WO2010073640A1 - Dispositif de clivage et procédé de clivage pour la fabrication de composants électroniques - Google Patents

Dispositif de clivage et procédé de clivage pour la fabrication de composants électroniques Download PDF

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Publication number
WO2010073640A1
WO2010073640A1 PCT/JP2009/007148 JP2009007148W WO2010073640A1 WO 2010073640 A1 WO2010073640 A1 WO 2010073640A1 JP 2009007148 W JP2009007148 W JP 2009007148W WO 2010073640 A1 WO2010073640 A1 WO 2010073640A1
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WIPO (PCT)
Prior art keywords
sealed substrate
electronic component
manufacturing
cutting
substrate
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Application number
PCT/JP2009/007148
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English (en)
Japanese (ja)
Inventor
日比貴昭
北川康之
岡本純
Original Assignee
Ｔｏｗａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to CN200980151217XA priority Critical patent/CN102256739A/zh
Priority to SG2011045721A priority patent/SG172318A1/en
Publication of WO2010073640A1 publication Critical patent/WO2010073640A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Definitions

  • the present invention relates to a cutting apparatus and a cutting method for manufacturing an electronic component used when a plurality of electronic components are manufactured by cutting a sealed substrate having a plurality of regions for each region.
  • the following method is one of the methods conventionally used for the purpose of efficiently producing a plurality of electronic components. That is, a plurality of chip capacitors, LED chips, semiconductor chips, etc. (hereinafter referred to as “chips”) mounted on a circuit board are collectively sealed with a resin to form a sealed substrate.
  • a plurality of electronic components are manufactured by cutting into individual pieces (see, for example, Patent Document 1).
  • a dicing saw can be used when cutting a sealed substrate, or it can be cut with a laser.
  • An individual electronic component obtained by dividing a sealed substrate is often called a package.
  • a glass epoxy substrate can be used as a circuit board, and an epoxy resin, a phenol resin, or a silicone resin can be used as a sealing resin used for resin sealing. From this, it can be said that the circuit board and the sealing resin are made of the same material, that is, a resin material. Therefore, no major problem has occurred when using either a dicing saw using a rotary blade or a laser.
  • Ceramic substrate in addition to a resin substrate typified by a glass epoxy substrate, a substrate made of ceramic (hereinafter referred to as “ceramic substrate”) and a substrate made of metal (hereinafter referred to as “metal substrate”). Began to be used. Ceramic substrates and metal substrates have excellent heat dissipation characteristics, and are used for optoelectronic components such as LEDs and semiconductor lasers, power semiconductor elements, and the like.
  • the base material of the ceramic substrate and the metal substrate has different properties from the sealing resin.
  • the sealing resin has different properties from the sealing resin.
  • the first problem is that the dross formed by melting the material constituting the circuit board is likely to adhere to the package, resulting in a decrease in yield in terms of appearance quality.
  • the second problem is a problem when a ceramic substrate is used as a circuit board. This is a problem that internal stress is generated by thermal shock applied to the ceramic substrate, and cracking or chipping of the ceramic substrate due to the internal stress occurs particularly at the end of cutting at one cutting line. is there.
  • the problem to be solved by the present invention is that dross adheres to a sealed substrate when a sealed substrate including a circuit board made of a ceramic substrate or a metal substrate is cut by a laser, and internal stress It is to prevent the ceramic substrate from cracking or chipping.
  • a cutting apparatus for manufacturing an electronic component according to the present invention includes resin-sealing chips (3) mounted in a plurality of regions (7) provided on a circuit board (2). Used to manufacture a plurality of electronic components by forming a sealed substrate (1) and cutting the sealed substrate (1) at the boundary line (6) of the plurality of regions (7).
  • the fixing means (8) for fixing the sealed substrate (1), the laser light generating means (11) for generating the laser light (12, 18), the sealed substrate (1) and / or the laser light ( 12, 18) a cutting device for manufacturing an electronic component comprising a moving means (9) for moving relative to each other, The first laser beam (12) for the laser beam generating means (11) to form the perforated holes (17, 19) at the boundary line (6) and the perforated holes (17, 19) The second laser beam (18) for cutting the sealed substrate (1) is generated at the formed boundary line (6).
  • the cutting device for manufacturing an electronic component according to the present invention is such that the first laser beam (12) is pulsed and the second laser beam (18) is continuous. It is characteristic.
  • the cutting device for manufacturing an electronic component according to the present invention is characterized in that, in one aspect, the laser light generating means (11) includes a fiber laser oscillator or a YAG laser oscillator.
  • the cutting device for manufacturing an electronic component according to the present invention is characterized in that, in one aspect, the perforated holes (17, 19) are through holes (17).
  • the cutting device for manufacturing an electronic component according to the present invention is characterized in that, in one aspect, the perforated holes (17, 19) are blind holes (19).
  • the cutting device for manufacturing an electronic component according to the present invention is characterized in that, in one aspect, the base material of the circuit board (2) is ceramic or metal.
  • the cutting device for manufacturing an electronic component according to the present invention is characterized in that, in one aspect, the electronic component is an optoelectronic component or a power semiconductor component.
  • the cutting method for manufacturing an electronic component according to the present invention provides a sealed substrate by resin-sealing the chip (3) mounted on each of the plurality of regions (7) provided on the circuit board (2).
  • the step (1) is fixed, and the sealed substrate (1) and / or the laser beam (12, 18) are made relative to each other while irradiating the laser beam (12, 18) toward the sealed substrate (1).
  • a cutting method for manufacturing an electronic component comprising an irradiation step of automatically moving, In the irradiation step, a perforated hole (17, 19) is formed in the boundary line (6) by irradiating the first laser beam (12) toward the sealed substrate (1), and then the boundary The sealed substrate (1) is cut by irradiating the second laser beam (18) toward the line (6).
  • the cutting method for manufacturing an electronic component according to the present invention is such that the first laser beam (12) is pulsed and the second laser beam (18) is continuous. It is characteristic.
  • the cutting method for manufacturing an electronic component according to the present invention includes, in the above-described irradiation step, a first laser beam (12) and a second laser beam (18) by a fiber laser oscillator or a YAG laser oscillator. ).
  • the cutting method for manufacturing an electronic component according to the present invention is characterized in that, in one aspect, the perforated holes (17, 19) are through holes (17).
  • the cutting method for manufacturing an electronic component according to the present invention is characterized in that, in one aspect, the perforated holes (17, 19) are blind holes (19).
  • the cutting method for manufacturing an electronic component according to the present invention is characterized in that, in one aspect, the base material of the circuit board (2) is ceramic or metal.
  • the cutting method for manufacturing an electronic component according to the present invention is characterized in that, in one aspect, the electronic component is an optoelectronic component or a power semiconductor component.
  • the second laser light is formed. Is used to cut (full cut) the sealed substrate (1).
  • the sum of the volume of the part removed when forming the perforated holes (17, 19) and the volume of the part removed by the subsequent cutting (full cut) is one time as in the conventional case. It is equal to the volume of the part to be removed when the sealed substrate (1) is cut at a stroke (full cut) by laser light irradiation.
  • the volume of each part removed from the sealed substrate (1) by each of the two irradiations in the present invention is the same as that when the sealed substrate (1) is cut by the conventional one irradiation. All are small compared with the volume of the part removed from the sealed substrate (1).
  • the amount of dross generated by each irradiation is small.
  • the amount of dross generated when the second laser beam is irradiated is small. By being small, the amount of dross that finally adheres to the cut portion is small.
  • the dross can be easily removed by gas injection or the like during laser irradiation. Therefore, adhesion of dross to the sealed substrate 1 when cutting the sealed substrate (1) is suppressed, and a good cutting quality at the cut surface is obtained.
  • the sealed substrate (1) when the sealed substrate (1) includes a ceramic substrate, the sealed substrate in which the perforated holes (17, 19) are formed using the first laser beam. (1) is cut using the second laser beam.
  • the perforated holes (17, 19) are formed using the first laser beam.
  • (1) is cut using the second laser beam.
  • the perforated holes (17, 19) in advance at the location to be cut in this way, the cutting can be completed in a relatively short time during cutting.
  • the surface area near the cut portion is large due to the perforated holes (17, 19), and heat generated by laser irradiation is easily released.
  • heat hardly accumulates in the vicinity of the perforated holes (17, 19), and thermal stress generated by irradiation with the second laser light is relieved.
  • FIG. 1 is a cross-sectional view illustrating a state in which the cutting device for manufacturing an electronic component according to the first embodiment forms a perforated hole in a sealed substrate.
  • 2 (1) shows a state in which the cutting device for manufacturing electronic components according to the first embodiment forms through holes, which are perforated holes, in the sealed substrate, and
  • FIG. 2 (2) shows a perforated shape.
  • FIG. 2C is a cross-sectional view showing a state in which the sealed substrate is cut
  • FIG. FIG. 3 (1) shows a state in which the cutting device for manufacturing an electronic component according to the second embodiment forms a blind hole which is a perforated hole in the sealed substrate
  • FIG. 3 (2) shows a perforated shape.
  • FIG. 1 is a cross-sectional view illustrating a state in which the cutting device for manufacturing an electronic component according to the first embodiment forms a perforated hole in a sealed substrate.
  • 2 (1) shows a state in which the cutting device for manufacturing electronic components according to the first embodiment forms through holes, which are
  • FIG. 3C is a cross-sectional view showing a state where the sealed substrate is cut
  • FIG. 4 (1) shows a state in which the cutting apparatus for manufacturing an electronic component according to Example 3 forms a groove in the sealing resin
  • FIG. 4 (2) shows a perforated through hole formed in the circuit board
  • FIG. 4 (3) is a cross-sectional view showing a state where the cutting device is cutting the sealed substrate.
  • the sealed substrate (1) is formed by resin-sealing the chip (3) mounted on each of the plurality of regions (7) provided on the circuit board (2).
  • a cutting method used in manufacturing a plurality of electronic components by cutting the sealed substrate (1) along the boundary line (6) of the plurality of regions (7), The step of fixing the sealed substrate (1) to the table (9) and the first laser beam (12) or the second laser beam (18) from the irradiation head (10) toward the sealed substrate (1). ), And an irradiation step of moving the irradiation head (10) and / or the sealed substrate (1) relative to each other.
  • a perforated hole (17) is formed in the boundary line (6) by irradiating the first laser light (12), and then the second laser light ( 18), the sealed substrate (1) is cut.
  • FIG. 1 is a schematic cross-sectional view showing a state in which a cutting device for manufacturing an electronic component according to the present embodiment forms a perforated hole in a sealed substrate.
  • the cutting device shown in FIG. 1 is a cutting device that separates a sealed substrate 1 into a plurality of electronic components.
  • any figure included in this application document is schematically omitted or exaggerated as appropriate.
  • the “perforated hole” means a hole provided at a predetermined interval and includes both a through hole and a blind hole.
  • the sealed substrate 1 is formed so as to cover the circuit board 2, the plurality of chips 3 mounted on the circuit board 2, and the plurality of chips 3 together. And a sealing resin 4.
  • a ceramic substrate or a metal substrate is used as the circuit board 2
  • a translucent silicone resin is used as the sealing resin 4
  • an LED chip is used as the chip 3. Therefore, it can be said that the sealed substrate 1 is a composite material composed of a ceramic substrate or a metal substrate and plastic.
  • the metal substrate includes a metal core substrate, a metal base substrate, and a hollow substrate.
  • the sealing resin 4 has lens portions 5 corresponding to the chips 3 respectively.
  • the sealed substrate 1 is divided into a plurality of regions 7 by lattice-like boundary lines 6.
  • each boundary line 6 is composed of line segments. Therefore, the shape of each region 7 is a rectangle (including a square).
  • FIG. 1 shows an example in which one chip 3 is attached to each of a plurality of regions 7.
  • FIG. 1 shows an example in which the lens unit 5 constitutes a convex lens, and the lens unit 5 and the chip 3 correspond one-to-one. Not only this but the lens part 5 should just have the function to converge light, the function to make parallel light, or the function to diffuse.
  • the lens unit 5 may have a plurality of lenses, and may be a Fresnel lens or the like.
  • the sealed substrate 1 is fixed to the table 9 via an adhesive tape 8.
  • the table 9 is provided so as to be movable in the X direction, the Y direction, and the Z direction shown in the drawing and to be rotatable in the ⁇ direction.
  • An irradiation head 10 is disposed above the sealed substrate 1.
  • a laser oscillator 11 is optically connected to the irradiation head 10.
  • the irradiation head 10 irradiates the laser beam generated by the laser oscillator 11 toward the sealed substrate 1 as the first laser beam 12.
  • the irradiation head 10 can also irradiate the laser beam generated by the laser oscillator 11 toward the sealed substrate 1 as a second laser beam (described later).
  • the laser oscillator 11 can generate the first laser beam 12 and the second laser beam.
  • the first laser beam 12 is pulsed, and the second laser beam is continuous.
  • the irradiation head 10 is provided with a pipe 13, and the assist gas 14 is supplied into the irradiation head 10 through the pipe 13.
  • a nozzle 15 is provided below the irradiation head 10. The first laser beam 12 is irradiated from the opening of the nozzle 15 toward the irradiated portion 16 of the sealed substrate 1 and the assist gas 14 is injected.
  • FIG. 1 and FIG. 2 (1) shows a state in which the cutting device for manufacturing an electronic component according to the present embodiment forms a perforated through hole in the sealed substrate
  • FIG. 2 (2) shows a perforated through hole
  • FIG. 2C is a cross-sectional view showing a state where the sealed substrate is cut
  • the table 9 is applied to the irradiation head 10 while irradiating the pulsed first laser beam 12 toward the boundary line 6 of the sealed substrate 1. Is moved in the + X direction in the figure.
  • the first laser beam 12 is irradiated toward the boundary line 6 of the sealed substrate 1 and the assist gas 14 is injected. By injecting the assist gas 14, the generated dross can be blown off and removed.
  • the irradiation condition of the first laser beam 12 is set in advance so that a through hole can be formed in the sealed substrate 1 that is a composite material.
  • a perforated hole 17 consisting of a through hole can be formed in one boundary line 6 along the X direction among the boundary lines 6 of the sealed substrate 1. it can.
  • perforated holes 17 made of through holes are formed in all the remaining boundary lines 6 along the X direction among the boundary lines 6 of the sealed substrate 1.
  • perforated holes 17 including through holes are formed in all the boundary lines 6 along the X direction among the boundary lines 6.
  • a perforated hole 17 made of a through hole is opened at the boundary line 6 along the Y direction among the lattice-like boundary lines 6.
  • the table 9 is moved in the + Y (or -Y) direction of the drawing with respect to the irradiation head 10 while irradiating the first laser beam 12 toward one boundary line 6 along the Y direction.
  • perforated holes 17 including through holes are formed in all the remaining boundary lines 6 along the Y direction among the boundary lines 6 of the sealed substrate 1.
  • the perforated holes 17 including the through holes are formed in all the boundary lines 6 of the sealed substrate 1.
  • the table 9 is placed on the irradiation head 10 while irradiating the continuous second laser beam 18 toward the boundary line 6 of the sealed substrate 1.
  • the second laser beam 18 is irradiated toward the boundary line 6 of the sealed substrate 1 and the assist gas 14 (see FIG. 1) is injected.
  • the irradiation condition of the second laser beam 18 is set in advance so that the sealed substrate 1 in which the perforated hole 17 including the through hole is formed can be completely cut. Thereby, the sealed substrate 1 can be completely cut (full cut) at one boundary line 6 along the X direction among the boundary lines 6 of the sealed substrate 1.
  • the sealed substrate 1 is completely cut at all the remaining boundary lines 6 along the X direction among the boundary lines 6 of the sealed substrate 1.
  • the sealed substrate 1 is completely cut at all the boundary lines 6 along the Y direction among the lattice-shaped boundary lines 6. Specifically, the table 9 is moved in the + Y (or -Y) direction of the figure with respect to the irradiation head 10 while irradiating the second laser beam 18 toward one boundary line 6 along the Y direction. . Subsequently, the sealed substrate 1 is cut at all the remaining boundary lines 6 along the Y direction among the boundary lines 6 of the sealed substrate 1. Through the steps so far, the sealed substrate 1 can be cut at all the boundary lines 6. Therefore, the sealed substrate 1 is separated into a plurality of packages respectively corresponding to the plurality of regions 7.
  • the first effect is that the occurrence of dross is suppressed when the sealed substrate 1 is cut.
  • the volume of each part removed from the sealed substrate 1 by each of the two irradiations is removed from the sealed substrate when the sealed substrate is cut by one irradiation. Both are small compared with the volume of the part to be. Thereby, the melted portion of the sealed substrate 1 by each of the two irradiations is easily removed by the assist gas. Therefore, adhesion of dross to the sealed substrate 1 when cutting the sealed substrate 1 is suppressed.
  • the second effect is that a good cutting quality at the cut surface can be obtained.
  • the melted portion of the sealed substrate 1 by each of the two irradiations is easily removed by the assist gas. Therefore, a good cutting quality can be obtained at the cut surface of the manufactured electronic component.
  • the third effect is that when a ceramic substrate is used as the circuit board 2, the occurrence of cracking and chipping of the ceramic substrate due to internal stress is suppressed.
  • the sealed substrate 1 in which the perforated holes 17 are formed using a pulsed laser is cut using a continuous laser.
  • thermal stress generated by continuous laser irradiation in the vicinity of the perforated hole 17 is alleviated.
  • the stress received by the sealed substrate 1 in the vicinity of the perforated hole 17, particularly the stress received by the circuit board 2 made of a ceramic substrate is reduced. Therefore, the occurrence of cracking and chipping of the circuit board 2 due to internal stress is suppressed.
  • the diameter of the perforated holes 17 and the interval between the hole centers are determined by the irradiation condition of the first laser beam 12.
  • the irradiation conditions include, for example, the type of laser, energy, frequency, duty ratio, irradiation diameter, moving speed of the table 9, the type and pressure of the assist gas 14.
  • the diameter of the perforated holes 17 and the distance between the hole centers can completely cut the sealed substrate 1 on which the perforated holes 17 are formed by the irradiation of the second laser light 18. As such, it is set in advance. Further, in this embodiment, by appropriately setting the diameter of the perforated holes 17 and the distance between the hole centers according to the material, thickness and the like of the sealing resin 4 and the circuit board 2, various specifications can be obtained. Applicable to the circuit board 2.
  • a YAG laser for example, wavelength 1064 nm
  • a fiber laser for example, wavelength 1070 nm
  • the energy is 200 W for the pulsed laser light irradiation condition
  • the moving speed of the table 9 is 300 mm / sec
  • the energy is 300 W for the continuous laser light irradiation condition
  • the moving speed of the table 9 is 150 mm / sec.
  • table 9 moving speed moving speed (moving speed with continuous laser light) ⁇ (moving with pulsed laser light)
  • Embodiment 2 of a cutting apparatus for manufacturing electronic parts according to the present invention will be described with reference to FIG. 3 (1) shows a state in which the cutting apparatus for manufacturing electronic components according to this embodiment forms a perforated blind hole in the sealed substrate, and FIG. 3 (2) shows a perforated blind hole.
  • FIG. 3C is a cross-sectional view showing a state where the sealed substrate is cut, and FIG.
  • the irradiation head 10 is irradiated while irradiating the pulsed first laser light 12 toward the boundary line 6 of the sealed substrate 1.
  • the table 9 is moved in the + X direction in the figure.
  • the irradiation condition of the first laser beam 12 is set in advance so that a blind hole can be formed in the sealed substrate 1 that is a composite material.
  • a perforated hole 19 made of a blind hole is formed in one boundary line 6 along the X direction among the boundary lines 6 of the sealed substrate 1. Can do.
  • perforated holes 19 made of blind holes are formed in all the remaining boundary lines 6 along the X direction among the boundary lines 6 of the sealed substrate 1. As a result, perforated holes 19 formed of blind holes are formed in all of the boundary lines 6 along the X direction.
  • perforated holes 19 made of blind holes are formed in all the boundary lines 6 along the Y direction among the lattice-shaped boundary lines 6.
  • the table 9 is moved to the irradiation head 10 while irradiating the continuous second laser beam 18 toward the boundary line 6 of the sealed substrate 1. Move in + X direction. Thereby, the sealed substrate 1 can be completely cut (full cut) at one boundary line 6 along the X direction among the boundary lines 6 of the sealed substrate 1.
  • the sealed substrate 1 is completely cut at all the remaining boundary lines 6 along the X direction among the boundary lines 6 of the sealed substrate 1.
  • the sealed substrate 1 is completely cut at all the boundary lines 6 along the Y direction among the lattice-shaped boundary lines 6. Through the steps so far, the sealed substrate 1 can be cut at all the boundary lines 6. Therefore, the sealed substrate 1 is separated into a plurality of packages respectively corresponding to the plurality of regions 7.
  • a feature of the present embodiment is that a perforated hole 19 formed of a blind hole is formed by irradiating the pulsed first laser light 12 toward the boundary line 6 of the sealed substrate 1. .
  • These perforated holes 19 have an opening on the sealing resin 4 side and an inner bottom surface in the circuit board 2.
  • the perforated hole 19 is formed from the sealing resin 4 side to the middle of the circuit board 2 in the thickness direction of the sealed substrate 1.
  • the diameter and depth of the perforated holes 19 and the distance between the hole centers are determined by the irradiation condition of the first laser beam 12. .
  • the diameter and depth of the perforated holes 19 and the distance between the hole centers are such that the sealed substrate 1 on which the perforated holes 19 are formed is completely cut by irradiation with the second laser light 18. It is set in advance so that it can be performed.
  • the same effect as in the first embodiment can be obtained.
  • the diameter and depth of the perforated holes 19 and the interval between the hole centers are appropriately set according to the material and thickness of the sealing resin 4 and the circuit board 2. It becomes applicable to the circuit board 2 of various specifications.
  • FIG. 4 (1) shows a state in which the cutting device for manufacturing electronic components according to this embodiment forms a groove in the sealing resin of the sealed substrate
  • FIG. 4 (2) shows a perforated through hole
  • FIG. 4 (3) is a cross-sectional view showing a state where the circuit board is formed
  • FIG. 4 (3) is a state where the cutting device is cutting the sealed substrate.
  • FIG. 4A a groove is formed in the sealing resin 4 of the sealed substrate using the rotary blade 20.
  • FIG. 4 (1) shows a state in which a groove (not shown) is formed on the left side of the rotary blade 20 by moving the table 9 in the ⁇ X direction (left direction).
  • the rotary blade 20 is shown small for easy understanding.
  • the first laser beam 12 is irradiated to the circuit board 2 at one boundary line 6 along the X direction among the boundary lines 6 of the sealed substrate 1.
  • a perforated hole 21 made of a through hole is formed in the circuit board 2.
  • perforated holes 21 made of through holes are formed in the circuit board 2 at all the boundary lines 6 of the sealed substrate 1.
  • the irradiation head 10 (FIG. 1) is irradiated while irradiating the continuous second laser light 18 toward the circuit board 2 at the boundary line 6 of the sealed substrate 1.
  • the table 9 is moved in the + X direction in the figure.
  • the sealed substrate 1 can be completely cut (full cut) at one boundary line 6 along the X direction among the boundary lines 6 of the sealed substrate 1.
  • the sealed substrate 1 is completely cut at all the remaining boundary lines 6 along the X direction among the boundary lines 6 of the sealed substrate 1.
  • the sealed substrate 1 is completely cut at all the boundary lines 6 along the Y direction among the boundary lines 6 of the sealed substrate 1.
  • a rotary blade suitable for this is used for cutting the sealing resin 4, and a type of laser and irradiation conditions suitable for this are used for cutting the circuit board 2. it can. Therefore, the efficiency of the process of cutting the sealed substrate 1 is improved.
  • both the rotary blade 20 and the laser oscillator 11 (see FIG. 1) for irradiating the first laser beam 12 and the second laser beam 18 are provided in one cutting device.
  • An example was explained. Not limited to this, after a groove is formed in the sealing resin 4 of the sealed substrate 1 using a cutting device having the rotary blade 20, the sealing device having the laser oscillator 11 (see FIG. 1) is sealed. The substrate 1 may be transported.
  • the groove may be formed in the sealing resin 4 of the sealed substrate 1 by using laser light instead of the rotary blade 20.
  • laser light that is easily absorbed by the sealing resin 4, for example, laser light from a CO 2 laser oscillator.
  • the groove provided in the sealing resin 4 in this embodiment may be formed in the resin sealing step.
  • grooves can be formed in the sealing resin 4 by providing thin plate-like protrusions in a lattice shape in the cavity of the mold for resin sealing.
  • the surface of the circuit board 2 may be exposed without the resin 4 being present at all. Further, the sealing resin 4 may be present at the bottom of the groove. In the present embodiment, it is sufficient that the thickness of the sealing resin 4 is reduced at the boundary line 6.
  • the perforated holes 17 and 19 are formed in all the boundary lines 6 along the X direction, and then the perforated holes 17 are formed in all the boundary lines 6 along the Y direction. , 19 was formed. Then, after sealing the sealed substrate 1 at all the boundary lines 6 along the X direction, the sealed substrate 1 was cut at all the boundary lines 6 along the Y direction.
  • each block may be cut into a plurality of regions 7 units. Specifically, first, perforated holes 17 are formed in all the boundary lines 6 of the sealed substrate 1. Next, the sealed substrate 1 is cut at the boundary line 6 near the center line in the X direction and the Y direction of the sealed substrate 1. Thereby, the sealed substrate 1 is equally divided into four blocks. Next, each of the four blocks is cut into a plurality of area 7 units. According to this method, when the deformation (warping, waviness, deflection, etc.) in the sealed substrate 1 is large, the perforated holes 17 are formed in all the boundary lines 6, thereby causing the deformation. Stress is reduced. Therefore, it is possible to suppress adverse effects caused by the deformation when the sealed substrate 1 is cut.
  • perforated holes 17 are formed in the boundary line 6 near the center line in the X direction and the Y direction of the sealed substrate 1.
  • the sealed substrate 1 is cut at the boundary line 6. Thereby, the sealed substrate 1 is equally divided into four blocks.
  • perforated holes 17 are formed in all the boundary lines 6 for each of the four blocks.
  • the sealed substrate 1 is cut along all the boundary lines 6 for each of the four blocks. Also by this method, when the sealed substrate 1 is cut, adverse effects caused by deformation such as warpage, undulation, and bending can be suppressed.
  • the sealed substrate 1 having the LED chip as the chip 3 and the translucent silicone resin as the sealing resin 4 has been described.
  • a laser diode chip can be used as the chip 3.
  • the present invention can be applied when manufacturing a power semiconductor component.
  • a plurality of chips 3 may be mounted in one area 7.
  • one area 7 to which a plurality of LED chips are attached can function as a surface light source by being separated into pieces.
  • the plurality of chips 3 attached to one region 7 may not have the same function.
  • the one area 7 can be functioned as an optical sensor by being separated into pieces.
  • the table 9 is applied to the irradiation head 10 while irradiating the first laser beam 12 or the second laser beam 18 toward the boundary 6 of the sealed substrate 1. It was decided to move in the X direction or the Y direction. Not limited to this, the irradiation head 10 may be moved in the X direction or the Y direction in the figure with respect to the table 9. Further, both the table 9 and the irradiation head 10 may be moved in the X direction or the Y direction in the figure. In short, the table 9 and the irradiation head 10 may be moved relative to each other in the X or Y direction in the figure.
  • the irradiation position may be moved, and thereby the laser beam and the sealed substrate 1 may be moved relative to each other.
  • the sealed substrate 1 and the irradiation head 10 need not be moved, but may be moved relative to each other in the same manner as described above.
  • the present invention is not limited to this, and the present invention is applied to a case where the boundary line 6 includes a curved line or a broken line in which a plurality of line segments are combined. Therefore, the present invention is also applied to the case where a package (for example, a certain type of memory card) in which a sealed substrate is cut to include a curved line or a broken line in a part of the outer shape is manufactured. In this case, the perforated holes 17 and 19 are formed side by side in a curved line or a polygonal line.
  • the sealed substrate 1 is fixed to the table 9 via the adhesive tape 8.
  • the sealed substrate 1 may be fixed to the table 9 by suction.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

Selon l'invention, le but est de réguler l'adhésion de scories, l'apparition de fissurations et l'écaillage de substrats céramiques lors du clivage par laser d'un substrat étanche contenant un substrat de céramique ou un substrat métallique. L'invention porte sur un procédé de clivage utilisé lors de la fabrication de composants électroniques multiples par formation d'un substrat étanche (1) par étanchage de puces (3) montées de manière diverse sur des zones multiples (7) disposées sur une carte (2) en résine, puis le clivage du substrat étanche (1) selon des lignes de frontière (6) des zones multiples (7), lequel procédé de clivage comprend une étape dans laquelle on fixe le substrat étanche (1) à une table (9) et une étape d'irradiation, dans laquelle on irradie le substrat étanche (1) par des première et seconde lumières lasers (12, 18) à partir d'une tête d'irradiation (10), tandis qu'on déplace la tête d'irradiation (10) et/ou le substrat étanche (1) l'un par rapport à l'autre. Dans l'étape d'irradiation, après formation de trous de perforation (17) sur les lignes de frontière (6) par irradiation par la première lumière laser (12), on clive le substrat étanche (1) par irradiation par la seconde lumière laser (18) sur les lignes de frontière (6).
PCT/JP2009/007148 2008-12-26 2009-12-22 Dispositif de clivage et procédé de clivage pour la fabrication de composants électroniques WO2010073640A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200980151217XA CN102256739A (zh) 2008-12-26 2009-12-22 用于电子部件制造的切割装置以及切割方法
SG2011045721A SG172318A1 (en) 2008-12-26 2009-12-22 Cutting device and cutting method for producing electronic parts

Applications Claiming Priority (2)

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JP2008-332054 2008-12-26
JP2008332054A JP5261168B2 (ja) 2008-12-26 2008-12-26 電子部品製造用の切断装置及び切断方法

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JP6017373B2 (ja) * 2013-05-21 2016-11-02 Ｔｏｗａ株式会社 半導体デバイスの製造方法
JP2016015447A (ja) * 2014-07-03 2016-01-28 パナソニックＩｐマネジメント株式会社 ウエハの製造方法および装置
JP6460704B2 (ja) * 2014-09-30 2019-01-30 株式会社ディスコ セラミック基板の分割方法
JP6377514B2 (ja) * 2014-12-17 2018-08-22 株式会社ディスコ パッケージ基板の加工方法
US11428251B2 (en) * 2015-09-15 2022-08-30 Panasonic Intellectual Property Management Co., Ltd. Weld structure of metal member and welding process
CN106249955A (zh) * 2016-08-03 2016-12-21 业成科技（成都）有限公司 切割密封压力感测模组方法及其加工而成的压力感测装置
CN108666212B (zh) * 2018-05-02 2023-01-10 南方科技大学 一种led芯片制作方法
US10562338B2 (en) * 2018-06-25 2020-02-18 American Crafts, L.C. Heat pen for use with electronic cutting and/or drawing systems
US11361998B2 (en) 2019-08-30 2022-06-14 Innolux Corporation Method for manufacturing an electronic device
CN112620965A (zh) * 2019-10-08 2021-04-09 台湾丽驰科技股份有限公司 一种双雷射加工机及其加工方法

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SG172318A1 (en) 2011-07-28
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TW201024011A (en) 2010-07-01
CN102256739A (zh) 2011-11-23
JP2010149165A (ja) 2010-07-08

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