WO2010116636A1 - 電子部品実装システムおよび電子部品実装方法 - Google Patents
電子部品実装システムおよび電子部品実装方法 Download PDFInfo
- Publication number
- WO2010116636A1 WO2010116636A1 PCT/JP2010/002085 JP2010002085W WO2010116636A1 WO 2010116636 A1 WO2010116636 A1 WO 2010116636A1 JP 2010002085 W JP2010002085 W JP 2010002085W WO 2010116636 A1 WO2010116636 A1 WO 2010116636A1
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- substrate
- electronic component
- mounting
- bonding material
- solder
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Definitions
- the present invention is configured by connecting a plurality of electronic component mounting apparatuses in series.
- the electronic component is mounted on the first substrate, and the first substrate and the second substrate on which the electronic component is previously mounted are provided.
- the present invention relates to an electronic component mounting system to be connected and an electronic component mounting method using the electronic component mounting system.
- a configuration in which individual functional modules such as CCD cameras and display panels are connected to a main electronic circuit module provided on a rigid substrate via a film-like flexible substrate Is generally used.
- a method of connecting the terminal provided on the flexible substrate to the circuit electrode of the rigid substrate a method of conducting the terminal and the circuit electrode using an anisotropic conductive adhesive containing conductive particles in a thermosetting resin (for example, see Patent Document 1).
- solder particles are used as conductive particles, and the flexible substrate and the rigid substrate are bonded together by a thermosetting resin, and the terminals of the flexible substrate are soldered to the circuit substrate of the rigid substrate to electrically conduct. I try to let them.
- the conventional techniques including the above-mentioned patent document examples have the following problems due to the process configuration. That is, in the prior art, the component mounting process for mounting the electronic component on the rigid board and the board connecting process for connecting the flexible board to the rigid board on which the component mounting has been completed are individually performed as separate processes. For this reason, it is necessary to further provide equipment for stocking rigid boards after component mounting as a plurality of mounting lines and intermediate products and transporting them to the mounting line for connecting the boards, resulting in an increase in equipment occupation space and equipment costs. It was. In addition, the rigid board after the reflow is completed in the component mounting process is stocked before being sent to the board connection process, and moisture absorption of the rigid board occurs during this stock time. For this reason, in the board
- an object of the present invention is to provide an electronic component mounting system and an electronic component mounting method capable of reducing equipment occupation space and equipment cost and ensuring high connection reliability.
- the electronic component mounting system is configured by connecting a plurality of electronic component mounting devices in series, mounting the electronic component on the first substrate, and connecting the first substrate and the second substrate.
- the plurality of electronic component mounting devices include a solder printing device that prints a solder bonding paste on the first substrate, and the first printed after the paste is printed.
- said electronic component and said second base By heating the first substrate on which the electronic component is mounted, the electronic component is solder-bonded to the first substrate, and the second connection portion and the first connection portion are bonded by the bonding material.
- a reflow device By heating the first substrate on which the electronic component is mounted, the electronic component is solder-bonded to the first substrate
- the electronic component mounting system of the present invention is configured by connecting a plurality of electronic component mounting devices in series, mounting the electronic component on the first substrate, and combining the first substrate and the second substrate.
- the plurality of electronic component mounting devices include a solder printing device that prints a solder bonding paste on the first substrate, and the first after the paste is printed.
- a bonding material supply device for supplying a bonding material in which solder particles are contained in a thermosetting resin to a first connection portion provided on the first substrate, and after the paste is printed
- a component mounting apparatus for mounting the electronic component on the first substrate, and mounting the second substrate on the first substrate, wherein the second connection portion provided on the second substrate is The first connecting portion via a solder bonding material And heating the first substrate on which the electronic component and the second substrate are mounted, thereby soldering the electronic component to the first substrate and the second substrate.
- a reflow device for joining the first connection part with the joining material.
- the electronic component mounting system of the present invention is configured by connecting a plurality of electronic component mounting devices in series, mounting the electronic component on the first substrate, and combining the first substrate and the second substrate.
- the plurality of electronic component mounting devices include a solder printing device that prints a paste for solder bonding on the first substrate, and a first provided on the first substrate.
- a bonding material supply device for supplying a bonding material in which solder particles are contained in a thermosetting resin, and the electronic component on the first substrate on which the paste is printed and the bonding material is supplied. And mounting the second substrate on the first substrate and landing the second connection portion provided on the second substrate on the first connection portion via the bonding material.
- Device, said electronic component and By heating the first substrate on which the second substrate is mounted, the electronic component is soldered to the first substrate, and the second connection portion and the first connection portion are connected.
- a reflow device for joining with the joining material.
- An electronic component mounting method of the present invention is an electronic component mounting method for mounting an electronic component on a first substrate and connecting the first substrate and a second substrate, and soldering the first substrate to the first substrate.
- the electronic component mounting method of the present invention is an electronic component mounting method for mounting an electronic component on a first substrate and connecting the first substrate to a second substrate, the electronic component mounting method being performed on the first substrate.
- a solder printing process for printing a paste for solder joining, and a joining material in which solder particles are contained in a thermosetting resin at a first connection site provided on the first substrate after the paste is printed
- a bonding material supply step for supplying the electronic component, a component mounting step for mounting the electronic component on the first substrate after the bonding material is supplied, and mounting the second substrate on the first substrate.
- an electronic component mounting method is an electronic component mounting method for mounting an electronic component on a first substrate and connecting the first substrate and a second substrate, wherein the electronic substrate is mounted on the first substrate.
- a solder printing process for printing a solder bonding paste, and a bonding in which solder particles are contained in a thermosetting resin in a first connection portion provided on the first substrate after the paste is printed A bonding material supply step of supplying a material; and mounting the electronic component on the first substrate on which the soldering paste is printed and the bonding material is supplied, and the second substrate is mounted on the first substrate.
- a solder bonding paste is printed on the first substrate.
- the electronic component is mounted on the second substrate by supplying a bonding material in which solder particles are contained in a thermosetting resin to the first connection portion provided on the first substrate.
- the connecting portion is landed on the first connecting portion provided on the first substrate via the bonding material, and then the first substrate on which the electronic component and the second substrate are mounted is heated in the same reflow process.
- the fragmentary sectional view of the solder printer which constitutes the electronic component mounting system of Embodiment 1 of the present invention The fragmentary sectional view of the application
- the fragmentary sectional view of the component mounting apparatus which comprises the electronic component mounting system of Embodiment 1 of this invention 1 is a partial cross-sectional view of a bonding material supply / board mounting apparatus that constitutes the electronic component mounting system according to the first embodiment of the present invention.
- (A) And (b) is process explanatory drawing of the electronic component mounting method by the electronic component mounting system of Embodiment 1 of this invention.
- (A) And (b) is process explanatory drawing of the electronic component mounting method by the electronic component mounting system of Embodiment 1 of this invention.
- Process explanatory drawing of the electronic component mounting method by the electronic component mounting system of Embodiment 1 of this invention (A) And (b) is process explanatory drawing of the electronic component mounting method by the electronic component mounting system of Embodiment 1 of this invention.
- Process explanatory drawing of the electronic component mounting method by the electronic component mounting system of Embodiment 1 of this invention The figure which shows the heating profile of the reflow process in the electronic component mounting system of Embodiment 1 of this invention.
- FIG. 1 is a plan view showing the configuration of an electronic component mounting system according to Embodiment 1 of the present invention
- FIG. 2 is an explanatory diagram of a substrate to be mounted in the electronic component mounting system according to Embodiment 1 of the present invention
- FIG. 4 is a partial cross-sectional view of a solder printing apparatus that constitutes the electronic component mounting system according to the first embodiment of the present invention.
- FIG. 4 is a partial cross-sectional view of the coating / inspection apparatus that constitutes the electronic component mounting system according to the first embodiment of the present invention.
- FIG. 5 is a partial cross-sectional view of the component mounting apparatus constituting the electronic component mounting system according to the first embodiment of the present invention
- FIG. 6 is a bonding material supply / board mounting configuring the electronic component mounting system according to the first embodiment of the present invention.
- 7, 8, 9, 10, and 11 are process explanatory views of an electronic component mounting method by the electronic component mounting system according to the first embodiment of the present invention
- FIG. 12 is an implementation of the present invention.
- FIG. 13 is an explanatory view of a substrate support method in an electronic component mounting method of the embodiment 1 of the present invention.
- the electronic component mounting system 1 includes a plurality of electronic component mounting devices, a solder printing device M1, a coating / inspection device M2, a component mounting device M3, a bonding material supply / board mounting device M4, and a reflow device M5 connected in series. It is configured.
- Each device includes a substrate transport mechanism 3 disposed in the X direction (substrate transport direction) at the center of the base 2.
- the substrate transport mechanism 3 of each device is connected to the substrate transport mechanism 3 of an adjacent device.
- a board transfer path that is connected in series and passes through the electronic component mounting system 1 is configured.
- the main board 4 to be mounted with electronic components is carried into the board transfer mechanism 3 of the solder printing apparatus M1 from the upstream side (left side in FIG. 1) (see arrow a), and sequentially passes through the electronic component mounting system 1 in the X direction. Be transported.
- FIG. 2A shows the main board 4 (first board) on which electronic components are mounted, and the module board 5 (second board) shown in FIG. 2B is connected to the main board 4. Is done.
- the main board 4 and the module board 5 constitute an electronic circuit of a small terminal device such as a mobile phone, and are mounted in the housing with the module board 5 connected to the main board 4.
- the main board 4 is made of glass epoxy resin or the like, and as shown in FIG. 2A, the mounting surface 4a of the main board 4 is positioned at one edge to connect the module board 5 to the mounting surface 4a.
- a plurality of connection terminals 4b (first connection sites) are formed.
- Electrodes 4c, 4d, and 4e to which terminals of electronic components are connected are formed at the center of the mounting surface 4a.
- the electrodes 4c, 4d, and 4e are solder-bonded to the terminals 8a formed at the ends of the chip-type component 8 and the bumps 9a formed on the lower surfaces of the bumped components 9A and 9B, respectively (see FIGS. 8 and 9). ).
- the module substrate 5 has a configuration in which a flexible substrate 5c is connected in advance to a sub-substrate 5a on which electronic components 5b for drivers are mounted in advance.
- a flexible terminal 5e (second connection portion) connected to the connection terminal 4b of the main substrate 4 is formed on the lower surface side of the connection end 5d of the flexible substrate 5c.
- the solder printing apparatus M1 has a function of printing cream solder, which is a paste for solder bonding, on the main board 4.
- the substrate transport mechanism 3 is provided with a substrate receiving portion 18 that can be moved up and down, and a mask plate 16 extended on a mask frame 15 is disposed above the substrate transport mechanism 3. Yes.
- the main substrate 4 transported from the upstream side by the substrate transport mechanism 3 is supported on the lower surface side by the substrate lower receiving portion 18 and further abutted on the lower surface side of the mask plate 16 while being clamped from both sides by the clamp member 17. .
- a Y-axis table 11 is arranged in the Y direction at the end of the base 2 in the X direction, and the X-axis beam 12 mounted on the Y-axis table 11 by driving the Y-axis table 11 is in the Y direction.
- a squeegee unit 13 having a squeegee member 14 at the lower end is mounted on the X-axis beam 12. By driving the squeegee unit 13, the squeegee member 14 moves up and down. Abuts the top surface. The cream solder 6 is supplied onto the mask plate 16 and the squeegee member 14 is lowered.
- the Y-axis table 11 is driven to move the squeegee unit 13 in the Y direction (arrow b).
- the solder paste 6 is printed on the electrodes 4c, 4d, and 4e provided on the mask plate 16 through pattern holes (not shown) provided on the mask plate 16 corresponding to the electrodes 4c, 4d, and 4e (see FIG. 7). ).
- the application / inspection apparatus M2 has a function of inspecting the printing state of the cream solder 6 printed on the main board 4 by the solder printing apparatus M1 and applying an adhesive 7 for temporarily fixing components to the main board 4. .
- the substrate transport mechanism 3 is provided with substrate support pins 19 that can be moved up and down.
- the main substrate 4 transported from the upstream side by the substrate transport mechanism 3 is lower side by the substrate support pins 19. Is undertaken.
- an adhesive application unit 20 is provided so as to be movable in the X direction by the first X-axis table 12A, and an inspection unit 22 is provided so as to be movable in the X direction by the second X-axis table 12B.
- a dispenser 21 having an application nozzle 21a at the lower end is mounted on the adhesive application unit 20 so as to be movable up and down.
- the adhesive 7 is discharged from the application nozzle 21 a by operating the discharge mechanism built in the dispenser 21.
- the inspection unit 22 has a function of imaging the main board 4 positioned below, and the imaging result is subjected to recognition processing by a recognition processing unit (not shown), whereby the cream solder 6 printed on the main board 4 is processed.
- the printing state and the application state of the adhesive 7 are inspected.
- a Y-axis table 11 is disposed in the Y direction at the end of the base 2 in the X direction, and the first X-axis table 12A and the second X-axis table 12B can freely move in the Y direction on the Y-axis table 11, respectively. It is installed individually.
- the first X-axis table 12A and the second X-axis table 12B reciprocate individually in the Y direction.
- the adhesive application unit 20 and the inspection unit 22 are each X with respect to the main substrate 4 positioned below. Move in the direction, Y direction.
- the adhesive application unit 20 applies the adhesive 7 to an arbitrary point of the main substrate 4, and the adhesive application unit 20 inspects the printing state of the cream solder 6 printed at an arbitrary position of the main substrate 4.
- the application / inspection apparatus M2 is an inspection for inspecting the printing state of the cream solder 6 printed on the main substrate 4 and the application state of the adhesive 7 and the application device M2A for applying the adhesive 7 to the main substrate 4.
- the device M2B is incorporated in a single device.
- the component mounting apparatus M3 has a function of mounting electronic components on the main board 4 after the cream solder 6 is printed.
- the substrate transport mechanism 3 is provided with substrate support pins 19 that can be moved up and down, and the main substrate 4 transported from the upstream side by the substrate transport mechanism 3 is lower side by the substrate support pins 19. Is undertaken.
- a first component supply unit 25A and a second component supply unit 25B are disposed on both sides of the substrate transport mechanism 3, respectively.
- a plurality of tape feeders 26 are arranged in parallel in the first component supply unit 25A.
- the tape feeder 26 pitches a carrier tape containing a relatively small electronic component such as the chip-type component 8 by a built-in tape feeding mechanism, so that the first feeder head 23A, which will be described below, picks up a component. Supply these electronic components.
- a component tray 27 for storing relatively large components such as bumped components 9A and 9B having bumps formed on the lower surface in a predetermined regular arrangement is disposed.
- the second mounting head 23 ⁇ / b> B described below accesses the component storage position of the component tray 27, these electronic components are taken out from the component tray 27.
- a Y-axis table 11 is disposed in the Y direction at the end of the base 2 in the X direction, and the first X-axis table 12A and the second X-axis table 12B can freely move in the Y direction on the Y-axis table 11, respectively. It is installed individually.
- the first X-axis table 12A and the second X-axis table 12B are mounted with a first mounting head 23A and a second mounting head 23B each having a first suction nozzle 24A and a second suction nozzle 24B at their lower end portions.
- the first mounting head 23A sucks and holds the chip-type component 8 by the first suction nozzle 24A
- the second mounting head 23B sucks and holds the bumped component 9A and the bumped component 9B by the second suction nozzle 24B.
- the first X-axis table 12A and the second X-axis table 12B reciprocate individually in the Y direction.
- the first mounting head 23A and the second mounting head 23B have the first component supply unit 25A and the second component respectively. It freely moves between the component supply unit 25B and the main substrate 4 positioned by the substrate transport mechanism 3.
- the first mounting head 23A mounts the chip-type component 8 taken out from the tape feeder 26 of the first component supply unit 25A at an arbitrary mounting position of the main substrate 4 (arrow c), and the second suction nozzle 24B
- the bumped components 9A and 9B taken out from the component tray 27 of the second component supply unit 25B are mounted at an arbitrary mounting position on the main board 4 (arrow d).
- the bonding material supply / substrate mounting apparatus M4 In order to connect the module substrate 5 to the main substrate 4, the bonding material supply / substrate mounting apparatus M4 contains solder particles in a thermosetting resin in a predetermined range on the plurality of connection terminals 4b provided on the main substrate 4. A function of supplying the bonded bonding material 10, and a function of mounting the module substrate 5 on the main substrate 4 and landing the connection end 5 d of the module substrate 5 on the connection terminal 4 b via the bonding material 10. .
- the bonding material supply / substrate mounting apparatus M4 includes a single bonding material supply apparatus M4A for supplying the bonding material 10 to the main substrate 4 and a substrate mounting apparatus M4B for mounting the module substrate 5 on the main substrate 4.
- the configuration is built into the device.
- a Y-axis table 11 is disposed in the Y direction at the end of the base 2 in the X direction, and the first X axis table 12A and the second X axis table 12B are movable in the Y direction on the Y axis table 11, respectively. It is installed individually. As shown in FIG. 6, above the substrate transport mechanism 3, the bonding material application unit 30 is movable in the X direction by the first X axis table 12A, and the mounting head 32 is moved in the X direction by the second X axis table 12B. It is provided freely.
- a dispenser 31 having a coating nozzle 31a at the lower end is mounted on the bonding material coating unit 30 so as to be movable up and down.
- the bonding material 10 When the dispenser 31 is lowered and the dispensing nozzle 31a is brought close to the upper surface of the main substrate 4 and the ejection mechanism built in the dispenser 31 is operated, the bonding material 10 is ejected from the coating nozzle 31a. It is applied to the substrate 4.
- the bonding material 10 contains solder particles in a thermosetting resin such as an epoxy resin, and further contains an active ingredient having an action of removing an oxide film formed on the surfaces of the solder particles and the connection terminals 4b to be bonded. It has a composition.
- the mounting head 32 includes a suction tool 33 having a special shape at the lower end, and the suction tool 33 can hold the module substrate 5 shown in FIG. 2B by two suction parts 33a and 33b. (See FIG. 10B).
- the mounting head 32 accesses the substrate supply unit 34, the module substrate 5 can be taken out by the suction tool 33.
- FIG. 6 for convenience of illustration, the posture in which the module substrate 5 is held by the suction tool 33 is illustrated as being rotated 90 degrees around the vertical axis from the actual holding posture.
- the first X-axis table 12A and the second X-axis table 12B reciprocate individually in the Y direction.
- the bonding material application unit 30 and the mounting head 32 are respectively positioned with respect to the main substrate 4 positioned below. Move in the X and Y directions.
- the bonding material application unit 30 supplies the bonding material 10 to the mounting surface 4a formed on the edge of the main substrate 4 by application.
- the mounting head 32 can land the connection end 5d of the module substrate 5 taken out from the substrate storage tray 35 of the substrate supply unit 34 on the connection terminal 4b of the main substrate 4 via the bonding material 10 (arrow). e).
- a method of supplying the bonding material 10 onto the connection terminals 4 b a method of applying the bonding material 10 by the bonding material application unit 30 is used. You may employ
- the reflow apparatus M5 will be described with reference to FIG.
- electronic components such as chip-type components 8 and bumped components 9A and 9B are mounted, and further, the main substrate 4 on which the module substrate 5 is mounted is heated, so that these electronic components are applied to the main substrate 4.
- the flexible substrate 5 e of the module substrate 5 and the connection terminal 4 b of the main substrate 4 are bonded by the bonding material 10.
- a heating furnace 28 provided with a heater is disposed on the main substrate 4, and the substrate transport mechanism 3 is vertically provided in the X direction in the heating furnace 28.
- the heating furnace 28 includes a temperature adjusting mechanism, and the main board 4 after mounting the components carried into the heating furnace 28 is heated according to a predetermined temperature profile in the process of being transferred downstream by the board transfer mechanism 3. Is done.
- the cream solder 6 supplied to the electrodes 4c, 4d, 4e of the main substrate 4 is melted and solidified, and the terminals 8a of the chip-type component 8 and the bumps 9a of the bumped components 9A, 9B are respectively connected to the electrodes 4c, 4d, Soldered to 4e.
- the bonding material 10 is heated, the flexible terminal 5e of the module substrate 5 and the connection terminal 4b of the main substrate 4 are electrically connected by the solder component in the bonding material 10, and the bonding material 10 is further configured.
- the thermosetting resin to be cured is thermally cured, and the connection end 5 d is fixed to the mounting surface 4 a of the main substrate 4.
- the electronic component mounting system 1 having the above-described configuration is configured by connecting a plurality of electronic component mounting apparatuses in series.
- the electronic component mounting system 1 mounts an electronic component on a main substrate 4 which is a first substrate, and the main substrate 4 and the second substrate.
- a plurality of electronic component mounting apparatuses constituting the electronic component mounting system 1 include a solder printing device M1 for printing cream solder 6 for solder bonding on the main substrate 4, and a main substrate after the cream solder 6 is printed.
- the electronic component is soldered to the main substrate 4, and the flexible terminal 5e and the connection end It has a configuration comprising a reflow device M5 for joining the 4b by the bonding material 10.
- FIG. 7A shows the main board 4 carried into the board transport mechanism 3 of the solder printing apparatus M1.
- the mounting surface 4a of the main substrate 4 is formed with a plurality of connection terminals 4b for connecting the module substrate 5 located on one edge, and an electronic component is formed at the center of the mounting surface 4a. Electrodes 4c, 4d, and 4e to which these terminals are connected are formed.
- the main board 4 is carried into the solder printing apparatus M1, and the solder solder cream solder 6 is printed on the main board 4 here (solder printing process).
- cream solder 6 is supplied to the upper surfaces of the electrodes 4c, 4d, and 4e with a predetermined thickness.
- the main board 4 after the solder printing is carried into the application / inspection apparatus M2, and the adhesive 7 is applied by the adhesive application unit 20 here. That is, as shown in FIG. 8A, the dispenser 21 is lowered with respect to the main substrate 4, and the adhesive 7 for temporarily fixing the component is applied to a plurality of application points set in advance for each component mounting position. Apply sequentially.
- the inspection of the solder printed state is performed by imaging the main board 4 by the inspection unit 22.
- the main board 4 is carried into the component mounting apparatus M3, and the component mounting for mounting electronic components by the first mounting head 23A and the second mounting head 23B on the main board 4 after the cream solder 6 is printed here.
- Work is executed (part mounting process). That is, as shown in FIG. 8B, the terminal 8a of the chip-type component 8 is lowered with respect to the electrode 4c and landed (arrow f), and the bump 9a of the bumped component 9A is lowered with respect to the electrode 4d.
- the bump 9a of the bumped component 9B is lowered with respect to the electrode 4e and landed (arrow h).
- the bonding material supply apparatus M4A applies the connection terminal 4b, which is the first connection portion of the main board 4 to the module board 5. Then, a bonding material 10 in which solder particles are contained in a thermosetting resin is supplied (bonding material supply step). That is, as shown in FIG. 9, the bonding material 10 is applied to a predetermined range on the connection terminals 4 b of the main board 4 that has been loaded. Here, the bonding material 10 is applied onto the connection terminal 4b by lowering the dispenser 31 above the connection terminal 4b and moving the dispenser 31 in the Y direction while discharging the bonding material 10 from the application nozzle 31a.
- the module substrate 5 is mounted on the main substrate 4 by the substrate mounting apparatus M4B, and the flexible terminals 5e provided on the module substrate 5 are landed on the connection terminals 4b via the bonding material 10 (substrate mounting step).
- a holding jig 38 for supporting the sub board 5 a of the module board 5 from below is placed at a position adjacent to the main board 4 in the board transport mechanism 3. .
- the module substrate 5 is taken out from the substrate supply unit 34 by the suction tool 33, and alignment for connection with the main substrate 4 is performed as shown in FIG.
- the suction tool 33 includes two branched suction portions 33a and 33b, and the electronic component 5b mounted on the sub-board 5a is sucked and held by the suction portion 33a and extended from the sub-board 5a.
- the connection end 5d of 5c is sucked and held by the suction portion 33b. Accordingly, the module substrate 5 having a complicated shape and difficult to be stably held by a normal method can be held in a correct posture.
- the sub board 5a sucked and held by the sucking part 33a is placed on the holding jig 38, and the connection end part 5d sucked and held by the sucking part 33b is joined.
- the material 10 is landed on the connection terminal 4b.
- the flexible terminal 5e (FIG. 2) formed in the lower surface of the connection end part 5d will be in the state adjoined to the surface of the connection terminal 4b.
- the suction tool 33 having a heating function the solder component in the bonding material 10 can be heated to improve the wettability with respect to the connection terminal 4b and the flexible terminal 5e.
- the main board 4 after the electronic components and the module board 5 are mounted is carried into the reflow apparatus M5. Then, as shown in FIG. 11, by heating the main substrate 4 on which the electronic components such as the chip-type component 8 and the bumped components 9A and 9B and the module substrate 5 are mounted, these electronic components are soldered to the main substrate 4. While joining, the flexible terminal 5e of the module board
- the bonding material 10 when the bonding material 10 is heated, the solder component contained in the bonding material 10 is melted to connect the connection terminal 4b and the flexible terminal 5e, and the thermosetting resin constituting the bonding material 10 is used. Is thermally cured to fix the connection end 5d to the mounting surface 4a of the main substrate 4. Thereby, the flexible terminal 5e and the connection terminal 4b are joined by the joining material 10. At this time, the oxide film generated on the surface of the solder particles, the connection terminals 4b to be joined, and the like is removed by the action of the active component blended in the joining material 10, and good solderability is ensured.
- FIG. 12 shows an example of a desirable temperature profile in the reflow process.
- the temperatures of the main board 4 and the module board 5 are set to the preset preheating temperature T1. (120 ° C. to 160 ° C.).
- T1 the preset preheating temperature
- the main substrate 4 is dehumidified and moisture that adversely affects the connection quality is removed, and the active action of the active component blended in the bonding material 10 is expressed, and solder particles and bonding Removal of the oxide film on the surface of the target connection terminal 4b or the like is promoted.
- the temperatures of the main substrate 4 and the module substrate 5 are set to the preset main heating temperature T2 (230 ° C. to 260 ° C.). Retained.
- T2 main heating temperature
- the solder components in the cream solder 6 and the bonding material 10 are melted, and solder bonding for bonding the electronic component to each electrode of the main substrate 4 or solder for connecting the connection terminal 4b and the flexible terminal 5e. Joining is performed.
- the thermosetting reaction of the thermosetting resin in the bonding material 10 proceeds, and the fixing of the connection end 5d to the main substrate 4 is completed.
- a sub-board of the module board 5 is used as a supporting method for carrying the main board 4 and the module board 5 after being integrally connected by the board carrying mechanism 3.
- the example using the holding jig 38 for holding 5a separately from the main substrate 4 from below is shown, various methods are used as a configuration for supporting the main substrate 4 and the module substrate 5 integrally. be able to.
- a substrate carrier 39 that integrally accommodates and holds the main substrate 4 and the module substrate 5 is used. That is, the substantially rectangular block-shaped substrate carrier 39 is provided with recesses 39a and 39b each having a shape in which the main substrate 4 and the module substrate 5 are fitted from above.
- the connection end 5d of the module board 5 is correctly positioned on the connection terminal 4b of the main board 4.
- FIG. 13B shows an example in which the main substrate 4 is transferred by the substrate transfer mechanism 3 in a state where the module substrate 5 is superimposed on the upper surface of the main substrate 4. That is, the module substrate 5 is held by a mounting jig 40 having a substantially gate-shaped cross section that can be mounted on the main substrate 4 so as to cover the upper surfaces of the bumped component 9A and the chip-type component 8 mounted on the main substrate 4. It is used as a jig.
- the module substrate 5 is mounted on the main substrate 4 with the sub substrate 5a positioned on the upper surface of the mounting jig 40 mounted on the upper surface of the main substrate 4 so as to cover these electronic components.
- the mounting jig 40 is removed after the connection between the connection terminal 4b and the connection end 5d is completed.
- FIG. 14 is a plan view showing the configuration of the electronic component mounting system according to the second embodiment of the present invention
- FIG. 15 is a portion of the adhesive application / bonding material supply device that constitutes the electronic component mounting system according to the second embodiment of the present invention.
- Cross-sectional view, FIG. 16 is a partial cross-sectional view of an inspection / board mounting apparatus constituting the electronic component mounting system according to the second embodiment of the present invention
- FIGS. 17, 18, and 19 are electronic components according to the second embodiment of the present invention. It is process explanatory drawing of the electronic component mounting method by a mounting system.
- an electronic component mounting system 1A includes a solder printing apparatus M1, which is a plurality of electronic component mounting apparatuses, an adhesive application / bonding material supply apparatus M21, a component mounting apparatus M3, an inspection / board mounting apparatus M41, and a reflow apparatus M5.
- a solder printing apparatus M1 which is a plurality of electronic component mounting apparatuses
- an adhesive application / bonding material supply apparatus M21 a component mounting apparatus M3, an inspection / board mounting apparatus M41
- a reflow apparatus M5. are connected in series.
- Each device includes a substrate transport mechanism 3 disposed in the X direction (substrate transport direction) at the center of the base 2. The substrate transport mechanism 3 of each device is connected to the substrate transport mechanism 3 of an adjacent device.
- a board transfer path that is connected in series and passes through the electronic component mounting system 1A is configured.
- the main board 4 to be mounted with electronic components is carried into the board transfer mechanism 3 of the solder printing apparatus M1 from the upstream side (left side in FIG. 1; see arrow a), and sequentially in the X direction in the electronic component mounting system 1A. Be transported.
- the solder printing device M1, the component mounting device M3, and the reflow device M5 are the same as those in the electronic component mounting system 1 shown in the first embodiment.
- the adhesive application / bonding material supply device M21 is composed of an adhesive application device M21A, an adhesive material supply device M21A, and a bonding material supply device M21B having the same functions as the bonding material supply device M4A in the electronic component mounting system 1.
- the configuration is built into the device.
- a Y-axis table 11 is disposed in the Y direction at the end of the base 2 in the X direction, and the first X axis table 12A and the second X axis table 12B are movable in the Y direction on the Y axis table 11, respectively. It is installed individually.
- an adhesive application unit 20 is provided so as to be movable in the X direction by the first X-axis table 12A, and a bonding material application unit 30 is provided so as to be movable in the X direction by the second X-axis table 12B. Yes.
- a dispenser 21 having a coating nozzle 21a at the lower end is mounted on the adhesive application unit 20 so as to be movable up and down.
- a dispenser 31 having a coating nozzle 31a at its lower end is mounted on the bonding material coating unit 30 so as to be movable up and down.
- the discharge mechanism built in the dispenser 21 is operated, whereby the adhesive 7 for temporarily fixing the components is discharged from the application nozzle 21a. And applied to the main substrate 4.
- the dispenser 31 is lowered and the dispensing nozzle 31a is brought close to the upper surface of the main substrate 4 and the ejection mechanism built in the dispenser 31 is operated, the bonding material 10 is ejected from the coating nozzle 31a. It is applied to the substrate 4.
- the inspection / board mounting apparatus M41 has a configuration in which an inspection apparatus M41A for inspecting the main board 4 after component mounting and a board mounting apparatus M41B for mounting the module board 5 on the main board 4 are incorporated in a single apparatus. ing.
- the board mounting device M41B has the same configuration as the board mounting device M4B in the bonding material supply / board mounting device M4 of the electronic component mounting system 1 shown in the first embodiment.
- a Y-axis table 11 is disposed in the Y direction at the end of the base 2 in the X direction, and the first X axis table 12A and the second X axis table 12B are movable in the Y direction on the Y axis table 11, respectively. It is installed individually.
- An inspection unit 41 and a mounting head 32 are mounted on the first X-axis table 12A and the second X-axis table 12B so as to be movable in the X direction.
- the inspection unit 41 has a function of imaging the main board 4 located below, and the imaging result is subjected to recognition processing by a recognition processing unit (not shown), whereby the electronic components mounted on the main board 4 are mounted. A state check is performed.
- the substrate mounting apparatus M41B includes the same mounting head 32 as the substrate mounting apparatus M4B in the first embodiment, and the module head 5 is taken out by the suction tool 33 when the mounting head 32 accesses the substrate supply unit 34. Can do.
- FIG. 16 as in FIG. 6, for the convenience of illustration, the posture in which the module substrate 5 is held by the suction tool 33 is illustrated as being rotated 90 degrees around the vertical axis from the actual holding posture. .
- the electronic component mounting system 1A having the above-described configuration is configured by connecting a plurality of electronic component mounting devices in series, mounting electronic components on the main substrate 4 which is the first substrate, This is an electronic component mounting system for connecting a module substrate 5 as a second substrate.
- the plurality of electronic component mounting apparatuses constituting the electronic component mounting system 1A include a solder printing device M1 for printing cream solder 6 for solder bonding on the main substrate 4, and a main substrate after the cream solder 6 is printed.
- a bonding material supply device M21B for supplying a bonding material 10 containing solder particles in a thermosetting resin to a connection terminal 4b which is a first connection portion provided on the main board 4, and cream solder 6
- the component mounting apparatus M3 for mounting electronic components on the main board 4 after the printing is performed, and the module board 5 is mounted on the main board 4, and the flexible terminal 5e which is the second connection portion provided on the module board 5 Is heated on the main board 4 on which the electronic component and the module board 5 are mounted, and the board mounting device M41B that lands on the connection terminal 4b via the bonding material 10.
- soldered to the plate 4 has a configuration including a reflow device M5 joined by bonding material 10 and the flexible terminals 5e connection terminal 4b.
- the electronic component mounting system 1A having the above-described configuration mounts the electronic component on the main substrate 4 that is the first substrate, and also connects the main substrate 4 and the module substrate 5 that is the second substrate.
- a method will be described.
- the main board 4 is carried into the adhesive application / bonding material supply apparatus M21.
- the application of the adhesive 7 for temporary fixing of the component by the dispenser 21 of the adhesive application unit 20 and the supply of the bonding material 10 for the substrate bonding by the dispenser 31 of the bonding material application unit 30 to the main substrate 4 Is executed.
- component mounting and board mounting are sequentially performed. That is, the main substrate 4 to which the adhesive 7 is applied and the bonding material 10 is supplied is carried into the component mounting apparatus M3, and the chip-type component 8 and the bumped components 9A and 9B are mounted on the main substrate 4 (components). Mounting process). That is, as shown in FIG. 18A, the terminal 8a of the chip-type component 8 is lowered with respect to the electrode 4c (arrow j), and the bump 9a of the bumped component 9A is lowered with respect to the electrode 4d. Then, the bump 9a of the bumped component 9B is lowered with respect to the electrode 4e and landed (arrow l).
- the main board 4 is carried into the inspection / board mounting apparatus M41, and the module board 5 is mounted on the main board 4 by the board mounting apparatus M41B as shown in FIG. That is, the module substrate 5 is held by the suction tool 33 of the mounting head 32, and the sub-substrate 5 a is placed on the holding jig 38 previously placed on the substrate transport mechanism 3, and the flexible provided on the module substrate 5.
- the terminal 5e is landed on the connection terminal 4b through the bonding material 10 (substrate mounting process).
- the main substrate 4 to which the module substrate 5 is connected is carried into the reflow apparatus M5, and the electronic components such as the chip-type component 8 and the bumped components 9A and 9B and the module substrate 5 are loaded as in FIG. 11 of the first embodiment.
- these electronic components are soldered to the main board 4 and the flexible terminals 5 e of the module board 5 and the connection terminals 4 b of the main board 4 are bonded by the bonding material 10 ( Reflow process).
- the terminal 8a of the chip-type component 8 is soldered to the electrode 4c, and the bumps 9a of the bumped components 9A and 9B are soldered to the electrodes 4d and 4e, respectively.
- the bonding material 10 when the bonding material 10 is heated, the solder component contained in the bonding material 10 is melted to connect the connection terminal 4b and the flexible terminal 5e, and the thermosetting resin constituting the bonding material 10 is used. Is thermally cured to fix the connection end 5d to the mounting surface 4a of the main substrate 4. Thereby, the flexible terminal 5e and the connection terminal 4b are joined by the joining material 10.
- the component mounting apparatus M3 and the inspection / board mounting apparatus M41 are individually arranged in the electronic component mounting system 1A, and after the component mounting process is first executed by the component mounting apparatus M3, the inspection / board mounting apparatus M41 is performed.
- the board mounting process is executed by the board mounting apparatus M41B included in the above, but the functions of the component mounting apparatus M3 and the board mounting apparatus M41B may be integrated into a single apparatus as an equipment configuration.
- the mounting of the electronic parts on the main board 4 and the mounting of the module board 5 are the same by a single mounting device. It can be performed in the process.
- the electronic component mounting system 1A mounts the electronic component on the main substrate 4 on which the cream solder 6 is printed and the bonding material 10 is supplied, and the module substrate 5 is mounted on the main substrate 4.
- 5 includes a mounting device for landing the flexible terminal 5e provided on the connection terminal 4b via the bonding material 10.
- the main board after the application of the adhesive 7 for temporarily fixing components to the main board 4 and the supply of the bonding material 10 for board bonding shown in FIG. 4, the mounting of the electronic component and the mounting of the module substrate 5 are performed in the same mounting process. That is, the main board 4 is carried into a mounting apparatus in which the functions of the component mounting apparatus M3 and the board mounting apparatus M41B are combined, and the terminal 8a of the chip-type component 8 is lowered with respect to the electrode 4c and landed as shown in FIG.
- the electronic component is mounted on the main substrate 4 that is the first substrate, and the main substrate 4 and the second substrate.
- the cream solder 6 is printed on the main substrate 4 to mount the electronic component, and the connection terminal 4 b that is the first connection portion provided on the main substrate 4
- the bonding material 10 containing solder particles in a thermosetting resin is supplied, and the flexible terminal 5e, which is the second connection portion provided on the module substrate 5, is landed on the connection terminal 4b via the bonding material 10. .
- the main substrate 4 on which the electronic component and the main substrate 4 are mounted is heated in the same reflow process, and the electronic component is soldered to the main substrate 4 and the flexible terminal 5e and the connection terminal 4b are bonded by the bonding material 10. It is made to join.
- the main substrate 4 on which the electronic component and the module substrate 5 are mounted has been generated in the conventional method because the solder bonding of the electronic component and the bonding between the flexible terminal 5e and the connection terminal 4b are completed in the same reflow process. The following problems have been resolved.
- the electronic component mounting system and the electronic component mounting method of the present invention have an effect that high connection reliability can be ensured, and are configured by connecting a plurality of electronic component mounting devices in series. This is useful in an electronic component mounting system that mounts an electronic component on and connects the first board and the second board.
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Abstract
Description
図1は本発明の実施の形態1の電子部品実装システムの構成を示す平面図、図2は本発明の実施の形態1の電子部品実装システムの実装対象となる基板の説明図、図3は本発明の実施の形態1の電子部品実装システムを構成する半田印刷装置の部分断面図、図4は本発明の実施の形態1の電子部品実装システムを構成する塗布・検査装置の部分断面図、図5は本発明の実施の形態1の電子部品実装システムを構成する部品搭載装置の部分断面図、図6は本発明の実施の形態1の電子部品実装システムを構成する接合材料供給・基板搭載装置の部分断面図、図7、図8、図9、図10、図11は本発明の実施の形態1の電子部品実装システムによる電子部品実装方法の工程説明図、図12は本発明の実施の形態1の電子部品実装方法におけるリフロー過程の加熱プロファイルを示す図、図13は本発明の実施の形態1の電子部品実装方法における基板支持方法の説明図である。
図14は本発明の実施の形態2の電子部品実装システムの構成を示す平面図、図15は本発明の実施の形態2の電子部品実装システムを構成する接着剤塗布・接合材料供給装置の部分断面図、図16は本発明の実施の形態2の電子部品実装システムを構成する検査・基板搭載装置の部分断面図、図17、図18、図19は本発明の実施の形態2の電子部品実装システムによる電子部品実装方法の工程説明図である。
3 基板搬送機構
4 主基板(第1の基板)
4b 接続端子(第1の接続部位)
5 モジュール基板(第2の基板)
5a サブ基板
5c フレキシブル基板
5e フレキシブル端子(第2の接続部位)
6 クリーム半田(ペースト)
8 チップ型部品(電子部品)
9A,9B バンプ付き部品(電子部品)
10 接合材料
30 接合材塗布ユニット
32 搭載ヘッド
M1 半田印刷装置
M2 塗布・検査装置
M2A 接合材料供給装置
M3 部品搭載装置
M4 接合材料供給・基板搭載装置
M4A 接合材料供給装置
M4B 基板搭載装置
M5 リフロー装置
M21 接着剤塗布、接合材料供給装置
M21A 接着剤塗布装置
M21B 接合材料供給装置
M41 検査・基板搭載装置
M41B 基板搭載装置
Claims (6)
- 複数の電子部品実装用装置を直列に連結して構成され、第1の基板に電子部品を実装するとともに、前記第1の基板と第2の基板とを接続する電子部品実装システムであって、
前記複数の電子部品実装用装置は、前記第1の基板に半田接合用のペーストを印刷する半田印刷装置と、前記ペーストが印刷された後の前記第1の基板に前記電子部品を搭載する部品搭載装置と、前記第1の基板に設けられた第1の接続部位に、半田粒子を熱硬化性の樹脂に含有させた接合材料を供給する接合材料供給装置と、前記第1の基板に前記第2の基板を搭載して、この第2の基板に設けられた第2の接続部位を前記接合材料を介して前記第1の接続部位に着地させる基板搭載装置と、前記電子部品および前記第2の基板が搭載された前記第1の基板を加熱することにより、前記電子部品を前記第1の基板に半田接合するとともに、前記第2の接続部位と前記第1の接続部位とを前記接合材料によって接合するリフロー装置とを含むことを特徴とする電子部品実装システム。 - 複数の電子部品実装用装置を直列に連結して構成され、第1の基板に電子部品を実装するとともに、前記第1の基板と第2の基板とを接続する電子部品実装システムであって、
前記複数の電子部品実装用装置は、前記第1の基板に半田接合用のペーストを印刷する半田印刷装置と、前記ペーストが印刷された後の前記第1の基板において、前記第1の基板に設けられた第1の接続部位に、半田粒子を熱硬化性の樹脂に含有させた接合材料を供給する接合材料供給装置と、前記ペーストが印刷された後の前記第1の基板に前記電子部品を搭載する部品搭載装置と、前記第1の基板に前記第2の基板を搭載して、この第2の基板に設けられた第2の接続部位を前記半田接合材料を介して前記第1の接続部位に着地させる基板搭載装置と、前記電子部品および前記第2の基板が搭載された前記第1の基板を加熱することにより、前記電子部品を前記第1の基板に半田接合するとともに、前記第2の接続部位と前記第1の接続部位とを前記接合材料によって接合するリフロー装置とを含むことを特徴とする電子部品実装システム。 - 複数の電子部品実装用装置を直列に連結して構成され、第1の基板に電子部品を実装するとともに、前記第1の基板と第2の基板とを接続する電子部品実装システムであって、
前記複数の電子部品実装用装置は、前記第1の基板に半田接合用のペーストを印刷する半田印刷装置と、前記第1の基板に設けられた第1の接続部位に、半田粒子を熱硬化性の樹脂に含有させた接合材料を供給する接合材料供給装置と、前記ペーストが印刷され前記接合材料が供給された前記第1の基板に前記電子部品を搭載するとともに、前記第1の基板に前記第2の基板を搭載してこの第2の基板に設けられた第2の接続部位を前記接合材料を介して前記第1の接続部位に着地させる搭載装置と、前記電子部品および前記第2の基板が搭載された前記第1の基板を加熱することにより、前記電子部品を前記第1の基板に半田接合するとともに、前記第2の接続部位と前記第1の接続部位とを前記接合材料によって接合するリフロー装置とを含むことを特徴とする電子部品実装システム。 - 第1の基板に電子部品を実装するとともに、前記第1の基板と第2の基板とを接続する電子部品実装方法であって、
前記第1の基板に半田接合用のペーストを印刷する半田印刷工程と、前記ペーストが印刷された後の前記第1の基板に前記電子部品を搭載する部品搭載工程と、前記第1の基板に設けられた第1の接続部位に、半田粒子を熱硬化性の樹脂に含有させた接合材料を供給する接合材料供給工程と、前記第1の基板に前記第2の基板を搭載して、この第2の基板に設けられた第2の接続部位を前記接合材料を介して前記第1の接続部位に着地させる基板搭載工程と、前記電子部品および前記第2の基板が搭載された前記第1の基板を加熱することにより、前記電子部品を前記第1の基板に半田接合するとともに、前記第2の接続部位と前記第1の接続部位とを前記接合材料によって接合するリフロー工程とを含むことを特徴とする電子部品実装方法。 - 第1の基板に電子部品を実装するとともに、前記第1の基板と第2の基板とを接続する電子部品実装方法であって、
前記第1の基板に半田接合用のペーストを印刷する半田印刷工程と、前記ペーストが印刷された後に、前記第1の基板に設けられた第1の接続部位に半田粒子を熱硬化性の樹脂に含有させた接合材料を供給する接合材料供給工程と、前記接合材料が供給された後の前記第1の基板に前記電子部品を搭載する部品搭載工程と、前記第1の基板に前記第2の基板を搭載して、この第2の基板に設けられた第2の接続部位を前記半田接合材料を介して前記第1の接続部位に着地させる基板搭載工程と、前記電子部品および前記第2の基板が搭載された前記第1の基板を加熱することにより、前記電子部品を前記第1の基板に半田接合するとともに、前記第2の接続部位と前記第1の接続部位とを前記接合材料によって接合するリフロー工程とを含むことを特徴とする電子部品実装方法。 - 第1の基板に電子部品を実装するとともに、前記第1の基板と第2の基板とを接続する電子部品実装方法であって、
前記第1の基板に半田接合用のペーストを印刷する半田印刷工程と、前記ペーストが印刷された後に、前記第1の基板に設けられた第1の接続部位に、半田粒子を熱硬化性の樹脂に含有させた接合材料を供給する接合材料供給工程と、前記半田接合用のペーストが印刷され前記接合材料が供給された前記第1の基板に前記電子部品を搭載するとともに、前記第1の基板に前記第2の基板を搭載して、この第2の基板に設けられた第2の接続部位を前記接合材料を介して前記第1の接続部位に着地させる搭載工程と、前記電子部品および前記第2の基板が搭載された前記第1の基板を加熱することにより、前記電子部品を前記第1の基板に半田接合するとともに、前記第2の接続部位と前記第1の接続部位とを前記接合材料によって接合するリフロー工程とを含むことを特徴とする電子部品実装方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/255,986 US8434665B2 (en) | 2009-04-07 | 2010-03-24 | Electronic component mounting system and electronic component mounting method |
CN201080014962.2A CN102388687B (zh) | 2009-04-07 | 2010-03-24 | 电子元件安装系统和电子元件安装方法 |
DE112010001545T DE112010001545T5 (de) | 2009-04-07 | 2010-03-24 | Elektronikbauteil-Einbausystem und Elektronikbauteil-Einbauverfahren |
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JP2009092617A JP5099064B2 (ja) | 2009-04-07 | 2009-04-07 | 電子部品実装システムおよび電子部品実装方法 |
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JP (1) | JP5099064B2 (ja) |
KR (1) | KR20110137350A (ja) |
CN (1) | CN102388687B (ja) |
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- 2010-03-24 US US13/255,986 patent/US8434665B2/en active Active
- 2010-03-24 KR KR1020117023707A patent/KR20110137350A/ko not_active Application Discontinuation
- 2010-03-24 DE DE112010001545T patent/DE112010001545T5/de not_active Withdrawn
- 2010-03-24 WO PCT/JP2010/002085 patent/WO2010116636A1/ja active Application Filing
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Also Published As
Publication number | Publication date |
---|---|
KR20110137350A (ko) | 2011-12-22 |
US20120012645A1 (en) | 2012-01-19 |
DE112010001545T5 (de) | 2012-09-13 |
CN102388687A (zh) | 2012-03-21 |
JP5099064B2 (ja) | 2012-12-12 |
CN102388687B (zh) | 2015-03-11 |
JP2010245309A (ja) | 2010-10-28 |
US8434665B2 (en) | 2013-05-07 |
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