재 접합 시스템 |
JP5486705B1 (ja) * | 2013-01-30 | 2014-05-07 | オリジン電気株式会社 | 部材貼り合わせ装置 |
KR101475840B1 (ko) * | 2013-02-22 | 2014-12-30 | 주식회사 씨엘디 | 디스플레이 장치의 제조장치 및 디스플레이 장치의 제조방법 |
JP5676046B1 (ja) * | 2014-09-16 | 2015-02-25 | オリジン電気株式会社 | 部材貼り合わせ装置及び方法 |
CN105629590A (zh) * | 2016-01-04 | 2016-06-01 | 京东方科技集团股份有限公司 | 一种封框胶涂覆装置及涂覆方法 |
CN105607328A (zh) * | 2016-03-31 | 2016-05-25 | 京东方(河北)移动显示技术有限公司 | 一种显示装置及其制备方法 |
EP3290185A1 (en) * | 2016-08-31 | 2018-03-07 | Airbus Operations GmbH | Method and apparatus for joining components |
JP6878225B2 (ja) * | 2017-09-15 | 2021-05-26 | デクセリアルズ株式会社 | 透明パネルの製造方法、光学装置の製造方法 |
CN112703544B (zh) | 2018-09-27 | 2024-03-08 | 迪睿合株式会社 | 光学装置、光学装置的制造方法 |
KR102250076B1 (ko) * | 2019-11-05 | 2021-05-10 | (주)에스티아이 | 라미네이팅 시스템 |
CN112157898A (zh) * | 2020-08-14 | 2021-01-01 | 广州瑞伯科技发展有限公司 | 一种用于液晶显示器保护部件的粘贴方法 |
DE102023108832A1 (de) * | 2023-04-06 | 2024-10-10 | Leonhard Kurz Stiftung & Co. Kg | Verfahren zur Herstellung eines Bauteils, Vorrichtung zur Herstellung eines Bauteils und Bauteil |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03116459A (ja) * | 1989-09-28 | 1991-05-17 | Matsushita Electric Ind Co Ltd | 光ディスクの製造方法 |
JPH0520714A (ja) * | 1991-07-15 | 1993-01-29 | Matsushita Electric Ind Co Ltd | 光デイスク製造方法及び製造装置 |
JP2002254010A (ja) * | 2001-03-02 | 2002-09-10 | Ricoh Co Ltd | 接着剤塗布装置 |
JP2006134545A (ja) * | 2004-04-02 | 2006-05-25 | Ricoh Co Ltd | 光記録媒体の製造方法及びその装置 |
JP2009008851A (ja) | 2007-06-27 | 2009-01-15 | Toray Eng Co Ltd | 液晶部品の製造方法および製造装置 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3902255A1 (de) * | 1989-01-26 | 1990-08-02 | Nokia Unterhaltungselektronik | Verfahren und vorrichtung zum herstellen einer fluessigkristallzelle |
JP2917387B2 (ja) * | 1990-04-03 | 1999-07-12 | 日本電気株式会社 | 液晶素子の製造方法 |
ATE179652T1 (de) * | 1990-12-11 | 1999-05-15 | Pilkington Uk Ltd | Verfahren zur verbindung von glasscheiben und danach hergestellte artikel |
JP2908259B2 (ja) * | 1994-12-09 | 1999-06-21 | ウシオ電機株式会社 | 液晶パネルの貼り合わせ方法および装置 |
JP3284822B2 (ja) * | 1995-05-10 | 2002-05-20 | ソニー株式会社 | 液晶注入方法、プラズマアドレス表示装置の製造方法およびその装置 |
JPH10311981A (ja) * | 1997-05-14 | 1998-11-24 | Sony Corp | 液晶表示素子の製造方法および製造装置 |
JP2001209980A (ja) * | 2000-01-26 | 2001-08-03 | Matsushita Electric Ind Co Ltd | 光学的情報記録媒体の製造方法および製造装置 |
JP2003043504A (ja) * | 2001-07-31 | 2003-02-13 | Fujitsu Ltd | 液晶表示パネルの製造装置及び製造方法 |
CN1297844C (zh) * | 2001-11-27 | 2007-01-31 | 夏普株式会社 | 液晶板、液晶板制造方法、液晶板制造设备和偏振片粘结设备 |
US20040134603A1 (en) * | 2002-07-18 | 2004-07-15 | Hideo Kobayashi | Method and apparatus for curing adhesive between substrates, and disc substrate bonding apparatus |
JP4815768B2 (ja) * | 2003-08-22 | 2011-11-16 | 旭硝子株式会社 | 表示装置及び表示装置の製造方法 |
JP2006292993A (ja) * | 2005-04-11 | 2006-10-26 | Mitsubishi Electric Corp | 貼り合わせ装置 |
GB2425313B (en) * | 2005-04-20 | 2008-07-30 | Pyroline Services Ltd | Fire resisting composition |
JP2007264308A (ja) * | 2006-03-28 | 2007-10-11 | Optrex Corp | 板状体の積層方法 |
KR101261606B1 (ko) * | 2006-05-09 | 2013-05-09 | 삼성디스플레이 주식회사 | 표시판의 제조 장치 및 제조 방법 |
US9423638B2 (en) * | 2006-07-14 | 2016-08-23 | Dexerials Corporation | Resin composition and display unit |
JP5298605B2 (ja) * | 2007-04-03 | 2013-09-25 | デクセリアルズ株式会社 | 画像表示装置の製造方法 |
JP5470735B2 (ja) * | 2007-04-10 | 2014-04-16 | デクセリアルズ株式会社 | 画像表示装置の製造方法 |
TWI379131B (en) * | 2008-08-27 | 2012-12-11 | Tpo Displays Corp | System for displaying images and manufacturing method of the same |
JP2014122947A (ja) * | 2012-12-20 | 2014-07-03 | Japan Display Inc | 表示装置及びカバー部材 |
CN104183785B (zh) * | 2014-06-27 | 2016-05-11 | 京东方科技集团股份有限公司 | 一种oled器件的封装方法、oled显示面板及oled显示装置 |
-
2010
- 2010-10-04 KR KR1020127011432A patent/KR101752020B1/ko active IP Right Grant
- 2010-10-04 WO PCT/JP2010/067369 patent/WO2011043295A1/ja active Application Filing
- 2010-10-04 TW TW099133808A patent/TWI421578B/zh active
- 2010-10-04 CN CN201080055585.7A patent/CN102640201B/zh active Active
- 2010-10-04 EP EP10821965.0A patent/EP2487670B1/en active Active
- 2010-10-04 US US13/500,537 patent/US9789674B2/en active Active
- 2010-10-07 JP JP2010227283A patent/JP5740130B2/ja active Active
-
2013
- 2013-01-09 HK HK13100320.6A patent/HK1174138A1/xx unknown
-
2017
- 2017-09-11 US US15/700,785 patent/US10737477B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03116459A (ja) * | 1989-09-28 | 1991-05-17 | Matsushita Electric Ind Co Ltd | 光ディスクの製造方法 |
JPH0520714A (ja) * | 1991-07-15 | 1993-01-29 | Matsushita Electric Ind Co Ltd | 光デイスク製造方法及び製造装置 |
JP2002254010A (ja) * | 2001-03-02 | 2002-09-10 | Ricoh Co Ltd | 接着剤塗布装置 |
JP2006134545A (ja) * | 2004-04-02 | 2006-05-25 | Ricoh Co Ltd | 光記録媒体の製造方法及びその装置 |
JP2009008851A (ja) | 2007-06-27 | 2009-01-15 | Toray Eng Co Ltd | 液晶部品の製造方法および製造装置 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2487670A4 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012241190A (ja) * | 2011-05-18 | 2012-12-10 | Tpk Touch Solutions (Xiamen) Inc | 透明多層板を積層する装置、および、その液状接着剤があふれ出ることを防止する方法 |
TWI466780B (zh) * | 2011-05-18 | 2015-01-01 | Tpk Touch Solutions Xiamen Inc | 透明多層板貼合裝置及其防止液態膠溢滿之方法 |
CN103913875A (zh) * | 2012-12-31 | 2014-07-09 | 乐金显示有限公司 | 液晶显示装置的自动粘合系统以及自动粘合方法 |
US9835883B2 (en) | 2012-12-31 | 2017-12-05 | Lg Display Co., Ltd. | Automatic bonding system for liquid crystal display device and automatic bonding method using the same |
CN103149738A (zh) * | 2013-02-22 | 2013-06-12 | 深圳市华星光电技术有限公司 | 液晶显示器基板 |
CN105182656A (zh) * | 2014-06-16 | 2015-12-23 | 三星电机株式会社 | 相机模块的焦距调节和粘合设备及方法 |
Also Published As
Publication number | Publication date |
---|---|
US20170368814A1 (en) | 2017-12-28 |
EP2487670A1 (en) | 2012-08-15 |
KR101752020B1 (ko) | 2017-06-28 |
EP2487670B1 (en) | 2016-09-21 |
TW201120521A (en) | 2011-06-16 |
US20120247644A1 (en) | 2012-10-04 |
EP2487670A4 (en) | 2013-04-17 |
JP2011100118A (ja) | 2011-05-19 |
HK1174138A1 (en) | 2013-05-31 |
US9789674B2 (en) | 2017-10-17 |
CN102640201B (zh) | 2015-02-25 |
CN102640201A (zh) | 2012-08-15 |
JP5740130B2 (ja) | 2015-06-24 |
US10737477B2 (en) | 2020-08-11 |
KR20120085796A (ko) | 2012-08-01 |
TWI421578B (zh) | 2014-01-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5740130B2 (ja) | 接着装置、板状接着体の製造方法 | |
SG190467A1 (en) | A laminated product, an apparatus and a method for forming a laminated product | |
KR101597087B1 (ko) | 판상 접합체의 제조 방법, 접합 장치 및 판상 접합체 | |
TWI493012B (zh) | A transparent surface material attached to an adhesive layer, a display device, and the like | |
KR101814831B1 (ko) | 표시 장치의 제조 방법 및 투명 수지 충전제 | |
KR101380978B1 (ko) | 합착장치 | |
TW201532681A (zh) | 黏合劑塗布裝置、顯示裝置用構件的製造裝置及製造方法 | |
TW201416231A (zh) | 面板貼附方法及面板貼附裝置 | |
JP5799131B2 (ja) | 充填装置 | |
KR20190064081A (ko) | 패널 합착 장치 및 방법 | |
KR101442932B1 (ko) | 충전 장치 | |
TWI429608B (zh) | The manufacturing method of the layered body | |
KR102571054B1 (ko) | 패널 합착 장치 및 방법 | |
KR101512137B1 (ko) | 커버글래스 부착장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201080055585.7 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 10821965 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
REEP | Request for entry into the european phase |
Ref document number: 2010821965 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2010821965 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 20127011432 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13500537 Country of ref document: US |