WO2010089279A2 - Varistorkeramik, vielschichtbauelement umfassend die varistorkeramik, herstellungsverfahren für die varistorkeramik - Google Patents

Varistorkeramik, vielschichtbauelement umfassend die varistorkeramik, herstellungsverfahren für die varistorkeramik Download PDF

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WO2010089279A2
WO2010089279A2 PCT/EP2010/051188 EP2010051188W WO2010089279A2 WO 2010089279 A2 WO2010089279 A2 WO 2010089279A2 EP 2010051188 W EP2010051188 W EP 2010051188W WO 2010089279 A2 WO2010089279 A2 WO 2010089279A2
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varistor ceramic
proportion
varistor
ceramic according
atomic
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English (en)
French (fr)
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WO2010089279A3 (de
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Monika Piber
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TDK Electronics AG
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Epcos AG
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Priority to US13/146,450 priority Critical patent/US8487735B2/en
Priority to KR1020117020443A priority patent/KR101667073B1/ko
Priority to CN2010800060182A priority patent/CN102300832A/zh
Priority to JP2011546868A priority patent/JP5833929B2/ja
Priority to EP10702118.0A priority patent/EP2393761B1/de
Publication of WO2010089279A2 publication Critical patent/WO2010089279A2/de
Publication of WO2010089279A3 publication Critical patent/WO2010089279A3/de
Anticipated expiration legal-status Critical
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    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/453Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
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    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/62218Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products obtaining ceramic films, e.g. by using temporary supports
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/06533Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
    • H01C17/06546Oxides of zinc or cadmium
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    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/1006Thick film varistors
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    • H01C7/10Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
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    • H01C7/105Varistor cores
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Definitions

  • Varistor ceramic multilayer component comprising the varistor ceramic, manufacturing method for the varistor ceramic
  • a varistor ceramic according to claim 1 is specified.
  • a widespread problem of varistor ceramics is to achieve a low dielectric constant ( ⁇ r ).
  • varistor ceramic according to claim 1.
  • Further embodiments of the varistor ceramic are the subject matter of further claims, as well as multilayer components comprising this varistor ceramic and a production method for the varistor ceramic.
  • Varistors are voltage-dependent resistors and are used as overvoltage protection.
  • a metal M selected from Y, Ho, Er, Yb, Lu in an amount of 0.1 to 5 atomic%.
  • M is Y or Lu.
  • the proportion of Co is in a range of 0.1 to 10 atom%, wherein Co is preferably present as Co 2+ .
  • the proportion of Si is in a range of 0.001 to 0.5 atom%, wherein Si is preferably present as Si 4+ .
  • the proportion of Al is in a range of 0.001 to 0.1 atom%, with Al preferably being present as Al 3+ .
  • the proportion of Cr is in a range of 0.001 to 5 at.%, Wherein Cr is preferably present as Cr 3+ .
  • the proportion of B is in the range of 0.001 to 5 at.%, B preferably being present as B 3+ .
  • C is the capacitance
  • ⁇ g the permittivity of vacuum
  • ⁇ r the relative permittivity
  • A the area between two electrodes and d the thickness of the layer between the electrodes.
  • C is the capacitance
  • ⁇ g is the permittivity of vacuum
  • z is the number of grain-to-grain contacts between two electrodes
  • A is the area between the electrodes
  • d is the junction thickness of a grain-to-grain contact.
  • the varistor ceramic includes, in addition to cobalt oxide and praseodymium oxide additions of a salt or oxide of the metal M with low basicity
  • an oxide or salt of the metal M whose cations have a comparatively small ionic radius (eg Y 3+ , Lu 3+ ), is dissolved in the varistor ceramic, so that it has a lower capacitance per grain-grain contact.
  • FIG. 1 shows, as a schematic flow diagram, the production process of multilayer varistors comprising the process steps: Al weighing, A2 pre-milling, A3 drying, A4 screening, A5 calcination, A6 regrinding, A7 drying, A8 screening, Bl slurry formation, B2 green films, Cl printing with conductive paste, C2 stacking, C3 cutting, Dl decarburization, D2 sintering, El application of exterior finishing, E2 firing.
  • FIG. 2 shows schematically the construction of a multilayer varistor comprising the inner electrodes (1), the varistor ceramic material (2) and the outer termination (3).
  • the ceramic body of the multilayer varistor is present as a monolithic ceramic body.
  • FIG. 3 shows on the left the characteristic of an ESD pulse and on the right the characteristic of an 8/20 pulse.
  • the production of the multilayer varistor can be carried out according to FIG.
  • a slurry is prepared by addition of a binder, dispersant and a solvent (Bl), are drawn from the films with a layer thickness between 5 and 60 microns
  • the binder is burned in the following decarburization Sch ⁇ tt (Dl) from the green parts at temperatures between 180 0 C and 500 0 C and sintered the components at a temperature between 900 and 1400 ° C (D2). Subsequently, the outer termination layer (El) is applied and this layer is baked at temperatures between 500 0 C and 1000 0 C (E2).
  • Dl decarburization Sch ⁇ tt
  • the sintering temperature in process step D2) is between 1100 ° C. and 1400 ° C.
  • the temperature for the burn-in method step E2) is between 600 ° C and 1000 0 C.
  • FIG. 2 shows a schematic side view of a multilayer component.
  • the internal electrodes (1) and the layer of the varistor ceramic material (2) follow one another alternately.
  • the inner electrodes (1) are alternately connected to one or the other external termination (3). In the middle area overlap the internal electrodes (1).
  • FIG. 2 shows a typical structure of a 0402 multi-layer waveguide (dimensions 1.0 mm ⁇ 0.5 mm ⁇ 0.5 mm).
  • the overlap area of the internal electrodes (2) and the number of internal electrodes can be adapted to the desired electrical component properties.
  • the electrical characterization of the components was carried out by determining the leakage current, the varistor voltage, the fostlinea ⁇ tatskoefflzienten, of the 8/20 Pulsstabilitat, the ESD Pulsstabilitat, the ( ⁇ U) 8/20 -Klemmenschreib at 1 A.
  • FIG. 3 shows a pulse progression left and right, respectively.
  • the current I is plotted against the time t.
  • the specific varistor voltage E v is determined at 1 mA.
  • the capacitance is measured at 1 V and 1 kHz.
  • the ESD stability is determined with pulses of Figure 3 left: For this purpose, the components with +/- 10 ESD pulses (see Figure 3 right) were charged. The percentage change of U v before and after the pulses and of the leakage current before and after the pulses in percent are calculated and must not have any percentage change of more than 10%. In addition, 8/20 robustness tests (pulse shape, see FIG. 3, right) were carried out. The components were loaded with 8/20 pulses (see Figure 3, right) at IA, 5 A, 10 A, 15 A, 20 A and 25 A, as well as the percent change in the
  • the electrical data are summarized in Table 2.
  • the addition of yttrium increases the specific varistor voltage from 268 V / mm to 525 V / mm and at the same time decreases the relative permittivity. This change is due to the grain growth inhibiting properties of yttrium composites.
  • the ratio ⁇ r / Ev was formed. Table 2 shows that this ratio decreases with increasing yttrium addition. At the same time, high ESD and 8/20 stabilities are obtained with equally good non-permeability.
  • the proportion of Zn is preferably greater than or equal to about 90 atomic%, with Zn preferably being present as Zn 2+ .
  • the proportion of Pr is preferably in a range of 0.5 to 0.6 atom%, wherein Pr is preferably present as Pr 3 V 4+ .
  • the proportion of M is preferably in a range of 1 to 5 atomic%, wherein M is preferably as
  • the proportion of Co is preferably in a range of 1.5 to 2.0 at.%, With Co preferably being present as Co 2+ .
  • the proportion of Ca is preferably in a range of 0.01 to 0.03 at%, with Ca preferably present as Ca 2+ .
  • the content of Si is preferably in a range of 0.01 to 0.15 atom%, Si preferably being present as Si 4+ .
  • the proportion of Al is preferably in the range of 0.005 to 0.01 atom%, with Al preferably being present as Al 3+ .
  • the proportion of Cr is preferably in a range of 0.05 to 0.2 atom%, with Cr preferably being present as Cr 3+ .
  • the amount of B is preferably in a range of 0.001 to 0.01 at.%, B preferably being present as B 3+ .
  • the relative permittivity ⁇ r is less than 1000.
  • boron oxide can be released from suitable precursors while largely avoiding evaporation losses in order to control the formation of nucleation as a sintering aid in the high temperature range.
  • the multilayer varistors of types 0402 and 0201 are characterized by excellent results in leakage current, ESD stability, 8/20 robustness, long-term stability and non-linearity.
  • the main component is a share of at least
  • the proportion of Zn is preferably more than 70 atom%, with Zn preferably being present as Zn 2+ .
  • Varistor ceramic the production process comprises the process steps: a) calcination of the raw ceramic material, b) production of a slip, c) production of green films, d) debindering the green films and e) sintering the green films from d).
  • this additionally comprises between process steps d) and e) the process step d1) building of a component.

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PCT/EP2010/051188 2009-02-03 2010-02-01 Varistorkeramik, vielschichtbauelement umfassend die varistorkeramik, herstellungsverfahren für die varistorkeramik Ceased WO2010089279A2 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US13/146,450 US8487735B2 (en) 2009-02-03 2010-02-01 Varistor ceramic, multilayer component comprising the varistor ceramic, and production method for the varistor ceramic
KR1020117020443A KR101667073B1 (ko) 2009-02-03 2010-02-01 바리스터 세라믹, 바리스터 세라믹을 포함하는 다층 소자, 바리스터 세라믹의 제조 방법
CN2010800060182A CN102300832A (zh) 2009-02-03 2010-02-01 可变电阻陶瓷和含该可变电阻陶瓷的多层构件以及该可变电阻陶瓷的制备方法
JP2011546868A JP5833929B2 (ja) 2009-02-03 2010-02-01 バリスタセラミック、バリスタセラミックを含む多層構成要素、バリスタセラミックの製造方法
EP10702118.0A EP2393761B1 (de) 2009-02-03 2010-02-01 Varistorkeramik

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DE102009007234.9 2009-02-03
DE102009007234 2009-02-03
DE102009023846.8 2009-06-04
DE102009023846.8A DE102009023846B4 (de) 2009-02-03 2009-06-04 Varistorkeramik, Vielschichtbauelement umfassend die Varistorkeramik, Herstellungsverfahren für die Varistorkeramik

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WO2010089279A3 WO2010089279A3 (de) 2010-10-14

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JP5833929B2 (ja) 2015-12-16
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WO2010089279A3 (de) 2010-10-14
US8487735B2 (en) 2013-07-16

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