WO2010113978A1 - Condensateur à électrolyte solide - Google Patents

Condensateur à électrolyte solide Download PDF

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Publication number
WO2010113978A1
WO2010113978A1 PCT/JP2010/055762 JP2010055762W WO2010113978A1 WO 2010113978 A1 WO2010113978 A1 WO 2010113978A1 JP 2010055762 W JP2010055762 W JP 2010055762W WO 2010113978 A1 WO2010113978 A1 WO 2010113978A1
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WO
WIPO (PCT)
Prior art keywords
anode
cathode
capacitor element
capacitor
solid electrolytic
Prior art date
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PCT/JP2010/055762
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English (en)
Japanese (ja)
Inventor
秀範 末永
嘉宏 竹田
幸 氏家
勝憲 野上
敏行 村上
仁 会田
Original Assignee
日本ケミコン株式会社
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Filing date
Publication date
Priority claimed from JP2009088318A external-priority patent/JP2010239089A/ja
Priority claimed from JP2009228751A external-priority patent/JP2011009683A/ja
Application filed by 日本ケミコン株式会社 filed Critical 日本ケミコン株式会社
Priority to CN2010800148456A priority Critical patent/CN102379016A/zh
Priority to US13/260,149 priority patent/US20120018206A1/en
Publication of WO2010113978A1 publication Critical patent/WO2010113978A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/14—Structural combinations or circuits for modifying, or compensating for, electric characteristics of electrolytic capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15—Solid electrolytic capacitors

Definitions

  • the present invention relates to a solid electrolytic capacitor. More specifically, the present invention can function as a solid electrolytic capacitor having a low equivalent series inductance as electrical characteristics and good transient response characteristics, or a distributed constant noise filter. The present invention relates to a solid electrolytic capacitor.
  • capacitors that are one of the electronic components have been required to have better impedance characteristics in the high frequency range than before.
  • Various solid electrolytic capacitors using a highly conductive polymer as a solid electrolyte have been studied.
  • LSIs such as CPUs typified by computers, LSIs for image processing of televisions, and memories that exchange data with these LSIs have been placed around these devices for power supply applications.
  • a solid electrolytic capacitor to be used is strongly demanded to be small in size and large in capacity.
  • ESR equivalent series resistance
  • ESL excellent noise removal and transient response
  • Equivalent series inductance is strongly demanded, and various studies have been made to meet such a demand.
  • FIG. 13 is a cross-sectional view showing a conventional solid electrolytic capacitor.
  • a dielectric layer made of an oxide film is formed on the anode body 304 made of a valve metal, and then a solid electrolyte layer (cathode electrode layer) 305 made of a conductive polymer is formed on the dielectric layer, and further around that After the graphite layer 306 is formed and the cathode layer composed of the silver paste layer 307 is sequentially formed, the anode lead 309 is connected to the other end side of the anode body 304, and the cathode lead 310 is connected to the lower surface of the silver paste layer 307. It is connected and pulled out and molded with exterior resin 308.
  • a solid electrolytic capacitor is disclosed in Patent Document 7.
  • the current path is made as short as possible, and secondly, the magnetic field formed by the current path is canceled by the magnetic field formed by another current path.
  • a third method is known in which the current path is divided into n and the effective ESL is reduced to 1 / n.
  • the invention disclosed in Japanese Patent Laid-Open No. 2000-311832 employs the first and third methods
  • the invention disclosed in Japanese Patent Laid-Open No. 06-267802 discloses the second and third methods
  • the invention disclosed in Japanese Patent Laid-Open No. 06-267801, Japanese Patent Laid-Open No. 11-288846, and Japanese Patent No. 4208831 employs the third method.
  • Japanese Patent Laid-Open No. 2002-164760 discloses a distributed constant type noise filter using a conductive polymer as an electrolyte, in which two flat plate-shaped oxide films are formed of a plate-shaped valve metal.
  • An anode terminal having a distributed constant circuit forming portion sandwiched between the cathode terminal connected to the distributed constant circuit forming portion and an anode lead portion protruding from an oxide film in which a part of the valve action metal plate is a dielectric is provided.
  • a three-terminal capacitor type distributed constant noise filter is disclosed.
  • FIG. 14 is a cross-sectional view showing a conventional distributed constant noise filter.
  • a solid electrolyte (cathode electrode layer) 405, a graphite layer 406, and a silver paste layer 407 made of a conductive polymer are sequentially formed on the surface of the central portion of the dielectric layer formed on the anode body 404 of the valve metal to form a cathode.
  • Both ends of the body 404 are a pair of anodes, anode leads 409 are connected to both ends thereof, cathode leads 410 are connected to the central silver paste layer 407, and molded with exterior resin 408.
  • This distributed constant type noise filter utilizes the structure of a three-terminal type solid electrolytic capacitor and can also function as a solid electrolytic capacitor.
  • the capacitor disclosed in Patent Document 1 can cope with high frequency by using a thin film capacitor, but in order to increase the capacitance, is it necessary to increase the area of the dielectric layer? It is necessary to laminate dielectric layers.
  • the dielectric layer used is a perovskite-type complex oxide crystal containing Ba and Ti, and the realizable capacitance is nanofarad (nF) order capacitance, and microfarad ( ⁇ F).
  • nF nanofarad
  • ⁇ F microfarad
  • Patent Document 2 the current path is divided by making the solid electrolytic capacitor into four terminals, so that the solid electrolytic capacitor is more than the conventional two-terminal type solid electrolytic capacitor.
  • Patent Document 2 has a structure in which an external anode terminal and an external cathode terminal are attached to the capacitor element, and the current path inside the solid electrolytic capacitor is not necessarily short.
  • the anode and cathode terminals are arranged on the four side surfaces of the solid electrolytic capacitor, and the four terminals are separated from each other, which is called cancellation of the induced magnetic field. The effect cannot be expected.
  • the solid electrolytic capacitors described in Patent Document 1 to Patent Document 5 described above have an ESL reduction effect and are expected to improve transient response characteristics as compared with the conventionally known two-terminal capacitors. However, it has not always obtained a sufficient effect for the low ESL requirement recently required.
  • Patent Document 1 to Patent Document 5 described above are solid electrolytic capacitors for the purpose of reducing ESL, and are not intended for the function as a transmission line.
  • patent document 2, patent document 3, and patent document 5 are 3 terminal type solid electrolytic capacitors, it is thought that it can also be utilized as a transmission line, but when using these as a transmission line, Therefore, it cannot be used as a solid electrolytic capacitor for transient response, and has a single function.
  • a distributed constant type noise filter disclosed in Patent Document 6 is known as a noise filter having a three-terminal type solid electrolytic capacitor and having a transmission line structure. It has only a single function and cannot sufficiently meet the demand for transient response characteristics.
  • the capacitor is arranged near the CPU, and a capacitor having a function with excellent transient response characteristics for quickly supplying power to an instantaneous voltage drop of the CPU is required.
  • the noise filter is also arranged near the CPU. Therefore, it is required to remove the high frequency noise of the power supplied to the CPU and stabilize the operation of the CPU. For this reason, it is desirable that the capacitor and the noise filter are respectively disposed in the vicinity of the CPU, but there are restrictions on disposing them all in the vicinity of the CPU due to the limitation of the mounting area.
  • An object of the present invention is to provide a capacitor that is good and can be used as a composite component having two functions of a capacitor and a distributed constant noise filter as a distributed constant noise filter.
  • Capacitor element pieces having both ends of the anode body as anode lead portions and both sides of the central portion of the anode body as cathode lead portions, the cathode lead portions overlap and the anode lead portions are substantially perpendicular to each other It is characterized by being a solid electrolytic capacitor having capacitor elements laminated so as to deviate from each other.
  • the cathode lead portions on the side surfaces of the stacked capacitor element pieces are connected to each other with a conductive material.
  • a mounting surface facing a wiring board in a solid electrolytic capacitor having a capacitor element in which both ends of an anode body are anode lead portions and a dielectric layer, a solid electrolyte layer, and a cathode lead portion are sequentially formed on the anode body.
  • Capacitor element in which both ends of the anode body are anode extraction portions, and a dielectric layer, a solid electrolyte layer, and a cathode extraction portion are sequentially formed on the anode body, a surface on which the capacitor element is mounted, and a surface on the wiring board A conductor surface corresponding to the anode lead portion and the cathode lead portion of the capacitor element is formed on the surface on which the capacitor element is mounted, and an anode terminal is provided on the mounting surface facing the wiring board.
  • a cathode terminal portion, and the conductor comprises a mounting substrate that penetrates the wiring board and is electrically connected to the anode terminal portion and the cathode terminal portion, respectively, on the mounting surface of the mounting substrate.
  • the first cathode terminal portion is arranged at the center thereof, and the anode terminal portion is arranged on four sides of the mounting surface of the mounting substrate around the first cathode terminal portion, and the mounting surface of the mounting substrate is At the four corners Characterized in that it is a solid electrolytic capacitor which arranged the second cathode terminal portion adjacent to the anode terminal Te.
  • the first cathode terminal portion is formed in a region substantially equal to the size of the cathode lead portion of the capacitor element, and the anode terminal portion And it is set as the area
  • the first cathode terminal portion is a central portion of the mounting surface of the mounting board and is close to each anode terminal portion. And an insulating region is formed at the center of the mounting surface.
  • a solid electrolytic capacitor comprising a rectangular mounting substrate having a mounting surface that is surface-mounted on a printed circuit board on one surface and an element mounting surface on which the capacitor element is mounted on the other surface, and a capacitor element.
  • the mounting substrate has anode terminal portions at the four corners of the mounting surface and cathode terminal portions at the central portion, anode conductors connected to the anode terminal portions at the four corners of the element mounting surface, and a central portion.
  • Cathode conductors that are electrically connected to the cathode terminal portion are respectively disposed, and the capacitor element has a capacitance forming portion, a cathode electrode layer, and a cathode lead portion sequentially laminated at a central portion of the conductor, and from the periphery of the cathode lead portion.
  • An anode lead portion comprising four protruding conductors is formed, the anode lead portion of the capacitor element is formed on the anode conductor of the mounting substrate, and the cathode of the capacitor element is formed on the cathode conductor.
  • Out section was connected, characterized in that it is a solid electrolytic capacitor comprising a transmission line structure by conductor in the capacitor element positioned diagonally of the mounting substrate.
  • the capacitor element is made of a rectangular conductor, and the anode lead portion protrudes from both ends of the cathode lead portion into a cruciform shape. It is characterized in that a plurality of layers are stacked.
  • the capacitor element is made of a cross-shaped conductor, and the anode lead portion protrudes from the periphery of the cathode lead portion.
  • the capacitor lead-out part overlaps the capacitor element piece with both ends of the anode body as the anode lead-out part and both surfaces of the central part of the anode body as the cathode lead-out part,
  • the anode lead portions arranged opposite to each other are electrically connected inside the capacitor element pieces, and further have a cathode lead portion sandwiched between the anode lead portions, thereby constituting a transmission line structure. It can also function as a three-terminal noise filter. That is, when this solid electrolytic capacitor is mounted on a circuit board, an electric signal input from one of the opposing anode lead portions is filtered, and the electric signal is output to the other anode lead portion.
  • the laminated capacitor element pieces can be regarded as independent capacitors in terms of electrical circuits.
  • the capacitor element pieces constituting the transmission line structure intersect each other, so that there is little mutual influence. For this reason, a pair of anode lead portions facing each other is used as a noise filter, and a pair of anode lead portions arranged at a rotation angle perpendicular to the anode lead portion functioning as the noise filter is used as an output terminal of a capacitor for transient response. It is also possible to do. It is also possible to use the two capacitor element pieces as transmission lines.
  • the internal resistance of the cathode lead portions of the stacked capacitor elements is reduced by connecting the side surfaces of the cathode lead portions of the stacked capacitor element pieces with a conductive material. Reduction can be achieved. For this reason, since the charge accumulated in the capacitance forming part of the laminated capacitor element can be quickly supplied from any of the four anode lead parts, the solid electrolytic capacitor as a whole has excellent transient response characteristics. A capacitor can be obtained.
  • the first cathode terminal portion is arranged at the center of the mounting surface facing the wiring board, and the anode terminal portion is arranged around the first cathode terminal portion, and is adjacent to the anode terminal portion.
  • the distance from the anode lead portion and the cathode lead portion of the capacitor element to the anode terminal portion and the cathode terminal portion of the mounting substrate, which is the current outlet, is as follows. This can be achieved only by the thickness, and the current path can be shortened.
  • the anode terminal portion of the mounting substrate is arranged so that the three directions are surrounded by the cathode terminal portion, the effect of canceling the induced magnetic fields of the anode and the cathode is large, and the ESL of the solid electrolytic capacitor can be reduced. .
  • the anode mounting portion of the capacitor element, the anode conductor corresponding to the cathode leading portion, and the cathode conductor are provided on the surface on which the capacitor element is mounted.
  • Each of the mounting substrates has a first cathode terminal portion in the center of the mounting substrate and four anode terminal portions on the four sides of the mounting substrate so as to surround the outer periphery of the first cathode terminal portion.
  • second cathode terminal portions electrically connected to the cathode lead portions of the capacitor elements are provided at the four corners of the mounting substrate.
  • the anode terminal portion Since the second cathode terminal portion is disposed adjacent to the anode terminal portion, the anode terminal portion is surrounded in three directions by the first cathode terminal portion and the second cathode terminal portion, respectively. Arrangement. And, by the configuration in which the anode conductor and the anode terminal portion, and the cathode conductor and the cathode terminal portion are electrically connected by conductors penetrating the mounting substrate, respectively, first, from the anode lead portion and the cathode lead portion of the capacitor element, The distance to the anode terminal portion and the cathode terminal portion of the mounting substrate, which is the current outlet, can be achieved by a distance corresponding to the thickness of the mounting substrate, and the current path can be shortened.
  • the anode terminal portion of the mounting substrate is arranged so that three directions are surrounded by the cathode terminal portion, the effect of canceling the induced magnetic fields of the anode and the cathode is large.
  • the current path can be divided into four, and the substantial ESL can be reduced to 1 ⁇ 4.
  • the solid electrolytic capacitor of the present invention a method of shortening the length of the current path as the first element technology for reducing ESL and a magnetic field formed by the current path as the second element technique are separated. Using all the methods of canceling by the magnetic field formed by the current path of the current, and dividing the current path, which is the third elemental technology, into n pieces and reducing the effective ESL to 1 / n, Thus, it is possible to realize a solid electrolytic capacitor with an increased reduction effect.
  • the first cathode terminal portion disposed in the center of the mounting surface is formed in a region substantially equal to the size of the cathode lead portion of the capacitor element, and the anode terminal portion Since the area is larger than that of the second cathode terminal portion, the distance from the cathode lead portion of the capacitor element to the first cathode terminal portion can be formed to be the shortest, and ESL can be reduced. At the same time, the current capacity output from the cathode lead portion of the capacitor element can be increased, and the cathode terminal portion can supply a large current during a transient response.
  • the first cathode terminal portion is disposed in the central portion of the mounting surface and in the vicinity of each anode terminal portion, and the central portion is an insulating region.
  • the current is concentrated by narrowing the current path of the first cathode terminal portion, and the effect of canceling the induced magnetic field can be further enhanced by bringing the current path closer to the anode terminal portion. That is, it is possible to realize a solid electrolytic capacitor that further enhances the overall ESL reduction effect.
  • the solid electrolytic capacitor described in the above (7) functions as a five-terminal capacitor in which the anode terminal portion is led out in four directions and the cathode terminal portion is arranged in the center portion. Furthermore, the capacitor element is formed by sequentially laminating a capacitance forming portion, a cathode electrode layer, and a cathode lead portion at the center of the conductor, and an anode lead portion comprising four conductors protruding from the periphery of the cathode lead portion is formed. And the anode terminal parts located diagonally comprise the transmission line structure with the conductor.
  • the dielectric layer and the cathode electrode layer serving as the capacitance forming portion of the capacitor element can function as a distributed constant circuit, it can function as a three-terminal noise filter using the distributed constant circuit portion as a filter portion. That is, when this capacitor is mounted on a circuit board, an electrical signal input from one of the opposing anode terminal portions arranged diagonally is filtered by the distributed constant circuit portion, and the electrical signal is filtered by the other anode terminal portion. Will be output.
  • the transmission line structure of the capacitor element is a crossed structure. Therefore, the crossed transmission line structures can be regarded as independent transmission lines in terms of electrical circuits.
  • the transmission line structure is orthogonal, and the phase of the induced magnetic field generated from each transmission line is shifted, so that there is little mutual influence.
  • the transmission line structure is composed of the anode terminal portions arranged diagonally, the length of the transmission line on a fixed rectangular mounting surface can be made the longest. As a result, the distributed constant circuit portion formed on the transmission line can be formed longer.
  • the length of the distributed constant circuit unit is 1 ⁇ 4 ⁇ or more when the wavelength of the input noise wave is ⁇ . Therefore, in order to function as a noise filter that can cope with a wideband frequency, the longer the distributed constant circuit portion, the better.
  • the transmission line length is the longest among the solid electrolytic capacitors having a fixed mounting area, and the length of the distributed constant circuit portion on the transmission line can be increased. Therefore, it becomes possible to reduce the size of the noise filter corresponding to broadband noise.
  • a five-terminal solid electrolytic capacitor having a cathode terminal portion at the center and four anode terminal portions around the cathode terminal portion is obtained.
  • the current path can be divided into four, and the substantial ESL of the solid electrolytic capacitor can be reduced to 1 ⁇ 4.
  • one of the crossed transmission line structures can be used as a solid electrolytic capacitor, and the other can be used as a distributed constant noise filter. Can be used.
  • FIG. 5A is a top view of the solid electrolytic capacitor
  • FIG. 5B is a cross-sectional view taken along line AA in FIG. It is drawing which shows the modification of the 3rd Embodiment of this invention.
  • FIG. 1 It is drawing which shows the mounting substrate used for the solid electrolytic capacitor of the 3rd Embodiment of this invention, (a) is an element mounting surface, (b) is drawing which shows a mounting surface. It is sectional drawing which shows the internal structure of the conventional solid electrolytic capacitor. It is sectional drawing which shows the internal structure of the conventional distributed constant type noise filter.
  • the capacitor element used for the solid electrolytic capacitor according to the first embodiment of the present invention has a rectangular capacitor element piece in which both ends are an anode lead portion and a central portion between the anode lead portions is a cathode lead portion.
  • the capacitor element pieces are shifted and overlapped so that the anode lead portions are oriented at a right angle of rotation angle, and the central portion becomes the cathode lead portion, and the anode lead portions are arranged in four directions from the cathode lead portion. It is a formed form.
  • the capacitor element piece 121 uses a valve metal plate or valve metal foil (hereinafter referred to as an anode body) made of substantially rectangular aluminum or the like, and the central portion of the anode body is enlarged by an etching process.
  • a porous etching layer 125 is formed on both sides of the aluminum foil by processing.
  • the inside of the anode body is not etched and an aluminum ingot remains, and this aluminum ingot becomes a remaining core layer ((a) of FIG. 1).
  • a dielectric oxide film is formed on the surface of the etching layer 125 by anodic oxidation. In this case, both end portions of the anode body are unetched portions and become anode lead portions 122.
  • a dielectric oxide film is formed on the surface of the etching layer 125 by anodic oxidation.
  • the etching treatment is a step of forming a porous etching layer by dissolving both surfaces of the anode body with hydrochloric acid or the like.
  • an anode body made of a high-purity aluminum foil having a cross-sectional size of 10 mm ⁇ 5 mm and a thickness of 120 ⁇ m is used, and a resist material is applied to the positions of 1.5 mm from both ends of the anode body, respectively. (Not shown).
  • an etching layer is formed in the central part of the anode body at a depth of 40 ⁇ m from both sides. In this case, the thickness of the remaining core layer is 40 ⁇ m.
  • a separation layer 124 is formed on the capacitor element piece, and the anode lead portion 122 and the cathode lead portion 123 of the capacitor element piece 121 are separated. After the etching is finished, the separation layer 124 is coated with an insulating resin and penetrated into the etching layer 125 to insulate the anode lead portion 122 and the etching layer 125. For example, the separation layer 124 can be formed to a position of 0.5 mm from the unetched portion.
  • the etched anode body is subjected to chemical conversion treatment by anodization to form a dielectric oxide film layer made of aluminum oxide.
  • a predetermined voltage is applied in a state where the etching foil is immersed in an aqueous solution such as boric acid or adipic acid to form a dielectric oxide film.
  • a solid electrolyte layer (not shown) is formed on the dielectric oxide film.
  • the solid electrolyte layer is sequentially immersed in a solution containing a polymerizable monomer that becomes a conductive polymer by polymerization and an oxidizer solution, and is pulled up from each solution to advance the polymerization reaction.
  • These solid electrolyte layers may be formed by a method of applying or discharging a solution containing a polymerizable monomer and an oxidant solution. Moreover, the method of immersing and apply
  • the solid electrolyte layer can be formed by an electrolytic polymerization method used in the field of solid electrolytic capacitors or a method of applying and drying a conductive polymer solution. Furthermore, it is also possible to form a solid electrolyte layer by combining these solid electrolyte layer forming methods.
  • thiophene, pyrrole or their derivatives can be suitably used as the polymerizable monomer used for forming the solid electrolyte layer.
  • the monomer is preferably thiophene or a derivative thereof.
  • thiophene derivatives can be exemplified by the following structures: thiophene or its derivatives have higher electrical conductivity and particularly excellent thermal stability than polypyrrole or polyaniline. An excellent solid electrolytic capacitor can be obtained.
  • X is O or S.
  • A is alkylene or polyoxyalkylene.
  • A is alkylene, polyoxyalkylene, substituted alkylene, or substituted polyoxyalkylene.
  • the substituent is an alkyl group, an alkenyl group, or an alkoxy group.
  • thiophene derivatives 3,4-ethylenedioxythiophene is preferably used.
  • an aqueous solution of ferric paratoluenesulfonate, periodic acid or iodic acid dissolved in ethanol can be used as an oxidizing agent used for polymerization of a polymerizable monomer.
  • a cathode layer composed of a graphite layer and a silver paste layer is sequentially formed on the solid electrolyte layer of the capacitor element piece to form a cathode lead-out portion 123.
  • This capacitor element piece 121 has a length of 1.5 mm for the anode lead portions 122 and 122 at both ends, a length of 0.5 mm for the separation layer 124, a length of 6 mm for the cathode lead portion 123, and a width of 5 mm for all the capacitor element pieces. It becomes a piece 121.
  • the capacitor element pieces 121 formed as described above are stacked so that the cathode lead portions 123 overlap and the anode lead portions 122 and 122 form a right angle to each other.
  • a capacitor element 120 having a cross-shaped top view in which the anode lead-out part 123 and the anode lead-out part 122 are radially arranged in four directions from the cathode lead-out part 123 is formed.
  • the size of the cathode lead portion 123 of the capacitor element piece 121 is a rectangle of 5 ⁇ 6 mm. It is preferable to overlap the portions so that they protrude from each other by 0.5 mm.
  • the capacitor element 120 is formed in a cross shape when viewed from above, and the cathode lead-out portion 123 is arranged at the center thereof.
  • the cathode lead-out portion 123 has a square shape of approximately 6 ⁇ 6 mm, and has four corner portions cut out in a size of 0.5 ⁇ 0.5 mm.
  • capacitor element pieces each having an anode lead portion at both ends and a cathode lead portion at the center in a cross shape in a top view.
  • anode terminal By forming the anode terminal at four locations, the current path can be divided into four, and the substantial ESL can be reduced to 1 ⁇ 4.
  • Opposite anode terminal portions are electrically connected inside the capacitor element pieces, and are composed of an opposing anode terminal portion 2 and a cathode terminal portion connected to a cathode lead portion, so that a transmission line structure Can be made to function as a noise filter of a three-pole terminal.
  • the pair of opposite anode terminal portions is used as a noise filter, and the other pair of opposite anode terminal portions is used as an output terminal of a capacitor for transient response. It is also possible to do.
  • the mounting substrate 141 is based on an insulating substrate such as a rectangular glass epoxy substrate, and includes an anode terminal portion 142 and a cathode terminal portion 143 on the lower surface, and the upper surface is connected to the anode lead portion and the cathode lead portion of the capacitor element, respectively.
  • the anode conductor 144 and the cathode conductor 145 are provided, and the anode conductor 144 and the anode terminal portion 142 on the upper surface and the back surface are electrically connected to each other.
  • a cathode conductor joined to the cathode lead portion of the capacitor element is formed in a square shape at the center of the capacitor element mounting surface of the mounting substrate 141, and the anode conductor 144 is disposed so as to surround the cathode conductor 145. .
  • a cathode terminal portion 143 is formed at the center, and four anode terminal portions 142 are arranged so as to surround the cathode terminal portion 143.
  • the anode conductor 144 and the anode terminal portion 142, and the cathode conductor 145 and the cathode terminal portion 143 formed on both surfaces of the mounting substrate 141 are electrically joined through electrodes 148 penetrating the front and back of via holes or through holes, respectively. Yes.
  • a glass epoxy substrate having a thickness of about 200 ⁇ m from the viewpoint of strength but a glass epoxy substrate having a thickness of about 80 ⁇ m can also be used.
  • the electrodes and conductors formed on the glass epoxy substrate need only have low electrical resistance and can be soldered, and it is preferable to use copper or nickel plated gold conductor.
  • the electrodes and conductors can be formed with a thickness of 3 to 5 ⁇ m on one side.
  • the electrodes and conductors on both surfaces of the mounting substrate 141 and the through holes that electrically connect them can be formed by a method for creating a double-sided printed circuit board that is often used in printed circuit boards. The arrangement of the through holes, the inner diameter, etc. at this time can be arbitrarily set.
  • the distance from the anode lead part and cathode lead part of the capacitor element to the anode terminal part and cathode terminal part of the mounting board that is the outlet of the current is only the thickness of the mounting board.
  • the distance can be achieved, and the current path can be shortened.
  • the thickness of the mounting substrate is preferably about 200 ⁇ m, but a thickness of about 80 ⁇ m can also be manufactured.
  • the capacitor The distance from the cathode lead portion of the device to the cathode terminal portion can be made extremely short.
  • the current path can be divided into four, and the substantial ESL can be reduced to 1 ⁇ 4. Combined with these two ESL reduction effects, the ESL of the solid electrolytic capacitor can be reduced.
  • the capacitor element 120 is mounted on the mounting substrate 141, and the cathode lead-out portion 123 of the capacitor element 120 and the cathode conductor 145 of the mounting substrate are joined by a conductive adhesive. Further, the anode lead part 122 of the capacitor element 120 and the anode conductor 144 are connected. At this time, the anode lead portion 122 of the capacitor element 120 is aluminum, and the wettability with the silver paste or the like is not good, and adhesion with the silver paste may be difficult.
  • a connecting member 127 such as a copper material is connected to the anode lead portion 122 of the capacitor element 120 by laser welding, ultrasonic welding, or the like, and the connecting member 127 is made of a conductive material such as silver paste. It is preferable to bond to the anode conductor 144 of the mounting substrate 141 with an adhesive.
  • the capacitor element pieces are stacked and arranged one above the other.
  • the internal resistance between the cathode lead portions 123 and 123 of 121 and 121 can be reduced, and a conductive path to the cathode conductor 145 of the mounting substrate 141 is formed. For this reason, the charge accumulated in the capacitance forming part of the laminated capacitor element can be supplied quickly from anywhere in the four anode terminal parts, so that the solid electrolytic capacitor as a whole has excellent transient response characteristics. A capacitor can be obtained.
  • the number of capacitor elements mounted on the mounting substrate 141 is not limited to one. When a large capacitance is required, capacitor elements can be further stacked to achieve the required capacitance.
  • the exterior is molded by exterior resin.
  • the mounting substrate 241 is based on an insulating substrate such as a rectangular glass epoxy substrate, and includes an anode terminal portion 242 and a first cathode terminal portion 243 on a mounting surface that faces a wiring substrate on which a solid electrolytic capacitor is mounted.
  • the surface on which the capacitor element is mounted is provided with an anode conductor 244 and a cathode conductor 245 connected to the anode lead portion and the cathode lead portion of the capacitor element, respectively, and the anode conductor 244, the anode terminal portion 242 and the cathode conductor on each surface. 245 and the first cathode terminal portion 243 are electrically connected.
  • a cathode conductor 245 joined to the cathode lead portion of the capacitor element is formed in a square shape at the center of the surface of the mounting substrate 241 where the capacitor element is mounted.
  • the four anode conductors 244 are arranged on the four sides of the mounting substrate 241 so as to surround the outer periphery of the cathode conductor 245.
  • auxiliary conductors 247 that are electrically continuous with the cathode conductors 245 are disposed at the four corners of the mounting substrate 241.
  • a first cathode terminal portion 243 having substantially the same size as that of the anode conductor 244 is formed in the central portion.
  • Four anode terminal portions 242 are arranged on the four sides so as to surround the outer periphery of the first cathode terminal portion 243.
  • the second cathode terminal portion 246 is disposed adjacent to the anode terminal portion 242 at the four corners of the mounting surface of the mounting substrate 241. As shown in FIG.
  • the anode conductor 244 and anode terminal portion 242 are These are electrically connected to each other through conductors 248 penetrating front and back such as via holes or through holes formed substantially perpendicular to the substrate surface of the mounting substrate 241.
  • the anode conductor 244 and the cathode conductor 245 disposed on the surface of the mounting substrate 241 on which the capacitor element is mounted are conductors corresponding respectively to the anode lead portion and the cathode lead portion of the capacitor element, and match the shape of the capacitor element. It becomes the size and arrangement which can be mounted.
  • the cathode conductor 245 corresponding to the cathode lead portion of the capacitor element is a conductor formed on the mounting substrate 241. Will occupy the largest area.
  • the first cathode terminal portion 243 connected to the cathode conductor 245 through a through hole or the like is also formed so as to occupy the same area as the cathode conductor 245, the cathode conductor 245,
  • the first cathode terminal portion 243 is arranged at the shortest distance through the through hole, and it is achieved to shorten the current path that is an element of ESL reduction. Therefore, also on the mounting surface of the mounting substrate 241, the area occupied by the first cathode terminal portion 243 is the largest compared to the anode terminal portion 242 and the second cathode terminal portion 246.
  • increasing the area occupied by the first cathode terminal portion 243 also increases the current capacity, and it is possible to flow a large current when outputting the charge accumulated by the capacitor element. By supplying the electric charge required at the time of the transient response with a large current, it is possible to quickly recover the instantaneous voltage drop state.
  • a substrate having a thickness of about 200 ⁇ m in terms of strength but an insulating substrate having a thickness of about 80 ⁇ m can also be used.
  • the anode terminal portion, the first cathode terminal portion, the second cathode terminal portion, and the conductor formed on the insulating substrate need only have low electrical resistance and can be soldered. It is preferable to use a conductor plated with gold.
  • the electrodes and conductors can be formed with a thickness of 3 to 5 ⁇ m on one side.
  • the anode terminal portion of the mounting substrate 241, the cathode terminal portion and the conductor, and the through holes that electrically connect them can be formed by a method for producing a double-sided wiring board that is often used in printed wiring boards. it can.
  • the arrangement of the through holes, the inner diameter, etc. at this time can be arbitrarily set.
  • first cathode terminal portion 243 and the second cathode terminal portion 246 are preferably insulated by a resist layer on the mounting surface of the mounting substrate 241.
  • the first cathode terminal portion 243 and the second cathode terminal portion 246 are exposed on the mounting surface of the mounting substrate 241, the first cathode terminal portion 243 and the second cathode terminal portion The distance between the conductive pattern connecting 246 and the anode terminal portion 242 becomes short, and a solder bridge may be generated when soldering on the mounting surface, resulting in a short circuit.
  • a conductive pattern for connecting the first cathode terminal portion 243 and the second cathode terminal portion 246 is formed on the mounting surface of the mounting substrate 241, it is preferable that at least the conductive pattern is covered with a resist layer. .
  • the cathode conductor 245 and the auxiliary conductor 247 are connected to the conductive pattern on the surface on which the capacitor element of the mounting substrate 241 is mounted. It is most preferable that the auxiliary conductor 247 and the second cathode terminal portion 246 are connected by a through hole or the like. Regardless of whether the conductive pattern is formed on the surface on which the capacitor element is mounted or the mounting surface, the characteristics of the solid electrolytic capacitor are not greatly affected. However, if a conductive pattern is formed on the mounting surface, this solid This is because there is a possibility that noise is generated due to electromagnetic coupling with a conductive pattern formed on a wiring board or the like on which an electrolytic capacitor is mounted.
  • the anode terminal portion 242 and the second cathode terminal portion 246 of the mounting substrate 241 are preferably formed up to the end of the mounting surface of the mounting substrate 241. If the anode terminal portion 242 and the second cathode terminal portion 246 are formed up to the end of the mounting surface of the mounting substrate 241, when the solid electrolytic capacitor is mounted on the wiring substrate or the like by soldering, the wiring substrate or the like A solder fillet is formed between the conductive pattern, the anode terminal portion 242 and the second cathode terminal portion 246, and visibility of whether or not the soldering connection is surely made is improved. Furthermore, when the anode terminal portion 242 and the second cathode terminal portion 246 are formed from the mounting surface to the side surface of the mounting substrate 241, a solder fillet is formed large, which is preferable.
  • the distance from the anode lead portion and the cathode lead portion of the capacitor element to the anode terminal portion and the first cathode terminal portion of the mounting substrate, which is the outlet of current is determined by the thickness of the mounting substrate. This can be achieved by a short distance, and the current path can be shortened.
  • the thickness of the mounting substrate is preferably about 200 ⁇ m, but a thickness of about 80 ⁇ m can also be manufactured.
  • the capacitor The distance from the cathode lead portion of the element to the first cathode terminal portion can be made extremely short.
  • the anode terminal portion of the mounting substrate is arranged in three directions by the first cathode terminal portion and the second cathode terminal portion, the effect of canceling the induced magnetic fields of the anode and the cathode is large.
  • the current path can be divided into four, and the substantial ESL can be reduced to 1 ⁇ 4.
  • a method of shortening the length of the current path as the first element technology for reducing ESL and a magnetic field formed by the current path as the second element technique are separated. Using all the methods of canceling by the magnetic field formed by the current path of the current, and dividing the current path, which is the third elemental technology, into n pieces and reducing the effective ESL to 1 / n, This enhances the effect of reducing the above.
  • the second cathode terminal portion equivalent in potential to the first cathode terminal portion is formed at the four corners of the mounting surface of the mounting substrate 241, so that the degree of freedom of conduction with the GND line such as the wiring substrate to be mounted is increased. Can also be increased. Further, in the conventional solid electrolytic capacitor having a five-terminal structure, it is difficult to visually confirm whether the first cathode terminal portion is securely soldered. However, the second cathode terminal portion 246 is formed at the four corners. By forming the second cathode terminal portion 246 to the end of the mounting substrate 241, a solder fillet is formed between the conductive pattern of the wiring board to be mounted and the second cathode terminal portion 246. Visibility of surely soldering connection is improved.
  • the first cathode terminal portion formed on the mounting substrate 241 is not a pattern with the entire surface exposed, but at the center of the first cathode terminal portion 243 formed in a square shape. May be formed in a so-called square shape without forming a conductive pattern and having an insulating region at the center. If the first cathode terminal portion 243 is formed in the shape of a mouth in this way, the current path of the first cathode terminal portion 243 is narrowed and the current is concentrated.
  • first cathode terminal portion where the current is concentrated is disposed so as to be close to the anode terminal portion 242
  • the effect of canceling the induced magnetic field can be further enhanced, and the overall ESL reduction effect can be achieved.
  • a further improved solid electrolytic capacitor can be realized.
  • a conductive pattern is not formed in advance, and the first cathode terminal portion 243 is formed with a conductive pattern on the entire surface, and the central portion is covered with a resist layer.
  • the central portion can be an insulating region.
  • the outer peripheral region of the first cathode terminal portion 243 is formed in a region substantially equal to the size of the cathode lead portion of the capacitor element.
  • the anode and the cathode are arranged closest to each other, and the effect of canceling the induced magnetic field is large and preferable.
  • the shape of the first cathode terminal is a square shape as described above, but the pattern arrangement of the substrate on which the solid electrolytic capacitor is mounted
  • the shape of the first cathode terminal portion can be arbitrarily changed depending on the terminal arrangement of the IC supplied with power by the solid electrolytic capacitor or the amount of electric power required.
  • the shape of the first cathode terminal portion 243 is not a perfect square, but an octagonal shape in which square corners are cut.
  • the capacitor element 220 is mounted on the mounting substrate 241, and the cathode lead-out portion 223 of the capacitor element 220 and the cathode conductor 245 of the mounting substrate are joined by a conductive adhesive. Further, the anode lead part 222 of the capacitor element 220 and the anode conductor 244 are connected. At this time, the anode lead portion 222 of the capacitor element 220 is aluminum, and the wettability with the silver paste or the like is not good, and there are cases where adhesion with the silver paste is difficult.
  • a connecting member 227 such as a copper material is connected to the anode lead portion 222 of the capacitor element 220 by laser welding, ultrasonic welding or the like, and this connecting member 227 is made of a conductive material such as silver paste. It is preferable to join the anode conductor 244 of the mounting substrate 241 with an adhesive.
  • the number of capacitor elements mounted on the mounting board 241 is not limited to one. When a large capacitance is required, capacitor elements can be further stacked to achieve the required capacitance.
  • the exterior is molded by exterior resin.
  • the mounting substrate 341 is based on an insulating substrate such as a rectangular glass epoxy substrate, and has an anode terminal portion 342 and a cathode terminal portion 343 on the bottom surface, and is connected to the anode lead portion and the cathode lead portion of the capacitor element on the top surface.
  • the anode conductor 344 and the cathode conductor 345 are connected to each other, and the anode conductor 344 and the anode terminal portion 342 on the top surface and the back surface are electrically connected to each other.
  • Anode conductors 344 are arranged at the four corners of the capacitor element mounting surface of the mounting substrate 341.
  • a cathode conductor 345 joined to the cathode lead portion of the capacitor element is formed in a square shape.
  • four anode terminal portions 342 are formed at four corners, and a cathode terminal portion 343 is disposed at the center portion.
  • the anode conductor and anode terminal portion, and the cathode conductor and cathode terminal portion formed on both surfaces of the mounting substrate 341 are electrically joined via electrodes 348 penetrating the front and back surfaces of via holes or through holes, respectively.
  • the cathode terminal portion 343 of the mounting substrate 341 is preferably formed up to the end of the mounting surface of the mounting substrate 341. If the cathode terminal portion is formed up to the end of the mounting surface of the mounting board 341, when the solid electrolytic capacitor is mounted on the printed board or the like by soldering, the conductive pattern of the printed board or the like, the anode terminal part 342 and the cathode A solder fillet is formed between the terminal portion 343 and the visibility of whether or not the solder connection is surely improved.
  • FIG. 12 shows an example in which such a cathode terminal portion 343 is formed up to the end portion of the mounting surface of the mounting substrate 341.
  • the cathode terminal portion 343 formed at the end portion of the mounting substrate only needs to be electrically connected to the cathode terminal portion 343 formed at the center, and even if it has a separated shape on the mounting surface. good.
  • the length of the diagonal line is about 1.4 times the length of the mounting board in the vertical or horizontal dimension. If the transmission line is formed on the diagonal line, a transmission line having a length of about 1.4 times can be theoretically formed compared to the case where the transmission line is formed in parallel to the vertical and horizontal directions of the mounting substrate. However, even if the transmission line is formed, it is necessary to electrically connect the entrance and the exit of the transmission line. Considering the space for forming the anode conductor for connecting this transmission line, the length of the transmission line is 1.1 to 1.3 times the vertical dimension of the mounting substrate.
  • the length of the distributed constant circuit is 1.0 to 1.2 times that in the case where the transmission line parallel to the two sides of the mounting substrate is formed. It is possible to form a distributed constant circuit having a length of.
  • the transmission line is constituted between the anode lead portions facing each other of the capacitor element, and the distributed constant circuit is constituted by a dielectric layer and a cathode electrode layer (solid electrolyte layer) serving as a capacitance forming portion of the capacitor element.
  • the length of the transmission line and the length of the distributed constant circuit can be changed depending on the shape and width of the capacitor element, and can be arbitrarily designed in consideration of the required capacitance and transmission line length.
  • FIG. 11 shows a modification in which the length of the transmission line and the length of the distributed constant circuit are made as long as possible by using the same mounting board. If the anode lead-out portion 322 of the capacitor element is formed in a substantially triangular shape so as to match the corner of the element mounting surface of the mounting substrate, the length of the distributed constant circuit (the cathode electrode layer of the capacitor element (solid electrolyte) The length of the layer) can be made longer.
  • a glass epoxy substrate having a thickness of about 200 ⁇ m from the viewpoint of strength but a glass epoxy substrate having a thickness of about 80 ⁇ m can also be used.
  • substrate should just have a small electrical resistance and can be soldered, and it is preferable to use copper and the conductor which plated gold on nickel.
  • the conductor can be formed with a thickness of 3 to 5 ⁇ m on one side.
  • the conductors and electrodes on both sides of the mounting board 341 and the through holes for electrically joining them can be formed by a method for producing a double-sided printed board often used in printed circuit boards. The arrangement of the through holes, the inner diameter, etc. at this time can be arbitrarily set.
  • the distance from the anode lead part and cathode lead part of the capacitor element to the anode terminal part and cathode terminal part of the mounting board that is the outlet of current can be achieved by a distance equal to the thickness of the mounting substrate, and the current path can be shortened.
  • the thickness of the mounting substrate is preferably about 200 ⁇ m, and a thickness of about 80 ⁇ m can be manufactured.
  • the capacitor The distance from the cathode lead portion of the device to the cathode terminal portion can be made extremely short.
  • the current path can be divided into four, and the substantial ESL can be reduced to 1 ⁇ 4.
  • the solid electrolytic capacitor of the present invention uses a method of reducing the length of the current path as much as possible and dividing the current path into n pieces to reduce the effective ESL to 1 / n. The effect of reduction is enhanced.
  • the cathode terminal portions 343 are formed on the four sides of the mounting surface of the mounting substrate 341, the degree of freedom of conduction with the GND line of the printed circuit board to be mounted can be increased. Further, in the conventional solid electrolytic capacitor having a five-terminal structure, it is difficult to visually confirm whether the cathode terminal portion is securely soldered, but by forming the cathode terminal portion on four sides, the conductive pattern of the printed circuit board to be mounted A solder fillet is formed between the cathode terminal portion 343 and the like, and the visibility of whether or not the solder connection is surely improved.
  • the capacitor element 320 is mounted on the mounting substrate 341, and the cathode lead-out portion 323 of the capacitor element 320 and the cathode conductor 345 of the mounting substrate are joined by a conductive adhesive. Further, the anode lead portion 322 of the capacitor element 320 and the anode conductor 344 are connected. At this time, the anode lead portion 322 of the capacitor element 320 is aluminum, and the wettability with the silver paste or the like is not good, and adhesion with the silver paste may be difficult.
  • connection member 327 such as a copper material is connected to the anode lead portion 322 of the capacitor element 320 by laser welding, ultrasonic welding, or the like, and the connection member 327 is electrically conductive such as silver paste. It is preferable to join the anode conductor 344 of the mounting substrate 341 with an adhesive.
  • the number of capacitor elements mounted on the mounting board 341 is not limited to one. When a large capacitance is required, capacitor elements can be further stacked to achieve the required capacitance.
  • the exterior is molded by exterior resin.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

L'invention porte sur un condensateur dont les caractéristiques de réponse transitoires sont excellentes par réduction de l'inductance série équivalente (ESL) d'un condensateur à électrolyte solide plus utilisation du condensateur à électrolyte solide avec la facilité d'une augmentation de capacité, et qui est disponible sous la forme d'un filtre de bruit à constante répartie et sous la forme d'un composant composite ayant deux fonctions du condensateur et du filtre de bruit à constante répartie. Deux pièces d'élément de condensateur (121) dans lesquelles les deux extrémités d'un corps d'anode sont rendues sous la forme de sections de sortie d'anode (122, 122) et deux surfaces de la partie centrale du corps d'anode sont rendues sous la forme de sections de sortie de cathode (123) sont préparées. Les deux pièces d'élément de condensateur (121, 121) sont empilées de telle manière que les sections de sortie de cathode (123, 123) se chevauchent l'une l'autre et les sections de sortie d'anode (122, 122) sont désalignées à peu près à angles droits l'une de l'autre, pour ainsi obtenir un élément de condensateur (120). En tant que substrat de montage (141), un substrat de montage (141) est préparé qui est muni de conducteurs (144, 145) compatibles avec les sections de sortie d'anode (122, 122) et les sections de sortie de cathode (123) de l'élément de condensateur sur la surface de montage et est muni de sections de borne d'anode (142) et d'une section de borne de cathode (143) sur la surface d'installation, et dans lequel les conducteurs (144, 145), les sections de borne d'anode (142) et la section de borne de cathode (143) sont soumis à une connexion par trou traversant. L'élément de condensateur (120) est monté sur le substrat de montage (141) pour créer le condensateur à électrolyte solide.
PCT/JP2010/055762 2009-03-31 2010-03-30 Condensateur à électrolyte solide WO2010113978A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2010800148456A CN102379016A (zh) 2009-03-31 2010-03-30 固体电解电容器
US13/260,149 US20120018206A1 (en) 2009-03-31 2010-03-30 Solid electrolytic capacitor

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2009-088318 2009-03-31
JP2009088318A JP2010239089A (ja) 2009-03-31 2009-03-31 固体電解コンデンサ
JP2009124737 2009-05-22
JP2009-124737 2009-05-22
JP2009228751A JP2011009683A (ja) 2009-05-22 2009-09-30 コンデンサ
JP2009-228751 2009-09-30

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WO2010113978A1 true WO2010113978A1 (fr) 2010-10-07

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003289018A (ja) * 2002-03-28 2003-10-10 Tdk Corp チップ型積層コンデンサ
WO2003107365A1 (fr) * 2002-06-18 2003-12-24 ティーディーケイ株式会社 Condensateur electrolytique solide et procede de fabrication correspondant
WO2004077466A1 (fr) * 2003-02-26 2004-09-10 Tdk Corporation Condensateur electrolytique solide
JP2005045068A (ja) * 2003-07-23 2005-02-17 Tdk Corp 固体電解コンデンサ
JP2005191466A (ja) * 2003-12-26 2005-07-14 Tdk Corp コンデンサ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003289018A (ja) * 2002-03-28 2003-10-10 Tdk Corp チップ型積層コンデンサ
WO2003107365A1 (fr) * 2002-06-18 2003-12-24 ティーディーケイ株式会社 Condensateur electrolytique solide et procede de fabrication correspondant
WO2004077466A1 (fr) * 2003-02-26 2004-09-10 Tdk Corporation Condensateur electrolytique solide
JP2005045068A (ja) * 2003-07-23 2005-02-17 Tdk Corp 固体電解コンデンサ
JP2005191466A (ja) * 2003-12-26 2005-07-14 Tdk Corp コンデンサ

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