WO2011033407A3 - Module de del à lentille d'indice élevé - Google Patents

Module de del à lentille d'indice élevé Download PDF

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Publication number
WO2011033407A3
WO2011033407A3 PCT/IB2010/053772 IB2010053772W WO2011033407A3 WO 2011033407 A3 WO2011033407 A3 WO 2011033407A3 IB 2010053772 W IB2010053772 W IB 2010053772W WO 2011033407 A3 WO2011033407 A3 WO 2011033407A3
Authority
WO
WIPO (PCT)
Prior art keywords
array
led
housings
lens
openings
Prior art date
Application number
PCT/IB2010/053772
Other languages
English (en)
Other versions
WO2011033407A2 (fr
Inventor
Serge Bierhuizen
Nanze Patrick Wang
Gregory W. Eng
Decai Sun
Yajun Wei
Original Assignee
Koninklijke Philips Electronics N.V.
Philips Lumileds Lighting Company, Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics N.V., Philips Lumileds Lighting Company, Llc filed Critical Koninklijke Philips Electronics N.V.
Priority to CN201080041382.2A priority Critical patent/CN102484191B/zh
Priority to KR1020127009716A priority patent/KR101880767B1/ko
Priority to EP10757835.3A priority patent/EP2478575B1/fr
Priority to JP2012529369A priority patent/JP2013505572A/ja
Publication of WO2011033407A2 publication Critical patent/WO2011033407A2/fr
Publication of WO2011033407A3 publication Critical patent/WO2011033407A3/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

Selon la présente invention, un ensemble de boîtiers comportant des corps de boîtier et des lentilles est moulé ou un ensemble de corps de boîtier est moulé et connecté à des lentilles afin de former un ensemble de boîtiers comportant des corps de boîtier et des lentilles. Des diodes électroluminescentes (DEL) sont reliées aux boîtiers dans ledit ensemble. Un ensemble de plots métalliques peut être connecté à l'arrière de l'ensemble ou moulé par insertion avec l'ensemble de boîtiers de manière à former des plots de connexion à l'arrière des boîtiers. L'ensemble est séparé afin d'obtenir des modules de DEL individuels.
PCT/IB2010/053772 2009-09-17 2010-08-20 Module de del à lentille d'indice élevé WO2011033407A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201080041382.2A CN102484191B (zh) 2009-09-17 2010-08-20 带高折射率透镜的led模块
KR1020127009716A KR101880767B1 (ko) 2009-09-17 2010-08-20 Ｌｅｄ 및 렌즈에 대한 2개의 개구를 가지는 하우징 본체를 구비한 ｌｅｄ 모듈
EP10757835.3A EP2478575B1 (fr) 2009-09-17 2010-08-20 Module de del avec deux ouvertures pour une lentille et une del
JP2012529369A JP2013505572A (ja) 2009-09-17 2010-08-20 高屈折率レンズを有するｌｅｄモジュール

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/561,617 2009-09-17
US12/561,617 US9385285B2 (en) 2009-09-17 2009-09-17 LED module with high index lens

Publications (2)

Publication Number Publication Date
WO2011033407A2 WO2011033407A2 (fr) 2011-03-24
WO2011033407A3 true WO2011033407A3 (fr) 2011-06-16

Family

ID=43242886

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2010/053772 WO2011033407A2 (fr) 2009-09-17 2010-08-20 Module de del à lentille d'indice élevé

Country Status (7)

Country Link
US (2) US9385285B2 (fr)
EP (1) EP2478575B1 (fr)
JP (3) JP2013505572A (fr)
KR (1) KR101880767B1 (fr)
CN (2) CN102484191B (fr)
TW (2) TWI600186B (fr)
WO (1) WO2011033407A2 (fr)

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US9385285B2 (en) 2016-07-05
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TWI505518B (zh) 2015-10-21
JP2016001756A (ja) 2016-01-07
CN104953018A (zh) 2015-09-30
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TWI600186B (zh) 2017-09-21
US20110062471A1 (en) 2011-03-17
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KR101880767B1 (ko) 2018-07-20
WO2011033407A2 (fr) 2011-03-24
JP2013505572A (ja) 2013-02-14
CN102484191B (zh) 2015-08-12
JP6310994B2 (ja) 2018-04-11
EP2478575A2 (fr) 2012-07-25
TW201603333A (zh) 2016-01-16
CN102484191A (zh) 2012-05-30
CN104953018B (zh) 2018-09-18
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TW201119098A (en) 2011-06-01
US20160240754A1 (en) 2016-08-18

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