WO2010110558A2 - 인라인 열처리 장치 - Google Patents

인라인 열처리 장치 Download PDF

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Publication number
WO2010110558A2
WO2010110558A2 PCT/KR2010/001736 KR2010001736W WO2010110558A2 WO 2010110558 A2 WO2010110558 A2 WO 2010110558A2 KR 2010001736 W KR2010001736 W KR 2010001736W WO 2010110558 A2 WO2010110558 A2 WO 2010110558A2
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WO
WIPO (PCT)
Prior art keywords
heat treatment
heater
chamber
substrate
treatment apparatus
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PCT/KR2010/001736
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English (en)
French (fr)
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WO2010110558A3 (ko
Inventor
강호영
Original Assignee
주식회사 테라세미콘
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Filing date
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Application filed by 주식회사 테라세미콘 filed Critical 주식회사 테라세미콘
Priority to JP2012501928A priority Critical patent/JP2012521653A/ja
Priority to CN2010800123656A priority patent/CN102356455A/zh
Publication of WO2010110558A2 publication Critical patent/WO2010110558A2/ko
Publication of WO2010110558A3 publication Critical patent/WO2010110558A3/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Definitions

  • the present invention relates to an inline heat treatment apparatus for a substrate. More specifically, in-line heat treatment apparatus which can perform a uniform heat treatment on the substrate by installing a heater inside the rotary shaft of the drive roller for loading and unloading the substrate into the chamber for heat treatment, and increase the space utilization inside the chamber It is about.
  • a heat treatment process is performed on the substrate.
  • LCD liquid crystal display
  • PDP plasma display panel
  • OLED organic light emitting diode
  • the substrate is loaded in a chamber using a transfer mechanism such as an end effector for heat treatment of the substrate, and then heat treatment is performed.
  • a transfer mechanism such as an end effector for heat treatment of the substrate
  • a plurality of drive rollers are continuously arranged before and after the chamber, and the substrate is loaded into the chamber by the drive rollers for heat treatment, and in-line that is unloaded by the drive rollers after the heat treatment is completed.
  • the heat treatment apparatus of the type) was disclosed.
  • the inline heat treatment apparatus has a problem in that the space of the chamber is narrowed because the devices for the operation of the driving roller and the driving roller are installed inside the chamber as well as the devices for the operation of the heater and the heater.
  • the present invention is to solve the problems of the prior art as described above, in-line heat treatment apparatus that can perform a heat treatment on the substrate by installing a heater on the rotary shaft of the drive roller for loading and unloading a large area substrate into the chamber
  • the purpose is to provide.
  • an object of the present invention is to provide an inline heat treatment apparatus capable of increasing space utilization inside a chamber by installing a heater on a rotating shaft of a driving roller for loading and unloading a substrate into a chamber.
  • the heater is installed on the rotating shaft of the drive roller disposed inside the chamber for loading and unloading the substrate, so that uniform heat supply to the substrate is possible in the heater installed at the rotating shaft, so that efficient heat treatment is achieved. It has an effect.
  • in-line heat treatment apparatus that can reduce the equipment installation space inside the chamber to improve the internal space utilization of the chamber To provide.
  • FIG. 1 is a view showing the configuration of an in-line heat treatment apparatus according to an embodiment of the present invention.
  • Figure 2 is an exploded perspective view showing the configuration of the in-line heat treatment apparatus according to an embodiment of the present invention.
  • FIG. 3 is a detailed view of portion A of FIG. 1.
  • FIG. 4 is a view showing a connection state of the rotating shaft, the drive pulley and the heater in FIG.
  • FIG. 5 is a sectional view taken along the line B-B in FIG.
  • FIG. 6 is a sectional view taken along the line C-C in FIG.
  • FIG. 7 is a view illustrating an example of a heater as a detailed view of part D of FIG. 6.
  • FIG. 8 is a diagram illustrating another example of the heater as a detailed view of part D of FIG. 6.
  • an inline heat treatment apparatus that can continuously heat treatment the substrate, the chamber providing a heat treatment space for the substrate and the opening is formed opposite to the front and rear;
  • a driving roller unit including a driving roller which moves while supporting the substrate and a rotating shaft having a hollow shape penetrating the driving roller; And a heater disposed inside the rotation shaft, wherein the driving roller unit is provided in plural along the moving direction of the substrate to load the substrate into the chamber and to unload the substrate from the chamber. Both ends are fixed to the outer wall of the chamber, characterized in that not interlocked with the operation of the rotating shaft.
  • the driving roller unit may be installed to be perpendicular to the loading and unloading direction of the substrate.
  • the plurality of driving roller units may interlock with each other.
  • An interlocking pulley installed at one end of each of the plurality of rotation shafts; And an interlocking belt for connecting the plurality of interlocking pulleys, and the plurality of driving roller units may interlock with each other as one of the plurality of interlocking pulleys is driven.
  • One end of the rotating shaft may be connected to a drive pulley for receiving an external drive force.
  • Terminals for receiving external power may be installed at both ends of the heater.
  • Fixing flanges may be installed at both ends of the heater to fix the heater to the outer wall of the chamber.
  • the heater may be heated by a pipe through which cooling water or cooling gas flows and an external power source, and a heating wire surrounding the outer circumferential surface of the tube may be installed in the heater.
  • Conductors receiving power from the outside may be installed at both ends of the heater, and a heating element may be installed at the inner center of the heater to generate heat by receiving power from the conductor.
  • the length of the heating element may be formed to correspond to the length of the substrate.
  • FIG. 1 is a view showing the configuration of an in-line heat treatment apparatus 100 according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view showing the configuration of the in-line heat treatment apparatus 100 according to an embodiment of the present invention.
  • FIG. 3 is a view illustrating a portion A of FIG. 1.
  • FIG. 4 is a view illustrating a connection state of the rotation shaft 124, the driving pulley 126, and the heater 130 in FIG. 3.
  • FIG. 5 is a cross-sectional view illustrating a cross section of the B-B line of FIG. 3.
  • FIG. 6 is a cross-sectional view showing a cross section of the C-C line of FIG.
  • FIG. 7 illustrates an example of the heater 130 as a detailed view of part D of FIG. 6.
  • FIG. 8 shows another example of the heater 130 as a detailed view of part D of FIG.
  • the inline heat treatment apparatus 100 includes a chamber 110 in which a heat treatment space is provided, and a heating heater (not shown) installed inside or outside the chamber 110 for heating a substrate (not shown). It may include a gas supply pipe (not shown) for supplying gas for the heat treatment process atmosphere composition and a gas exhaust pipe (not shown) for gas discharge.
  • a gas supply pipe (not shown) for supplying gas for the heat treatment process atmosphere composition
  • a gas exhaust pipe (not shown) for gas discharge.
  • the configuration of the heating heater, the gas supply pipe, the gas exhaust pipe is well known in the art, so a detailed description thereof will be omitted.
  • the material of the substrate loaded in the inline heat treatment apparatus 100 of the present invention is not particularly limited and may be loaded with a substrate of various materials such as glass, plastic, polymer, silicon wafer, stainless steel, and the like.
  • a description will be given assuming a rectangular glass substrate that is most commonly used in the field of flat panel displays such as LCDs and OLEDs or thin film silicon solar cells.
  • the inline heat treatment apparatus 100 of the present invention is a sheet type processing one substrate at a time, but is not necessarily limited thereto. Therefore, the inline heat treatment apparatus 100 of the present invention may be configured in a batch type capable of simultaneously processing a plurality of substrates according to the object of the present invention.
  • FIG. 1 and 2 illustrate an inla heat treatment apparatus 100 according to an embodiment of the present invention. More specifically, in FIG. 1, the direction is set to show a characteristic configuration of the inline heat treatment apparatus 100 according to an embodiment of the present invention, and FIG. 2 is an inline heat treatment apparatus according to an embodiment of the present invention. The configuration of 100 is shown in an exploded manner.
  • the inline heat treatment apparatus 100 may include a chamber 110.
  • the chamber 110 may be configured to substantially seal an inner space while the heat treatment process is performed to provide a space for heat treating the substrate.
  • the shape of the chamber 110 is not limited to a particular shape, but is preferably a rectangular parallelepiped, as shown in FIGS. 1 and 2.
  • a first opening 112 having a predetermined width and height may be formed on the front surface of the chamber 110.
  • the first opening 112 may serve as a passage through which the substrate is loaded. Since the first opening 112 needs to be blocked to seal the inside of the chamber 110 while the heat treatment process is performed, a door (not shown) that opens and closes in the vertical direction may be installed in the first opening 112. .
  • a second opening 114 having a predetermined width and height may be formed on the rear surface of the chamber 110 (that is, the opposite side of the first opening 112).
  • the second opening 114 may serve as a passage through which the substrate is unloaded.
  • the second opening 114 needs to be blocked to seal the inside of the chamber 110 while the heat treatment process is performed, and thus the second opening 114 is opened and closed in the vertical direction.
  • a door (not shown) may be installed.
  • a third opening 116 having a predetermined width and height may be formed on the upper surface of the chamber 110.
  • repair and replacement of components for example, a gas supply pipe and a gas exhaust pipe
  • the third opening 116 may need to be blocked for the interior of the chamber 110 to be sealed during the heat treatment process.
  • An openable cover may be installed.
  • a frame (not shown) supporting the chamber 110 may be installed below the chamber 110.
  • the material of the frame is preferably stainless steel, but is not necessarily limited thereto.
  • the inline heat treatment apparatus 100 may include a plurality of driving roller units installed in the chamber 110 along a moving direction of the substrate. 120 may be configured to be included.
  • the plurality of driving roller units 120 move the substrate loaded through the first opening 112, support the substrate during the heat treatment of the substrate, and the second opening 114 to unload the substrate after the heat treatment is completed. ) To perform the function.
  • the plurality of drive roller unit 120 is preferably installed in a direction perpendicular to the loading and unloading direction of the substrate. Also, in a similar sense, the plurality of driving roller units 120 may be installed at the same height inside the chamber 110.
  • the in-line heat treatment apparatus 100 may further include a linkage pulley 140 and the linkage belt 142, which will be described later.
  • a separate driving roller unit (not shown) different from the driving roller unit 120 installed inside the chamber 110 is provided at the front and rear of the chamber 110.
  • a plurality of first openings 112 and the second opening 114 may be provided outside.
  • Such a separate driving roller unit may perform a function to facilitate loading and unloading of the substrate into the chamber 110. To multiply these functions.
  • the driving roller unit 120 and the separate driving roller unit installed in the chamber 110 are interlocked with each other.
  • the driving roller unit 120 may include a driving roller 122 and a rotating shaft 124.
  • the driving roller 122 may be formed along the outer circumferential surface of the rotating shaft 124, which will be described later, to be in contact with the lower surface of the substrate and to move and support the substrate. As shown in FIG. 2, a plurality of driving rollers 122 may be included in each driving roller unit 120. Accordingly, the movement and support of the substrate can be made more stable by the driving roller 122.
  • the plurality of driving rollers 122 included in each of the driving roller units 120 may be formed to have different widths according to the installation positions. It may be, but the diameter is preferably all formed the same.
  • the number of the driving rollers 122 included in each driving roller unit 120 is preferably determined in a range capable of stable movement and support of the substrate to be loaded.
  • the departure prevention step 122a may serve to prevent the substrate from being separated from the normal position.
  • the rotation shaft 124 may be installed to penetrate the central axis of the driving roller 122 to perform a function of rotating the driving roller 122. More specifically, the rotation shaft 124 may receive a driving force from the outside to rotate about its longitudinal axis, thereby rotating the driving roller 122 formed along its outer circumferential surface.
  • both ends of the rotation shaft 124 may be rotatably connected to both walls of the chamber 110 via a mechanism such as a fixing flange 134 described later.
  • the driving pulley 126 may be installed at one end of the rotating shaft 124.
  • the drive pulley 126 may perform a function of transmitting a rotational driving force to the rotation shaft 124.
  • the driving force of the motor 150 may be received by the motor pulley 152 and the driving belt 128, and the driving force may be transmitted to the rotation shaft 124.
  • the drive pulley 126 may be installed at any position of the rotation shaft 124, but may be preferably installed at one end of the rotation shaft 124 extending out of the chamber 110 as shown in FIG. 4. More specifically, one end of the rotating shaft 124 may be extended to the outside of the chamber 110 through one side wall of the chamber 110, the driving pulley 126 to receive the driving force from the outside to the extended portion so ) Can be installed.
  • the driving pulley 126 may be installed at one end of each rotation shaft 124, but preferably may be installed on any one rotation shaft 124 of the plurality of rotation shaft 124 as shown in FIG. .
  • the reason for installing in this way is to facilitate the interlocking of the plurality of driving roller units 120. Interlocking of the driving roller unit 120 may be further embodied by the following configuration.
  • the inline heat treatment apparatus 100 may further include an interlocking pulley 140 and an interlocking belt 142.
  • the interlocking pulley 140 may be installed at one end of each of the plurality of rotation shafts 124 to perform a function of allowing the driving roller unit 120 to interlock.
  • the interlocking belt 142 may be installed to contact the outer circumferential surfaces of the plurality of interlocking pulleys 140 to perform a function of connecting the plurality of interlocking pulleys 140 with each other.
  • the mechanism by which the drive roller unit 120 interlocks by the interlocking pulley 140 and the interlocking belt 142 is as follows. First, when any one of the plurality of interlocking pulleys 140 is driven by receiving a driving force from the outside, the interlocking belt 142 in contact with the outer peripheral surface is driven. Accordingly, the other interlocking pulley 140 in contact with the interlocking belt 142 is sequentially driven, and as a result, the plurality of driving roller units 120 interlock with each other.
  • all the driving roller units 120 can interlock with each other when a driving force is transmitted to only one of the interlocking pulleys 140.
  • the transmission of the driving force is preferably performed by the driving pulley 126.
  • the driving pulley 126 is installed only on any one rotation shaft 124 of the plurality of rotation shafts 124. It is preferable.
  • the driving pulley 126 and the interlocking pulley 140 may be formed adjacent to each other.
  • the fixing bracket 160 bent in a 'c' shape may be installed on the outer wall of the chamber 110.
  • the fixing bracket 160 may be rotatably coupled to the rotating shaft 124 extending to the outside of the chamber 110, and a hole 162 through which the driving belt 128 passes may be formed at a lower portion thereof. Accordingly, the driving force of the motor 150 is transmitted to the drive pulley 126 through the drive belt 128 so that the rotation shaft 124 can smoothly rotate.
  • the fixing bracket 160 may have open both sides. Accordingly, the interlocking belt 142 can be passed through the open both sides of the fixing bracket 160, the linkage of the drive roller unit 120 can be made more smoothly.
  • the tension pulley 154 for adjusting the tension of the interlocking belt 142 is further installed in the chamber 110.
  • the tension pulley 154 is in close contact with the interlock belt 142 and adjusts the tension of the interlock belt 142 so that the driving force is easily transmitted. It is preferable that the tension pulley 154 is configured in plural and in close contact with the interlock belt 142 at a position between the plurality of interlock pulleys 140.
  • the rotary shaft 124 can be rotated by receiving an external driving force, and the plurality of rotary shafts 124 can be interlocked with each other, the components employed in the present invention and the operation thereof are not limited to the above. No.
  • the rotating shaft 124 may perform not only a function of rotating the driving roller 122, but also a function of providing a space for installing the heater 130 therein.
  • the rotation shaft 124 may be formed in a hollow shape in which a space is formed inward along the central axis.
  • a heater 130 which is a characteristic configuration of the present invention will be described.
  • the inline heat treatment apparatus 100 may include a heater 130.
  • the heater 130 may perform a function of generating heat by the power supplied from the outside and applying the heat to the substrate.
  • the heater 130 is disposed in the inner space of the rotating shaft 124, thereby enabling efficient heat treatment of the substrate, it is possible to maximize the space utilization in the chamber 110.
  • both ends of the heater 130 are fixed to both outer walls of the chamber 110. This is to prevent the heater 130 from being rotated even when the rotating shaft 124 is rotated to move the substrate, so as to facilitate maintenance of the heater 130 connected to the external terminal 132 and the like described later.
  • the heater 130 is disposed in the inner space of the rotation shaft 124, the length may be formed longer than the rotation shaft 124. Accordingly, both ends of the heater 130 are extended to the outside of the chamber 110 through both ends of the rotating shaft 124, so that both ends of the extended heater 130 can be fixed to both outer walls of the chamber 110. do.
  • Fixing flanges 134 may be installed at both ends of the heater 130 to fix the heater 130 to both outer walls of the chamber 110.
  • the fixing flange 134 may fix both ends of the heater 130 protruding from the rotation shaft 124 so that the heater 130 does not rotate even when the rotation shaft 124 rotates.
  • the fixing flange 134 may be positioned on the side of the fixing bracket 160 installed on the outer wall of the chamber 110 as shown in FIG. 3. have.
  • the terminal 132 may be installed at the extended portions of both ends of the heater 130.
  • the terminal 132 may perform a function of transferring external power to the heater 130 to allow the heater 130 to generate heat.
  • the terminal 132 used in the present invention is not particularly limited and various types of terminals may be used.
  • the heater 130 according to an embodiment of the present invention, the cooling water or the cooling gas flows in the tube is installed therein, the outer circumferential surface of the tube is configured to be installed in the form of heating wire to generate heat by an external power source. Can be. If it can be configured in this way, the specific configuration inside the heater 130 is not particularly limited, but preferably may be configured as shown in FIG.
  • an outer circumferential surface of the first tube 130a and the first tube 130a having a hollow shape is surrounded and spaced apart from the first tube 130a by a predetermined distance.
  • tube 130b used is arrange
  • the outer circumferential surface of the second tube 130b is also spaced apart from the inner circumferential surface of the rotation shaft 124 by a predetermined distance.
  • the first tube (a) may be spaced apart from the space between the first tube 130a and the second tube 130b.
  • a coil-type hot wire (not shown) surrounding 130a is disposed.
  • heat generated in the hot wire is applied to the substrate supported by the drive roller 122, so that the substrate can be subjected to heat treatment.
  • the cooling water or the cooling gas may flow to the inside of the first tube 130a to unload the substrate, thereby rapidly cooling the inside of the chamber 110.
  • the material of the heating wire may include nichrome
  • the material of the first and second tubes 130a and 130b may include quartz.
  • a configuration in which the cooling water or the cooling gas is supplied and flows to the first pipe 130a may use the configurations disclosed in Korean Patent Application No. 2008-110813 and Korean Patent Application No. 2008-110814.
  • the heater 130 may be configured such that the conductor 130d is installed at both ends thereof, and the heating element 130c is installed at the center thereof. More specifically, referring to FIG. 8, a conductor 130d receiving external power through the terminal 132 is installed at both ends of the heater 130, and is supplied from the conductor 130d at the center of the heater 130.
  • a heating element 130c may be installed to generate heat with the received power and apply the heat to the substrate. By adopting such a configuration, heat can be preferentially generated in the heating element 130c, so that the substrate can be heat treated efficiently.
  • the material of the heating element 130c may include nichrome or Kanthal, and the material of the conductor 130d may include stainless steel (SUS).
  • the heating element 130c may be configured to correspond to the length of the substrate.
  • the heat treatment for the substrate by the heat generated by the heater 130 when the heat treatment for the substrate by the heat generated by the heater 130 is progressed, since the plate surface of the substrate is located in parallel with the heater 130, the heat generated from the heater 130 is uniformly applied to the entire substrate Uniform heat treatment can be achieved.
  • the heater 130 is disposed inside the rotating shaft 124, a space for installing the heater 130 in the chamber 110 may be reduced.

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Abstract

열처리를 위해 기판을 챔버로 로딩 및 언로딩하는 구동 롤러의 회전축에 히터를 설치하여 기판에 대한 균일한 열처리를 수행할 수 있고 챔버 내부의 공간 활용도를 높일 수 있는 인라인 열처리 장치가 개시된다. 본 발명에 따른 인라인 열처리 장치는, 기판을 연속적으로 열처리할 수 있는 인라인 열처리 장치로서, 기판에 대한 열처리 공간을 제공하며 전후에 개구가 대향하여 형성되어 있는 챔버(110); 기판을 지지하면서 이동시키는 구동 롤러(122)와 구동 롤러(122)를 관통하는 중공 형태의 회전축(124)을 포함하는 구동 롤러 유닛(120); 및 회전축(124)의 내측에 배치되는 히터(130)를 포함하고, 구동 롤러 유닛(120)은 기판의 이동 방향을 따라 복수개로 설치되어 챔버(110)로 기판을 로딩 및 챔버(110)로부터 기판을 언로딩하며, 히터(130)의 양단은 챔버(110)의 외벽에 고정되어 회전축(124)의 동작과 연동되지 않는 것을 특징으로 한다.

Description

인라인 열처리 장치
본 발명은 기판에 대한 인라인 열처리 장치에 관한 것이다. 보다 상세하게는, 열처리를 위해 기판을 챔버로 로딩 및 언로딩하는 구동 롤러의 회전축 내부에 히터를 설치하여 기판에 대한 균일한 열처리를 수행할 수 있고 챔버 내부의 공간 활용도를 높일 수 있는 인라인 열처리 장치에 관한 것이다.
기판을 사용하여 LCD(Liquid Crystal Display), PDP(Plasma Display Panel) 및 OLED (Organic Light Emitting Diode) 등 평면 디스플레이를 제작하는 경우, 기판에 대하여 열처리 공정을 수행한다.
이를 위하여 종래에는 기판의 열처리를 위해 엔드 이펙터와 같은 이송 기구를 사용하여 챔버에 기판을 로딩한 후 열처리를 수행하였다. 그러나, 근래에 기판이 점차 대면적화 되고 있어 엔드 이펙터를 이용한 기판의 로딩 작업시 기판이 변형되거나 손상을 입는 등의 문제점이 대두되었다.
이러한 문제점을 해결하기 위하여 복수개의 구동 롤러를 챔버의 전후에 연속적으로 배치하고, 기판은 구동 롤러에 의해 챔버로 로딩되어 열처리 되도록 하며, 열처리가 종료되면 구동 롤러에 의해 언로딩되는 인라인(in-line) 방식의 열처리 장치가 개시되었다.
하지만 인라인 열처리 장치는 챔버의 내측에 구동 롤러와 구동 롤러의 동작을 위한 기기들이 설치될 뿐만 아니라 히터와 히터의 동작을 위한 기기들이 설치되므로 챔버의 공간이 협소해지는 문제점이 있었다.
챔버의 공간 확보를 위해서 챔버의 크기를 증대시키면 챔버의 제작비가 상승되는 문제점이 있었다.
또한, 대면적인 기판에 대한 균일한 열처리를 위해 챔버 내부에 히터를 균일하게 설치할 필요가 있으나, 챔버의 내부 공간이 협소해지는 문제가 있어 히터의 설치가 어려운 문제점이 있었다.
이에 본 발명은 상기와 같은 종래기술의 문제점을 해결하기 위한 것으로서, 대면적 기판을 챔버로 로딩 및 언로딩하는 구동 롤러의 회전축에 히터를 설치하여 기판에 대한 효율적인 열처리를 수행할 수 있는 인라인 열처리 장치를 제공하는 것을 목적으로 한다.
또한, 기판을 챔버로 로딩 및 언로딩하는 구동 롤러의 회전축에 히터를 설치함으로써 챔버 내부의 공간 활용도를 높일 수 있는 인라인 열처리 장치를 제공하는 것을 목적으로 한다.
상기와 같이 구성된 본 발명에 따르면, 챔버의 내측에 배치되어 기판을 로딩 및 언로딩하는 구동 롤러의 회전축에 히터가 설치되어 있어 회전축에서 설치된 히터에서 기판에 대하여 균일한 열 공급이 가능하므로 효율적인 열처리가 이루어지는 효과가 있다.
또한, 본 발명에 따르면, 대면적 기판을 챔버로 로딩 및 언로딩하는 구동 롤러의 회전축 내부에 히터를 설치함으로써 챔버 내부의 기기 설치 공간을 감소시켜 챔버의 내부 공간 활용도를 향상시킬 수 있는 인라인 열처리 장치를 제공하는 데 있다.
도 1은 본 발명의 일 실시예에 따른 인라인 열처리 장치의 구성을 나타내는 도면이다.
도 2는 본 발명의 일 실시예에 따른 인라인 열처리 장치의 구성을 나타내는 분해 사시도이다.
도 3은 도 1의 A 부분의 상세도면이다.
도 4는 도 3에서 회전축, 구동 풀리 및 히터의 연결 상태를 나타내는 도면이다.
도 5는 도 3의 B-B 선의 선단면도이다.
도 6은 도 1의 C-C 선의 선단면도이다.
도 7은 도 6의 D 부분의 상세도면으로서 히터의 일 예를 나타내는 도면이다.
도 8은 도 6의 D 부분의 상세도면으로서 히터의 다른 예를 나타내는 도면이다.
<도면의 주요 부분에 대한 부호의 설명>
100: 인라인 열처리 장치
110: 챔버
112: 제1 개구
114: 제2 개구
116: 제3 개구
120: 구동 롤러 유닛
122: 구동 롤러
124: 회전축
126: 구동 풀리
128: 구동 벨트
130: 히터
132: 단자
134: 고정 플랜지
140: 연동 풀리
142: 연동 벨트
150: 모터
152: 모터 풀리
154: 텐션 풀리
160: 고정 브라켓
162: 홀
상술한 목적을 달성하기 위하여 본 발명에 따른 인라인 열처리 장치는, 기판을 연속적으로 열처리할 수 있는 인라인 열처리 장치로서, 상기 기판에 대한 열처리 공간을 제공하며 전후에 개구가 대향하여 형성되어 있는 챔버; 상기 기판을 지지하면서 이동시키는 구동 롤러와 상기 구동 롤러를 관통하는 중공 형태의 회전축을 포함하는 구동 롤러 유닛; 및 상기 회전축의 내측에 배치되는 히터 를 포함하고, 상기 구동 롤러 유닛은 상기 기판의 이동 방향을 따라 복수개로 설치되어 상기 챔버로 상기 기판을 로딩 및 상기 챔버로부터 상기 기판을 언로딩하며, 상기 히터의 양단은 상기 챔버의 외벽에 고정되어 상기 회전축의 동작과 연동되지 않는 것을 특징으로 한다.
상기 구동 롤러 유닛은 상기 기판의 로딩 및 언로딩 방향에 대하여 직교하여 설치될 수 있다.
상기 복수개의 구동 롤러 유닛은 서로 연동할 수 있다.
상기 복수개의 회전축 각각의 일단에 설치되는 연동 풀리; 및 상기 복수개의 연동 풀리를 연결시키는 연동 벨트를 더 포함하며, 상기 복수개의 연동 풀리 중에서 어느 하나가 구동됨에 따라 상기 복수개의 구동 롤러 유닛이 서로 연동할 수 있다.
상기 회전축의 일단에는 외부의 구동력을 공급받기 위한 구동 풀리가 연결될 수 있다.
상기 히터의 양단에는 외부의 전원을 공급받기 위한 단자가 설치될 수 있다.
상기 히터의 양단에는 상기 히터를 상기 챔버의 외벽에 고정시키는 고정 플랜지가 설치될 수 있다.
상기 히터의 내부에는 냉각 용수 또는 냉각 가스가 흐르는 관 및 외부 전원에 의하여 발열하며 상기 관의 외주면을 감싸는 열선이 설치될 수 있다.
상기 히터의 내부 양단에는 외부로부터 전원을 공급받는 전도체가 설치되며 상기 히터의 내부 중앙에는 상기 전도체로부터 전원을 전달받아 발열하는 발열체가 설치될 수 있다
상기 발열체의 길이는 상기 기판의 길이에 대응되게 형성될 수 있다.
이하 첨부된 도면을 참조하여 본 발명의 구성을 상세하게 설명하도록 한다.
도 1은 본 발명의 일 실시예에 따른 인라인 열처리 장치(100)의 구성을 나타내는 도면이다.
도 2는 본 발명의 일 실시예에 따른 인라인 열처리 장치(100)의 구성을 나타내는 분해 사시도이다.
도 3은 도 1의 A 부분을 나타내는 도면이다.
도 4는 도 3에서 회전축(124), 구동 풀리(126) 및 히터(130)의 연결 상태를 나타내는 도면이다.
도 5는 도 3의 B-B 선의 단면을 나타내는 선단면도이다.
도 6은 도 1의 C-C 선의 단면을 나타내는 선단면도이다.
도 7은 도 6의 D 부분의 상세도면으로서 히터(130)의 일 예를 나타낸다.
도 8은 도 6의 D 부분의 상세도면으로서 히터(130)의 다른 예를 나타낸다.
먼저, 본 발명의 인라인 열처리 장치(100)는 내부에 열처리 공간이 제공되는 챔버(110), 기판(미도시)을 가열하기 위한 챔버(110)의 내부 또는 외부에 설치되는 가열 히터(미도시), 열처리 공정 분위기 조성을 위한 가스를 공급하는 가스 공급관(미도시) 및 가스 배출을 위한 가스 배기관(미도시)을 포함하여 구성될 수 있다. 여기서 가열 히터, 가스 공급관, 가스 배기관의 구성은 이 분야에서는 널리 알려져 있는 공지 기술이므로 이에 대한 상세한 설명은 생략한다.
또한, 본 발명의 인라인 열처리 장치(100)에 로딩되는 기판의 재질은 특별히 제한되지 않으며 글래스, 플라스틱, 폴리머, 실리콘 웨이퍼, 스테인레스 스틸 등 다양한 재질의 기판이 로딩될 수 있다. 이하에서는 LCD나 OLED와 같은 평판 디스플레이나 박막형 실리콘 태양전지 분야에 가장 일반적으로 사용되는 직사각형 형상의 글래스 기판을 상정하여 설명한다.
또한, 도 1 내지 도 8에는 본 발명의 인라인 열처리 장치(100)가 한 번에 한 개의 기판을 처리하는 매엽식인 것으로 도시되어 있으나 반드시 이에 한정되지는 아니한다. 따라서, 본 발명의 인라인 열처리 장치(100)는 본 발명이 이용되는 목적에 따라 복수개의 기판을 동시에 처리할 수 있는 배치식으로 구성될 수도 있다.
도 1 및 도 2에서는 본 발명의 일 실시예에 따른 인라의 열처리 장치(100)를 도시하고 있다. 보다 구체적으로, 도 1에서는 본 발명의 일 실시예에 따른 인라인 열처리 장치(100)의 특징적인 구성이 부각되도록 방향을 설정하여 도시하고 있고, 도 2는 본 발명의 일 실시예에 따른 인라인 열처리 장치(100)의 구성을 분해하여 도시하고 있다.
도 1 및 도 2를 참조하면, 본 발명의 일 실시예에 따른 인라인 열처리 장치(100)는 챔버(110)를 포함하여 구성될 수 있다. 챔버(110)는 열처리 공정이 수행되는 동안 실질적으로 내부 공간이 밀폐되도록 구성되어 기판을 열처리하기 위한 공간을 제공하는 기능을 수행할 수 있다. 챔버(110)의 형상은 특별한 형태로 제한되지 아니하나, 도 1 및 도 2에 도시된 바와 같이, 직육면체인 것이 바람직하다.
도 1 및 도 2를 더 참조하면, 챔버(110)의 전면에는 소정의 너비와 높이를 가지는 제1 개구(112)가 형성될 수 있다. 이러한 제1 개구(112)는 기판이 로딩되는 통로로서의 역할을 수행할 수 있다. 열처리 공정이 수행되는 동안에는 챔버(110) 내부의 밀폐를 위하여 제1 개구(112)가 차단될 필요가 있으므로, 제1 개구(112)에는 상하 방향으로 개폐되는 도어(미도시)가 설치될 수 있다.
도 1 및 도 2를 더 참조하면, 챔버(110)의 후면(즉, 제1 개구(112)의 반대측)에는 소정의 너비와 높이를 가지는 제2 개구(114)가 형성될 수 있다. 이러한 제2 개구(114)는 기판이 언로딩되는 통로로서의 역할을 수행할 수 있다. 제1 개구(112)와 유사하게, 열처리 공정이 수행되는 동안에는 챔버(110) 내부의 밀폐를 위하여 제2 개구(114)가 차단될 필요가 있으므로, 제2 개구(114)에는 상하 방향으로 개폐되는 도어(미도시)가 설치될 수 있다.
도 1 및 도 2를 더 참조하면, 챔버(110)의 상부면에는 소정의 너비와 높이를 가지는 제3 개구(116)가 형성될 수 있다. 이러한 제3 개구(116)를 통해서는 챔버(110)의 내부에 설치되는 구성요소(예를 들어, 가스 공급관 및 가스 배기관 등)의 수리 및 교체가 이루어 질 수 있다. 제1 및 제2 개구(112, 114)와 유사하게, 열처리 공정이 수행되는 동안에는 챔버(110) 내부의 밀폐를 위하여 제3 개구(116)가 차단될 필요가 있으므로, 제3 개구(116)에는 개폐 가능한 커버가 설치될 수 있다.
한편, 도 1 및 도 2에는 도시되지 않았지만, 챔버(110)의 하측에는 챔버(110)를 지지하는 프레임(미도시)이 설치될 수 있다. 이러한 프레임의 재질은 스테인레스 스틸인 것이 바람직하나 반드시 이에 한정되는 것은 아니다.
다음으로, 도 1 및 도 2를 더 참조하면, 본 발명의 일 실시예에 따른 인라인 열처리 장치(100)는 기판의 이동 방향을 따라 챔버(110)의 내부에 복수개로 설치되는 복수개의 구동 롤러 유닛(120)을 포함하여 구성될 수 있다. 이러한 복수개의 구동 롤러 유닛(120)은 제1 개구(112)를 통해 로딩된 기판을 이동시키고, 기판에 대한 열처리 도중 기판을 지지하며, 열처리가 종료된 기판을 언로딩하기 위해 제2 개구(114)로 이동시키는 기능을 수행할 수 있다.
이러한 기능을 원활하게 수행하기 위하여, 도 1 및 도 2에 도시된 바와 같이, 복수개의 구동 롤러 유닛(120)은 기판의 로딩 및 언로딩 방향에 대하여 직교하는 방향으로 설치되는 것이 바람직하다. 또한, 유사한 의미에서, 복수개의 구동 롤러 유닛(120)은 챔버(110) 내부에 동일한 높이로 설치되는 것이 바람직하다.
또한, 유사한 의미에서, 복수개의 구동 롤러 유닛(120)은 연동하는(즉, 어느 하나의 구동 롤러 유닛(120)이 동작하면 다른 구동 롤러 유닛(120)도 함께 동작하는) 것이 바람직하다. 이를 위하여, 인라인 열처리 장치(100)는 연동 풀리(140) 및 연동 벨트(142)를 더 포함하여 구성될 수 있는데, 이에 대해서는 후술하도록 하겠다.
또한, 도 1 및 도 2에는 도시되지 않았지만, 챔버(110) 내부에 설치되는 구동 롤러 유닛(120)과는 다른 별도의 구동 롤러 유닛(미도시)이 챔버(110)의 전방과 후방 즉, 제1 개구(112)와 제2 개구(114) 외측에 각각 복수개로 설치될 수 있다. 이러한 별도의 구동 롤러 유닛은 챔버(110)로의 기판의 로딩 및 언로딩이 용이하게 이루어지도록 하는 기능을 수행할 수 있다. 이러한 기능을 배가시키기 위하여. 챔버(110) 내부에 설치되는 구동 롤러 유닛(120)과 별도의 구동 롤러 유닛은 서로 연동되는 것이 바람직하다.
한편, 도 1 및 도 2를 더 참조하면, 구동 롤러 유닛(120)은 구동 롤러(122) 및 회전축(124)을 포함하여 구성될 수 있다.
먼저, 구동 롤러(122)는 후술하는 회전축(124)의 외주면을 따라 형성되어 기판의 하면과 접촉하며 기판을 이동 및 지지시키는 기능을 수행할 수 있다. 도 2에 도시된 바와 같이, 구동 롤러(122)는 각 구동 롤러 유닛(120)에 복수개로 포함되는 것이 바람직하다. 이에 따라, 구동 롤러(122)에 의하여 기판의 이동 및 지지가 보다 안정적으로 이루어질 수 있게 된다.
이처럼 구동 롤러(122)가 각 구동 롤러 유닛(120)에 복수개로 포함되는 경우, 각 구동 롤러 유닛(120)에 포함되는 복수개의 구동 롤러(122)는, 설치 위치에 따라 서로 다른 폭으로 형성될 수 있으나, 직경은 모두 동일하게 형성되는 것이 바람직하다. 또한, 각 구동 롤러 유닛(120)에 포함되는 구동 롤러(122)의 개수는 로딩되는 기판의 안정적인 이동과 지지를 할 수 있는 범위에서 결정되는 것이 바람직하다.
한편, 도 7 및 도 8에 도시된 바와 같이, 각 구동 롤러 유닛(120)에 포함되는 복수개의 구동 롤러(122) 중에서, 양측 외곽에 배치되는 구동 롤러(122)의 외주면 일측에는 이탈 방지턱(122a)이 형성될 수 있다. 이러한 이탈 방지턱(122a)은 기판이 정규 위치에서 이탈하는 것을 방지하는 기능을 수행할 수 있다.
다음으로, 회전축(124)은 구동 롤러(122)의 중심축을 관통하도록 설치되어 구동 롤러(122)를 회전시키는 기능을 수행할 수 있다. 보다 구체적으로, 회전축(124)은 외부로부터 구동력을 전달받아 그 길이 방향 축을 중심으로 회전하여, 그 외주면을 따라 형성되는 구동 롤러(122)를 회전시키는 기능을 수행할 수 있다.
구동 롤러(122)를 회전시키기 위하여, 회전축(124)의 양단은 후술하는 고정 플랜지(134)와 같은 기구를 매개로 챔버(110)의 양측 벽에 회전 가능하게 연결될 수 있다. 또한, 외부로부터 구동력을 전달받기 위하여, 회전축(124)의 일단에는 구동 풀리(126)가 설치될 수 있다. 구동 풀리(126)는 회전 구동력을 회전축(124)으로 전달하는 기능을 수행할 수 있는데. 예를 들어, 도 4에 도시된 바와 같이 모터 풀리(152) 및 구동 벨트(128)에 의해 모터(150)의 구동력을 전달받고 그 구동력을 회전축(124)으로 전달하는 기능을 수행할 수 있다.
구동 풀리(126)는 회전축(124)의 어느 위치에도 설치될 수 있으나, 바람직하게는 도 4에 도시된 바와 같이 챔버(110)의 외부로 연장된 회전축(124)의 일단에 설치될 수 있다. 보다 구체적으로, 회전축(124)의 일단은 챔버(110)의 일측 벽을 통해 챔버(110)의 외부로 길게 연장될 수 있는데, 이렇게 연장된 부위에 외부에서 구동력을 전달받을 수 있도록 구동 풀리(126)가 설치될 수 있다.
또한, 구동 풀리(126)는 각 회전축(124)의 일단에 설치될 수도 있으나, 바람직하게는 도 2에 도시된 바와 같이 복수개의 회전축(124) 중에서 어느 하나의 회전축(124)에 설치될 수 있다. 이와 같이 설치하는 이유는 복수개의 구동 롤러 유닛(120)을 서로 연동시키기 용이하게 하기 위함이다. 이러한 구동 롤러 유닛(120)의 연동은 다음과 같은 구성에 의해서 더욱 구체화될 수 있다.
도 4를 참조하면, 앞서 언급한 바와 같이, 인라인 열처리 장치(100)는 연동 풀리(140) 및 연동 벨트(142)를 더 포함하여 구성될 수 있다. 연동 풀리(140)는 복수개의 회전축(124) 각각의 일단에 설치되어 구동 롤러 유닛(120)이 연동할 수 있도록 하는 기능을 수행할 수 있으며. 연동 벨트(142)는 복수개의 연동 풀리(140)의 외주면에 접촉하도록 설치되어 복수개의 연동 풀리(140)를 서로 연결시키는 기능을 수행할 수 있다.
이러한 연동 풀리(140)와 연동 벨트(142)에 의하여 구동 롤러 유닛(120)이 연동하는 메커니즘은 다음과 같다. 먼저, 복수개의 연동 풀리(140) 중에서 어느 하나의 연동 풀리(140)가 외부로부터 구동력을 전달받아 구동하면, 그 외주면과 접촉하고 있는 연동 벨트(142)가 구동한다. 이에 따라, 연동 벨트(142)와 접촉하고 있는 다른 연동 풀리(140)가 순차적으로 구동하게 되며, 결과적으로 복수개의 구동 롤러 유닛(120)이 서로 연동하게 된다.
이러한 메커니즘을 살펴보면, 어느 하나의 연동 풀리(140)에만 구동력이 전달되면 모든 구동 롤러 유닛(120)이 서로 연동할 수 있음을 알 수 있다. 이러한 구동력의 전달은 도 4에 도시된 바와 같이 구동 풀리(126)에 의하여 수행되는 것이 바람직한데, 결과적으로 구동 풀리(126)는 복수개의 회전축(124) 중에서 어느 하나의 회전축(124)에만 설치되는 것이 바람직하다.
이때 도 4에 도시된 바와 같이 구동 풀리(126)와 연동 풀리(140)는 서로 인접하여 형성될 수 있다. 이 경우, 구동 풀리(126) 및 연동 풀리(140)의 구동 메커니즘을 고려하여, 'ㄷ' 형태로 절곡된 고정 브라켓(160)이 챔버(110)의 외벽에 설치될 수 있다. 고정 브라켓(160)은 챔버(110)의 외부로 연장되는 회전축(124)과 회전 가능하게 결합될 수 있으며 그 하부에는 구동 벨트(128)가 통과하는 홀(162)이 형성될 수 있다. 이에 따라, 모터(150)의 구동력이 구동 벨트(128)를 매개로 구동 풀리(126)에 전달되어 회전축(124)이 원활하게 회전할 수 있게 된다. 또한, 고정 브라켓(160)은 개방된 양면을 가질 수 있다. 이에 따라, 연동 벨트(142)가 고정 브라켓(160)의 개방된 양면을 통하여 통과될 수 있게 되며, 구동 롤러 유닛(120)의 연동이 보다 원활하게 이루어질 수 있게 된다.
한편, 연동 풀리(140)와 연동 벨트(142)에 의하여 구동 롤러 유닛(120)이 연동하는 경우, 챔버(110)에는 연동 벨트(142)의 텐션을 조절하기 위한 텐션 풀리(154)가 더 설치될 수 있다. 도 4에 도시된 바와 같이, 텐션 풀리(154)는 연동 벨트(142)와 밀착하며 연동 벨트(142)의 텐션을 조절하여 구동력 전달이 용이하게 이루어지도록 한다. 텐션 풀리(154)는 복수개로 구성되어 복수개의 연동 풀리(140) 사이의 위치에서 연동 벨트(142)에 밀착되는 것이 바람직하다.
물론, 외부의 구동력을 전달받아 회전축(124)이 회전될 수 있고, 또한 복수개의 회전축(124)이 서로 연동될 수 있다면, 본 발명에 채용되는 구성 요소 및 이에 의한 동작 등은 상술한 바에 한정되지 아니한다.
한편, 회전축(124)은 구동 롤러(122)를 회전시키는 기능뿐만 아니라, 그 내부에 히터(130)가 설치되기 위한 공간을 제공하는 기능도 수행할 수 있다. 이를 위하여, 도 5에 도시된 바와 같이, 회전축(124)은 중심축을 따라 내측으로 공간이 형성되어 있는 중공 형태로 형성될 수 있다. 이하에서는 본 발명의 특징적 구성인 히터(130)에 대해서 살펴보기로 한다.
도 5를 참조하면, 본 발명의 일 실시예에 따른 인라인 열처리 장치(100)는 히터(130)를 포함하여 구성될 수 있다. 히터(130)는 외부에서 공급되는 전원에 의해 열을 발생시켜 기판으로 인가하는 기능을 수행할 수 있다. 이러한 히터(130)는 회전축(124)의 내측 공간에 배치되는데, 이에 따라, 기판에 대한 효율적인 열처리를 수행할 수 있게 되며, 챔버(110) 내부의 공간 활용도를 극대화할 수 있게 된다.
또한, 도 5를 참조하면, 히터(130)의 양단은 챔버(110)의 양측 외벽에 고정된다. 이는, 회전축(124)이 기판의 이동을 위하여 회전될 때에도 히터(130)는 회전되지 않도록 하여, 후술하는 외부 단자(132) 등과 연결되는 히터(130)의 유지보수를 용이하게 하기 위함이다. 이를 위하여, 히터(130)는 회전축(124)의 내측 공간에 배치되되, 그 길이는 회전축(124) 보다 길게 형성될 수 있다. 이에 따라, 히터(130)의 양단은 회전축(124)의 양단을 통해 챔버(110) 외부로 연장되게 되는데, 이렇게 연장된 히터(130)의 양단이 챔버(110)의 양측 외벽에 고정될 수 있게 된다.
히터(130)를 챔버(110)의 양측 외벽에 고정시키기 위하여 히터(130)의 양단에는 고정 플랜지(134)가 설치될 수 있다. 고정 플랜지(134)는 회전축(124)으로부터 돌출된 히터(130)의 양단을 고정하여 회전축(124)이 회전하여도 히터(130)가 회전하지 않도록 하는 기능을 수행할 수 있다. 이처럼 고정 플랜지(134)가 히터(130)의 양단에 설치되는 경우, 도 3에 도시된 바와 같이 챔버(110)의 외벽에 설치된 고정 브라켓(160)의 측면에 고정 플랜지(134)가 위치될 수 있다.
한편, 히터(130) 양단의 연장된 부분에는 단자(132)가 설치될 수 있다. 이러한 단자(132)는 외부의 전력을 히터(130)로 전달하여 히터(130)가 발열할 수 있도록 하는 기능을 수행할 수 있다. 본 발명에서 이용되는 단자(132)는 특별하게 한정되지 아니하며 다양한 종류의 단자가 이용될 수 있다.
한편, 본 발명의 일 실시예에 따른 히터(130)는, 그 내부에 냉각 용수 또는 냉각 가스가 흐르는 관이 설치되고, 이러한 관의 외주면에 외부 전원에 의하여 발열하는 열선이 설치되는 형태로 구성될 수 있다. 이와 같은 형태로 구성될 수 있다면 히터(130) 내부의 구체적인 구성은 특별하게 한정되지 아니하나, 바람직하게는 도 7과 같이 구성될 수 있다.
도 7을 참조하면, 히터(130)의 중심축 내부에는 중공 형태의 제1 관(130a) 및 제1 관(130a)의 외주면을 둘러싸며 제1 관(130a)과 소정의 거리만큼 이격되어 배치되는 제2 관(130b)이 배치되어 있다. 또한, 제2 관(130b)의 외주면 역시 회전축(124)의 내주면과 소정 거리만큼 이격되어 있으며, 도시되어 있지는 않지만 제1 관(130a)과 제2 관(130b)의 이격 공간에는 제1 관(130a)을 감싸는 코일형 열선(미도시)이 배치되어 있다. 이러한 구성을 채용함으로써, 열선에서 발열된 열이 구동 롤러(122)에 의해 지지되는 기판으로 인가되어 기판의 열처리를 진행할 수 있다. 또한, 열처리가 완료된 후에는 기판의 언로딩을 위해 제1 관(130a)의 내측으로 냉각용수 또는 냉각 가스가 흐르도록 하여 챔버(110) 내부의 냉각을 빠르게 진행할 수 있다.
여기서, 열선의 재질은 니크롬을 포함할 수 있고, 제1 및 제2 관(130a, 130b)의 재질은 석영을 포함할 수 있다. 또한, 제1 관(130a)으로 냉각용수 또는 냉각 가스가 공급되어 흐르도록 하는 구성은 한국특허출원 2008-110813호 및 한국특허출원 2008-110814호에 개시되어 있는 구성을 이용할 수 있다.
또한, 본 발명의 일 실시예에 따른 히터(130)는, 그 내부 양단에 전도체(130d)가 설치되고, 그 내부 중앙에 발열체(130c)가 설치되는 형태로 구성될 수 있다. 보다 구체적으로, 도 8을 참조하면, 히터(130) 내부 양단에 단자(132)를 통하여 외부의 전원을 공급받는 전도체(130d)가 설치되고, 히터(130) 내부 중앙에 전도체(130d)로부터 공급받은 전원으로 열을 발생시켜 기판으로 인가하는 발열체(130c)가 설치될 수 있다. 이와 같은 구성을 채용함으로써, 발열체(130c)에서 열을 우선적으로 발생시킬 수 있게 되므로, 효율적으로 기판을 열처리할 수 있게 된다.
발열체(130c)의 재질은 니크롬 또는 칸탈(Kanthal)을 포함할 수 있고, 전도체(130d)의 재질은 스테인레스강(SUS)를 포함할 수 있다. 또한, 보다 효율적인 기판의 열처리를 위하여, 발열체(130c)를 기판의 길이에 대응되게 구성할 수 있다.
상기와 같이 구성된 인라인 열처리 장치(100)의 동작과 이에 의한 열처리 공정은 기존의 인라인 방식 열처리 장치와 동일한 방식으로 동작하므로 이에 대한 상세한 설명은 생략한다.
본 발명에서는 히터(130)에서 발열된 열에 의해 기판에 대한 열처리가 진행될 때, 기판의 판면은 히터(130)와 평행하게 위치되므로 히터(130)에서 발생된 열은 기판 전체에 대하여 균일하게 인가되어 균일한 열처리가 이루어질 수 있다.
또한, 히터(130)는 회전축(124)의 내부에 배치되어 있으므로 챔버(110) 내부에서 히터(130)의 설치를 위한 공간이 감소될 수 있다.
본 발명은 상술한 바와 같이 바람직한 실시예를 들어 도시하고 설명하였으나, 상기 실시예에 한정되지 아니하며 본 발명의 정신을 벗어나지 않는 범위 내에서 당해 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 의해 다양한 변형과 변경이 가능하다. 그러한 변형예 및 변경예는 본 발명과 첨부된 특허청구범위의 범위 내에 속하는 것으로 보아야 한다.

Claims (10)

  1. 기판을 연속적으로 열처리할 수 있는 인라인 열처리 장치로서,
    상기 기판에 대한 열처리 공간을 제공하며 전후에 개구가 대향하여 형성되어 있는 챔버;
    상기 기판을 지지하면서 이동시키는 구동 롤러와 상기 구동 롤러를 관통하는 중공 형태의 회전축을 포함하는 구동 롤러 유닛; 및
    상기 회전축의 내측에 배치되는 히터를 포함하고,
    상기 구동 롤러 유닛은 상기 기판의 이동 방향을 따라 복수개로 설치되어 상기 챔버로 상기 기판을 로딩 및 상기 챔버로부터 상기 기판을 언로딩하며,
    상기 히터의 양단은 상기 챔버의 외벽에 고정되어 상기 회전축의 동작과 연동되지 않는 것을 특징으로 하는 인라인 열처리 장치.
  2. 제1항에 있어서,
    상기 구동 롤러 유닛은 상기 기판의 로딩 및 언로딩 방향에 대하여 직교하여 설치되는 것을 특징으로 하는 인라인 열처리 장치.
  3. 제1항에 있어서,
    상기 복수개의 구동 롤러 유닛은 서로 연동하는 것을 특징으로 하는 인라인 열처리 장치.
  4. 제3항에 있어서,
    상기 복수개의 회전축 각각의 일단에 설치되는 연동 풀리; 및
    상기 복수개의 연동 풀리를 연결시키는 연동 벨트
    를 더 포함하며,
    상기 복수개의 연동 풀리 중에서 어느 하나가 구동됨에 따라 상기 복수개의 구동 롤러 유닛이 서로 연동하는 것을 특징으로 하는 인라인 열처리 장치.
  5. 제1항에 있어서,
    상기 회전축의 일단에는 외부의 구동력을 공급받기 위한 구동 풀리가 연결되는 것을 특징으로 하는 인라인 열처리 장치.
  6. 제1항에 있어서,
    상기 히터의 양단에는 외부의 전원을 공급받기 위한 단자가 설치되는 것을 특징으로 하는 인라인 열처리 장치.
  7. 제1항에 있어서,
    상기 히터의 양단에는 상기 히터를 상기 챔버의 외벽에 고정시키는 고정 플랜지가 설치되는 것을 특징으로 하는 인라인 열처리 장치.
  8. 제1항에 있어서,
    상기 히터의 내부에는 냉각 용수 또는 냉각 가스가 흐르는 관 및 외부 전원에 의하여 발열하며 상기 관의 외주면을 감싸는 열선이 설치되는 것을 특징으로 하는 인라인 열처리 장치.
  9. 제1항에 있어서,
    상기 히터의 내부 양단에는 외부로부터 전원을 공급받는 전도체가 설치되며 상기 히터의 내부 중앙에는 상기 전도체로부터 전원을 전달받아 발열하는 발열체가 설치되는 것을 특징으로 하는 인라인 열처리 장치.
  10. 제9항에 있어서,
    상기 발열체의 길이는 상기 기판의 길이에 대응되게 형성되는 것을 특징으로 하는 인라인 열처리 장치.
PCT/KR2010/001736 2009-03-23 2010-03-22 인라인 열처리 장치 WO2010110558A2 (ko)

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WO2010110558A3 (ko) 2010-12-23
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TW201041045A (en) 2010-11-16
CN102356455A (zh) 2012-02-15
JP2012521653A (ja) 2012-09-13

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