WO2010143302A1 - Appareil de transfert et procédé de transfert - Google Patents

Appareil de transfert et procédé de transfert Download PDF

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Publication number
WO2010143302A1
WO2010143302A1 PCT/JP2009/060789 JP2009060789W WO2010143302A1 WO 2010143302 A1 WO2010143302 A1 WO 2010143302A1 JP 2009060789 W JP2009060789 W JP 2009060789W WO 2010143302 A1 WO2010143302 A1 WO 2010143302A1
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WIPO (PCT)
Prior art keywords
mold
transfer
pattern
force
transferred
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Application number
PCT/JP2009/060789
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English (en)
Japanese (ja)
Inventor
正 藤縄
孝幸 糟谷
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パイオニア株式会社
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Publication date
Application filed by パイオニア株式会社 filed Critical パイオニア株式会社
Priority to PCT/JP2009/060789 priority Critical patent/WO2010143302A1/fr
Publication of WO2010143302A1 publication Critical patent/WO2010143302A1/fr

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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/855—Coating only part of a support with a magnetic layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
    • B29C33/442—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles with mechanical ejector or drive means therefor
    • B29C33/444—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles with mechanical ejector or drive means therefor for stripping articles from a mould core, e.g. using stripper plates

Definitions

  • the present invention relates to a transfer apparatus and a transfer method for transferring an uneven pattern to a transfer target.
  • Patent Document 2 discloses a magnetic transfer apparatus that transfers magnetic information of a master carrier to a slave carrier, wherein at least one claw peeling means is inserted into a gap between the master carrier and the slave medium, It is disclosed that the slave medium that is in close contact with the substrate is peeled off from the master carrier.
  • the present invention has been made in view of the above points, and provides a transfer apparatus and a transfer method that can make the release force uniform and can reliably hold the transfer target having the center hole during the release operation.
  • the purpose is to do.
  • the transfer device is a transfer device that transfers a pattern formed on a mold to a transfer target, and supports the transfer target via a hole formed in the transfer target.
  • a releasing means for releasing the transferred body and the mold.
  • the transfer device transfers the first pattern formed on the first mold to one surface of the transferred body and transfers the second pattern formed on the second mold to the transferred body.
  • a transfer device for transferring to the other surface wherein the transfer member support means supports a peripheral portion of a hole formed in the transfer member from the one surface side and the other surface side of the transfer member.
  • the transfer device is a transfer object support means for supporting a peripheral portion of a hole formed in the transfer object from the one surface side and the other surface side of the transfer object; Transfer means for transferring the first pattern to one surface of the transferred body and transferring the second pattern to the other surface of the transferred body, and a predetermined bending force in a direction for bending the first mold A first mold release means for moving the first mold to release the first mold from the transfer target body, and the first mold while applying the predetermined bending force in a direction to bend the second mold. And a second release means for moving the transferred body so as to release the mold from the transferred body.
  • the transfer method according to claim 15 is a transfer method for transferring a pattern formed on a mold to a transfer object, and is supported by a transfer object support means through a hole of the transfer object.
  • a transfer step for transferring the pattern of the mold to the transferred body, a bending step for applying a first bending force in a direction for bending either the mold or the transferred body, and the pattern are transferred.
  • the transfer method according to claim 16 is a transfer method for transferring a pattern formed on a mold to a transfer target, a transfer step for transferring the pattern of the mold, and the transfer target to which the pattern is transferred.
  • a mold release step for releasing the transfer body and the mold, and the mold release step applies an outer peripheral portion of the mold while applying a force in a first direction to a peripheral portion of the hole of the transfer body.
  • the method includes a step of applying a second force in a direction opposite to the first direction, and a step of separating the mold from the transfer target.
  • the first pattern formed on the first mold is transferred to one surface of the transferred body, and the second pattern formed on the second mold is transferred to the transferred body.
  • a transfer method for transferring to the other surface wherein the first pattern of the first mold is transferred to one surface of the transfer object, and the second pattern of the second mold is transferred to the other surface of the transfer object.
  • FIG. 1 It is a figure which shows schematic structure of the imprint apparatus which concerns on this invention. It is a figure which shows an example of the flowchart which shows the imprint method implemented in the imprint apparatus shown in FIG. It is a figure which shows an example of the flowchart which shows the imprint method implemented in the imprint apparatus shown in FIG. It is a figure which represents typically the state (positional relationship) of each of the upper mold holding
  • FIG. 3 is a diagram illustrating a schematic configuration of a substrate 6. It is a figure which shows an example of the mold release process routine performed when performing a double-sided pattern transfer. It is a figure for demonstrating an example of mold release operation
  • FIG. 20 is a diagram showing a transition of the driving force of the upper stage from [State 9] at the time of mold pressing to [State 14] at the time of mold release by the mold release processing routine shown in FIGS. 13, 16, and 19. .
  • Mold for explaining the operation when shifting the start timing to start applying a predetermined force f plurality of gripping portions (509 a1 ⁇ 509 a3, 509 b1 ⁇ 509 b3) every gripping the outer edge of the It is.
  • the mold In order to transfer the concavo-convex pattern formed on the mold to the transfer object, the mold is pressed against the transfer object, and at least one of the mold and the transfer object is bent, the transfer object is pressed. Release the mold from the transfer target.
  • the concave / convex pattern of the mold is gradually peeled off from the transfer layer of the transferred body from the outer edge of the mold and the transferred body toward the inner periphery. Therefore, even if the transfer object has a relatively large area such as a magnetic disk substrate and a center hole, the mold is removed from the transfer object with a uniform peeling force over the entire area of the concavo-convex pattern. It becomes possible to release the mold.
  • FIG. 1 is a cross-sectional view showing a schematic configuration of a UV (ultraviolet) type, that is, an ultraviolet curing type imprint apparatus as a transfer apparatus according to the present invention.
  • a UV (ultraviolet) type that is, an ultraviolet curing type imprint apparatus as a transfer apparatus according to the present invention.
  • This imprint apparatus transfers patterns onto both surfaces of a substrate (including a transfer layer) as an object to be transferred using an upper mold and a lower mold (to be described later) on which uneven patterns to be transferred are formed. Is to do.
  • the imprint apparatus includes an upper mechanism unit, a lower mechanism unit, a controller 200 that controls the upper mechanism unit and the lower mechanism unit, and an operation unit 201.
  • the upper mechanism unit includes an upper center pin 30a, an upper device station 90a, an upper mold holding unit 501a, a board-shaped upper stage 505a, an upper center pin driving unit 507a, an upper UV irradiation unit 508a, and an upper mold gripping unit 510a.
  • the upper stage 505a there is a screw hole portion in which a screw groove into which a ball screw 512, which will be described later, is screwed is cut, along with the opening portion 100a as shown in FIG.
  • An upper mold holder 501a made of a transparent material is installed on the lower surface of the upper stage 505a so as to cover the opening 100a, and an upper device station 90a is installed on the upper surface thereof.
  • an upper center pin drive unit 507a and an upper UV irradiation unit 508 are provided in a movable manner.
  • the upper device station 90a selects the unit designated by the unit designation signal US U supplied from the controller 200 among the upper center pin driving unit 507a and the upper UV irradiation unit 508a as the unit operation position (for example, the opening 100a). Move to the center position.
  • the upper center pin drive unit 507a sets the upper center pin 30a at the center of an upper mold holding surface DF U (described later) of the upper mold holding portion 501a in accordance with the upper center pin movement signal CG U supplied from the controller 200. by penetrating the central hole provided, it is moved in a direction perpendicular to the mold holding surface DF U.
  • the upper UV irradiation unit 508a in accordance with the above ultraviolet radiation signal UV U supplied from the controller 200, the ultraviolet ray as the energy ray to cure the transferred material, toward the upper mold holding portion 501a side through the opening 100a Irradiate.
  • the upper mold holding portion 501a has an upper mold holding surface DF U for holding the upper mold (described later).
  • Upper mold holding surface DF U has a diameter small becomes circular plane than the diameter of the upper mold, the center hole for passing the upper center pin 30a is provided at the center.
  • the outer periphery of the upper mold holding surface DF U of the upper mold holding portion 501a is provided with a plurality of upper mold grip driving unit 510a.
  • the upper mold grip driving unit 510a includes a plurality of grip portions 509a for gripping the outer edge portion of the upper mold. As shown in FIG. 23 (described later), for example, three gripping portions 509a are provided at intervals of 120 degrees as shown in FIG. 23 (described later).
  • the upper mold grip driving unit 510 a drives the grip portion 509 a to grip the outer edge portion of the upper mold in accordance with the upper mold grip signal MQ U supplied from the controller 200.
  • the lower mechanism unit includes a lower center pin 30b, a lower device station 90b, a lower mold holding unit 501b, a board-like lower stage 505b, a lower center pin driving unit 507b, a lower UV irradiation unit 508b, A stage vertical drive unit 511 and a ball screw 512 are provided.
  • the lower stage 505b has a through hole through which the ball screw 512 passes, together with the opening 100b as shown in FIG.
  • One end of the ball screw 512 penetrates the through hole of the lower stage 505b and the other end is a screw hole of the upper stage 505a so that the lower stage 505b and the upper stage 505a are maintained in a parallel state. It is screwed into the part.
  • a lower mold holding unit 501b made of a transparent material is provided on the upper surface of the lower stage 505b so as to cover the opening 100b, and a stage vertical drive unit 511 and a lower device station 90b are provided on the lower surface thereof. Yes.
  • a lower center pin driving unit 507b and a lower UV irradiation unit 508b are provided in a movable manner.
  • Lower device station 90b is within the lower center pin drive unit 507b and the lower UV irradiation unit 508b, unit operating position the unit towards specified by the supplied unit designation signal US L from the controller 200 (e.g., aperture To the center position of the portion 100b.
  • Lower center pin drive unit 507b in accordance with the lower center pin moving signal CG L supplied from the controller 200, a lower center pin 30b, the lower mold holding surface DF L (described later of the lower mold holding portion 501b a center hole provided in the center of to) by penetrating, is moved in a direction perpendicular to the lower mold holding surface DF L.
  • a first support portion TB1 for supporting the upper mold or the lower mold and a second support portion TB2 for supporting the substrate are provided at the tip of the lower center pin 30b.
  • the lower UV irradiation unit 508b emits ultraviolet rays as energy rays for curing the transfer material in accordance with the lower ultraviolet irradiation signal UV L supplied from the controller 200 via the opening 100b. Irradiate toward the side.
  • the stage vertical drive unit 511 maintains the upper stage 505a parallel to the lower stage 505b by rotating the ball screw 512 clockwise or counterclockwise according to the stage drive signal SG supplied from the controller 200. Move it up or down. That is, the upward movement of the upper stage 505a causes the upper mold holding portion 501a to move away from the lower mold holding portion 501b in the direction perpendicular to the mold holding surface of the lower mold holding portion 501b. To do.
  • Lower mold holding part 501b includes a lower mold holding surface DF L for holding the lower mold (described later).
  • Lower mold holding surface DF L has a small becomes circular plane than the diameter of the lower mold a diameter, a center hole for passing the lower center pin 30b is provided at the center thereof.
  • the outer periphery of the lower mold holding surface DF L of the lower mold holding portion 501b, a plurality of lower mold grip driving unit 510b are provided.
  • the lower mold grip driving unit 510b includes a plurality of grip portions 509b for gripping the outer edge portion of the lower mold.
  • the lower mold grip driving unit 510b drives the grip portion 509b to grip the outer edge portion of the lower mold in accordance with the lower mold grip signal MQ L supplied from the controller 200.
  • the operation unit 201 receives various operations by the user and supplies an operation signal CS representing the operation content to the controller 200.
  • the controller 200 controls the imprint apparatus in accordance with the imprint processing program shown in FIGS.
  • FIGS. 4 to 7 show the upper mold holding portion 501a, the lower mold holding portion 501b, the upper center pin 30a, and the lower center pin 30b in the imprint apparatus shown in FIG. 1 at each stage in the pattern transfer operation.
  • Excerpts schematically represent each state (positional relationship).
  • step S1 the controller 200 supplies the lower center pin moving signal CG L to move the lower center pin 30b to a predetermined initial position on the lower center pin drive unit 507b (step S1).
  • step S1 the lower center pin 30b is in the initial state as shown in [State 1] in FIG. 4, that is, the first support portion TB1 and the second support portion TB2 of the lower center pin 30b are both on the lower side. than the lower mold holding surface DF L of the mold holding portion 501b moves to a position which appears in the upper position.
  • step S2 the controller 200 repeatedly determines whether or not the lower center pin 30b supports the mold until the mold is supported (step S2).
  • FIG. 1 the controller 200
  • the transport device (not shown) includes a pattern area PA in which an uneven pattern to be transferred is formed, an outermost peripheral area GA in which such an uneven pattern is not formed, and
  • the disk-shaped mold having the center hole CA is used as the upper mold 503a, and the mold is conveyed to the imprint apparatus with the concave / convex pattern forming surface facing downward.
  • the size of the pattern area PA of the upper mold 503a (diameter) is smaller than the same as the diameter of the upper mold holding surface DF U is circular plane, or the DF U diameter. Further, the diameter of the upper mold 503a itself is larger than the diameter of the upper mold holding surface DF U.
  • a conveying apparatus mounts this upper mold 503a to the lower center pin 30b so that the front-end
  • the upper mold 503a is supported by the first support portion TB1 of the center pin 30b with the concavo-convex pattern surface facing downward, as shown in [State 2] in FIG.
  • the controller 200 sends a stage drive signal SG for moving the upper stage 505a downward to the stage vertical drive unit 511.
  • Supply step S3
  • Step S4 the controller 200, the upper mold holding surface DF U of the upper mold holding portion 501a determines whether or not contact with the upper mold 503a (Step S4).
  • step S4 the upper mold 503a if it is determined not in contact with the upper mold holding surface DF U, the controller 200 again executes the foregoing operation returns to the execution of step S3. That is, as shown in state 3 of FIG. 4, to the upper mold 503a is in contact with the upper mold holding surface DF U of the upper mold holding unit 501a, it is to move the upper mold holding portion 501a downward.
  • step S4 if the upper mold 503a is determined to be in contact with the upper mold holding surface DF U, the controller 200 causes the grip the outermost region GA is the outer edge of the upper mold 503a by the gripping portion 509a, this upper supplying an upper mold gripping signal MQ U to make pressed against the mold holding surface DF U on the upper mold holding the drive unit 510a (step S5).
  • the gripper 509a of each of the upper mold holding / driving unit 510a is shown in FIG.
  • step S5 the upper mold 503a is of being held in the upper mold holding surface DF U of the upper mold holding portion 501a.
  • step S6 the controller 200 supplies a stage drive signal SG that should move the upper stage 505a upward by a predetermined distance to the stage vertical drive unit 511 (step S6).
  • step S6 As shown in [State 4] in FIG. 4, the upper mold holding portion 501a moves upward in the direction of the central axis of the lower center pin 30b. Thereby, the upper mold 503a is detached from the lower center pin 30b.
  • step S7 the controller 200 repeatedly determines whether or not the lower center pin 30b supports the mold until the mold is supported.
  • step S7 for example, as shown in FIG.
  • the transport device is a disk having a pattern area PA in which an uneven pattern to be transferred is formed, an outermost peripheral area GA in which such an uneven pattern is not formed, and a center hole CA.
  • the lower mold 503b is used as the lower mold 503, and the mold is conveyed to the imprint apparatus with the concave / convex pattern forming surface facing upward.
  • the size of the pattern area PA of the lower mold 503b (diameter) is smaller than the diameter of the same as the diameter of the lower mold holding surface DF L is a circular plane, or DF L. Further, the diameter of the lower mold 503b itself is larger than the diameter of the lower mold holding surface DF L.
  • the conveying device attaches the lower mold 503b to the lower center pin 30b so that the tip of the lower center pin 30b penetrates the center hole CA of the lower mold 503b.
  • the lower mold 503b is supported by the first support portion TB1 of the lower center pin 30b with the concave / convex pattern surface facing upward as shown in [State 5] in FIG.
  • the controller 200 may lower the center pin moving signal CG L to lowering the lower center pin 30b to a predetermined position It supplies to the side center pin drive unit 507b (step S8).
  • the lower center pin drive unit 507b lowers the lower center pin 30b to a predetermined position.
  • the lower center pin driving unit 507b is such as Figure 5 in the state 6]
  • the lower center pin 30b is moved downward until it is located on the same plane.
  • the lower mold 503b as shown in the state 6] in FIG. 5, is to be supported on the lower mold holding surface DF L of the lower mold holding portion 501b.
  • the controller 200 causes the grip the outermost region GA is the outer edge of the lower mold 503b by the gripping unit 509b, the lower the lower mold gripping signal MQ L which should make pressed against the lower mold holding surface DF L It supplies to the side mold holding drive unit 510b (step S9).
  • the holding part 509b of each of the lower mold holding and driving unit 510b is obtained by executing step S9. gripping the region surrounded by one-dot chain line in the outermost peripheral region GA of the lower mold 503b as shown in FIG. 8, pressing the lower mold 503b in the lower mold holding surface DF L.
  • step S9 the lower mold 503b is of being held in the lower mold holding surface DF L of the lower mold holding portion 501b.
  • the controller 200 repeatedly determines whether or not the substrate is supported by the lower center pin 30b until the substrate is supported (step S10).
  • the transport device (not shown) transports the disk-shaped substrate 6 having the center hole CB to the imprint device, for example, as shown in FIG.
  • the substrate 6 is cured by being irradiated with ultraviolet rays as energy rays on one side (upper side) and the other side (lower side) of the support substrate 601.
  • An upper transfer layer 604a and a lower transfer layer 604b made of a material are formed.
  • the upper transfer layer 604a and the lower transfer layer 604b are formed on the surface of the support substrate 601 in the transfer area NA excluding the outermost peripheral area QA and the innermost peripheral area JA.
  • the transfer device attaches the substrate 6 to the lower center pin 30b so that the tip of the lower center pin 30b penetrates the center hole CB of the substrate 6.
  • the innermost peripheral area JA of the substrate 6 as shown in FIG. 9 abuts against the second support portion TB2 of the lower center pin 30b, and as a result, the substrate 6 itself is shown in [State 7] in FIG.
  • the substrate 6 itself is shown in [State 7] in FIG.
  • it is supported by the second support portion TB2 of the lower center pin 30b. That is, the lower center pin 30b supports the substrate 6 at a location (non-edge portion) other than the edge portion of the substrate 6 by the second support portion TB2.
  • step S10 If it is determined in step S10 that the substrate 6 is supported by the lower center pin 30b as shown in [State 7] in FIG. 5, the controller 200 drives the stage to move the upper stage 505a downward.
  • the signal SG is supplied to the stage vertical drive unit 511 (step S11).
  • step S11 the upper mold holding unit 501a moves downward in the direction of the central axis of the center pin 30b.
  • step S12 determines whether the upper mold 503a has contacted the substrate 6 (step S12). When it is determined in step S12 that the upper mold 503a is not in contact with the substrate 6, the controller 200 returns to the execution of step S11 and performs the above-described operation again. That is, as shown in [State 8] in FIG. 5, the upper mold holding unit 501a is moved downward until the upper mold 503a contacts the substrate 6.
  • the lower mold 503b is brought into contact with the substrate 6 before the upper mold 503a.
  • the upper mold 503a may be brought into contact with the substrate 6 first.
  • step S12 When it is determined in step S12 that the upper mold 503a is in contact with the substrate 6, the controller 200 performs a mold pressing operation for pressing the upper mold 503a and the lower mold 503b against the substrate 6 (step S13).
  • the controller 200 first, in order to press the substrate 6 the upper mold 503a and the lower mold 503b with a predetermined pressing value PV AD, stage drive signal for moving the upper stage 505a downward SG is supplied to the stage vertical drive unit 511.
  • both surfaces of the substrate 6 are pressed by the upper mold 503a and the lower mold 503b as shown in [State 9] in FIG. Retained.
  • the concavo-convex pattern formed on the upper mold 503a is pressed against the upper transfer layer 604a
  • the concavo-convex pattern formed on the lower mold 503b is pressed against the lower transfer layer 604b.
  • the upper transfer layer 604a and the lower transfer layer 604b are in a liquid state (flowable state)
  • the upper transfer layer 604a is deformed along the uneven pattern shape formed on the upper mold 503a
  • the lower transfer layer 604b is Each deforms along the uneven pattern shape formed in the lower mold 503b.
  • the conditions such as the pressure and holding time for pressing the upper mold 503a and the lower mold 503b against the substrate 6 are the uneven pattern shape of the upper mold 503a and the lower mold 503b and the transfer material of the upper transfer layer 604a and the lower transfer layer 604b. It sets suitably according to etc.
  • step S14 the controller 200 executes a transfer layer curing operation.
  • the controller 200 supplies an ultraviolet irradiation signal UV to the upper UV irradiation unit 508a and the lower UV irradiation unit 508b.
  • the upper UV irradiation unit 508a irradiates the upper transfer layer 604a of the substrate 6 with ultraviolet rays for curing the transfer layer
  • the lower UV irradiation unit 508b applies the ultraviolet rays with which the transfer layer is cured. Irradiate toward 604b.
  • the transfer layers of the upper transfer layer 604a and the lower transfer layer 604b are cured, and the uneven pattern on the surfaces of the upper transfer layer 604a and the lower transfer layer 604b is determined.
  • controller 200 executes a mold release processing routine for releasing the substrate 6 from the upper mold 503a and the lower mold 503b (step S15).
  • FIG. 10 is a diagram showing an example of such a mold release processing routine.
  • the controller 200 supplies a stage drive signal SG for moving the upper stage 505a downward to the stage vertical drive unit 511 in order to press the upper mold 503a against the substrate 6 with a predetermined pressing value PV DD.
  • Step S150 By executing step S150, as shown in [State 11] in FIG. 6, both surfaces of the substrate 6 are brought into a pressure-bonded state by the upper mold 503a and the lower mold 503b. This prevents the lower mold 503b from being released from the substrate 6 when the outer edge of the upper mold 503a is bent upward as will be described later.
  • the controller 200 supplies the upper center pin moving signal CG U to move the upper center pin 30a in a downward direction to the upper center pin drive unit 507a (step S151).
  • the controller 200 determines whether or not the upper center pin 30a has contacted the substrate 6 (step S152). If it is determined in step S152 that the tip of the upper center pin 30a is not in contact with the substrate 6, the process returns to the execution of step S151 and the above-described operation is repeatedly executed. That is, as shown in [State 12] in FIG. 6, the upper center pin 30a is moved downward until the tip of the upper center pin 30a contacts the substrate 6.
  • step S152 If it is determined in step S152 that the upper center pin 30a is in contact with the substrate 6 because the tip of the upper center pin 30a is in contact with the innermost peripheral area JA of the substrate 6 as shown in FIG. 200 supplies the upper center pin moving signal CG U to be pressed upper center pin 30a on the substrate 6 with a predetermined force F to the upper center pin drive unit 507a (step S153). Thereby, as shown in [State 12] in FIG. 6, the upper center pin 30a and the lower center pin 30b are disposed in the innermost peripheral region of the substrate 6 in the substrate 6. The innermost peripheral area of the substrate 6 is pressed downward with a predetermined force F at the tip of the upper center pin 30a.
  • the controller 200 supplies the upper mold holding signal MQ U that should press the outermost peripheral area GA of the upper mold 503a upward with a predetermined force f to the upper mold holding drive unit 510a (step S154).
  • the gripper 509a of the upper mold holding drive unit 510a grips the outer edge of the upper mold 503a (the outermost peripheral area GA) as shown in [State 13] in FIG. Press with a predetermined force f so as to bend in the direction.
  • step S154 the upper mold 503a is curved edges of the upper mold holding surface DF U of the upper mold holding portion 501a as a fulcrum, its outermost region GA curves upward.
  • the controller 200 supplies a stage drive signal SG for moving the upper stage 505a upward to the stage vertical drive unit 511 (step S155).
  • step S155 the upper mold holding unit 501a moves upward, and the upper mold 503a is released from the substrate 6 as shown in [State 14] in FIG. At this time, the upper mold 503a moves upward with the outermost peripheral area GA bent upward as shown in FIG. Therefore, immediately after the movement, as shown in FIG. 11B, the upper mold 503a bends in a form in which the concavo-convex pattern surface side is raised with the mold center as the apex. As a result, first, as shown in FIG. 11B, release from the upper transfer layer 604a of the substrate 6 occurs from the outermost peripheral portion of the pattern area PA of the upper mold 503a. Then, as the upper mold 503a moves upward, as shown in FIGS.
  • the concavo-convex pattern gradually changes from the outer peripheral portion to the inner peripheral portion of the upper mold 503a.
  • the mold is released from the upper transfer layer 604a.
  • the controller 200 lowers the lower mold grip signal MQ L to press the outermost peripheral area GA of the lower mold 503b downward with a predetermined force f.
  • Supply to the mold holding drive unit 510b step S156.
  • the gripper 509b of the lower mold holding drive unit 510b grips the outer edge portion (outermost peripheral area GA) of the lower mold 503b as shown in [State 15] in FIG.
  • step S156 As a fulcrum edge of the lower mold holding surface DF L of the lower mold holding part 501b, the outermost peripheral area GA of the lower mold 503b It is pushed down.
  • the controller 200 supplies the center pin moving signal CG L to be raised to the lower center pin 30b to a predetermined position on the lower center pin drive unit 507b (step S157).
  • step S157 the lower center pin 30b, [state 16 to indicate as a first lower mold holding surface DF L and the same plane of the support section TB1 lower mold holding portion 501b of FIG. 7 Move up until it is positioned above.
  • the substrate 6 moves upward and separates from the lower mold 503b in a state where the outermost peripheral area GA of the lower mold 503b is pushed downward. Therefore, immediately after the movement, as shown in FIG. 12B, the lower mold 503b bends in a form in which the concavo-convex pattern surface side is raised with the mold center as the apex. As a result, as the substrate 6 moves upward, as shown in FIG. 12B, the lower transfer layer 604b of the substrate 6 moves from the outermost periphery of the pattern area PA of the lower mold 503b toward the inner periphery. Go mold release.
  • the controller 200 exits the release processing routine shown in FIG. 10 and proceeds to the execution of step S16 in FIG. That is, the controller 200 determines whether or not an operation command signal indicating the end of the operation is supplied as the operation signal CS from the operation unit 201 (step S16).
  • step S16 When it is determined in step S16 that an operation command signal indicating the end of the operation has been supplied, the controller 200 ends the imprint processing program. On the other hand, when it is determined in step S16 that the operation command signal indicating the end of the operation is not supplied, the controller 200 waits until the transfer device removes the substrate 6 supported by the lower center pin 30b. , it supplies the lower center pin 30b, the lower center pin moving signal CG L to be moved to a predetermined position for supporting the substrate 6 on the lower center pin drive unit 507b (step S17). After the completion of step S17, the controller 200 returns to the execution of step S10 and repeatedly executes the operation as described above. As a result, pattern transfer is continuously performed on the newly supported substrate 6.
  • the molds (503a and 503b) are placed with the concave / convex pattern surface at the center of the mold. Each of them is separated from the substrate 6 in a state of being bent as shown in FIG. 11B and FIG. That is, first, a predetermined bending force is applied in a direction to bend the upper mold 503a by the first mold release means including the upper mold grip driving unit 510a, the stage vertical drive unit 511, and the controller 200, and the upper mold 503a is moved upward. The upper mold 503a is released from the substrate 6 by moving in the direction.
  • a predetermined bending force is applied in a direction in which the lower mold 503b is bent by the second mold release means including the lower mold grip driving unit 510b, the lower center pin driving unit 507b, the lower center pin 30b, and the controller 200.
  • the lower mold 503b is released from the substrate 6 by moving the substrate 6 upward.
  • corrugated pattern of a mold (503a, 503b) is gradually peeled from the transfer layer (604a, 604b) of the board
  • the molds (503a, 503b) can be released from the substrate 6 with a uniform peeling force over the entire region. Become. Further, in the release processing routine shown in FIG. 10, when releasing the upper mold 503a from the substrate 6, the innermost peripheral portion of the substrate 6 is formed at the tip of the upper center pin 30a as shown in [State 13] in FIG. By pressing and bending the innermost peripheral portion of the substrate 6, the peeling force at the inner peripheral portion is made uniform.
  • the upper mold 503a is bent and the inner peripheral area of the substrate 6 is bent.
  • the substrate 6 is not bent.
  • only the upper mold 503a may be bent.
  • the inner peripheral area of the substrate 6 may be simply bent. That is, the mold and the substrate are released from the peripheral portion of the hole by bending the peripheral portion of the hole (CB) in the substrate 6.
  • the amount of deflection of the upper mold 503a may be increased by reducing or reducing the pressing value for pressing the substrate 6 with the upper mold 503a.
  • the direction (from the inner periphery or the outer periphery) in which the mold release occurs may be different when either one of the mold and the substrate is bent or when both are bent. Since this varies depending on the substrate used, the material of the mold, the rigidity, and the like, appropriate adjustment is necessary.
  • FIG. 13 is a diagram showing a release processing routine performed in view of the above points.
  • the release process routine shown in FIG. 13 is executed in place of the release process routine shown in FIG. 10 in step S15 in FIG.
  • step S250 the controller 200 supplies the stage drive signal SG to the stage vertical drive unit 511 to reduce the pressing value for pressing the upper mold 503a against the substrate 6 or to zero (step S250).
  • step S250 the imprint apparatus transitions from [state 10] in FIG. 6 to [state 11] in FIG. That is, the upper mold holding unit 501a stops the operation of pressing the upper mold 503a against the substrate 6, that is, reduces the pressing value of the upper mold against the substrate 6 or sets the upper mold 503a in the vertical direction to zero.
  • the controller 200 supplies the upper center pin moving signal CG U to move the upper center pin 30a in a downward direction to the upper center pin drive unit 507a (step S251).
  • step S252 determines whether or not the upper center pin 30a has contacted the substrate 6 (step S252). If it is determined in step S252 that the tip of the upper center pin 30a is not in contact with the substrate 6, the process returns to the execution of step S251 and the above-described operation is repeated. That is, as shown in [State 12] in FIG. 14, the upper center pin 30a is moved downward until the tip of the upper center pin 30a contacts the substrate 6.
  • step S252 determines whether or not the upper center pin 30a has contacted the substrate 6 because the tip of the upper center pin 30a has contacted the innermost peripheral area JA of the substrate 6 as shown in FIG.
  • the controller 200 supplies the upper mold holding signal MQ U that should press the outermost peripheral area GA of the upper mold 503a upward with a predetermined force f to the upper mold holding drive unit 510a (step S254).
  • the gripping portion 509a of the upper mold holding / driving unit 510a holds the outer edge portion in the state of gripping the outer edge portion (outermost peripheral area GA) of the upper mold 503a.
  • Press with a predetermined force f so as to bend in the direction.
  • the predetermined force f is a force large enough to bend the mold. Therefore, according to the execution of step S254, as shown in FIG.
  • the upper mold 503a is curved edges of the upper mold holding surface DF U of the upper mold holding portion 501a as a fulcrum, its outermost region GA curves upward.
  • the controller 200 supplies a stage drive signal SG for moving the upper stage 505a upward to the stage vertical drive unit 511 (step S255).
  • step S255 the upper mold holding unit 501a moves upward, and the upper mold 503a is released from the substrate 6 as shown in [State 14] in FIG.
  • the upper mold 503a moves upward with the outermost peripheral area GA curved upward, and is separated from the substrate 6. Therefore, immediately after the movement, as shown in FIG.
  • the upper mold 503a bends in a form in which the concavo-convex pattern surface side is raised with the mold center as the apex.
  • the release from the upper transfer layer 604a of the substrate 6 occurs from the outermost peripheral portion of the pattern area PA of the upper mold 503a.
  • the concavo-convex pattern gradually changes from the outer peripheral portion to the inner peripheral portion of the upper mold 503a. The mold is released from the upper transfer layer 604a.
  • step S256 the controller 200 lowers the lower mold grip signal MQ L to press the outermost peripheral area GA of the lower mold 503b downward with a predetermined force f.
  • the mold is supplied to the mold holding / driving unit 510b (step S256).
  • the gripper 509b of the lower mold holding drive unit 510b grips the outer edge portion (outermost peripheral area GA) of the lower mold 503b as shown in [State 15] in FIG. Is pressed with a predetermined force f so as to be pushed downward.
  • step S256 as shown in FIG.
  • step S257 the controller 200 supplies the center pin moving signal CG L to be raised to the lower center pin 30b to a predetermined position on the lower center pin drive unit 507b (step S257).
  • step S257 the lower center pin 30b, [state 16 to indicate as a first lower mold holding surface DF L and the same plane of the support section TB1 lower mold holding portion 501b of FIG. 7 Move up until it is positioned above. Accordingly, as shown in FIG.
  • the substrate 6 moves upward and is separated from the lower mold 503b in a state where the outermost peripheral area GA of the lower mold 503b is pushed downward. Therefore, immediately after the movement, as shown in FIG. 12B, the lower mold 503b bends in a form in which the concavo-convex pattern surface side is raised with the mold center as a vertex. As a result, as the substrate 6 moves upward, as shown in FIG. 12B, the lower transfer layer 604b of the substrate 6 moves from the outermost periphery of the pattern area PA of the lower mold 503b toward the inner periphery. Go mold release. Thereafter, the controller 200 exits the release processing routine shown in FIG.
  • the upper mold 503a should be bent (step S254). To do. As a result, the amount of bending of the upper mold 503a increases as compared with the case where the mold release processing routine shown in FIG. 10 is executed, so that the mold can be easily released.
  • the bending operation for the inner peripheral region of the substrate 6 may be executed while the upper mold 503a is bent.
  • FIG. 16 is a diagram showing a release processing routine performed in view of such points. Note that the release processing routine shown in FIG. 16 is executed in place of the release processing routine shown in FIG. 13 in step S15 of FIG.
  • step S350 the controller 200 supplies a stage drive signal SG to be reduced or reduced to zero to press the upper mold 503a against the substrate 6 to the stage vertical drive unit 511 (step S350).
  • step S350 the imprint apparatus transitions from [state 10] in FIG. 6 to [state 11] in FIG. That is, the upper mold holding unit 501a stops the operation of pressing the upper mold 503a against the substrate 6, that is, reduces the pressing value against the substrate 6 or sets the upper mold 503a in the vertical direction to zero.
  • the controller 200 supplies the upper center pin moving signal CG U to move the upper center pin 30a in a downward direction to the upper center pin drive unit 507a (step S351).
  • step S352 determines whether or not the upper center pin 30a has contacted the substrate 6 (step S352). If it is determined in step S352 that the tip of the upper center pin 30a is not in contact with the substrate 6, the process returns to the execution of step S351 and the above-described operation is repeatedly executed. That is, as shown in [State 12] in FIG. 17, the upper center pin 30a is moved downward until the tip of the upper center pin 30a contacts the substrate 6.
  • step S352 determines the upper center pin movement signal CG U to press the upper center pin 30a against the substrate 6 with a predetermined force F. It supplies to the center pin drive unit 507a (step S353).
  • the upper center pin 30a and the lower center pin 30b sandwich and support the substrate 6 in the innermost peripheral region of the substrate 6, and the tip of the upper center pin 30a.
  • the innermost peripheral area of the substrate 6 is pressed downward with a predetermined force F.
  • the controller 200 supplies the upper mold holding signal MQ U to press the outermost peripheral area GA of the upper mold 503a upward with a predetermined force f to the upper mold holding drive unit 510a (step S354).
  • the gripper 509a of the upper mold holding / driving unit 510a holds the outer edge of the upper mold 503a in the state of gripping the outer edge (outermost peripheral area GA) as shown in [State 13] in FIG. Press with a predetermined force f so as to bend in the direction.
  • the predetermined force f is a force large enough to bend the mold. Therefore, according to the execution of step S354, as shown in FIG. 18 (a), the upper mold 503a is curved edges of the upper mold holding surface DF U of the upper mold holding portion 501a as a fulcrum, its outermost region GA curves upward.
  • step S355 the controller 200 supplies a stage drive signal SG for moving the upper stage 505a upward to the stage vertical drive unit 511 (step S355).
  • step S355 the upper mold holding unit 501a moves upward, and the upper mold 503a is released from the substrate 6 as shown in [State 14] in FIG.
  • the upper mold 503a moves upward with the outermost peripheral area GA curved upward, and is separated from the substrate 6. Therefore, immediately after the movement, as shown in FIG. 18B, the upper mold 503a bends in a form in which the concavo-convex pattern surface side is raised with the mold center as the apex.
  • FIG. 18A the upper mold 503a moves upward with the outermost peripheral area GA curved upward, and is separated from the substrate 6. Therefore, immediately after the movement, as shown in FIG. 18B, the upper mold 503a bends in a form in which the concavo-convex pattern surface side is raised with the mold center as the apex.
  • step S356 release from the upper transfer layer 604a of the substrate 6 occurs from the outermost peripheral portion of the pattern area PA of the upper mold 503a. Then, as the upper mold 503a moves upward, as shown in FIGS. 18 (b) to 18 (c), the concavo-convex pattern gradually changes from the outer peripheral portion to the inner peripheral portion of the upper mold 503a. The mold is released from the upper transfer layer 604a.
  • the controller 200 lowers the lower mold grip signal MQ L to press the outermost peripheral area GA of the lower mold 503b downward with a predetermined force f. Supply to the mold holding drive unit 510b (step S356).
  • step S356 As a result, the gripper 509b of the lower mold holding drive unit 510b grips the outer edge portion (outermost peripheral area GA) of the lower mold 503b as shown in [State 15] in FIG. Is pressed with a predetermined force f so as to be pushed downward.
  • step S356 As shown in FIG. 12 (a), as a fulcrum edge of the lower mold holding surface DF L of the lower mold holding part 501b, the outermost peripheral area GA of the lower mold 503b It is pushed down.
  • the controller 200 supplies the center pin moving signal CG L to be raised to the lower center pin 30b to a predetermined position on the lower center pin drive unit 507b (step S357).
  • step S357 the lower center pin 30b, to the lower mold holding surface DF L of the first support portion TB1 and the lower mold holding portion 501b is to be positioned on the same plane, upward Move to.
  • the substrate 6 moves upward and is separated from the lower mold 503b in a state where the outermost peripheral area GA of the lower mold 503b is pushed downward. Therefore, immediately after the movement, as shown in FIG. 12B, the lower mold 503b bends in a form in which the concavo-convex pattern surface side is raised with the mold center as a vertex.
  • the lower transfer layer 604b of the substrate 6 moves from the outermost periphery of the pattern area PA of the lower mold 503b toward the inner periphery. Go mold release. Thereafter, the controller 200 exits the release processing routine shown in FIG.
  • step S354 the mold (503a, 503b) should be bent (steps S354, S356) in the state where the pressing value for pressing the mold against the substrate is zero, and the substrate is subjected to the final processing.
  • An operation (step S353) to bend the inner peripheral portion is performed. This makes it possible to make the peeling force uniform at the inner periphery of the mold as compared with the case where the mold release processing routine shown in FIG. 13 is executed.
  • the substrate 6 is bent in the inner peripheral region and the upper mold 503 a is bent.
  • the inner peripheral region of the substrate 6 may be bent.
  • at least one of the mold and the substrate is bent in a state in which the pressing value for pressing the mold against the substrate is zero, thereby uniformizing the peeling force at the time of releasing. It is for illustration.
  • the mold releasing operation has been described by taking as an example the case where the molds pressed on both sides of the substrate are released, but also when the mold pressed only on one side of the substrate is released. The same applies.
  • FIG. 19 shows the imprint apparatus shown in FIG. 1, after transferring the concavo-convex pattern only to the upper transfer layer 604a of the substrate 6 using the upper mold 503a of the upper mold 503a and the lower mold 503b. It is a figure which shows the mold release process routine implemented in order to mold
  • FIG. It is assumed that the imprint apparatus is in [State 11] in FIG. 20 at a stage immediately before executing such a release processing routine.
  • the controller 200 supplies a stage drive signal SG to be reduced or reduced to zero to press the upper mold 503a against the substrate 6 to the stage vertical drive unit 511 (step S449).
  • the upper mold holding unit 501a stops the operation of pressing the upper mold 503a against the substrate 6, that is, reduces the pressing value against the substrate 6 or sets the position of the upper mold 503a in the vertical direction to zero.
  • the controller 200 supplies a stage drive signal SG for moving the upper stage 505a upward to the stage vertical drive unit 511, and causes the lower center pin to follow the upward movement of the upper stage 505a.
  • step S450 supplies the center pin moving signal CG L to be moved upward in the lower center pin driving unit 507b (steps S450).
  • step S450 As shown in [State 12] in FIG. 20, the substrate 6 is separated from the lower mold holding portion 501b with the upper mold 503a adhered.
  • the controller 200 supplies the upper center pin moving signal CG U to move the upper center pin 30a in a downward direction to the upper center pin drive unit 507a (step S451).
  • step S452 determines whether or not the upper center pin 30a has contacted the substrate 6 (step S452).
  • step S452 When it is determined in step S452 that the tip of the upper center pin 30a is not in contact with the substrate 6, the process returns to the execution of step S451 and the above-described operation is repeatedly executed. That is, as shown in [State 13] in FIG. 20, the upper center pin 30a is moved downward until the tip of the upper center pin 30a contacts the substrate 6.
  • the controller 200 When it is determined in step S452 that the upper center pin 30a has come into contact with the substrate 6, the controller 200 generates an upper center pin movement signal CG U to press the upper center pin 30a against the substrate 6 with a predetermined force F. It supplies to the drive unit 507a (step S453). As a result, as shown in [State 13] in FIG.
  • the upper center pin 30a and the lower center pin 30b sandwich and support the substrate 6 in the innermost peripheral region of the substrate 6, and the tip of the upper center pin 30a.
  • the innermost peripheral area of the substrate 6 is pressed downward with a predetermined force F.
  • the controller 200 supplies the upper mold holding signal MQ U that should press the outermost peripheral area GA of the upper mold 503a upward with a predetermined force f to the upper mold holding drive unit 510a (step S454).
  • step S454 As a result, the gripping portion 509a of the upper mold holding / driving unit 510a flexes the outer edge portion while gripping the outer edge portion (outermost peripheral area GA) of the upper mold 503a as shown in [State 13] in FIG. It is pressed with a predetermined force f so as to be bent. Therefore, according to the execution of step S454, as shown in FIG. 21 (a), as a fulcrum edge of the upper mold holding surface DF U of the upper mold holding portion 501a, upper outermost region GA of the upper mold 503a Bend in the direction. Next, the controller 200 supplies a stage drive signal SG for moving the upper stage 505a upward to the stage vertical drive unit 511 (step S455).
  • step S455 the upper mold holding unit 501a moves upward, and the upper mold 503a is released from the substrate 6 as shown in [State 14] in FIG. At this time, the upper mold 503a moves upward with the outermost peripheral area GA curved upward as shown in FIG. 21A, and is separated from the substrate 6. Therefore, immediately after the movement, as shown in FIG. 21B, the upper mold 503a bends in a form in which the concavo-convex pattern surface side is raised with the mold center as the apex. As a result, first, as shown in FIG. 21B, release from the upper transfer layer 604a of the substrate 6 occurs from the outermost peripheral portion of the pattern area PA of the upper mold 503a. Then, as the upper mold 503a moves upward, as shown in FIG. 21C, the concave / convex pattern gradually moves from the upper transfer layer 604a of the substrate 6 toward the inner peripheral portion of the upper mold 503a. The mold is released.
  • the substrate 6 is pressed by the upper mold 503a in steps S255, S355, and S45 in order to increase the amount of bending of the upper mold 503a during mold release.
  • the pressing value to be reduced is reduced (or 0), and the transition of the pressing value at each stage is shown in FIG.
  • the driving force PV AD of the upper stage 505 a that is applied downward to press the upper mold 503 a and the lower mold 503 b against the substrate 6 with the pressing value PV AD is applied to the initial stage of the mold release operation.
  • the driving force PV LL is changed to the upward direction in each stage, that is, each of [State 11] to [State 13] in FIGS.
  • the driving force PV LL is slightly smaller than the force that supports the weight of the upper mechanism including the upper mold 503a. Therefore, by applying such a driving force PV LL upward, the position of the upper stage 505a in the vertical direction is not changed from the position at the time of pressing, as shown by the one-dot chain line in FIG. Only the force applied to 6 is reduced (or zero).
  • a predetermined force f is simultaneously applied to the outer edge of the mold by a plurality of gripping portions (509a or 509b) in order to bend the mold (503a, 503b) during the mold release operation.
  • the start timing at which the predetermined force f starts to be applied for each gripping part may be shifted. For example, as shown in FIG. 23, when the three portions of the outer edge portion of the mold (503a, 503b) are gripped by the three gripping portions 509a1 to 509a3 ( 509b1 to 509b3 ), the above steps S154 and S254 are performed.
  • step S354 or S454 the order of the grip portion 509 a1, 509 a2, 509 a3 , go over the predetermined force f at the outer edge of the upper mold 503a. Further, in step S156, S256, or S356, the order of the grip portion 509 b1, 509 b2, 509 b3 , is going over a predetermined force f at the outer edge of the lower mold 503b.
  • a space region surrounded by the stage (505a, 505b) and the mold holding unit (501a, 501b) is formed by the opening (100a, 100b).
  • This region may be constructed of a transparent quartz member.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

Un moule est poussé vers un objet de transfert de sorte qu'un motif découpé ou chantourné formé sur le moule puisse être transféré sur l'objet de transfert, et le moule poussant l'objet de transfert est séparé de l'objet de transfert pendant que le moule et/ou l'objet de transfert sont déformés.
PCT/JP2009/060789 2009-06-12 2009-06-12 Appareil de transfert et procédé de transfert WO2010143302A1 (fr)

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PCT/JP2009/060789 WO2010143302A1 (fr) 2009-06-12 2009-06-12 Appareil de transfert et procédé de transfert

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PCT/JP2009/060789 WO2010143302A1 (fr) 2009-06-12 2009-06-12 Appareil de transfert et procédé de transfert

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WO2010143302A1 true WO2010143302A1 (fr) 2010-12-16

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63131352A (ja) * 1986-11-21 1988-06-03 Canon Inc 光学的記録媒体用基板の製造方法
JPS6461247A (en) * 1987-09-01 1989-03-08 Nec Corp Base plate separating device
JPH02166645A (ja) * 1988-12-21 1990-06-27 Canon Inc 光学的記録媒体用基板の製造方法
JPH0423244A (ja) * 1990-05-18 1992-01-27 Tdk Corp 光ディスク用基板の製造方法および光ディスク
JP2002172626A (ja) * 2000-12-08 2002-06-18 Dainippon Printing Co Ltd レンズシートの剥離方法及び剥離装置
JP2003181855A (ja) * 2001-12-17 2003-07-02 Toppan Printing Co Ltd フレネルレンズの製造方法及びこの製造装置
JP2003296977A (ja) * 2002-04-02 2003-10-17 Global Mach Kk 光学記録媒体の製造方法
JP2008524854A (ja) * 2004-12-16 2008-07-10 エーエスエムエル ホールディング エヌ．ブイ． インプリントリソグラフィに使用されるナノディスクを形成するためのシステムおよび方法ならびにそれによって形成されたナノディスクおよびメモリディスク

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63131352A (ja) * 1986-11-21 1988-06-03 Canon Inc 光学的記録媒体用基板の製造方法
JPS6461247A (en) * 1987-09-01 1989-03-08 Nec Corp Base plate separating device
JPH02166645A (ja) * 1988-12-21 1990-06-27 Canon Inc 光学的記録媒体用基板の製造方法
JPH0423244A (ja) * 1990-05-18 1992-01-27 Tdk Corp 光ディスク用基板の製造方法および光ディスク
JP2002172626A (ja) * 2000-12-08 2002-06-18 Dainippon Printing Co Ltd レンズシートの剥離方法及び剥離装置
JP2003181855A (ja) * 2001-12-17 2003-07-02 Toppan Printing Co Ltd フレネルレンズの製造方法及びこの製造装置
JP2003296977A (ja) * 2002-04-02 2003-10-17 Global Mach Kk 光学記録媒体の製造方法
JP2008524854A (ja) * 2004-12-16 2008-07-10 エーエスエムエル ホールディング エヌ．ブイ． インプリントリソグラフィに使用されるナノディスクを形成するためのシステムおよび方法ならびにそれによって形成されたナノディスクおよびメモリディスク

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