WO2010106601A1 - 接続構造体、回路装置及び電子機器 - Google Patents
接続構造体、回路装置及び電子機器 Download PDFInfo
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- WO2010106601A1 WO2010106601A1 PCT/JP2009/006697 JP2009006697W WO2010106601A1 WO 2010106601 A1 WO2010106601 A1 WO 2010106601A1 JP 2009006697 W JP2009006697 W JP 2009006697W WO 2010106601 A1 WO2010106601 A1 WO 2010106601A1
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
- H01L2924/16315—Shape
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
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- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H01L2924/3025—Electromagnetic shielding
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to a connection structure for electrically and mechanically connecting two members, a circuit device including the connection structure, and an electronic device including the circuit device.
- the circuit device 100 of Patent Document 1 shown in FIG. 8 includes a first circuit board 111 and a second circuit board 121, a first circuit board 111, and a second circuit board 121 disposed along the thickness direction of the substrates 110 and 120.
- the first circuit board 111 and the second circuit board 121 are electrically connected by the terminal portion 131 provided on the connection member 130 and the connection member 130 interposed between the two circuit boards 121.
- the first circuit pattern 112 of the first circuit board 111 is connected to the terminal portion 131 of the connection member 130
- the second circuit pattern 122 of the second circuit board 121 is the connection member It is connected to the terminal portion 131 of 130.
- a frame-shaped housing 210 having an inner peripheral portion 210A and an outer peripheral portion 210B, and a plurality of connection terminal electrodes 220 connecting the upper and lower surfaces of the housing 210. 230, and bumps 240 provided on the plurality of connection terminal electrodes 220 and 230 on at least one surface of the housing 210.
- connection body a structure in which the first member (circuit board) and the second member (connector substrate) are electrically connected, that is, two types of terminals.
- connection structure By the way, when it is going to form a different-type terminal in a connection body, ensuring insulation which prevents that both terminals contact will become an important subject. Therefore, in order to realize the connection structure with a simple structure, for example, while forming the connection body of an insulating resin material or the like and arranging the different types of terminals apart from each other to ensure the insulation property, plating etc. It is conceivable to form the
- components placed in the lower part are affected by the weight and height of the components. The lower the connection, the greater the impact force will be.
- breakage occurs in the parts and connections in accordance with the structure.
- a crack is generated from the corner where the stress is the largest, and in the structure in which a layer is formed in the component height direction, delamination in the component occurs starting from the connection.
- the terminal portion 131 of the connection member 130 is a simple connection structure in which only one type of terminal is formed. Therefore, for example, with respect to different types of terminals such as a plurality of ground terminals and signal terminals, the structure in which the occurrence of cracking and peeling of terminals is suppressed is not obtained.
- the circuit device described in Patent Document 2 has a thin and reliable connection between a plurality of circuit boards having mechanical deformation such as warpage, and also has an electromagnetic shielding function.
- the circuit device described in Patent Document 2 also does not have a structure in which the occurrence of a crack and peeling of the terminal is suppressed with respect to the dissimilar terminal as in the case described in Patent Document 1.
- An object of the present invention is to provide a connection structure, a circuit device and an electronic device capable of effectively suppressing defects such as occurrence of cracks and peeling of terminals in view of the above-mentioned circumstances.
- a connection structure according to the present invention is a connection structure that electrically and mechanically connects between a first member and a second member, and a first connection surface connected to the first member;
- a rectangular shape made of an insulating material having at least a second connection surface connected to the second member, and a first side surface and a second side surface intersecting the first connection surface and the second connection surface.
- a connecting terminal including a frame of the first aspect, a conductive first terminal portion formed on the first connection surface, and a conductive second terminal portion formed on the second connection surface, and the first side surface And a conductive body electrically connecting the first terminal portion and the second terminal portion, and a recess formed in the first connection surface, the first terminal portion being the recess The end of the recess and the insulating material of the frame, the end of the first terminal portion and the second side Exposed at between.
- the first terminal portion is formed along the recess, that is, formed so as to bite into the connection surface, so that the adhesion strength between the first terminal portion and the frame can be enhanced, and generation of a crack, Problems such as peeling of the terminal from the frame can be suppressed.
- the insulating material of the frame is exposed between the end portion of the first terminal portion provided in the recess and the second side surface, the first terminal portion does not reach the second side surface, That is, the end of the first terminal portion is not exposed to the second side surface.
- connection structure is a connection structure that electrically and mechanically connects between the first member and the second member, and is connected to the first member.
- a second connection surface connected to the second member, and at least a first side surface and a second side surface intersecting the first connection surface and the second connection surface.
- a connection terminal including a rectangular frame made of an insulating material, a conductive first terminal portion formed on the first connection surface, and a conductive second terminal portion formed on the second connection surface.
- a conductive body formed on the first side surface and the second side surface and electrically connecting the first terminal portion and the second terminal portion in a ring shape; and a recess formed on the first connection surface And the first terminal portion is formed along the recess, and the first terminal portion is formed between the recess and the first side surface. And it comprises a flat portion between the concave portion and the second side surface.
- the one connection terminal is a signal terminal electrically connecting the first member and the second member, and the other connection terminal is a ground. It is a ground terminal connected to
- the adhesion strength between the signal terminal or the ground terminal and the frame can be increased, and defects such as generation of a crack and peeling of the signal terminal or the ground terminal from the frame can be suppressed.
- connection terminals are arranged in the longitudinal direction of the frame, and are arranged in line symmetry with respect to an outer surface center line of the frame. .
- the mounting strength of the component is also It becomes line symmetrical and secures connection stability.
- an annular conductive body is formed along the rectangular shape of the frame on the second side surface of the frame.
- the annular conductive body when the annular conductive body is connected to the ground terminal provided on the frame along the rectangular shape, it has a shielding function, so noises such as electromagnetic waves generated inside and outside the connection structure are eliminated. It can be shielded.
- a circuit device includes a first substrate provided with the connection structure described above, a land portion joined to the first terminal portion, and a second substrate provided with a land portion joined to the second terminal portion. And.
- a circuit device having a large bonding strength between the first substrate and the second substrate can be provided.
- the solder for connecting the first terminal portion or the second terminal portion and the land portion is completely filled in the recess. .
- the first terminal portion or the second terminal portion includes a flat portion between the first side surface and the recess, and the first terminal Solder connecting the land portion or the second terminal portion with the land portion is filled between the first terminal portion or the second terminal portion and the land portion, and the flat portion to the bottom portion of the concave portion At a position between them, only a part of the inside of the recess is filled.
- the impact stress applied to the solder connection portion is dispersed to the frame through the recess and generation of the crack can be suppressed, and the end portion of the terminal portion is not soldered, so peeling of the terminal portion end portion at the connection surface It can be suppressed from occurring.
- the first terminal portion or the second terminal portion includes a flat portion between the first side surface and the recess, and the first terminal The solder that connects the land portion or the second terminal portion is filled between the first terminal portion or the second terminal portion and the land portion, and the inside of the recess is not filled. It is a thing.
- an electronic component is mounted on the surface of at least one of the first substrate and the second substrate.
- a circuit device having a large bonding strength between the first substrate and the second substrate can be provided.
- a recess is formed in both the first connection surface and the second connection surface, and both of the first terminal portion and the second terminal portion are It is formed along the said recessed part.
- An electronic device includes any one of the connection structures described above or any one of the circuit devices described above.
- a recess is formed in at least one of the first connection surface and the second connection surface of the frame, and the first terminal portion or the second terminal of the connection terminal corresponding to the recess The portion is formed along the recess and does not expose the end to the side surface of the frame. Therefore, the first or second terminal portion of the connection terminal bites into the recess of the frame, and the adhesion strength between the connection terminal and the frame can be enhanced, and problems such as generation of cracks and peeling of the connection terminal from the frame There is an advantage that generation can be suppressed.
- FIG. 1 The schematic perspective view which shows the principal part of the mobile telephone which is 1 type of an electronic device provided with the circuit apparatus to which the connection structure which concerns on the 1st Embodiment of this invention is applied II-II sectional view in FIG. 1
- Top view of relay connector 3 shows a cross section of the relay connector of the circuit device shown in FIG. 1, (A) is a cross sectional view taken along line IVA-IVA in FIG. 3, (B) is a cross sectional view taken along line IVB-IVB in FIG.
- FIG. 8 An exploded perspective view showing a conventional circuit device
- a plan view showing another conventional circuit device 8 is a cross-sectional view showing a connection member of the circuit device of FIG. 8
- FIG.1 and FIG.2 shows the principal part of the circuit apparatus 1 to which the bonded structure which concerns on the 1st Embodiment of this invention is applied.
- the connection structure and circuit device of the present invention can be preferably used in an electronic device such as a mobile phone.
- the circuit device 1 includes, as a schematic configuration, a connector substrate 20 that constitutes a first member (first substrate), a circuit substrate 10 that constitutes a second member (second substrate), and It mounts in the mounting space S provided between the relay connector part 30 which comprises the connection structure of invention (that is, it comprises a standoff part), the card connector part 40, and the circuit board 10 and the connector board 20. And an electronic component 50.
- the card connector portion 40 is supported on the circuit board 10 via the relay connector portion 30 and the connector substrate 20 on one side (upper surface in FIG. 1; hereinafter referred to as “surface”).
- the electronic component 50 is mounted on the front surface of the circuit board 10 of the present embodiment via the substrate electrode 10A and the solder H, and an electronic component not shown and a key sheet on the opposite surface (the lower surface in FIG. 1). Or a liquid crystal display (LCD) or the like.
- a wiring pattern and a substrate electrode 10A are formed by etching and plating of a conductor, and in particular, an electrode land for connecting the relay connector portion 30 is a land portion. Assume 10B.
- Connector substrate 20 has a first surface (hereinafter referred to as “upper surface”) facing card connector portion 40 and a second surface (hereinafter referred to as “lower surface”) opposite to the surface of circuit board 10.
- Wiring patterns 26 are formed on both upper and lower surfaces, and in particular, the electrode lands connecting the relay connector portion 30 are referred to as land portions 21.
- the housing portion includes the frame 31 and the beam portion 34, the conductor portion (electrode) is formed by plating, and the first connection terminal constituting the ground terminal 32 and a second connection terminal 33 that constitutes a signal terminal.
- the ground terminal is a terminal electrically connected (grounded) to the ground
- the signal terminal is electrically connected to the connector substrate 20 and the circuit substrate 10, and to the connector substrate 20. It is a terminal for relaying a signal to and from the circuit board 10.
- the relay connector portion 30 is made of an appropriate insulating material (for example, an injection molding material such as LCP, PEEK, PEI, PES, PSF, SPS, PA, PPO, or PPE, or a sintered material such as ceramics).
- the frame 31 is composed of four outer sides 323A to 323D. Further, as shown in FIGS. 2 and 5, the frame 31 has a first connection surface (upper surface) 31A connected to the connector substrate 20 and a second connection surface (lower surface) 31B connected to the circuit substrate 10. And a first side surface 31C and a second side surface 31D which intersect the first connection surface 31A and the second connection surface 31B.
- the frame 31 has a portion where only the first connection terminal 32 is annularly installed (this is referred to as a “single-wire region ⁇ ”); As shown in FIG. 1, there exist portions where different types of terminals of the first connection terminal 32 and the second connection terminal 33 are provided together (this will be referred to as a “multiple line region ⁇ ”).
- the first connection terminal 32 described above is installed in a substantially square cross section across all four surfaces constituting the outer peripheral surface.
- the first connection terminal (ground terminal) 32 is installed only on the second side surface 31D.
- the second connection terminal (signal terminal) 33 is installed in a substantially U-shaped cross section (a shape obtained by rotating the U-shape by 90 °) on the outer peripheral three surfaces including the second connection surface 31B and the first side surface 31C. ing.
- the first connection terminal 32 and the second connection terminal 33 are separated from each other, in other words, a frame which is an insulating resin between the two connection terminals 32 and 33 The insulation is ensured by exposing 31.
- recesses G are formed on two surfaces of the first connection surface 31A and the second connection surface 31B. That is, the first terminal portion 32A and the second terminal portion 32B of the first connection terminal 32 shown in FIG. 4A are formed along the recess G in the recess G in the single wire region ⁇ of the frame 31. ing. Further, in the recess G in the double track region ⁇ of the frame 31, the first terminal portion 33A and the second terminal portion 33B of the second connection terminal 33 shown in FIG. 4B are formed along the recess G. ing.
- the first connection terminal (hereinafter, referred to as "ground terminal") 32 is formed by plating (electroless plating or electrolytic plating) on the outer surface of the frame 31 made of an insulating material. As described above, in the single-wire region ⁇ shown in FIG.
- the ground terminal 32 of the present embodiment includes the first terminal portion 32A provided on the first connection surface 31A connected to the connector substrate 20, and the circuit substrate
- the second terminal portion 32B provided on the second connection surface 31B connected to 10, and the connection provided on the first side surface 31C and the second side surface 31D intersecting the first connection surface 31A and the second connection surface 31B
- the portion 32 ⁇ / b> C and the conductor 32 ⁇ / b> D are electrically connected to each other, and a ring is formed in the cross section of the frame 31.
- the frame is integrated over the four surfaces (that is, the first connection surface 31A, the second connection surface 31B, the first side surface 31C, and the second side surface 31D). Since the (cross section) is annularly surrounded, there is no portion where the conductor of the ground terminal 32 is peeled off, which is the cause of peeling, so that the occurrence of peeling can be effectively suppressed.
- the first terminal portion 32A and the second terminal portion 32B are in a state in which they enter the concave portions G formed in each of the first connection surface 31A and the second connection surface 31B of the frame 31
- the first connection surface 31A and the second connection surface 31B are respectively formed.
- the frame body 31 can be firmly connected to the connector substrate 20 and the circuit substrate 10 by, in particular, completely filling the recess G with solder.
- the contact area between the ground terminal 32 and the frame 31 is enlarged due to the presence of the recess G, so that the stress acting between the two tends to be dispersed inside the frame 31, causing the occurrence of a crack, the ground terminal 32. Is less likely to occur.
- the frame 31 excluding the three sides where the signal terminal 33 is installed.
- Conductor 32D is formed only on one side (second side 31D).
- the conductive body 32D is a frame in the single-line region ⁇ shown in FIG. 4A (this single-line region occupies most of the outer peripheral portion of the frame 31 as shown in FIG. 3). It is connected to the terminal portion of the ground terminal 32 formed over all four surfaces of the body 31 or the like. Therefore, further strength is secured for the ground terminal 32, and cracking and peeling of the terminal are more effectively prevented.
- the ground terminals 32 of the present invention are single-wire regions in which the signal terminals (signal lines) 33 are not disposed, and the ground terminals 32 are provided on the entire surface (four sides) of the frame 31. That is, as shown in FIG. 4B, the ground terminal 32 is integrated on the entire surface of the frame 31, and integrally covers the four sides of the frame 31 annularly in cross section of the frame 31 as described above. As a result, there is no crack or a portion of the conductor which is the cause of peeling of the ground terminal 32, and generation of the crack and peeling of the terminal can be effectively suppressed.
- a plurality of ground terminals 32 are formed in the longitudinal direction of the frame 31, particularly in the present embodiment, in a large number so as to occupy the frame 31 in a large proportion along the outer side direction. Then, at least one of the two ground terminals 32 is electrically and physically connected to each other at either one of the first side surface 31C or the second side surface 31D of the frame 31 so as to be conducted by the conductive body 32D. There is. In the case of this embodiment, as shown in FIGS. 3 and 4 (B), for example, the ground terminals of the two ground terminals 32 are integrated on the second side 31D (outer portion) via the conductor 32D. It is possible to mutually suppress the cracks and the exfoliation of the terminals, and to further suppress the occurrence of the cracks and the exfoliation of the terminals.
- the lands 10B provided on the circuit board 10 form lands 10B of the same shape also at positions facing in line symmetry with respect to the center line of the connector component. For this reason, when solder connection is performed, the self-alignment effect is achieved by the surface tension at the time of solder melting, so that it is fixed at a position symmetrical with respect to the center line of the connector component. Therefore, the stress applied to the terminals is dispersed symmetrically in the component as viewed from the center line, and the cracks and the exfoliation of the terminals can be mutually suppressed, and the occurrence of the cracks and the exfoliation of the terminals can be further suppressed.
- the ground terminal 32 of the present embodiment is, in particular, two outer sides (for example, the outer side 323A in the vertical direction and the outer side 323A in the vertical direction) of the four outer sides 323A to 323D that constitute the frame 31.
- a planar first chamfered portion 322 is provided at a corner portion 321 where the lateral outer sides 323C cross each other. That is, also in the corner portion 321 of the frame 31, since the ground terminal 32 integrally encloses the frame 31 in an annular shape, there is no portion which becomes a notch of the conductor which is the cause of peeling from the frame 31 It can be suppressed.
- the ground terminal 32 is formed over all of the four outer sides 323A to 323D of the frame 31 when the entire frame 31 is viewed. That is, the ground terminal 32 is formed by connecting all the four outer side portions integrally, and while mutually reinforcing each other, the occurrence of peeling is further suppressed, and cracking and peeling of the terminal are more effective. Can be suppressed.
- a planar second part is connected to the connection portion with the beam portion 34 connecting the outer sides 323A and 323B.
- a chamfered portion 324 is formed.
- the ground terminal 32 is also formed on the second chamfered portion 324 from the outer sides 323A and 323B to the beam portion 34. That is, even in the second chamfered portion 324, since the ground terminal 32 annularly surrounds, there is no portion which becomes a notch of the conductor which is the cause of peeling, and even in the second chamfered portion 324, cracking and peeling of the terminal can be suppressed. .
- the second connection terminal 33 (hereinafter, referred to as “signal terminal”) is formed by plating on the outer surface of the frame 31 made of an insulating material, like the ground terminal 32.
- the signal terminal 33 of the present invention is formed between two adjacent ground terminals 32 in the longitudinal direction of the frame 31 (in the direction of the four outer sides 323A to 323D in FIG. 4). It is done.
- the ground terminal 32 is formed on three sides (three sides excluding the second side surface 31D in the present embodiment), and the side to which the ground terminal 32 is not connected. Therefore, the signal terminal 33 is separated from the ground terminal 32. That is, the insulating frame 31 is exposed between the ground terminal 32 and the signal terminal 33 so that the ground terminal 32 and the signal terminal 33 are insulated.
- the signal terminals 33 also form the signal terminals 33 of the same shape at positions facing in line symmetry from the center line of the connector part.
- the distance (length) between the ends of the recess of the signal terminal is equal to the maximum length L1max of the distance (length) between the ends of the land 10B in FIG. There is. If the land portion is larger than this, when the signal terminal 33 and the land portion 10B are connected by solder, the solder may wet and spread on the land, which may cause a short circuit with the ground terminal 32.
- the separation distance (length) between the ground terminal 32 and the signal terminal 33 is (L2-L3) / 2, and this separation distance is in the connection plane Since the end portion of the signal terminal portion is not exposed to the side surface of the frame by providing the above, the structure is such that delamination of the terminal does not easily occur.
- the signal terminal 33 has a first terminal portion 33A provided on the first connection surface (upper surface) 31A connected to the connector substrate 20, and a second connection surface (lower surface) connected to the circuit substrate 10 It has the 2nd terminal area 33B provided in 31B, and the connection part 33C provided in the 1st side 31C which intersects with the 1st connection side 31A and the 2nd connection side 31B.
- the first terminal portion 33A and the second terminal portion 33B are formed on a part of the first connection surface 31A and the second connection surface 31B of the frame 31.
- the first connection surface 31 ⁇ / b> A and the second connection surface 31 ⁇ / b> B are formed in a state in which they enter the recess G. That is, also in the signal terminal 33, the first terminal portion 33A and the second terminal portion 33B bite into the recess G of the frame 31. Therefore, peeling of the first terminal portion 33A and the second terminal portion 33B of the signal terminal 33 from the frame 31 can be effectively suppressed.
- the solder H for connecting the first terminal portion 33A and the second terminal portion 33B and the land portions 21 and 10B formed by plating the connector substrate 20 and the circuit board 10 is The inside of the recess G is completely filled. Therefore, as in the case of the ground terminal 32, the frame 31 can be firmly connected to the connector substrate 20 and the circuit substrate 10, in particular, by completely filling the recess G with the solder.
- the recess G of the present invention has a configuration in which both the first connection surface and the second connection surface have the same size and the same shape, and are arranged on the same vertical line (the same vertical direction line).
- the same size, the same shape, and the same vertical line may not be necessary.
- the beam portion 34 is provided so as to connect between the two opposing frame bodies 31 using an appropriate insulating material.
- the frame body 31 and the beam portion 34 are connected via a branch portion 325, and the branch portion 325 is formed with the above-described second chamfered portion 324.
- the electronic component 50 is mounted using a mounting space S which is a space area between the card connector portion 40 on the surface of the circuit board 10 and the connector board 20.
- a surface mounted component such as the semiconductor package component 51 or the LCR circuit chip component 52 is used, and is mounted on the surface of the circuit board 10. If the mounting space S is formed between the circuit board 10 and the connector board 20, the electronic component 50 may be attached to the connector board 20 instead of the circuit board 10.
- the ground terminal 32 and the signal terminal 33 are separately isolated in a state of being insulated while suppressing occurrence of cracks and peeling of the terminals. It can be formed.
- the terminal G is formed in such a state that the recess G is formed in the frame 31 and the recess G is inserted. Therefore, a strong connection between the circuit board and the frame 31 is realized. Further, by applying the connection structure of the present embodiment, a circuit device having a large bonding strength can be realized for the connector substrate 20 which is the first substrate and the circuit substrate 10 which is the second substrate.
- an electronic device such as a portable terminal device or the like to which a large stress is instantaneously applied by an impact such as a drop, a drop or the like can be obtained by providing a circuit device having a large bonding strength between the connector substrate 20 and the circuit substrate 10.
- the insulating resin is supplied and reinforced to the outer periphery of the frame and the mounting area inside the frame, it is possible to realize an electronic device that has a higher bonding strength and is resistant to impact such as falling. It is self-explanatory.
- the circuit device of the present embodiment is different from the circuit device of the first embodiment in that, as shown in FIG. 5, a recess G is formed in the frame 31 only in the second connection surface (lower surface) 31B. It is a point.
- the concave G is formed only in the second connection surface (lower surface) 31B in consideration of receiving a large impact force as the lower connection portion gets closer.
- the second terminal portion 32B of the ground terminal 32 bites into the recess G of the second connection surface (lower surface) 31B. There is. Thereby, it is possible to effectively suppress the second terminal portion 32B from coming off the frame 31.
- solder H for connecting the second terminal portion 32B and the land portion 10B formed by plating of the circuit board 10 is also completely filled in the recess G.
- the frame 31 can be firmly connected to the circuit board 10 by completely filling the recess G with the solder.
- the second terminal portion 33B of the signal terminal 33 bites into the recess G of the second connection surface (lower surface) 31B. Therefore, it is possible to effectively suppress the second terminal portion 33B from coming off the frame 31. Also in this multi-line region ⁇ , the solder H for connecting the second terminal portion 33B and the land portion 10B formed by plating of the circuit board 10 is completely filled in the recess G. Therefore, the frame 31 can be firmly connected to the circuit board 10 by completely filling the recess G with the solder.
- the concave portion G of the present invention is not limited to the configuration shown in the present embodiment, and in the circuit device or the electronic device, the side having a large impact stress in consideration of the magnitude of the impact stress received by the connection portion.
- the recess G may be installed in the That is, although the recessed part G is formed in the 2nd connection surface 31B in this embodiment, you may form in the 1st connection surface 31A.
- connection structure of the present embodiment a circuit device having high bonding strength can be realized for the connector substrate 20 as the first substrate and the circuit substrate 10 as the second substrate.
- the insulating resin is supplied and reinforced to the outer periphery of the frame and the mounting area inside the frame, it is possible to realize an electronic device that has a higher bonding strength and is resistant to impact such as falling. It is self-explanatory.
- connection structure according to a third embodiment of the present invention will be described with reference to FIG.
- the same parts as those of the second embodiment are denoted by the same reference numerals to avoid redundant description.
- the circuit device according to the present embodiment is the second one in that the recess G is formed only in the second connection surface (lower surface) 31B in the frame 31 and the second terminal portion 32B or 33B is formed in the entire recess G. It is the same as the circuit device of the embodiment, but differs from the circuit device of the second embodiment in that the solder H is filled in only a part of the inside of the recess G.
- the solder H connecting the land 10B of the circuit board 10 and the second terminal 32B of the ground terminal 32 is the first terminal 32A. It is formed in the region between the up position halfway not reaching the bottom of the recess G from the left end E 1 of the connecting portion 32C side of the. That is, the solder H is filled in only a part of the inside of the recess G.
- the second terminal portion 33B of the signal terminal 33 when the land portion 10B and the second terminal portion 33B of the signal terminal 33 are joined with the solder H, the other end E 2 of the second terminal portion 33B facing the exposed portion of the frame 31
- the solder H does not hang on the Therefore, by utilizing the adhesion strength between the second terminal portion 33B and the frame body 31 which is improved by only the second terminal portion 33B (without the solder H) biting into the recess G of the frame body 31, the second terminal portion It is possible to more effectively suppress the occurrence of cracks at the end of 33B and peeling of the terminal.
- the concave portion G of the present invention is not limited to the configuration shown in the present embodiment, and in the circuit device or the electronic device, the side having a large impact stress in consideration of the magnitude of the impact stress received by the connection portion.
- the recess G may be installed in the That is, in the present embodiment, the recess G is formed in the second connection surface 31B, but may be formed in the first connection surface 31A.
- the solder H is not applied to the end of the second terminal portion 33B where the frame 31 is exposed in the multi-wire region ⁇ . Accordingly, the occurrence of peeling at the second terminal portion 33B can be suppressed.
- the recess G is reinforced by the solder + resin.
- connection structure according to a fourth embodiment of the present invention will be described with reference to FIG.
- the same parts as those of the third embodiment are denoted by the same reference numerals to avoid redundant description.
- solder H provided for the connection between the second terminal portions 32B and 33B and the first land portion 10B of the circuit board 10 is the third embodiment. It is a point which is not filled up in crevice G of 2 terminal parts 32B and 33B.
- the second terminal portion 32B of the ground terminal 32 between the end portion E 1 in contact with the first side surface 31C of the frame 31 to the recess G is constitutes a flat portion ⁇ There is.
- the land portion 10B is disposed only in the region corresponding to the flat portion ⁇ avoiding the recess G. That is, it can be formed in a narrower shape than the land portion 10B in the first to third embodiments.
- the second terminal portion 33B of the signal terminal 33 and the land portion 10B have the same configuration.
- the end-to-end distance (length) of the land portion 10 ⁇ / b> B matches the minimum length L 1 min of L 1. If the land portion is smaller than this, the connection area for connecting the signal terminal 33 and the land portion 10B with solder may be reduced, and the bonding strength may be reduced.
- the land portion 10B is formed in a narrow shape corresponding to the flat portion ⁇ of the second terminal portion 33B of the signal terminal 33. Therefore, when bonding the second terminal portion 33B of the land portion 10B and the signal terminal 33 with solder H, the solder H at the other end E 2 of the second terminal portion 33B facing the exposed portion of the frame 31 It does not hang. Therefore, by utilizing the adhesion strength between the second terminal portion 33B and the frame body 31 which is improved by only the second terminal portion 33B (without the solder H) biting into the recess G of the frame body 31, the second terminal portion The occurrence of peeling at the end of 33B can be suppressed more effectively.
- the recess G is reinforced with a resin.
- a conductor is formed on the second side surfaces of all the four outer sides such that all of the plurality of first connection terminals are located outside the four outer sides of the frame. Connected.
- the strength can be increased by coupling all the first connection terminals, but it is not necessary to connect all the first connection terminals via a conductor, and a plurality of the first connection terminals may be connected.
- the first connection terminals may be connected via the conductor.
- the present invention is also applicable to the case where a frame, a connector board, and a circuit board are joined using an isotropic conductive resin or an anisotropic conductive resin other than solder.
- the present invention is not limited to those described in the above embodiments, but may be modified or applied by those skilled in the art based on the description of the specification and well-known techniques. Yes, within the scope of seeking protection.
- the present invention has the effect of being able to effectively suppress the occurrence of cracks and peeling of terminals with respect to two types of connection terminals of different functions provided on the same frame in an insulated state separated from each other, It is useful for the circuit apparatus which provided the connection structure, and the electronic device provided with a circuit apparatus.
- circuit device 10 first member (circuit board) 10A substrate electrode 10B land portion 20 second member (connector substrate) 21 land portion 26 wiring pattern 30 relay connector portion (connection structure) 31 frame 31A first connection surface (bottom surface) 31 B Second connection surface (upper surface) 31C first side 31D second side 32 first connection terminal (ground terminal) 32A first terminal portion 32B second terminal portion 32C connecting portion 32D conductor 323A to 323D outer side 33 second connection terminal (signal terminal) 33A 1st terminal section 33B 2nd terminal section 33C connecting section 34 beam section 40 card connector section 50 electronic parts 51 semiconductor package parts 52 LCR circuit chip parts C card E 2 other end G concave section H solder S mounting space ⁇ single wire area ⁇ Double-line region ⁇ flat
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
Description
図1及び図2は、本発明の第1の実施形態に係る接続構造体を適用した回路装置1の要部を示す。本発明の接続構造体、回路装置は、好ましくは携帯電話機のような電子機器に使用され得る。本実施形態の回路装置1は、概略構成として、第1の部材(第1の基板)を構成するコネクタ基板20と、第2の部材(第2の基板)を構成する回路基板10と、本発明の接続構造体を構成する(別言すれば、スタンドオフ部を構成する)中継コネクタ部30と、カードコネクタ部40と、回路基板10とコネクタ基板20の間に設けた実装空間Sに実装された電子部品50と、を備えている。
また、枠体31には、図4(A)に示すように、第1の接続端子32のみが環状に設置される部分(これを「単線領域α」とよぶ)と、図4(B)に示すように、第1の接続端子32及び第2の接続端子33という異種端子が共に設置されている部分(これを「複線領域β」とよぶ)と、が存在する。
次に、本発明の第2の実施形態に係る接続構造体を適用した回路装置を備える電子機器について、図5を参照しながら説明する。なお、本実施形態において、第1の実施形態と同一部分には同一符号を付して重複説明を避ける。
次に、本発明の第3の実施形態に係る接続構造体を適用した回路装置について、図6を参照しながら説明する。なお、本実施形態において、第2の実施形態と同一部分には同一符号を付して重複説明を避ける。
次に、本発明の第4の実施形態に係る接続構造体を適用した回路装置について、図7を参照しながら説明する。なお、本実施形態において、第3の実施形態と同一部分には同一符号を付して重複説明を避ける。
10 第1の部材(回路基板)
10A 基板電極
10B ランド部
20 第2の部材(コネクタ基板)
21 ランド部
26 配線パターン
30 中継コネクタ部(接続構造体)
31 枠体
31A 第1接続面(下面)
31B 第2接続面(上面)
31C 第1の側面
31D 第2の側面
32 第1の接続端子(グランド端子)
32A 第1端子部
32B 第2端子部
32C 連結部
32D 導通体
323A~323D 外辺
33 第2の接続端子(信号端子)
33A 第1端子部
33B 第2端子部
33C 連結部
34 梁部
40 カードコネクタ部
50 電子部品
51 半導体パッケージ部品
52 LCR回路チップ部品
C カード
E2 他端部
G 凹部
H 半田
S 実装空間
α 単線領域
β 複線領域
γ 平坦部
Claims (13)
- 第1の部材および第2の部材の間を電気的および機械的に接続する接続構造体であって、
前記第1の部材に接続される第1接続面と、前記第2の部材に接続される第2接続面と、前記第1接続面と前記第2接続面とに交差する第1の側面及び第2の側面とを少なくとも有する絶縁性材料からなる矩形状の枠体と、
前記第1接続面に形成された導電性の第1端子部と前記第2接続面に形成された導電性の第2端子部とを含む接続端子と、
前記第1の側面に形成され、前記第1端子部と前記第2端子部とを電気的に接続する導通体と、
前記第1接続面に形成された凹部と、
を備え、
前記第1端子部は、前記凹部に沿って形成され、前記凹部内に端部を備え、
前記枠体の絶縁性材料が、前記第1端子部の端部と前記第2の側面との間で露出する接続構造体。 - 第1の部材および第2の部材の間を電気的および機械的に接続する接続構造体であって、
前記第1の部材に接続される第1接続面と、前記第2の部材に接続される第2接続面と、前記第1接続面と前記第2接続面とに交差する第1の側面及び第2の側面とを少なくとも有する絶縁性材料からなる矩形状の枠体と、
前記第1接続面に形成された導電性の第1端子部と前記第2接続面に形成された導電性の第2端子部とを含む接続端子と、
前記第1の側面および第2の側面に形成され、前記第1端子部と前記第2端子部とを環状に電気的に接続する導通体と、
前記第1接続面に形成された凹部と、
を備え、
前記第1端子部は、前記凹部に沿って形成され、かつ、前記凹部と前記第1の側面との間と前記凹部と前記第2の側面との間に平坦部を備える接続構造体。 - 請求項1記載の接続構造体であって、
前記接続端子は、信号端子である接続構造体。 - 請求項2記載の接続構造体であって、
前記接続端子は、グランド端子である接続構造体。 - 請求項1から4のいずれか1項に記載の接続構造体であって、
前記接続端子は、
前記枠体の長手方向に並べられており、前記枠体の外形中心線に対して、線対称に配置されている、接続構造体。 - 請求項1から5のいずれか1項に記載の接続構造体であって、
前記枠体の前記第2の側面には、枠体の矩形状に沿って環状の導通体が形成されている、接続構造体。 - 請求項1から6のいずれか1項に記載の接続構造体と、
前記第1端子部と接合されたランド部を備える第1基板と
前記第2端子部と接合されたランド部を備える第2基板と、を備える回路装置。 - 請求項7に記載の回路装置であって、
前記第1端子部または前記第2端子部と前記ランド部を接続する半田が、前記凹部の内部に完全に充填された、回路装置。 - 請求項7に記載の回路装置であって、
前記第1端子部または前記第2端子部は、前記第1の側面と前記凹部との間に平坦部を備え、
前記第1端子部または前記第2端子部と前記ランド部を接続する半田が、前記第1端子部または前記第2端子部と前記ランド部の間に充填されているとともに、前記平坦部から前記凹部の底部に到達する位置までの間の位置において、前記凹部の内部の一部にのみ充填された、回路装置。 - 請求項7に記載の回路装置であって、
前記第1端子部または前記第2端子部は、前記第1の側面と前記凹部との間に平坦部を備え、
前記第1端子部または前記第2端子部と前記ランド部を接続する半田が、前記第1端子部または前記第2端子部と前記ランド部の間に充填されているとともに、前記凹部の内部に充填されていない、回路装置。 - 請求項7から請求項10のいずれか1項に記載の回路装置であって、
前記第1の基板と前記第2基板の少なくともいずれかの表面に電子部品が実装された回路装置。 - 請求項7から11のいずれか1項に記載の回路装置であって、
前記第1接続面および前記第2接続面の双方に凹部が形成され、前記第1端子部および前記第2端子部の双方が、当該凹部に沿って形成されている、回路装置。 - 請求項1から6のいずれか1項に記載の接続構造体、または
請求項7から12のいずれか1項に記載の回路装置を備える電子機器。
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US13/254,685 US20110317386A1 (en) | 2009-03-19 | 2009-12-08 | Connecting structure, circuit device and electronic apparatus |
JP2011504623A JPWO2010106601A1 (ja) | 2009-03-19 | 2009-12-08 | 接続構造体、回路装置及び電子機器 |
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WO2016166811A1 (ja) * | 2015-04-14 | 2016-10-20 | オリンパス株式会社 | 接続構造体および撮像装置 |
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WO2014128795A1 (ja) * | 2013-02-22 | 2014-08-28 | パナソニック株式会社 | 電子部品パッケージ |
WO2014171225A1 (ja) * | 2013-04-16 | 2014-10-23 | 株式会社村田製作所 | 高周波部品およびこれを備える高周波モジュール |
US10276402B2 (en) * | 2016-03-21 | 2019-04-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor package and manufacturing process thereof |
KR102400748B1 (ko) * | 2017-09-12 | 2022-05-24 | 삼성전자 주식회사 | 인터포저를 포함하는 전자 장치 |
CN117374014B (zh) * | 2023-12-07 | 2024-03-08 | 潮州三环(集团)股份有限公司 | 一种封装基座及其制备方法 |
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JP5168819B2 (ja) * | 2006-06-02 | 2013-03-27 | 日産自動車株式会社 | 半導体パッケージおよびその製造方法 |
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- 2009-12-08 JP JP2011504623A patent/JPWO2010106601A1/ja not_active Withdrawn
- 2009-12-08 CN CN2009801581146A patent/CN102356701A/zh active Pending
- 2009-12-08 US US13/254,685 patent/US20110317386A1/en not_active Abandoned
- 2009-12-08 WO PCT/JP2009/006697 patent/WO2010106601A1/ja active Application Filing
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JP2006237276A (ja) * | 2005-02-25 | 2006-09-07 | Matsushita Electric Ind Co Ltd | 立体的電子回路装置およびその中継基板 |
WO2007116657A1 (ja) * | 2006-04-10 | 2007-10-18 | Panasonic Corporation | 中継基板とその製造方法およびそれを用いた立体回路装置 |
WO2008035442A1 (fr) * | 2006-09-22 | 2008-03-27 | Panasonic Corporation | Dispositif de circuit, procédé de fabrication de dispositif de circuit et élément de connexion |
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WO2016166811A1 (ja) * | 2015-04-14 | 2016-10-20 | オリンパス株式会社 | 接続構造体および撮像装置 |
JPWO2016166811A1 (ja) * | 2015-04-14 | 2018-02-15 | オリンパス株式会社 | 接続構造体および撮像装置 |
US10327335B2 (en) | 2015-04-14 | 2019-06-18 | Olympus Corporation | Connection structure and image pickup apparatus |
Also Published As
Publication number | Publication date |
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US20110317386A1 (en) | 2011-12-29 |
CN102356701A (zh) | 2012-02-15 |
JPWO2010106601A1 (ja) | 2012-09-13 |
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