WO2010139175A1 - 一种有机电致发光器件及其测试方法 - Google Patents

一种有机电致发光器件及其测试方法 Download PDF

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Publication number
WO2010139175A1
WO2010139175A1 PCT/CN2009/076257 CN2009076257W WO2010139175A1 WO 2010139175 A1 WO2010139175 A1 WO 2010139175A1 CN 2009076257 W CN2009076257 W CN 2009076257W WO 2010139175 A1 WO2010139175 A1 WO 2010139175A1
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Prior art keywords
lead
leads
region
column
row
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PCT/CN2009/076257
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English (en)
French (fr)
Inventor
邱勇
彭兆基
钟馨义
孙剑
Original Assignee
北京维信诺科技有限公司
昆山维信诺显示技术有限公司
清华大学
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Application filed by 北京维信诺科技有限公司, 昆山维信诺显示技术有限公司, 清华大学 filed Critical 北京维信诺科技有限公司
Priority to JP2012511122A priority Critical patent/JP5716015B2/ja
Priority to PL09845455T priority patent/PL2440015T3/pl
Priority to US13/375,688 priority patent/US8836337B2/en
Priority to EP09845455.6A priority patent/EP2440015B1/en
Publication of WO2010139175A1 publication Critical patent/WO2010139175A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/70—Testing, e.g. accelerated lifetime tests
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/60—Circuit arrangements for operating LEDs comprising organic material, e.g. for operating organic light-emitting diodes [OLED] or polymer light-emitting diodes [PLED]
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F3/00—Optical logic elements; Optical bistable devices
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • G09G3/3225—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
    • G09G3/3233—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • G09G3/3275—Details of drivers for data electrodes
    • G09G3/3291—Details of drivers for data electrodes in which the data driver supplies a variable data voltage for setting the current through, or the voltage across, the light-emitting elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/179—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/861—Repairing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K99/00—Subject matter not provided for in other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Definitions

  • the present invention relates to an organic light emitting device (hereinafter referred to as OLED) and a test method thereof, and more particularly to a lead design of an OLED. Background technique
  • OLED is a flat panel display device which is made by the phenomenon that carriers are combined by an anode and a cathode into an organic functional layer under the action of an electric field to emit light.
  • OLEDs are all solid, self-illuminating, high contrast, ultra-thin, and flexible display.
  • the OLED includes a substrate 103 and a light emitting region 102.
  • the light emitting region 102 is composed of an anode 1002 on the substrate 103.
  • the organic functional layer 1003 and the cathode 1004 are formed.
  • the left and right sides and the lower edge of the light-emitting area 102 are provided with a lead portion 101, and a lower edge of the lead portion 101 is provided with a bonding region 104.
  • the odd row leads 101 [1] are drawn from the left side of the light emitting region 102; the even row leads 101 [2] are drawn from the right side of the light emitting region 102; the left column lead 101 [3] and the right column lead 101 [4] are under the light emitting region 102 Lead out.
  • the row leads and the column leads are respectively led out, they are insulatively condensed in the bonding zone 104, and bonding is performed on one side of the substrate, that is, unilateral bonding.
  • the OLED leads are prepared by photolithography. Important process conditions include etching temperature, speed, time, and etchant concentration. Any process parameters are not well mastered and may cause over-etching. If there is no lead extension, the end of the lead is bonded to the driver chip. Over-etched leads are short Due to the required length of Bonding, these over-etched leads cannot be in contact or poorly contacted with the corresponding chip pins, resulting in the corresponding rows or columns of the illumination area not being illuminated. As shown in FIG. 2-1, the left column lead 201 and the right column lead 202 are over-etched, and the length thereof is shorter than the required length of the bonding, and cannot be in contact with the chip pins.
  • the bonding position is moved up, as shown in Figure 2-2, the left column lead 201 and the right column lead 202 can be normally bonded, but in this way, the chip pin will reach the left column lead 203 and the right column lead. In the bent position of 204, the left column lead 203 and the right column lead 204 cannot be normally connected to the corresponding chip pins.
  • the present invention provides a lead design for an OLED that can be tested and guaranteed to test.
  • the organic electroluminescent device comprises a light emitting region, a lead region, a bonding region, the light emitting region comprises an anode, an organic functional layer, a cathode; the lead region is composed of a lead connecting the anode and the cathode with the driving chip or the circuit board; the bonding region is a lead An area connected to the driver chip or the circuit board; further comprising a lead extension area, the end of the lead being located in the lead extension area, and the lead of the lead extension area forms an angle of more than 0° and less than 90 with the lead of the lead area.
  • the leads of the lead extension area form an angle with the leads of the lead area that is greater than 20° and less than 80°, preferably 30°, 45°, 60° or 75°.
  • the leads are unilaterally divided into odd row leads, even row leads, left column leads and right column leads, column leads are in the middle, odd row leads and even row leads are separated on both sides of the column leads.
  • odd row leads and the even row leads may extend in opposite directions or may extend away from each other, and all row and column leads do not intersect.
  • the left and right column leads extend in opposite directions
  • the odd row and even row leads may also extend in opposite or opposite directions, and all row and column leads do not intersect.
  • the angles of the extensions of the odd row leads, the even row leads, the left column leads, and the right column leads may be different.
  • the leads of the lead extension area may be smaller than the leads of the lead area. That is: when the lead of the lead extension area extends at an angle to the vertical direction, in order to ensure that all the row and column leads do not intersect, the end of the partial lead may be located in the bonding area without extending to the lead extension area.
  • the lead length of the lead extension region is preferably from 0.1 mm to 0.5 mm.
  • Another object of the present invention is to provide a test method for an OLED.
  • a method for testing the above organic electroluminescent display device comprising: (1) shorting the row lead to be lit, short-circuiting the column lead to be lit; (2) shorting the step (1) or The column leads get the lighting voltage; (3) The test results are given according to the test conditions.
  • Step (1) shorts all odd row leads, shorts all even row leads, and shorts all column leads. Step (1) can also short-circuit all the row leads and short-circuit all the column leads.
  • Step (1) ⁇ connect the lead wire to be short-circuited with a conductive material, which is a metal film or a conductive strip.
  • the present invention changes the lead arrangement of the OLED by respectively extending the row and column leads away from each other or relative to each other: (1) Since the row and column leads are respectively connected to the anode or cathode of the OLED, the row leads cannot be connected to the column leads.
  • the lead design of the present invention increases the spacing of the row and column leads, preventing shorting of the row and column leads during the screen test phase.
  • the row and column leads are inclined at a certain angle, so that the contact area with the conductive strip is increased, and the current load shared by the conductive medium per unit area is reduced, thereby improving the life of the conductive strip.
  • the width of the row and column leads in the horizontal direction is increased, which satisfies the requirements of the minimum alignment accuracy of the current test and the old refining tool, so that the conductive strip can be crimped with the lead more easily and accurately.
  • the corresponding test method guarantees the aging and testing of OLEDs, ensuring high yield.
  • the end of the lead is located in the lead extension, that is, it is not bonded at the end of the lead. In this way, even if the etching is performed when the wiring is etched, the end of the lead is not used, thereby ensuring good contact between all the leads and the chip pins, and the bonding effect is ensured.
  • Figure 1-1 is a schematic view of a screen of a conventional organic electroluminescent device
  • Figure 1-2 is a longitudinal sectional view showing the structure of an organic electroluminescent device
  • Figure 2-1 is a schematic diagram of the existing bonding in the case of lead over-etching
  • Figure 2-2 is a schematic diagram of the upward shift of the bonding region in the case of lead over-etching
  • FIG. 3 is a schematic diagram of bonding according to Embodiment 1 of the present invention.
  • Figure 4 is an enlarged view of the area shown by 301 in Figure 3;
  • Figure 5 is a schematic view showing the bonding of Embodiment 2 of the present invention.
  • FIG. 6 is a schematic diagram of bonding according to Embodiment 3 of the present invention.
  • Figure 7 is an enlarged view of the area indicated by 603 in Figure 6;
  • Figure 8 is a schematic view of the bonding according to Embodiment 4 of the present invention.
  • the direction of the OLED from the substrate to the cathode is the longitudinal direction, and the direction perpendicular thereto is the lateral direction.
  • the lead region, the bonding region, and the lead extension region are defined for convenience of description, but it does not mean that the leads of the regions are independent of each other, but are a whole, which is formed by a photolithography process at a time.
  • a portion between the light-emitting region and the bonding region constitutes a lead region; a portion located between the bonding region and the lower edge of the substrate constitutes a lead extension region.
  • the technical solution of the present invention uses a new mask, so that the pattern of the lithographic leads is different from the prior art.
  • OLED manufacturing processes typically include:
  • the lithographic ITO pattern includes a portion as an anode of the OLED device and as an electrode.
  • the part of the lead When the lead is too long or too thin, a large voltage drop is generated on the lead, which reduces the luminous intensity of the display area.
  • chromium is usually added to the ITO as a lead. Therefore, the electrode lead usually comprises two layers of ITO and chromium.
  • An insulating layer and a spacer are prepared by photolithography, which is a necessary process for realizing RGB color, and different pixels are separated to realize a pixel array.
  • an organic electroluminescent material by vacuum evaporation to form an organic functional layer, including a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and the like.
  • the cathode material is covered by vacuum evaporation.
  • the electrode lead is bonded to the driving chip or the circuit board to realize the connection between the light emitting area and the driving chip or the circuit board.
  • the bonding method of the lead and the chip is as follows: Unilateral bonding, that is, all the row and column leads are arranged. One side of the substrate is connected to one chip, as shown in FIG. 1-1; in the bilateral bonding, the row leads are arranged on one side of the substrate, and the column leads are arranged on the other side of the substrate, and are respectively connected to one chip.
  • Unilateral bonding that is, all the row and column leads are arranged. One side of the substrate is connected to one chip, as shown in FIG. 1-1; in the bilateral bonding, the row leads are arranged on one side of the substrate, and the column leads are arranged on the other side of the substrate, and are respectively connected to one chip.
  • Usually unilateral bonding it can save space on the edge of the device and the number of chips.
  • Example 1 is a 96-row X 16-column organic electroluminescent device.
  • the illuminating area laterally leads to the odd row leads 401 [1] and the even row leads 401 [2], and the left column leads 401 [3] and the right column leads 401 [4].
  • the ends of the leads are located in lead extensions 300.
  • the left column lead 401 [3] is bonded to the chip pin, its end exceeds the chip pin and is 30 in the vertical direction.
  • the right column lead 401 [4] is bonded to the chip pin, and its end exceeds the chip pin and is 30 in the vertical direction.
  • Extending to the right; the odd-numbered row leads 401 [1] are bonded to the chip pins, and their ends are 30 after the chip pins are in the vertical direction.
  • the end of the chip is 30 after the chip pin and the vertical direction. Extend to the left.
  • the length of the lead in the lead extension is 0.4 mm.
  • the odd row leads 401 [1], the even row leads 401 [2] the left column leader 401 [3], and the right column leader 401 [4] do not intersect each other.
  • the glass substrate which has been cleaned and dried is placed in a lithographic apparatus on which an ITO layer and a metallic chromium layer thereon have been prepared.
  • UV ultraviolet light
  • the etching solution for etching ITO and chrome is different, the water, hydrochloric acid and nitric acid mixed etching solution with concentration ratio of 10:10:1 and water with a concentration ratio of 10:2:1, ammonium cerium nitrate and nitric acid. Mix the etching solution.
  • the etched lead pattern is shown in FIG. 3. After the etching is completed, it is placed in the vapor deposition chamber to prepare the organic functional layer and the cathode, and then the package cap application process in the isolation chamber is completed. The substrate after the encapsulation step is taken out, and the test process before the bonding is started: In this embodiment, the short-circuit of each part of the lead is realized by the conductive strip, and the blocks 402, 403, and 404 in FIG. 4 are the conductive strip crimping area.
  • the conductive strip of 402 is connected to all the odd row leads 401 [1] of the conducting screen body, and the conductive strip of 403 is connected to all the column leads 401 [3] and 401 [4] of the conducting screen body, and the conductive strip of 404 is connected and connected. All even lines Lead 401 [2], the distance between the three conductive strips is about 1.6mm, which is much larger than the minimum alignment accuracy of the test device - 0.8mm, which can effectively realize the test, and the conductive pads on the PCB of the test device are respectively.
  • the conductive strip at the conductive position is electrically connected, and the test screen is illuminated and recorded in full screen. After the test is completed, the three conductive strips are removed from the screen body, and the screen enters the next step and the driving chip bonding stage.
  • Example 2 is also a 96-row X 16-column organic electroluminescent device.
  • the illuminating area laterally leads to the odd row leads 501 [1] and the even row leads 501 [2], and the left column leads 501 [3] and the right column leads 501 [4].
  • the end of the lead is located in the lead extension area 500. After the left column lead 501 [3] is bonded to the chip pin, its end exceeds the chip pin and is 45 in the vertical direction. Extending to the left; after the right column lead 501 [4] is bonded to the chip pin, its end exceeds the chip pin and is 45 in the vertical direction.
  • the zebra strip is used to realize the short circuit of each part of the lead.
  • the lead extension area 500 is the zebra. The location of the strip.
  • Embodiment 3 is a 64-row X 128-column organic electroluminescent device.
  • the light emitting region laterally leads out odd row leads 701 [1] and even row leads 701 [2], and longitudinally leads left column lead 701 [3] and right column lead 701 [4].
  • the ends of the leads are located in lead extensions 700. After the left column lead 701 [3] is bonded to the chip pin, the end thereof exceeds the chip pin and is 60 in the vertical direction. Extending to the right; after the right column lead 701 [4] is bonded to the chip pin, the end thereof is 60 after the chip pin and the vertical direction.
  • One of the lead 601 and the right of the left column lead 602 is an adjacent lead which may intersect if it extends beyond the chip to the right and left, respectively. Therefore, in order to prevent the ends of the left column lead 601 and the right column lead 602 from intersecting, the ends of the left column lead 601 and the right column lead 602 are located in the bonding area, that is, the two leads are not extended to the lead extension after bonding with the chip pins. Area.
  • test procedure is the same as that of the embodiment 1, and will not be described again.
  • Example 4 is also a 64-row X 128-column organic electroluminescent device.
  • the illuminating area laterally leads to the odd row leads 801 [1] and the even row leads 801 [2], and the left column leads 801 [3] and the right column leads 801 [4] are longitudinally led out.
  • the end of the lead is located in the lead extension area 800. After the left column lead 801 [3] is bonded to the chip pin, its end exceeds the chip pin and is 75 in the vertical direction. Extending to the right; after the right column lead 801 [4] is bonded to the chip pin, its end exceeds the chip pin and is 75 in the vertical direction.
  • the odd-numbered row leads 801 [1] are bonded to the chip pins, and their ends are 75 after the chip pins are in the vertical direction. Extending to the left; even-numbered row leads 801 [2] after bonding with the chip pins, the end of the chip exceeds the chip pin and is 75 in the vertical direction. Extend to the right. The length of the lead in the lead extension is 0.2 mm.
  • the odd row leads 801 [1], the even row leads 801 [2] the left column leader 801 [3], and the right column leader 801 [4] do not intersect each other.
  • Embodiments 2, 3, and 4 are the same as the photolithography process steps of Embodiment 1, however, since the patterns of the leads are different, the mask used in photolithography is different.
  • the present invention uses a new mask, and the pattern of the optically engraved leads is different from the prior art, and the rows and arrows are respectively inclined away from each other or relatively extended.
  • the lead design of the present invention increases the spacing of the row and column leads to prevent shorting of the row and column leads during the screen test phase.
  • the row and column leads are inclined at a certain angle, the contact area with the conductive strip is increased, and the current load shared by the conductive medium per unit area is reduced, thereby improving the life of the conductive strip.
  • the inventors use the present The test and the old refining tool successfully tested and tempered the COG products, ensuring high yield.
  • the end of the lead is located in the lead extension area, that is, it is not bonded at the end of the lead.
  • the etching is etched, the end of the lead is not used, thereby ensuring good contact between the lead and the chip pin, and the lead structure does not increase the number of process steps.

Description

一种有机电致发光器件及其测试方法 技术领域
本发明涉及一种有机电致发光器件 ( Organic Light Emitting Device, 以下 称 OLED )及其测试方法， 尤其涉及 OLED的引线设计。 背景技术
OLED是一种利用载流子在电场作用下由阳极、 阴极进入有机功能层复 合而发光的现象而制成的平板显示器件。 OLED具有全固态、 自发光、 高对 比度、 超薄、 可实现柔软显示等特点。
目前的电子器件在出厂前都要经过测试、 老炼的环节， 对器件性能进行 测试。 对应不同的芯片邦定技术， 在测试老炼阶段会出现不同的问题。 釆用 COG ( Chip on glass )方式进行屏体与芯片邦定， 参照图 1-1及图 1-2, OLED 包括基板 103、发光区 102, 其中发光区 102由位于基板 103上的阳极 1002、 有机功能层 1003、 阴极 1004形成。 发光区 102的左右两侧及下部边缘设置 了引线区 101、 引线区 101的下部边缘设置邦定区 104。 奇数行引线 101 [ 1 ] 由发光区 102左侧引出； 偶数行引线 101 [ 2 ]由发光区 102右侧引出； 左列 引线 101 [ 3 ]和右列引线 101 [ 4 ]由发光区 102下方引出。 行引线及列引线 分别引出后， 彼此绝缘地会聚于邦定区 104, 在基板的一侧进行邦定， 即单 边邦定。
为了图示清晰， 并未画出所有的行、 列引线。 因 COG产品屏体引线间 隙太小，过窄的空间只能用更窄的导电胶条， 以至于导电胶条与引线压接时： ( 1 )导电胶条容易偏位而导致屏体短路； （ 2 )导电胶条的寿命缩短； （ 3 )引 线折断。 当引线间的间隙小于测试、 老炼工装能做到的最小对位精度时， 无 法用全屏点亮 （short bar )方式点亮屏体， 无法做屏体的测试与老炼， 产品 的不良只有在与驱动芯片绑定后才能被发现。 目前无法对此类产品做屏体测 试与老炼， 很难保证高成品率。
OLED的引线是釆用光刻工艺制备的， 重要的工艺条件有刻蚀温度、 速 度、 时间和刻蚀液浓度等， 任何工艺参数掌握不好， 都可能会造成过刻蚀。 如果没有引线延长区， 则引线的末端与驱动芯片进行邦定。 过刻蚀的引线短 于邦定所需的长度， 这些过刻蚀的引线就无法与相应的芯片管脚接触或接触 不良，从而导致发光区相应的行或列无法点亮。如图 2-1所示，左列引线 201、 右列引线 202出现了过刻蚀， 其长度短于邦定所需长度， 无法与芯片管脚接 触。 如果将邦定位置上移， 如图 2-2所示， 使左列引线 201、 右列引线 202 能正常邦定， 但这样一来， 芯片管脚就会到达左列引线 203、 右列引线 204 的弯曲位置， 左列引线 203、 右列引线 204无法与相应的芯片管脚正常连接。 发明内容
本发明提供一种能进行测试并保证测试效果的 OLED的引线设计。
本发明的目的是通过以下技术方案实现的：
有机电致发光器件包括发光区、 引线区、 邦定区， 发光区包括阳极、 有 机功能层、 阴极； 引线区由使阳极和阴极与驱动芯片或电路板连接的引线构 成； 邦定区为引线与驱动芯片或电路板连接的区域； 还包括引线延长区， 引 线的末端位于引线延长区， 引线延长区的引线与引线区的引线形成的角度大 于 0° 且小于 90。 。
引线延长区的引线与引线区的引线形成的角度大于 20° 且小于 80° ，优 选为 30° 、 45° 、 60° 或 75° 。
引线釆用单边邦定时， 分为奇数行引线、 偶数行引线、 左列引线和右列 引线， 列引线位于中部， 奇数行引线及偶数行引线分居列引线的两侧。 左列 引线和右列引线朝相互背离的方向延伸时， 奇数行引线和偶数行引线可以朝 相对的方向延伸， 也可以朝相互背离的方向延伸， 且所有行、 列引线都不相 交。 同样， 左列引线和右列引线朝相对的方向延伸时， 奇数行引线和偶数行 引线也可以朝相对或相互背离的方向延伸， 且所有行、 列引线都不相交。 并 且， 这些奇数行引线、 偶数行引线、 左列引线和右列引线的延长部分的角度 可以不相同。
引线延长区的引线可以少于引线区的引线。 即： 引线延长区的引线与竖 直方向呈一定角度延伸时， 为了保证所有的行、 列引线都不相交， 可以有部 分引线的末端位于邦定区， 而不延伸至引线延长区。
引线延长区的引线长度优选为 0.1mm~0.5mm。
本发明的另一目的是提供一种 OLED的测试方法。
本发明的目的是通过以下技术方案实现的： 一种对上述有机电致发光显示器件进行测试的方法，测试步骤包括： （ 1 ) 将待点亮行引线短路， 将待点亮列引线短路； （ 2 )使步骤（ 1 )短路的行或列 引线得到点亮电压； （3 )根据测试情况给出测试结果。
步骤（1 )可以将所有奇数行引线短路， 将所有偶数行引线短路， 将所有 列引线短路。 步骤（ 1 )也可以将所有行引线短路， 将所有列引线短路。
步骤（ 1 )釆用导电材料连接需短路的引线， 导电材料为金属薄膜或导电 胶条。
本发明改变 OLED的引线设置，分别将行、列引线相互背离或相对延伸： ( 1 ) 因为行引线与列引线分别与 OLED的阳极或阴极相连， 所以行引线不 能与列引线发生连接。 本发明的引线设计增大了行引线与列引线的间距， 防 止在屏体测试阶段将行列引线短路。 （2 )行列引线进行了一定角度的倾斜， 从而与导电胶条的接触面积增大,单位面积的导电介质分担的电流负载减小， 从而提高了导电胶条的寿命。 （3 )增加了行列引线在水平方向上的宽度， 满 足了目前测试、 老炼工装的最小对位精度的要求， 使导电胶条可以更容易、 更精确地与引线压接。
相应的测试方法保证 OLED的老炼与测试， 保证了高成品率。
另外， 引线的末端位于引线延长区， 即不在引线的末端进行邦定。 这样 一来， 即使刻蚀引线时出现过刻蚀的现象， 引线末端并没有被用到， 从而保 证了所有引线与芯片管脚的良好接触， 保证了邦定的效果。 附图说明
图 1-1为现有有机电致发光器件屏体示意图；
图 1-2为有机电致发光器件结构纵向剖面示意图；
图 2-1为引线过刻蚀的情况下现有邦定示意图；
图 2-2为引线过刻蚀的情况下邦定区上移的示意图；
图 3为本发明实施例 1的邦定示意图；
图 4为图 3中 301所示区域的放大图；
图 5为本发明实施例 2的邦定示意图；
图 6为本发明实施例 3的邦定示意图；
图 7为图 6中 603所示区域的放大图； 图 8为本发明实施例 4的邦定示意图。
101-引线区; 102-发光区; 103-基板; 104、 205-邦定区; 1002-阳极; 1003-有机功能层； 1004-阴极； 300、 500、 700、 800-引线延长区; 402、 403、 404-导电胶条压接区； 101[1]、 401 [1]、 501 [1]、 701 [1]、 801 [1]-奇数行引线； 101 [2]、 401 [2]、 501 [2]、 701 [2]、 801 [2]-偶数行引线； 101 [3]、 401 [3]、 501 [3]、 701 [3]、 801 [3]、 201、 203、 601-左列引线； 101 [4]、 401[4]、 501 [4]、 701 [4]、 801 [4]、 202、 204、 602-右列引线。 具体实施方式
本发明以 OLED从基板到阴极的方向为纵向， 与之垂直的方向为横向。 需要说明的是， 为了便于表述而定义了引线区、 邦定区、 引线延长区， 但并 不表示这些区域的引线是相互独立的， 而是一个整体， 是通过光刻工艺一次 形成的， 位于发光区和邦定区之间的部分构成引线区； 位于邦定区和基板下 边缘之间的部分构成引线延长区。
本发明的技术方案釆用新的掩模板， 从而光刻出的引线的图形与现有技 术不同。
OLED的制造工艺通常包括：
( 1 )在玻璃基板上溅射一层电极材料，通常由氧化铟锡（以下简称 ITO ) 或氧化锡辞等透明导电材料构成，光刻后的 ITO图形包括作为 OLED器件阳 极的部分以及作为电极引线的部分。 当引线过长或过细时， 在引线上就会产 生较大的电压降， 使显示区的发光强度减小。 为了尽可能地减小电阻， 通常 在作为引线的 ITO上增加铬。 因此， 电极引线通常包括 ITO和铬两层。
( 2 )通过光刻的方法制备出绝缘层和隔离柱， 这是实现 RGB彩色的必 经工艺， 将不同的像素隔开， 实现像素阵列。
( 3 )真空蒸镀法沉积有机电致发光材料形成有机功能层， 包括空穴注入 层、 空穴传输层、 发光层、 电子传输层等。
( 4 )再用真空蒸镀法覆盖阴极材料。
( 5 )将贴附了干燥片的带有凹槽的玻璃基片与 OLED基板压合在一起， 实现封装， 减少水氧气成分对器件的破坏。
( 6 )电极引线与驱动芯片或电路板邦定， 实现发光区与驱动芯片或电路 板的连接。 引线与芯片的邦定方式有： 单边邦定， 即将所有行、 列引线排布 到基板的一侧与一个芯片进行连接， 如图 1-1; 双边邦定， 即将行引线排布 到基板的一侧， 列引线排布到基板的另一侧， 分别与一个芯片进行连接。 通 常为单边邦定， 可以节省器件边缘的空间及芯片的数量。
以下结合实施例及附图对本发明做进一步说明。
实施例 1
如图 3、 图 4所示， 实施例 1是一个 96行 X 16列的有机电致发光器件。 发光区横向引出奇数行引线 401 [ 1 ]和偶数行引线 401 [2], 纵向引出 左列引线 401 [3]和右列引线 401 [4]。 引线的末端位于引线延长区 300。 左列引线 401 [3 ]与芯片管脚邦定后， 其末端超过芯片管脚后与竖直方向呈 30。 向左侧延伸； 右列引线 401 [4]与芯片管脚邦定后， 其末端超过芯片管 脚后与竖直方向呈 30。 向右侧延伸； 奇数行引线 401 [ 1 ]与芯片管脚邦定 后， 其末端超过芯片管脚后与竖直方向呈 30。 向右侧延伸； 偶数行引线 401
[2]与芯片管脚邦定后， 其末端超过芯片管脚后与竖直方向呈 30。 向左侧 延伸。 引线在引线延长区的长度为 0.4mm。 奇数行引线 401 [ 1 ]、 偶数行引 线 401 [2]左列引线 401 [3 ]、 右列引线 401 [4] 互不相交。
制备本实施例所述有机电致发光器件的引线的工艺步骤包括：
( 1 )将已经清洗干净并烘干的玻璃基板置入光刻设备，玻璃基板上已经 制备有 ITO层及其上的金属铬层。
(2)用旋涂的方法在 ITO及铬层上涂光刻胶并烘烤。
(3)将掩模板覆盖在光刻胶上， 用紫外光 ( UV )通过掩模板照射光刻 胶表面， 对光刻胶进行选择性曝光。
(4)显影、 坚膜。
(5)刻蚀。 刻蚀 ITO和铬釆用的刻蚀液不同， 分别为浓度比例为 10: 10: 1的水、 盐酸、 硝酸混合刻蚀液和浓度比例为 10: 2: 1的水、硝酸铈铵、 硝酸混合刻蚀液。
刻蚀出的引线图形如图 3所示， 刻蚀完成后， 放入蒸镀腔室内进行有机 功能层及阴极的制备， 然后完成在隔离腔室的封装盖贴敷工序。 将完成封装 步骤的基板取出， 开始进行邦定前的测试工序： 本实施例釆用导电胶条实现 各部分引线的短路， 图 4中框 402、 403、 404即为导电胶条压接区域， 402 的导电胶条连接导通屏体全部奇数行引线 401 [ 1 ], 403的导电胶条连接导通 屏体全部列引线 401 [3]和 401 [ 4 ], 404的导电胶条连接导通全部偶数行 引线 401 [2], 三处导电胶条彼此间距约为 1.6mm, 远大于测试装置的最小 对位精度一一 0.8mm, 可有效实现测试， 将测试装置的 PCB上的导电焊盘分 别与三处导电位置的导电胶条电连接， 测试屏体全屏点亮结果并记录， 待测 试完毕， 将三处导电胶条从屏体上取下， 屏体进入下一步与驱动芯片邦定阶 段。
实施例 2
如图 5所示， 实施例 2同样是一个 96行 X 16列的有机电致发光器件。 发光区横向引出奇数行引线 501 [ 1 ]和偶数行引线 501 [2], 纵向引出左列 引线 501 [3]和右列引线 501 [4]。 引线的末端位于引线延长区 500。 左列 引线 501 [3 ]与芯片管脚邦定后， 其末端超过芯片管脚后与竖直方向呈 45 。 向左侧延伸； 右列引线 501 [4]与芯片管脚邦定后， 其末端超过芯片管脚 后与竖直方向呈 45。 向右侧延伸； 奇数行引线 501 [ 1 ]与芯片管脚邦定后， 其末端超过芯片管脚后与竖直方向呈 45。 向左侧延伸； 偶数行引线 501 [2] 与芯片管脚邦定后， 其末端超过芯片管脚后与竖直方向呈 45。 向右侧延伸。 引线在引线延长区的长度为 0.5mm。 奇数行引线 501 [ 1 ]、 偶数行引线 501 [2]左列引线 501 [3 ]、 右列引线 501 [4] 互不相交。
制备本实施例所述有机电致发光器件的引线的工艺步骤与实施例 1 相 同， 在此不再赘述。
刻蚀完成后， 放入蒸镀腔室内进行有机功能层及阴极的制备， 然后完成 在隔离腔室的封装盖贴敷工序。 将完成封装步骤的基板取出， 开始进行邦定 前的测试工序， 测试步骤与实施例 1基本相同， 本实施例釆用斑马条实现各 部分引线的短路， 图 5中引线延长区 500即为斑马条的贴敷位置。 待测试完 毕， 将斑马条从屏体上取下， 屏体进入下一步与驱动芯片邦定阶段。
实施例 3
如图 6、 图 7所示， 实施例 3是一个 64行 X 128列的有机电致发光器件。 发光区横向引出奇数行引线 701 [ 1 ]和偶数行引线 701 [2], 纵向引出左列 引线 701 [3]和右列引线 701 [4]。 引线的末端位于引线延长区 700。 左列 引线 701 [3 ]与芯片管脚邦定后， 其末端超过芯片管脚后与竖直方向呈 60 。 向右侧延伸； 右列引线 701 [4]与芯片管脚邦定后， 其末端超过芯片管脚 后与竖直方向呈 60。 向左侧延伸； 奇数行引线 701 [ 1 ]与芯片管脚邦定后， 其末端超过芯片管脚后与竖直方向呈 60。 向右侧延伸； 偶数行引线 701 [2] 与芯片管脚邦定后， 其末端超过芯片管脚后与竖直方向呈 60。 向左侧延伸。 引线在引线延长区的长度为 0.1mm。 奇数行引线 701 [ 1 ]、 偶数行引线 701 [2]左列引线 701 [3 ]、 右列引线 701 [4]互不相交。
制备本实施例所述有机电致发光器件的引线的工艺步骤与实施例 1 相 同， 在此不再赘述。
左列引线中的一条引线 601和右列引线中的一条引线 602为相邻的引线， 如果超过芯片后分别朝右侧和左侧延伸， 则可能会相交。 所以， 为了防止左 列引线 601和右列引线 602的末端相交， 左列引线 601和右列引线 602的末 端位于邦定区， 即这两条引线与芯片管脚邦定后没有延伸至引线延长区。
测试工序与实施例 1相同， 在此不再赘述。
实施例 4
如图 8所示， 实施例 4同样是一个 64行 X 128列的有机电致发光器件。 发光区横向引出奇数行引线 801 [ 1 ]和偶数行引线 801 [2], 纵向引出左列 引线 801 [3]和右列引线 801 [4]。 引线的末端位于引线延长区 800。 左列 引线 801 [3 ]与芯片管脚邦定后， 其末端超过芯片管脚后与竖直方向呈 75 。 向右侧延伸； 右列引线 801 [4]与芯片管脚邦定后， 其末端超过芯片管脚 后与竖直方向呈 75。 向左侧延伸； 奇数行引线 801 [ 1 ]与芯片管脚邦定后， 其末端超过芯片管脚后与竖直方向呈 75。 向左侧延伸； 偶数行引线 801 [2] 与芯片管脚邦定后， 其末端超过芯片管脚后与竖直方向呈 75。 向右侧延伸。 引线在引线延长区的长度为 0.2mm。 奇数行引线 801 [ 1 ]、 偶数行引线 801 [2]左列引线 801 [3 ]、 右列引线 801 [4] 互不相交。
制备本实施例所述有机电致发光器件的引线的工艺步骤、 测试工序与实 施例 2相同， 在此不再赘述。
实施例 2、 3、 4与实施例 1的光刻工艺步骤相同， 不过， 因为引线的图 形不同， 所以光刻时使用的掩模板不同。
根据实施例 1至实施例 4所述的引线结构， 本发明釆用新的掩模板， 光 刻出的引线的图形与现有技术不同， 分别将行列弓 )线相互背离或相对延伸。 本发明的引线设计增大了行引线与列引线的间距， 防止在屏体测试阶段将行 列引线短路。行列引线进行了一定角度的倾斜，与导电胶条的接触面积增大， 单位面积的导电介质分担的电流负载减小， 从而提高了导电胶条的寿命。
釆用本发明实施例 1至实施例 4的引线结构及测试方法， 发明人用目前 的测试、 老炼工装成功对 COG产品进行了测试与老炼， 保证了高成品率。 另外， 因引线的末端位于引线延长区， 即不在引线的末端进行邦定。 这 样一来， 即使刻蚀引线时出现过刻蚀的现象， 引线末端并没有被用到， 从而 保证了引线与芯片管脚的良好接触， 而且这种引线结构不增加工艺步骤。 虽然本发明已以较佳实施例揭露如上， 然而其并非用以限定本发明， 任 何熟悉此技术人士， 在不脱离本发明的精神和范围内， 当可作各种的更动与 润饰， 因此， 本发明的保护范围当以申请的专利范围所界定为准。

Claims

权利要求书
1. 一种有机电致发光器件， 包括发光区、 引线区、 邦定区，
发光区包括阳极、 有机功能层、 阴极；
引线区由使阳极和阴极与驱动芯片或电路板连接的引线构成；
邦定区为引线与驱动芯片或电路板连接的区域；
还包括引线延长区， 所述引线的末端位于引线延长区；
其特征在于， 引线延长区的引线与引线区的引线形成的角度大于 0° 且 小于 90° 。
2. 根据权利要求 1所述的有机电致发光器件， 其特征在于， 所述引线延 长区的引线与引线区的引线形成的角度大于 20。 且小于 80。 。
3. 根据权利要求 1所述的有机电致发光器件， 其特征在于， 所述引线延 长区的引线与引线区的引线形成的角度为 30° 、 45° 、 60° 或 75。 。
4. 根据权利要求 1~3任一所述的有机电致发光器件， 其特征在于， 所述 引线釆用单边邦定， 引线分别为奇数行引线、 偶数行引线、 左列引线、 右列 引线， 列引线位于中部， 奇数行引线及偶数行引线分居列引线的两侧。
5. 根据权利要求 4所述的有机电致发光器件， 其特征在于， 所述引线延 长区的左列引线 (401 [3])和右列引线 (401 [4])朝相互背离的方向延伸， 且 不相交。
6. 根据权利要求 5所述的有机电致发光器件， 其特征在于， 所述引线延 长区的奇数行引线（401[1])和偶数行引线（401[2])朝相对的方向延伸， 且 所述的左列引线（401[3])、 右列引线（401[4])、 奇数行引线（401[1])、 偶数 行引线（401 [2])都不相交。
7. 根据权利要求 5所述的有机电致发光器件， 其特征在于， 所述引线延 长区的奇数行引线（501[1])和偶数行引线（501[2])朝互背离的方向延伸， 且所述的左列引线（501[3])、 右列引线（501[4])、 奇数行引线（501[1])、 偶 数行引线（501[2])都不相交。
8. 根据权利要求 4所述的有机电致发光器件， 其特征在于， 所述引线延 长区的左列引线（701[3])和右列引线（701[4])朝相对的方向延伸， 且不相 交。
9. 根据权利要求 8所述的有机电致发光器件， 其特征在于， 所述引线延 长区的奇数行引线（701[1])和偶数行引线（701[2])朝相对的方向延伸， 且 所述的左列引线（701[3])、 右列引线（701[4])、 奇数行引线（701[1])、 偶数 行引线（701 [2])都不相交。
10. 根据权利要求 8所述的有机电致发光器件， 其特征在于， 所述引线 延长区的奇数行引线（801[1])和偶数行引线（801[2])朝相互背离的方向延 伸， 且所述的左列引线（801 [3])、右列引线（801 [4])、 奇数行引线（801 [1])、 偶数行引线（801[2])都不相交。
11. 根据权利要求 1~3任一所述的有机电致发光器件， 其特征在于， 所 述引线延长区的引线少于引线区的引线。
12. 根据权利要求 1~3任一所述的有机电致发光器件， 其特征在于， 所 述引线延长区的引线长度为 0.1mm~0.5mm。
13. 一种用于根据权利要求 1至 12任一项所述有机电致发光显示器件的 测试方法， 其特征在于， 该测试方法包括步骤：
a)将待点亮行引线短路， 将待点亮列引线短路；
b)使步骤 a)短路的行或列引线得到点亮电压；
c)根据测试情况给出测试结果。
14. 根据权利要求 13所述的有机电致发光显示器件测试方法，其特征在 于， 所述步骤 a)将所有奇数行引线短路， 将所有偶数行引线短路， 将所有 列引线短路。
15. 根据权利要求 13所述的有机电致发光显示器件测试方法，其特征在 于， 所述步骤 a)将所有行引线短路， 将所有列引线短路。
16. 根据权利要求 13至 15任一所述的有机电致发光显示器件测试方法， 其特征在于， 所述步骤 a)釆用导电材料连接需短路的引线。
17. 根据权利要求 16所述的有机电致发光显示器件测试方法，其特征在 于， 所述导电材料为金属薄膜或导电胶条。
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