WO2010095672A1 - Procédé de production d'une pellicule mince métallique et pellicule mince métallique - Google Patents

Procédé de production d'une pellicule mince métallique et pellicule mince métallique Download PDF

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Publication number
WO2010095672A1
WO2010095672A1 PCT/JP2010/052405 JP2010052405W WO2010095672A1 WO 2010095672 A1 WO2010095672 A1 WO 2010095672A1 JP 2010052405 W JP2010052405 W JP 2010052405W WO 2010095672 A1 WO2010095672 A1 WO 2010095672A1
Authority
WO
WIPO (PCT)
Prior art keywords
thin film
metal
fine particles
metal thin
superheated steam
Prior art date
Application number
PCT/JP2010/052405
Other languages
English (en)
Japanese (ja)
Inventor
剛志 八塚
佳孝 鮎澤
博俊 木津本
浩二 小木
Original Assignee
東洋紡績株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東洋紡績株式会社 filed Critical 東洋紡績株式会社
Priority to KR1020117021546A priority Critical patent/KR101132108B1/ko
Priority to JP2010512865A priority patent/JP4853590B2/ja
Priority to CN2010800088116A priority patent/CN102326213A/zh
Publication of WO2010095672A1 publication Critical patent/WO2010095672A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

L'invention concerne un procédé de formation d'une pellicule mince métallique où l'utilisation d'une dispersion de particules métalliques permet d'obtenir une couche conductrice avec une faible résistivité volumique sur un substrat isolé. Ledit procédé comprend une étape de production où une pellicule de revêtement comprenant une dispersion de particules métalliques est traitée thermiquement au moyen de vapeur surchauffée. L'invention concerne aussi une pellicule mince métallique produite par ledit procédé. Il est souhaitable que la pellicule de revêtement soit formée à partir de la dispersion de particules métalliques étalée ou imprimée sur le substrat isolé. La dispersion de particules métalliques peut contenir un agent réducteur et la vapeur surchauffée peut contenir des composés d'alcool.
PCT/JP2010/052405 2009-02-18 2010-02-18 Procédé de production d'une pellicule mince métallique et pellicule mince métallique WO2010095672A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020117021546A KR101132108B1 (ko) 2009-02-18 2010-02-18 금속 박막 제조 방법 및 금속 박막
JP2010512865A JP4853590B2 (ja) 2009-02-18 2010-02-18 金属薄膜製造方法および金属薄膜
CN2010800088116A CN102326213A (zh) 2009-02-18 2010-02-18 金属薄膜制造方法以及金属薄膜

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2009-035053 2009-02-18
JP2009035053 2009-02-18
JP2009177704 2009-07-30
JP2009-177704 2009-07-30
JP2009-177703 2009-07-30
JP2009177703 2009-07-30
JP2009207808 2009-09-09
JP2009-207808 2009-09-09

Publications (1)

Publication Number Publication Date
WO2010095672A1 true WO2010095672A1 (fr) 2010-08-26

Family

ID=42633952

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/052405 WO2010095672A1 (fr) 2009-02-18 2010-02-18 Procédé de production d'une pellicule mince métallique et pellicule mince métallique

Country Status (4)

Country Link
JP (1) JP4853590B2 (fr)
KR (1) KR101132108B1 (fr)
CN (1) CN102326213A (fr)
WO (1) WO2010095672A1 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011060653A (ja) * 2009-09-11 2011-03-24 Toyobo Co Ltd 金属薄膜製造方法および金属薄膜
JP2013175559A (ja) * 2012-02-24 2013-09-05 Hitachi Chemical Co Ltd 接着剤層と配線層よりなる複合層及びそれを形成するための印刷用接着剤層形成インク
JP2014057028A (ja) * 2012-09-14 2014-03-27 Shin Etsu Chem Co Ltd 太陽電池及び太陽電池の製造方法
JPWO2012157704A1 (ja) * 2011-05-18 2014-07-31 戸田工業株式会社 銅粉末、銅ペースト、導電性塗膜の製造方法及び導電性塗膜
JP2015076232A (ja) * 2013-10-08 2015-04-20 東洋紡株式会社 導電性ペースト、導電性薄膜及び電気回路
JP2015181160A (ja) * 2014-03-05 2015-10-15 トッパン・フォームズ株式会社 導電パターンの形成方法及び導電性配線
KR20170032275A (ko) 2014-07-14 2017-03-22 도다 고교 가부시끼가이샤 도전성 도막의 제조 방법 및 도전성 도막
US20210138541A1 (en) * 2018-08-08 2021-05-13 Mitsui Mining & Smelting Co., Ltd. Bonding composition, conductor bonding structure, and method for producing same
JP2022533024A (ja) * 2019-04-30 2022-07-21 アグフア－ゲヴエルト，ナームローゼ・フエンノートシヤツプ 導電性パターンの製造法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014132961A1 (fr) * 2013-03-01 2014-09-04 戸田工業株式会社 Procédé de fabrication de film de revêtement conducteur et film de revêtement conducteur
JP2014199720A (ja) * 2013-03-29 2014-10-23 富士フイルム株式会社 導電膜形成用組成物およびこれを用いる導電膜の製造方法
WO2015053160A1 (fr) * 2013-10-08 2015-04-16 東洋紡株式会社 Pâte conductrice, film mince conducteur, et circuit
JP6641217B2 (ja) * 2016-03-30 2020-02-05 東京応化工業株式会社 金属酸化物膜形成用塗布剤及び金属酸化物膜を有する基体の製造方法
CN106756977B (zh) * 2016-12-20 2019-04-05 南京九致信息科技有限公司 热电金属薄膜及其制备方法
CN112805104B (zh) * 2018-10-12 2023-10-27 花王株式会社 金属微粒分散体的制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05166414A (ja) * 1991-12-11 1993-07-02 Matsushita Electric Ind Co Ltd 透明導電膜およびその形成方法
JP2000348549A (ja) * 1999-06-04 2000-12-15 Mitsubishi Materials Corp Ｓｒｏ導電性薄膜形成用組成物及びｓｒｏ導電性薄膜の形成方法
JP2004288448A (ja) * 2003-03-20 2004-10-14 Kitagawa Ind Co Ltd 薄膜状導体パターン、配線構造物、面状ヒーター、および薄膜状導体パターンの製造方法
WO2008001600A1 (fr) * 2006-06-30 2008-01-03 Think Laboratory Co., Ltd. procédé d'élimination de pâte conductrice

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3585244B2 (ja) 1997-02-20 2004-11-04 パレレック，インコーポレイテッド 導電体製造のための低温方法および組成物
KR102220703B1 (ko) * 2002-11-15 2021-02-26 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 금속 아미디네이트를 이용한 원자층 증착법
US20050159298A1 (en) * 2004-01-16 2005-07-21 American Superconductor Corporation Oxide films with nanodot flux pinning centers
JP5072220B2 (ja) * 2005-12-06 2012-11-14 キヤノン株式会社 薄膜の製造方法及び電子放出素子の製造方法
JP2009016782A (ja) * 2007-06-04 2009-01-22 Tokyo Electron Ltd 成膜方法及び成膜装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05166414A (ja) * 1991-12-11 1993-07-02 Matsushita Electric Ind Co Ltd 透明導電膜およびその形成方法
JP2000348549A (ja) * 1999-06-04 2000-12-15 Mitsubishi Materials Corp Ｓｒｏ導電性薄膜形成用組成物及びｓｒｏ導電性薄膜の形成方法
JP2004288448A (ja) * 2003-03-20 2004-10-14 Kitagawa Ind Co Ltd 薄膜状導体パターン、配線構造物、面状ヒーター、および薄膜状導体パターンの製造方法
WO2008001600A1 (fr) * 2006-06-30 2008-01-03 Think Laboratory Co., Ltd. procédé d'élimination de pâte conductrice

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011060653A (ja) * 2009-09-11 2011-03-24 Toyobo Co Ltd 金属薄膜製造方法および金属薄膜
JPWO2012157704A1 (ja) * 2011-05-18 2014-07-31 戸田工業株式会社 銅粉末、銅ペースト、導電性塗膜の製造方法及び導電性塗膜
US9221979B2 (en) 2011-05-18 2015-12-29 Toda Kogyo Corporation Copper particles, copper paste, process for producing conductive coating film, and conductive coating film
JP6028727B2 (ja) * 2011-05-18 2016-11-16 戸田工業株式会社 銅粉末、銅ペースト、導電性塗膜の製造方法及び導電性塗膜
JP2013175559A (ja) * 2012-02-24 2013-09-05 Hitachi Chemical Co Ltd 接着剤層と配線層よりなる複合層及びそれを形成するための印刷用接着剤層形成インク
JP2014057028A (ja) * 2012-09-14 2014-03-27 Shin Etsu Chem Co Ltd 太陽電池及び太陽電池の製造方法
JP2015076232A (ja) * 2013-10-08 2015-04-20 東洋紡株式会社 導電性ペースト、導電性薄膜及び電気回路
JP2015181160A (ja) * 2014-03-05 2015-10-15 トッパン・フォームズ株式会社 導電パターンの形成方法及び導電性配線
KR20170032275A (ko) 2014-07-14 2017-03-22 도다 고교 가부시끼가이샤 도전성 도막의 제조 방법 및 도전성 도막
US20210138541A1 (en) * 2018-08-08 2021-05-13 Mitsui Mining & Smelting Co., Ltd. Bonding composition, conductor bonding structure, and method for producing same
US11931808B2 (en) * 2018-08-08 2024-03-19 Mitsui Mining & Smelting Co., Ltd. Bonding composition, conductor bonding structure, and method for producing same
JP2022533024A (ja) * 2019-04-30 2022-07-21 アグフア－ゲヴエルト，ナームローゼ・フエンノートシヤツプ 導電性パターンの製造法

Also Published As

Publication number Publication date
KR20110122187A (ko) 2011-11-09
JP4853590B2 (ja) 2012-01-11
KR101132108B1 (ko) 2012-04-05
JPWO2010095672A1 (ja) 2012-08-30
CN102326213A (zh) 2012-01-18

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