JP2008166488A - 電子部品の接続方法 - Google Patents
電子部品の接続方法 Download PDFInfo
- Publication number
- JP2008166488A JP2008166488A JP2006354301A JP2006354301A JP2008166488A JP 2008166488 A JP2008166488 A JP 2008166488A JP 2006354301 A JP2006354301 A JP 2006354301A JP 2006354301 A JP2006354301 A JP 2006354301A JP 2008166488 A JP2008166488 A JP 2008166488A
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- JP
- Japan
- Prior art keywords
- connection
- terminal group
- connection terminal
- electronic component
- preheating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/592—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connections to contact elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/111—Preheating, e.g. before soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
【解決手段】リジット基板1の接続領域3に形成された第1の接続端子群5と、第2の接続端子群6が形成されたフレキシブル基板2を熱硬化性樹脂を用いて導電可能に接続する際に、熱硬化性樹脂を熱硬化させる工程において加熱される接続領域3を予め局所的に予備加熱することでリジット基板1に吸湿された水分や油脂類のうち接続領域3に含まれるものを脱湿し、その後、第1の接続端子群5と第2の接続端子群6との間に介在させた熱硬化性樹脂を熱硬化させる。予備加熱は接続領域3に局所的に施すので、リジット基板1に既に実装された電子部品4に熱的影響を及ぼすことがなく、また短時間で脱湿を行うことができる。
【選択図】図1
Description
CP8の塗布が可能である。また熱硬化性接続材として異方性導電フィルム(ACF)を使用し、専用の装置を用いて接続領域3にACFを供給することもできる。ACPおよびACFは、接着、導電、絶縁という複数の機能を同時に有する異方性導電材料であり、熱圧着加工を施すことで、圧着面における厚み方向に対しては導通性、一方、その面方向に対しては絶縁性という電気的異方性を示す。
2 フレキシブル基板
3 接続領域
5 第1の接続端子列
6 第2の接続端子列
7 加熱ツール
8 異方性導電ペースト
Claims (4)
- 配線基板の接続領域に形成された第1の接続端子群と、前記第1の接続端子群に対応する第2の接続端子群が形成された電子部品とを導電可能に接続する電子部品の接続方法であって、
前記接続領域を局所的に予備加熱する工程と、前記第1の接続端子群と前記第2の接続端子群との間に硬化性接続材を介在させる工程と、前記第1の接続端子群と前記第2の接続端子群とを圧着させるとともに前記熱硬化性接続材を熱硬化させる工程とを含む電子部品の接続方法。 - 前記接続領域を加熱ツールで押圧することで予備加熱を行う請求項1に記載の電子部品の接続方法。
- 前記加熱ツールを用いて前記第2の接続端子群を前記第1の接続端子群に対して押圧するとともに前記熱硬化性接続材を加熱する請求項2に記載の電子部品の接続方法。
- 前記接続領域に接触することなく予備加熱を行う請求項1に記載の電子部品の接続方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006354301A JP5020629B2 (ja) | 2006-12-28 | 2006-12-28 | 電子部品の接続方法 |
US12/518,387 US9015932B2 (en) | 2006-12-28 | 2007-12-26 | Connecting method of electronic component |
PCT/JP2007/075369 WO2008081969A1 (en) | 2006-12-28 | 2007-12-26 | Connecting method of electronic component |
TW96150704A TW200829109A (en) | 2006-12-28 | 2007-12-28 | Connecting method of electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006354301A JP5020629B2 (ja) | 2006-12-28 | 2006-12-28 | 電子部品の接続方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008166488A true JP2008166488A (ja) | 2008-07-17 |
JP5020629B2 JP5020629B2 (ja) | 2012-09-05 |
Family
ID=39167616
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006354301A Active JP5020629B2 (ja) | 2006-12-28 | 2006-12-28 | 電子部品の接続方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9015932B2 (ja) |
JP (1) | JP5020629B2 (ja) |
TW (1) | TW200829109A (ja) |
WO (1) | WO2008081969A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010116637A1 (ja) * | 2009-04-07 | 2010-10-14 | パナソニック株式会社 | 電子部品実装システムおよび電子部品実装方法 |
WO2010116636A1 (ja) * | 2009-04-07 | 2010-10-14 | パナソニック株式会社 | 電子部品実装システムおよび電子部品実装方法 |
CN104206036B (zh) * | 2012-04-10 | 2017-05-03 | 松下知识产权经营株式会社 | 电极接合方法、电极接合结构体的制造方法以及电极接合结构体的制造系统 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2950673B1 (fr) | 2009-09-30 | 2011-12-09 | Valeo Vision | Support pour source lumineuse de module d'eclairage |
EP2527776A1 (en) | 2011-05-24 | 2012-11-28 | Thermal Corp. | Capillary device for use in heat pipe and method of manufacturing such capillary device |
US9300196B2 (en) | 2011-11-16 | 2016-03-29 | Lg Innotek Co., Ltd. | Voice coil motor |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1022344A (ja) * | 1996-07-08 | 1998-01-23 | Matsushita Electric Ind Co Ltd | バンプ付きワークのボンディング方法 |
JPH10223686A (ja) * | 1997-02-05 | 1998-08-21 | Nec Corp | 半導体実装方法 |
JPH1187429A (ja) * | 1997-05-09 | 1999-03-30 | Citizen Watch Co Ltd | 半導体チップの実装方法 |
JP2002252254A (ja) * | 2001-02-26 | 2002-09-06 | Sony Chem Corp | 電気装置製造方法 |
JP2004128337A (ja) * | 2002-10-04 | 2004-04-22 | Sharp Corp | Cof半導体装置およびその製造方法 |
JP2005203104A (ja) * | 2004-01-09 | 2005-07-28 | Opnext Japan Inc | 硬質回路基板とフレキシブル基板との接続構造、接続方法及びそれを用いた回路モジュール |
WO2006123554A1 (ja) * | 2005-05-17 | 2006-11-23 | Matsushita Electric Industrial Co., Ltd. | フリップチップ実装体およびフリップチップ実装方法 |
Family Cites Families (4)
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JPS6045028A (ja) | 1983-08-22 | 1985-03-11 | Nec Corp | 樹脂封止型半導体装置 |
JPH04301817A (ja) * | 1991-03-29 | 1992-10-26 | Rohm Co Ltd | 液晶表示装置とその製造方法 |
US6077382A (en) | 1997-05-09 | 2000-06-20 | Citizen Watch Co., Ltd | Mounting method of semiconductor chip |
WO2000002245A1 (fr) * | 1998-07-01 | 2000-01-13 | Seiko Epson Corporation | Dispositif a semi-conducteur, procede de fabrication associe, carte imprimee et dispositif electronique |
-
2006
- 2006-12-28 JP JP2006354301A patent/JP5020629B2/ja active Active
-
2007
- 2007-12-26 WO PCT/JP2007/075369 patent/WO2008081969A1/en active Application Filing
- 2007-12-26 US US12/518,387 patent/US9015932B2/en active Active
- 2007-12-28 TW TW96150704A patent/TW200829109A/zh unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1022344A (ja) * | 1996-07-08 | 1998-01-23 | Matsushita Electric Ind Co Ltd | バンプ付きワークのボンディング方法 |
JPH10223686A (ja) * | 1997-02-05 | 1998-08-21 | Nec Corp | 半導体実装方法 |
JPH1187429A (ja) * | 1997-05-09 | 1999-03-30 | Citizen Watch Co Ltd | 半導体チップの実装方法 |
JP2002252254A (ja) * | 2001-02-26 | 2002-09-06 | Sony Chem Corp | 電気装置製造方法 |
JP2004128337A (ja) * | 2002-10-04 | 2004-04-22 | Sharp Corp | Cof半導体装置およびその製造方法 |
JP2005203104A (ja) * | 2004-01-09 | 2005-07-28 | Opnext Japan Inc | 硬質回路基板とフレキシブル基板との接続構造、接続方法及びそれを用いた回路モジュール |
WO2006123554A1 (ja) * | 2005-05-17 | 2006-11-23 | Matsushita Electric Industrial Co., Ltd. | フリップチップ実装体およびフリップチップ実装方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010116637A1 (ja) * | 2009-04-07 | 2010-10-14 | パナソニック株式会社 | 電子部品実装システムおよび電子部品実装方法 |
WO2010116636A1 (ja) * | 2009-04-07 | 2010-10-14 | パナソニック株式会社 | 電子部品実装システムおよび電子部品実装方法 |
JP2010245308A (ja) * | 2009-04-07 | 2010-10-28 | Panasonic Corp | 電子部品実装システムおよび電子部品実装方法 |
US8434665B2 (en) | 2009-04-07 | 2013-05-07 | Panasonic Corporation | Electronic component mounting system and electronic component mounting method |
US8817487B2 (en) | 2009-04-07 | 2014-08-26 | Panasonic Corporation | Electronic component mounting system and electronic component mounting method |
CN104206036B (zh) * | 2012-04-10 | 2017-05-03 | 松下知识产权经营株式会社 | 电极接合方法、电极接合结构体的制造方法以及电极接合结构体的制造系统 |
US9839143B2 (en) | 2012-04-10 | 2017-12-05 | Panasonic Intellectual Property Management Co., Ltd. | Electrode joining method, production method of electrode joined structure |
Also Published As
Publication number | Publication date |
---|---|
TW200829109A (en) | 2008-07-01 |
JP5020629B2 (ja) | 2012-09-05 |
WO2008081969A1 (en) | 2008-07-10 |
US20100018048A1 (en) | 2010-01-28 |
US9015932B2 (en) | 2015-04-28 |
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