WO2011004729A1 - 基板収納容器 - Google Patents
基板収納容器 Download PDFInfo
- Publication number
- WO2011004729A1 WO2011004729A1 PCT/JP2010/060989 JP2010060989W WO2011004729A1 WO 2011004729 A1 WO2011004729 A1 WO 2011004729A1 JP 2010060989 W JP2010060989 W JP 2010060989W WO 2011004729 A1 WO2011004729 A1 WO 2011004729A1
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- WIPO (PCT)
- Prior art keywords
- substrate storage
- synthetic resin
- less
- storage container
- molding material
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
Definitions
- the present invention relates to a substrate storage container used when a substrate made of a semiconductor wafer, a mask glass, or the like is stored, stored, transported, transported, or the like.
- a conventional substrate storage container is not shown, but a front open box container body for aligning and storing a plurality of semiconductor wafers, and a lid that is detachably fitted to the open front of the container body via a sealing gasket. And a lid opening / closing device attached to the semiconductor processing apparatus.
- a predetermined circuit pattern is formed on the semiconductor wafer, and a plurality of semiconductor chips are cut out by dicing.
- the container main body and the lid are each injection-molded with a predetermined molding material containing a synthetic resin.
- a plurality of paired left and right support pieces for horizontally supporting the semiconductor wafer are provided on both sides inside the container body in the vertical direction.
- the lid body is removed by the lid opening / closing device, the semiconductor wafer is taken out from the container body by a dedicated robot, or the lid body is opened in front of the container body containing the semiconductor wafer. After being fitted in a sealed state, the air in the container body is replaced with an inert gas or the like.
- substrate containers are required to have high airtightness and automated handling from the viewpoint of preventing contamination of semiconductor wafers. Is coming.
- an appropriate molding material is selected, and the container body and lid are purged with gas. Yes.
- high-purity polycarbonate with reduced additives is used as an appropriate molding material for the container body
- polybutylene terephthalate or polyetheretherketone is used as a molding material for components attached to the container body.
- the conventional substrate storage container is configured as described above, and the container body is formed of high-purity polycarbonate.
- the minimum processing line width of the semiconductor chip is 45 nm or less
- the copper of the semiconductor wafer is used.
- corrosion of copper wiring due to the hygroscopicity of polycarbonate may occur, or basic organic substances may be formed on the semiconductor wafer due to hydrolysis of organic substances, which may reduce product yield. is there.
- a semiconductor wafer cooled by heat treatment may be stored, but at this time, a contact portion such as a support piece of the container main body in contact with the semiconductor wafer is deformed, There is a possibility that the region with low heat resistance of the container main body is deformed by the heat stored in the substrate storage container, and the sealing performance on the front surface of the container main body is deteriorated. As a result, it is expected that no effect can be expected even if the air in the substrate storage container is replaced with inert gas or dry air.
- the present invention has been made in view of the above, and an object thereof is to provide an inexpensive substrate storage container capable of reducing moisture absorption and moisture permeability and suppressing organic contamination of the substrate. Another object of the present invention is to provide a substrate storage container that can maintain the effect of gas replacement over a long period of time.
- the present invention includes a container main body that accommodates a substrate, and a lid that is detachably fitted to the opening of the container main body via a gasket.
- a substrate storage container formed with a synthetic resin-containing molding material having a water absorption of 0.1% or less, heated at 80 ° C. for 24 hours, and measured by a dynamic headspace method with a total resin amount of 15 ppm or less,
- the synthetic resin of the molding material is at least one selected from cycloolefin polymer, liquid crystal polymer, polyether ether ketone, polybutylene terephthalate, or polyethylene terephthalate, or an alloy resin thereof.
- the state in which the relative humidity is 5% or less can be maintained for 2 hours or more. Can do.
- the load deflection temperature of the synthetic resin of the molding material can be 120 ° C. or higher.
- a substrate support is provided in the container body, and this support is molded from a synthetic resin-containing molding material having a load deflection temperature of 120 ° C. or higher and a water absorption of 0.1% or less.
- the synthetic resin of the material may be at least one selected from cycloolefin polymer, liquid crystal polymer, polyether ether ketone, polybutylene terephthalate, or polyethylene terephthalate, or an alloy resin thereof.
- a bottom plate is attached to the bottom of the container body, and the bottom plate is molded with a synthetic resin-containing molding material having a load deflection temperature of 120 ° C. or higher and a water absorption of 0.1% or less.
- the resin can be at least one selected from cycloolefin polymer, liquid crystal polymer, polyether ether ketone, polybutylene terephthalate, polyethylene terephthalate, or polyphenylene sulfide, or an alloy resin thereof.
- an opening / closing valve for gas replacement is attached to the container body, and a part of the opening / closing valve is molded with a synthetic resin-containing molding material having a load deflection temperature of 120 ° C. or higher and a water absorption of 0.1% or less
- the synthetic resin of the molding material can be at least one selected from cycloolefin polymer, liquid crystal polymer, polyether ether ketone, polybutylene terephthalate, polyethylene terephthalate, or polyphenylene sulfide, or an alloy resin thereof.
- a retainer for supporting the substrate is attached to the lid, and the retainer is molded with a synthetic resin-containing molding material having a load deflection temperature of 120 ° C. or more and a water absorption of 0.1% or less.
- the resin may be at least one selected from cycloolefin polymer, liquid crystal polymer, polyether ether ketone, polybutylene terephthalate, or polyethylene terephthalate, or an alloy resin thereof.
- the substrate in the claims includes at least semiconductor wafers of various sizes (for example, ⁇ 200, 300, 450 mm, etc.), liquid crystal substrates, mask glass, and the like.
- This substrate may be singular or plural.
- the container body may be any of a front open box type, a top open box type, and a bottom open box type.
- the dynamic headspace method (also called the purge and trap method) is generally a kind of headspace method, in which chemical substances released from a sample under a gas stream such as air or nitrogen are evaluated by a gas chromatograph (GC).
- GC gas chromatograph
- the test method In addition to the synthetic resin, various fillers that improve rigidity, conductivity, flame retardancy, and the like are appropriately added to the molding material.
- the total outgas amount generated when the pellet of the synthetic resin material is heated at 80 ° C. for 60 minutes is determined by the dynamic headspace method.
- the total outgas amount is 15 ppm or less, preferably 10 ppm or less.
- the sealing property of the substrate storage container according to the present invention when the substrate storage container is set in a sealed chamber and these are left under reduced pressure at ⁇ 30 kPa and ⁇ 0.3 kPa, respectively, the reduced pressure state is maintained for 2 hours or more. Possible performance is good.
- a cycloolefin polymer having a total outgas amount of 15 ppm or less measured by a dynamic headspace method by heating a synthetic resin as a molding material for a substrate container to a water absorption of 0.1% or less and 80 ° C. for 24 hours.
- a synthetic resin as a molding material for a substrate container
- a water absorption of 0.1% or less and 80 ° C. for 24 hours since at least one selected from liquid crystal polymer, polyether ether ketone, polybutylene terephthalate, or polyethylene terephthalate, or an alloy resin thereof, the humidity in the substrate storage container can be lowered. Therefore, contamination of the substrate stored in the container body can be suppressed, and corrosion of the circuit pattern and the like of the substrate can be prevented.
- substrate storage container which can reduce hygroscopicity and moisture permeability and can suppress the organic contamination of a board
- the support for supporting the substrate is molded with a synthetic resin-containing molding material having a load deflection temperature of 120 ° C. or more and a water absorption of 0.1% or less. If at least one selected from liquid crystal polymer, polyetheretherketone, polybutylene terephthalate, or polyethylene terephthalate, or an alloy resin thereof, the substrate can be safely supported by the support, so that the substrate is not displaced. It is possible to prevent the generation of dust that adversely affects the substrate. In addition, the state where the relative humidity in the substrate storage container is lowered to 5% or less can be maintained for 1 hour or longer.
- a part of the opening / closing valve for gas replacement is molded with a synthetic resin-containing molding material having a load deflection temperature of 120 ° C. or more and a water absorption rate of 0.1% or less. If at least one selected from olefin polymer, liquid crystal polymer, polyether ether ketone, polybutylene terephthalate, polyethylene terephthalate, or polyphenylene sulfide, or an alloy resin thereof, the relative humidity in the substrate storage container is lowered to 5% or less. It becomes possible to maintain this state for 1 hour or more.
- the retainer for supporting the substrate is molded with a synthetic resin-containing molding material having a load deflection temperature of 120 ° C. or more and a water absorption rate of 0.1% or less, and the synthetic resin of the molding material is made of cycloolefin polymer, liquid crystal If at least one selected from polymers, polyetheretherketone, polybutylene terephthalate, or polyethylene terephthalate, or an alloy resin thereof, the relative humidity in the substrate storage container is kept at a low value of 5% or less for 1 hour or more. Is possible.
- a container main body 1 capable of aligning and storing a plurality of semiconductor wafers W;
- the container body 1 is provided with a lid 20 that is fitted to the front face 6 of the container body 1 through a gasket for sealing, and the container body 1 and the lid body 20 have a water absorption rate of 0.1% or less and a total outgas amount.
- a lid 20 that is fitted to the front face 6 of the container body 1 through a gasket for sealing, and the container body 1 and the lid body 20 have a water absorption rate of 0.1% or less and a total outgas amount.
- Each of which is injection molded with a molding material containing a synthetic resin of 15 ppm or less, and the inside of the container body 1 in which the lid 20 is fitted to the opened front face 6 is replaced with an inert gas such as nitrogen gas.
- an inert gas such as nitrogen gas.
- the semiconductor wafer W is made of, for example, a thinly sliced ⁇ 300 mm round silicon wafer, a predetermined circuit pattern is formed on the surface, and a plurality of semiconductor chips are cut out by dicing in a dicing process.
- the semiconductor wafer W has a back-ground back surface in order to contribute to thinning of the semiconductor package.
- the container body 1 includes a bottom plate 2 that is larger than the semiconductor wafer W, a top plate 3 that faces the bottom plate 2 from above with a storage space for the semiconductor wafer W, and these bottom plates 2. And a rear wall 4 that connects the rear portion of the top plate 3 up and down, and a front open box type that includes a pair of left and right side walls 5 that connect the bottom plate 2 and the left and right side portions of the top plate 3 up and down, It is positioned and mounted on the lid opening / closing device attached to the semiconductor processing apparatus with the horizontally long front face 6 opened in the horizontal horizontal direction.
- a plurality of support pieces 7 are arranged at a predetermined pitch in the vertical direction, and each support piece 7 extends in the front-rear direction of the container body 1 and comes into contact with the peripheral edge side of the back surface of the semiconductor wafer W.
- Locating tools 8 for positioning with respect to the positioning pins of the lid opening / closing device are respectively attached to the front and rear portions of the bottom plate 2 of the container body 1, and round through holes are drilled near the four corners of the bottom plate 2.
- An opening / closing valve 9 that replaces the air inside the substrate storage container with an inert gas or the like is detachably fitted to each through hole via an O-ring.
- the opening / closing valve 9 includes a cylindrical valve body that is fitted into the through hole of the bottom plate 2 of the container body 1. Inside the valve body, a valve body that opens and closes the flow path is interposed via an elastic member such as a coil spring. The upper and lower surfaces of the valve body are covered with a filter for filtering gas.
- Such an on-off valve 9 is fitted as an air supply filter in a through hole in the rear part of the bottom plate 2 and is fitted as an exhaust filter in a through hole in the front part of the bottom plate 2 and connected to a gas displacement device or the like.
- the air in the container body 1 is replaced with nitrogen gas, and functions to prevent surface oxidation of the semiconductor wafer W and the like.
- a bottom plate 10 that covers the bottom plate 2 and exposes the plurality of positioning tools 8 and the opening / closing valves 9 is selectively screwed to the bottom plate 2 of the container body 1 via fastening screws.
- the bottom plate 10 is formed in a similar shape that is slightly smaller than the bottom plate 2, the peripheral edge is erected and reinforced, and conveyor rails for conveyance are selectively formed on both the left and right sides.
- a robotic flange 11 for gripping and automatically transporting is detachably mounted near the center of the top plate 3 of the container body 1.
- a rim flange 12 projecting outward is formed on the periphery, and a detachable lid 20 is fitted into the rim flange 12 by a lid opening / closing device.
- a transparent viewing window is selectively formed at the center of the back wall 4 of the container body 1, and the inside of the container body 1 is visually observed and grasped from the outside by the viewing window.
- the lid 20 includes a horizontally long casing 21 that is detachably fitted to the opened front face 6 of the container body 1, and an open front face of the casing 21. 6 and a locking mechanism 23 interposed between the housing 21 and the surface plate 22.
- the casing 21 is basically formed in a shallow cross-sectional substantially dish shape having a frame-shaped peripheral wall, and a central portion is formed so as to protrude in a frontal substantially box shape from the back side to the front side.
- An installation space for the locking mechanism 23 is formed with a plurality of screw bosses between the left and right side portions of the peripheral portion and the peripheral wall.
- Through holes 24 for the locking mechanism 23 are drilled in both the upper and lower sides of the peripheral wall of the casing 21, and each through hole 24 faces a locking hole drilled in the inner peripheral surface of the rim flange 12.
- a front retainer 25 that elastically holds the semiconductor wafer W is detachably mounted on the rear surface of the housing 21.
- the front retainer 25 includes, for example, a vertically long frame that is detachably mounted on both sides of the back surface of the housing 21, and the vertical rail portion of each frame is inclined toward the center of the back surface of the housing 21.
- a plurality of elastic pieces 26 that extend while being vertically arranged are integrally formed, and a small holding block 27 that holds the front of the peripheral edge of the semiconductor wafer W with a V-groove is integrally formed at the tip of each elastic piece 26.
- a frame-shaped fitting groove is formed in the peripheral edge of the back surface of the housing 21, and a lip type gasket that can be elastically deformed is tightly fitted in the fitting groove, and this gasket is a rim flange of the container body 1. 12 is pressed into contact.
- the gasket includes a frame-shaped base material that is in close contact with the rim flange 12 of the container body 1, an endless seal piece that extends from the base material and presses against the rim flange 12, and is formed on the base material so as to protrude into the fitting groove. And a positioning fitting protrusion for a base material that is in pressure contact with the inside, and is molded from a predetermined molding material.
- the seal piece of the gasket extends obliquely from the base material and is bent and pressed to the inner peripheral surface of the rim flange 12 while being appropriately bent to prevent gas from entering from the outside of the substrate storage container to the inside of the semiconductor wafer W. It functions to prevent contamination and maintain the oxygen concentration and relative humidity over a long period of time when the inside of the substrate storage container is replaced with an inert gas.
- the molding material for the gasket include thermoplastic elastomers such as polyesters, polyolefins, and polystyrenes having a spring hardness (JIS A hardness) measured by JIS K7202 of 80 Hs or less, fluorine rubber, and IR rubber.
- the surface plate 22 is formed in a horizontally long flat plate so as to correspond to the opened surface of the housing 21, and a plurality of mounting holes are drilled on both the left and right sides together with an operation port 28 for the locking mechanism 23.
- the fastening screws penetrating the plurality of mounting holes are screwed into the screw bosses of the housing 21, whereby the positioning screws are positioned and fixed on the surface of the housing 21.
- the locking mechanism 23 includes a pair of left and right rotating plates that are rotated by operating pins of the lid opening / closing device that penetrates the operation port 28 of the surface plate 22, and a plurality of slide plates that slide in the vertical direction as each rotating plate rotates. And a plurality of locking claws 29 that protrude from the through holes 24 of the housing 21 and are locked to the locking holes of the rim flange 12 as each slide plate slides, and are positioned in front of the front retainer 25. Thus, the rigidity of the lid 20 is ensured.
- the synthetic resin of the molding material for molding the container body 1 and the lid 20 of the substrate storage container is heated at a water absorption rate of 0.1% or less, a load deflection temperature of 120 ° C. or more, and 80 ° C. for 24 hours.
- a type whose total outgas amount measured by the dynamic headspace method is 15 ppm or less is selected.
- COP cycloolefin polymer
- LCP liquid crystal polymer
- PEEK polyether ether ketone
- PBT polybutylene terephthalate
- PET polyethylene terephthalate
- the reason why the water absorption rate of the synthetic resin is 0.1% or less is that when the water absorption rate is 0.1% or less, the state in which the relative humidity in the substrate storage container is lowered to 5% or less can be maintained for 1 hour or more. On the contrary, when the water absorption rate exceeds 0.1%, water is released from the surface of the substrate storage container even if the relative humidity in the substrate storage container is lowered to 5% or less. This is because the relative humidity cannot be kept below 5% over time.
- the synthetic resin of the container body 1 and the lid 20 is most preferably a cycloolefin polymer or a liquid crystal polymer that can reduce the water absorption rate to 0.02% or less. If these are selected, when the air in the container body 1 in which the lid 20 is fitted to the opened front face 6 is replaced with nitrogen gas or the like to reduce the relative humidity to 5% or less, the relative humidity is 5% or less. The state can be maintained for 2 hours or more.
- liquid crystal polymers are classified into two types: thermotropic type and lyotropic type. Here, they are thermotropic types that are used as molding materials. It is defined as a synthetic resin exhibiting liquid crystal-like properties that are aligned and regularly aligned.
- the thickness of the substrate storage container can be suppressed to less than 4 mm, preferably 2 to 3 mm, and this suppression can reduce the weight of the substrate storage container by 10% or more. Can do.
- the liquid crystal polymer has a two-layer structure of a surface layer that is sufficiently oriented and strong at the time of molding, and a core layer that is insufficiently oriented and has low strength and is surrounded by a skin layer. For this reason, as the thickness is reduced, the ratio of the skin layer is increased, the strength per unit area is increased, and the strength can be improved even if the substrate container is thin. Furthermore, if the liquid crystallizing temperature is molded using a type having a temperature of 250 ° C. or higher, and then annealed, outgas generated from the substrate container during use can be significantly reduced.
- the load deflection temperature of the synthetic resin is required to be 120 ° C. or higher. This is because when the load deflection temperature is 120 ° C. or higher, the deterioration of the sealing performance of the container body 1 is prevented, or the air in the substrate storage container is removed. This is because the effect of substituting with an inert gas or the like can be expected.
- the semiconductor wafer W may be heat-treated at a high temperature, cooled to 80 to 100 ° C., and inserted into the substrate storage container for storage.
- the load deflection temperature of the synthetic resin is 120 ° C. or more
- the contact portion such as the support piece 7 of the container main body 1 that contacts the semiconductor wafer W is deformed, or the container main body 1 is heated by the heat stored in the substrate storage container. It becomes possible to wipe the fear that the sealing performance of the front surface 6 of the container body 1 will be deteriorated. As a result, high sealing performance can be maintained by the gasket, so that excellent effects can be expected even if the air in the substrate storage container is replaced with inert gas or dry air.
- a dynamic headspace method suitable for microanalysis For measuring the total outgas amount of the synthetic resin, it is preferable to employ a dynamic headspace method suitable for microanalysis. According to this dynamic headspace method, unlike the other static headspace methods, it is possible to collect almost the entire amount of the target component, and it can be expected that the sample is reduced in volume and the detection sensitivity is improved.
- each support piece 7 of the container body 1 has a load deflection temperature of 120 ° C. or higher and a water absorption rate of 0.1% or less in order to suppress and prevent deformation caused by contact with the heat-treated semiconductor wafer W.
- Molded with a synthetic resin-containing molding material examples include at least one selected from cycloolefin polymer, liquid crystal polymer, polyether ether ketone, polybutylene terephthalate, and polyethylene terephthalate, or alloy resins thereof.
- liquid crystal polymer, polyether ether ketone, and polybutylene terephthalate having excellent rigidity are particularly preferable.
- each support piece 7 is molded with such a synthetic resin, the semiconductor wafer W can be safely held on the support piece 7, so that the semiconductor wafer W can be prevented from being displaced or adversely affected. Generation of particles can be prevented.
- liquid crystal polymer, polyetheretherketone, or polybutylene terephthalate is excellent in heat resistance. Therefore, if the support piece 7 is formed by selectively adopting these, organic substances accompanying the contact with the heat-treated semiconductor wafer W are obtained. It is possible to reduce the generation of organic substances and to prevent organic substances from adhering to the semiconductor wafer W.
- Each open / close valve 9 of the container body 1 is also formed of a synthetic resin-containing molding material having a load deflection temperature of 120 ° C. or more and a water absorption of 0.1% or less, excluding coil springs and filters.
- the synthetic resin corresponds to at least one selected from cycloolefin polymer, liquid crystal polymer, polyether ether ketone, polybutylene terephthalate, polyethylene terephthalate, or polyphenylene sulfide (PPS), or an alloy resin thereof.
- the opening / closing valve 9 is molded from a molding material containing such a synthetic resin, moisture is released into the gas when the gas is replaced, or moisture is released into the substrate storage container in the state of being left after the gas replacement.
- the relative humidity of the substrate storage container can be maintained at a low value of 5% or less.
- a synthetic resin-containing molding material having a load deflection temperature of 120 ° C. or more and a water absorption of 0.1% or less in order to suppress deformation caused by contact with the heat-treated semiconductor wafer W. Molded with.
- the synthetic resin include at least one selected from cycloolefin polymer, liquid crystal polymer, polyether ether ketone, polybutylene terephthalate, or polyethylene terephthalate, or an alloy resin thereof, preferably a liquid crystal polymer and polyether excellent in rigidity. Ether ketone and polybutylene terephthalate are preferable.
- the molding material may be only the above-mentioned synthetic resin, but when the substrate storage container is used for in-process use, particles are attached to the semiconductor wafer W or damage to the semiconductor wafer W due to electrostatic discharge is prevented. Therefore, it is preferable to prepare by adding an appropriate amount of conductive filler.
- the conductive filler include conductive carbon black, carbon fiber, carbon nanotube, metal fiber, metal oxide, and conductive polymer. Also, one kind of these materials and an alloy of other materials or a combination thereof may be used.
- the volume resistance value of the substrate storage container can be made 10 8 ⁇ or less, preferably 10 6 ⁇ . .
- the volume resistance value of the substrate storage container is set to 10 8 ⁇ or less as described above, particles adhere to the semiconductor wafer W stored in the substrate storage container or damage to the semiconductor wafer W due to electrostatic discharge is prevented. Is possible.
- the synthetic resin in the molding material of the substrate storage container is a synthetic resin having a low moisture content
- the inside of the substrate storage container is replaced with nitrogen gas (purity 99.999%) to replace the inside of the substrate storage container.
- nitrogen gas purity 99.999%
- the relative humidity is reduced to 1%, gas replacement is stopped, the substrate storage container is left, and the relative humidity is measured with a hygrometer previously installed in the substrate storage container, this humidity is kept for 1 hour or more. Can be held. Therefore, since the humidity in the substrate storage container can be kept low, the contamination of the semiconductor wafer W can be prevented, and even after the circuit pattern is formed and stored on the surface of the semiconductor wafer W, the corrosion of the circuit pattern can be prevented. Can be planned.
- the container main body 1 having the portion communicating from the outer surface to the inner surface of the substrate storage container and the lid 20 or the open / close valve 9 are heated at 80 ° C. for 24 hours at a water absorption rate of 0.1% or less.
- the plurality of support pieces 7 and the front retainer 25 that are in contact with the semiconductor wafer W have a water absorption rate of 0.1% or less and 80 ° C.
- the relative humidity in the substrate storage container can be maintained at a low state of 5% or less for a long time. .
- a molding material having a load deflection temperature of 120 ° C. or higher is selected as these molding materials, it is possible to effectively prevent and prevent the loss of the sealing property of the substrate storage container, and to store the substrate for a longer period of time. It becomes possible to keep the relative humidity in the container low.
- the sealing property of the substrate storage container is not sufficient, external air enters the inside of the substrate storage container, so that it is difficult to keep the relative humidity in the substrate storage container low. Therefore, when the substrate storage container is set in the sealed chamber and these are depressurized to ⁇ 30 kPa and ⁇ 0.3 kPa, respectively, and the transition of the internal pressure of the substrate storage container is observed, the substrate storage container can be kept sealed in a reduced pressure state. preferable.
- the plurality of support pieces 7 are arranged side by side on the both side walls 5 of the container body 1, but the plurality of support pieces 7 may be integrally formed on the both side walls 5 of the container body 1, or the molded container Separate support pieces 7 may be attached to both side walls 5 of the main body 1 later.
- the bottom plate 10 of the container body 1 may be formed of the same molding material as that of the on-off valve 9 or may be omitted.
- the front retainer 25 includes a vertically long frame body that is detachably attached to the center of the back surface of the casing 21, and a plurality of frames that are arranged between a pair of vertical rail portions of the frame body and arranged in the vertical direction.
- the elastic piece 26 and a holding block 27 formed on each elastic piece 26 and holding the front of the peripheral edge of the semiconductor wafer W with a V-groove may be used.
- Example ⁇ Measurement of relative humidity in the substrate storage container
- the container body, support piece, opening / closing valve, lid, and front retainer shown in FIGS. 1 and 2 were respectively molded from the molding materials shown in Table 1, and Examples 1, 2, Each of the three substrate storage containers was manufactured.
- the inside of the sealed substrate storage container was replaced with nitrogen gas having a purity of 99.999% to reduce the relative humidity in the substrate storage container to 1%
- the relative humidity in the substrate storage container exceeds 5% by measuring the humidity with a humidity sensor installed in the substrate storage container in advance. The measured values are summarized in Table 2.
- the surface resistance values of the substrate storage containers of Examples 1, 2, and 3 were measured by a resistance value measuring instrument (manufactured by Sanwa MI Technos Co., Ltd .: Model 5501DM) and summarized in Table 2.
- the surface resistance value of the substrate storage container was measured in an environment of a temperature of 24 ° C. and a humidity of 50% in accordance with ASTM D257.
- the container main body, the support piece, the opening / closing valve, the lid, and the front retainer shown in FIGS. 1 and 2 were each molded from the molding material shown in Table 1 to produce a substrate storage container of a comparative example.
- the substrate storage container of the comparative example was manufactured in this way, the relative humidity measurement, the resistivity measurement, and the total outgas amount in the substrate storage container were measured and summarized in Table 2, as in the example.
- the substrate storage containers of Examples 1, 2, and 3 were able to obtain really good results with respect to measurement of relative humidity, measurement of resistivity, and measurement of total outgas. On the other hand, the substrate storage container of the comparative example could not obtain good results.
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Abstract
Description
成形材料の合成樹脂を、シクロオレフィンポリマー、液晶ポリマー、ポリエーテルエーテルケトン、ポリブチレンテレフタレート、若しくはポリエチレンテレフタレートから選択された少なくとも一種、又はこれらのアロイ樹脂としたことを特徴としている。
また、成形材料の合成樹脂の荷重撓み温度を120℃以上とすることができる。
また、成形材料の合成樹脂の荷重撓み温度を120℃以上とすれば、容器本体のシール性の低下を抑制することができるので、基板収納容器の気体置換の効果を長期に亘り維持することができる。
〔実施例〕
・基板収納容器内の相対湿度の測定
図1や図2に示す容器本体、支持片、開閉バルブ、蓋体、及びフロントリテーナを表1に示す成形材料によりそれぞれ成形し、実施例1、2、3の基板収納容器をそれぞれ製造した。
実施例1、2、3の基板収納容器の表面抵抗値を抵抗値測定器(三和MIテクノス社製:モデル5501DM)によりそれぞれ測定し、表2にまとめた。基板収納容器の表面抵抗値は、ASTM D257に準拠し、温度24℃、湿度50%の環境下で測定した。
実施例1、2、3の基板収納容器の成形材料のアウトガス量を測定するため、材料ペレット0.1gにつき、ダイナミックヘッドスペース法により、高純度ヘリウム流通下で80℃、60分の条件で加熱した場合に発生するアウトガスを捕集してガスクロマトグラフで分析した後、n‐デカンを標準物質としてアウトガスの総量を計測・定量し、その結果を表2にまとめた。
図1や図2に示す容器本体、支持片、開閉バルブ、蓋体、及びフロントリテーナを表1に示す成形材料によりそれぞれ成形し、比較例の基板収納容器を製造した。こうして比較例の基板収納容器を製造したら、実施例同様、基板収納容器内の相対湿度の測定、抵抗率の測定、アウトガス総量を測定して表2にまとめた。
2 底板
3 天板
4 背面壁
5 側壁
6 正面
7 支持片(支持体)
9 開閉バルブ
12 リムフランジ
20 蓋体
21 筐体
22 表面プレート
23 施錠機構
25 フロントリテーナ(リテーナ)
W 半導体ウェーハ(基板)
Claims (6)
- 基板を収納する容器本体と、この容器本体の開口部にガスケットを介して着脱自在に嵌め合わされる蓋体とを備え、これら容器本体と蓋体とを、吸水率が0.1%以下、80℃で24時間加熱してダイナミックヘッドスペース法により測定した総アウトガス量が15ppm以下の合成樹脂含有の成形材料でそれぞれ成形した基板収納容器であって、
成形材料の合成樹脂を、シクロオレフィンポリマー、液晶ポリマー、ポリエーテルエーテルケトン、ポリブチレンテレフタレート、若しくはポリエチレンテレフタレートから選択された少なくとも一種、又はこれらのアロイ樹脂としたことを特徴とする基板収納容器。 - 開口部に蓋体が嵌め合わされた容器本体内の気体を置換してその相対湿度を5%以下とする場合に、この相対湿度が5%以下の状態を2時間以上保持可能とした請求項1記載の基板収納容器。
- 成形材料の合成樹脂の荷重撓み温度を120℃以上とした請求項1又は2記載の基板収納容器。
- 容器本体内に基板支持用の支持体を備え、この支持体を、荷重撓み温度が120℃以上、吸水率が0.1%以下の合成樹脂含有の成形材料で成形するとともに、この成形材料の合成樹脂を、シクロオレフィンポリマー、液晶ポリマー、ポリエーテルエーテルケトン、ポリブチレンテレフタレート、若しくはポリエチレンテレフタレートから選択された少なくとも一種、又はこれらのアロイ樹脂とした請求項1、2、又は3記載の基板収納容器。
- 容器本体に気体置換用の開閉バルブを取り付け、この開閉バルブの一部を、荷重撓み温度が120℃以上、吸水率が0.1%以下の合成樹脂含有の成形材料で成形するとともに、この成形材料の合成樹脂を、シクロオレフィンポリマー、液晶ポリマー、ポリエーテルエーテルケトン、ポリブチレンテレフタレート、ポリエチレンテレフタレート、若しくはポリフェニレンサルファイドから選択された少なくとも一種、又はこれらのアロイ樹脂とした請求項1ないし4いずれかに記載の基板収納容器。
- 蓋体に基板支持用のリテーナを取り付け、このリテーナを、荷重撓み温度が120℃以上、吸水率が0.1%以下の合成樹脂含有の成形材料で成形するとともに、この成形材料の合成樹脂を、シクロオレフィンポリマー、液晶ポリマー、ポリエーテルエーテルケトン、ポリブチレンテレフタレート、若しくはポリエチレンテレフタレートから選択された少なくとも一種、又はこれらのアロイ樹脂とした請求項1ないし5いずれかに記載の基板収納容器。
Priority Applications (4)
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CN2010800308671A CN102473664A (zh) | 2009-07-09 | 2010-06-28 | 基板收纳容器 |
US13/382,439 US20120103860A1 (en) | 2009-07-09 | 2010-06-28 | Substrate-storing container |
EP10797040.2A EP2453473A4 (en) | 2009-07-09 | 2010-06-28 | SUBSTRATE STORAGE CONTAINER |
SG2012001491A SG177578A1 (en) | 2009-07-09 | 2010-06-28 | Substrate storing container |
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JP2009162359A JP2011018771A (ja) | 2009-07-09 | 2009-07-09 | 基板収納容器 |
JP2009-162359 | 2009-07-09 |
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US (1) | US20120103860A1 (ja) |
EP (1) | EP2453473A4 (ja) |
JP (1) | JP2011018771A (ja) |
KR (1) | KR20120037914A (ja) |
CN (1) | CN102473664A (ja) |
SG (1) | SG177578A1 (ja) |
TW (1) | TW201132563A (ja) |
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EP2835821A4 (en) * | 2012-04-04 | 2015-11-04 | Shinetsu Polymer Co | SUBSTRATE STORAGE CONTAINER |
WO2019127738A1 (zh) * | 2017-12-25 | 2019-07-04 | 惠州市华星光电技术有限公司 | 具有吸水功能的液晶面板包装箱 |
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US10580674B2 (en) | 2013-08-22 | 2020-03-03 | Miraial Co., Ltd. | Substrate storing container |
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WO2015037176A1 (ja) * | 2013-09-11 | 2015-03-19 | 信越ポリマー株式会社 | フォトマスクブランクス基板収納容器 |
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US11227781B2 (en) | 2017-11-15 | 2022-01-18 | Shin-Etsu Polymer Co., Ltd. | Substrate storage container |
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Also Published As
Publication number | Publication date |
---|---|
EP2453473A4 (en) | 2014-07-30 |
US20120103860A1 (en) | 2012-05-03 |
KR20120037914A (ko) | 2012-04-20 |
SG177578A1 (en) | 2012-03-29 |
CN102473664A (zh) | 2012-05-23 |
TW201132563A (en) | 2011-10-01 |
EP2453473A1 (en) | 2012-05-16 |
JP2011018771A (ja) | 2011-01-27 |
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