WO2010052759A1 - チップ剥離方法、チップ剥離装置、及び半導体装置製造方法 - Google Patents

チップ剥離方法、チップ剥離装置、及び半導体装置製造方法 Download PDF

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Publication number
WO2010052759A1
WO2010052759A1 PCT/JP2008/070057 JP2008070057W WO2010052759A1 WO 2010052759 A1 WO2010052759 A1 WO 2010052759A1 JP 2008070057 W JP2008070057 W JP 2008070057W WO 2010052759 A1 WO2010052759 A1 WO 2010052759A1
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WO
WIPO (PCT)
Prior art keywords
chip
movable stage
peeling
protruding
adhesive sheet
Prior art date
Application number
PCT/JP2008/070057
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English (en)
French (fr)
Japanese (ja)
Inventor
顕 中津
Original Assignee
キヤノンマシナリー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by キヤノンマシナリー株式会社 filed Critical キヤノンマシナリー株式会社
Priority to JP2010536597A priority Critical patent/JP4668361B2/ja
Priority to PCT/JP2008/070057 priority patent/WO2010052759A1/ja
Priority to KR1020117003603A priority patent/KR101062708B1/ko
Priority to TW098137459A priority patent/TWI452614B/zh
Publication of WO2010052759A1 publication Critical patent/WO2010052759A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Definitions

  • the present invention relates to a chip peeling method, a chip peeling apparatus, and a semiconductor device manufacturing method.
  • a diced semiconductor chip hereinafter simply referred to as a chip
  • a conventional chip peeling apparatus there is one provided with a stage for holding an adhesive sheet, a push-up stand that advances and retreats with respect to this stage, and a needle that is pushed up by this push-up stand. That is, it is configured such that the needle is pushed up by the push-up stand and the adhesive sheet of the stage is pushed from the back side so that the chip is detached from the adhesive sheet.
  • the pressure sensitive adhesive tape may be broken.
  • the back surface of the chip may be damaged.
  • the length of each needle is different due to abrasion or breakage, and the tip is tilted and pushed up, and adjacent tips may collide and be damaged.
  • the chip is adsorbed by a collet and taken out.
  • a tip suction error due to the collet occurs. If a collet chip suction error occurs, it will hinder subsequent operations. Further, the tip may be damaged by the needle being pushed up.
  • the chip peeling apparatus includes a stage 3 that holds an adhesive sheet 2 to which a chip 1 is attached. Further, the stage 3 is provided with a movable stage portion 4 whose upper surface 4a protrudes from the stage upper surface 3a. That is, a recess 5 is provided in the stage 3, and the movable stage portion 4 is fitted in the recess 5. In this case, there is a step of S0 between the upper surface 4a of the movable stage portion 4 and the upper surface 3a of the stage 3.
  • the upper surface 4a of the movable stage unit 4 is positioned higher than the upper surface 3a of the stage 3 by S0 in the vertical direction. Further, the first side 1 a of the chip 1 protrudes beyond the end face 9 of the movable stage portion 4. Therefore, a gap 6 is formed between the movable stage portion 4 and the adhesive sheet 2 on the outer peripheral side. Further, as shown in FIG. 6, the stage 3 is provided with a suction hole 8 communicating with the gap 6.
  • the pressure-sensitive adhesive sheet 2 is sucked downward through the suction holes 8 in a state where the chip 1 is sucked (held) by a collet (adsorption collet) (not shown) from above.
  • a collet adsorption collet
  • the air in the gap 6 is sucked, the pressure-sensitive adhesive sheet 2 at the protruding portion of the chip 1 is sucked, and the pressure-sensitive adhesive sheet 2 is peeled off at the protruding portion of the chip 1 as indicated by a virtual line as shown in FIG. 6A.
  • the chip peeling device When the chip peeling device is used, in the initial stage of peeling, it is necessary to peel off the adhesive sheet 2 at a part of the peripheral edge of the chip 1 (in the case shown in FIG. 5, the protruding portion of the chip 1). Since the pressure-sensitive adhesive sheet 2 at the protruding portion of the chip 1 is strongly stuck due to stress during dicing, a larger stress than other portions is required for peeling. For this reason, the upper surface 4a of the movable stage portion 4 is projected from the stage upper surface 3a by S0. Thereby, the stress which peels the adhesive sheet 2 becomes large, and the adhesive sheet 2 of the protrusion part of the chip
  • the chip When the pressure-sensitive adhesive sheet 2 is peeled off, the chip is bent greatly due to a large stress that can peel off a part of the peripheral portion (protruding portion), that is, a high step, and a sliding operation is performed in a state in which the step is maintained.
  • a large peeling force is required in the case of peeling a part of the peripheral edge (the protruding portion) at the initial peeling stage.
  • a large peeling force in the initial peeling stage is not required. That is, the peeling strength is not uniform on the back surface of the chip at the peeling stage.
  • the present invention can peel a part of the peripheral edge of the chip (extrusion part) with a large peeling force in the initial stage of peeling, and can reduce cracks in the sliding stress during sliding.
  • the present invention provides a chip peeling method, a chip peeling apparatus, and a semiconductor device manufacturing method capable of easily peeling and taking out a chip to be peeled.
  • the chip peeling method of the present invention is a chip peeling method in which the chip is peeled off from an adhesive sheet having a chip attached to the upper surface.
  • the chip to be peeled is placed on a stage having a fixed stage portion and a movable stage portion.
  • the protruding portion of the tip is pushed up by the convex portion through the adhesive sheet in the protruding state after being installed so that at least a part of the peripheral edge portion of the tip protrudes from the movable stage portion.
  • a space is formed below the protruding portion, and then the movable stage portion is driven after a negative pressure is applied to the space below the protruding portion.
  • the protruding part of the chip can be pushed up by the convex part through the adhesive sheet. And a big peeling force can be provided by making a negative pressure act on the space
  • the upper surface of the movable stage portion can be raised from the upper surface of the fixed stage portion.
  • the movable stage part can be slid horizontally in the direction opposite to the protruding side.
  • the raised surface of the convex portion is the same as the upper surface of the movable stage portion or lower than the upper surface of the movable stage portion. can do.
  • the semiconductor device manufacturing method of the present invention manufactures a semiconductor device using a chip peeling method.
  • the chip peeling apparatus of the present invention is a chip peeling apparatus for peeling the chip from an adhesive sheet having a chip attached on the upper surface, a stage having a fixed stage part and a movable stage part, and a chip to be peeled off. And at least a part of the peripheral edge of the tip protrudes from the movable stage portion, the protruding portion of the tip is pushed up through the adhesive sheet, and a gap is formed below the protruding portion. And a negative pressure supply means for applying a negative pressure to the gap via a negative pressure passage, and a slide means for sliding the movable stage portion in the horizontal direction on the side opposite to the protruding side. It is.
  • the convex part can be constituted by a pin member or a plate member. That is, even if it is a pin member or a plate-like member, the chip can be pushed up.
  • the movable stage can be slidable, and can be raised and lowered and slidable.
  • a void for negative pressure action can be secured, and the protruding part of the chip can be stably peeled off. Further, at the time of sliding, it is possible to prevent the other adjacent chips from being bent and further prevent the adjacent adjacent chips from cracking.
  • the convex portion may be a pin member or a plate-like member, can be formed with a simple configuration, can reduce costs, and has a stable push-up function. Further, if the movable stage unit can be moved up and down, an optimum low step (step between the upper surface of the fixed stage unit and the upper surface of the movable stage unit) can be obtained when the movable stage unit is slid. As a result, the bending applied to other adjacent chips can be reduced, and it is possible to reliably prevent a large force from being applied to the other adjacent chips. For this reason, the crack of the other chip
  • the protruding surface of the convex part is the same as the upper surface of the movable stage part or lower than the upper surface of the movable stage part, so that the convex part is affected.
  • the movable stage portion can be driven by sliding or the like, and a smooth peeling operation can be performed.
  • FIG. 2 is a simplified cross-sectional view showing a chip peeling method using the chip peeling apparatus of the present invention and before a protruding portion is pushed up. It is a simplified sectional view showing a chip peeling method using the chip peeling apparatus of the present invention, and showing a protruding state of a protruding portion.
  • FIG. 2 is a simplified cross-sectional view showing a chip peeling method using the chip peeling apparatus of the present invention, in a sliding state of a movable stage portion. It is a simplified top view of the said chip peeling apparatus. It is a simplified top view which shows the chip
  • Chip 12 Adhesive sheet 16 Stage 16a Movable stage portion 16b Fixed stage portion 19 Gap 30 Negative pressure passage 31 Overhang portion 50 Convex portions 51, 53 Plate member 52 Push-up surface 55 Pin member
  • the chip peeling device is a device that sequentially peels and takes out a plurality of rectangular thin-walled chips (semiconductor chips) 11 attached on the pressure-sensitive adhesive sheet 12 from the pressure-sensitive adhesive sheet 12. That is, it is used for a semiconductor device manufacturing apparatus for manufacturing a semiconductor chip 11 as a semiconductor device.
  • the chip 11 is a final product by using the wafer 10 (see FIG. 3) as a material and cutting the material into a rectangular shape. For this reason, the chip 11 includes a square or a strip. That is, as shown in FIG. 3, the wafer 10 is circular as a whole, and is divided into individual chips 11 by dicing, and the chips 11 are attached to the adhesive sheet 12. A frame 13 made of a ring body is attached to the outer peripheral side of the adhesive sheet 12. That is, the frame 13 and the adhesive sheet 12 are integrated. And the chip
  • the chip peeling apparatus includes a holding means 15 that holds the chip 11 to be peeled from above, and a stage 16 on which the adhesive sheet 12 is placed.
  • the stage 16 includes a fixed stage portion 16b and a slidable movable stage portion 16a. That is, the recess 22 is provided in the upper surface 37 of the fixed stage portion 16b, and the movable stage portion 16a, which is a rectangular flat plate body, is disposed in the recess 22.
  • the upper surface 34 of the movable stage portion 16a is higher than the upper surface 37 of the fixed stage portion 16b. That is, a step S is provided between the upper surface 34 of the movable stage portion 16a and the upper surface 37 of the fixed stage portion 16b.
  • the width dimension W of the movable stage portion 16a is set smaller than the length (width dimension) W1 of one side of the chip 11 which is a square.
  • one tip surface 17a of the movable stage portion 16a corresponds to the first side 23a of the chip 11 to be peeled off, and the first side 23a of the chip 11 protrudes beyond the tip surface 17a of the movable stage portion 16a.
  • a negative pressure passage 30 for introducing a negative pressure to the interface with the adhesive sheet 12 is provided in the stage 16.
  • the negative pressure passage 30 is provided with suction ports 30 a and 30 b that open on the first side 23 a side of the chip 11.
  • each suction port 30a, 30b corresponds to the protruding portion 31 of the chip 11, as can be seen in plan view.
  • a vacuum pump (not shown) is connected to the negative pressure passage 30. That is, by driving the vacuum pump, air can be sucked from the suction ports 30 a and 30 b of the negative pressure passage 30.
  • the negative pressure passage 30 and the vacuum pump can constitute negative pressure supply means (air suction means).
  • the holding means 15 is constituted by a suction member (collet) 21 having a head 20 for sucking the chip 11.
  • the head 20 is provided with a suction hole in its lower end surface 20 a, and the chip 11 is vacuumed through the suction hole, and the chip 11 is sucked into the lower end surface 20 a of the head 20. For this reason, if this vacuum suction (evacuation) is released, the chip 11 is detached from the head 20.
  • the movable stage portion 16a moves along the horizontal direction while the tip end surface 17a of the movable stage portion 16a is parallel to the first side 23a of the chip 11 via a drive mechanism (not shown).
  • a drive mechanism (not shown).
  • various mechanisms such as a reciprocating mechanism and a cylinder mechanism including a bolt shaft member and a nut member screwed to the bolt shaft member can be used.
  • a convex portion 50 made of a plate-like member 51 is provided in the recess 22 of the fixed stage portion 16b corresponding to the protruding portion 31 of the chip 11. That is, as shown in FIG. 2, the convex portion 50 has a long side 51a of its upper end surface (push-up surface) set to be substantially the same as the length dimension of the distal end surface 17a of the movable stage portion 16a, and its short side. 51 b is set to be smaller than the width dimension of the protruding portion 31. And this convex-shaped part 50 is arrange
  • a vertical movement mechanism (not shown) is connected to the convex portion 50, and the convex portion 50 moves up and down independently of the movable stage portion 16a.
  • various mechanisms such as a reciprocation mechanism and a cylinder mechanism which consist of a bolt shaft member and a nut member screwed together, can be used.
  • the gap 19 is formed in the lower portion of the protruding portion 31 of the chip 11, but the protruding portion 31 of the chip 11 is shown in FIG. 1B through the adhesive sheet 12 by raising the convex portion 50. Can be pushed up. By this push-up, the step between the protruding portion 31 of the chip 11 and the upper surface of the fixed stage portion 16b becomes large.
  • the height position of the protruding surface (tip surface) 52 of the convex portion 50 is matched with the height position of the upper surface 34 of the movable stage portion 16a.
  • the protruding portion 50 can be raised and the protruding portion 31 of the chip 11 can be pushed up through the adhesive sheet 12. That is, the level difference between the protruding portion 31 of the chip 11 and the upper surface of the fixed stage portion 16b is increased.
  • the gap 19 communicates with the suction ports 30a and 30b as described above. Therefore, by driving the suction means (negative pressure supply means), the air in the gap 19 is sucked through the suction ports 30a and 30b to apply negative pressure. As a result, the protruding portion 31 of the chip 11 is sucked, and the adhesive sheet 12 is peeled from the protruding portion 31 of the chip 11 as indicated by the phantom line shown in FIG. 1B.
  • the convex portion 50 is lowered.
  • the height position of the raised surface 52 of the convex portion 50 is set lower than the height position of the upper surface 34 of the movable stage portion 16a.
  • the movable stage portion 16a is slid through the drive mechanism in the direction of arrow B which is the direction opposite to the protruding side.
  • the receiving area of the chip 1 by the movable stage portion 16a is sequentially reduced, and the area of adsorption (suction) downward of the adhesive sheet 12 is increased.
  • the adhesive sheet 12 is sequentially peeled from the chip 11. For this reason, when the front end surface 17a of the movable stage portion 16a is detached from the first side 23a of the chip 11, the adhesive sheet 12 can be completely peeled from the chip 1 to be peeled.
  • a semiconductor device refers to all devices that can function by utilizing semiconductor characteristics, and electro-optical devices, semiconductor circuits, and electronic devices are all semiconductor devices.
  • it may be in a wafer state on which a circuit is formed, an individual semiconductor chip cut out from the wafer, a wafer divided into a plurality of pieces, or a package in the wafer state. Even if it is, what was packaged in the wafer state may be divided into a plurality of parts, or what was packaged in the wafer state may be cut out to form individual semiconductor elements.
  • the protruding portion 31 of the chip 11 can be pushed up by the convex portion 50 via the adhesive sheet 12. And a big peeling force can be provided by making a negative pressure act on the space
  • the protruding surface 52 of the convex portion 50 can be made lower than the upper surface 34 of the movable stage portion 16a, and therefore the convex portion 50 is affected.
  • the movable stage portion 16a can be driven by sliding or the like, and a smooth peeling operation can be performed.
  • FIG. 4 shows a modified example of the convex portion 50.
  • the convex portion 50 includes a substantially U-shaped plate member 53 in a plan view. That is, the plate-like member 53 includes a flat plate-like main body portion 53a arranged in parallel with the distal end surface 17a of the movable stage portion 16a, and end piece portions 54b, 54b bent at right angles from the end portions of the flat plate-like main body portion 53a. It consists of. End piece portions 54b and 54b are disposed along the side surface of the distal end surface 17a of the movable stage portion 16a.
  • the push-up surface 52 has a U shape in plan view.
  • the chip 11 can be pushed up stably, a large peeling force can be exerted in the initial peeling stage, and the peeling work can be stabilized. it can.
  • the convex portion 50 is composed of a pin member 55.
  • three are arranged at a predetermined pitch along the distal end surface 17a of the movable stage portion 16a.
  • Each pin member 55 is movable up and down. For this reason, the protrusion part 31 of the chip
  • the movable stage unit 16a only slides. However, the movable stage unit 16a may slide up and down (elevate).
  • the driving means in this case includes an elevating mechanism part (elevating means) for elevating and lowering the movable stage part 16a, and a slide mechanism part (sliding means) for sliding the movable stage part 16a.
  • the elevating mechanism unit has, for example, a push-up pin, and moves the push-up pin up and down via a reciprocating mechanism.
  • the slide mechanism section includes a reciprocating mechanism that slides the elevating mechanism section in a substantially horizontal direction.
  • various known and publicly available mechanisms such as a reciprocating mechanism including a bolt shaft member and a nut member screwed to the bolt shaft member, a cylinder mechanism, and a linear actuator can be used. .
  • the movable stage portion 16a can be moved up and down, the amount of step difference between the upper surface 34 of the movable stage portion 16a and the upper surface 37 of the fixed stage portion 16b can be variously changed. That is, the movable stage portion can be raised once and lowered to the original position, or the movable stage portion 16a can be raised once and lowered to an intermediate height position higher than the original position.
  • the movable stage portion 16a and the fixed stage portion 16b can have a high step or a low step. For this reason, at the initial stage of peeling, if the step between the movable stage portion 16a and the fixed stage portion 16b is increased, a large peeling force is applied to the adhesive sheet 12 even if the rising amount of the convex portion 50 is reduced. be able to. For this reason, generation
  • the step between the movable stage portion 16a and the fixed stage portion 16b is reduced, it is effective to apply dynamic twisting stress to other adjacent chips 11 when the movable stage portion 16a slides. Therefore, it is possible to reduce the bending applied to other adjacent chips 11.
  • the suction port 30a provided in the stage 16 has a size and a number of The shape and the like can be arbitrarily set within the air suckable range of the gap 19. For this reason, the suction port 30a may be one.
  • the chip 11 to be peeled is not limited to a square, but may be a rectangle having a short side and a long side, or may be a strip having a very long long side compared to the short side. .
  • the thickness of the pressure-sensitive adhesive sheet 12 is different depending on the suction force or the like, it can be curved and deformed so that it can be peeled off from the chip 11 when the air in the gap 19 is sucked by the suction means (negative pressure supply means). I just need it.
  • the thickness of the movable stage portion 16a can be arbitrarily set according to the range that can be peeled from the chip 11 when the air in the gap 19 is sucked by the suction means (negative pressure supply means). Further, the angle of the corner of the movable stage portion 16a is not limited to 90 degrees, and may be somewhat acute or obtuse.
  • the number of chips 11 stuck on the pressure-sensitive adhesive sheet 12 is also arbitrary, and in the present invention, all the chips 11 on the pressure-sensitive adhesive sheet 12 can be sequentially peeled without being affected by the number. .
  • the area of the protruding portion 31 of the chip 11 can be variously set within a range in which a peeling force acts on the adhesive sheet 12 when a negative pressure is applied.
  • the long side 51a is set to be substantially the same as the length of the movable stage portion 16a as shown in FIG. May be longer or shorter than the length of the movable stage portion 16a.
  • the thickness dimension of the plate-like member 51 may be anything as long as it can be disposed below the protruding portion 31.
  • a plurality of plate-like members 51 may be provided.
  • the pin member 55 may be a cylindrical body having a circular cross section, an elliptical or elliptical cross section, a triangular, quadrangular, pentagonal, or more rectangular prism having a cross section. Also good. Moreover, a cylinder may be sufficient.
  • the area of the push-up surface 52 of the pin member 55 can be variously changed within a range in which the protruding portion 31 can be pushed up.
  • the height position of the push-up surface 52 of the convex portion 50 may be matched with the height position of the upper surface 34 of the movable stage portion 16a. Even in such a case, the slide of the movable stage portion 16a is not adversely affected.
  • the amount of protrusion of the protruding portion 31 of the chip 11 can be arbitrarily set within a range in which the adhesive sheet 12 can be peeled by the action of negative pressure at the initial stage of peeling depending on the size, thickness, material, etc. of the chip 11. .
  • ⁇ A plurality of rectangular thin-walled chips (semiconductor chips) attached on the adhesive sheet can be used in a pickup device that sequentially separates and picks up from the adhesive sheet.
  • a chip is made into a material, and this material is cut into a rectangular shape to become a final product. For this reason, there are square and strip-shaped chips.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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PCT/JP2008/070057 2008-11-04 2008-11-04 チップ剥離方法、チップ剥離装置、及び半導体装置製造方法 WO2010052759A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010536597A JP4668361B2 (ja) 2008-11-04 2008-11-04 チップ剥離方法、チップ剥離装置、及び半導体装置製造方法
PCT/JP2008/070057 WO2010052759A1 (ja) 2008-11-04 2008-11-04 チップ剥離方法、チップ剥離装置、及び半導体装置製造方法
KR1020117003603A KR101062708B1 (ko) 2008-11-04 2008-11-04 칩 박리 방법, 칩 박리 장치, 및 반도체 장치 제조 방법
TW098137459A TWI452614B (zh) 2008-11-04 2009-11-04 晶片剝離方法、晶片剝離裝置以及半導體裝置製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2008/070057 WO2010052759A1 (ja) 2008-11-04 2008-11-04 チップ剥離方法、チップ剥離装置、及び半導体装置製造方法

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WO2010052759A1 true WO2010052759A1 (ja) 2010-05-14

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JP (1) JP4668361B2 (ko)
KR (1) KR101062708B1 (ko)
TW (1) TWI452614B (ko)
WO (1) WO2010052759A1 (ko)

Cited By (2)

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Publication number Priority date Publication date Assignee Title
WO2012043057A1 (ja) * 2010-09-28 2012-04-05 株式会社新川 半導体ダイのピックアップ装置及びその装置を用いた半導体ダイのピックアップ方法
JP2016063057A (ja) * 2014-09-18 2016-04-25 ファスフォードテクノロジ株式会社 ダイボンダ並びにボンディング方法及びピックアップ装置

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JP5980875B2 (ja) * 2014-10-21 2016-08-31 キヤノンマシナリー株式会社 チップ剥離装置及びチップ剥離方法

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JP2005328054A (ja) * 2004-05-11 2005-11-24 Asm Assembly Automation Ltd 半導体チップの分離装置及び分離方法
JP2006093592A (ja) * 2004-09-27 2006-04-06 Shibaura Mechatronics Corp 半導体チップのピックアップ装置、ピックアップ方法及び実装装置
JP2006156806A (ja) * 2004-11-30 2006-06-15 Canon Machinery Inc ペレットピックアップ方法及びピックアップ装置
WO2008004270A1 (fr) * 2006-07-03 2008-01-10 Canon Machinery Inc. Méthode de ramassage et appareil de ramassage
WO2008041273A1 (fr) * 2006-09-29 2008-04-10 Canon Machinery Inc. Procédé de capture et appareil de capture

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JP3209736B2 (ja) * 1999-11-09 2001-09-17 エヌイーシーマシナリー株式会社 ペレットピックアップ装置
JP2005328054A (ja) * 2004-05-11 2005-11-24 Asm Assembly Automation Ltd 半導体チップの分離装置及び分離方法
JP2006093592A (ja) * 2004-09-27 2006-04-06 Shibaura Mechatronics Corp 半導体チップのピックアップ装置、ピックアップ方法及び実装装置
JP2006156806A (ja) * 2004-11-30 2006-06-15 Canon Machinery Inc ペレットピックアップ方法及びピックアップ装置
WO2008004270A1 (fr) * 2006-07-03 2008-01-10 Canon Machinery Inc. Méthode de ramassage et appareil de ramassage
WO2008041273A1 (fr) * 2006-09-29 2008-04-10 Canon Machinery Inc. Procédé de capture et appareil de capture

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Publication number Priority date Publication date Assignee Title
WO2012043057A1 (ja) * 2010-09-28 2012-04-05 株式会社新川 半導体ダイのピックアップ装置及びその装置を用いた半導体ダイのピックアップ方法
JP2012074491A (ja) * 2010-09-28 2012-04-12 Shinkawa Ltd 半導体ダイのピックアップ装置及びその装置を用いた半導体ダイのピックアップ方法
KR101430936B1 (ko) 2010-09-28 2014-08-18 가부시키가이샤 신가와 반도체 다이의 픽업 장치 및 그 장치를 사용한 반도체 다이의 픽업 방법
US9028649B2 (en) 2010-09-28 2015-05-12 Shinkawa Ltd. Semiconductor die pick-up apparatus and method of picking up semiconductor die using the same
JP2016063057A (ja) * 2014-09-18 2016-04-25 ファスフォードテクノロジ株式会社 ダイボンダ並びにボンディング方法及びピックアップ装置

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