TW201024011A - Cutting apparatus and cutting method for manufacturing electronic component - Google Patents
Cutting apparatus and cutting method for manufacturing electronic component Download PDFInfo
- Publication number
- TW201024011A TW201024011A TW098144638A TW98144638A TW201024011A TW 201024011 A TW201024011 A TW 201024011A TW 098144638 A TW098144638 A TW 098144638A TW 98144638 A TW98144638 A TW 98144638A TW 201024011 A TW201024011 A TW 201024011A
- Authority
- TW
- Taiwan
- Prior art keywords
- laser light
- substrate
- sealing substrate
- electronic component
- manufacturing
- Prior art date
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims description 46
- 239000000758 substrate Substances 0.000 claims abstract description 207
- 238000007789 sealing Methods 0.000 claims abstract description 173
- 229920005989 resin Polymers 0.000 claims abstract description 37
- 239000011347 resin Substances 0.000 claims abstract description 37
- 239000000919 ceramic Substances 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 16
- 230000001678 irradiating effect Effects 0.000 claims abstract description 9
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000000835 fiber Substances 0.000 claims description 4
- 238000005286 illumination Methods 0.000 claims description 3
- 230000005693 optoelectronics Effects 0.000 claims description 3
- 238000005336 cracking Methods 0.000 abstract description 4
- 210000003128 head Anatomy 0.000 description 21
- 235000012431 wafers Nutrition 0.000 description 21
- 230000035882 stress Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000002131 composite material Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 210000003734 kidney Anatomy 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008332054A JP5261168B2 (ja) | 2008-12-26 | 2008-12-26 | 電子部品製造用の切断装置及び切断方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201024011A true TW201024011A (en) | 2010-07-01 |
Family
ID=42287287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098144638A TW201024011A (en) | 2008-12-26 | 2009-12-24 | Cutting apparatus and cutting method for manufacturing electronic component |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP5261168B2 (fr) |
| KR (1) | KR20110110238A (fr) |
| CN (1) | CN102256739A (fr) |
| SG (1) | SG172318A1 (fr) |
| TW (1) | TW201024011A (fr) |
| WO (1) | WO2010073640A1 (fr) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102368521B (zh) * | 2011-10-26 | 2013-11-20 | 深圳市瑞丰光电子股份有限公司 | 发光二极管晶片的切割方法 |
| CN102699536A (zh) * | 2012-05-11 | 2012-10-03 | 东莞光谷茂和激光技术有限公司 | 一种金属厚板的激光切割工艺 |
| JP6017373B2 (ja) * | 2013-05-21 | 2016-11-02 | Ｔｏｗａ株式会社 | 半導体デバイスの製造方法 |
| JP2016015447A (ja) * | 2014-07-03 | 2016-01-28 | パナソニックＩｐマネジメント株式会社 | ウエハの製造方法および装置 |
| JP6460704B2 (ja) * | 2014-09-30 | 2019-01-30 | 株式会社ディスコ | セラミック基板の分割方法 |
| JP6377514B2 (ja) * | 2014-12-17 | 2018-08-22 | 株式会社ディスコ | パッケージ基板の加工方法 |
| WO2017047050A1 (fr) * | 2015-09-15 | 2017-03-23 | パナソニックＩｐマネジメント株式会社 | Structure soudée d'élément métallique et procédé de soudage |
| CN106249955A (zh) * | 2016-08-03 | 2016-12-21 | 业成科技（成都）有限公司 | 切割密封压力感测模组方法及其加工而成的压力感测装置 |
| CN108666212B (zh) * | 2018-05-02 | 2023-01-10 | 南方科技大学 | 一种led芯片制作方法 |
| US10562338B2 (en) * | 2018-06-25 | 2020-02-18 | American Crafts, L.C. | Heat pen for use with electronic cutting and/or drawing systems |
| US11361998B2 (en) | 2019-08-30 | 2022-06-14 | Innolux Corporation | Method for manufacturing an electronic device |
| CN112620965A (zh) * | 2019-10-08 | 2021-04-09 | 台湾丽驰科技股份有限公司 | 一种双雷射加工机及其加工方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62234686A (ja) * | 1986-04-02 | 1987-10-14 | Mitsubishi Electric Corp | 加工材料の切断方法 |
| JPS62234685A (ja) * | 1986-04-02 | 1987-10-14 | Mitsubishi Electric Corp | 加工材料の切断方法 |
| EP1550528A1 (fr) * | 2003-12-30 | 2005-07-06 | Advanced Laser Separation International (ALSI) B.V. | Procédé, dispositif et réseau de diffraction pour séparer des semiconducteurs formés sur un substrat en altérant ledit réseau de diffraction |
| FR2893873B1 (fr) * | 2005-11-25 | 2008-12-12 | Air Liquide | Procede de coupage avec un laser a fibre d'acier inoxydable |
| KR20070097189A (ko) * | 2006-03-28 | 2007-10-04 | 삼성전자주식회사 | 기판 절단 방법 및 이에 사용되는 기판 절단 장치 |
| JP2007279616A (ja) * | 2006-04-12 | 2007-10-25 | Sony Corp | 駆動基板の製造方法および駆動基板 |
| JP5086690B2 (ja) * | 2007-05-18 | 2012-11-28 | 日本特殊陶業株式会社 | セラミック基板の製造方法 |
-
2008
- 2008-12-26 JP JP2008332054A patent/JP5261168B2/ja active Active
-
2009
- 2009-12-22 SG SG2011045721A patent/SG172318A1/en unknown
- 2009-12-22 WO PCT/JP2009/007148 patent/WO2010073640A1/fr active Application Filing
- 2009-12-22 KR KR1020117017507A patent/KR20110110238A/ko not_active Application Discontinuation
- 2009-12-22 CN CN200980151217XA patent/CN102256739A/zh active Pending
- 2009-12-24 TW TW098144638A patent/TW201024011A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20110110238A (ko) | 2011-10-06 |
| CN102256739A (zh) | 2011-11-23 |
| JP5261168B2 (ja) | 2013-08-14 |
| JP2010149165A (ja) | 2010-07-08 |
| SG172318A1 (en) | 2011-07-28 |
| WO2010073640A1 (fr) | 2010-07-01 |
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