WO2010143515A1 - 高温用バイメタル - Google Patents
高温用バイメタル Download PDFInfo
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- WO2010143515A1 WO2010143515A1 PCT/JP2010/058637 JP2010058637W WO2010143515A1 WO 2010143515 A1 WO2010143515 A1 WO 2010143515A1 JP 2010058637 W JP2010058637 W JP 2010058637W WO 2010143515 A1 WO2010143515 A1 WO 2010143515A1
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- WIPO (PCT)
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- thermal expansion
- temperature
- expansion layer
- bimetal
- curie point
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- G—PHYSICS
- G12—INSTRUMENT DETAILS
- G12B—CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILS OF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR
- G12B1/00—Sensitive elements capable of producing movement or displacement for purposes not limited to measurement; Associated transmission mechanisms therefor
- G12B1/02—Compound strips or plates, e.g. bimetallic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/011—Layered products comprising a layer of metal all layers being exclusively metallic all layers being formed of iron alloys or steels
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/08—Ferrous alloys, e.g. steel alloys containing nickel
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/12—Ferrous alloys, e.g. steel alloys containing tungsten, tantalum, molybdenum, vanadium, or niobium
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
- C22C38/40—Ferrous alloys, e.g. steel alloys containing chromium with nickel
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12465—All metal or with adjacent metals having magnetic properties, or preformed fiber orientation coordinate with shape
Definitions
- the present invention relates to a high temperature bimetal, and more particularly to a high temperature bimetal provided with a high thermal expansion layer and a low thermal expansion layer.
- a sprayed layer made of a 16Cr-5Al-0.3Y-Fe alloy containing 16% by mass of Cr, 5% by mass of Al, 0.3% by mass of Y, and Fe.
- a high-temperature bimetal that includes an expansion layer) and a plurality of W lines (low thermal expansion layers) arranged in parallel with a predetermined interval and that is curved and deforms according to a temperature change.
- the plurality of W lines of the high-temperature bimetal disclosed in Patent Document 1 are embedded on the upper surface side inside the sprayed layer in a state where each is separated by the same distance from the upper surface of the sprayed layer toward the inside.
- the high-temperature bimetal disclosed in Patent Document 1 has a maximum allowable temperature of 1200 ° C. (upper limit of the operating temperature range) and a curvature coefficient of 5 to 6 ⁇ 10 ⁇ 6 / K.
- the high-temperature bimetal disclosed in Patent Document 1 is considered to have a substantially constant curvature coefficient (5 to 6 ⁇ 10 ⁇ 6 / K) over the entire operating temperature range.
- the high-temperature bimetal disclosed in Patent Document 1 is considered to have a substantially constant curvature coefficient (5 to 6 ⁇ 10 ⁇ 6 / K) over the entire operating temperature range.
- the high-temperature bimetal is configured to come into contact with a stopper member for suppressing the bending deformation of the high-temperature bimetal to a certain range at a set temperature lower than the maximum allowable temperature (1200 ° C.). There may be.
- the stopper member inhibits the deformation of the high temperature bimetal.
- the high-temperature bimetal having a substantially constant curvature coefficient over the entire operating temperature range as in Patent Document 1 has a large curvature coefficient over the low-temperature region and the entire high-temperature region. Thermal stress is likely to accumulate in. Therefore, if the temperature is raised from room temperature to the vicinity of the maximum allowable temperature and then lowered (cooled) to room temperature again, there is a problem that the origin position at room temperature changes greatly.
- the present invention has been made to solve the above-described problems, and one object of the present invention is to provide a high temperature capable of suppressing an increase in the origin position when the temperature is lowered to room temperature. It is to provide bimetal for use.
- a high-temperature bimetal includes a high thermal expansion layer made of austenitic stainless steel, a thermosensitive magnetic metal material having a Curie point, and a low thermal expansion layer bonded to the high thermal expansion layer. It is used over both the high temperature region and the low temperature region below the Curie point, and the upper limit of the use temperature in the high temperature region above the Curie point is 500 ° C. or higher.
- the low thermal expansion layer is made of a temperature-sensitive magnetic metal material having a Curie point, and the high temperature bimetal is divided into a high temperature region above the Curie point and a low temperature below the Curie point.
- the thermal expansion coefficient in the high temperature region above the Curie point is greater than the thermal expansion coefficient in the low temperature region below the Curie point.
- the difference between the thermal expansion coefficient of the high thermal expansion layer and the thermal expansion coefficient of the low thermal expansion layer can be made smaller than the difference between the thermal expansion coefficient of the high thermal expansion layer and the thermal expansion coefficient of the low thermal expansion layer in the low temperature region.
- the bending deformation in the high temperature region is smaller than the bending deformation in the low temperature region, so the displacement amount of the bending deformation of the high temperature bimetal in the high temperature region above the Curie point is less than the Curie point. It can be made smaller than the amount of bending deformation of the high temperature bimetal in the low temperature region. For this reason, since it is possible to suppress the thermal stress from being accumulated inside the high temperature bimetal in the high temperature region above the Curie point, it is possible to make it difficult to accumulate the thermal stress inside the high temperature bimetal. As a result, it is possible to provide a high-temperature bimetal capable of suppressing a change in the origin position when the temperature is lowered to room temperature.
- the curvature coefficient in the high temperature region above the Curie point is preferably smaller than the curvature coefficient in the low temperature region below the Curie point during use.
- the bending deformation of the high temperature bimetal in the high temperature region above the Curie point is smaller than the bending deformation of the high temperature bimetal in the low temperature region below the Curie point. Accumulation of thermal stress inside the bimetal can be easily suppressed.
- the Curie point of the temperature-sensitive magnetic metal material of the low thermal expansion layer is 100 ° C. or more and 400 ° C. or less, and the upper limit of the use temperature in the high temperature region above the Curie point Is 500 ° C. or more and 700 ° C. or less. If comprised in this way, the bimetal for high temperature useful when it is desired to make thermal expansion small in the temperature range more than the temperature contained in 100 degreeC or more and 400 degrees C or less can be obtained.
- the origin position at the time of temperature fall which can be used to the temperature contained in 500 degreeC or more and 700 degrees C or less by using the high temperature bimetal which has the upper limit temperature of use temperature in the temperature range of 500 degreeC or more and 700 degrees C or less It is possible to obtain a high-temperature bimetal with a small change in.
- the operating temperature range in the high temperature region above the Curie point is larger than the operating temperature range in the low temperature region below the Curie point. If comprised in this way, the temperature range where the amount of displacement of the high temperature bimetal in the high temperature region above the Curie point is small can be made larger than the temperature region where the amount of displacement of the high temperature bimetal in the low temperature region below the Curie point is large. . As a result, it is possible to further suppress the thermal stress from being accumulated inside the high temperature bimetal in the high temperature region above the Curie point.
- the temperature-sensitive magnetic metal material of the low thermal expansion layer is preferably a Ni—Fe alloy. If comprised in this way, the temperature-sensitive magnetic metal material which has a Curie point can be obtained easily.
- the temperature-sensitive magnetic metal material of the low thermal expansion layer is a Ni—Fe alloy containing Ni of 32 mass% or more and 45 mass% or less. If comprised in this way, the high temperature bimetal which has a Curie point of 100 to 400 degreeC can be obtained easily.
- the temperature-sensitive magnetic metal material is a Ni—Fe alloy containing Ni of 32% by mass or more and 45% by mass or less
- the temperature-sensitive magnetic metal material of the low thermal expansion layer is made of Ni—Fe alloy with Nb. , Cr, Al, Si, and Ti are added. If comprised in this way, the high temperature bimetal which provided the oxidation resistance to the thermosensitive magnetic metal material which has a Curie point of 100 degreeC or more and 400 degrees C or less can be obtained.
- the temperature-sensitive magnetic metal material is preferably a temperature-sensitive magnetism of a low thermal expansion layer.
- the metal material is formed by adding 2 mass% or more and 8 mass% or less of Nb to the Ni—Fe alloy. With this configuration, by adding 2% by mass or more of Nb to the Ni—Fe alloy, sufficient oxidation resistance is obtained so that there is no problem even if the temperature rises to the upper limit of the use temperature of the high temperature bimetal. It can be applied to a temperature-sensitive magnetic metal material. Further, the addition of more than 8% by mass of Nb to the Ni—Fe alloy results in an excessive increase in the strength of the temperature-sensitive magnetic metal material, thereby reducing the workability of the temperature-sensitive magnetic metal material. Can be suppressed.
- the temperature-sensitive magnetic metal material of the low thermal expansion layer is preferably 36 It is formed by adding 6% by mass of Nb to a Ni—Fe alloy containing mass% of Ni. With this configuration, the temperature-sensitive magnetism has sufficient oxidation resistance so that there is no problem even if the temperature rises to the upper limit of the working temperature of the high-temperature bimetal, and can suppress the deterioration of workability.
- a high-temperature bimetal having a low thermal expansion layer made of a metal material can be obtained.
- the temperature-sensitive magnetic metal material of the low thermal expansion layer is preferably 36 It is formed by adding 2% by mass of Nb to a Ni—Fe alloy containing mass% of Ni. With this configuration, the temperature-sensitive magnetism has sufficient oxidation resistance so that there is no problem even if the temperature rises to the upper limit of the working temperature of the high-temperature bimetal, and can suppress the deterioration of workability.
- a high-temperature bimetal having a low thermal expansion layer made of a metal material can be obtained.
- the temperature-sensitive magnetic metal material is preferably a temperature-sensitive magnetism of a low thermal expansion layer.
- the metal material is formed by adding 2 mass% or more and 13 mass% or less of Cr to the Ni—Fe alloy. With this configuration, by adding 2 mass% or more of Cr to the Ni—Fe alloy, sufficient oxidation resistance is obtained so that there is no problem even if the temperature rises to the upper limit of the use temperature of the high temperature bimetal. It can be applied to a temperature-sensitive magnetic metal material. Further, it is possible to suppress an excessive increase in the thermal expansion coefficient of the low thermal expansion layer due to the addition of more than 13 mass% of Cr to the Ni—Fe alloy.
- the temperature-sensitive magnetic metal material of the low thermal expansion layer is 40 It is formed by adding 10% by mass of Cr to a Ni—Fe alloy containing mass% of Ni. If comprised in this way, even if it raises to the upper limit of the use temperature of a high temperature bimetal, it has sufficient oxidation resistance to the extent that it is satisfactory, and it can suppress that a thermal expansion coefficient becomes large. A high-temperature bimetal having a low thermal expansion layer made of a temperature-sensitive magnetic metal material can be obtained.
- the thickness of the low thermal expansion layer is preferably larger than the thickness of the high thermal expansion layer. If comprised in this way, the high temperature bimetal which has a big curvature coefficient in the low temperature area
- the high-temperature bimetal preferably increased by oxidation when the high thermal expansion layer and the low thermal expansion layer are oxidized by the temperature rising to the upper limit of the use temperature in the high temperature region above the Curie point.
- the total thickness of the high thermal expansion layer and the low thermal expansion layer is 1% or less of the total thickness of the high thermal expansion layer and the low thermal expansion layer before the high thermal expansion layer and the low thermal expansion layer are oxidized.
- the total thickness of the high thermal expansion layer and the low thermal expansion layer is increased by more than 1% due to oxidation, so that the properties (curvature coefficient, etc.) of the high temperature bimetal cause a practical problem. It can suppress changing to a grade.
- the total amount of increase in mass per square centimeter of the high thermal expansion layer and the low thermal expansion layer which is increased by oxidation is 1.5 mg or less. If comprised in this way, it can be confirmed easily whether the total thickness of the high thermal expansion layer and the low thermal expansion layer increased more than 1% by oxidation.
- the thermal expansion coefficient of the low thermal expansion layer in the high temperature region above the Curie point is smaller than the thermal expansion coefficient of the high thermal expansion layer, and the low thermal expansion layer in the low temperature region below the Curie point. Greater than the coefficient of thermal expansion.
- the thermal expansion coefficient of the low thermal expansion layer in the high temperature region above the Curie point is larger than the thermal expansion coefficient of the low thermal expansion layer in the low temperature region below the Curie point, so that the bending deformation of the high temperature bimetal in the low temperature region below the Curie point. Can be suppressed.
- the thermal expansion coefficient of the low thermal expansion layer in the high temperature region above the Curie point is 70% or more and less than 100% of the thermal expansion coefficient of the high thermal expansion layer.
- the thermal expansion coefficient of the low thermal expansion layer in the high temperature region above the Curie point is preferably It is twice or more the thermal expansion coefficient of the low thermal expansion layer in the low temperature region below the point. If comprised in this way, it can suppress more that the curvature deformation of the high temperature bimetal becomes small in the low temperature area
- the thermal expansion coefficient of the low thermal expansion layer in the low temperature region below the Curie point is preferably 50% or less of the thermal expansion coefficient of the high thermal expansion layer.
- the one end of the low thermal expansion layer is preferably fixed, and the other end of the low thermal expansion layer is fixed in a high temperature region above the Curie point. It is comprised so that it may contact.
- the low thermal expansion layer contacts the stopper member in a high temperature region above the Curie point at which thermal stress is prevented from accumulating inside the high temperature bimetal.
- the vicinity of the other end of the low thermal expansion layer is configured to come into contact with the stopper member in a high temperature region above the Curie point and at a temperature near the Curie point.
- the low thermal expansion layer contacts the stopper member at a temperature in the vicinity of the Curie point, so that the thermal stress caused by contacting the stopper member is unlikely to accumulate in the high-temperature bimetal. It can be configured to be usable over a wide temperature range.
- FIG. 5 is a diagram showing a state of a high temperature bimetal in an initial state according to the first to third embodiments of the present invention. It is the figure which showed the state of the bimetal for high temperature when temperature rises from the state shown in FIG. 1, and reaches preset temperature. It is the figure which showed the state of the high temperature bimetal when temperature rises from the state shown in FIG. 2, and it reaches the maximum allowable temperature. It is the figure which showed the state of the bimetal for high temperature when temperature falls from the state shown in FIG. 3, and it returned to normal temperature. It is a figure for demonstrating the initial state of the displacement amount measurement performed in order to confirm the effect of this invention.
- FIG. It is a figure for demonstrating the curved deformation state of the displacement amount measurement performed in order to confirm the effect of this invention. It is the table
- FIG. It is the graph which showed the result of the displacement measurement performed in order to confirm the effect of this invention. It is the table
- the high-temperature bimetal 1 As shown in FIG. 1, the high-temperature bimetal 1 according to the first embodiment of the present invention has two layers of a plate-like high thermal expansion layer 2 and a plate-like low thermal expansion layer 3 bonded to the high thermal expansion layer 2. It is composed of a clad material.
- the high temperature bimetal 1 has a thickness t1 of about 0.2 mm.
- the high-temperature bimetal 1 is configured not to be bent and deformed at an initial state of room temperature T1 (about 25 ° C.).
- T1 room temperature
- the high-temperature bimetal 1 when the high-temperature bimetal 1 is used in a predetermined device (not shown), one end of the high-temperature bimetal 1 is fixed by the fixing portion 4.
- a predetermined device on the other end side of the high temperature bimetal 1 and on the low thermal expansion layer 3 side, a predetermined device in which a stopper 5 for suppressing deformation of the high temperature bimetal 1 beyond a certain level is used. Is provided.
- the stopper 5 is disposed so as to come into contact when the high-temperature bimetal 1 is curved and deformed at a predetermined set temperature T2.
- the stopper 5 is an example of the “stopper member” in the present invention.
- the lower limit of the use temperature range in which the high-temperature bimetal 1 can be used is about ⁇ 70 ° C.
- the upper limit of the use temperature range (maximum allowable temperature T3) is about 700 ° C.
- the upper limit of the use temperature range of the high temperature bimetal 1 should just be about 500 degreeC or more, Preferably, it is good that it is about 500 degreeC or more and about 700 degrees C or less.
- the high thermal expansion layer 2 is made of an 18Cr-8Ni—Fe alloy (SUS304) composed of about 18% by mass of Cr, about 8% by mass of Ni, Fe, and a small amount of inevitable impurities.
- SUS304 is a basic component of SUS304, and occupies the remainder other than Cr, Ni and inevitable impurities.
- SUS304 of the high thermal expansion layer 2 is austenitic stainless steel and has a thermal expansion coefficient of about 17.3 ⁇ 10 ⁇ 6 / K.
- the low thermal expansion layer 3 includes a 36Ni-6Nb-Fe alloy composed of about 36% by mass of Ni, about 6% by mass of Nb, Fe, and a small amount of inevitable impurities. Consists of.
- Fe is a basic component of the 36Ni-6Nb—Fe alloy and occupies the remainder other than Ni, Nb, and inevitable impurities.
- the 36Ni-6Nb—Fe alloy of the low thermal expansion layer 3 is a temperature-sensitive magnetic metal material having a Curie point of about 200 ° C. As a result, the Curie point (about 200 ° C.) of the 36Ni-6Nb—Fe alloy of the low thermal expansion layer 3 is about ⁇ 70 ° C.
- the high temperature bimetal 1 of 1st Embodiment is comprised so that it may be used over the temperature range of both the high temperature area
- the “Curie point” means the temperature at which the temperature-sensitive magnetic metal material changes from a ferromagnetic material to a paramagnetic material when the temperature is raised, and the temperature-sensitive magnetic metal material is stronger than the paramagnetic material when the temperature is lowered. It means the temperature when changing to a magnetic material.
- the 36Ni-6Nb—Fe alloy of the low thermal expansion layer 3 has a thermal expansion coefficient of about 4.1 ⁇ 10 ⁇ 6 / K in a low temperature region below the Curie point (about 200 ° C.) and a high temperature higher than the Curie point.
- the region has a thermal expansion coefficient of about 15.8 ⁇ 10 ⁇ 6 / K.
- the thermal expansion coefficient in the low temperature region (about 4.1 ⁇ 10 ⁇ 6 / K) below the Curie point is It is configured to be smaller than about 15.8 ⁇ 10 ⁇ 6 / K).
- the thermal expansion coefficient of the low thermal expansion layer 3 in the high temperature region is the thermal expansion coefficient of the low thermal expansion layer 3 in the low temperature region (about 4.1 ⁇ 10 ⁇ 6 / K). About 3.9 times.
- the thermal expansion coefficient of the low thermal expansion layer 3 in the high temperature region is preferably about twice or more the thermal expansion coefficient of the low thermal expansion layer 3 in the low temperature region.
- the difference between the thermal expansion coefficient of the high thermal expansion layer 2 (about 17.3 ⁇ 10 ⁇ 6 / K) and the thermal expansion coefficient of the low thermal expansion layer 3 (about 15.8 ⁇ 10 ⁇ 6 / K) in the high temperature region. (About 1.5 ⁇ 10 ⁇ 6 / K) is a coefficient of thermal expansion (about 17.3 ⁇ 10 ⁇ 6 / K) of the high thermal expansion layer 2 and a coefficient of thermal expansion of the low thermal expansion layer 3 (about 4. 1 ⁇ 10 ⁇ 6 / K) (approximately 13.2 ⁇ 10 ⁇ 6 / K).
- the thermal expansion coefficients (about 4.1 ⁇ 10 ⁇ 6 / K and about 15.8 ⁇ 10 ⁇ 6 / K) of the 36Ni-6Nb—Fe alloy of the low thermal expansion layer 3 in the low temperature region and the high temperature region are both
- the high thermal expansion layer 2 is configured to be smaller than the thermal expansion coefficient (about 17.3 ⁇ 10 ⁇ 6 / K) of SUS304.
- the thermal expansion coefficient (about 4.1 ⁇ 10 ⁇ 6 / K) of the 36Ni-6Nb—Fe alloy of the low thermal expansion layer 3 in the low temperature region below the Curie point (about 200 ° C.) is equal to the high thermal expansion layer 2.
- SUS304 about 17.3 ⁇ 10 ⁇ 6 / K).
- the thermal expansion coefficient (about 15.8 ⁇ 10 ⁇ 6 / K) of the 36Ni-6Nb—Fe alloy of the low thermal expansion layer 3 in the high temperature region above the Curie point is about the thermal expansion coefficient (about about 5.8) of the SUS304 of the high thermal expansion layer 2. 17.3 ⁇ 10 ⁇ 6 / K).
- the thermal expansion coefficient of the low thermal expansion layer 3 in the low temperature region is preferably about 50% or less of the thermal expansion coefficient of the high thermal expansion layer 2, and the thermal expansion coefficient of the low thermal expansion layer 3 in the high temperature region is high thermal expansion. It is preferable that the thermal expansion coefficient of the layer 2 is about 70% or more and less than about 100%.
- the high temperature bimetal 1 has a curvature coefficient K1 of about 6.7 ⁇ 10 ⁇ 6 / K in a low temperature region below the Curie point (about 200 ° C.) and about 3.3 ⁇ in a high temperature region above the Curie point. It has a curvature coefficient K2 of 10 ⁇ 6 / K.
- the curvature coefficient K2 (about 3.3 ⁇ 10 ⁇ 6 / K) is configured to be smaller than the curvature coefficient K1 (about 6.7 ⁇ 10 ⁇ 6 / K).
- the thickness t3 of the high thermal expansion layer 2 is configured to be greater than the thickness t2 of the SUS304.
- the high temperature bimetal 1 (the high thermal expansion layer 2 and the low thermal expansion layer 3) is oxidized when the temperature rises to the upper limit temperature (about 700 ° C) of the operating temperature in the high temperature region above the Curie point (about 200 ° C).
- the mass (oxidation increase) of the high-temperature bimetal 1 that increases due to oxidation is about 1.5 mg or less per square centimeter.
- the increase in oxidation is greater than about 1.5 mg (permissible value) per square centimeter
- the increase in the thickness of the high-temperature bimetal 1 due to oxidation becomes greater than about 2 ⁇ m, and the thickness of the high-temperature bimetal before being oxidized. More than about 1% of (about 0.2 mm).
- the properties of the high-temperature bimetal 1 (curvature coefficient K and the like) change to such a degree that a practical problem occurs.
- the high-temperature bimetal 1 in the initial state (normal temperature T1 (about 25 ° C.)), the high-temperature bimetal 1 is not deformed by bending. When the temperature is raised from this state, the high-temperature bimetal 1 is bent and deformed toward the low thermal expansion layer 3 to generate a displacement amount D (see FIG. 2).
- the predetermined set temperature T2 is reached, as shown in FIG. 2, the low thermal expansion layer 3 side of the high temperature bimetal 1 is provided with a stopper 5 provided on the predetermined device side using the high temperature bimetal 1. (Contact).
- the predetermined set temperature T2 is near the Curie point (about 200 ° C.) of the low thermal expansion layer 3 of the high temperature bimetal 1 and from the Curie point. Is also a large temperature.
- the temperature is raised from a predetermined set temperature T2 to a maximum allowable temperature T3 (about 700 ° C.).
- T2 a predetermined set temperature
- T3 a maximum allowable temperature
- the high-temperature bimetal 1 tends to be bent and deformed toward the low thermal expansion layer 3 due to the temperature rise, while the stopper 5 is deformed more than the curved deformation at the predetermined set temperature T2. Not to be restricted. Therefore, a force is applied to the stopper 5 from the high temperature bimetal 1, and a reaction force is applied to the high temperature bimetal 1 from the stopper 5. This reaction force becomes thermal stress and accumulates in the high temperature bimetal 1.
- the bending coefficient K2 (about 3.3 ⁇ 10 ⁇ 6 / K) of the high temperature bimetal 1 in the high temperature region above the Curie point (about 200 ° C.) is in the low temperature region below the Curie point. Since the curvature coefficient K1 (about 6.7 ⁇ 10 ⁇ 6 / K) of the high-temperature bimetal 1 is smaller, the bending deformation in the high temperature region above the Curie point is smaller than the bending deformation in the low temperature region below the Curie point.
- the force applied from the high temperature bimetal 1 to the stopper 5 is applied only when it has only the curvature coefficient K1 in the low temperature region below the Curie point (when it does not have the Curie point and the curvature coefficient K does not change). It is smaller than the force that is generated.
- the high temperature bimetal 1 of the first embodiment has a smaller change in the origin position compared to the conventional high temperature bimetal of the present invention.
- a plate-like SUS304 having a thickness of about 1.5 mm and a plate-like 36Ni-6Nb—Fe alloy having a thickness of about 1.7 mm are cold-welded with a reduction ratio of about 60.6%.
- a bimetal made of a two-layer clad material having a thickness of about 1.3 mm is formed.
- diffusion annealing is performed at about 1050 ° C. for about 3 minutes in a hydrogen atmosphere. Thereby, it is possible to improve the joint strength between the high thermal expansion layer and the low thermal expansion layer of the bimetal.
- the bimetal having a thickness of about 1.3 mm is cold-rolled to a thickness t1 (see FIG. 1) of about 0.2 mm.
- the high temperature bimetal 1 (refer FIG. 1) by 1st Embodiment is formed.
- the ratio between the thickness of the plate-like SUS304 and the thickness of the plate-like 36Ni-6Nb—Fe alloy does not change even in the above-described pressure welding and rolling.
- the low thermal expansion layer 3 is made of a 36Ni-6Nb—Fe alloy having a Curie point (about 200 ° C.), and the high-temperature bimetal 1 is placed in a high temperature region above the Curie point (about 200 ° C.). More than about 700 ° C or lower) and a low temperature range lower than the Curie point (about -70 ° C or higher and lower than about 200 ° C), the 36Ni-6Nb-Fe alloy has a high temperature higher than the Curie point.
- the coefficient of thermal expansion in the region (about 15.8 ⁇ 10 ⁇ 6 / K) is larger than the coefficient of thermal expansion in the low temperature region below the Curie point (about 4.1 ⁇ 10 ⁇ 6 / K).
- the bending deformation in the high temperature region is smaller than the bending deformation in the low temperature region, and therefore the displacement amount D of the bending deformation of the high temperature bimetal 1 in the high temperature region above the Curie point.
- the displacement amount D of the bending deformation of the high temperature bimetal 1 in the low temperature region below the Curie point can be made smaller than the displacement amount D of the bending deformation of the high temperature bimetal 1 in the low temperature region below the Curie point.
- the high-temperature bimetal 1 that can suppress the change in the origin position when the temperature is lowered to room temperature.
- the bimetal 1 can be obtained easily.
- the bending coefficient K2 (about 3.3 ⁇ 10 ⁇ 6 / K) of the high-temperature bimetal 1 in the high temperature region above the Curie point (about 200 ° C.) is less than the Curie point.
- the bending deformation of the high-temperature bimetal 1 in the high-temperature region above the Curie point can be reduced by configuring it so as to be smaller than the curvature coefficient K1 (about 6.7 ⁇ 10 ⁇ 6 / K) of the high-temperature bimetal 1 in the low-temperature region. Since it becomes smaller than the curved deformation of the high temperature bimetal 1 in the low temperature region below the Curie point, it is possible to easily suppress the accumulation of thermal stress inside the high temperature bimetal 1 in the high temperature region above the Curie point. .
- the operating temperature range (about 500 ° C.) of the high temperature region composed of the Curie point (about 200 ° C.) or more and about 700 ° C. or less is about ⁇ 70 ° C. or more and less than the Curie point.
- the temperature range in which the displacement D of the high-temperature bimetal 1 is small in the high temperature region above the Curie point is reduced in the low temperature region below the Curie point.
- the displacement amount D of the high-temperature bimetal 1 can be made larger than the temperature region. As a result, it is possible to further suppress the thermal stress from being accumulated inside the high temperature bimetal 1 in a high temperature region above the Curie point.
- the low thermal expansion layer 3 is made of 36Ni— composed of about 36% by mass of Ni, about 6% by mass of Nb, Fe, and a small amount of inevitable impurities.
- the high-temperature bimetal 1 having a temperature-sensitive magnetic metal material having a Curie point of about 200 ° C. can be obtained.
- it has sufficient oxidation resistance to the extent that there is no problem even if the temperature rises to the upper limit (about 700 ° C.) of the use temperature of the high-temperature bimetal 1, and the temperature sensitivity that can suppress deterioration in workability.
- a high-temperature bimetal 1 having a magnetic metal material can be obtained.
- the thickness t3 of the 36Ni-6Nb—Fe alloy of the low thermal expansion layer 3 is made larger than the thickness t2 of the SUS304 of the high thermal expansion layer 2, thereby causing a Curie point (about 200).
- the high-temperature bimetal 1 having a large curvature coefficient K1 in a low-temperature region below (° C.) can be easily obtained.
- the total thickness t1 of the high-temperature bimetal 1 increases by more than about 1% due to oxidation, and the properties of the high-temperature bimetal 1 (curvature coefficients K1 and K2, etc.) cause practical problems. It is possible to suppress the change by the time.
- K the thermal expansion coefficient
- the high temperature bimetal 1 is deformed to the high thermal expansion layer 2 side in the high temperature region.
- the bending of the high-temperature bimetal 1 in the high temperature region is caused by a large difference between the thermal expansion coefficient of the high thermal expansion layer 2 and the thermal expansion coefficient of the low thermal expansion layer 3 in the high temperature region. An increase in deformation can be suppressed.
- the thermal expansion coefficient (about 15.8 ⁇ 10 ⁇ 6 / K) of the low thermal expansion layer 3 in the high temperature region is set to be in the low temperature region below the Curie point (about 200 ° C.).
- the thermal expansion coefficient (about 4.1 ⁇ 10 ⁇ 6 / K) of the low thermal expansion layer 3 is set to be in the low temperature region below the Curie point (about 200 ° C.).
- the thermal expansion coefficient (about 4.1 ⁇ 10 ⁇ 6 / K) of the 36Ni-6Nb—Fe alloy of the low thermal expansion layer 3 in the low temperature region is set to be equal to that of the high thermal expansion layer 2.
- the thermal expansion coefficient of SUS304 is set to about 24% of the thermal expansion coefficient (about 17.3 ⁇ 10 ⁇ 6 / K)
- the difference between the thermal expansion coefficient of the high thermal expansion layer 2 and the thermal expansion coefficient of the low thermal expansion layer 3 in the low temperature region is reduced. Since it can be enlarged, the high-temperature bimetal 1 can be further curved and deformed in the low-temperature region.
- the low thermal expansion layer 3 side of the high-temperature bimetal 1 is in contact (contact) with the stopper 5 provided on the predetermined device side using the high-temperature bimetal 1.
- Thermal stress accumulates inside the high-temperature bimetal 1 by setting the set temperature T2 to be near the Curie point (about 200 ° C.) of the low thermal expansion layer 3 of the high-temperature bimetal 1 and higher than the Curie point. Since the low thermal expansion layer 3 comes into contact with the stopper member 5 in a high temperature region above the Curie point at which it is suppressed, thermal stress generated due to contact with the stopper member 5 is accumulated inside the high temperature bimetal 1. Can be made difficult.
- the low thermal expansion layer 3 is in contact with the stopper member 5 at a temperature in the vicinity of the Curie point, the state in which the thermal stress generated due to the contact with the stopper member 5 is difficult to accumulate inside the high temperature bimetal 1 is wide. It can be configured to be available over a temperature range.
- the low thermal expansion layer 103 includes 40Ni composed of about 40% by mass of Ni, about 10% by mass of Cr, Fe, and a small amount of inevitable impurities.
- 40Ni composed of about 40% by mass of Ni, about 10% by mass of Cr, Fe, and a small amount of inevitable impurities.
- Fe is a basic component of the 40Ni-10Cr—Fe alloy and occupies the remainder other than Ni, Cr and inevitable impurities.
- the 40Ni-10Cr—Fe alloy of the low thermal expansion layer 103 has a Curie point of about 200 ° C.
- the Curie point (about 200 ° C.) of the temperature-sensitive magnetic metal material of the low thermal expansion layer 103 is included in the operating temperature range in which the high-temperature bimetal 101 can be used, from about ⁇ 70 ° C. to about 700 ° C. It is. Further, in the high temperature bimetal 101, the operating temperature range (about 500 ° C.) of the high temperature region configured from the Curie point (about 200 ° C.) to about 700 ° C. is configured from about ⁇ 70 ° C. to less than about 200 ° C. It is comprised so that it may become larger than the use temperature range (about 270 degreeC) of a low temperature area
- the 40Ni-10Cr—Fe alloy of the low thermal expansion layer 103 has a thermal expansion coefficient of about 8.2 ⁇ 10 ⁇ 6 / K in a low temperature region below the Curie point (about 200 ° C.) and a high temperature above the Curie point. The region is configured to have a thermal expansion coefficient of about 16.8 ⁇ 10 ⁇ 6 / K.
- the thermal expansion coefficient in the low temperature region (about 8.2 ⁇ 10 ⁇ 6 / K) below the Curie point is approximately equal to the thermal expansion coefficient in the high temperature region above the Curie point ( It is configured to be smaller than about 16.8 ⁇ 10 ⁇ 6 / K).
- the thermal expansion coefficient (about 16.8 ⁇ 10 ⁇ 6 / K) of the low thermal expansion layer 103 in the high temperature region is the thermal expansion coefficient (about 8.2 ⁇ 10 ⁇ 6 / K) of the low thermal expansion layer 103 in the low temperature region. About twice as much.
- the thermal expansion coefficients (about 8.2 ⁇ 10 ⁇ 6 / K and about 16.8 ⁇ 10 ⁇ 6 ) of the 40Ni-10Cr—Fe alloy of the low thermal expansion layer 103 below the Curie point (about 200 ° C.) and above the Curie point are used.
- / K) are both configured to be smaller than the thermal expansion coefficient (approximately 17.3 ⁇ 10 ⁇ 6 / K) of SUS304 of the high thermal expansion layer 2.
- the thermal expansion coefficient (about 16.8 ⁇ 10 ⁇ 6 / K) of the 40Ni-10Cr—Fe alloy of the low thermal expansion layer 103 in the high temperature region above the Curie point is about the thermal expansion coefficient (about about 16.8 ⁇ 10 ⁇ 6 / K) of the high thermal expansion layer 2. 17.3 ⁇ 10 ⁇ 6 / K) is about 97%.
- the thermal expansion coefficient of the low thermal expansion layer 103 in the low temperature region is preferably about 50% or less of the thermal expansion coefficient of the high thermal expansion layer 2, and the thermal expansion coefficient of the low thermal expansion layer 103 in the high temperature region is high thermal expansion. It is preferable that the thermal expansion coefficient of the layer 2 is about 70% or more and less than about 100%.
- the high temperature bimetal 101 has a curvature coefficient K1 of about 2.3 ⁇ 10 ⁇ 6 / K in a low temperature region below the Curie point (about 200 ° C.) and about 1.1 ⁇ in a high temperature region above the Curie point. It has a curvature coefficient K2 of 10 ⁇ 6 / K.
- the curvature coefficient K2 (about 1.1 ⁇ 10 ⁇ 6 / K) is configured to be smaller than the curvature coefficient K1 (about 2.3 ⁇ 10 ⁇ 6 / K).
- the configuration and the bending deformation of the high temperature bimetal of the second embodiment are the same as those of the first embodiment.
- a plate-like SUS304 having a thickness of about 1.5 mm and a plate-like 40Ni-10Cr-Fe alloy having a thickness of about 1.8 mm are cold-welded with a reduction ratio of about 60.6%.
- a bimetal made of a two-layer clad material having a thickness of about 1.3 mm is formed.
- diffusion annealing is performed at about 1050 ° C. for about 3 minutes in a hydrogen atmosphere. Thereby, it is possible to improve the joint strength between the high thermal expansion layer and the low thermal expansion layer of the bimetal.
- the bimetal having a thickness of about 1.3 mm is cold-rolled to a thickness t1 (see FIG. 1) of about 0.2 mm.
- the bimetal 101 for high temperature (refer FIG. 1) by 2nd Embodiment is formed.
- the ratio between the thickness of the plate-like SUS304 and the thickness of the plate-like 40Ni-10Cr—Fe alloy does not change even in the above-described pressure welding and rolling.
- the ratio of the thickness t3 of the 40Ni-10Cr—Fe alloy of the low thermal expansion layer 103 to the thickness t1 of the high temperature bimetal 101 is about 0.55, so that the thickness of the 40Ni-10Cr—Fe alloy of the low thermal expansion layer 103 is approximately 0.55.
- t3 is configured to be larger than the thickness t2 of the SUS304 of the high thermal expansion layer 2.
- the low thermal expansion layer 103 is made of 40Ni-10Cr— composed of about 40% by mass of Ni, about 10% by mass of Cr, Fe, and a small amount of inevitable impurities.
- the high temperature bimetal 101 which has a temperature-sensitive magnetic metal material which has a Curie point of about 200 degreeC can be obtained.
- it has sufficient oxidation resistance to the extent that there is no problem even if the temperature rises to the upper limit (about 700 ° C.) of the use temperature of the high-temperature bimetal 101 and suppresses an excessive increase in the thermal expansion coefficient. It is possible to obtain a high-temperature bimetal 101 having a temperature-sensitive magnetic metal material capable of being
- K the thermal expansion coefficient
- the high-temperature bimetal 101 is deformed to the high thermal expansion layer 2 side in the high temperature region.
- the bending of the high-temperature bimetal 101 in the high temperature region is caused by the large difference between the thermal expansion coefficient of the high thermal expansion layer 2 and the thermal expansion coefficient of the low thermal expansion layer 103 in the high temperature region. An increase in deformation can be suppressed.
- the thermal expansion coefficient (about 16.8 ⁇ 10 ⁇ 6 / K) of the low thermal expansion layer 103 in the high temperature region is set to be in the low temperature region below the Curie point (about 200 ° C.).
- the thermal expansion coefficient (about 8.2 ⁇ 10 ⁇ 6 / K) of the low thermal expansion layer 103 approximately twice, the bending deformation of the high temperature bimetal 101 is small in a low temperature region below the Curie point (about 200 ° C.). This can be further suppressed.
- the thermal expansion coefficient (about 8.2 ⁇ 10 ⁇ 6 / K) of the low thermal expansion layer 103 in the low temperature region is set to the thermal expansion coefficient (about 17.7) of the high thermal expansion layer 2.
- 3 ⁇ 10 ⁇ 6 / K) of about 47% the difference between the thermal expansion coefficient of the high thermal expansion layer 2 and the thermal expansion coefficient of the low thermal expansion layer 103 in the low temperature region can be increased.
- the bimetal 101 for high temperature can be curved and deformed more greatly.
- the other effects of the high temperature bimetal of the second embodiment are the same as those of the first embodiment.
- the high thermal expansion layer 202 is made of a 12Cr-18Ni—Fe alloy and the low thermal expansion layer 203 is made of a 36Ni-2Nb—Fe alloy. explain.
- the high thermal expansion layer 202 has 12Cr composed of about 12% by mass of Cr, about 18% by mass of Ni, Fe, and a small amount of inevitable impurities.
- 12Cr composed of about 12% by mass of Cr, about 18% by mass of Ni, Fe, and a small amount of inevitable impurities.
- Fe is a basic component of the 12Cr-18Ni—Fe alloy and occupies the remainder other than Ni, Cr and inevitable impurities.
- the 12Cr-18Ni—Fe alloy of the high thermal expansion layer 202 is austenitic stainless steel and has a thermal expansion coefficient of about 19.0 ⁇ 10 ⁇ 6 / K.
- the low thermal expansion layer 203 is a 36Ni-2Nb-Fe alloy composed of about 36% by mass of Ni, about 2% by mass of Nb, Fe, and a small amount of inevitable impurities. Consists of.
- Fe is a basic component of the 36Ni-2Nb-Fe alloy and occupies the remainder other than Ni, Nb and unavoidable impurities.
- the 36Ni-2Nb-Fe alloy of the low thermal expansion layer 203 has a Curie point of about 170 ° C.
- the Curie point (about 170 ° C.) of the temperature-sensitive magnetic metal material of the low thermal expansion layer 203 is included in the operating temperature range in which the high-temperature bimetal 201 can be used, from about ⁇ 70 ° C. to about 700 ° C. It is. Further, in the high temperature bimetal 201, the operating temperature range (about 530 ° C.) of the high temperature region configured from the Curie point (about 170 ° C.) to about 700 ° C. is configured from about ⁇ 70 ° C. to less than about 170 ° C. It is comprised so that it may become larger than the use temperature range (about 200 degreeC) of a low temperature area
- the 36Ni-2Nb-Fe alloy of the low thermal expansion layer 203 has a thermal expansion coefficient of about 3.0 ⁇ 10 ⁇ 6 / K in a low temperature region below the Curie point (about 170 ° C.) and a high temperature above the Curie point. The region has a thermal expansion coefficient of about 15.7 ⁇ 10 ⁇ 6 / K. Further, in the 36Ni-2Nb-Fe alloy of the low thermal expansion layer 203, the thermal expansion coefficient (about 3.0 ⁇ 10 ⁇ 6 / K) in the low temperature region below the Curie point is the thermal expansion coefficient in the high temperature region above the Curie point ( It is configured to be smaller than about 15.7 ⁇ 10 ⁇ 6 / K).
- the thermal expansion coefficient (about 15.7 ⁇ 10 ⁇ 6 / K) of the low thermal expansion layer 203 in the high temperature region is the thermal expansion coefficient (about 3.0 ⁇ 10 ⁇ 6 / K) of the low thermal expansion layer 203 in the low temperature region. Is about 5.2 times greater than
- the difference between the thermal expansion coefficient (about 19.0 ⁇ 10 ⁇ 6 / K) of the high thermal expansion layer 202 and the thermal expansion coefficient (about 15.7 ⁇ 10 ⁇ 6 / K) of the low thermal expansion layer 203 in the high temperature region. (About 3.3 ⁇ 10 ⁇ 6 / K) is the coefficient of thermal expansion (about 19.0 ⁇ 10 ⁇ 6 / K) of the high thermal expansion layer 202 in the low temperature region and the coefficient of thermal expansion (about 3.0.3 ⁇ 10 ⁇ 6 / K). 0 ⁇ 10 ⁇ 6 / K) (approximately 16.0 ⁇ 10 ⁇ 6 / K).
- the thermal expansion coefficients (about 3.0 ⁇ 10 ⁇ 6 / K and about 15.7 ⁇ 10 ⁇ 6 ) of the 36Ni-2Nb—Fe alloy of the low thermal expansion layer 203 below and above the Curie point (about 170 ° C.). / K) are both configured to be smaller than the thermal expansion coefficient (about 19.0 ⁇ 10 ⁇ 6 / K) of the 12Cr-18Ni—Fe alloy of the high thermal expansion layer 202.
- the thermal expansion coefficient (about 3.0 ⁇ 10 ⁇ 6 / K) of the 36Ni-2Nb—Fe alloy of the low thermal expansion layer 203 in the low temperature region below the Curie point (about 170 ° C.) is high.
- thermal expansion coefficient (about 19.0 ⁇ 10 ⁇ 6 / K) of the 12Cr-18Ni—Fe alloy is about 16% of the thermal expansion coefficient (about 19.0 ⁇ 10 ⁇ 6 / K) of the 12Cr-18Ni—Fe alloy.
- thermal expansion coefficient (about 15.7 ⁇ 10 ⁇ 6 / K) of the 36Ni-2Nb—Fe alloy of the low thermal expansion layer 203 in the high temperature region above the Curie point is equal to that of the 12Cr-18Ni—Fe alloy of the high thermal expansion layer 202. It is about 83% of the thermal expansion coefficient (about 19.0 ⁇ 10 ⁇ 6 / K).
- the high temperature bimetal 201 has a curvature coefficient K1 of about 11.9 ⁇ 10 ⁇ 6 / K in a low temperature region below the Curie point (about 170 ° C.), and about 6.5 ⁇ in a high temperature region above the Curie point. It has a curvature coefficient K2 of 10 ⁇ 6 / K.
- the curvature coefficient K2 (about 6.5 ⁇ 10 ⁇ 6 / K) is configured to be smaller than the curvature coefficient K1 (about 11.9 ⁇ 10 ⁇ 6 / K).
- the configuration, bending deformation, and manufacturing method of the high-temperature bimetal of the third embodiment are the same as those of the first embodiment.
- the low thermal expansion layer 203 is made of 36Ni-2Nb- composed of about 36% by mass of Ni, about 2% by mass of Nb, Fe, and a small amount of inevitable impurities.
- the high temperature bimetal 201 which has a temperature-sensitive magnetic metal material which has a Curie point of about 170 degreeC can be obtained.
- it has sufficient oxidation resistance to the extent that there is no problem even if the temperature rises to the upper limit (about 700 ° C.) of the operating temperature of the high-temperature bimetal 201, and it is possible to suppress a decrease in workability.
- a high-temperature bimetal 201 having a magnetic metal material can be obtained.
- K is set to about 83% of the thermal expansion coefficient (about 19.0 ⁇ 10 ⁇ 6 / K) of the 12Cr-18Ni—Fe alloy of the high thermal expansion layer 202, whereby the high temperature bimetal 201 has a high thermal expansion in the high temperature region.
- the thermal expansion coefficient (about 15.7 ⁇ 10 ⁇ 6 / K) of the low thermal expansion layer 203 in the high temperature region is set to be in the low temperature region below the Curie point (about 170 ° C.).
- the thermal expansion coefficient (about 3.0 ⁇ 10 ⁇ 6 / K) of the low thermal expansion layer 203 approximately 5.2 times, the curved deformation of the high temperature bimetal 201 in the low temperature region below the Curie point (about 170 ° C.). Can be further suppressed.
- the thermal expansion coefficient (about 3.0 ⁇ 10 ⁇ 6 / K) of the low thermal expansion layer 203 in the low temperature region is set to the thermal expansion coefficient (about 19. 0 ⁇ 10 ⁇ 6 / K), the difference between the thermal expansion coefficient of the high thermal expansion layer 202 and the thermal expansion coefficient of the low thermal expansion layer 203 in the low temperature region can be increased.
- the high-temperature bimetal 201 can be curved and deformed more greatly.
- the other effects of the high temperature bimetal of the third embodiment are the same as those of the first embodiment.
- Example 1 corresponding to the high temperature bimetal 1 of the first embodiment (see FIG. 1), the manufacturing method of the high temperature bimetal 1 of the first embodiment is used.
- the produced high temperature bimetal was used.
- a high-temperature bimetal SUS304 / 36Ni-6Nb—Fe alloy
- the thickness t1 (see FIG. 5) of the high-temperature bimetal of Example 1 is 0.2 mm
- the thickness t2 see FIG.
- Example 2 corresponding to the high temperature bimetal 101 of the second embodiment (see FIG. 1), a high temperature bimetal produced by the method of manufacturing the high temperature bimetal 101 of the second embodiment was used.
- a high temperature bimetal SUS304 / 40Ni-10Cr—Fe alloy
- the thickness t1 (see FIG. 5) of the high-temperature bimetal of Example 2 is 0.2 mm
- the thickness t2 (see FIG. 5) of SUS304 as the high thermal expansion layer
- 40Ni-10Cr—Fe as the low thermal expansion layer.
- Example 3 corresponding to the high temperature bimetal 201 of the third embodiment (see FIG. 1), the method of manufacturing the high temperature bimetal 201 of the third embodiment (manufacturing of the high temperature bimetal 1 of the first embodiment).
- the high temperature bimetal produced by the same method was used.
- a high-temperature bimetal (12Cr-18Ni-Fe alloy / 36Ni-2Nb-Fe) composed of a high thermal expansion layer made of 12Cr-18Ni-Fe alloy and a low thermal expansion layer made of 36Ni-2Nb-Fe alloy. Alloy
- the displacement amount measurement one end in the length direction of the high temperature bimetal 301 was fixed by the fixing portion 304. Then, by raising the temperature from the initial state to a maximum of 700 ° C., the high-temperature bimetal 301 was curved and deformed toward the low thermal expansion layer 303 as shown in FIG. At this time, the displacement amount D (mm) due to the bending deformation of the high temperature bimetal 301 accompanying the change of the temperature T (° C.) was measured. Further, the bending coefficient K of the high-temperature bimetal 301 was calculated based on the measured displacement amount D and the following equation (1).
- K (t1) ⁇ D / L 2 ⁇ T (1)
- ⁇ D is a difference between the first displacement amount at an arbitrary first temperature and the second displacement amount at an arbitrary second temperature different from the first temperature.
- ⁇ T is the difference between the first temperature and the second temperature.
- Example 1 SUS304 / 36Ni-6Nb—Fe alloy
- Example 2 SUS304 / 40Ni-10Cr—Fe alloy
- Example 3 (12Cr-18Ni—Fe alloy / 36Ni—) were used.
- 2Nb—Fe alloy was used as the high-temperature bimetal 301.
- Comparative Example 1 for comparison with Example 1 the high thermal expansion layer 302 is made of SUS304, and the low thermal expansion layer 303 is 18Cr composed of 18% by mass of Cr, Fe, and a small amount of inevitable impurities.
- a high-temperature bimetal 301 SUS304 / 18Cr—Fe alloy made of —Fe alloy was used.
- the 18Cr—Fe alloy of the low thermal expansion layer 303 of the high-temperature bimetal 301 of Comparative Example 1 does not have a Curie point. Further, the thickness t1 of the high-temperature bimetal 301 of Comparative Example 1 is 0.2 mm, the thickness t2 of the SUS 304 of the high thermal expansion layer 302 of the high-temperature bimetal 301 of Comparative Example 1 (see FIG. 5), and the low thermal expansion layer.
- Comparative Example 2 for comparison with Example 2 it has the same curvature coefficient K as the curvature coefficient K1 in the low temperature region below the Curie point in Example 2, and does not have the Curie point (the curvature coefficient K changes). No) High temperature bimetal was assumed.
- Comparative Example 3 for comparison with Example 3 it has the same curvature coefficient K as the curvature coefficient K1 in the low temperature region below the Curie point in Example 3, and does not have the Curie point (the curvature coefficient K is High temperature bimetal was assumed.
- the curvature coefficient K1 in a low temperature region below the Curie point and the curvature coefficient K2 in a high temperature region above the Curie point were calculated separately.
- the bending coefficient K1 in the low temperature region below the Curie point was calculated.
- the curvature coefficient K2 in the high temperature region above the Curie point was calculated.
- Example 1 As for the experimental results of the displacement measurement shown in FIG. 7 to FIG. 10, with respect to Example 1, in the low temperature region below the Curie point (200 ° C.) shown in FIG. The high-temperature bimetal 301 was curved and deformed in substantially the same manner as the high-temperature bimetal 301 of Comparative Example 1. On the other hand, in the high temperature region above the Curie point, the high temperature bimetal 301 of Example 1 has a smaller amount of bending deformation D than the high temperature bimetal 301 of Comparative Example 1.
- the slope (displacement amount per unit temperature) of the displacement amount D of the high temperature bimetal 301 of Example 1 is a graph of the displacement amount D of the high temperature bimetal 301 of Comparative Example 1. It was confirmed that the inclination was smaller than the inclination (displacement per unit temperature).
- the difference (displacement amount of the first embodiment in the high temperature region) D5 from the deformation displacement amount D5 is the displacement amount D of the bending deformation at 700 ° C. and the displacement amount D of the bending deformation at 200 ° C. It is estimated that it is about one third of the difference (the displacement amount of Comparative Example 1 in the high temperature region) D6.
- the high-temperature bimetal 301 of Example 1 can suppress an increase in thermal stress more than the high-temperature bimetal 301 of Comparative Example 1 in a high-temperature region above the Curie point.
- Example 2 in the low temperature region below the Curie point (200 ° C.) shown in FIG. 7, the high temperature bimetal 301 of Example 2 is for the high temperature of the hypothetical comparative example 2 as shown in FIG. Curved deformation similar to bimetal.
- the high temperature bimetal 301 of Example 2 in the high temperature region above the Curie point, has a smaller amount of bending deformation D than the high temperature bimetal of Comparative Example 2. That is, in the high temperature region above the Curie point, the slope (displacement per unit temperature) of the displacement amount D of the high temperature bimetal 301 of Example 2 is the displacement amount D of the high temperature bimetal of the comparative example 2. It was confirmed that the slope was smaller than the slope (displacement per unit temperature).
- the difference (displacement amount of the second embodiment in the high temperature region) D7 from the deformation displacement amount D7 is the bending deformation displacement amount D at 700 ° C. and the bending deformation displacement at 200 ° C. of the high temperature bimetal of the comparative example 2. It is estimated that the difference from the amount D (a displacement amount of the comparative example 2 in the high temperature region) D8 is about 1/6. Thereby, it is thought that the high temperature bimetal 301 of Example 2 can suppress the increase in thermal stress in the high temperature region above the Curie point, compared with the hypothetical high temperature bimetal of Comparative Example 2.
- the high temperature bimetal 301 of Example 3 is for the high temperature of the hypothetical comparative example 3 as shown in FIG. Curved deformation similar to bimetal.
- the high temperature bimetal 301 of Example 3 had a smaller amount of bending deformation D than the high temperature bimetal of Comparative Example 3. That is, in the high temperature region above the Curie point, the gradient (displacement amount per unit temperature) of the displacement amount D of the high temperature bimetal 301 of Example 3 is the displacement amount D of the high temperature bimetal of Comparative Example 3.
- the curvature coefficient K shown in FIG. 10 was calculated using the data of the displacement D at the predetermined temperature T (100 ° C., 250 ° C. and 300 ° C.) shown in FIG.
- the curvature coefficient K2 (3.3 ⁇ 10 ⁇ 6 / K) in the high temperature region above the Curie point (200 ° C.) is the curvature coefficient K1 in the low temperature region below the Curie point. It was confirmed that it was smaller than (6.7 ⁇ 10 ⁇ 6 / K).
- the curvature coefficient K2 (1.1 ⁇ 10 ⁇ 6 / K) in the high temperature region above the Curie point (200 ° C.) is the curvature coefficient K1 in the low temperature region below the Curie point ( It was confirmed that it was smaller than 2.3 ⁇ 10 ⁇ 6 / K).
- the curvature coefficient K2 (6.5 ⁇ 10 ⁇ 6 / K) in the high temperature region above the Curie point (170 ° C.) is the curvature coefficient K1 ( 11.9 ⁇ 10 ⁇ 6 / K).
- Oxidation increase measurement Next, the oxidation increase measurement will be described.
- measurement was performed using a high-temperature bimetal having a thickness of 0.2 mm, a width of 1.0 cm, and a length of 3.0 cm and composed of a high thermal expansion layer and a low thermal expansion layer. Went.
- the mass after the heat treatment of the sample was measured when the heat treatment was performed by holding at 500 ° C., 600 ° C. and 700 ° C. (maximum allowable temperature) for 15 hours. And the oxidation increase was computed using following formula (2).
- Oxidation increase (mass after heat treatment ⁇ mass before heat treatment) / (1.0 cm ⁇ 3.0 cm) (2) Further, in the measurement of increase in oxidation, Example 1 (SUS304 / 36Ni-6Nb—Fe alloy), Example 2 (SUS304 / 40Ni-10Cr—Fe alloy), and Example 3 (12Cr-18Ni alloy) used in the above-described displacement measurement were used. -Fe alloy / 36Ni-2Nb-Fe alloy) and Comparative Example 1 (SUS304 / 18Cr-Fe alloy) used for comparison with Example 1 in the displacement measurement described above were used as high-temperature bimetals, respectively.
- the high thermal expansion layer is composed of a 23Ni-5Mn-Fe alloy composed of 23% by mass of Ni, 5% by mass of Mn, Fe, and a small amount of inevitable impurities.
- a bimetal made of a 36Ni—Fe alloy composed of 36 mass% Ni, Fe, and a small amount of inevitable impurities was used.
- the high thermal expansion layer is made of a 20Ni-6Cr—Fe alloy composed of 20% by mass of Ni, 6% by mass of Cr, Fe, and a small amount of inevitable impurities. Used a bimetal made of 36Ni-Fe alloy.
- the high thermal expansion layer is made of a 20Ni-6Cr-Fe alloy
- the low thermal expansion layer is made of a 42Ni—Fe alloy composed of 42% by mass of Ni, Fe, and a small amount of inevitable impurities. Bimetal was used.
- the increase in oxidation is greater than 1.5 mg per square centimeter (allowable value)
- the increase in the thickness of the high-temperature bimetal due to oxidation is greater than 2 ⁇ m, and the total thickness of the high-temperature bimetal before being oxidized ( Over 1% of 0.2 mm).
- the properties of the high-temperature bimetal change to such a degree that a practical problem occurs.
- the increase in oxidation was 1.5 mg or less per square centimeter because the high thermal expansion layer made of SUS304 contained Cr and the low thermal expansion made of 36Ni-6Nb—Fe alloy. This is probably because the oxidation resistance of each of the high thermal expansion layer and the low thermal expansion layer was improved by containing Nb in the layer.
- the increase in oxidation was 1.5 mg or less per square centimeter because Cr contained in the high thermal expansion layer made of SUS304 and the low thermal expansion layer made of 40Ni-10Cr—Fe alloy, respectively. This is considered to be because the oxidation resistance of each of the high thermal expansion layer and the low thermal expansion layer was improved.
- the increase in oxidation was 1.5 mg or less per square centimeter because Cr was contained in the high thermal expansion layer made of 12Cr-18Ni—Fe alloy and 36Ni-2Nb—Fe. It is thought that this is because the oxidation resistance of each of the high thermal expansion layer and the low thermal expansion layer was improved by containing Nb in the low thermal expansion layer made of an alloy.
- the increase in oxidation amount was 1.5 mg or less (0.07 mg) per square centimeter in each of the high thermal expansion layer made of SUS304 and the low thermal expansion layer made of 18Cr—Fe alloy. This is considered to be because the oxidation resistance of the high thermal expansion layer and the low thermal expansion layer was improved by the contained Cr.
- the high-temperature bimetal of Example 1 composed of the high thermal expansion layer made of SUS304 and the low thermal expansion layer made of 36Ni-6Nb-Fe alloy was found to have a Curie point (200 In the high temperature region above [° C.], it is possible to suppress an increase in thermal stress compared to the high temperature bimetal of Comparative Example 1 having no Curie point, and the temperature is raised to the maximum allowable temperature (700 ° C.).
- the properties of the high temperature bimetal (curvature coefficient K and the like) do not change to the extent that a practical problem occurs.
- the high temperature bimetal of Example 1 can suppress the accumulation of thermal stress inside the high temperature bimetal in a high temperature region above the Curie point (200 ° C.), and It was confirmed that it was possible to suppress the property from changing to such an extent that a practical problem occurred.
- the high-temperature bimetal of Example 2 constituted by a high thermal expansion layer made of SUS304 and a low thermal expansion layer made of 40Ni-10Cr-Fe alloy has a Curie point in a high temperature region above the Curie point (200 ° C.). It is possible to suppress an increase in thermal stress as compared with the high temperature bimetal assumed in Comparative Example 2 that does not have, and even if the temperature is increased to the maximum allowable temperature (700 ° C.), the property of the high temperature bimetal (curvature) It is considered that the coefficient K) does not change to the extent that a practical problem occurs.
- the high temperature bimetal of Example 2 can suppress the accumulation of thermal stress inside the high temperature bimetal in the high temperature region above the Curie point (200 ° C.), and It was confirmed that it was possible to suppress the property from changing to such an extent that a practical problem occurred.
- the high temperature bimetal of Example 3 constituted by a high thermal expansion layer made of 12Cr-18Ni—Fe alloy and a low thermal expansion layer made of 36Ni-2Nb—Fe alloy has a high temperature region above the Curie point (170 ° C.).
- the high temperature bimetal of Example 3 can suppress the accumulation of thermal stress inside the high temperature bimetal in the high temperature region above the Curie point (170 ° C.), and It was confirmed that it was possible to suppress the property from changing to such an extent that a practical problem occurred.
- the high thermal expansion layer 2 is made of SUS304 (18Cr-8Ni—Fe alloy), and in the third embodiment, the high thermal expansion layer 202 is made of 12Cr-18Ni—.
- the present invention is not limited to this, and the high thermal expansion layer is not particularly limited as long as it is an austenitic stainless steel.
- SUS305 ((17-19) Cr- (8- 10.5) Ni—Fe alloy) or the like.
- the low thermal expansion layer 3 is made of a 36Ni-6Nb—Fe alloy
- the low thermal expansion layer 103 is made of a 40Ni-10Cr—Fe alloy
- the low thermal expansion layer 203 is made of a 36Ni-2Nb-Fe alloy.
- the present invention is not limited to this, and the low thermal expansion layer is not particularly limited as long as the low thermal expansion layer is a temperature-sensitive magnetic metal material.
- the temperature-sensitive magnetic metal material of the low thermal expansion layer contains about 32 mass% or more of Ni, it is possible to have a Curie point of about 100 ° C. or more.
- the temperature-sensitive magnetic metal material of the low thermal expansion layer contains about 45% by mass or less of Ni, it can have a Curie point of about 400 ° C. or less. Therefore, the temperature-sensitive magnetic metal material of the low thermal expansion layer is preferably made of a Ni—Fe alloy containing about 32% by mass or more and about 45% by mass or less of Ni.
- the low thermal expansion layer 3 is made of a 36Ni-6Nb—Fe alloy.
- the low thermal expansion layer 103 is made of a 40Ni-10Cr—Fe alloy is shown.
- the low thermal expansion layer 203 is made of a 36Ni-2Nb-Fe alloy is shown.
- the present invention is not limited to this, and the temperature-sensitive magnetic metal material of the low thermal expansion layer is about 32% by mass or more. You may comprise so that it may consist of a Ni-Fe alloy which added at least one of Nb, Cr, Al, Si, and Ti to the Ni-Fe alloy containing about 45 mass% or less of Ni.
- Al is preferably added in the range of about 1 mass% to about 5 mass%.
- the reason is as follows. By adding about 1 mass% or more of Al to the Ni—Fe alloy, it is possible to improve the oxidation resistance of the temperature-sensitive magnetic metal material.
- Al is added to the Ni—Fe alloy in an amount of about 5% by mass or less, the workability of the temperature-sensitive magnetic metal material is reduced due to the excessively high strength of the temperature-sensitive magnetic metal material. Can be suppressed.
- the temperature-sensitive magnetic metal material of the low thermal expansion layer when Si is added to the Ni—Fe alloy, it is preferable to add Si in a range of about 1 mass% to about 5 mass%.
- the reason is as follows. By adding about 1% by mass or more of Si to the Ni—Fe alloy, it is possible to improve the oxidation resistance of the temperature-sensitive magnetic metal material.
- Si when Si is added to the Ni—Fe alloy in an amount of about 5 mass% or less, the workability of the temperature-sensitive magnetic metal material is reduced due to the excessively high strength of the temperature-sensitive magnetic metal material. Can be suppressed.
- the temperature-sensitive magnetic metal material of the low thermal expansion layer when Ti is added to the Ni—Fe alloy, it is preferable to add Ti in a range of about 0.2 mass% to about 1 mass%. .
- the reason is as follows. By adding about 0.2% by mass or more of Ti to the Ni—Fe alloy, it is possible to improve the oxidation resistance of the temperature-sensitive magnetic metal material. Further, the addition of about 1% by mass or less of Ti to the Ni—Fe alloy causes the temperature-sensitive magnetic metal material to have an excessively high strength, thereby reducing the workability of the temperature-sensitive magnetic metal material. Can be suppressed.
- the low thermal expansion layer 3 is made of a 36Ni-6Nb-Fe alloy.
- the low thermal expansion layer 203 is made of a 36Ni-2Nb-Fe alloy.
- the present invention is not limited to this, and a Ni—Fe alloy in which the temperature-sensitive magnetic metal material of the low thermal expansion layer contains about 32 mass% or more and about 45 mass% or less of Ni is about 2 mass% or more and about 8 mass%. You may comprise so that it may consist of what was added in the range of the mass% or less.
- the low thermal expansion layer 103 is made of a 40Ni-10Cr—Fe alloy.
- the present invention is not limited to this, and the temperature-sensitive magnetic metal material of the low thermal expansion layer is about 32% by mass. You may comprise so that Cr may be added to the Ni-Fe alloy containing about 45 mass% or less of Ni in the range of about 2 mass% or more and about 13 mass% or less.
- the ratio of the thickness t3 of the 36Ni-6Nb—Fe alloy of the low thermal expansion layer 3 to the total thickness t1 of the high-temperature bimetal 1 is about 0.53.
- the invention is not limited to this, and the ratio of the thickness of the 36Ni-6Nb-Fe alloy of the low thermal expansion layer to the total thickness of the high-temperature bimetal may be about 0.48 or more and about 0.58 or less.
- the ratio of the thickness of the 36Ni-6Nb—Fe alloy is about 0.48 or more and about 0.58 or less, the fluctuation range of the curvature coefficients K1 and K2 is set to the optimum ratio (about 0.53).
- the ratio of the thickness of the 36Ni-6Nb—Fe alloy of the low thermal expansion layer to the total thickness of the high temperature bimetal is preferably larger than about 0.50.
- the ratio of the thickness t3 of the 40Ni-10Cr—Fe alloy of the low thermal expansion layer 103 to the total thickness t1 of the high-temperature bimetal 101 is about 0.55.
- the invention is not limited to this, and the ratio of the thickness of the 40Ni-10Cr—Fe alloy of the low thermal expansion layer to the total thickness of the high temperature bimetal may be about 0.50 or more and about 0.60 or less.
- the fluctuation range of the curvature coefficients K1 and K2 is set to the optimum ratio (about 0.55).
- the ratio of the thickness of the 40Ni-10Cr—Fe alloy of the low thermal expansion layer to the total thickness of the high-temperature bimetal is preferably larger than about 0.50.
- the example in which the lower limit of the use temperature range in which the high-temperature bimetal 1 (101, 201) can be used is about ⁇ 70 ° C.
- the lower limit of the operating temperature range in which the high-temperature bimetal can be used is not limited to about -70 ° C, and may be higher than about -70 ° C or lower than about -70 ° C. .
- the thickness t2 of the high thermal expansion layer 2 (202) is smaller than the thickness t3 of the low thermal expansion layer 3 (103, 203) has been described.
- the thickness of the high thermal expansion layer may be substantially the same as the thickness of the low thermal expansion layer, or may be larger than the thickness of the low thermal expansion layer.
- the high-temperature bimetal 1 (101, 201) has an example having the thickness t1 of about 0.2 mm.
- the present invention is not limited to this, and the thickness of the high-temperature bimetal is not limited to this. May be greater than about 0.2 mm or less than about 0.2 mm.
- the predetermined set temperature T2 is the Curie point (about 200 ° C., about 170 ° C.) of the low thermal expansion layer 3 (103, 203) of the high-temperature bimetal 1 (101, 201).
- the present invention is not limited to this, and the set temperature T2 may not be near the Curie point, or may be a temperature below the Curie point. Good.
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Abstract
Description
まず、図1を参照して、本発明の第1実施形態による高温用バイメタル1の構造について説明する。
次に、図1を参照して、本発明の第2実施形態について説明する。この第2実施形態による高温用バイメタル101では、上記第1実施形態と異なり、低熱膨張層103が40Ni-10Cr-Fe合金からなる場合について説明する。
次に、図1を参照して、本発明の第3実施形態について説明する。この第3実施形態による高温用バイメタル201では、上記第1実施形態と異なり、高熱膨張層202が12Cr-18Ni-Fe合金からなるとともに、低熱膨張層203が36Ni-2Nb-Fe合金からなる場合について説明する。
次に、図1および図5~図10を参照して、上記第1~第3実施形態による高温用バイメタル1(101、201)の効果を確認するために行った変位量測定および酸化増量測定について説明する。
まず、変位量測定について説明する。この変位量測定では、図5に示すように、0.2mmの厚みt1と、15mmの長さLと、2mmの幅(図示せず)とを有する高温用バイメタル301を用いて測定を行った。また、初期状態(常温T1(25℃))では、高温用バイメタル301は湾曲変形しないように構成した。
ここで、t1は、高温用バイメタル301の厚み(図5参照)であり、t1=0.2mmである。また、Lは、高温用バイメタル301の幅(図5参照)であり、L=15mmである。また、ΔDは、任意の第1温度における第1変位量と、第1温度とは異なる任意の第2温度における第2変位量との差である。また、ΔTは、第1温度と第2温度との差である。
次に、酸化増量測定について説明する。この酸化増量測定では、0.2mmの厚みと、1.0cmの幅と、3.0cmの長さとを有し、高熱膨張層と低熱膨張層とから構成されている高温用バイメタルを用いて測定を行った。また、酸化増量測定では、500℃、600℃および700℃(最高許容温度)において、それぞれ、15時間保持することによって熱処理をした際の、試料の熱処理後の質量をそれぞれ測定した。そして、酸化増量を下記の式(2)を用いて算出した。
また、酸化増量測定では、上記した変位量測定で用いた実施例1(SUS304/36Ni-6Nb-Fe合金)、実施例2(SUS304/40Ni-10Cr-Fe合金)および実施例3(12Cr-18Ni-Fe合金/36Ni-2Nb-Fe合金)と、上記した変位量測定において実施例1と比較するために用いた比較例1(SUS304/18Cr-Fe合金)とを高温用バイメタルとしてそれぞれ用いた。一方、比較例4として、高熱膨張層が23質量%のNiと、5質量%のMnと、Feと、微量の不可避的不純物とから構成される23Ni-5Mn-Fe合金からなり、低熱膨張層が36質量%のNiと、Feと、微量の不可避的不純物とから構成される36Ni-Fe合金からなるバイメタルを用いた。また、比較例5として、高熱膨張層が20質量%のNiと、6質量%のCrと、Feと、微量の不可避的不純物とから構成される20Ni-6Cr-Fe合金からなり、低熱膨張層が36Ni-Fe合金からなるバイメタルを用いた。また、比較例6として、高熱膨張層が20Ni-6Cr-Fe合金からなり、低熱膨張層が42質量%のNiと、Feと、微量の不可避的不純物とから構成される42Ni-Fe合金からなるバイメタルを用いた。
Claims (21)
- オーステナイト系ステンレスからなる高熱膨張層(2)と、
キュリー点を有する感温磁性金属材からなり、前記高熱膨張層に貼り合わされた低熱膨張層(3)とを備え、
前記キュリー点以上の高温領域と前記キュリー点未満の低温領域との両方の温度領域に渡って使用されるとともに、前記キュリー点以上の高温領域における使用温度の上限の温度は、500℃以上である、高温用バイメタル。 - 使用時において、前記キュリー点以上の高温領域における湾曲係数は、前記キュリー点未満の低温領域における湾曲係数よりも小さい、請求項1に記載の高温用バイメタル。
- 前記低熱膨張層の感温磁性金属材のキュリー点は、100℃以上400℃以下であるとともに、前記キュリー点以上の高温領域における使用温度の上限の温度は、500℃以上700℃以下である、請求項1に記載の高温用バイメタル。
- 前記キュリー点以上の高温領域における使用温度の範囲は、前記キュリー点未満の低温領域における使用温度の範囲よりも大きい、請求項3に記載の高温用バイメタル。
- 前記低熱膨張層の感温磁性金属材は、Ni-Fe合金である、請求項1に記載の高温用バイメタル。
- 前記低熱膨張層の感温磁性金属材は、32質量%以上45質量%以下のNiを含むNi-Fe合金である、請求項5に記載の高温用バイメタル。
- 前記低熱膨張層の感温磁性金属材は、前記Ni-Fe合金にNb、Cr、Al、Si、Tiのうちの少なくとも1つを添加することにより形成されている、請求項6に記載の高温用バイメタル。
- 前記低熱膨張層の感温磁性金属材は、前記Ni-Fe合金に2質量%以上8質量%以下のNbを添加することにより形成されている、請求項7に記載の高温用バイメタル。
- 前記低熱膨張層の感温磁性金属材は、36質量%のNiを含むNi-Fe合金に6質量%のNbを添加することにより形成されている、請求項8に記載の高温用バイメタル。
- 前記低熱膨張層の感温磁性金属材は、36質量%のNiを含むNi-Fe合金に2質量%のNbを添加することにより形成されている、請求項8に記載の高温用バイメタル。
- 前記低熱膨張層の感温磁性金属材は、前記Ni-Fe合金に2質量%以上13質量%以下のCrを添加することにより形成されている、請求項7に記載の高温用バイメタル。
- 前記低熱膨張層の感温磁性金属材は、40質量%のNiを含むNi-Fe合金に10質量%のCrを添加することにより形成されている、請求項11に記載の高温用バイメタル。
- 前記低熱膨張層の厚みは、前記高熱膨張層の厚みよりも大きい、請求項1に記載の高温用バイメタル。
- 前記キュリー点以上の高温領域における使用温度の上限の温度まで温度が上昇することにより前記高熱膨張層および前記低熱膨張層が酸化される際の、酸化によって増加する前記高熱膨張層および前記低熱膨張層の合計の厚みは、前記高熱膨張層および前記低熱膨張層が酸化される前の前記高熱膨張層および前記低熱膨張層の合計の厚みの1%以下である、請求項1に記載の高温用バイメタル。
- 酸化によって増加する前記高熱膨張層および前記低熱膨張層の1平方センチメートル当たりの質量の増加量の合計は、1.5mg以下である、請求項14に記載の高温用バイメタル。
- 前記キュリー点以上の高温領域における前記低熱膨張層の熱膨張係数は、前記高熱膨張層の熱膨張係数よりも小さく、前記キュリー点未満の低温領域における前記低熱膨張層の熱膨張係数よりも大きい、請求項1に記載の高温用バイメタル。
- 前記キュリー点以上の高温領域における前記低熱膨張層の熱膨張係数は、前記高熱膨張層の熱膨張係数の70%以上100%未満である、請求項16に記載の高温用バイメタル。
- 前記キュリー点以上の高温領域における前記低熱膨張層の熱膨張係数は、前記キュリー点未満の低温領域における前記低熱膨張層の熱膨張係数の2倍以上である、請求項16に記載の高温用バイメタル。
- 前記キュリー点未満の低温領域における前記低熱膨張層の熱膨張係数は、前記高熱膨張層の熱膨張係数の50%以下である、請求項1に記載の高温用バイメタル。
- 前記低熱膨張層の一方端部は固定されているとともに、前記低熱膨張層の他方端部近傍は、前記キュリー点以上の高温領域において、固定されたストッパ部材(5)に接触するように構成されている、請求項1に記載の高温用バイメタル。
- 前記低熱膨張層の他方端部近傍は、前記キュリー点以上の高温領域で、かつ、前記キュリー点近傍の温度において、前記ストッパ部材に接触するように構成されている、請求項20に記載の高温用バイメタル。
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CN201080025529.9A CN102458831B (zh) | 2009-06-11 | 2010-05-21 | 高温用双金属 |
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US10569504B2 (en) * | 2017-02-27 | 2020-02-25 | The Boeing Company | Panel and method of forming a three-sheet panel |
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JP2005206944A (ja) * | 2003-12-26 | 2005-08-04 | Jfe Steel Kk | フェライト系Cr含有鋼材及びその製造方法 |
Cited By (2)
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CN106240124A (zh) * | 2016-08-02 | 2016-12-21 | 温州亚大双金属元件有限公司 | 一种金属复合片生产方法 |
CN106240124B (zh) * | 2016-08-02 | 2018-12-28 | 温州亚大双金属元件有限公司 | 一种金属复合片生产方法 |
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CN102458831A (zh) | 2012-05-16 |
JP5555697B2 (ja) | 2014-07-23 |
US11955205B2 (en) | 2024-04-09 |
CN102458831B (zh) | 2014-12-10 |
US20120077056A1 (en) | 2012-03-29 |
US20220051750A1 (en) | 2022-02-17 |
JPWO2010143515A1 (ja) | 2012-11-22 |
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