WO2010058754A1 - シリカ粒子を含有する重合性有機化合物の組成物の製造方法 - Google Patents
シリカ粒子を含有する重合性有機化合物の組成物の製造方法 Download PDFInfo
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- WO2010058754A1 WO2010058754A1 PCT/JP2009/069442 JP2009069442W WO2010058754A1 WO 2010058754 A1 WO2010058754 A1 WO 2010058754A1 JP 2009069442 W JP2009069442 W JP 2009069442W WO 2010058754 A1 WO2010058754 A1 WO 2010058754A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F292/00—Macromolecular compounds obtained by polymerising monomers on to inorganic materials
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
- C09C1/30—Silicic acid
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
Definitions
- the present invention relates to a method for producing a stable composition of a polymerizable organic compound containing silica particles and a purification method thereof.
- an organic solvent-dispersed silica sol is prepared as a curable resin composition by blending with a polymerizable organic compound, and the surface hardness, wear resistance, mechanical strength, heat resistance, corrosion resistance, etc. of coating materials, molding materials, etc. It is used to improve.
- resin monomers, oligomers and the like are used as the polymerizable organic compound, and other resins, various curing agents, curing catalysts, and the like are further added.
- the curable resin composition can obtain a cured resin body by performing a curing reaction by irradiation with active energy rays or heating.
- the resin cured body containing the colloidal silica particles may be obtained without lowering the transparency.
- an optical semiconductor element sealing material such as a light emitting diode (LED), a semiconductor element sealing material, a hard coating material, and the like.
- An object of the present invention is to provide a method for producing a composition of a polymerizable organic compound containing silica particles, which does not cause polymerization or decomposition of the polymerizable organic compound and has good long-term storage stability.
- the present invention achieves the above object and has the following gist.
- (1) (a) The average primary particle diameter of a diluted solution obtained by a method of mixing organic solvent-dispersed silica sol, methanol, and pure water in the same mass each at 20 ° C. is 2.5 to 4.0.
- Step (B) A method for producing a composition of a polymerizable organic compound containing silica particles, comprising a step of mixing the amine-added organic solvent-dispersed silica sol obtained in step (a) and a polymerizable organic compound. .
- step (a) the silica particles according to claim 1, wherein the diluted liquid obtained by the mixing method of the amine-added organic solvent-dispersed silica sol has a pH at 20 ° C. of 5.0 to 8.5.
- the manufacturing method of the composition of the polymeric organic compound to contain.
- the present invention relates to a method for producing a composition of a polymerizable organic compound containing particles.
- the present invention it is possible to efficiently produce a composition of a polymerizable organic compound containing silica particles having high dispersibility of colloidal silica particles and good storage stability.
- the present invention is effective when a cationic polymerizable resin such as an epoxy resin is used as the polymerizable organic compound.
- the present invention includes the following two steps.
- a diluted liquid obtained by mixing organic solvent-dispersed silica sol, methanol, and pure water in the same mass each has a pH at 20 ° C. of 2.5 to 4.0 and an average primary particle size of 5 to 100 nm.
- An amine compound is added to the organic solvent-dispersed silica sol containing the colloidal silica particles, so that the pH of the diluted solution obtained by the same method as the mixing method is 4.5 to 11.0 at 20 ° C.
- Preparing an organic solvent-dispersed silica sol Preparing an organic solvent-dispersed silica sol;
- B A step of mixing the amine-added organic solvent-dispersed silica sol obtained in step (a) and a polymerizable organic compound.
- the organic solvent-dispersed silica sol used in the present invention can be obtained by replacing an aqueous silica sol produced by a known method using water glass as a raw material with an organic solvent.
- a free alkali component is present in the aqueous silica sol, colloidal silica particles may agglomerate when the organic solvent is replaced.
- an acidic aqueous silica sol that has been dealkalized by cation exchange or the like is subjected to organic solvent replacement. The method is taken.
- the liquid property of the organic solvent-dispersed silica sol obtained by this method is acidic, and the pH of the diluted solution obtained by mixing the organic solvent-dispersed silica sol, the three components of methanol and pure water in the same mass is 2.5 to 4 0.0.
- the average primary particle diameter of the colloidal silica particles contained in the organic solvent-dispersed silica sol used in the present invention is 5 to 100 nm.
- the average primary particle diameter of the colloidal silica particles is calculated from the specific surface area measured by the nitrogen adsorption method (BET method) according to the following conversion formula. *
- Average primary particle diameter D (nm) 2720 / specific surface area S (m 2 / g)
- the specific surface area of the colloidal silica particles contained in the organic solvent-dispersed silica sol used in the present invention is 27.2 to 550 m 2 / g.
- the particle shape of the colloidal silica particles contained in the organic solvent-dispersed silica sol may be any shape known in the art, and examples thereof include a spherical shape, an elongated shape, an elliptical sphere shape, a confetti shape, and an irregular shape.
- the silica concentration of the organic solvent-dispersed silica sol used in the present invention is not particularly limited, but is usually preferably 10 to 50% by mass. *
- the organic solvent-dispersed silica sol used in the present invention can use all organic solvents such as alcohols, ketones, esters and hydrocarbons as organic solvents. Particularly preferred are those having good compatibility with the polymerizable organic compound to be used. *
- the alcohol examples include methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, isobutanol, 2-butanol, ethylene glycol, glycerin, propylene glycol, triethylene glycol, polyethylene glycol, and benzyl alcohol. 1,5-pentanediol, diacetone alcohol and the like. *
- ether specifically, diethyl ether, dibutyl ether, tetrahydrofuran, dioxane, ethylene glycol monomethyl ether, ethylene glycol monopropyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, Examples include diethylene glycol monobutyl ether. *
- ester examples include ethyl formate, methyl acetate, ethyl acetate, propyl acetate, butyl acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, and the like.
- ketones include acetone, methyl ethyl ketone, 2-pentanone, 3-pentanone, methyl isobutyl ketone, 2-heptanone, and cyclohexanone.
- hydrocarbons include n-hexane, cyclohexane, benzene, toluene, xylene, solvent naphtha, and styrene.
- halogenated hydrocarbons include dichloromethane and trichloroethylene. *
- a commercially available organic solvent-dispersed silica sol can be used.
- examples of those containing colloidal silica particles already organophilically treated with an organosilane compound include MEK-ST (methyl ethyl ketone dispersed silica sol, manufactured by Nissan Chemical Industries, Ltd.), MEK-ST-MS (methyl ethyl ketone dispersed silica sol, Nissan).
- MEK-ST-UP methyl ethyl ketone dispersed silica sol, manufactured by Nissan Chemical Industries, Ltd.
- MIBK-ST methyl isobutyl ketone dispersed silica sol, manufactured by Nissan Chemical Industries, Ltd.
- EAC-ST acetic acid
- TOL-ST toluene-dispersed silica sol, manufactured by Nissan Chemical Industries, Ltd.
- PMA-ST propylene glycol monomethyl ether acetate-dispersed silica sol, manufactured by Nissan Chemical Industries, Ltd.
- MA-ST-S methanol-dispersed silica sol, manufactured by Nissan Chemical Industries, Ltd.
- MT-ST methanol-dispersed silica sol, manufactured by Nissan Chemical Industries, Ltd.
- MA-ST-UP methanol-dispersed silica sol
- Nissan Chemical Industries, Ltd. MA-ST-MS
- IPA-ST isopropanol-dispersed silica sol, manufactured by Nissan Chemical Industries, Ltd.
- IPA-ST- UP isopropanol-dispersed silica sol, manufactured by Nissan Chemical Industries, Ltd.
- IPA-ST-MS isopropanol-dispersed silica sol, Nissan Chemical Industries, Ltd.
- NPC-ST-30 n-propyl cellosolve dispersed silica sol, Nissan Chemical Industries ( Co., Ltd.), PGM-ST (1-methoxy-2-propanol-dispersed silica sol
- Examples of the amine compound used in the present invention include triethylamine, isopropylamine, diisopropylamine, n-propylamine, di-n-propylamine, isobutylamine, diisobutylamine, n-butylamine, di-n-butylamine, tri-n- Alkylamines such as butylamine, tri-n-octylamine, N-ethyldiisopropylamine, cyclohexylamine, dicyclohexylamine, aralkylamines such as benzylamine, alicyclic amines such as piperidine, N-methylpiperidine, quinuclidine, monoethanolamine , Triethanolamine, N-methyldiethanolamine, N, N-dimethylethanolamine, N, N-diethylethanolamine, N, N-dibutylethanolamine, triisopropanol Alkanol amines such as amines
- the polymerizable organic compound used in the present invention is an organic compound having one or more polymerizable groups in the molecule and is liquid at 30 ° C.
- the polymerizable organic compound used in the present invention may be any of a monomer, an oligomer and a prepolymer. Examples include acrylic monomers, acrylic oligomers, liquid epoxy resins, oxetane resins, vinyl ether resins, and the like. *
- the present invention is particularly effective when a cationic polymerizable resin such as an epoxy resin, an oxetane resin, or a vinyl ether resin is used. Moreover, it is particularly effective for epoxy resins having one or more epoxycyclohexyl groups in the molecule among the epoxy resins.
- the acrylic monomer is not particularly limited, but specific examples include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, and tetraethylene glycol di (meth) acrylate.
- the acrylic oligomer is not particularly limited, but representative examples include an epoxy acrylate oligomer, a urethane acrylate oligomer, and a polyester acrylate oligomer. *
- the epoxy resin is not particularly limited, but specific examples include 1,4-butanediol diglycidyl ether, 1,2-epoxy-4- (epoxyethyl) cyclohexane, glycerol triglycidyl ether, diethylene glycol diester.
- Glycidyl ether 2,6-diglycidylphenyl glycidyl ether, 1,1,3-tris [p- (2,3-epoxypropoxy) phenyl] propane, 1,2-cyclohexanedicarboxylic acid diglycidyl ester, 4,4 ′ -Methylenebis (N, N-diglycidylaniline), 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, trimethylolethane triglycidyl ether, triglycidyl-p-aminophenol, tetraglycidyl Taxylenediamine, tetraglycidyldiaminodiphenylmethane, tetraglycidyl-1,3-bisaminomethylcyclohexane, bisphenol-A-diglycidyl ether, bisphenol-S-diglycidyl ether, pentaerythritol
- epoxy resins containing one or more epoxycyclohexyl groups in the molecule include 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate, 3,4-epoxycyclohexyloxirane, 2- (3 , 4-epoxycyclohexyl) -3 ', 4'-epoxy-1,3-dioxane-5-spirocyclohexane, 1,2-ethylenedioxy-bis (3,4-epoxycyclohexylmethane), 4', 5 ' -Epoxy-2'-methylcyclohexylmethyl-4,5-epoxy-2-methylcyclohexanecarboxylate, ethylene glycol-bis (3,4-epoxycyclohexanecarboxylate), bis- (3,4-epoxycyclohexylmethyl) adipate , And bis (2,3-epoxy Cyclopentyl)
- the oxetane resin is not particularly limited.
- 3-ethyl-3-hydroxymethyloxetane 3-ethyl-3- (phenoxymethyl) oxetane, 3,3-diethyloxetane, and 3-ethyl- 3- (2-ethylhe
- the vinyl ether resin is not particularly limited.
- the surface of the colloidal silica particles contained in the organic solvent-dispersed silica sol used in the present invention is subjected to an organophilic treatment by reacting the surface silanol groups of the colloidal silica particles with an organic silane compound to form a covalent bond.
- an organophilic treatment by reacting the surface silanol groups of the colloidal silica particles with an organic silane compound to form a covalent bond.
- the colloidal silica particles may agglomerate depending on the type of the amine compound to be added next, and the composition of the polymerizable organic compound containing the resulting silica particles Dispersion stability may deteriorate.
- organic silane compound that can react with the surface silanol groups of the colloidal silica particles to form a covalent bond
- examples of the organic silane compound that can react with the surface silanol groups of the colloidal silica particles to form a covalent bond include silazane compounds, siloxane compounds, alkoxysilanes or partial hydrolysates thereof, or 2 to 5 of partial hydrolysates thereof.
- examples include oligomers of monomers.
- silazane compound examples include hexamethyldisilazane and hexaethyldisilazane.
- siloxane compound examples include hexamethyldisiloxane, 1,3-dibutyltetramethyldisiloxane, 1,3-diphenyltetramethyldisiloxane, 1,3-divinyltetramethyldisiloxane, hexaethyldisiloxane and 3-glycidide.
- Xylpropylpentamethyldisiloxane is mentioned. *
- alkoxysilane examples include trimethylmethoxysilane, trimethylethoxysilane, trimethylpropoxysilane, phenyldimethylmethoxysilane, chloropropyldimethylmethoxysilane, dimethyldimethoxysilane, methyltrimethoxysilane, tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, Tetrabutoxysilane, ethyltrimethoxysilane, dimethyldiethoxysilane, propyltriethoxysilane, n-butyltrimethoxysilane, n-hexyltrimethoxysilane, n-octyltriethoxysilane, n-octylmethyldiethoxysilane, n- Octadecyltrimethoxysilane, phenyltrimethoxysilane, phenylmethyldime
- organic silane compounds can be used alone or in admixture of two or more.
- the pH at 20 ° C. of the diluted solution obtained by mixing the same mass each of the organic solvent-dispersed silica sol, methanol and pure water is 2.5 to 4.0.
- An organic solvent-dispersed silica sol containing colloidal silica particles having a primary particle size of 5 to 100 nm is placed in a suitable reaction vessel, and then an amine compound is added with stirring at room temperature or under heating.
- the organic solvent-dispersed silica sol is heated when the amine compound is added, it is preferably performed at a temperature lower than the boiling point of the organic solvent-dispersed silica sol.
- the addition amount of the amine is such that after adding an amine compound to the organic solvent-dispersed silica sol, the liquid obtained by the mixing method has a pH of 4.5 to 11.0, preferably 5.0 to 8.5 at 20 ° C. Adjust so that When the pH of the diluted solution at 20 ° C. is less than 4.5, the solid acidity of the colloidal silica particles cannot be sufficiently suppressed, and a polymerizable organic compound to be mixed later may be polymerized. When the pH at 20 ° C. of the diluent exceeds 11.0, the dispersibility of the colloidal silica particles decreases, and the dispersion stability of the polymerizable organic compound composition containing the silica particles obtained deteriorates. There is. *
- the amine compound used in the present invention is preferably added after being dissolved in water or an organic solvent. After the amine compound is added to the organic solvent-dispersed silica sol, stirring is performed for 1 to 300 minutes, preferably 10 to 60 minutes, so that the amine compound is sufficiently uniformly dissolved in the organic solvent-dispersed silica sol.
- step (a) the surface of the colloidal silica particles contained in the organic solvent-dispersed silica sol is preferably made organophilic by reacting with an organosilane compound to form a covalent bond.
- the dispersibility of the colloidal silica particles of the organic solvent-dispersed silica sol can be determined by using the particle diameter by the dynamic light scattering method as an index.
- the particle diameter of the organic solvent-dispersed silica sol is increased by the dynamic light scattering method.
- the composition of the polymerizable organic compound containing the silica particles may be increased in viscosity and may be difficult to handle or storage stability may be deteriorated.
- step (b) the amine-added organic solvent-dispersed silica sol obtained in step (a) is mixed with the polymerizable organic compound.
- the mass ratio of the polymerizable organic compound and the silica component of the amine-added organic solvent-dispersed silica sol in the step (b) is 1 to 200 parts by mass of the silica component with respect to 100 parts by mass of the polymerizable organic compound.
- the polymerizable organic compound may be added to the amine-added organic solvent-dispersed silica sol, or the amine-added organic solvent-dispersed silica sol may be added to the polymerizable organic compound. Moreover, this mixing may add the other, stirring one, and may add one without stirring. Furthermore, during mixing, part or all of the organic solvent contained in the amine-added organic solvent-dispersed silica sol may be distilled off. This mixing may be performed at room temperature or under heating.
- any temperature may be used as long as thermal polymerization or thermal decomposition of the polymerizable organic compound does not occur, but part or all of the organic solvent contained in the amine-added organic solvent-dispersed silica sol is distilled off during mixing. In the case, it is necessary to be higher than the boiling point of the organic solvent.
- the composition of the polymerizable organic compound containing silica particles obtained in the step (b) is at least part of the organic solvent under normal pressure heating, reduced pressure heating or room temperature while further stirring. Can be removed.
- the conditions for removing the organic solvent may be any conditions that allow the organic solvent to be distilled off without causing polymerization or decomposition of the polymerizable organic compound, and may be performed by appropriately adjusting the pressure and liquid temperature in the container to be replaced.
- the container used for distilling off the organic solvent is preferably a distillation apparatus capable of appropriately adjusting the pressure and temperature in the container such as a rotary evaporator. *
- composition of the polymerizable organic compound containing silica particles obtained by the present invention can use the change in viscosity over time of the composition as an index of storage stability.
- the composition of the polymerizable organic compound containing silica particles obtained by the present invention has little change in viscosity and good storage stability.
- composition of the polymerizable organic compound containing silica particles obtained by the present invention is suitably blended with other polymerizable organic compound, curing agent, curing accelerator, polymerization initiator, etc., and colloidal silica particles are good. It can be set as the curable resin composition disperse
- the curable resin composition is coated or casted and then cured by irradiation with active energy rays or heating to obtain a cured resin.
- the curable resin composition contains an organic solvent, it is preferable to perform curing after appropriately removing the organic solvent.
- the cured resin body can take various forms depending on the application, such as a thin film such as a hard coat film applied to a transparent plastic plate, a plastic lens, a plastic bottle, or a film, various sealing materials, and a molded product.
- a thin film such as a hard coat film applied to a transparent plastic plate, a plastic lens, a plastic bottle, or a film, various sealing materials, and a molded product.
- Silica sol was diluted with the dispersion solvent and measured with a Coulter N5 (trade name: manufactured by Coulter, USA) using the solvent parameters. The following materials were prepared.
- Organic Sol Sol (I) A commercially available methyl ethyl ketone-dispersed silica sol (colloidal silica particles treated with an organosilane compound) was prepared (trade name: MEK-ST, BET particle size 12 nm, SiO 2 concentration 30 mass). %, Methanol concentration 0.9 mass%, water content 0.1 mass%, particle diameter 16 nm by dynamic light scattering method, pH 3.7 of a solution diluted with methanol and water of the same mass, manufactured by Nissan Chemical Industries, Ltd.
- Organic solvent sol (II) Commercially available 2-propanol-dispersed silica sol (colloidal silica particles not subjected to organophilic treatment with an organosilane compound) was prepared (trade name: IPA-ST, BET particle size 12 nm, SiO 2 concentration 30% by mass, methanol concentration 2.1% by mass, moisture 0.3% by mass, particle size 20 nm by dynamic light scattering method, pH 3.6 of a solution diluted with methanol and water of the same mass, Nissan Chemical Industries (Made by Co., Ltd.)
- Organic solvent sol (III) Commercially available methyl ethyl ketone-dispersed silica sol (colloidal silica particles treated with an organosilane compound) was prepared (trade name: MEK-ST-L, BET particle size 44 nm, SiO 2 concentration 30.5 mass%, methanol concentration 0.5 mass%, water content 0.1 mass%, particle size 90 nm by dynamic light scattering method, pH 3.6 of a solution
- methanol-dispersed silica sol one in which colloidal silica particles are not subjected to organophilic treatment with an organosilane compound
- MT-ST methanol-dispersed silica sol
- BET particle size 12 nm SiO 2 concentration 30% by mass
- methanol concentration 68% by mass A glass reactor equipped with a stirrer having an internal volume of 2 L was charged with 1000 g of a liquid diluted with methanol and water having a water content of 2 mass% and a pH of 3.6 diluted by Nissan Chemical Industries, Ltd.
- Liquid epoxy resin (Ib) Commercially available liquid epoxy resin was prepared [trade name: Celoxide (registered trademark) 2021P, 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate (substance name) , Manufactured by Daicel Chemical Industries, Ltd.].
- Liquid epoxy resin (II-b) A commercially available liquid epoxy resin was prepared [trade name: Epicoat (registered trademark) 828, bisphenol-A-diglycidyl ether (substance name), manufactured by Japan Epoxy Resins Co., Ltd.]. *
- Acrylic monomer (Ic) A commercially available acrylic monomer was prepared (trade name: Biscoat # 150, tetrahydrofurfuryl acrylate (substance name), manufactured by Osaka Organic Chemical Industry Co., Ltd.). *
- Example 1 A solution prepared by dissolving 0.060 g of cyclohexylamine in 3.0 g of methanol was added to the organic solvent sol (I) while stirring at room temperature with 150 g of the organic solvent sol (I), and the mixture was stirred for 30 minutes. , Amine-added methyl ethyl ketone-dispersed silica sol (SiO 2 concentration 29.4 mass%, methanol concentration 2.8 mass%, water content 0.1 mass%, particle diameter 16 nm by dynamic light scattering method, diluted with methanol and water of the same mass) PH 7.7) of the solution was obtained.
- Amine-added methyl ethyl ketone-dispersed silica sol SiO 2 concentration 29.4 mass%, methanol concentration 2.8 mass%, water content 0.1 mass%, particle diameter 16 nm by dynamic light scattering method, diluted with methanol and water of the same mass
- a light yellow transparent liquid epoxy resin composition containing silica particles (Ia-1) (SiO 2 concentration 22.6% by mass, epoxy) The resin concentration was 76.8% by mass, the methyl ethyl ketone concentration was 0.6% by mass, and the B-type viscosity at 30 ° C. was 770 mPa ⁇ s).
- a part of the liquid epoxy resin composition (Ia-1) containing silica particles obtained was sealed in a glass container, kept in a thermostat at 23 ° C. for 1 month, and then B-type at 30 ° C. When the viscosity was measured, it was 1050 mPa ⁇ s, and the fluidity sufficient for use was maintained.
- Examples 2-4 Except having carried out the kind and quantity of an amine compound as Table 1, it carried out similarly to Example 1, and obtained the liquid epoxy resin composition (II-a) thru
- the obtained composition maintained its original fluidity even when stored at 50 ° C. for 1 month. Further, the organic solvent was distilled off in the same manner as in Example 1 to obtain liquid epoxy resin compositions (II-a-1) to (IV-a-1) containing silica particles.
- the liquid epoxy resin compositions (II-a-1) to (IV-a-1) containing silica particles are used with little change in viscosity even if they are kept in a thermostat at 23 ° C. for one month. Sufficient fluidity was maintained.
- Example 5 The same procedure as in Example 1 was carried out except that the organic solvent sol (II) was used instead of the organic solvent sol (I), and 0.105 g of tri-n-butylamine was added instead of 0.060 g of cyclohexylamine.
- a liquid epoxy resin composition (Va) containing silica particles was obtained. The obtained composition maintained its original fluidity even when stored at 50 ° C. for 1 month. Further, the organic solvent was distilled off in the same manner as in Example 1 to obtain a liquid epoxy resin composition (Va-1) containing silica particles.
- the viscosity increased about 6 times compared to immediately after production.
- Example 6 A liquid epoxy resin composition (VI-a) containing silica particles was obtained in the same manner as in Example 1 except that 1.36 g of tri-n-butylamine was added instead of 0.060 g of cyclohexylamine. The obtained composition maintained its original fluidity even when stored at 50 ° C. for 1 month. Further, the organic solvent was distilled off in the same manner as in Example 1 to obtain a liquid epoxy resin composition (VI-a-1) containing silica particles. The composition (VI-a-1) of the liquid epoxy resin containing silica particles showed little change in viscosity even when held in a thermostatic bath at 23 ° C. for 1 month, and maintained sufficient fluidity for use. .
- Comparative Example 1 When the same procedure as in Example 1 was performed except that the amine compound was not added, the mixed solution generated heat when the methyl ethyl ketone-dispersed silica sol and the epoxy resin were mixed, and thickening and gelation due to polymerization occurred.
- Comparative Example 2 The same procedure as in Example 1 was conducted except that 0.014 g of 1,8-diaza-bicyclo (5,4,0) undec-7-ene was used instead of 0.060 g of cyclohexylamine.
- Silica sol SiO 2 concentration 29 mass%, methanol concentration 2.8 mass%, water content 0.1 mass%, particle diameter 16 nm by dynamic light scattering method, pH 4.2 of a solution diluted with methanol and water of the same mass
- 5.0 g of this sol is taken into a 20 mL screw-mouth glass bottle, mixed with 4.9 g of liquid epoxy resin (Ib), and shaken well for 1 minute to give a colorless and transparent liquid containing silica particles.
- An epoxy resin composition (C-IV-a) was obtained. When this composition was sealed and stored at 50 ° C., it gelled by polymerization of an epoxy resin in 3 hours.
- Example 3 Except that no tri-n-butylamine was added, the same procedure was carried out as in Example 5. As a result, heat was generated when isopropanol-dispersed silica sol and the epoxy resin were mixed, and thickening and gelation due to polymerization occurred.
- Example 7 Into a 200 mL beaker, 150 g of the organic solvent sol (III) is added at a room temperature, a solution obtained by dissolving 0.086 g of tri-n-butylamine in 3.0 g of methyl ethyl ketone is added to the organic solvent sol (III), and the mixture is stirred for 30 minutes. Amine-added methyl ethyl ketone-dispersed silica sol (SiO 2 concentration 30.1% by mass, methanol concentration 0.4% by mass, moisture 0.1% by mass, particle size 90 nm by dynamic light scattering method, methanol and water of the same mass) A diluted solution having a pH of 6.9) was obtained.
- Comparative Example 4 A liquid epoxy resin composition (C-VII-a-1) having a high viscosity and containing silica particles (SiO 2 concentration 22) was carried out in the same manner as in Example 7 except that tri-n-butylamine was not added. 0.5 mass%, an epoxy resin concentration of 76.4 mass%, a methyl ethyl ketone concentration of 3.0 mass%, and a B-type viscosity at 60 ° C. of 15000 mPa ⁇ s) were obtained. A part of this resin composition was sealed in a glass container and kept in a thermostat at 23 ° C. for 1 day. As a result, it was solidified and showed no fluidity. Moreover, it remained solidified even at 60 ° C., and the viscosity could not be measured.
- Example 8 800 g of organic solvent sol (IV) was charged into a glass reactor equipped with a stirrer having an internal volume of 1 L, and 1,8-diaza-bicyclo (5,4,0) undec-7-ene was stirred while the sol was stirred.
- a solution obtained by dissolving 0.156 g in 11.2 g of methanol was added, and stirring was continued for 30 minutes, whereby an amine-added methanol-dispersed silica sol containing organophilic colloidal silica (SiO 2 concentration 28. 8% by mass, 2% by mass of water, and pH 5.2) of a solution obtained by diluting the sol with water and methanol of the same mass were obtained.
- organophilic colloidal silica SiO 2 concentration 28. 8% by mass, 2% by mass of water, and pH 5.2
- this sol was transferred to an eggplant-shaped flask having an internal volume of 2 L, 560 g of acrylic monomer (Ic) was added, and methanol was then evacuated with a rotary evaporator while heating at a bath temperature of 40 to 50 ° C. under a reduced pressure of 200 to 20 Torr. Then, 833 g of a colorless and transparent acrylic monomer composition (VIII-a-1) containing silica particles (SiO 2 concentration 30 mass%, tetrahydrofurfuryl acrylate concentration 69.7) was obtained by distilling water off. Mass%, B-type viscosity at 30 ° C. 9.1 mPa ⁇ s, moisture 0.1 mass%, methanol concentration 0.2 mass%).
- Comparative Example 5 The same procedure as in Example 8 was carried out except that 1,8-diaza-bicyclo (5,4,0) undec-7-ene was not added, and the methanol was distilled off by an evaporator after addition of the acrylic monomer (Ic). During this process, the viscosity of the sol suddenly increased and polymerization of the acrylic monomer (Ic) occurred, so that a stable composition of acrylic monomer containing silica particles could not be obtained.
- composition of the polymerizable organic compound containing silica particles obtained by the present invention is a hard coat film or thin film formed on the surface of a synthetic resin molding such as a plastic lens, a plastic bottle, a film or a transparent plastic plate, It is suitable for use in various sealing materials such as LEDs and semiconductors.
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Abstract
Description
(1)(a)有機溶媒分散シリカゾルとメタノールと純水とをそれぞれ同質量ずつ混合する方法で得られる希釈液の20℃におけるpHが2.5乃至4.0である、平均一次粒子径が5乃至100nmのコロイダルシリカ粒子を含有する有機溶媒分散シリカゾルに、前記混合方法で得られる希釈液のpHが、20℃において4.5乃至11.0となるようアミン化合物を添加する、アミン添加有機溶媒分散シリカゾルを調製する工程、
(b)(a)工程で得られたアミン添加有機溶媒分散シリカゾルと重合性有機化合物とを混合する工程、を含むことを特徴とするシリカ粒子を含有する重合性有機化合物の組成物の製造方法。
(2)前記(a)工程において、アミン添加有機溶媒分散シリカゾルの前記混合方法で得た希釈液の20℃におけるpHが5.0乃至8.5である、請求項1に記載のシリカ粒子を含有する重合性有機化合物の組成物の製造方法。
(3)前記(a)工程のコロイダルシリカ粒子が、有機シラン化合物で親有機化処理されていることを特徴とする、(1)又は(2)に記載のシリカ粒子を含有する重合性有機化合物の組成物の製造方法。
(4)前記重合性有機化合物がカチオン重合性樹脂である、(1)乃至(3)いずれか一項に記載のシリカ粒子を含有する重合性有機化合物の組成物の製造方法。
(5)前記重合性有機化合物が液状エポキシ樹脂である、(1)乃至(3)いずれか一項に記載のシリカ粒子を含有する重合性有機化合物の組成物の製造方法。
(6)前記重合性有機化合物が分子内に1個以上のエポキシシクロヘキシル基を有するエポキシ樹脂である、(1)乃至(3)のいずれか一項に記載のシリカ粒子を含有する重合性有機化合物の組成物の製造方法。
(7)前記重合性有機化合物がアクリルモノマー及び/又はアクリルオリゴマーである(1)乃至(3)のいずれか一項に記載のシリカ粒子を含有する重合性有機化合物の組成物の製造方法。
(8)シリカ粒子を含有する重合性有機化合物の組成物に含まれる有機溶媒の一部又は全部を除去することを特徴とする、(1)乃至(3)のいずれか一項に記載のシリカ粒子を含有する重合性有機化合物の組成物の製造方法に関する。
(a)有機溶媒分散シリカゾルとメタノールと純水とをそれぞれ同質量ずつ混合する方法で得られる希釈液の20℃におけるpHが2.5乃至4.0である、平均一次粒子径が5乃至100nmのコロイダルシリカ粒子を含有する有機溶媒分散シリカゾルに、前記混合方法と同様の方法で得られる希釈液のpHが、20℃において4.5乃至11.0となるようアミン化合物を添加する、アミン添加有機溶媒分散シリカゾルを調製する工程、
(b)(a)工程で得られたアミン添加有機溶媒分散シリカゾルと重合性有機化合物とを混合する工程。
本発明で使用する有機溶媒分散シリカゾルに含まれるコロイダルシリカ粒子の比表面積は、27.2乃至550m2/gである。
〔SiO2濃度〕
シリカゾルを130℃で乾燥後、得られたゲルを坩堝中で800℃焼成し、焼成残分によって算出した。
〔平均一次粒子径(窒素吸着法粒子径)〕
シリカゾルを300℃で乾燥させた粉末の比表面積を比表面積測定装置モノソーブ(登録商標)MS-16(ユアサアイオニクス(株)製)を用いて測定した。
〔水分〕カールフィッシャー滴定法にて求めた。
〔有機溶媒含有量〕ガスクロマトグラフィーにて求めた。
ガスクロマトグラフィー条件:
カラム:3mm×1mガラスカラム、
充填剤:ポーラパックQ、
カラム温度:130乃至230℃(昇温8℃/min)、
キャリアー:N2 40mL/min、
検出器:FID 注入量:1μL、
内部標準:メチルエチルケトン又はアセトニトリルを採用した。
〔粘度〕シリカゾルの粘度をB型回転粘度計(東機産業(株)製)を用いて測定した。
〔動的光散乱法粒子径〕シリカゾルをその分散溶媒で希釈し、溶媒のパラメーターを用いてコルターN5(商品名:米国コルター社製)で測定した。
下記の材料を準備した。
・有機溶媒ゾル(I) 市販のメチルエチルケトン分散シリカゾル(コロイダルシリカ粒子を有機シラン化合物で親有機化処理したもの)を準備した(商品名:MEK-ST、BET法粒子径12nm、SiO2濃度30質量%、メタノール濃度0.9質量%、水分0.1質量%、動的光散乱法による粒子径16nm、同質量のメタノールと水とで希釈した液のpH3.7、日産化学工業(株)製)。
・有機溶媒ゾル(II) 市販の2-プロパノール分散シリカゾル(コロイダルシリカ粒子を有機シラン化合物で親有機化処理していないもの)を準備した(商品名:IPA-ST、BET法粒子径12nm、SiO2濃度30質量%、メタノール濃度2.1質量%、水分0.3質量%、動的光散乱法による粒子径20nm、同質量のメタノールと水とで希釈した液のpH3.6、日産化学工業(株)製)。
・有機溶媒ゾル(III) 市販のメチルエチルケトン分散シリカゾル(コロイダルシリカ粒子を有機シラン化合物で親有機化処理したもの)を準備した(商品名:MEK-ST-L、BET法粒子径44nm、SiO2濃度30.5質量%、メタノール濃度0.5質量%、水分0.1質量%、動的光散乱法による粒子径90nm、同質量のメタノールと水とで希釈した液のpH3.6、日産化学工業(株)製)。
・有機溶媒ゾル(IV) 以下の方法で有機溶媒ゾル(IV)を準備した。市販のメタノール分散シリカゾル(コロイダルシリカ粒子を有機シラン化合物で親有機化処理していないもの)(商品名:MT-ST、BET法粒子径12nm、SiO2濃度30質量%、メタノール濃度68質量%、水分2質量%、同質量のメタノールと水とで希釈した液のpH3.6、日産化学工業(株)製)1000gを内容積2Lの撹拌機を備えたガラス製反応器に仕込み、該ゾルを攪拌しながら、γ-メタクリルオキシプロピルトリメトキシシラン[商品名:KBM-503、信越化学工業(株)製]38.0gを添加して、液温を50℃で4時間保持し、有機溶媒ゾル(IV)(SiO2濃度30.5質量%、水分2質量%、同質量のメタノールと水とで希釈した液のpH3.6)を得た。
・液状エポキシ樹脂(I-b): 市販の液状エポキシ樹脂を準備した[商品名:セロキサイド(登録商標)2021P、3,4-エポキシシクロヘキシルメチル-3’,4’-エポキシシクロヘキサンカルボキシレート(物質名)、ダイセル化学工業(株)製]。
有機溶媒ゾル(I)150gを200mLビーカーに入れ、室温で攪拌しながら、シクロヘキシルアミン0.060gをメタノール3.0gに溶解した溶液を有機溶媒ゾル(I)に添加し、30分間攪拌を行って、アミン添加メチルエチルケトン分散シリカゾル(SiO2濃度29.4質量%、メタノール濃度2.8質量%、水分0.1質量%、動的光散乱法による粒子径16nm、同質量のメタノールと水とで希釈した液のpH7.7)を得た。得られたゾルのうち5.0gを20mLネジ口ガラス瓶に取り、液状エポキシ樹脂(I-b)4.9gと混合して1分間良く振とうすることにより、無色透明の、シリカ粒子を含有する液状エポキシ樹脂の組成物(I-a)を得た。この組成物を密閉して50℃で1ヶ月保管したところ、元の流動性を保っており、明らかな増粘はみられなかった。次いで、上記アミン添加メチルエチルケトン分散シリカゾル100gを内容積500mLのナス型セパラブルフラスコに移し、液状エポキシ樹脂(I)96.7gを添加した後、200乃至50Torrの減圧下、浴温60乃至100℃で加熱しながらロータリーエバポレーターにて有機溶媒を留去することにより、淡黄色透明の、シリカ粒子を含有する液状エポキシ樹脂の組成物(I-a-1)(SiO2濃度22.6質量%、エポキシ樹脂濃度76.8質量%、メチルエチルケトン濃度0.6質量%、30℃におけるB型粘度770mPa・s)126.5gを得た。得られたシリカ粒子を含有する液状エポキシ樹脂の組成物(I-a-1)の一部をガラス製容器に密閉し、23℃の恒温槽内で1ヶ月保持した後、30℃におけるB型粘度を測定したところ1050mPa・sであり、使用するのに十分な流動性を保っていた。
アミン化合物の種類及び量を表1の通り行った以外は実施例1と同様に行い、シリカ粒子を含有する液状エポキシ樹脂の組成物(II-a)乃至(IV-a)を得た。得られた組成物は50℃で1ヶ月保管しても元の流動性を保っていた。また、実施例1と同様に有機溶媒の留去を行い、シリカ粒子を含有する液状エポキシ樹脂の組成物(II-a-1)乃至(IV-a-1)を得た。シリカ粒子を含有する液状エポキシ樹脂の組成物(II-a-1)乃至(IV-a-1)はいずれも23℃の恒温槽内で1ヶ月保持しても粘度の変化は少なく、使用するのに十分な流動性を保っていた。
有機溶媒ゾル(I)の代わりに有機溶媒ゾル(II)を使用し、また、シクロヘキシルアミン0.060gの代わりにトリn-ブチルアミン0.105gを添加した以外は実施例1と同様にして行い、シリカ粒子を含有する液状エポキシ樹脂の組成物(V-a)を得た。得られた組成物は50℃で1ヶ月保管しても元の流動性を保っていた。また、実施例1と同様に有機溶媒の留去を行い、シリカ粒子を含有する液状エポキシ樹脂の組成物(V-a-1)を得た。得られたシリカ粒子を含有する液状エポキシ樹脂の組成物(V-a-1)は23℃の恒温槽内で1ヶ月保持すると製造直後に比べて粘度が6倍程度上昇した。
シクロヘキシルアミン0.060gの代わりにトリn-ブチルアミン1.36gを添加した以外は実施例1と同様にして行い、シリカ粒子を含有する液状エポキシ樹脂の組成物(VI-a)を得た。得られた組成物は50℃で1ヶ月保管しても元の流動性を保っていた。また、実施例1と同様に有機溶媒の留去を行い、シリカ粒子を含有する液状エポキシ樹脂の組成物(VI-a-1)を得た。シリカ粒子を含有する液状エポキシ樹脂の組成物(VI-a-1)は23℃の恒温槽内で1ヶ月保持しても粘度の変化は少なく、使用するのに十分な流動性を保っていた。
アミン化合物を添加しなかった以外は実施例1と同様にして行ったところ、メチルエチルケトン分散シリカゾルとエポキシ樹脂を混合した段階で混合液が発熱し、重合による増粘とゲル化が起こった。
シクロヘキシルアミン0.060gの代わりに1,8-ジアザ-ビシクロ(5,4,0)ウンデカ-7-エン0.014gを用いた以外は実施例1と同様にして行ったところ、アミン添加メチルエチルケトン分散シリカゾル(SiO2濃度29質量%、メタノール濃度2.8質量%、水分0.1質量%、動的光散乱法による粒子径16nm、同質量のメタノールと水とで希釈した液のpH4.2)を得た。次いでこのゾルのうち5.0gを20mLネジ口ガラス瓶に取り、液状エポキシ樹脂(I-b)4.9gと混合して1分間良く振とうすることにより、無色透明の、シリカ粒子を含有する液状エポキシ樹脂の組成物(C-IV-a)を得た。この組成物を密閉して50℃で保管したところ、3時間でエポキシ樹脂の重合によりゲル化した。
トリn-ブチルアミンを添加しなかった以外は実施例5と同様にして行ったところ、イソプロパノール分散シリカゾルとエポキシ樹脂を混合した段階で発熱し、重合による増粘とゲル化が起こった。
有機溶媒ゾル(III)150gを200mLビーカーにいれ、室温で攪拌しながら、トリn-ブチルアミン0.086gをメチルエチルケトン3.0gに溶解した溶液を有機溶媒ゾル(III)に添加し、30分間攪拌を行い、アミン添加メチルエチルケトン分散シリカゾル(SiO2濃度30.1質量%、メタノール濃度0.4質量%、水分0.1質量%、動的光散乱法による粒子径90nm、同質量のメタノールと水とで希釈した液のpH6.9)を得た。次いで、このゾル100gを内容積500mLのナス型セパラブルフラスコに移し、液状エポキシ樹脂(II-b)96.7gを添加した後、200乃至50Torrの減圧下、浴温60乃至100℃で加熱しながらロータリーエバポレーターにて有機溶媒を留去することより、シリカ粒子を含有する液状エポキシ樹脂の組成物(VII-a-1)(SiO2濃度23.0質量%、エポキシ樹脂濃度74.5質量%、メチルエチルケトン濃度0.6質量%、60℃におけるB型粘度1110mPa・s)126.5gを得た。この樹脂組成物の一部をガラス製容器に密閉し、23℃の恒温槽内で1ヶ月保持した後、60℃におけるB型粘度を測定したところ1130mPa・sであり、安定であった。
トリn-ブチルアミンを添加しなかった以外は実施例7と同様にして行ったところ、高粘度でシリカ粒子を含有する液状エポキシ樹脂の組成物(C-VII-a-1)(SiO2濃度22.5質量%、エポキシ樹脂濃度76.4質量%、メチルエチルケトン濃度3.0質量%、60℃におけるB型粘度15000mPa・s)129.0gを得た。この樹脂組成物の一部をガラス製容器に密閉し、23℃の恒温槽内で1日保持したところ、固化しており、全く流動性を示さなかった。また、60℃においても固化したままであり、粘度を測定することができなかった。
有機溶媒ゾル(IV)800gを内容積1Lの撹拌機を備えたガラス製反応器に仕込み、該ゾルを攪拌しながら、1,8-ジアザ-ビシクロ(5,4,0)ウンデカ-7-エン[ACROS社試薬]0.156gをメタノール11.2gに溶解させた溶液を添加し、30分攪拌を継続することにより、親有機化コロイダルシリカを含有するアミン添加メタノール分散シリカゾル(SiO2濃度28.8質量%、水分2質量%、ゾルを同質量の水とメタノールとで希釈した液のpH5.2)を得た。次いで、このゾルを内容積2Lのナス型フラスコに移し、アクリルモノマー(I-c)560gを添加した後、200乃至20Torrの減圧下、浴温40乃至50℃で加熱しながらロータリーエバポレーターにてメタノール及び水を留去することにより、無色透明の、シリカ粒子を含有するアクリルモノマーの組成物(VIII-a-1)833gを得た(SiO2濃度30質量%、テトラヒドロフルフリルアクリレート濃度69.7質量%、30℃におけるB型粘度9.1mPa・s、水分0.1質量%、メタノール濃度0.2質量%)。このアクリルモノマー組成物の一部をガラス製容器に密閉し、23℃の恒温槽内で1ヶ月保持した後、30℃におけるB型粘度を測定したところ9.1mPa・sであり、安定であった。また、外観も無色透明のままであった。
1,8-ジアザ-ビシクロ(5,4,0)ウンデカ-7-エンを添加しない以外は実施例8と同様に行ったところ、アクリルモノマー(I-c)添加後のエバポレーターによるメタノール留去工程の途中で、ゾルの粘度が急激に増大し、アクリルモノマー(I-c)の重合が起こったため、安定な、シリカ粒子を含有するアクリルモノマーの組成物が得られなかった。
Claims (8)
- (a)有機溶媒分散シリカゾルとメタノールと純水とをそれぞれ同質量ずつ混合する方法で得られる希釈液の20℃におけるpHが2.5乃至4.0である、平均一次粒子径が5乃至100nmのコロイダルシリカ粒子を含有する有機溶媒分散シリカゾルに、前記混合方法で得られる希釈液のpHが、20℃において4.5乃至11.0となるようアミン化合物を添加する、アミン添加有機溶媒分散シリカゾルを調製する工程、
(b)(a)工程で得られたアミン添加有機溶媒分散シリカゾルと重合性有機化合物とを混合する工程、を含むことを特徴とする、シリカ粒子を含有する重合性有機化合物の組成物の製造方法。 - 前記(a)工程において、アミン添加有機溶媒分散シリカゾルの前記混合方法で得た希釈液の20℃におけるpHが5.0乃至8.5である、請求項1に記載のシリカ粒子を含有する重合性有機化合物の組成物の製造方法。
- 前記(a)工程のコロイダルシリカ粒子が、有機シラン化合物で親有機化処理されていることを特徴とする、請求項1又は2に記載のシリカ粒子を含有する重合性有機化合物の組成物の製造方法。
- 前記重合性有機化合物がカチオン重合性樹脂である、請求項1乃至請求項3のいずれか一項に記載のシリカ粒子を含有する重合性有機化合物の組成物の製造方法。
- 前記重合性有機化合物が液状エポキシ樹脂である、請求項1乃至請求項3のいずれか一項に記載のシリカ粒子を含有する重合性有機化合物の組成物の製造方法。
- 前記重合性有機化合物が分子内に1個以上のエポキシシクロヘキシル基を有するエポキシ樹脂である、請求項1乃至請求項3のいずれか一項に記載のシリカ粒子を含有する重合性有機化合物の組成物の製造方法。
- 前記重合性有機化合物がアクリルモノマー及び/又はアクリルオリゴマーである請求項1乃至請求項3のいずれか一項に記載のシリカ粒子を含有する重合性有機化合物の組成物の製造方法。
- 前記(b)工程の後、さらに、シリカ粒子を含有する重合性有機化合物の組成物に含まれる有機溶媒の一部又は全部を除去することを特徴とする、請求項1乃至請求項7のいずれか一項に記載のシリカ粒子を含有する重合性有機化合物の組成物の製造方法。
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US13/128,517 US20110281974A1 (en) | 2008-11-18 | 2009-11-16 | Process for producing composition of polymerizable organic compound containing silica particles |
JP2010539225A JP5574111B2 (ja) | 2008-11-18 | 2009-11-16 | シリカ粒子を含有する重合性有機化合物の組成物の製造方法 |
EP09827535A EP2366737A4 (en) | 2008-11-18 | 2009-11-16 | METHOD FOR PRODUCING A COMPOSITION OF A POLYMERIZABLE ORGANIC COMPOUND CONTAINING SILICON DIOXIDE PARTICLES |
CN2009801458334A CN102216387A (zh) | 2008-11-18 | 2009-11-16 | 含有二氧化硅粒子的聚合性有机化合物的组合物的制造方法 |
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WO2021199870A1 (ja) * | 2020-03-31 | 2021-10-07 | 日産化学株式会社 | 表面修飾シリカ粒子の有機溶媒分散ゾルの製造方法 |
WO2023032680A1 (ja) | 2021-08-31 | 2023-03-09 | 日産化学株式会社 | エポキシ基含有オルガノシリカゾル、エポキシ樹脂組成物、及びその製造方法 |
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WO2021199870A1 (ja) * | 2020-03-31 | 2021-10-07 | 日産化学株式会社 | 表面修飾シリカ粒子の有機溶媒分散ゾルの製造方法 |
KR20220160001A (ko) | 2020-03-31 | 2022-12-05 | 닛산 가가쿠 가부시키가이샤 | 표면수식 실리카입자의 유기용매 분산졸의 제조방법 |
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EP2366737A1 (en) | 2011-09-21 |
KR20110084992A (ko) | 2011-07-26 |
US20110281974A1 (en) | 2011-11-17 |
EP2366737A4 (en) | 2012-07-04 |
CN102216387A (zh) | 2011-10-12 |
JP5574111B2 (ja) | 2014-08-20 |
TW201030070A (en) | 2010-08-16 |
JPWO2010058754A1 (ja) | 2012-04-19 |
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